► High data rate: dc to 100 Mbps (NRZ)
► Compatible with 3.3 V and 5.0 V operation/level translation
► 125°C maximum operating temperature
► Low power operation
► 5 V operation
► 1.0 mA maximum @ 1 Mbps
► 4.5 mA maximum @ 25 Mbps
► 16.8 mA maximum @ 100 Mbps
► 3.3 V operation
► 0.4 mA maximum @ 1 Mbps
► 3.5 mA maximum @ 25 Mbps
► 7.1 mA maximum @ 50 Mbps
► 8-lead SOIC_N package (RoHS compliant version available)
► High common-mode transient immunity: >25 kV/μs
► Safety and regulatory approvals
► UL 1577
► V
= 2500 V rms for 1 minute
ISO
► IEC/EN/CSA 62368-1
► IEC/CSA 61010-1
► CQC GB 4943.1
► DIN EN IEC 60747-17 (VDE 0884-17)
► V
= 560 V peak
IORM
APPLICATIONS
► Digital field bus isolation
► Opto-isolator replacement
► Computer peripheral interface
► Microprocessor system interface
► General instrumentation and data acquisition applications
GENERAL DESCRIPTION
The ADuM11001 is a digital isolator based on Analog Devices Inc.,
iCoupler® technology. Combining high speed CMOS and monolithic
air core transformer technology, this isolation component provides
outstanding performance characteristics superior to alternatives,
such as optocoupler devices.
Configured as a pin-compatible replacement for existing high speed
optocouplers, the ADuM1100 supports data rates as high as 25
Mbps and 100 Mbps.
The ADuM1100 operates with a voltage supply ranging from 3.0 V
to 5.5 V, boasts a propagation delay of <18 ns and edge asymmetry
of <2 ns, and is compatible with temperatures up to 125°C. It
operates at very low power, less than 0.9 mA of quiescent current
(sum of both sides), and a dynamic current of less than 160 μA
per Mbps of data rate. Unlike other optocoupler alternatives, the
ADuM1100 provides dc correctness with a patented refresh feature
that continuously updates the output signal.
The ADuM1100 is offered in three grades. The ADuM1100AR and
ADuM1100BR can operate up to a maximum temperature of 105°C
and support data rates up to 25 Mbps and 100 Mbps, respectively.
The ADuM1100UR can operate up to a maximum temperature of
125°C and supports data rates up to 100 Mbps.
FUNCTIONAL BLOCK DIAGRAM
Figure 1.
1
Protected by U.S. Patents 5,952,849; 6,525,566; 6,922,080; 6,903,578; 6,873,065; 7,075,329.
Rev. L
DOCUMENT FEEDBACK
TECHNICAL SUPPORT
Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to
change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
Changes to Features Section.......................................................................................................................... 1
Changes to Regulatory Information Section and Table 5.................................................................................9
Changes to Table 6..........................................................................................................................................9
Changed DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 Insulation Characteristics Section to DIN
EN IEC 60747-17 (VDE 0884-17) Insulation Characteristics Section..........................................................10
Changes to DIN EN IEC 60747-17 (VDE 0884-17) Insulation Characteristics Section, Table 7, and
All voltages are relative to their respective ground. 4.5 V ≤ V
the entire recommended operation range, unless otherwise noted. All typical specifications are at T
≤ 5.5 V, 4.5 V ≤ V
DD1
≤ 5.5 V. All minimum/maximum specifications apply over
DD2
= 25°C, V
A
DD1
= V
DD2
= 5 V.
Table 1.
ParameterSymbolMinTypMaxUnitTest Conditions
DC SPECIFICATIONS
Input Supply CurrentI
Output Supply CurrentI
Input Supply Current (25 Mbps) (See Figure 5)I
Output Supply Current1 (25 Mbps) (See Figure 6)I
Input Supply Current (100 Mbps) (See Figure 5)I
DD1 (Q)
DD2 (Q)
DD1 (25)
DD2 (25)
DD1 (100)
0.30.8mAVI = 0 V or V
0.010.06mAVI = 0 V or V
DD1
DD1
2.23.5mA12.5 MHz logic signal frequency
0.51.0mA12.5 MHz logic signal frequency
9.014mA50 MHz logic signal frequency, ADuM1100BR/
ADuM1100UR only
Output Supply Current1 (100 Mbps) (See Figure 6)I
DD2 (100)
2.02.8mA50 MHz logic signal frequency, ADuM1100BR/
ADuM1100UR only
Input CurrentI
Logic High Output VoltageV
