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their respective companies.
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Revision History
DateRevDescription
Public revision H of the AMD Athlon™ XP Processor Model 8 Data Sheet includes the following
changes:
March 2003H
March 2003G
■In Chapter 6, revised Table 2, “Electrical and Thermal Specifications for Processors with a
CPUID of 681,” on page 23.
■
In Chapter 12, revised Figure 18, “OPN Example for the AMD Athlon™ XP Processor Model 8,”
on page 81.
Public revision G of the AMD Athlon™ XP Processor Model 8 Data Sheet includes the following
changes:
■In Chapter 6, revised Table 2, “Electrical and Thermal Specifications for Processors with a
CPUID of 681,” on page 23.
■In Chapter 7, revised Table 6, “SYSCLK and SYSCLK# AC Characteristics,” on page 28.
■In Chapter 10, renamed Table 21, “Part Number 27291 OPGA Package Dimensions for
AMD Athlon™ XP Processors Model 8 with a CPUID of 680,” on page 50, renamed Table 22,
“Part Number 27291 OPGA Package Dimensions for AMD Athlon™ XP Processors Model 8
with a CPUID of 681,” on page 51, added Table 23, “Part Number 27648 OPGA Package
Dimensions for AMD Athlon™ XP Processors Model 8 with a CPUID of 681,” on page 53,
renamed Figure 14, “AMD Athlon™ XP Processor Model 8 Part Number 27291 OPGA
Package,” on page 52, and added Figure 15, “AMD Athlon™ XP Processor Model 8 Part
Number 27648 OPGA Package,” on page 54.
■
In Chapter 12, revised Figure 18, “OPN Example for the AMD Athlon™ XP Processor Model 8,”
on page 81.
Public revision F of the AMD Athlon™ XP Processor Model 8 Data Sheet includes the following
changes:
December 2002F
■In Chapter 6, revised Table 2, “Electrical and Thermal Specifications for Processors with a
CPUID of 681,” on page 23.
■In Chapter 8, revised Table 16, “General AC and DC Characteristics,” on page 39 and
Figure 12, “General ATE Open-Drain Test Circuit,” on page 41.
Public revision E of the AMD Athlon™ XP Processor Model 8 Data Sheet includes the following
changes:
■In Chapter 6, revised Table 2, “Electrical and Thermal Specifications for Processors with a
CPUID of 681,” on page 23.
November 2002E
■In Chapter 3, revised Figure 2, “Logic Symbol Diagram,” on page 7.
■In Chapter 7, revised Table 5, “Electrical and Thermal Specifications,” on page 27.
■In Chapter 8, revised Table 9, “VID[4:0] DC Characteristics,” on page 33.
■
In Chapter 12, revised Figure 18, “OPN Example for the AMD Athlon™ XP Processor Model 8,”
on page 81.
Revision History11
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H— March 2003
DateRevDescription
Public revision D of the AMD Athlon™ XP Processor Model 8 Data Sheet includes the following
changes:
■In Chapter 1, revised wording in Overview.
■In Chapter 6, revised Table 2, “Electrical and Thermal Specifications for Processors with a
CPUID of 681,” on page 23, added Table 3, “SYSCLK and SYSCLK# AC Characteristics,” on
page 24, Figure 8, “SYSCLK Waveform,” on page 24, and Table 4, “AMD Athlon™ System
Bus AC Characteristics,” on page 25.
■Added Chapter 7, “Advanced 333 Front-Side Bus AMD Athlon™ XP Processor Model 8
Specifications” on page 27, Table 5, “Electrical and Thermal Specifications,” on page 27,
Table 6, “SYSCLK and SYSCLK# AC Characteristics,” on page 28, Figure 9, “SYSCLK
October 2002D
Waveform,” on page 28, and Table 7, “AMD Athlon™ System Bus AC Characteristics,” on
page 29.
■In Chapter 8, revised Table 8, “Interface Signal Groupings,” on page 31, Table 9, “VID[4:0]
DC Characteristics,” on page 33, Table 10, “FID[3:0] DC Characteristics,” on page 33, and
Table 19, “APIC Pin AC and DC Characteristics,” on page 44.
■In Chapter 10, revised Table 21, “Part Number 27291 OPGA Package Dimensions for
AMD Athlon™ XP Processors Model 8 with a CPUID of 680,” on page 50 and Table 22, “Part
Number 27291 OPGA Package Dimensions for AMD Athlon™ XP Processors Model 8 with a
CPUID of 681,” on page 51.
■In Chapter 12, revised Figure 18, “OPN Example for the AMD Athlon™ XP Processor Model
8,” on page 81.
Public revision C of the AMD Athlon™ XP Processor Model 8 Data Sheet includes the following
changes:
■In Chapter 3, revised Figure 2, “Logic Symbol Diagram,” on page 7.
■In Chapter 6, added Table 1, “Electrical and Thermal Specifications for Processors with a
CPUID of 680,” on page 22 and Table 2, “Electrical and Thermal Specifications for
Processors with a CPUID of 681,” on page 23.
■In Chapter 8, revised Table 8, “Interface Signal Groupings,” on page 31.
■In Chapter 10, added Table 21, “Part Number 27291 OPGA Package Dimensions for
August 2002C
AMD Athlon™ XP Processors Model 8 with a CPUID of 680,” on page 50 and Table 22, “Part
Number 27291 OPGA Package Dimensions for AMD Athlon™ XP Processors Model 8 with a
CPUID of 681,” on page 51.
■In Chapter 11, revised Figure 16, “AMD Athlon™ XP Processor Model 8 Pin Diagram—
Topside View,” on page 56, Figure 17, “AMD Athlon™ XP Processor Model 8 Pin Diagram—
Bottomside View,” on page 57, Table 24, “Pin Name Abbreviations,” on page 58, Table 25,
“Cross-Reference by Pin Location,” on page 66, and added “FSB_Sense[1:0] Pins” on page
77, and Table 27, “Front-Side Bus Sense Truth Table,” on page 77.
■In Chapter 12, revised Figure 18, “OPN Example for the AMD Athlon™ XP Processor Model
8,” on page 81.
June 2002BFirst public release of the AMD Athlon™ XP Processor Model 8 Data Sheet
12Revision History
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
1Overview
The AMD Athlon™ XP processor model 8 with QuantiSpeed™
architecture powers the next generation in computing platforms,
®
delivering extreme performance for Windows
The AMD Athlon™ XP processor model 8, based on leadingedge 0.13 micron technology, integrates the innovative design
and manufacturing expertise of AMD to deliver improved
performance, lower power, and smaller die size while
maintaining the stable and compatible Socket A infrastructure
of the AMD Athlon processor.
Delivered in an OPGA package, the AMD Athlon XP processor
model 8 delivers the integer, floating-point, and 3D multimedia
performance for highly demanding applications running on x86
system platforms. The AMD Athlon XP processor model 8
delivers compelling performance for cutting-edge software
applications that include high-speed Internet capability, digital
content creation, digital photo editing, digital video, image
compression, video encoding for streaming over the Internet,
soft DVD, commercial 3D modeling, workstation-class
computer-aided design (CAD), commercial desktop publishing,
and speech recognition. The AMD Athlon XP processor model 8
also offers the scalability and reliability that IT managers and
business users require for enterprise computing.
XP.
The AMD Athlon XP processor model 8 features a
seventh-generation microarchitecture with an integrated,
exclusive L2 cache, which supports the growing processor and
system bandwidth requirements of emerging software,
graphics, I/O, and memory technologies. The high-speed
execution core of the AMD Athlon XP processor model 8
includes multiple x86 instruction decoders, a dual-ported
128-Kbyte split level-one (L1) cache, an exclusive 256-Kbyte L2
cache, three independent integer pipelines, three address
calculation pipelines, and a superscalar, fully pipelined,
out-of-order, three-way floating-point engine. The floating-point
engine is capable of delivering outstanding performance on
numerically complex applications.
Chapter 1Overview1
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
The features of the AMD Athlon XP processor model 8 are
QuantiSpeed™ architecture, a high-performance full-speedcache,
an advanced 333 front-side Bus (FSB) with a 2.7-Gigabyte per
second system bus, or an advanced 266 FSB with a 2.1-Gigabyte per
second system bus, and 3DNow!™ Professional technology. The
AMD Athlon system bus combines the latest technological
advances, such as point-to-point topology, source-synchronous
packet-based transfers, and low-voltage signaling to provide an
extremely powerful, scalable bus for an x86 processor.
The AMD Athlon XP processor model 8 is binary-compatible with
existing x86 software and backwards compatible with applications
optimized for MMX™, SSE, and 3DNow! technology. Using a data
format and single-instruction multiple-data (SIMD) operations
based on the MMX instruction model, the AMD Athlon XP
processor model 8 can produce as many as four, 32-bit,
single-precision floating-point results per clock cycle. The 3DNow!
Professional technology implemented in the AMD Athlon XP
processor model 8 includes new integer multimedia instructions
and software-directed data movement instructions for optimizing
such applications as digital content creation and streaming video
for the internet, as well as new instructions for digital signal
processing (DSP) and communications applications.
1.1QuantiSpeed™ Architecture Summary
The following features summarize the AMD Athlon XP
processor model 8 QuantiSpeed architecture:
■
Advanced 333 FSB technology available
■
An advanced nine-issue, superpipelined, superscalar x86
processor microarchitecture designed for increased instructions
per cycle (IPC) and high clock frequencies
■
Fully pipelined floating-point unit that executes all x87
(floating-point), MMX, SSE and 3DNow! instructions
■
Hardware data pre-fetch that increases and optimizes
performance on high-end software applications utilizing highbandwidth system capabilities
■
Advanced two-level translation look-aside buffer (TLB)
structures for both enhanced data and instruction address
translation. The AMD Athlon XP processor model 8 with
QuantiSpeed architecture incorporates three TLB
optimizations: the L1 DTLB increases from 32 to 40 entries, the
L2 ITLB and L2 DTLB both use exclusive architecture, and the
TLB entries can be speculatively loaded.
2OverviewChapter 1
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
The AMD Athlon XP processor model 8 delivers excellent
system performance in a cost-effective, industry-standard form
factor. The AMD Athlon XP processor model 8 is compatible
with motherboards based on Socket A.
Figure 1 shows a typical AMD Athlon XP processor model 8
system block diagram.
Thermal Monitor
AMD Athlon™ XP
Processor Model 8
AMD Athlon System Bus
AGP Bus
AGP
System Controller
(Northbridge)
Peripheral Bus
Controller
(Southbridge)
Dual EIDE
USB
Memory Bus
PCI Bus
LPC Bus
LAN
Modem / Audio
SDRAM or DDR
SCSI
BIOS
Figure 1. Typical AMD Athlon™ XP Processor Model 8 System Block Diagram
Chapter 1Overview3
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
4OverviewChapter 1
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
2Interface Signals
This section describes the interface signals utilized by the
AMD Athlon™ XP processor model 8.
2.1Overview
The AMD Athlon™ system bus architecture is designed to
deliver excellent data movement bandwidth for nextgeneration x86 platforms as well as the high-performance
required by enterprise-class application software. The system
bus architecture consists of three high-speed channels (a
unidirectional processor request channel, a unidirectional
probe channel, and a 64-bit bidirectional data channel),
source-synchronous clocking, and a packet-based protocol. In
addition, the system bus supports several control, clock, and
legacy signals. The interface signals use an impedance
controlled push-pull, low-voltage, swing-signaling technology
contained within the Socket A socket.
For more information, see “AMD Athlon™ System Bus Signals”
on page 6,Chapter 11, “Pin Descriptions” on page 55, and the
AMD Athlon™ System Bus Specification, order# 21902.
2.2Signaling Technology
The AMD Athlon system bus uses a low-voltage, swing-signaling
technology, that has been enhanced to provide larger noise
margins, reduced ringing, and variable voltage levels. The
signals are push-pull and impedance compensated. The signal
inputs use differential receivers that require a reference
voltage (V
determine if a signal is asserted or deasserted by the source.
Termination resistors are not needed because the driver is
impedance-matched to the motherboard and a high impedance
reflection is used at the receiver to bring the signal past the
input threshold.
For more information about pins and signals, see Chapter 11,
“Pin Descriptions” on page 55.
REF
). The reference signal is used by the receivers to
Chapter 2Interface Signals5
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
2.3Push-Pull (PP) Drivers
The AMD Athlon XP processor model 8 supports push-pull (PP)
drivers. The system logic configures the processor with the
configuration parameter called SysPushPull (1=PP). The
impedance of the PP drivers is set to match the impedance of
the motherboard by two external resistors connected to the ZN
and ZP pins.
See “ZN and ZP Pins” on page 80 for more information.
2.4AMD Athlon™ System Bus Signals
The AMD Athlon system bus is a clock-forwarded, point-topoint interface with the following three point-to-point channels:
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
8Logic Symbol DiagramChapter 3
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
4Power Management
This chapter describes the power management control system
of the AMD Athlon™ XP processor model 8. The power
management features of the processor are compliant with the
ACPI 1.0b and ACPI 2.0 specifications.
4.1Power Management States
The AMD Athlon XP processor model 8 supports low-power
Halt and Stop Grant states. These states are used by advanced
configuration and power interface (ACPI) enabled operating
systems for processor power management.
Figure 3 shows the power management states of the processor.
The figure includes the ACPI “Cx” naming convention for these
states.
C1
Halt
Incoming Probe
Probe
State
SMI#, INTR, NMI, INIT#, RESET#
P
r
o
b
e
S
e
r
v
i
c
e
d
1
Execute HLT
S
T
P
C
L
S
T
P
C
L
K
#
Incoming Probe
Probe Serviced
C0
4
Working
(Read PLVL2 register
or throttling)
K
#
d
e
a
s
s
e
r
t
a
e
3
s
d
s
e
r
t
e
2
d
Stop Grant
Cache Snoopable
STPCLK# deasserted
STPCLK# asserted
C2
Note:The AMD AthlonTMSystem Bus is connected during the following states:
1) The Probe state
2) During transitions between the Halt state and the C2 Stop Grant state
3) During transitions between the C2 Stop Grant state and the Halt state
4) C0 Working state
S
T
P
C
L
K
S
T
P
C
L
K
#
a
s
#
d
e
a
s
s
e
r
t
e
d
s
e
r
t
e
d
Stop Grant
Cache Not Snoopable
Sleep
Legend
Hardware transitions
Software transitions
S1
Figure 3. AMD Athlon™ XP Processor Model 8 Power Management States
Chapter 4Power Management9
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
The following sections provide an overview of the power
management states. For more details, refer to the
AMD Athlon™ System Bus Specification, order# 21902.
