AMD Am29LV400B Service Manual

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ADVANCE INFORMATION
Am29LV400B
4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS 3.0 Volt-only Boot Sec tor Flash Memory
DISTINCTIVE CHARACTERISTICS
Single power supply operation
— Full voltage range: 2.7 to 3. 6 volt read and write
operations for battery-powered applications
— Regulated voltage range: 3.0 to 3. 6 volt read
and write operations and for compatibility with high performance 3.3 volt microprocessors
Manufactured on 0.35 µm process technology
— Compatible with 0.5 µm Am29LV400 device
High performance
— Full voltage range: ac cess times as f ast as 80 ns — Regulated voltage range: access times as fast
as 70 ns
Ultra low power consumption (typical values at
5 MHz)
— 200 nA Automatic Sleep mode current — 200 nA standby mode current — 7 mA read current — 15 mA program/erase current
Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
seven 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and
seven 32 Kword sectors (word mode) — Supports full chip erase — Sector Protection features:
A hardware method of locking a sector to
prevent any program or erase operations within
that sector
Sectors can be locked in-system or via
programming equipment
T emporary Sector Unprotect feat ure allows code
changes in previously locked sectors
Unlock Bypass Program Command
Top or bottom boot block configurations
Embedded Al gorithms
Minimum 1,000,000 write cycle guarantee per
Package option
Compatibility with JEDEC standards
Data# Polling and toggle bits
Ready/Busy# pin (RY/BY#)
Erase Suspend/Erase Resume
Hardware reset pin (RESET#)
— Reduces overall programming time when
issuing multiple program command sequences
available
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
sector
— 48-ball FBGA — 48-pin TSOP — 44-pin SO
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write protection
— Provides a software method of detecting
program or erase operation completion
— Provides a hardware method of detecting
program or erase cycle completion
— Suspends an erase operati on to read dat a from,
or program data to, a sector that is not being erased, then resumes the erase operation
— Hardware method to reset the de vi ce to reading
array data
This document contains information on a product under development at Advanced Micro Devices. The information is intended to help you ev aluate this product. AMD reserves the right to change or dis continue work on thi s proposed product without notice.
Publication# 21523 Rev: A Amendment/0 Issue Date: January 1998
ADVANCE INFORMATION
GENERAL DESCRIPTION
The Am29LV400B is a 4 Mbit, 3.0 volt-only Flash memory organized as 524,288 bytes or 262,144 words. The device is offered in 48-ball FBGA, 44-pin SO, and 48-pin TSOP packages. The wor d-wide data (x16)
appears on DQ 15–DQ0; the byte-wide (x8) data appears on DQ7–DQ0. This device is designed to be programmed in-system using only a single 3.0 volt V supply. No VPP is required for write or erase opera­tions. The device can also be programmed in standard EPROM programmers.
This device is manufactured usin g AMD’s 0.35 µm process technology, and offers all the features and benefits of the Am29LV400, which was manufactured using 0.5 µm process technology. In addition, the Am29LV400B features unlock bypass programming and in-system sector protection/unprotection.
The standard device offers access times of 70, 80, 90 and 120 ns, allowing high speed microprocessors to operate without wait s tates. To el iminate bus conten­tion the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls.
The device requires only a single 3. 0 v o lt po wer sup- ply for both read and write functions. Internally gener­ated and regulated voltages are provided for the program and erase operations.
The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Com­mands are written to the command regis ter using standard micropr ocessor wri te timings. Register co n­tents serve as input to an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices.
Device programming occurs by executing the program command sequence. This initiates the Embedded Program algorithm—an internal algorithm that auto­matically times the program pulse widths and verifies proper cell margin. The Unlock Bypass mode facili­tates faster programming times by requir ing only two write cycles to program data instead of four.
Device erasure occurs by executing the erase com­mand sequence. This initiates the Embedded Erase algorithm—an internal algorithm that automatically pre-
CC
programs the array (if it is not already progra mmed) be­fore executing the erase operation. During erase, the device automatically tim es the erase pulse widths and verifies proper cell margin.
The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command.
The sector erase ar chitecture allo ws memo ry secto rs to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory.
Hardware data protection meas ures include a low
detector that automatically in hibits write opera-
V
CC
tions during power transitions. The hardware sector protection feature disables both program and erase
operations in any combination of the sectors of mem­ory. This can be achieved in-system or via program­ming equipment.
The Erase Suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. True background erase can thus be achieved.
The hardware RESET# pi n terminates any operation in progress and resets the internal state machine to reading array dat a. The RESET# pin ma y be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory.
The device offers two power-saving features. When addresses have been stable for a specified amount of time, the device enters the automatic sleep m ode. The system can also place the de vice into the standby mode. Power consumption is greatly reduced in both these modes.
AMD’s Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effective­ness. The device electrically erases all b its wit hin a sector simultaneously via Fowler-Nordheim tun­neling. The data is programmed using hot electron injection.
1/29/98 Am29LV400B 2
ADVANCE INFORMATION
PRODUCT SELECTOR GUIDE
Family Part Number Am29LV400B
Speed Options
Max access time, ns (t Max CE# access time, ns (tCE) 70 80 90 120 Max OE# access time, ns (tOE) 30 30 35 50
Regulated Voltage Range: VCC =3.0–3.6 V 70R
Full Voltage Range: VCC = 2.7–3.6 V 80 90 120
) 70 80 90 120
ACC
Note: See “AC Characteristics” for full specifications.
BLOCK DIAGRAM
DQ0
DQ15 (A-1)
Input/Output
Buffers
Data
Latch
V
CC
V
SS
RESET#
WE#
BYTE#
CE#
OE#
RY/BY#
State
Control
Command
Register
PGM Voltage
Generator
Sector Switches
Erase Voltage
Generator
Chip Enable
Output Enable
Logic
STB
A0–A17
VCC Detector
Timer
STB
Address Latch
Y-Decoder
X-Decoder
Y-Gating
Cell Matrix
21523A-1
3 Am29LV400B
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