Logic Low Output VoltageV
I
OH
OL
−10+0.01+10µA0 V ≤ VIN ≤ V
V
− 0.15.0VIO = −20 μA, VI = V
DD2
V
− 0.84.6VIO = −4 mA, VI = V
DD2
0.00.1VIO = 20 μA, VI = V
0.030.1VIO = 400 μA, VI = V
0.30.8VIO = 4 mA, VI = V
DD1
IH
IH
IL
IL
IL
SWITCHING SPECIFICATIONS
For ADuM1100AR
Minimum Pulse Width
Maximum Data Rate
2
3
PW40nsCL = 15 pF, CMOS signal levels
25MbpsCL = 15 pF, CMOS signal levels
For ADuM1100BR/ADuM1100UR
Minimum Pulse Width
Maximum Data Rate
2
3
PW6.710nsCL = 15 pF, CMOS signal levels
100150MbpsCL = 15 pF, CMOS signal levels
For All Grades
Propagation Delay Time to Logic Low Output
4, 5
t
PHL
10.518nsCL = 15 pF, CMOS signal levels
(See Figure 7)
Propagation Delay Time to Logic High Output
4, 5
t
PLH
10.518nsCL = 15 pF, CMOS signal levels
(See Figure 7)
Pulse Width Distortion |t
PLH
Change vs. Temperature
Propagation Delay Skew (Equal Temperature)
Propagation Delay Skew (Equal Temperature,
5, 7
Supplies)
Output Rise/Fall TimetR, t
Common-Mode Transient Immunity at Logic
Low/High Output
8
Refresh Ratef
Input Dynamic Supply Current
Output Dynamic Supply Current
5
− t
|
PHL
6
9
9
PWD0.52nsCL = 15 pF, CMOS signal levels
3ps/°CCL = 15 pF, CMOS signal levels
5, 7
t
PSK1
t
PSK2
F
|CML|, |
CMH|
r
I
DDI (D)
I
DDO (D)
3nsCL = 15 pF, CMOS signal levels
2535kV/µsVI = 0 V or V
1.2Mbps
0.09mA/Mbps
0.02mA/Mbps
8nsCL = 15 pF, CMOS signal levels
6nsCL = 15 pF, CMOS signal levels
, VCM = 1000 V, transient
DD1
magnitude = 800 V
1
Output supply current values are with no output load present. See Figure 5 and Figure 6 for information on supply current variation with logic signal frequency. See the
Power Consumption section for guidance on calculating the input and output supply currents for a given data rate and output load.
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
analog.comRev. L | 3 of 19
Page 4
Data SheetADuM1100
SPECIFICATIONS
4
t
is measured from the 50% level of the falling edge of the V
PHL
edge of the VI signal to the 50% level of the rising edge of the V
5
Because the input thresholds of the ADuM1100 are at voltages other than the 50% level of typical input signals, the measured propagation delay and pulse width distortion
can be affected by slow input rise/fall times. See the Propagation Delay-Related Parameters section and Figure 14 through Figure 18 for information on the impact of given
input rise/fall times on these parameters.
6
Pulse width distortion change vs. temperature is the absolute value of the change in pulse width distortion for a 1°C change in operating temperature.
7
t
is the magnitude of the worst-case difference in t
PSK1
recommended operating conditions. t
is the magnitude of the worst-case difference in t
PSK2
temperature, supply voltages, and output load within the recommended operating conditions.
8
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining V
can be sustained while maintaining V
< 0.8 V. The common-mode voltage slew rates apply to both rising and falling edges. The transient magnitude is the range over
O
which the common mode is slewed.
9
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 5 and Figure 6 for information on supply
current variation with logic signal frequency. See the Power Consumption section for guidance on calculating the input and output supply currents for a given data rate and
output load.
signal to the 50% level of the falling edge of the V
I
signal.
O
and/or t
PHL
that is measured between units at the same operating temperature and output load within the
PLH
and/or t
PHL
that is measured between units at the same operating
PLH
> 0.8 V
O
DD2
signal. t
O
is measured from the 50% level of the rising
PLH
. CML is the maximum common-mode voltage slew rate that
analog.comRev. L | 4 of 19
Page 5
Data SheetADuM1100
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS—3.3 V OPERATION
All voltages are relative to their respective ground. 3.0 V ≤ V
the entire recommended operation range, unless otherwise noted. All typical specifications are at T
≤ 3.6 V, 3.0 V ≤ V
DD1
≤ 3.6 V. All minimum/maximum specifications apply over
DD2
= 25°C, V
A
DD1
= V
DD2
= 3.3 V.
Table 2.