Note: In all power management states that the processor is
powered, the system must not stop the system clock
(SYSCLK/SYSCLK#) to the processor.
Working StateThe Working state is the state in which the processor is
executing instructions.
Halt StateWhen the processor executes the HLT instruction, the processor
enters the Halt state and issues a Halt special cycle to the
AMD Athlon system bus. The processor only enters the low
power state dictated by the CLK_Ctl MSR if the system
controller (Northbridge) disconnects the AMD Athlon system
bus in response to the Halt special cycle.
If STPCLK# is asserted, the processor will exit the Halt state
and enter the Stop Grant state. The processor will initiate a
system bus connect, if it is disconnected, then issue a Stop
Grant special cycle. When STPCLK# is deasserted, the
processor will exit the Stop Grant state and re-enter the Halt
state. The processor will issue a Halt special cycle when
re-entering the Halt state.
The Halt state is exited when the processor detects the
assertion of INIT#, RESET#, SMI#, or an interrupt via the INTR
or NMI pins, or via a local APIC interrupt message. When the
Halt state is exited, the processor will initiate an AMD Athlon
system bus connect if it is disconnected.
Stop Grant StatesThe processor enters the Stop Grant state upon recognition of
assertion of STPCLK# input. After entering the Stop Grant
state, the processor issues a Stop Grant special bus cycle on the
AMD Athlon system bus. The processor is not in a low-power
state at this time, because the AMD Athlon system bus is still
connected. After the Northbridge disconnects the AMD Athlon
system bus in response to the Stop Grant special bus cycle, the
processor enters a low-power state dictated by the CLK_Ctl
MSR. If the Northbridge needs to probe the processor during
the Stop Grant state while the system bus is disconnected, it
must first connect the system bus. Connecting the system bus
10Power ManagementChapter 4
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
places the processor into the higher power probe state. After
the Northbridge has completed all probes of the processor, the
Northbridge must disconnect the AMD Athlon system bus
again so that the processor can return to the low-power state.
During the Stop Grant states, the processor latches INIT#,
INTR, NMI, SMI#, or a local APIC interrupt message, if they are
asserted.
The Stop Grant state is exited upon the deassertion of
STPCLK# or the assertion of RESET#. When STPCLK# is
deasserted, the processor initiates a connect of the
AMD Athlon system bus if it is disconnected. After the
processor enters the Working state, any pending interrupts are
recognized and serviced and the processor resumes execution
at the instruction boundary where STPCLK# was initially
recognized. If RESET# is sampled asserted during the Stop
Grant state, the processor exits the Stop Grant state and the
reset process begins.
There are two mechanisms for asserting STPCLK#—hardware
and software.
The Southbridge can force STPCLK# assertion for throttling to
protect the processor from exceeding its maximum case
temperature. This is accomplished by asserting the THERM#
input to the Southbridge. Throttling asserts STPCLK# for a
percentage of a predefined throttling period: STPCLK# is
repetitively asserted and deasserted until THERM# is
deasserted.
Software can force the processor into the Stop Grant state by
accessing ACPI-defined registers typically located in the
Southbridge.
The operating system places the processor into the C2 Stop
Grant state by reading the P_LVL2 register in the Southbridge.
If an ACPI Thermal Zone is defined for the processor, the
operating system can initiate throttling with STPCLK# using
the ACPI defined P_CNT register in the Southbridge. The
Northbridge connects the AMD Athlon system bus, and the
processor enters the Probe state to service cache snoops during
Stop Grant for C2 or throttling.
In C2, probes are allowed, as shown in Figure 3 on page 9
Chapter 4Power Management11
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
The Stop Grant state is also entered for the S1, Powered On
Suspend, system sleep state based on a write to the SLP_TYP
and SLP_EN fields in the ACPI-defined Power Management 1
control register in the Southbridge. During the S1 Sleep state,
system software ensures no bus master or probe activity occurs.
The Southbridge deasserts STPCLK# and brings the processor
out of the S1 Stop Grant state when any enabled resume event
occurs.
Probe StateThe Probe state is entered when the Northbridge connects the
AMD Athlon system bus to probe the processor (for example, to
snoop the processor caches) when the processor is in the Halt or
Stop Grant state. When in the Probe state, the processor
responds to a probe cycle in the same manner as when it is in
the Working state. When the probe has been serviced, the
processor returns to the same state as when it entered the
Probe state (Halt or Stop Grant state). When probe activity is
completed the processor only returns to a low-power state after
the Northbridge disconnects the AMD Athlon system bus again.
4.2Connect and Disconnect Protocol
Significant power savings of the processor only occur if the
processor is disconnected from the system bus by the
Northbridge while in the Halt or Stop Grant state. The
Northbridge can optionally initiate a bus disconnect upon the
receipt of a Halt or Stop Grant special cycle. The option of
disconnecting is controlled by an enable bit in the Northbridge.
If the Northbridge requires the processor to service a probe
after the system bus has been disconnected, it must first
initiate a system bus connect.
Connect ProtocolIn addition to the legacy STPCLK# signal and the Halt and Stop
Grant special cycles, the AMD Athlon system bus connect
protocol includes the CONNECT, PROCRDY, and CLKFWDRST
signals and a Connect special cycle.
AMD Athlon system bus disconnects are initiated by the
Northbridge in response to the receipt of a Halt or Stop Grant.
Reconnect is initiated by the processor in response to an
interrupt for Halt or STPCLK# deassertion. Reconnect is
initiated by the Northbridge to probe the processor.
12Power ManagementChapter 4
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
The Northbridge contains BIOS programmable registers to
enable the system bus disconnect in response to Halt and Stop
Grant special cycles. When the Northbridge receives the Halt or
Stop Grant special cycle from the processor and, if there are no
outstanding probes or data movements, the Northbridge
deasserts CONNECT a minimum of eight SYSCLK periods after
the last command sent to the processor. The processor detects
the deassertion of CONNECT on a rising edge of SYSCLK and
deasserts PROCRDY to the Northbridge. In return, the
Northbridge asserts CLKFWDRST in anticipation of
reestablishing a connection at some later point.
Note: The Northbridge must disconnect the processor from the
AMD Athlon system bus before issuing the Stop Grant
special cycle to the PCI bus or passing the Stop Grant special
cycle to the Southbridge for systems that connect to the
Southbridge with HyperTransport™ technology.
This note applies to current chipset implementation—
alternate chipset implementations that do not require this
are possible.
Note: In response to Halt special cycles, the Northbridge passes the
Halt special cycle to the PCI bus or Southbridge
immediately.
The processor can receive an interrupt after it sends a Halt
special cycle, or STPCLK# deassertion after it sends a Stop
Grant special cycle to the Northbridge but before the
disconnect actually occurs. In this case, the processor sends the
Connect special cycle to the Northbridge, rather than
continuing with the disconnect sequence. In response to the
Connect special cycle, the Northbridge cancels the disconnect
request.
The system is required to assert the CONNECT signal before
returning the C-bit for the connect special cycle (assuming
CONNECT has been deasserted).
For more information, see the AMD Athlon™ System BusSpecification, order# 21902 for the definition of the C-bit and
the Connect special cycle.
Chapter 4Power Management13
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Figure 4 shows STPCLK# assertion resulting in the processor in
the Stop Grant state and the AMD Athlon system bus
disconnected.
STPCLK#
AMD Athlon™
System Bus
CONNECT
PROCRDY
CLKFWDRST
Stop Grant
PCI Bus
Stop Grant
Figure 4. AMD Athlon™ System Bus Disconnect Sequence in the Stop Grant State
An example of the AMD Athlon system bus disconnect
sequence is as follows:
1. The peripheral controller (Southbridge) asserts STPCLK#
to place the processor in the Stop Grant state.
2. When the processor recognizes STPCLK# asserted, it enters
the Stop Grant state and then issues a Stop Grant special
cycle.
3. When the special cycle is received by the Northbridge, it
deasserts CONNECT, assuming no probes are pending,
initiating a bus disconnect to the processor.
4. The processor responds to the Northbridge by deasserting
PROCRDY.
5. The Northbridge asserts CLKFWDRST to complete the bus
disconnect sequence.
6. After the processor is disconnected from the bus, the
processor enters a low-power state. The Northbridge passes
the Stop Grant special cycle along to the Southbridge.
14Power ManagementChapter 4
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Figure 5 shows the signal sequence of events that takes the
processor out of the Stop Grant state, connects the processor to
the AMD Athlon system bus, and puts the processor into the
Working state.
STPCLK#
PROCRDY
CONNE CT
CLKFWDRST
Figure 5. Exiting the Stop Grant State and Bus Connect Sequence
The following sequence of events removes the processor from
the Stop Grant state and connects it to the system bus:
1. The Southbridge deasserts STPCLK#, informing the
processor of a wake event.
2. When the processor recognizes STPCLK# deassertion, it
exits the low-power state and asserts PROCRDY, notifying
the Northbridge to connect to the bus.
3. The Northbridge asserts CONNECT.
4. The Northbridge deasserts CLKFWDRST, synchronizing the
forwarded clocks between the processor and the
Northbridge.
5. The processor issues a Connect special cycle on the system
bus and resumes operating system and application code
execution.
Chapter 4Power Management15
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Connect State
Diagram
Disconnect
Pending
5/B
Disconnect
Figure 6 below and Figure 7 on page 17 show the Northbridge
and processor connect state diagrams, respectively.
4/A
2/A
Connect
3/C
8
Reconnect
Pending
1
Disconnect
Requested
3
8
Probe
Pending 2
7/D,C
6/C7/D
Condition
1A disconnect is requested and probes are still pending.
2A disconnect is requested and no probes are pending.
3A Connect special cycle from the processor.
4No probes are pending.
5PROCRDY is deasserted.
6A probe needs service.
7PROCRDY is asserted.
Three SYSCLK periods after CLKFWDRST is deasserted.
Although reconnected to the system interface, the
8
Northbridge must not issue any non-NOP SysDC
commands for a minimum of four SYSCLK periods after
deasserting CLKFWDRST.
Figure 6. Northbridge Connect State Diagram
Probe
Pending 1
Action
Deassert CONNECT eight SYSCLK periods
A
after last SysDC sent.
B Assert CLKFWDRST.
C Assert CONNECT.
D Deassert CLKFWDRST.
16Power ManagementChapter 4
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Connect
6/B
1
2/B
Connect
Pending 2
Disconnect
Pending
5
Connect
Pending 1
3/A
Condition
CONNECT is deasserted by the Northbridge (for a
1
previously sent Halt or Stop Grant special cycle).
Processor receives a wake-up event and must cancel
2
the disconnect request.
3Deassert PROCRDY and slow down internal clocks.
Processor wake-up event or CONNECT asserted by
4
Northbridge.
5CLKFWDRST is deasserted by the Northbridge.
Forward clocks start three SYSCLK periods after
6
CLKFWDRST is deasserted.
Figure 7. Processor Connect State Diagram
Disconnect
4/C
Action
A CLKFWDRST is asserted by the Northbridge.
B Issue a Connect special cycle.*
Return internal clocks to full speed and assert
C
PROCRDY.
Note:
*
The Connect special cycle is only issued after a
processor wake-up event (interrupt or STPCLK#
deassertion) occurs. If the AMD Athlon™ system
bus is connected so the Northbridge can probe the
processor, a Connect special cycle is not issued at
that time (it is only issued after a subsequent
processor wake-up event).
Chapter 4Power Management17
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
4.3Clock Control
The processor implements a Clock Control (CLK_Ctl) MSR
(address C001_001Bh) that determines the internal clock
divisor when the AMD Athlon system bus is disconnected.
Refer to the AMD Athlon™ and AMD Duron™ Processors BIOS,Software, and Debug Developers Guide, order# 21656, for more
details on the CLK_Ctl register.
18Power ManagementChapter 4
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
5CPUID Support
AMD Athlon™ XP processor model 8 version and feature set
recognition can be performed through the use of the CPUID
instruction, that provides complete information about the
processor—vendor, type, name, etc., and its capabilities.
Software can make use of this information to accurately tune
the system for maximum performance and benefit to users.
For information on the use of the CPUID instruction see the
following documents:
■AMD Athlon™ and AMD Duron™ Processors BIOS, Software,
and Debug Developers Guide, order# 21656
Chapter 5CPUID Support19
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
20CPUID SupportChapter 5
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
6Advanced 266 Front-Side Bus AMD Athlon™ XP
Processor Model 8 Specifications
This chapter describes the electrical specifications that are
unique to the advanced 266 front-side bus (FSB) AMD Athlon™
XP processor model 8.
6.1Part-Specific Electrical and Thermal Specifications for
Advanced 266 FSB AMD Athlon™ XP Processors Model 8
This section provides part-specific electrical and thermal
information for each type of the Advanced 266 FSB
AMD Athlon XP processors model 8 in Table 1 on page 22 and
Table 2 on page 23.
Chapter 6Advanced 266 Front-Side Bus AMD Athlon™ XP Processor Model 8 Specifications21
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 1 shows the part-specific electrical and thermal
specifications in the C0 working state and the S1 Stop Grant
state for processors with a CPUID = 680.
Table 1.Electrical and Thermal Specifications for Processors with a CPUID of 680
I
(Processor Current)
CC
Stop Grant S1
1, 2, 3, 4
Thermal Power
5
Maximum Die
Temperature
Frequency in MHz
(Model Number)
V
CC_CORE
(Core
Voltage)
Working State C0
MaximumTypicalMaximumTypicalMaximumTypical
1467 (1700+)
1533 (1800+)
1600 (1900+)
1.50 V
32.9 A29.9 A
34.0 A30.9 A51.0 W46.3 W
5.87 A3.7 A
35.0 A31.8 A52.5 W47.7 W
49.4 W44.9 W
1.60 V37.7 A34.2 A7.68 A4.7 A
1667 (2000+)
1733 (2100+)
1800 (2200+)
Notes:
1. See Figure 3, "AMD Athlon™ XP Processor Model 8 Power Management States" on page 9.
2. The maximum Stop Grant currents are absolute worst case currents for parts that may yield from the worst case corner of the
process and are not representative of the typical Stop Grant current that is currently about one-third of the maximum specified
current.
3. These currents occur when the AMD Athlon™ system bus is disconnected and has a low power ratio of 1/8 for Stop Grant
disconnect and a low power ratio of 1/8 Halt disconnect applied to the core clock grid of the processor as dictated by a value of
6003_1223h programmed into the Clock Control (CLK_Ctl) MSR. For more information, refer to the AMD Athlon™ and AMD Duron™ Processors BIOS, Software, and Debug Developers Guide, order# 21656.
