z Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z 0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iii
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF
THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY
BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY
FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE
MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS
MOTHERBOARD AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT
BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER
PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT
BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS
OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY
NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE
COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION
AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition Aug., 2009
Item Checklist
5
AMD785G Platform Processor Chipset based motherboard
5
CD for motherboard utilities
5
User’s Manual
5
SATA Cable
5
I/O back panel
AMD AM3 Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance with increasing
operation clock, thermal management becomes increasingly crucial while building computer
systems. Maintaining the proper computing environment without thermal increasing is the key to
reliable, stable, and 24 hours system operation. The overall goal is keeping the processor
below its specified maximum case temperature. Heatsinks induce improved processor heat
dissipation through increasing surface area and concentrated airflow from attached active
cooling fans. In addition, interface materials allow effective transfers of heat from the
processor to the heatsink. For optimum heat transfer, AMD recommends the use of thermal
grease and mounting clips to attach the heatsink to the processor.
Please refer to the website below for collection of heatsinks evaluated and recommended for
Socket AM3 processors by AMD. In addition, this collection is not intended to be a
comprehensive listing of all heatsinks that support AM3 processors.
iv
Chapter 1
Introduction of AMD785G Motherboards
1-1 Features of motherboard
The AMD785G chipset motherboard series are based on the latest AMD785G Chipset
and the SB710 chipset which supports the innovative AMD Phenom™ II X3 processor
and AMD Phenom™ II X 4 processors. With an integrated low-latency high-bandwidth
DDRIII memory controller and a highly-scalable Hyper Transport technology-based
system bus up to HT 3.0. AMD785G Platform Processor Chipset motherboard series
deliver the outstanding system performance and professional desktop platform
solution.
The AMD785G Series motherboards support new generation Socket AM3 processors
with an integrated DDRIII memory controller for Dual channel DDRIII800 /DDRIII1066/
DDRIII1333/DDRIII1600 DDRIII Module up to 8GB, also provide a DDRIII 128Mb
GPU Memory. The motherboard is embedded with SB710 chipset of providing ULTRA
ATA 133 connectors and Serial ATA2 with RAID 0, 1, 10 functions which support up to
one IDE and six Serial ATA2 devices to accelerate hard disk drives and guarantee the
data security without failure in advanced computing performance.
The AMD785G motherboards provide PCI-E Gigabit LAN chip which supports
10/100/1000Mbps data transfer rate. And the embedded ALC662 6-channel HD Audio
CODEC is fully compatible with Sound Blaster Pro standards that offer you with the
home cinema quality and satisfying software compatibility.
AMD785G Series motherboard series offer one PCI-Express2.0x16 graphics slots.
One PCI-Express 2.0 x16by16 deliver up to 8Gbyte/sec data transfer rate at each
relative direction. The AMD785G motherboards also carry two 32-bit PCI slots
guarantee the rich connectivity for the I/O peripheral devices. This motherboard
support Hybrid CrossFire function: when this function is selected through BIOS setting,
the VGA Card on PE1 and the integrated graphics chip together will activate a Hybrid
CrossFire with and the performance will be increased 15% to 75%.
Embedded USB controllers as well as capability of expanding to 8 of USB2.0
functional ports delivering 480Mb/s bandwidth of rich connectivity, these
motherboards meet the future USB demands which are also equipped with hardware
monitor function on system to monitor and protect your system and maintain your
non-stop business computing.
Some special features---
Audio
/
Windows7
in this motherboard are designed for power user to use the
CPU Thermal Throttling/ CPU VID/OC-CON/ G.P.I Function/3D
over-clocking function in more flexible ways. But please be caution that the
over-clocking maybe causes the fails in system reliabilities. This motherboard
provides the guaranteed performance and meets the demands of the next generation
computing. But if you insist to gain more system performance with variety possibilities
1
of the components you choose, please be careful and make sure to read the detailed
descriptions of these value added product features, please get them in the coming
section.
1-1.1 Special Features of Motherboard
CPU Thermal Throttling Technology---(The CPU Overheat Protection Technology)
To prevent the increasing heat from damage of CPU or accidental shutdown while at high
workload, the CPU Thermal Throttling Technology will force CPU to enter partially idle mode from
87.5% to 12.5% according to preset CPU operating temperature in BIOS (from 40℃ to 90℃).