ParameterSymbolMinTypMaxUnitTest Conditions
DC SPECIFICATIONS
Input Supply CurrentI
Output Supply CurrentI
Input Supply Current (25 Mbps) (See Figure 5)I
Output Supply Current1 (25 Mbps) (See Figure 6)I
Input Supply Current (50 Mbps) (See Figure 5)I
DD1 (Q)
DD2 (Q)
DD1 (25)
DD2 (25)
DD1 (50)
0.10.3mAVI = 0 V or V
0.0050.04mAVI = 0 V or V
DD1
DD1
2.02.8mA12.5 MHz logic signal frequency
0.30.7mA12.5 MHz logic signal frequency
4.06.0mA25 MHz logic signal frequency, ADuM1100BR/
ADuM1100UR only
Output Supply Current1 (50 Mbps) (See Figure 6)I
DD2 (50)
1.21.6mA25 MHz logic signal frequency, ADuM1100BR/
ADuM1100UR only
Input CurrentI
Logic High Output VoltageV
Logic Low Output VoltageV
I
OH
OL
−10+0.01+10µA0 V ≤ VIN ≤ V
V
− 0.13.3VIO = −20 μA, VI = V
DD2
V
− 0.53.0VIO = −2.5 mA, VI = V
DD2
0.00.1VIO = 20 μA, VI = V
0.040.1VIO = 400 μA, VI = V
0.30.4VIO = 2.5 mA, VI = V
DD1
IH
IH
IL
IL
IL
SWITCHING SPECIFICATIONS
For ADuM1100AR
Minimum Pulse Width
Maximum Data Rate
2
3
PW40nsCL = 15 pF, CMOS signal levels
25MbpsCL = 15 pF, CMOS signal levels
For ADuM1100BR/ADuM1100UR
Minimum Pulse Width
Maximum Data Rate
2
3
PW1020nsCL = 15 pF, CMOS signal levels
50100MbpsCL = 15 pF, CMOS signal levels
For All Grades
Propagation Delay Time to Logic Low Output
4, 5
t
PHL
14.528nsCL = 15 pF, CMOS signal levels
(See Figure 8)
Propagation Delay Time to Logic High Output
4, 5
t
PLH
15.028nsCL = 15 pF, CMOS signal levels
(See Figure 8)
Pulse Width Distortion |t
PLH
Change vs. Temperature
Propagation Delay Skew (Equal Temperature)
Propagation Delay Skew (Equal Temperature,
5, 7
Supplies)
Output Rise/Fall TimetR, t
Common-Mode Transient Immunity at Logic
Low/High Output
8
Refresh Ratef
Input Dynamic Supply Current
Output Dynamic Supply Current
5
− t
|
PHL
6
9
9
PWD0.53nsCL = 15 pF, CMOS signal levels
10ps/°CCL = 15 pF, CMOS signal levels
5, 7
t
PSK1
t
PSK2
F
|CML|, |
CMH|
r
I
DDI (D)
I
DDO (D)
3nsCL = 15 pF, CMOS signal levels
2535kV/µsVI = 0 V or V
1.1Mbps
0.08mA/Mbps
0.04mA/Mbps
15nsCL = 15 pF, CMOS signal levels
12nsCL = 15 pF, CMOS signal levels
, VCM = 1000 V, transient
DD1
magnitude = 800 V
1
Output supply current values are with no output load present. See Figure 5 and Figure 6 for information on supply current variation with logic signal frequency. See the
Power Consumption section for guidance on calculating the input and output supply currents for a given data rate and output load.
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
analog.comRev. L | 5 of 19
Page 6
Data SheetADuM1100
SPECIFICATIONS
4
t
is measured from the 50% level of the falling edge of the V
PHL
edge of the VI signal to the 50% level of the rising edge of the V
5
Because the input thresholds of the ADuM1100 are at voltages other than the 50% level of typical input signals, the measured propagation delay and pulse width distortion
can be affected by slow input rise/fall times. See the Propagation Delay-Related Parameters section and Figure 14 through Figure 18 for information on the impact of given
input rise/fall times on these parameters.
6
Pulse width distortion change vs. temperature is the absolute value of the change in pulse width distortion for a 1°C change in operating temperature.
7
t
is the magnitude of the worst-case difference in t
PSK1
recommended operating conditions. t
is the magnitude of the worst-case difference in t
PSK2
temperature, supply voltages, and output load within the recommended operating conditions.
8
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining V
can be sustained while maintaining V
< 0.8 V. The common-mode voltage slew rates apply to both rising and falling edges. The transient magnitude is the range over
O
which the common mode is slewed.
9
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 5 and Figure 6 for information on supply
current variation with logic signal frequency. See the Power Consumption section for guidance on calculating the input and output supply currents for a given data rate and
output load.
signal to the 50% level of the falling edge of the V
I
signal.
O
and/or t
PHL
that is measured between units at the same operating temperature and output load within the
PLH
and/or t
PHL
that is measured between units at the same operating
PLH
> 0.8 V
O
DD2
signal. t
O
is measured from the 50% level of the rising
PLH
. CML is the maximum common-mode voltage slew rate that
analog.comRev. L | 6 of 19
Page 7
Data SheetADuM1100
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS—MIXED 5 V/3 V OR 3 V/5 V OPERATION
All voltages are relative to their respective ground. 5 V/3 V operation: 4.5 V ≤ V
V
≤ 3.6 V, 4.5 V ≤ V
DD1
noted. All typical specifications are at T
≤ 5.5 V. All minimum/maximum specifications apply over the entire recommended operation range, unless otherwise
DD2
= 25°C, V
A
= 3.3 V, V
DD1
= 5 V or V
DD2
≤ 5.5 V, 3.0 V ≤ V
DD1
= 5 V, V
DD1
DD2
= 3.3 V.
≤ 3.6 V. 3 V/5 V operation: 3.0 V ≤
DD2
Table 3.