4. The Stop Grant current consumption is characterized at 50°C and not tested.
1.65 V36.5 A33.2 A8.85 A5.4 A
1.60 V38.8 A35.2 A7.68 A4.7 A62.1 W56.4 W
1.65 V41.2 A37.4 A8.85 A5.4 A67.9 W61.7 W85°C
60.3 W54.7 W
90°C
5. Thermal design power represents the maximum sustained power dissipated while executing publicly-available software or
instruction sequences under normal system operation at nominal V
the processor to prevent the processor from exceeding its maximum die temperature.
. Thermal solutions must monitor the temperature of
CC_CORE
22Advanced 266 Front-Side Bus AMD Athlon™ XP Processor Model 8 SpecificationsChapter 6
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Table 2 shows the part-specific electrical and thermal
specifications in the C0 working state and the S1 Stop Grant
state for processors with a CPUID = 681
Table 2.Electrical and Thermal Specifications for Processors with a CPUID of 681
I
(Processor Current)
CC
Stop Grant S1
1, 2, 3, 4
Thermal Power
5
Maximum Die
Temperature
Frequency in MHz
(Model Number)
V
CC_CORE
(Core
Voltage)
Working State C0
MaximumTypicalMaximumTypical Maximum Typical
1400 (1600+)
1.60 V30.3 A27.5 A8.1 A4.9 A48.5 W44.0 W
1.50 V32.9 A29.9 A5.4 A3.9 A49.4 W44.9 W
1467 (1700+)
1.60 V30.9 A28.0 A8.1 A4.9 A49.4 W44.9 W
1.50 V34.0 A30.9 A5.4 A3.9 A51.0 W46.3 W
1533 (1800+)
1667 (2000+)
1733 (2100+)
1800 (2200+)
2000 (2400+)
2133 (2600+)
Notes:
1. See Figure 3, "AMD Athlon™ XP Processor Model 8 Power Management States" on page 9.
2. The maximum Stop Grant currents are absolute worst case currents for parts that may yield from the worst case corner of the
process and are not representative of the typical Stop Grant current that is currently about one-third of the maximum specified
current.
3. These currents occur when the AMD Athlon™ system bus is disconnected and has a low power ratio of 1/8 for Stop Grant
disconnect and a low power ratio of 1/8 Halt disconnect applied to the core clock grid of the processor as dictated by a value of
2003_1223h programmed into the Clock Control (CLK_Ctl) MSR. For more information, refer to the AMD Athlon™ and AMD Duron™ Processors BIOS, Software, and Debug Developers Guide, order# 21656.
1.60 V31.9 A28.9 A8.1 A4.9 A51.0 W46.3 W
1.60 V37.7 A34.2 A8.1 A4.9 A60.3 W54.7 W
1.60 V38.8 A34.9 A8.1 A4.9 A62.1 W55.9 W
1.60 V39.3 A35.6 A8.1 A4.9 A62.8 W57.0 W
1.65 V41.4 A37.6 A8.9 A5.4 A68.3 W62.0 W
1.65 V41.4 A37.6 A8.9 A5.4 A68.3 W62.0 W
90°C
85°C
4. The Stop Grant current consumption is characterized at 50°C and not tested.
5. Thermal design power represents the maximum sustained power dissipated while executing publicly-available software or
instruction sequences under normal system operation at nominal V
the processor to prevent the processor from exceeding its maximum die temperature.
. Thermal solutions must monitor the temperature of
CC_CORE
Chapter 6Advanced 266 Front-Side Bus AMD Athlon™ XP Processor Model 8 Specifications23
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
6.2Advanced 266 FSB AMD Athlon™ XP Processor Model 8
SYSCLK and SYSCLK# AC Characteristics
Table 3 shows the SYSCLK/SYSCLK# differential clock AC
1. The AMD Athlon™ system bus operates at twice this clock frequency.
2. Circuitry driving the AMD Athlon system bus clock inputs must exhibit a suitably low closed-loop jitter bandwidth to allow the PLL
to track the jitter. The –20dB attenuation point, as measured into a 20
3. Circuitry driving the AMD Athlon system bus clock inputs may purposely alter the AMD Athlon system bus clock frequency (spread
spectrum clock generators). In no cases can the AMD Athlon system bus period violate the minimum specification above.
AMD Athlon system bus clock inputs can vary from 100% of the specified frequency to 99% of the specified frequency at a
maximum rate of 100 kHz.
- or 30-pF load must be less than 500 kHz.
Figure 8 shows a sample waveform of the SYSCLK signal.
t
2
V
CROSS
t
5
V
Threshold-AC
t
3
t
4
t
1
Figure 8. SYSCLK Waveform
24Advanced 266 Front-Side Bus AMD Athlon™ XP Processor Model 8 SpecificationsChapter 6
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
6.3Advanced 266 FSB AMD Athlon™ System Bus
AC Characteristics
The AC characteristics for the AMD Athlon system bus of this
processor are shown in Table 4. The parameters are grouped
based on the source or destination of the signals involved.
Table 4.AMD Athlon™ System Bus AC Characteristics
GroupSymbolParameterMinMaxUnitsNotes
T
All Signals
Forward
Clocks
Sync
Notes:
1. Rise and fall time ranges are guidelines over which the I/O has been characterized.
2. T
SKEW-SAMEEDGE
forward clock, as measured at the package, with respect to the same clock edge.
T
SKEW-DIFFEDGE
forward clock, as measured at the package, with respect to different clock edges.
RISE
T
FALL
T
SKEW-SAMEEDGE
T
SKEW-DIFFEDGE
T
SU
T
HD
C
IN
C
OUT
T
VAL
T
SU
T
HD
is the maximum skew within a clock forwarded group between any two signals or between any signal and its
is the maximum skew within a clock forwarded group between any two signals or between any signal and its
Output Rise Slew Rate13V/ns1
Output Fall Slew Rate13V/ns1
Output skew with respect to
the same clock edge
Output skew with respect to a
different clock edge
Input Data Setup Time300ps3
Input Data Hold Time300ps3
Capacitance on input Clocks425pF
Capacitance on output Clocks412pF
RSTCLK to Output Valid2502000ps4, 5
Setup to RSTCLK500ps4, 6
Hold from RSTCLK1000ps4, 6
–385ps2
–770ps2
3. Input SU and HD times are with respect to the appropriate Clock Forward Group input clock.
4. The synchronous signals include
5. T
is RSTCLK rising edge to output valid for PROCRDY. Test Load is 25 pF.
VAL
6. T
is setup of CONNECT/CLKFWDRST to rising edge of RSTCLK. THD is hold of CONNECT/CLKFWDRST from rising edge of
SU
RSTCLK.
PROCRDY, CONNECT, and CLKFWDRST.
Chapter 6Advanced 266 Front-Side Bus AMD Athlon™ XP Processor Model 8 Specifications25
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
26Advanced 266 Front-Side Bus AMD Athlon™ XP Processor Model 8 SpecificationsChapter 6
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
7Advanced 333 Front-Side Bus AMD Athlon™ XP
Processor Model 8 Specifications
This chapter describes the electrical specifications that are
unique to the advanced 333 front-side bus (FSB) AMD Athlon™
XP processor model 8.
7.1Electrical and Thermal Specifications for the Advanced 333 FSB
AMD Athlon™ XP Processor Model 8
Table 5 shows the electrical and thermal specifications for this
processor in the C0 working state and the S1 Stop Grant state.
Table 5.Electrical and Thermal Specifications
I
(Processor Current)
V
Frequency in MHz
(Model Number)
2083 (2600+)
2167 (2700+)
Notes:
1. See Figure 3, "AMD Athlon™ XP Processor Model 8 Power Management States" on page 9.
2. The maximum Stop Grant currents are absolute worst case currents for parts that may yield from the worst case corner of the
process and are not representative of the typical Stop Grant current that is currently about one-third of the maximum specified
current.
3. These currents occur when the AMD Athlon™ system bus is disconnected and has a low power ratio of 1/8 for Stop Grant
disconnect and a low power ratio of 1/8 Halt disconnect applied to the core clock grid of the processor as dictated by a value of
2003_1223h programmed into the Clock Control (CLK_Ctl) MSR. For more information, refer to the AMD Athlon™ and AMD Duron™ Processors BIOS, Software, and Debug Developers Guide, order# 21656.
4. The Stop Grant current consumption is characterized at 50°C and not tested.
5. Thermal design power represents the maximum sustained power dissipated while executing publicly-available software or
instruction sequences under normal system operation at nominal V
the processor to prevent the processor from exceeding its maximum die temperature.
CC_CORE
(Core
Voltage)
1.65 V41.4 A37.6 A8.9 A5.9 A68.3 W62.0 W85°C
Working State C0
Maximum Typical Maximum Typical Maximum Typical
CC
Stop Grant S1
CC_CORE
1, 2, 3, 4
Thermal Power
. Thermal solutions must monitor the temperature of
5
Maximum Die
Temperature
Chapter 7Advanced 333 Front-Side Bus AMD Athlon™ XP Processor Model 8 Specifications27
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
7.2Advanced 333 FSB AMD Athlon™ XP Processor Model 8
SYSCLK and SYSCLK# AC Characteristics
Table 6 shows the SYSCLK/SYSCLK# differential clock AC
characteristics of this processor.
1. The AMD Athlon™ system bus operates at twice this clock frequency.
2. Circuitry driving the AMD Athlon system bus clock inputs must exhibit a suitably low closed-loop jitter bandwidth to allow the PLL
to track the jitter. The –20dB attenuation point, as measured into a 20
3. Circuitry driving the AMD Athlon system bus clock inputs may purposely alter the AMD Athlon system bus clock frequency (spread
spectrum clock generators). In no cases can the AMD Athlon system bus period violate the minimum specification above.
AMD Athlon system bus clock inputs can vary from 100% of the specified frequency to 99% of the specified frequency at a
maximum rate of 100 kHz.
- or 30-pF load must be less than 500 kHz.
Figure 9 shows a sample waveform of the SYSCLK signal.
t
2
V
CROSS
t
5
V
Threshold-AC
t
3
t
4
t
1
Figure 9. SYSCLK Waveform
28Advanced 333 Front-Side Bus AMD Athlon™ XP Processor Model 8 SpecificationsChapter 7
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
7.3Advanced 333 FSB AMD Athlon™ System Bus
AC Characteristics
The AC characteristics of the AMD Athlon system bus of this
processor are shown in Table 7. The parameters are grouped
based on the source or destination of the signals involved.
Table 7.AMD Athlon™ System Bus AC Characteristics
GroupSymbolParameterMinMaxUnitsNotes
T
All Signals
Forward
Clocks
Sync
Notes:
1. Rise and fall time ranges are guidelines over which the I/O has been characterized.
2. T
SKEW-DIFFEDGE
forward clock, as measured at the package, with respect to different clock edges.
3. Input SU and HD times are with respect to the appropriate Clock Forward Group input clock.
4. The synchronous signals include
RISE
T
FALL
T
SKEW-DIFFEDGE
T
SU
T
HD
C
IN
C
OUT
T
VAL
T
SU
T
HD
is the maximum skew within a clock forwarded group between any two signals or between any signal and its
Output Rise Slew Rate13V/ns1
Output Fall Slew Rate13V/ns1
Output skew with respect to a
different clock edge
–770ps2
Input Data Setup Time300ps3
Input Data Hold Time300ps3
Capacitance on input Clocks425pF
Capacitance on output Clocks412pF
RSTCLK to Output Valid8002000ps4, 5
Setup to RSTCLK500ps4, 6
Hold from RSTCLK500ps4, 6
PROCRDY, CONNECT, and CLKFWDRST.
5. T
is RSTCLK rising edge to output valid for PROCRDY. Test Load is 25 pF.
VAL
6. T
is setup of CONNECT/CLKFWDRST to rising edge of RSTCLK. THD is hold of CONNECT/CLKFWDRST from rising edge of
SU
RSTCLK.
Chapter 7Advanced 333 Front-Side Bus AMD Athlon™ XP Processor Model 8 Specifications29
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
30Advanced 333 Front-Side Bus AMD Athlon™ XP Processor Model 8 SpecificationsChapter 7
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
8Electrical Data
This chapter describes the electrical characteristics that apply
to all desktop AMD Athlon™ XP processors model 8.
8.1Conventions
The conventions used in this chapter are as follows:
■Current specified as being sourced by the processor is
negative.
■Current specified as being sunk by the processor is positive.
8.2Interface Signal Groupings
The electrical data in this chapter is presented separately for
each signal group.
Table 8 defines each group and the signals contained in each
group.
Table 8. Interface Signal Groupings
Signal GroupSignalsNotes
See “Advanced 266 FSB
AMD Athlon™ System Bus AC
SADDIN[14:2]#, SADDOUT[14:2]#, SADDINCLK#, SADDOUTCLK#,
AMD Athlon™
System Bus
Characteristics” on page 25,
“Advanced 333 FSB AMD Athlon™
System Bus AC Characteristics” on
page 29, “AMD Athlon™ System
Bus DC Characteristics” on page 36,
and “CLKFWDRST Pin” on page 73.
See “APIC Pins AC and DC
Characteristics” on page 44, and
“APIC Pins, PICCLK, PICD[1:0]#” on
page 73.
See “Frequency Identification
(FID[3:0])” on page 33, “FID[3:0]
Pins” on page 75, and
“FSB_Sense[1:0] Pins” on page 76.
See “General AC and DC
Characteristics” on page 39.
Chapter 8Electrical Data31
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 8. Interface Signal Groupings (continued)
Signal GroupSignalsNotes
See “Voltage Identification
(VID[4:0])” on page 33, “VID[4:0]
Pins” on page 78,“VCCA AC and DC
34,“VCCA Pin” on page 78, and
“COREFB and COREFB# Pins” on
page 74.
See “General AC and DC
Characteristics” on page 39, “INTR
Pin” on page 76, “NMI Pin” on page
77, “SMI# Pin” on page 78, “INIT#
Pin” on page 76, “A20M# Pin” on
page 73, “FERR Pin” on page
74,“IGNNE# Pin” on page 76,
“STPCLK# Pin” on page 79, and
“FLUSH# Pin” on page 77.