When the system senses the CPU operating temperature reaching the preset value, the CPU
operating bandwidth will be decreased to the preset idle percentage to cool down the processor.
When at throttling mode the beeper sound can be optionally selected to indicate it is in working.
(For detail operating please read Section 3-11 Bi-turbo Configuration)
CPU VID--- (Shift to Higher Performance)
The CPU voltage can be adjusted for the precisely over-clocking of extra demanding computing
performance.
The working temperature is from 55 degrees Centigrade below zero to 125 degrees Centigrade,
OC-CON capacitors possess superior physical characteristics that can be while reducing the
working temperature between 20 degrees Centigrade each time, intact extension 10 times of
effective product operation lives, at not rising degrees Centigrade of working temperatures each
time a relative one, life of product decline 10% only too.
G.P.I Function---G.P.I is a technology with remarkable power saving function: when you are
using a computer with G.P.I mold turned on, you save averagely 10.5W in power consumption in
the whole process than normal computer without G.P.I technology.
3D Audio
OP with two-stage Butterworth filter and quadruple noninverting amplifier enhances bass effect
under the 100MHz range to perfect audio effect, brings you stunning shock experience in video
game, true-to-life simulated feeling when watching films and the greatest touch as that in the
concert.
2
1-2 Specification
Spec Description
Design
Chipset
CPU Socket AM2
Memory Socket
GPU Memory
Expansion Slot
Integrate IDE and
Serial ATA2 RAID
Gigabit LAN
6 CH-Audio
z Micro ATX form factor; 4 layers PCB ;size:24.5cm*21.0cm
z AMD785G North Bridge Chipset
z AMD SB710 South Bridge Chipset
z Support AMD AM3 processors: AMD Phenom™ II X3 and AMD
Phenom™ II X4 processors
z Support HT 3.0
z 240-pin DDRIII Module socket x 2
z Support 2pcs DDRIII800/DDRIII1066/DDRIII1333/DDRIII1600
Modules Expandable to 8GB
z Dual channel supported
z Embedded 128Mb DDRIII GPU sideport Memory
z 1 pcs PCI-Express 2.0 x16 by 16 lane
z 2pcs 32-bit PCI slots
z One IDE controllers support PCI Bus Mastering, ATA PIO/DMA
and the ULTRA DMA 33/66/100/133 functions that deliver the data
transfer rate up to 133 MB/s for 2 IDE Devices and for 6 Serial
ATA2 ports providing 300 MB/sec data transfer rate with RAID 0, 1,
10 functions
z Integrated PCI-E gigabit LAN chip.
z Support Fast Ethernet LAN function of providing
10Mb/100Mb/1000 Mb/s data transfer rate
z Realtek ALC662 HD Audio 6-channel Audio Codec integrated
z Support 6-channel 3D surround & Positioning Audio
z Audio driver and utility included
BIOS
Multi I/O
z AMI 8MB DIP Flash ROM BIOS
z PS/2 keyboard and PS/2 mouse connectors
z Coaxial S/PDIF Out Connector x1
z HDMI Connector x1
z DVI Connector x1 (HDMI Connector and DVI Connector can not be
used at the same time)
z VGA Connector x1
z USB2.0 port x 4 and header x 2
z RJ-45 LAN Connector x1
z COM header x1
z Audio connectorx1
z Hard disk driver connector x 1/ SATA connector x 6
z Serial Port header x1
z HDMI_SPDIF header x1
3
/
1-3 Performance List
The following performance data list is the testing result of some popular benchmark
testing programs. These data are just referred by users, and there is no responsibility
for different testing data values gotten by users (the different Hardware & Software
configuration will result in different benchmark testing results.)