ParameterSymbolMinTypMaxUnitTest Conditions
DC SPECIFICATIONS
Input Supply Current, QuiescentI
DDI (Q)
5 V/3 V Operation0.30.8mA
3 V/5 V Operation0.10.3mA
Output Supply Current, QuiescentI
DDO (Q)
5 V/3 V Operation0.0050.04mA
3 V/5 V Operation0.010.06mA
Input Supply Current, 25 MbpsI
DDI (25)
5 V/3 V Operation2.23.5mA12.5 MHz logic signal frequency
3 V/5 V Operation2.02.8mA12.5 MHz logic signal frequency
Output Supply Current1, 25 MbpsI
DDO (25)
5 V/3 V Operation0.30.7mA12.5 MHz logic signal frequency
3 V/5 V Operation0.51.0mA12.5 MHz logic signal frequency
Input Supply Current, 50 MbpsI
DDI (50)
5 V/3 V Operation4.57.0mA25 MHz logic signal frequency
3 V/5 V Operation4.06.0mA25 MHz logic signal frequency
Output Supply Current1, 50 MbpsI
DDO (50)
5 V/3 V Operation1.21.6mA25 MHz logic signal frequency
3 V/5 V Operation1.01.5mA25 MHz logic signal frequency
Input CurrentsI
Logic High Output VoltageV
IA
OH
5 V/3 V OperationV
Logic Low Output VoltageV
OL
5 V/3 V Operation0.040.1VIO = 400 μA, VI = V
Logic High Output VoltageV
OH
3 V/5 V OperationV
Logic Low Output VoltageV
OL
3 V/5 V Operation0.030.1VIO = 400 μA, VI = V
−10+0.01+10μA0 V ≤ VIA, VIB, VIC, VID ≤ V
V
− 0.13.3VIO = −20 μA, VI = V
DD2
− 0.53.0VIO = −2.5 mA, VI = V
DD2
0.00.1VIO = 20 μA, VI = V
0.30.4VIO = 2.5 mA, VI = V
V
− 0.15.0VIO = −20 μA, VI = V
DD2
− 0.84.6VIO = −4 mA, VI = V
DD2
0.00.1VIO = 20 μA, VI = V
0.30.8VIO = 4 mA, VI = V
IH
IH
IL
IL
IL
IH
IH
IL
IL
IL
DD1
SWITCHING SPECIFICATIONS
For ADuM1100AR
Minimum Pulse Width
Maximum Data Rate
2
3
PW40nsCL = 15 pF, CMOS signal levels
25MbpsCL = 15 pF, CMOS signal levels
For ADuM1100BR/ADuM1100UR
Minimum Pulse Width
Maximum Data Rate
2
3
PW20nsCL = 15 pF, CMOS signal levels
50MbpsCL = 15 pF, CMOS signal levels
For All Grades
Propagation Delay Time to Logic Low/High
4, 5
Output
t
PHL
, t
PLH
5 V/3 V Operation (See Figure 9)1321nsCL = 15 pF, CMOS signal levels
3 V/5 V Operation (See Figure 10)1626nsCL = 15 pF, CMOS signal levels
or V
DD2
analog.comRev. L | 7 of 19
Page 8
Data SheetADuM1100
SPECIFICATIONS
Table 3. (Continued)
ParameterSymbolMinTypMaxUnitTest Conditions
Pulse Width Distortion, |t
PLH
5 V/3 V Operation0.52nsCL = 15 pF, CMOS signal levels
3 V/5 V Operation0.53nsCL = 15 pF, CMOS signal levels
Change in Pulse Width Distortion vs.
Temperature
6
5 V/3 V Operation3ps/°CCL = 15 pF, CMOS signal levels
3 V/5 V Operation10ps/°CCL = 15 pF, CMOS signal levels
Propagation Delay Skew (Equal Temperature)
5 V/3 V Operation12nsCL = 15 pF, CMOS signal levels
3 V/5 V Operation15nsCL = 15 pF, CMOS signal levels
Propagation Delay Skew (Equal Temperature,
5, 7
Supplies)
5 V/3 V Operation9nsCL = 15 pF, CMOS signal levels
3 V/5 V Operation12nsCL = 15 pF, CMOS signal levels
Output Rise/Fall Time (10% to 90%)tR, t
Common-Mode Transient Immunity at Logic Low/
High Output
8
Refresh Ratef
5 V/3 V Operation1.2Mbps
3 V/5 V Operation1.1Mbps
Input Dynamic Supply Current
5 V/3 V Operation0.09mA/Mbps
3 V/5 V Operation0.08mA/Mbps
Output Dynamic Supply Current9C
5 V/3 V Operation0.04mA/Mbps
3 V/5 V Operation0.02mA/Mbps
− t
PHL
5
|
PWD
5, 7
t
PSK1
t
PSK2
F
3nsCL = 15 pF, CMOS signal levels
|CML|,|CMH|2535kV/µsVI = 0 V or V
, VCM = 1000 V,transient
DD1
magnitude = 800 V
r
9
C
PD1
PD2
1
Output supply current values are with no output load present. See Figure 5 and Figure 6 for information on supply current variation with logic signal frequency. See the
Power Consumption section for guidance on calculating the input and output supply currents for a given data rate and output load.