System Clocks
Test
SYSCLK, SYSCLK# (Tied to CLKIN/CLKIN# and RSTCLK/RSTCLK#),
PLLBYPASSCLK#, PLLBYPASSCLK
PLLBYPASS#, PLLTEST#, PLLMON1, PLLMON2, SCANCLK1,
SCANCLK2, SCANSHIFTEN, SCANINTEVAL, ANALOG
ThermalTHERMDA, THERMDC
Miscellaneous DBREQ#, DBRDY, PWROK
See “Advanced 266 FSB
AMD Athlon™ XP Processor Model
8 SYSCLK and SYSCLK# AC
Characteristics” on page 24,
“Advanced 333 FSB AMD Athlon™
XP Processor Model 8 SYSCLK and
SYSCLK# AC Characteristics” on
page 28, Table 14, “SYSCLK and
SYSCLK# DC Characteristics,” on
page 37, “SYSCLK and SYSCLK#”
on page 78, and “PLL Bypass and
Test Pins” on page 77.
See “General AC and DC
Characteristics” on page 39, “PLL
Bypass and Test Pins” on page 77,
“Scan Pins” on page 78, “Analog
Pin” on page 73.
Table 17, “Thermal Diode Electrical
Characteristics,” on page 42, and
“THERMDA and THERMDC Pins”
on page 78.
See “General AC and DC
Characteristics” on page 39,
“DBRDY and DBREQ# Pins” on
page 74, “PWROK Pin” on page 77.
32Electrical DataChapter 8
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
8.3Voltage Identification (VID[4:0])
Table 9 shows the VID[4:0] DC Characteristics. For more information on VID[4:0] DC Characteristics, see “VID[4:0] Pins” on
page 78.
Table 9.VID[4:0] DC Characteristics
ParameterDescriptionMinMax
I
OL
V
OH
Note:
* The VID pins are either open circuit or pulled to ground. It is recommended that these pins
Output Current Low6 mA
Output High Voltage–5.25 V *
are not pulled above 5.25 V, which is 5.0 V + 5%.
8.4Frequency Identification (FID[3:0])
Table 10 shows the FID[3:0] DC characteristics. For more
information, see “FID[3:0] Pins” on page 75.
Table 10. FID[3:0] DC Characteristics
ParameterDescriptionMinMax
I
OL
V
OH
Note:
* The FID pins must not be pulled above this voltage by an external pullup resistor.
Output Current Low6 mA
Output High Voltage–2.625 V *
8.5VCCA AC and DC Characteristics
Table 11 shows the AC and DC characteristics for VCCA. For
more information, see “VCCA Pin” on page 78.
Table 11. VCCA AC and DC Characteristics
SymbolParameterMinNominalMaxUnitsNotes
V
VCCA
I
VCCA
Notes:
1. Minimum and Maximum voltages are absolute. No transients below minimum nor above maximum voltages are permitted.
2. Measured at 2.5 V.
VCCA Pin Voltage2.252.52.75V1
VCCA Pin Current050mA/GHz2
Chapter 8Electrical Data33
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
8.6Decoupling
See the AMD Athlon™ Processor-Based Motherboard Design
Guide, order# 24363, or contact your local AMD office for
information about the decoupling required on the motherboard
for use with the AMD Athlon™ XP processor model 8.
8.7V
CC_CORE
Characteristics
Table 12 shows the AC and DC characteristics for V
See Figure 10 on page 35 for a graphical representation of the
V
CC_CORE
Table 12. V
CC_CORE
AC and DC Characteristics
SymbolParameterLimit in Working StateUnits
V
CC_CORE_DC_MAX
V
CC_CORE_DC_MIN
V
CC_CORE_AC_MAX
V
CC_CORE_AC_MIN
t
MAX_AC
t
MIN_AC
Note:
*
All voltage measurements are taken differentially at the COREFB/COREFB# pins.
Maximum static voltage above V
Maximum static voltage below V
Maximum excursion above V
Maximum excursion below V
Maximum excursion time for AC transients10µs
Negative excursion time for AC transients5µs
waveform.
CC_CORE_NOM
CC_CORE_NOM
CC_CORE_NOM
CC_CORE_NOM
*
*
*
*
50mV
–50mV
150mV
–100mV
CC_CORE
.
34Electrical DataChapter 8
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
V
CC_CORE_AC_MAX
V
CC_CORE_DC_MAX
V
CC_CORE_NOM
V
CC_CORE_DC_MIN
Figure 10 shows the processor core voltage (V
waveform response to perturbation. The t
transient excursion time) and t
max_AC
min_AC
(positive AC transient
CC_CORE
(negative AC
excursion time) represent the maximum allowable time below
or above the DC tolerance thresholds.
t
MAX_AC
)
V
CC_CORE_AC_MIN
Figure 10. V
I
CORE_MAX
I
CORE_MIN
CC_CORE
t
Voltage Waveform
MIN_AC
dI /dt
Chapter 8Electrical Data35
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
8.8Absolute Ratings
The AMD Athlon XP processor model 8 should not be subjected
to conditions exceeding the absolute ratings, as such conditions
can adversely affect long-term reliability or result in functional
damage.
Table 13 lists the maximum absolute ratings of operation for the
AMD Athlon XP processor model 8.
Table 13. Absolute Ratings
ParameterDescriptionMinMax
V
CC_CORE
VCCAAMD Athlon XP processor model 8 PLL supply–0.5 VVCCA Max + 0.5 V
V
PIN
T
STORAGE
AMD Athlon™ XP processor model 8 core supply–0.5 V
Voltage on any signal pin–0.5 V
Storage temperature of processor–40ºC100ºC
V
CC_CORE
V
CC_CORE
Max + 0.5 V
Max + 0.5 V
36Electrical DataChapter 8
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
8.9SYSCLK and SYSCLK# DC Characteristics
Table 14 shows the DC characteristics of the SYSCLK and
SYSCLK# differential clocks. The SYSCLK signal represents
CLKIN and RSTCLK tied together while the SYSCLK# signal
represents CLKIN# and RSTCLK# tied together. For
information about SYSCLK and SYSCLK#, see “SYSCLK and
SYSCLK#” on page 79 and Table 24, “Pin Name
Abbreviations,” on page 58.
Table 14. SYSCLK and SYSCLK# DC Characteristics
SymbolDescriptionMinMaxUnits
V
Threshold-DC
V
Threshold-AC
I
LEAK_P
I
LEAK_N
V
CROSS
C
PIN
Note:
* The following processor inputs have twice the listed capacitance because they connect to two input pads—SYSCLK and SYSCLK#.
Crossing before transition is detected (DC)400mV
Crossing before transition is detected (AC)450mV
Leakage current through P-channel pullup to V
CC_CORE
–1mA
Leakage current through N-channel pulldown to VSS (Ground)1mA
Differential signal crossover
V
CC_CORE
Capacitance *425 *pF
SYSCLK connects to CLKIN/RSTCLK. SYSCLK# connects to CLKIN#/RSTCLK#.
/ 2±100
Figure 11 shows the DC characteristics of the SYSCLK and
SYSCLK# signals.
mV
V
CROSS
V
Threshold-DC
= 400mVV
Threshold-AC
= 450mV
Figure 11. SYSCLK and SYSCLK# Differential Clock Signals
Chapter 8Electrical Data37
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
8.10AMD Athlon™ System Bus DC Characteristics
Table 15 shows the DC characteristics of the AMD Athlon
system bus used by the AMD Athlon XP processor model 8.
Table 15. AMD Athlon™ System Bus DC Characteristics
SymbolParameterConditionMinMaxUnits Notes
V
REF
I
VREF_LEAK_PVREF
I
VREF_LEAK_NVREF
V
IH
V
IL
I
LEAK_P
I
LEAK_N
C
IN
R
ON
R
setP
R
setN
Notes:
1. V
DC Input Reference Voltage
Tristate Leakage PullupVIN = V
Tristate Leakage PulldownVIN = V
REF
REF
Nominal
Nominal
Input High Voltage
Input Low Voltage–500
V
= VSS
Tristate Leakage Pullup
Tristate Leakage Pulldown
IN
(Ground)
V
= V
IN
Nominal
CC_CORE
Input Pin Capacitance47pF
Output Resistance
Impedance Set Point, P Channel4070Ω2
Impedance Set Point, N Channel4070Ω2
is nominally set to 50% of V
REF
created with a sufficiently accurate DC source and a sufficiently quiet AC response to adhere to the ± 50 mV specification listed
above.
with actual values that are specific to motherboard design implementation. V
CC_CORE
(0.5 x V
CC_CORE
–50
–100µA
V
+ 200V
REF
–1mA
0.90 x R
setN,P
)
(0.5 x V
CC_CORE
+50
100µA
CC_CORE
V
– 200
REF
1mA
1.1 x R
+ 500
setN,P
)
mV1
mV
mV
Ω2
must be
REF
2. Measured at V
CC_CORE
/ 2.
38Electrical DataChapter 8
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
8.11General AC and DC Characteristics
Table 16 shows the AMD Athlon XP processor model 8 AC and
DC characteristics of the Southbridge, JTAG, test, and miscellaneous pins.
4. Synchronous inputs/outputs are specified with respect to RSTCLK and RSTCK# at the pins.
5. These are aggregate numbers.
6. Edge rates indicate the range over which inputs were characterized.
7. In asynchronous operation, the signal must persist for this time to enable capture.
8. This value assumes RSTCLK period is 10 ns ==> TBIT = 2*fRST.
9. The approximate value for standard case in normal mode operation.
10. This value is dependent on RSTCLK frequency, divisors, Low Power mode, and core frequency.
11. Reassertions of the signal within this time are not guaranteed to be seen by the core.
12. This value assumes that the skew between RSTCLK and K7CLKOUT is much less than one phase.
13. This value assumes RSTCLK and K7CLKOUT are running at the same frequency, though the processor is capable of other
14. Time to valid is for any open-drain pins. See requirements 7 and 8 in the “Power-Up Timing Requirements“ chapter for more
Input Time to Acquire20.0ns7, 8
Input Time to Reacquire40.0ns9–13
Signal Rise Time1.03.0V/ns6
Signal Fall Time1.03.0V/ns6
Pin Capacitance412pF
Time to data valid100ns14
CC_CORE
and IOH are measured at VOL maximum and VOH minimum, respectively.
OL
configurations.
information.
. Scale parameters between V
CC_CORE.
minimum and V
CC_CORE.
maximum.
40Electrical DataChapter 8
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
8.12Open-Drain Test Circuit
Figure 12 is a test circuit that may be used on automated test
equipment (ATE) to test for validity on open drain pins.
Refer to Table 16, “General AC and DC Characteristics,” on
page 39 for timing requirements.
V
Termination
Open-Drain Pin
IOL = Output Current
Notes:
1. V
Termination
V
Termination
= 1.2 V for VID and FID pins
= 1.0 V for APIC pins
2. IOL = –6 mA for VID and FID pins
IOL = –9 mA for APIC pins
Figure 12. General ATE Open-Drain Test Circuit
1
50 Ω ±3%
2
Chapter 8Electrical Data41
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
8.13Thermal Diode Characteristics
The AMD Athlon XP processor model 8 provides a diode that
can be used in conjunction with an external temperature sensor
to determine the die temperature of the processor. The diode
anode (THERMDA) and cathode (THERMDC) are available as
pins on the processor, as described in “THERMDA and
THERMDC Pins” on page 78.
For information about thermal design for the AMD Athlon XP
processor model 8, including layout and airflow considerations,
see the AMD Processor Thermal, Mechanical, and Chassis Cooling
Design Guide, order# 23794, and the cooling guidelines on
http://www.amd.com.
Thermal Diode
Electrical
Characteristics
Table 17 shows the AMD Athlon XP processor model 8
characteristics of the on-die thermal diode. For information
about calculations for the ideal diode equation and
temperature offset correction, see Appendix A, "Thermal
Diode Calculations," on page 77.
1. The sourcing current should always be used in forward bias only.
2. Characterized at 95°C with a forward bias current pair of 10 µA and 100 µA. AMD
recommends using a minimum of two sourcing currents to accurately measure the
temperature of the thermal diode.
3. Not 100% tested. Specified by design and limited characterization.
4. The lumped ideality factor adds the effect of the series resistance term to the actual ideality
factor. The series resistance term indicates the resistance from the pins of the processor to the
on-die thermal diode. The value of the lumped ideality factor depends on the sourcing current
pair used.
Parameter
Description
Sourcing current5300µA1
Lumped ideality
factor
Actual ideality factor1.002613, 4
Series Resistance0.93Ω3, 4
MinNomMaxUnitsNotes
1.000001.003741.009002, 3, 4
42Electrical DataChapter 8
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Thermal Protection
Characterization
The following section describes parameters relating to thermal
protection. The implementation of thermal control circuitry to
control processor temperature is left to the manufacturer to
determine how to implement.
Thermal limits in motherboard design are necessary to protect
the processor from thermal damage. T
SHUTDOWN
is the
temperature for thermal protection circuitry to initiate
shutdown of the processor. T
SD_DELAY
is the maximum time
allowed from the detection of the over-temperature condition to
processor shutdown to prevent thermal damage to the
processor.
Systems that do not implement thermal protection circuitry or
that do not react within the time specified by T
SD_DELAY
can
cause thermal damage to the processor during the unlikely
events of fan failure or powering up the processor without a
heat-sink. The processor relies on thermal circuitry on the
motherboard to turn off the regulated core voltage to the
processor in response to a thermal shutdown event.
Thermal protection circuitry reference designs and thermal
solution guidelines are found in the following documents:
■AMD Thermal, Mechanical, and Chassis Cooling Design Guide,
order# 23794
See http://www.amd.com for more information about thermal
solutions.
Table 18 on page 44 shows the T
SHUTDOWN
and T
SD_DELAY
specifications for circuitry in motherboard design necessary for
thermal protection of the processor.
Chapter 8Electrical Data43
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 18. Guidelines for Platform Thermal Protection of the Processor
SymbolParameter DescriptionMaxUnitsNotes
TSHUTDOWN
T
SD_DELAY
Notes:
1. The thermal diode is not 100% tested, it is specified by design and limited characterization.
2. The thermal diode is capable of responding to thermal events of 40°C/s or faster.
3. The AMD Athlon™ XP processor model 8 provides a thermal diode for measuring die temperature of the processor. The
processor relies on thermal circuitry on the motherboard to turn off the regulated core voltage to the processor in response to a
thermal shutdown event. Refer to AMD Athlon™ Processor-Based Motherboard Design Guide, order# 24363, for thermal
protection circuitry designs.
Thermal diode shutdown temperature for processor protection125°C1, 2, 3
Maximum allowed time from T
SHUTDOWN
detection to processor shutdown
500ms1, 3
8.14APIC Pins AC and DC Characteristics
Table 19 shows the AMD Athlon XP processor model 8 AC and
DC characteristics of the APIC pins.