CN5/UL1 for USB USB2.0 Port Connector 4-pin Connector P.13
UL1 for RJ45LAN Gigabit LAN Port Connector RJ-45 Connector P.13
AUDIO 8-CH HD Audio Connector 6- phone jack Conn. P.13
IDE1 Primary IDE Connector 40-pin Block P.13
SATA1, SATA2,
SATA3,SATA4,
SATA5,SATA6
VGA1 D-Sub Connector 15-pin Connector P.14
DVI Digital Visual Interface 24-pin Connector P.14
HDMI High-Definition Multimedia 19-pin Connector P.14
SPDIF_OUT1 Coaxial HDMI-SPDIF Out Connector1-phone Connector
Serial ATAII IDE Connectors 7-pin Connector P.14
6-pin Female P.13
P.14
Headers
Header Name Description Page
AUDIO1 Front Panel SPEAKER, MIC header 9-pin Block P.15
USB1,USB2USB Port Headers 9-pin Block P.15
SPEAK1 PC Speaker connector 4-pin Block P.15
PWR LED1 Power LED 3-pin Block P.15
JW_FP1
(Reset/IDE LED/Power
Button)
SYSFAN1/2 FAN Headers 3-pin Block P.16
CPUFAN FAN Header 4-pin Block P.16
CDIN1 CD Audio-In Header 4-pin Block P.16
COM1 Serial Port COM1 Header 9-pin Block P.17
HDMI-SPDIF SPDIF Out header 2-pin Block P.17
Front Panel Header
(including IDE activity LED/Reset
switch / Power On Button lead)
9-pin Block P.15
7
Chapter 2
Hardware Installation
WARNING!
Turn off your power when adding or removing expansion cards or
other system components. Failure to do so may cause severe
damage to both your motherboard and expansion cards.
2-1 Hardware installation Steps
Before using your computer, you had better complete the following steps:
1. Check motherboard jumper setting
2. Install CPU and Fan
3. Install System Memory (DIMM)
4. Install Expansion cards
5. Connect IDE and Front Panel /Back Panel cable
6. Connect ATX Power cable
7. Power-On and Load Standard Default
8. Reboot
9. Install Operating System
10. Install Driver and Utility
2-2 Checking Motherboard’s Jumper Setting
(1) Keyboard/USB function Enabled/Disabled: JP1
JP1
1-2 Close d KB/USB Power O N Dis able (De fault)
Keyb oard/Mous e & U SB Power On Settin g
JP1
2-3 Closed KB/USB Power ON Enabled
(2) CMOS RAM Clear (3-pin) : JBAT
A battery must be used to retain the motherboard configuration in CMOS RAM short
1-2 pins of JBAT to store the CMOS data.
To clear the CMOS, follow the procedure below:
1. Turn off the system and unplug the AC power
2. Remove ATX power cable from ATX power connector
3. Locate JBAT and short pins 2-3 for a few seconds
4. Return JBAT to its normal setting by shorting pins 1-2
5. Connect ATX power cable back to ATX power connector
Note: When should clear CMOS
1. Troubleshooting
2. Forget password
3. After over clocking system boot fail
JBATJBAT
1-2 Closed Normal
CMOS RAM Clear Setting
2-3 Closed Clear CMOS
2-3 Install CPU
2-3-1 Glossary
Chipset (or core logic) - two or more integrated circuits which control the interfaces
between the system processor, RAM, I/O devises, and adapter cards.
Processor socket - the socket used to mount the system processor on the
motherboard.
Slot (PCI-E, PCI, RAM) - the slots used to mount adapter cards and system RAM.
PCI - Peripheral Component Interconnect - a high speed interface for video cards,
sound cards, network interface cards, and modems; runs at 33MHz.
PCI Express2.0- Peripheral Component Interconnect Express2.0, developed in 2003,
the speed of each line doubled from the previous PCI-E of 2.5 Gbps to 5 Gbps.
Serial Port - a low speed interface typically used for mouse and external modems.
Parallel Port - a low speed interface typically used for printers.
PS/2 - a low speed interface used for mouse and keyboards.
USB - Universal Serial Bus - a medium speed interface typically used for mouse,
keyboards, scanners, and some digital cameras.
Sound (interface) - the interface between the sound card or integrated sound
connectors and speakers, MIC, game controllers, and MIDI sound devices.
LAN (interface) - Local Area Network - the interface to your local area network.
BIOS (Basic Input/Output System) - the program logic used to boot up a computer
and establish the relationship between the various components.
Driver - software, which defines the characteristics of a device for use by another
device or other software.
Processor - the "central processing unit" (CPU); the principal integrated circuit used
for doing the "computing" in "personal computer"
Front Side Bus Frequency -
generated by the clock generator for CPU, DRAM and PCI BUS.
CPU L2 Cache -
the flash memory inside the CPU, normal it depend on CPU type.
the working frequency of the motherboard, which is
8
2-3-2 About AMD AM3 CPU Installation
This motherboard provides a socket AM2 surface mount, Zero Insertion Force (ZIF)
socket, referred to as the mPGA940 socket supports AMD AM3 series processors.