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
t
is measured from the 50% level of the falling edge of the V
PHL
edge of the VI signal to the 50% level of the rising edge of the V
5
Because the input thresholds of the ADuM1100 are at voltages other than the 50% level of typical input signals, the measured propagation delay and pulse width distortion
signal to the 50% level of the falling edge of the V
I
signal.
O
signal. t
O
PLH
is measured from the 50% level of the rising
can be affected by slow input rise/fall times. See the Propagation Delay-Related Parameters section and Figure 14 through Figure 18 for information on the impact of given
input rise/fall times on these parameters.
6
Pulse width distortion change vs. temperature is the absolute value of the change in pulse width distortion for a 1°C change in operating temperature.
7
t
is the magnitude of the worst-case difference in t
PSK1
the recommended operating conditions. t
is the magnitude of the worst-case difference in t
PSK2
and/or t
PHL
that is measured between units at the same operating temperature and output load within
PLH
and/or t
PHL
that is measured between units at the same operating
PLH
temperature, supply voltages, and output load within the recommended operating conditions.
8
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining V
can be sustained while maintaining V
< 0.8 V. The common-mode voltage slew rates apply to both rising and falling edges. The transient magnitude is the range over
O
> 0.8 V
O
. CML is the maximum common-mode voltage slew rate that
DD2
which the common mode is slewed.
9
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 5 and Figure 6 for information on supply
current variation with logic signal frequency. See the Power Consumption section for guidance on calculating the input and output supply currents for a given data rate and
output load.
analog.comRev. L | 8 of 19
Page 9
Data SheetADuM1100
SPECIFICATIONS
PACKAGE CHARACTERISTICS
Table 4.
ParameterSymbolMinTypMaxUnitTest Conditions
Resistance (Input-to-Output)
Capacitance (Input-to-Output)
Input Capacitance
2
1
1
IC Junction-to-Case Thermal Resistance, Side 1θ
IC Junction-to-Case Thermal Resistance, Side 2θ
Package Power DissipationP
1
The device is considered a 2-terminal device; Pin 1, Pin 2, Pin 3, and Pin 4 are shorted together, and Pin 5, Pin 6, Pin 7, and Pin 8 are shorted together.
2
Input capacitance is measured at Pin 2 (VI).
R
C
C
I-O
I-O
I
JCI
JCO
PD
REGULATORY INFORMATION
The ADuM1100 certification approvals are listed in Table 5.
Table 5.
ULCSACQCVDE
1
UL 1577
Single Protection, 2500 V rmsBasic insulation, 400 V rmsBasic insulation, 400 V rmsReinforced insulation, 560 V peak
IEC/EN/CSA 62368-1CQC GB4943.1DIN EN IEC 60747-17 (VDE 0884-17)
Reinforced insulation, 150 V rmsReinforced insulation, 150 V rms
IEC/CSA 61010-1
Basic insulation, 300 V rms
Reinforced insulation, 150 V rms
12
10
Ω
1.0pFf = 1 MHz
4.0pF
46°C/WThermocouple located at center of package underside
41°C/W
240mW
2
1
In accordance with UL 1577, each ADuM1100 is proof tested by applying an insulation test voltage ≥3000 V rms for 1 sec (current leakage detection limit = 5 µA).
2
In accordance with DIN EN IEC 60747-17 (VDE 0884-17), each ADuM1100 is proof tested by applying an insulation test voltage ≥1050 V peak for 1 sec (partial discharge
detection limit = 5 pC).
INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 6.
ParameterSymbolValueUnitConditions
Rated Dielectric Insulation Voltage2500V rms1-minute duration
Minimum External Air Gap (Clearance)L(I01)4
Minimum External Tracking (Creepage)L(I02)4mmMeasured from input terminals to output terminals, shortest
Minimum Internal Gap (Internal Clearance)18μmInsulation distance through insulation
Tracking Resistance (Comparative Tracking Index)CTI>400VDIN IEC 112/VDE 0303 Part 1
Material GroupIIMaterial Group per IEC 60664-1
1
In accordance with IEC 62368-1/IEC 60601-1 guidelines for the measurement of creepage and clearance distances for a pollution degree of 2 and altitudes ≤2000 meters.
2
Consideration must be given to pad layout to ensure the minimum required distance for clearance is maintained.
1, 2
mmMeasured from input terminals to output terminals, shortest
distance through air
distance path along body
analog.comRev. L | 9 of 19
Page 10
Data SheetADuM1100
SPECIFICATIONS
DIN EN IEC 60747-17 (VDE 0884-17) INSULATION CHARACTERISTICS
This isolator is suitable for reinforced isolation only within the safety limit data. Maintenance of the safety data is ensured by means of protective
circuits. The asterisk (*) marking on the package denotes DIN EN IEC 60747-17 (VDE 0884-17) approval.
Table 7.