2. The 2.625-V value is equal to 2.5 V plus a maximum of five percent.
3. Edge rates indicate the range for characterizing the inputs.
Input High Voltage1.72.625V1, 2
Input Low Voltage–300700mV1
Output High Voltage2.625V2
Output Low Voltage–300400mV
V
Tristate Leakage Pullup
Tristate Leakage Pulldown
Output Low Current
= VSS (Ground)
IN
= 2.5 V
V
IN
V
Max
OL
–1mA
1mA
9mA
Signal Rise Time1.03.0V/ns3
Signal Fall Time1.03.0V/ns3
Setup Time1ns
Hold Time1ns
Pin Capacitance412pF
44Electrical DataChapter 8
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
9Signal and Power-Up Requirements
The AMD Athlon™ XP processor model 8 is designed to provide
functional operation if the voltage and temperature parameters
are within the limits of normal operating ranges.
9.1Power-Up Requirements
Signal Sequence and
Timing Description
3.3 V Supply
VCCA (2.5 V)
(for PLL)
V
CC_CORE
RESET#
NB_RESET#
PWROK
Figure 13 shows the relationship between key signals in the
system during a power-up sequence. This figure details the
requirements of the processor.
2
1
5
6
4
7
8
Warm reset
condition
FID[3:0]
3
System Clock
Figure 13. Signal Relationship Requirements During Power-Up Sequence
Notes: 1. Figure 13 represents several signals generically by using names not necessarily consistent
with any pin lists or schematics.
2.
Requirements 1–8 in Figure 13 are described in “Power-Up Timing Requirements” on page 46.
Chapter 9Signal and Power-Up Requirements45
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Power-Up Timing Requirements.
The signal timing requirements are
as follows:
1. RESET# must be asserted before PWROK is asserted.
The AMD Athlon XP processor model 8 does not set the
correct clock multiplier if PWROK is asserted prior to a
RESET# assertion. It is recommended that RESET# be
asserted at least 10 nanoseconds prior to the assertion of
PWROK.
In practice, a Southbridge asserts RESET# milliseconds
before PWROK is asserted.
2. All motherboard voltage planes must be within
specification before PWROK is asserted.
PWROK is an output of the voltage regulation circuit on the
motherboard. PWROK indicates that V
CC_CORE
and all
other voltage planes in the system are within specification.
The motherboard is required to delay PWROK assertion for
a minimum of three milliseconds from the 3.3 V supply
being within specification. This delay ensures that the
system clock (SYSCLK/SYSCLK#) is operating within
specification when PWROK is asserted.
The processor core voltage, V
CC_CORE
, must be within
specification as dictated by the VID[4:0] pins driven by the
processor before PWROK is asserted. Before PWROK
assertion, the AMD Athlon processor is clocked by a ring
oscillator.
The processor PLL is powered by VCCA. The processor PLL
does not lock if VCCA is not high enough for the processor
logic to switch for some period before PWROK is asserted.
VCCA must be within specification at least five
microseconds before PWROK is asserted.
In practice VCCA, V
CC_CORE
, and all other voltage planes
must be within specification for several milliseconds before
PWROK is asserted.
After PWROK is asserted, the processor PLL locks to its
operational frequency.
3. The system clock (SYSCLK/SYSCLK#) must be running
before PWROK is asserted.
When PWROK is asserted, the processor switches from
driving the internal processor clock grid from the ring
oscillator to driving from the PLL. The reference system
46Signal and Power-Up RequirementsChapter 9
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
clock must be valid at this time. The system clocks are
designed to be running after 3.3 V has been within
specification for three milliseconds.
4. PWROK assertion to deassertion of RESET#
The duration of RESET# assertion during cold boots is
intended to satisfy the time it takes for the PLL to lock with
a less than 1 ns phase error. The processor PLL begins to
run after PWROK is asserted and the internal clock grid is
switched from the ring oscillator to the PLL. The PLL lock
time may take from hundreds of nanoseconds to tens of
microseconds. It is recommended that the minimum time
between PWROK assertion to the deassertion of RESET# be
at least 1.0 milliseconds. Southbridges enforce a delay of
1.5 to 2.0 milliseconds between PWRGD (Southbridge
version of PWROK) assertion and NB_RESET# deassertion.
5. PWROK must be monotonic and meet the timing
requirements as defined in Table 16, “General AC and DC
Characteristics,” on page 39. The processor should not
switch between the ring oscillator and the PLL after the
initial assertion of PWROK.
6. NB_RESET# must be asserted (causing CONNECT to also
assert) before RESET# is deasserted. In practice all
Southbridges enforce this requirement.
If NB_RESET# does not assert until after RESET# has
deasserted, the processor misinterprets the CONNECT
assertion (due to NB_RESET# being asserted) as the
beginning of the SIP transfer. There must be sufficient
overlap in the resets to ensure that CONNECT is sampled
asserted by the processor before RESET# is deasserted.
7. The FID[3:0] signals are valid within 100 ns after PWROK is
asserted. The chipset must not sample the FID[3:0] signals
until they become valid. Refer to the AMD Athlon™Processor-Based Motherboard Design Guide, order# 24363, for
the specific implementation and additional circuitry
required.
8. The FID[3:0] signals become valid within 100 ns after
RESET# is asserted. Refer to the AMD Athlon™ Processor-Based Motherboard Design Guide, order# 24363, for the
specific implementation and additional circuitry required.
Chapter 9Signal and Power-Up Requirements47
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Clock Multiplier
Selection (FID[3:0])
The chipset samples the FID[3:0] signals in a chipset-specific
manner from the processor and uses this information to
determine the correct serial initialization packet (SIP). The
chipset then sends the SIP information to the processor for
configuration of the AMD Athlon system bus for the clock
multiplier that determines the processor frequency indicated
by the FID[3:0] code. The SIP is sent to the processor using the
SIP protocol. This protocol uses the PROCRDY, CONNECT, and
CLKFWDRST signals, that are synchronous to SYSCLK.
For more information about FID[3:0], see “FID[3:0] Pins” on
page 75.
Serial Initialization Packet (SIP) Protocol. Refer to AMD Athlon™
System Bus Specification, order# 21902 for details of the SIP
protocol.
9.2Processor Warm Reset Requirements
Northbridge Reset
Pins
RESET# cannot be asserted to the processor without also being
asserted to the Northbridge. RESET# to the Northbridge is the
same as PCI RESET#. The minimum assertion for PCI RESET#
is one millisecond. Southbridges enforce a minimum assertion
of RESET# for the processor, Northbridge, and PCI of 1.5 to 2.0
milliseconds.
48Signal and Power-Up RequirementsChapter 9
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
10Mechanical Data
The AMD Athlon™ XP processor model 8 connects to the
motherboard through a Pin Grid Array (PGA) socket named
Socket A. This processor utilizes the organic pin grid array
(OPGA) package type described in this chapter. For more
information, see the AMD Athlon™ Processor-Based MotherboardDesign Guide, order# 24363.
10.1Die Loading
The processor die on the OPGA package is exposed at the top of
the package. This feature facilitates heat transfer from the die
to an approved heat sink. Any heat sink design should avoid
loads on corners and edges of die. The OPGA package has
compliant pads that serve to bring surfaces in planar contact.
Tool-assisted zero insertion force sockets should be designed so
that no load is placed on the substrate of the package.
Table 20 shows the mechanical loading specifications for the
processor die. It is critical that the mechanical loading of the
heat sink does not exceed the limits shown in Table 20.
Table 20. Mechanical Loading
LocationDynamic (MAX)Static (MAX)UnitsNote
Die Surface10030lbf1
Die Edge1010lbf2
Notes:
1. Load specified for coplanar contact to die surface.
2. Load defined for a surface at no more than a two-degree angle of inclination to die surface.
Chapter 10Mechanical Data49
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
10.2Part Number 27291 OPGA Package Dimensions for
AMD Athlon™ XP Processors Model 8 with a CPUID of 680
For AMD Athlon XP processors model 8 with a CPUID of 680,
Table 21 shows the 27291 OPGA package dimensions in
millimeters assigned to the letters and symbols used in the
27291 package diagram, Figure 14 on page 52.
Table 21. Part Number 27291 OPGA Package Dimensions for AMD Athlon™
2. The mass consists of the completed package, including processor, surface mounted parts, and
pins.
Minimum
Dimension
Maximum
1
Dimension
1
Letter or
Symbol
2
Mass
Minimum
Dimension
11.0 g REF
Maximum
1
Dimension
1
50Mechanical DataChapter 10
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
10.3Part Number 27291 OPGA Package Dimensions for
AMD Athlon™ XP Processors Model 8 with a CPUID of 681
For AMD Athlon XP processors model 8 with a CPUID of 681,
Table 22 shows the 27291 OPGA package dimensions in
millimeters assigned to the letters and symbols used in the
27291 package diagram, Figure 14 on page 52.
Table 22. Part Number 27291 OPGA Package Dimensions for
AMD Athlon™ XP Processors Model 8 with a CPUID of 681
2. The mass consists of the completed package, including processor, surface mounted parts, and
pins.
Minimum
Dimension
Maximum
1
Dimension
1
Letter or
Symbol
2
Mass
Minimum
Dimension
11.0 g REF
Maximum
1
Dimension
1
Chapter 10Mechanical Data51
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Figure 14. AMD Athlon™ XP Processor Model 8 Part Number 27291 OPGA Package
52Mechanical DataChapter 10
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
10.4Part Number 27648 OPGA Package Dimensions for
AMD Athlon™ XP Processors Model 8 with a CPUID of 681
For AMD Athlon XP processors model 8 with a CPUID of 681,
Table 23 shows the part number 27648 OPGA package
dimensions in millimeters assigned to the letters and symbols
used in the 27648 package diagram, Figure 15 on page 54.
Table 23. Part Number 27648 OPGA Package Dimensions for
AMD Athlon™ XP Processors Model 8 with a CPUID of 681
2. The mass consists of the completed package, including processor, surface mounted parts, and
pins.
Chapter 10Mechanical Data53
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Figure 15. AMD Athlon™ XP Processor Model 8 Part Number 27648 OPGA Package
54Mechanical DataChapter 10
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
11Pin Descriptions
This chapter includes pin diagrams of the organic pin grid array
(OPGA) for the AMD Athlon™ XP processor model 8, a listing
of pin name abbreviations, and a cross-referenced listing of pin
locations to signal names.
11.1Pin Diagram and Pin Name Abbreviations
Figure 16 on page 56 shows the staggered pin grid array (PGA)
for the AMD Athlon™ XP processor model 8. Because some of
the pin names are too long to fit in the grid, they are
abbreviated. Figure 17 on page 57 shows the bottomside view of
the array. Table 24 on page 58 lists all the pins in alphabetical
order by pin name, along with the abbreviation where
necessary.