The CPU that comes with the motherboard should have a cooling FAN attached to
prevent overheating. If this is not the case, then purchase a correct cooling FAN
before you turn on your system.
WARNING!
To install a CPU, first turn off your system and remove its cover. Locate the ZIF
socket and open it by first pulling the level sideways away from the socket then
upward to a 90-degree angle. Insert the CPU with the correct orientation as shown
below. The notched corner should point toward the end of the level. Because the
CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation
as shown.
Be sure that there is sufficient air circulation across the processor’s
heatsink and CPU cooling FAN is working correctly, otherwise it may
cause the processor and motherboard overheat and damage, you
may install an auxiliary cooling FAN, if necessary.
Colden Arrow
So cket AM2
CPU ZIF mPGAB Socket
When you put the CPU into the ZIF socket, No force required to insert of the CPU, and
then press the level to locate position slightly without any extra force.
9
2-4 Install Memory
This motherboard provides two 240-pin DDRIII DUAL INLINE MEMORY MODULES
(DIMM) socket for DDRIII memory expansion to maximum memory volume of 8 GB
DDR SDRAM.
2. Two DDRIII Memory Modules---Plug in DDRIII1 and DDRIII 2 for Dual channel
function
Dual channel Limited!
1. Dual channel function only supports when 2 DDRIII Modules plug in either both DDRIII1
& DDRIII2.
2. Memory modules plugged in DDRIII1 & DDRIII2 must be of the same type, same size,
and same frequency for dual channel function.
Install DDRI II modules to your motherboard is not difficult, you can refer to figure
below to see how to install a 240-Pin DDRIII800/DDRIII1066/DDRIII1333/DDRIII1600
module.
DIMM1 (BA NK0+ BAN K1)
DIMM2 (BANK2+BANK3)
DRIII1 & DDRIII2 :
Dual Channel
NOTE! When you install DIMM module fully into the DIMM socket the eject tab should be
locked into the DIMM module very firmly and fit into its indention on both sides.
10
2-5 Expansion Cards
2-5-1 Procedure For Expansion Card Installation
1. Read the documentation for your expansion card and make any necessary
hardware or software setting for your expansion card such as jumpers.
2. Remove your computer’s cover and the bracket plate on the slot you intend to use.
3. Align the card’s connectors and press firmly.
4. Secure the card on the slot with the screen you remove above.
5. Replace the computer system’s cover.
6. Set up the BIOS if necessary.
7. Install the necessary software driver for your expansion card.
2-5-2 Assigning IRQs For Expansion Card
Some expansion cards need an IRQ to operate. Generally, an IRQ must exclusively
assign to one use. In a standard design, there are 16 IRQs available but most of
them are already in use.
Standard Interrupt Assignments
IRQ Priority Standard function
0 N/A System Timer
1 N/A Keyboard Controller
2 N/A Programmable Interrupt
3 * 8 Communications Port (COM2)
4 * 9 Communications Port (COM1)
5 * 6 Sound Card (sometimes LPT2)
6 * 11 Floppy Disk Controller
7 * 7 Printer Port (LPT1)
8 N/A System CMOS/Real Time Clock
9 * 10 ACPI Mode when enabled
10 * 3 IRQ Holder for PCI Steering
11 * 2 IRQ Holder for PCI Steering
12 * 4 PS/2 Compatible Mouse Port
13 N/A Numeric Data Processor
14 * 5 Primary IDE Channel
15 * 1 Secondary IDE Channel
* These IRQs are usually available for ISA or PCI devices.
NOTE! If using PCI cards on shared slots, make sure that the drivers support “Shared
IRQ” or that the cards don’t need IRQ assignments. Conflicts will arise between the
two PCI groups that will make the system unstable or cards inoperable.
2-5-3 Expasion Slot
One PCI-Express2.0 x16@16 lane graphic slot offer 8Gbyte/sec data transfer rate at
each relative direction and up to 16Gbyte/sec concurrent bandwidth at full speed.
Fully compliant to the
PCI Express Base Specification revision2.0
Express VGA card, and other PCI Express device. Two 32-bit PCI slots guarantee the
rich connectivity for the I/O of peripherals.
11
, support PCI
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