DescriptionConditionsSymbolCharacteristicUnit
Overvoltage Category per IEC 60664-1
≤ 150 V rmsI to IV
≤ 300 V rmsI to III
≤ 400 V rmsI to II
Climatic Classification40/105/21
Pollution Degree per DIN VDE 0110, Table 12
Maximum Repetitive Isolation VoltageV
Maximum Working Insulation VoltageV
Input-to-Output Test Voltage, Method B1V
× 1.875 = V
IORM
, 100% production test, tm = 1
pd(m)
IORM
IOWM
V
pd(m)
sec, partial discharge < 5 pC
Input-to-Output Test Voltage, Method A
After Environmental Tests Subgroup 1V
× 1.6 = V
IORM
, tm = 60 sec, partial discharge <
pd(m)
V
pd(m)
5 pC
After Input and/or Safety Test Subgroup 2 and Subgroup 3V
× 1.2 = V
IORM
, tm = 60 sec, partial discharge <
pd(m)
V
pd(m)
5 pC
Maximum Transient Isolation VoltageV
Maximum Impulse VoltageSurge voltage in air, waveform per IEC 61000-4-5V
Maximum Surge Isolation VoltageV
= 1.2 × V
TEST
≥ 1.3 × V
TEST
, t =1s (100% production)V
IOTM
(sample test), tested in oil,
IMP
IOTM
IMP
V
IOSM
waveform per IEC 61000-4-5
Safety-Limiting ValuesMaximum value allowed in the event of a failure (see
Figure 2)
Case TemperatureT
Side 1 CurrentI
Side 2 CurrentI
Insulation Resistance at T
S
VIO = 500 VR
S
S1
S2
S
560V peak
396V rms
1050V peak
896V peak
672V peak
4000V peak
4000V peak
10000V
peak
150°C
160mA
170mA
9
>10
Ω
Figure 2. Thermal Derating Curve, Dependence of Safety-Limiting Values with Case Temperature per DIN EN IEC 60747-17 (VDE 0884-17)
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Page 11
Data SheetADuM1100
SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
Table 8.
ParameterSymbolMinMaxUnit
Operating Temperature
ADuM1100AR/ADuM1100BRT
ADuM1100URT
Supply Voltages
Logic High Input Voltage, 5 V Operation
Logic Low Input Voltage, 5 V Operation
Logic High Input Voltage, 3.3 V Operation
Logic Low Input Voltage, 3.3 V Operation
1
1, 2
(See Figure 11 and Figure 12)V
1, 2
(See Figure 11 and Figure 12)V
1, 2
(See Figure 11 and Figure 12)V
1, 2
(See Figure 11 and Figure 12)V
A
A
V
DD1,VDD2
IH
IL
IH
IL
Input Signal Rise and Fall Times1.0ms
1
All voltages are relative to their respective ground.
2
Input switching thresholds have 300 mV of hysteresis. See the Method of Operation, DC Correctness, and Magnetic Field Immunity section, Figure 19, and Figure 20 for
information on immunity to external magnetic fields.
−40+105°C
−40+125°C
3.05.5V
2.0V
DD1
V
0.00.8V
1.5V
DD1
V
0.00.5V
analog.comRev. L | 11 of 19
Page 12
Data SheetADuM1100
ABSOLUTE MAXIMUM RATINGS
Table 9.
ParameterSymbolMinMaxUnit
Storage TemperatureT
Ambient Operating TemperatureT
Supply Voltages
Input Voltage
Output Voltage
Average Current, per Pin
1
1
1
2
V
V
V
ST
A
DD1
I
O
−55+150°C
−40+125°C
, V
−0.5+6.5V
DD2
−0.5V
−0.5V
+ 0.5V
DD1
+ 0.5V
DD2
Temperature ≤ 105°C−25+25mA
Temperature ≤ 125°C
3
Refers to common-mode transients across the insulation barrier. Commonmode transients exceeding the Absolute Maximum Rating may cause latch-up
or permanent damage.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
ESD CAUTION
Input Current−7+7mA
Output Current−20+20mA
Common-Mode Transients
1
All voltages are relative to their respective ground.
2
See Figure 2 for information on maximum allowable current for various temper-
3
−100+100kV/µs
atures.
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
VO returns to VI state within 1 μs of power restoration.
StateV
DD1
StateVO Output
DD2
1
1
Figure 3 shows the package branding. The asterisk (*) is the DIN EN 60747-5-2 mark, R is the package designator (R denotes SOIC_N),
YYWW is the date code, and XXXXXX is the lot code.
Figure 3. Package Branding
analog.comRev. L | 12 of 19
Page 13
Data SheetADuM1100
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 4. Pin Configuration
Table 11. Pin Function Descriptions
Pin No.MnemonicDescription
1V
2V
3V
DD1
I
DD1
4GND
5GND
6V
O
7GND
8V
DD2
1
2
2
Input Supply Voltage, 3.0 V to 5.5 V.
Logic Input.
Input Supply Voltage, 3.0 V to 5.5 V.
Input Ground Reference.
Output Ground Reference.
Logic Output.
Output Ground Reference.