Chapter 11Pin Descriptions55
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 24. Pin Name Abbreviations
AbbreviationFull NamePin
A20M#AE1
AMDAH6
ANLOGANALOGAJ13
CLKFRCLKFWDRSTAJ21
CLKINAN17
CLKIN#AL17
CNNCTCONNECTAL23
COREFBAG11
COREFB#AG13
CPR#CPU_PRESENCE#AK6
DBRDYAA1
DBREQ#AA3
FERRAG1
FID[0]W1
FID[1]W3
FID[2]Y1
FID[3]Y3
Table 24.Pin Name Abbreviations (continued)
AbbreviationFull NamePin
KEYAA7
KEYAG7
KEYAG9
KEYAG15
KEYAG17
KEYAG27
KEYAG29
NCA19
NCA31
NCC13
NCE25
NCE33
NCF8
NCF30
NCG11
NCG13
NCG19
FLUSH#AL3
FSB0FSB_Sense[0]AG31
FSB1FSB_Sense[1]AH30
IGNNE#AJ1
INIT#AJ3
INTRAL1
K7COK7CLKOUTAL21
K7CO#K7CLKOUT#AN21
KEYG7
KEYG9
KEYG15
KEYG17
KEYG23
KEYG25
KEYN7
KEYQ7
KEYY7
NCG21
NCG27
NCG29
NCG31
NCH6
NCH8
NCH10
NCH28
NCH30
NCH32
NCJ5
NCJ31
NCK8
NCK30
NCL31
NCL35
NCN31
58Pin DescriptionsChapter 11
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Table 24. Pin Name Abbreviations (continued)
AbbreviationFull NamePin
NCQ31
NCS31
NCU31
NCU37
NCW7
NCW31
NCY5
NCY31
NCY33
NCAA5
NCAA31
NCAC7
NCAC31
NCAD8
NCAD30
NCAE7
NCAE31
Table 24.Pin Name Abbreviations (continued)
AbbreviationFull NamePin
NCAJ19
NCAJ27
NCAK8
NCAL7
NCAL9
NCAL11
NCAL25
NCAL27
NCAM8
NCAN7
NCAN9
NCAN11
NCAN25
NCAN27
NMIAN3
PICCLKN1
PICD#0PICD[0]#N3
NCAF6
NCAF8
NCAF10
NCAF28
NCAF30
NCAF32
NCAG5
NCAG19
NCAG21
NCAG23
NCAG25
NCAH8
NCAJ7
NCAJ9
NCAJ11
NCAJ15
NCAJ17
PICD#1PICD[1]#N5
PLBYP#PLLBYPASS#AJ25
PLBYCPLLBYPASSCLKAN15
PLBYC#PLLBYPASSCLK#AL15
PLMN1PLLMON1AN13
PLMN2PLLMON2AL13
PLTST#PLLTEST#AC3
PRCRDYPROCREADYAN23
PWROKAE3
RESET#AG3
RCLKRSTCLKAN19
RCLK#RSTCLK#AL19
SAI#0SADDIN[0]#AJ29
SAI#1SADDIN[1]#AL29
SAI#2SADDIN[2]#AG33
SAI#3SADDIN[3]#AJ37
SAI#4SADDIN[4]#AL35
Chapter 11Pin Descriptions59
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 24. Pin Name Abbreviations (continued)
AbbreviationFull NamePin
SAI#5SADDIN[5]#AE33
SAI#6SADDIN[6]#AJ35
SAI#7SADDIN[7]#AG37
SAI#8SADDIN[8]#AL33
SAI#9SADDIN[9]#AN37
SAI#10SADDIN[10]#AL37
SAI#11SADDIN[11]#AG35
SAI#12SADDIN[12]#AN29
SAI#13SADDIN[13]#AN35
SAI#14SADDIN[14]#AN31
SAIC#SADDINCLK#AJ33
SAO#0SADDOUT[0]#J1
SAO#1SADDOUT[1]#J3
SAO#2SADDOUT[2]#C7
SAO#3SADDOUT[3]#A7
SAO#4SADDOUT[4]#E5
SAO#5SADDOUT[5]#A5
Table 24.Pin Name Abbreviations (continued)
AbbreviationFull NamePin
SD#3SDATA[3]#Y35
SD#4SDATA[4]#U35
SD#5SDATA[5]#U33
SD#6SDATA[6]#S37
SD#7SDATA[7]#S33
SD#8SDATA[8]#AA33
SD#9SDATA[9]#AE37
SD#10SDATA[10]#AC33
SD#11SDATA[11]#AC37
SD#12SDATA[12]#Y37
SD#13SDATA[13]#AA37
SD#14SDATA[14]#AC35
SD#15SDATA[15]#S35
SD#16SDATA[16]#Q37
SD#17SDATA[17]#Q35
SD#18SDATA[18]#N37
SD#19SDATA[19]#J33
SAO#6SADDOUT[6]#E7
SAO#7SADDOUT[7]#C1
SAO#8SADDOUT[8]#C5
SAO#9SADDOUT[9]#C3
SAO#10SADDOUT[10]#G1
SAO#11SADDOUT[11]#E1
SAO#12SADDOUT[12]#A3
SAO#13SADDOUT[13]#G5
SAO#14SADDOUT[14]#G3
SAOC#SADDOUTCLK#E3
SCNCK1SCANCLK1S1
SCNCK2SCANCLK2S5
SCNINVSCANINTEVALS3
SCNSNSCANSHIFTENQ5
SD#0SDATA[0]#AA35
SD#1SDATA[1]#W37
SD#2SDATA[2]#W35
SD#20SDATA[20]#G33
SD#21SDATA[21]#G37
SD#22SDATA[22]#E37
SD#23SDATA[23]#G35
SD#24SDATA[24]#Q33
SD#25SDATA[25]#N33
SD#26SDATA[26]#L33
SD#27SDATA[27]#N35
SD#28SDATA[28]#L37
SD#29SDATA[29]#J37
SD#30SDATA[30]#A37
SD#31SDATA[31]#E35
SD#32SDATA[32]#E31
SD#33SDATA[33]#E29
SD#34SDATA[34]#A27
SD#35SDATA[35]#A25
SD#36SDATA[36]#E21
60Pin DescriptionsChapter 11
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Table 24. Pin Name Abbreviations (continued)
AbbreviationFull NamePin
SD#37SDATA[37]#C23
SD#38SDATA[38]#C27
SD#39SDATA[39]#A23
SD#40SDATA[40]#A35
SD#41SDATA[41]#C35
SD#42SDATA[42]#C33
SD#43SDATA[43]#C31
SD#44SDATA[44]#A29
SD#45SDATA[45]#C29
SD#46SDATA[46]#E23
SD#47SDATA[47]#C25
SD#48SDATA[48]#E17
SD#49SDATA[49]#E13
SD#50SDATA[50]#E11
SD#51SDATA[51]#C15
SD#52SDATA[52]#E9
SD#53SDATA[53]#A13
SD#54SDATA[54]#C9
SD#55SDATA[55]#A9
SD#56SDATA[56]#C21
SD#57SDATA[57]#A21
SD#58SDATA[58]#E19
SD#59SDATA[59]#C19
SD#60SDATA[60]#C17
SD#61SDATA[61]#A11
SD#62SDATA[62]#A17
SD#63SDATA[63]#A15
SDIC#0SDATAINCLK[0]#W33
SDIC#1SDATAINCLK[1]#J35
SDIC#2SDATAINCLK[2]#E27
SDIC#3SDATAINCLK[3]#E15
SDINV#SDATAINVALID#AN33
SDOC#0SDATAOUTCLK[0]#AE35
SDOC#1SDATAOUTCLK[1]#C37
Table 24.Pin Name Abbreviations (continued)
AbbreviationFull NamePin
SDOC#2SDATAOUTCLK[2]#A33
SDOC#3SDATAOUTCLK[3]#C11
SDOV#SDATAOUTVALID#AL31
SFILLV#SFILLVALID#AJ31
SMI#AN5
STPC#STPCLK#AC1
TCKQ1
TDIU1
TDOU5
THDATHERMDAS7
THDCTHERMDCU7
TMSQ3
TRST#U3
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
B4
B8
B12
B16
B20
B24
B28
B32
B36
D2
D4
D8
D12
D16
D20
D24
D28
D32
F12
F16
F20
Chapter 11Pin Descriptions61
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 24. Pin Name Abbreviations (continued)
AbbreviationFull NamePin
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
F24
F28
F32
F34
F36
H2
H4
H12
H16
H20
H24
K32
K34
K36
M2
M4
M6
M8
P30
P32
P34
P36
R2
R4
R6
R8
T30
T32
T34
T36
V2
V4
V6
V8
Table 24.Pin Name Abbreviations (continued)
AbbreviationFull NamePin
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
X30
X32
X34
X36
Z2
Z4
Z6
Z8
AB30
AB32
AB34
AB36
AD2
AD4
AD6
AF14
AF18
AF22
AF26
AF34
AF36
AH2
AH4
AH10
AH14
AH18
AH22
AH26
AK10
AK14
AK18
AK22
AK26
AK30
62Pin DescriptionsChapter 11
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Table 24. Pin Name Abbreviations (continued)
AbbreviationFull NamePin
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VREF_SVREF_SYSW5
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
AK34
AK36
AJ5
AL5
AM2
AM10
AM14
AM18
AM22
AM26
AM22
AM26
AM30
AM34
VCCAAJ23
VID[0]L1
VID[1]L3
VID[2]L5
VID[3]L7
VID[4]J7
VSSB2
VSSB6
VSSB10
VSSB14
VSSB18
VSSB22
VSSB26
VSSB30
VSSB34
VSSD6
VSSD10
VSSD14
VSSD18
Table 24.Pin Name Abbreviations (continued)
AbbreviationFull NamePin
VSSD22
VSSD26
VSSD30
VSSD34
VSSD36
VSSF2
VSSF4
VSSF6
VSSF10
VSSF14
VSSF18
VSSF22
VSSF26
VSSH14
VSSH18
VSSH22
VSSH26
VSSH34
VSSH36
VSSK2
VSSK4
VSSK6
VSSM30
VSSM32
VSSM34
VSSM36
VSSP2
VSSP4
VSSP6
VSSP8
VSSR30
VSSR32
VSSR34
VSSR36
Chapter 11Pin Descriptions63
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 24. Pin Name Abbreviations (continued)
AbbreviationFull NamePin
VSST2
VSST4
VSST6
VSST8
VSSV30
VSSV32
VSSV34
VSSV36
VSSX2
VSSX4
VSSX6
VSSX8
VSSZ30
VSSZ32
VSSZ34
VSSZ36
VSSAB2
Table 24. Pin Name Abbreviations (continued)
AbbreviationFull NamePin
VSSAH36
VSSAK2
VSSAK4
VSSAK12
VSSAK16
VSSAK20
VSSAK24
VSSAK28
VSSAK32
VSSAM4
VSSAM6
VSSAM12
VSSAM16
VSSAM20
VSSAM24
VSSAM28
VSSAM32
VSSAB8
VSSAB4
VSSAB6
VSSAD32
VSSAD34
VSSAD36
VSSAF2
VSSAF4
VSSAF12
VSSAF16
VSSAH12
VSSAH16
VSSAH20
VSSAH24
VSSAH28
VSSAH32
VSSAH34
VSSAM36
ZNAC5
ZPAE5
64Pin DescriptionsChapter 11
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
11.2Pin List
Table 25 on page 66 cross-references Socket A pin location to
signal name.
The “L” (Level) column shows the electrical specification for
this pin. “P” indicates a push-pull mode driven by a single
source. “O” indicates open-drain mode that allows devices to
share the pin.
Note: The AMD Athlon processor supports push-pull drivers. For
more information, see “Push-Pull (PP) Drivers” on page 6.
The “P” (Port) column indicates if this signal is an input (I),
output (O), or bidirectional (B) signal. The “R” (Reference)
column indicates if this signal should be referenced to VSS (G)
or V
CC_CORE
respect to the current return paths.
(P) planes for the purpose of signal routing with
Chapter 11Pin Descriptions65
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 25. Cross-Reference by Pin Location
PinNameDescriptionLPR
A1
A3SADDOUT[12]#PO
A5SADDOUT[5]#PO
A7SADDOUT[3]#PO
A9SDATA[55]#PB
A11SDATA[61]#PB
A13SDATA[53]#PB
A15SDATA[63]#PB
A17SDATA[62]#PB
A19NC Pin page 78--
A21SDATA[57]#PB
A23SDATA[39]#PB
A25SDATA[35]#PB
A27SDATA[34]#PB
No Pin
page 78---
Table 25.Cross-Reference by Pin Location
PinNameDescriptionLPR
B24
B26 VSS---
G
G
B28
B30 VSS---
G
P
B32
B34 VSS---
P
G
B36
C1SADDOUT[7]#POG
G
C3SADDOUT[9]#POG
G
C5SADDOUT[8]#POG
-
C7SADDOUT[2]#POG
G
C9SDATA[54]#PBP
G
C11SDATAOUTCLK[3]#POG
P
C13NC Pin page 78---
P
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
---
A29SDATA[44]#PB
A31NC Pin page 78--
A33SDATAOUTCLK[2]#PO
A35SDATA[40]#PB
A37SDATA[30]#PB
B2VSS--
B4
V
CC_CORE
---
G
-
P
G
P
-
B6 VSS---
B8
V
CC_CORE
---
B10 VSS---
B12
V
CC_CORE
---
B14 VSS---
B16
V
CC_CORE
---
B18 VSS---
B20
V
CC_CORE
---
B22 VSS---
C15SDATA[51]#PBP
C17SDATA[60]#PBG
C19SDATA[59]#PBG
C21SDATA[56]#PBG
C23SDATA[37]#PBP
C25SDATA[47]#PBG
C27SDATA[38]#PBG
C29SDATA[45]#PBG
C31SDATA[43]#PBG
C33SDATA[42]#PBG
C35SDATA[41]#PBG
C37SDATAOUTCLK[1]#POG
D2
D4
V
CC_CORE
V
CC_CORE
---
---
D6 VSS---
D8
V
CC_CORE
---
66Pin DescriptionsChapter 11
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Table 25. Cross-Reference by Pin Location
(continued)
PinNameDescriptionLPR
D10 VSS---
D12
V
CC_CORE
---
D14 VSS---
D16
V
CC_CORE
---
D18 VSS---
D20
V
CC_CORE
---
D22VSS---
D24
V
CC_CORE
---
D26VSS---
D28
V
CC_CORE
---
D30VSS---
D32
V
CC_CORE
---
D34VSS---
D36VSS---
Table 25.Cross-Reference by Pin Location
PinNameDescriptionLPR
E33NC Pin page 78---
E35SDATA[31]#PBP
E37SDATA[22]#PBG
F2 VSS---
F4 VSS---
F6 VSS---
F8NC Pin page 78---
F10 VSS---
F12
F14 VSS---
F16
F18 VSS---
F20
F22 VSS---
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
E1SADDOUT[11]#POP
E3SADDOUTCLK#POG
E5SADDOUT[4]#POP
E7SADDOUT[6]#POG
E9SDATA[52]#PBP
E11SDATA[50]#PBP
E13SDATA[49]#PBG
E15SDATAINCLK[3]#PIG
E17SDATA[48]#PBP
E19SDATA[58]#PBG
E21SDATA[36]#PBP
E23SDATA[46]#PBP
E25NC Pin page 78---
E27SDATAINCLK[2]#PIG
E29SDATA[33]#PBP
E31SDATA[32]#PBP
F24
V
CC_CORE
---
F26 VSS---
F28
V
CC_CORE
---
F30NC Pin page 78---
F32
F34
F36
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
G1SADDOUT[10]#POP
G3SADDOUT[14]#POG
G5SADDOUT[13]#POG
G7Key Pinpage 78---
G9Key Pinpage 78---
G11NC Pinpage 78---
G13NC Pin page 78---
G15Key Pinpage 78---
G17Key Pin page 78---
Chapter 11Pin Descriptions67
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 25. Cross-Reference by Pin Location
(continued)
PinNameDescriptionLPR
G19NC Pin page 78---
G21NC Pin page 78---
G23Key Pinpage 78---
G25Key Pin page 78---
G27NC Pin page 78---
G29NC Pin page 78---
G31NC Pin page 78---
G33SDATA[20]#PBG
G35SDATA[23]#PBG
G37SDATA[21]#PBG
H2
H4
V
CC_CORE
V
CC_CORE
---
---
H6NC Pinpage 78---
H8NC Pinpage 78---
H10NC Pinpage 78---
Table 25.Cross-Reference by Pin Location
PinNameDescriptionLPR
J5NC Pin page 78---
J7VID[4]page 79OO-
J31NC Pinpage 78---
J33SDATA[19]#PBG
J35SDATAINCLK[1]#PIP
J37SDATA[29]#PBP
K2 VSS---
K4 VSS---
K6 VSS---
K8NC Pin page 78---
K30NC Pinpage 78---
K32
K34
K36
L1VID[0]page 79OO-
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
H12
V
CC_CORE
---
H14 VSS---
H16
V
CC_CORE
---
H18 VSS---
H20
V
CC_CORE
---
H22VSS---
H24
V
CC_CORE
---
H26VSS---
H28NC Pin page 78---
H30NC Pin page 78---
H32NC Pin page 78---
H34VSS---
H36VSS---
J1SADDOUT[0]#page 79PO-
J3SADDOUT[1]#page 79PO-
L3VID[1] page 79OO-
L5VID[2] page 79OO-
L7VID[3]page 79OO-
L31NC Pin page 78---
L33SDATA[26]#PBP
L35NC Pin page 78---
L37SDATA[28]#PBP
M2
M4
M6
M8
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
---
M30VSS---
M32VSS---
M34VSS---
M36VSS---
68Pin DescriptionsChapter 11
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Table 25. Cross-Reference by Pin Location
(continued)
PinNameDescriptionLPR
N1PICCLKpage 74OI-
N3PICD#[0]page 74OB-
N5PICD#[1]page 74OB-
N7Key Pin page 78---
N31NC Pinpage 78---
N33SDATA[25]#PBP
N35SDATA[27]#PBP
N37SDATA[18]#PBG
P2 VSS---
P4 VSS---
P6 VSS---
P8 VSS---
P30
P32
P34
P36
Q1TCK page 77PI
Q3TMSpage 77PI
Q5SCANSHIFTEN page 79PI
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
---
-
-
-
Table 25.Cross-Reference by Pin Location
PinNameDescriptionLPR
R34 VSS---
R36 VSS---
S1SCANCLK1 page 79PI-
S3SCANINTEVAL page 79PI-
S5SCANCLK2page 79PI-
S7THERMDApage 79---
S31NC Pinpage 78---
S33SDATA[7]#PBG
S35SDATA[15]#PBP
S37SDATA[6]#PBG
T2 VSS---
T4 VSS---
T6 VSS---
T8 VSS---
T30
T32
T34
T36
U1TDI page 77PI-
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
---
Q7Key Pin page 78--
Q31NC Pin page 78--
Q33SDATA[24]#PB
Q35SDATA[17]#PB
Q37SDATA[16]#PB
R2
R4
R6
R8
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
---
R30 VSS---
R32 VSS---
U3TRST# page 77PI-
-
U5TDO page 77PO-
-
U7THERMDCpage 79---
P
U31NC Pinpage 78---
G
U33SDATA[5]#PBG
G
U35SDATA[4]#PBG
U37NC Pin page 78---
V2
V4
V6
V8
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
---
Chapter 11Pin Descriptions69
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 25. Cross-Reference by Pin Location
(continued)
PinNameDescriptionLPR
V30 VSS---
V32 VSS---
V34 VSS---
V36 VSS---
W1FID[0] page 76OO-
W3FID[1]page 76OO-
W5VREFSYSpage 80P--
W7NC Pinpage 78---
W31NC Pinpage 78---
W33SDATAINCLK[0]#PIG
W35SDATA[2]#PBG
W37SDATA[1]#PBP
X2 VSS---
X4 VSS---
Table 25.Cross-Reference by Pin Location
PinNameDescriptionLPR
Z6
Z8
Z30 VSS---
Z32 VSS---
Z34 VSS---
Z36 VSS---
AA1DBRDY page 75PO-
AA3DBREQ# page 75PI-
AA5NC---
AA7Key Pinpage 78---
AA31NC Pinpage 78---
AA33SDATA[8]#PBP
AA35SDATA[0]#PBG
AA37SDATA[13]#PBG
V
CC_CORE
V
CC_CORE
---
---
X6 VSS---
X8 VSS---
X30
X32
X34
X36
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
---
Y1FID[2]page 76OO-
Y3FID[3] page 76OO-
Y5NC Pinpage 78---
Y7Key Pin page 78---
Y31NC Pinpage 78---
Y33NC Pin page 78---
Y35SDATA[3]#PBG
Y37SDATA[12]#PBP
Z2
Z4
V
CC_CORE
V
CC_CORE
---
---
AB2VSS---
AB4VSS---
AB6VSS---
AB8VSS---
AB30
AB32
AB34
AB36
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
---
AC1STPCLK#page 79PI-
AC3PLLTEST# page 78PI-
AC5ZN page 80P--
AC7NC---
AC31NC Pinpage 78---
AC33SDATA[10]#PBP
AC35SDATA[14]#PBG
AC37SDATA[11]#PBG
70Pin DescriptionsChapter 11
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Table 25. Cross-Reference by Pin Location
(continued)
PinNameDescriptionLPR
AD2
AD4
AD6
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
AD8NC Pinpage 78--
AD30NC Pinpage 78--
AD32VSS--
AD34VSS--
AD36VSS--
AE1A20M#PI
AE3PWROKPI
AE5ZP page 80P-
AE7NC--
AE31NC Pinpage 78--
AE33SADDIN[5]#PI
Table 25.Cross-Reference by Pin Location
PinNameDescriptionLPR
AF30NC Pinpage 78---
AF32NC Pinpage 78---
AF34
-
AF36
AG1FERRpage 75PO-
-
AG3RESET#-I-
-
AG5NC Pinpage 78---
-
AG7Key Pin page 78---
-
AG9Key Pinpage 78---
-
AG11COREFBpage75 ---
-
AG13COREFB#page75 ---
-
AG15Key Pin page 78---
-
AG17Key Pinpage 78---
-
AG19NC Pinpage 78---
G
V
CC_CORE
V
CC_CORE
---
---
AE35SDATAOUTCLK[0]#PO
AE37SDATA[9]#PB
AF2VSS--
AF4VSS--
AF6NC Pinpage 78--
AF8NC Pinpage 78--
AF10NC Pinpage 78--
AF12VSS--
AF14
V
CC_CORE
---
P
G
-
-
-
-
-
-
AF16VSS---
AF18
V
CC_CORE
---
AF20VSS---
AF22
V
CC_CORE
---
AF24VSS---
AF26
V
CC_CORE
---
AF28NC Pinpage 78---
AG21NC Pinpage 78---
AG23NC Pinpage 78---
AG25NC Pinpage 78---
AG27Key Pinpage 78---
AG29Key Pinpage 78---
AG31FSB_Sense[0]page 77-OG
AG33SADDIN[2]#PIG
AG35SADDIN[11]#PIG
AG37SADDIN[7]#PIP
AH2
AH4
V
CC_CORE
V
CC_CORE
---
---
AH6AMD Pin page74 ---
AH8NC Pinpage 78---
AH10
V
CC_CORE
---
AH12VSS---
AH14
V
CC_CORE
---
Chapter 11Pin Descriptions71
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 25. Cross-Reference by Pin Location
(continued)
PinNameDescriptionLPR
AH16VSS---
AH18
V
CC_CORE
---
AH20VSS---
AH22
V
CC_CORE
---
AH24VSS---
AH26
V
CC_CORE
---
AH28VSS---
AH30FSB_Sense[1]page 77-OG
AH32VSS---
AH34VSS---
AH36VSS---
AJ1IGNNE#page 77PI-
AJ3INIT#page 77PI-
AJ5
V
CC_CORE
---
AJ7NC Pinpage 78---
AJ9NC Pinpage 78---
Table 25.Cross-Reference by Pin Location
PinNameDescriptionLPR
AK2VSS---
AK4VSS---
AK6CPU_PRESENCE#page 75---
AK8NC Pinpage 78---
AK10
AK12VSS---
AK14
AK16VSS---
AK18
AK20VSS---
AK22
AK24VSS---
AK26
AK28VSS---
AK30
AK32VSS---
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
---
---
---
AJ11NC Pinpage 78---
AJ13Analog page 74---
AJ15NC Pinpage 78---
AJ17NC Pinpage 78---
AJ19NC Pinpage 78---
AJ21CLKFWDRSTpage 74PIP
AJ23VCCA page 79---
AJ25PLLBYPASS# page 78PI-
AJ27NC Pinpage 78---
AJ29SADDIN[0]#page 79PI-
AJ31SFILLVALID#PIG
AJ33SADDINCLK#PIG
AJ35SADDIN[6]#PIP
AJ37SADDIN[3]#PIG
AK34
AK36
V
CC_CORE
V
CC_CORE
---
---
AL1INTRpage 77PI-
AL3FLUSH#page 77PI-
AL5
V
CC_CORE
---
AL7NC Pinpage 78---
AL9NC Pinpage 78---
AL11NC Pinpage 78---
AL13PLLMON2page 78OO-
AL15PLLBYPASSCLK#page 78PI-
AL17CLKIN#page 74PIP
AL19RSTCLK#page 74PIP
AL21K7CLKOUTpage 78PO-
AL23CONNECTpage 75PIP
72Pin DescriptionsChapter 11
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Table 25. Cross-Reference by Pin Location
PinNameDescriptionLPR
AL25NC Pinpage 78---
AL27NC Pinpage 78---
AL29SADDIN[1]#page 79PI-
AL31SDATAOUTVALID#POP
AL33SADDIN[8]#PIP
AL35SADDIN[4]#PIG
AL37SADDIN[10]#PIG
AM2
AM4VSS---
AM6VSS---
AM8NC Pinpage 78---
AM10
AM12VSS---
AM14
AM16VSS---
V
CC_CORE
V
CC_CORE
V
CC_CORE
---
---
---
Table 25. Cross-Reference by Pin Location
PinNameDescriptionLPR
AN11NC Pinpage 78---
AN13PLLMON1 page 78OB-
AN15PLLBYPASSCLK page 78PI-
AN17CLKIN page 74PIP
AN19RSTCLK page 74PIP
AN21K7CLKOUT# page 78PO-
AN23PROCRDYPOP
AN25NC Pinpage 78---
AN27NC Pinpage 78---
AN29SADDIN[12]#PIG
AN31SADDIN[14]#PIG
AN33SDATAINVALID#PIP
AN35SADDIN[13]#PIG
AN37SADDIN[9]#PIG
AM18
V
CC_CORE
---
AM20VSS---
AM22
V
CC_CORE
---
AM24VSS---
AM26
V
CC_CORE
---
AM28VSS---
AM30
V
CC_CORE
---
AM32VSS---
AM34
V
CC_CORE
---
AM36VSS---
AN1No Pin page 78---
AN3NMIPI-
AN5SMI#PI-
AN7NC Pinpage 78---
AN9NC Pinpage 78---
Chapter 11Pin Descriptions73
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
11.3Detailed Pin Descriptions
The information in this section pertains to Table 25 on page 66.
A20M# PinA20M# is an input from the system used to simulate address
wrap-around in the 20-bit 8086.
AMD PinAMD Socket A processors do not implement a pin at location
AH6. All Socket A designs must have a top plate or cover that
blocks this pin location. When the cover plate blocks this
location, a non-AMD part (e.g., PGA370) does not fit into the
socket. However, socket manufacturers are allowed to have a
contact loaded in the AH6 position. Therefore, motherboard
socket design should account for the possibility that a contact
could be loaded in this position.
AMD Athlon™
System Bus Pins
Analog PinTreat this pin as a NC.
APIC Pins, PICCLK,
PICD[1:0]#
CLKFWDRST PinCLKFWDRST resets clock-forward circuitry for both the system
See the AMD Athlon™ System Bus Specification, order# 21902
for information about the system bus pins—PROCRDY,
PWROK, RESET#, SADDIN[14:2]#, SADDINCLK#,
SADDOUT[14:2]#, SADDOUTCLK#, SDATA[63:0]#,
SDATAINCLK[3:0]#, SDATAINVALID#, SDATAOUTCLK[3:0]#,
SDATAOUTVALID#, SFILLVALID#.
The Advanced Programmable Interrupt Controller (APIC) is a
feature that provides a flexible and expandable means of
delivering interrupts in a system using an AMD processor. The
pins, PICD[1:0], are the bi-directional message-passing signals
used for the APIC and are driven to the Southbridge or a
dedicated I/O APIC. The pin, PICCLK, must be driven with a
valid clock input.
For more information, see Table 19, “APIC Pin AC and DC
Characteristics,” on page 44.
and processor.
CLKIN, RSTCLK
(SYSCLK) Pins
74Pin DescriptionsChapter 11
Connect CLKIN with RSTCLK and name it SYSCLK. Connect
CLKIN# with RSTCLK# and name it SYSCLK#. Length match
the clocks from the clock generator to the Northbridge and
processor.
See “SYSCLK and SYSCLK#” on page 79 for more information.
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
CONNECT PinCONNECT is an input from the system used for power
management and clock-forward initialization at reset.
COREFB and
COREFB# Pins
COREFB and COREFB# are outputs to the system that provide
processor core voltage feedback to the system.
CPU_PRESENCE# PinCPU_PRESENCE# is connected to VSS on the processor
package. If pulled-up on the motherboard, CPU_PRESENCE#
may be used to detect the presence or absence of a processor in
the Socket A-style socket.
DBRDY and DBREQ#
Pins
DBRDY and DBREQ# are routed to the debug connector.
DBREQ# is tied to V
CC_CORE
with a pullup resistor.
FERR PinFERR is an output to the system that is asserted for any
unmasked numerical exception independent of the NE bit in
CR0. FERR is a push-pull active High signal that must be
inverted and level shifted to an active Low signal. For more
information about FERR and FERR#, see the “Required
Circuits” chapter of the AMD Athlon™ Processor-BasedMotherboard Design Guide, order# 24363.
FID[3:0] PinsFID[3] (Y3), FID[2] (Y1), FID[1] (W3), and FID[0] (W1) are the
4-bit processor clock-to-SYSCLK ratio.
Table 26 on page 76 shows the encodings of the clock
multipliers on FID[3:0].
Chapter 11Pin Descriptions75
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 26. FID[3:0] Clock Multiplier Encodings
FID[3:0]
Notes:
1. All ratios greater than or equal to 12.5x have the same FID[3:0] code of 0011b, which causes
the SIP configuration for all ratios of 12.5x or greater to be the same.
2. BIOS initializes the CLK_Ctl MSR during the POST routine. This CLK_Ctl setting is used with all
FID combinations and selects a Halt disconnect divisor and a Stop Grant disconnect divisor.
For more information, refer to the AMD Athlon™ and AMD Duron™ Processors BIOS, Software, and Debug Developers Guide, order# 21656.
The FID[3:0] signals are open-drain processor outputs that are
pulled High on the motherboard and sampled by the chipset to
determine the SIP (Serialization Initialization Packet) that is
sent to the processor. The FID[3:0] signals are valid after
PWROK is asserted. The FID[3:0]signals must not be sampled
until they become valid. See the AMD Athlon™ System BusSpecification, order# 21902 for more information about
Serialization Initialization Packets and SIP protocol.
The processor FID[3:0] outputs are open-drain and 2.5-V
tolerant. To prevent damage to the processor, if these signals
are pulled High to above 2.5 V, they must be electrically
isolated from the processor. For information about the FID[3:0]
isolation circuit, see the AMD Athlon™ Processor-BasedMotherboard Design Guide, order# 24363.
76Pin DescriptionsChapter 11
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
See “Frequency Identification (FID[3:0])” on page 33 for the
DC characteristics for FID[3:0].
FSB_Sense[1:0] PinsFSB_Sense[1:0] pins are either open circuit (logic level of 1) or
are pulled to ground (logic level of 0) on the processor package
with a 1 kΩ resistor. In conjunction with a circuit on the
motherboard, these pins may be used to automatically detect
the front-side bus (FSB) setting of this processor. Proper
detection of the FSB setting requires the implementation of a
pull-up resistor on the motherboard. Refer to the AMD Athlon™Processor-Based Motherboard Design Guide, order# 24363 and the
technical note FSB_Sense Auto Detection Circuitry for DesktopProcessors, order# TN26673 for more information.