Output Supply Voltage, 3.0 V to 5.5 V.
analog.comRev. L | 13 of 19
Page 14
Data SheetADuM1100
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 5. Typical Input Supply Current vs. Logic Signal Frequency for 5 V
and 3.3 V Operation
Figure 6. Typical Output Supply Current vs. Logic Signal Frequency for 5 V
and 3.3 V Operation
Figure 8. Typical Propagation Delays vs. Temperature, 3.3 V Operation
Figure 9. Typical Propagation Delays vs. Temperature, 5 V/3 V Operation
Figure 10. Typical Propagation Delays vs. Temperature, 3 V/5 V Operation
Figure 7. Typical Propagation Delays vs. Temperature, 5 V Operation
analog.comRev. L | 14 of 19
Page 15
Data SheetADuM1100
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 11. Typical Input Voltage Switching Threshold, Low-to-High TransitionFigure 12. Typical Input Voltage Switching Threshold, High-to-Low Transition
analog.comRev. L | 15 of 19
Page 16
Data SheetADuM1100
APPLICATION INFORMATION
PC BOARD LAYOUT
The ADuM1100 digital isolator requires no external interface circuitry for the logic interfaces. A bypass capacitor is recommended at
the input and output supply pins. The input bypass capacitor can
conveniently be connected between Pin 3 and Pin 4 (see Figure
13). Alternatively, the bypass capacitor can be located between
Pin 1 and Pin 4. The output bypass capacitor can be connected
between Pin 7 and Pin 8 or Pin 5 and Pin 8. The capacitor value
should be between 0.01 µF and 0.1 µF. The total lead length
between both ends of the capacitor and the power supply pins
should not exceed 20 mm.
Pulse width distortion is the maximum difference between t
t
and provides an indication of how accurately the input signal’s
PHL
timing is preserved in the component’s output signal. Propagation
delay skew is the difference between the minimum and maximum
propagation delay values among multiple ADuM1100 components
operated at the same operating temperature and having the same
output load.
Depending on the input signal rise/fall time, the measured propagation delay based on the input 50% level can vary from the true
propagation delay of the component (as measured from its input
switching threshold). This is because the input threshold, as is the
case with commonly used optocouplers, is at a different voltage
level than the 50% point of typical input signals. This propagation
delay difference is given by
See the AN-1109 Application Note for board layout guidelines.
PROPAGATION DELAY-RELATED
PARAMETERS
Propagation delay time describes the length of time it takes for a
logic signal to propagate through a component. Propagation delay
time to logic low output and propagation delay time to logic high
output refer to the duration between an input signal transition and
PLH
∆HL = t′
PHL
where:
t
and t
PLH
PHL
input 50% level.
t’
and t’
PLH
input switching thresholds.
tR and tF are the input 10% to 90% rise/fall times.
VI is the amplitude of the input signal (0 V to V
V
and V
ITH (L–H)
the respective output signal transition (see Figure 14).
and
PLH
− t
= (tR/0.8 VI)(0.5 VI − V
PLH
− t
= (tF/0.8 VI)(0.5 VI − V
PHL
ITH (L-H)
)
ITH (H-L)
)
(1)
(2)
are the propagation delays as measured from the
are the propagation delays as measured from the
PHL
levels assumed).
are the input switching thresholds.
ITH (H–L)
I
Figure 14. Propagation Delay Parameters
Figure 15. Impact of Input Rise/Fall Time on Propagation Delay
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Page 17
Data SheetADuM1100
APPLICATION INFORMATION
Figure 16. Typical Propagation Delay Change Due to Input Rise Time
Variation (for V
= 3.3 V and 5 V)
DD1
Figure 18. Typical Pulse Width Distortion Adjustment Due to Input Rise/Fall
METHOD OF OPERATION, DC CORRECTNESS,
AND MAGNETIC FIELD IMMUNITY
The two coils in Figure 1 act as a pulse transformer. Positive and
negative logic transitions at the isolator input cause narrow (2 ns)
pulses to be sent via the transformer to the decoder. The decoder
is bistable and therefore either set or reset by the pulses indicating
input logic transitions. In the absence of logic transitions at the input
for more than ~1 μs, a periodic update pulse of the appropriate
polarity is sent to ensure dc correctness at the output. If the
decoder receives none of these update pulses for more than about
5 μs, the input side is assumed to be unpowered or nonfunctional,
in which case the isolator output is forced to a logic high state by
the watchdog timer circuit.
Figure 17. Typical Propagation Delay Change Due to Input Fall Time Variation
(for V
= 3.3 V and 5 V)
DD1
The limitation on the magnetic field immunity of the ADuM1100 is
set by the condition in which induced voltage in the transformer’s
receiving coil is sufficiently large to either falsely set or reset the deThe impact of the slower input edge rates can also affect the
measured pulse width distortion as based on the input 50% level.
This impact can either increase or decrease the apparent pulse
width distortion depending on the relative magnitudes of t
PHL
, t
PLH
,
and PWD. The case of interest here is the condition that leads to
the largest increase in pulse width distortion. The change in this
case is given by
∆
= PWD′ − PWD = ∆LH − ∆HL = (t/0.8 VI)(V − V
PWD
V
), (for t = tR = tF)
ITH (H-L)
ITH (L-H)
−
(3)
where:
PWD = |t
PWD’ = |t’
PLH
PLH
− t
− t’
PHL
PHL
|.
|.