Table 27 is the truth table to determine the FSB of desktop
processors.
Table 27. Front-Side Bus Sense Truth Table
FSB_Sense[1] FSB_Sense[0] Bus Frequency
10 RESERVED
11 133 MHz
01 166 MHz
00 RESERVED
The FSB_Sense[1:0] pins are 3.3-V tolerant.
FLUSH# PinFLUSH# must be tied to V
CC_CORE
with a pullup resistor. If a
debug connector is implemented, FLUSH# is routed to the
debug connector.
IGNNE# PinIGNNE# is an input from the system that tells the processor to
ignore numeric errors.
INIT# PinINIT# is an input from the system that resets the integer
registers without affecting the floating-point registers or the
internal caches. Execution starts at 0_FFFF_FFF0h.
INTR PinINTR is an input from the system that causes the processor to
start an interrupt acknowledge transaction that fetches the
8-bit interrupt vector and starts execution at that location.
JTAG PinsTCK, TMS, TDI, TRST#, and TDO are the JTAG interface.
Connect these pins directly to the motherboard debug
connector. Pull TDI, TCK, TMS, and TRST# up to V
CC_CORE
with
pullup resistors.
Chapter 11Pin Descriptions77
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
K7CLKOUT and
K7CLKOUT# Pins
K7CLKOUT and K7CLKOUT# are each run for two to three
inches and then terminated with a resistor pair: 100 ohms to
V
CC_CORE
resistance and voltage are 50 ohms and V
and 100 ohms to VSS. The effective termination
CC_CORE
/2.
Key PinsThese 16 locations are for processor type keying for forwards
and backwards compatibility (G7, G9, G15, G17, G23, G25, N7,
Q7, Y7, AA7, AG7, AG9, AG15, AG17, AG27, and AG29).
Motherboard designers should treat key pins like NC (No
Connect) pins. A socket designer has the option of creating a
top mold piece that allows PGA key pins only where designated.
However, sockets that populate all 16 key pins must be allowed,
so the motherboard must always provide for pins at all key pin
locations.
See “NC Pins” for more information.
NC PinsThe motherboard should provide a plated hole for an NC pin.
The pin hole should not be electrically connected to anything.
NMI PinNMI is an input from the system that causes a non-maskable
interrupt.
PGA Orientation PinsNo pin is present at pin locations A1 and AN1. Motherboard
designers should not allow for a PGA socket pin at these
locations.
For more information, see the AMD Athlon™ Processor-BasedMotherboard Design Guide, order# 24363.
PLL Bypass and Test
Pins
PLLTEST#, PLLBYPASS#, PLLMON1, PLLMON2,
PLLBYPASSCLK, and PLLBYPASSCLK# are the PLL bypass
and test interface. This interface is tied disabled on the
motherboard. All six pin signals are routed to the debug
connector. All four processor inputs (PLLTEST#, PLLBYPASS#,
PLLMON1, and PLLMON2) are tied to V
CC_CORE
with pullup
resistors.
PWROK PinThe PWROK input to the processor must not be asserted until
all voltage planes in the system are within specification and all
system clocks are running within specification.
For more information, Chapter 9, “Signal and Power-Up
Requirements” on page 45.
78Pin DescriptionsChapter 11
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
SADDIN[1:0]# and
SADDOUT[1:0]# Pins
The AMD Athlon XP processor model 8 does not support
SADDIN[1:0]# or SADDOUT[1:0]#. SADDIN[1]# is tied to VCC
with pullup resistors, if this bit is not supported by the
Northbridge (future models can support SADDIN[1]#).
SADDOUT[1:0]# are tied to VCC with pullup resistors if these
pins are supported by the Northbridge. For more information,
see the AMD Athlon™ System Bus Specification, order# 21902.
Scan PinsSCANSHIFTEN, SCANCLK1, SCANINTEVAL, and SCANCLK2
are the scan interface. This interface is AMD internal and is
tied disabled with pulldown resistors to ground on the
motherboard.
SMI# PinSMI# is an input that causes the processor to enter the system
management mode.
STPCLK# PinSTPCLK# is an input that causes the processor to enter a lower
power mode and issue a Stop Grant special cycle.
SYSCLK and SYSCLK# SYSCLK and SYSCLK# are differential input clock signals
provided to the PLL of the processor from a system-clock
generator.
See “CLKIN, RSTCLK (SYSCLK) Pins” on page 74 for more
information.
THERMDA and
THERMDC Pins
Thermal Diode anode and cathode pins are used to monitor the
actual temperature of the processor die, providing more
accurate temperature control to the system.
See Table 17, “Thermal Diode Electrical Characteristics,” on
page 42 for more information.
VCCA PinVCCA is the processor PLL supply. For information about the
VCCA pin, see Table 5, “VCCA AC and DC Characteristics,” on
page 35 and the AMD Athlon™ Processor-Based MotherboardDesign Guide, order# 24363.
VID[4:0] PinsThe VID[4:0] (Voltage Identification) outputs are used to
dictate the V
CC_CORE
voltage level. The VID[4:0] pins are
strapped to ground or left unconnected on the processor
package. The VID[4:0] pins are pulled-up on the motherboard
and used by the V
CC_CORE
DC/DC converter.
The VID codes and corresponding voltage levels are shown in
Table 28.
Chapter 11Pin Descriptions79
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Table 28. VID[4:0] Code to Voltage Definition
VID[4:0]
000001.850100001.450
000011.825100011.425
000101. 80 0100101.40 0
000111.775100111. 375
001001.7501010 01.350
001011. 725101011. 325
001111. 675101111. 275
010001. 65 0110 001.250
010011.625110011.225
010101. 600110101. 200
010111. 575110111.175
011001.55 0111001.150
011011. 525111011.125
011101. 500111101.100
011111.47511111No C PU
V
CC_CORE
(V)
VID[4:0]
V
CC_CORE
(V)
For more information, see the “Required Circuits” chapter of
the AMD Athlon™ Processor-Based Motherboard Design Guide,
order# 24363.
VREFSYS PinVREFSYS (W5) drives the threshold voltage for the system bus
input receivers. The value of VREFSYS is system specific. In
addition, to minimize V
CC_CORE
noise rejection from VREFSYS,
include decoupling capacitors. For more information, see the
AMD Athlon™ Processor-Based Motherboard Design Guide, order#
24363.
ZN and ZP PinsZN (AC5) and ZP (AE5) are the push-pull compensation circuit
pins. In Push-Pull mode (selected by the SIP parameter
SysPushPull asserted), ZN is tied to V
CC_CORE
that has a resistance matching the impedance Z
with a resistor
of the
0
transmission line. ZP is tied to VSS with a resistor that has a
resistance matching the impedance Z0 of the transmission line.
80Pin DescriptionsChapter 11
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
12Ordering Information
This section provides the ordering information for the
AMD Athlon™ XP processor model 8.
Standard AMD Athlon™ XP Processor Model 8 Products
AMD standard products are available in several operating
ranges. The ordering part numbers (OPN) are formed by a
combination of the elements, as shown in Figure 18.
1
OPN
AXD AD2700
D K V 3
Advanced Front-Side Bus (FSB): C = 266, D = 333
Size of L2 Cache: 3 = 256 Kbytes
Die Temperature: T = 90°C, V = 85°C
Operating Voltage: L = 1.50 V, U = 1.60 V, K = 1.65 V
Package Type: D = OPGA
Model Number: 1600 operates at 1400 MHz
1700 at 1467 MHz
1800 at 1533 MHz
1900 at 1600 MHz
2000
at 1667 MHz
2100 at 1733 MHz
2200 at 1800 MHz
2400 at 2000 MHz
2600 at 2083 MHz
2700 at 2167 MHz
2
,
2
,
2
,
2
,
2
,
2
,
2
,
3
or 2133 MHz2,
3
2
,
Maximum Power: A = Desktop Processor
Architecture Segment: AXD = AMD Athlon™ XP Processor Model 8 with
QuantiSpeed™ Architecture for Desktop Products
Notes:
1. Spaces are added to the number shown above for viewing clarity only.
2. This processor is available only with a 266 advanced FSB.
3. This processor is available only with a 333 advanced FSB.
Figure 18. OPN Example for the AMD Athlon™ XP Processor Model 8
Chapter 12Ordering Information81
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
82Ordering InformationChapter 12
Preliminary Information
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Appendix A
Thermal Diode Calculations
This section contains information about the calculations for the
on-die thermal diode of the AMD Athlon™ XP processor model
8. For electrical information about this thermal diode, see
Table 17, “Thermal Diode Electrical Characteristics,” on
page 42.
Ideal Diode Equation
The ideal diode equation uses the variables and constants
defined in Table 29.
Table 29. Constants and Variables for the Ideal Diode Equation
Equation SymbolVariable, Constant Description
n
f, lumped
kBoltzmann constant
qElectron charge constant
TDiode temperature (Kelvin)
V
BE
I
C
I
S
Lumped ideality factor
Voltage from base to emitter
Collector current
Saturation current
Appendix A - Thermal Diode Calculations83
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
Equation (1) shows the ideal diode calculation.
BE
n
flumped,
V
Sourcing two currents and using Equation (1) derives the
difference in the base-to-emitter voltage that leads to finding
the diode temperature as shown in Equation (2). The use of
dual sourcing currents allows the measurement of the thermal
diode temperature to be more accurate and less susceptible to
die and process revisions. Temperature sensors that utilize
series resistance cancellation can use more than two sourcing
currents and are suitable to be used with the AMD thermal
diode. Equation (2) is the formula for calculating the
temperature of a thermal diode.
A temperature offset may be required to correct the value
measured by a temperature sensor. An offset is necessary if a
difference exists between the lumped ideality factor of the
processor and the ideality factor assumed by the temperature
sensor. The lumped ideality factor can be calculated using the
equations in this section to find the temperature offset that
should be used with the temperature sensor.
k
-- -
q
–
k
-- -
q
T
ln⋅⋅⋅=
V
BE low,
I
------- -
ln⋅⋅
I
I
--- -
I
high
low
C
S
(1)
(2)
Table 30 shows the constants and variables used to calculate the
temperature offset correction.
Table 30. Constants and Variables Used in Temperature Offset Equations
Equation SymbolVariable, Constant Description
n
f, actual
n
f, lumped
n
f, TS
I
high
I
low
T
die, spec
T
offset
Actual ideality factor
Lumped ideality factor
Ideality factor assumed by temperature sensor
High sourcing current
Low sourcing current
Die temperature specification
Temperature offset
84Appendix A - Thermal Diode Calculations
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
The formulas in Equation (3) and Equation (4) can be used to
calculate the temperature offset for temperature sensors that
do not employ series resistance cancellation. The result is
added to the value measured by the temperature sensor.
Contact the vendor of the temperature sensor being used for
the value of n
. Refer to the document, On-Die Thermal Diode
f,TS
Characterization, order# 25443, for further details.
Equation (3) shows the equation for calculating the lumped
ideality factor (n
Equation (4) shows the equation for calculating temperature
offset (T
) in sensors that do not employ series resistance
offset
cancellation.
n
T
offset
T
die spec,
273.15+()=1
⋅
flumped,
---------------–
n
fTS,
(4)
Equation (5) is the temperature offset for temperature sensors
that utilize series resistance cancellation. Add the result to the
value measured by the temperature sensor. Note that the value
of n
in Equation (5) may not equal the value used in
f,TS
Equation (4).
n
T
offset
T
die spec,
273.15+()=1
⋅
f actual,
---------------–
n
fTS,
(5)
Appendix A - Thermal Diode Calculations85
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
86Appendix A - Thermal Diode Calculations
Preliminary Information
25175H—March 2003AMD Athlon™ XP Processor Model 8 Data Sheet
Appendix B
Conventions and
Abbreviations
Signals and Bits
This section contains information about the conventions and
abbreviations used in this document.
■Active-Low Signals—Signal names containing a pound sign,
such as SFILL#, indicate active-Low signals. They are
asserted in their Low-voltage state and negated in their
High-voltage state. When used in this context, High and Low
are written with an initial upper case letter.
■Signal Ranges—In a range of signals, the highest and lowest
signal numbers are contained in brackets and separated by a
colon (for example, D[63:0]).
■Reserved Bits and Signals— Signals or bus bits marked
reserved must be driven inactive or left unconnected, as
indicated in the signal descriptions. These bits and signals
are reserved by AMD for future implementations. When
software reads registers with reserved bits, the reserved bits
must be masked. When software writes such registers, it
must first read the register and change only the
non-reserved bits before writing back to the register.
■Three-State—In timing diagrams, signal ranges that are
high impedance are shown as a straight horizontal line
half-way between the high and low levels.
Appendix B - Conventions and Abbreviations87
Preliminary Information
AMD Athlon™ XP Processor Model 8 Data Sheet25175H—March 2003
■Invalid and Don’t-Care— In timing diagrams, signal ranges
that are invalid or don't-care are filled with a screen pattern.
Data Terminology
The following list defines data terminology:
■Quantities
•A word is two bytes (16 bits)
•A doubleword is four bytes (32 bits)
•A quadword is eight bytes (64 bits)
■Addressing—Memory is addressed as a series of bytes on
eight-byte (64-bit) boundaries in which each byte can be
separately enabled.
■Abbreviations—The following notation is used for bits and
bytes:
•Kilo (K, as in 4-Kbyte page)
•Mega (M, as in 4 Mbits/sec)
•Giga (G, as in 4 Gbytes of memory space)
See Table 31 on page 89 for more abbreviations.
■Little-Endian Convention —The byte with the address
xx...xx00 is in the least-significant byte position (little end).
In byte diagrams, bit positions are numbered from right to
left—the little end is on the right and the big end is on the
left. Data structure diagrams in memory show low addresses
at the bottom and high addresses at the top. When data
items are aligned, bit notation on a 64-bit data bus maps
directly to bit notation in 64-bit-wide memory. Because byte
addresses increase from right to left, strings appear in
reverse order when illustrated.
■Bit Ranges—In text, bit ranges are shown with a dash (for
example, bits 9–1). When accompanied by a signal or bus
name, the highest and lowest bit numbers are contained in
brackets and separated by a colon (for example, AD[31:0]).
■Bit Values— Bits can either be set to 1 or cleared to 0.
■Hexadecimal and Binary Numbers—Unless the context
makes interpretation clear, hexadecimal numbers are
followed by an h and binary numbers are followed by a b.
88Appendix B - Conventions and Abbreviations
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