This adjustment in pulse width distortion is plotted as a function of
input rise/fall time in Figure 18.
coder. The analysis that follows defines the conditions under which
this can occur. The 3.3 V operating condition of the ADuM1100
is examined because it represents the most susceptible mode of
operation.
The pulses at the transformer output are greater than 1.0 V in
amplitude. The decoder has sensing thresholds at about 0.5 V,
therefore establishing a 0.5 V margin in which induced voltages can
be tolerated. The voltage induced across the receiving coil is given
by
V = (−dβ/dt) ∑π r
where:
β is the magnetic flux density (gauss).
N is the number of turns in the receiving coil.
rn is the radius of the nth turn in the receiving coil (cm).
Time Variation (for V
2
, n = 1, 2, . . . , N
n
DD1
= 3.3 V and 5 V)
(4)
Given the geometry of the receiving coil in the ADuM1100 and an
imposed requirement that the induced voltage be at most 50% of
analog.comRev. L | 17 of 19
Page 18
Data SheetADuM1100
APPLICATION INFORMATION
the 0.5 V margin at the decoder, a maximum allowable magnetic
field is calculated, as shown in Figure 19.
Note that at combinations of strong magnetic field and high frequency, any loops formed by printed circuit board traces could
induce sufficiently large error voltages to trigger the thresholds of
succeeding circuitry. Care should be taken in the layout of such
traces to avoid this possibility.
POWER CONSUMPTION
The supply current of the ADuM1100 isolator is a function of the
supply voltage, the input data rate, and the output load.
The input supply current is given by
I
= I
DDI
DDI (Q)
I
= I
DDI
DDI (D)
The output supply current is given by
I
= I
DDO
Figure 19. Maximum Allowable External Magnetic Field
For example, at a magnetic field frequency of 1 MHz, the maximum
allowable magnetic field of 0.2 kgauss induces a voltage of 0.25 V
at the receiving coil. This is about 50% of the sensing threshold and
does not cause a faulty output transition. Similarly, if such an event
were to occur during a transmitted pulse (and was of the worst-case
polarity), it would reduce the received pulse from >1.0 V to 0.75 V,
still well above the 0.5 V sensing threshold of the decoder.
The preceding magnetic flux density values correspond to specific
current magnitudes at given distances away from the ADuM1100
transformers. Figure 20 expresses these allowable current magnitudes as a function of frequency for selected distances. As can be
seen, the ADuM1100 is extremely immune and can be affected only
DDO (Q)
I
= (I
DDO
DDO (D)
f > 0.5f
where:
I
, I
DDI (D)
DDO (D)
per channel (mA/Mbps).
CL is the output load capacitance (pF).
V
is the output supply voltage (V).
DDO
f is the input logic signal frequency (MHz, half the input data rate,
NRZ signaling).
fr is the input stage refresh rate (Mbps).
I
, I
DDI (Q)
DDO (Q)
currents (mA).
by extremely large currents operated at high frequency and very
close to the component. For the 1 MHz example noted, one would
have to place a current of 0.5 kA 5 mm away from the ADuM1100 to
affect the component’s operation.
f ≤ 0.5f
× (2f − fr) + I
f > 0.5f
DDI (Q)
f ≤ 0.5f
+ (0.5 × 10−3) × CLV
) × (2f − fr) + I
DDO
DDO (Q)
(5)
r
(6)
r
(7)
r
(8)
r
are the input and output dynamic supply currents
are the specified input and output quiescent supply
Figure 20. Maximum Allowable Current for Various Current-to-ADuM1100
R-8SOIC_N8-Lead Standard Small Outline Package, Narrow Body
For the latest package outline information and land patterns (footprints), go to Package Index.
ORDERING GUIDE
1
Model
ADuM1100AR−40°C to +105°C8-Lead SOIC_NTube, 98R-8
ADuM1100AR-RL7−40°C to +105°C8-Lead SOIC_NReel, 1000R-8
ADuM1100ARZ−40°C to +105°C8-Lead SOIC_NTube, 98R-8
ADuM1100ARZ-RL7−40°C to +105°C8-Lead SOIC_NReel, 1000R-8
ADuM1100BR−40°C to +105°C8-Lead SOIC_NTube, 98R-8
ADuM1100BR-RL7−40°C to +105°C8-Lead SOIC_NReel, 1000R-8
ADuM1100BRZ−40°C to +105°C8-Lead SOIC_NTube, 98R-8
ADuM1100BRZ-RL7−40°C to +105°C8-Lead SOIC_NReel, 1000R-8
ADuM1100UR−40°C to +125°C8-Lead SOIC_NTube, 98R-8
ADuM1100UR-RL7−40°C to +125°C8-Lead SOIC_NReel, 1000R-8
ADuM1100URZ−40°C to +125°C8-Lead SOIC_NTube, 98R-8
ADuM1100URZ-RL7−40°C to +125°C8-Lead SOIC_NReel, 1000R-8
Temperature RangePackage DescriptionPacking QuantityPackage Option
1
Z = RoHS Compliant Part.
MAXIMUM DATA RATE (MBPS) AND MINIMUM PULSE WIDTH (NS) OPTIONS