AMD Advanced Micro Devices AM29LV008BB-70REIB, AM29LV008BB-70REI, AM29LV008BB-70REEB, AM29LV008BB-70REE, AM29LV008BB-70REC Datasheet

...

PRELIMINARY

Am29LV008B

8 Megabit (1 M x 8-Bit) CMOS 3.0 Volt-onl y Boot Sector Flash Memory

DISTINCTIVE CHARACTERISTICS

■ Single power supply operation

— Full voltage range: 2.7 to 3. 6 volt read and write

operations for battery-powered applications

— Regulated voltage range: 3.0 to 3. 6 volt read

and write operations and for compatibility with high performance 3.3 volt microprocessors

■ Manufactured on 0.35 µm process technology

— Compatible with 0.5 µm Am29LV008 device

■ High performance

— Full voltage range: ac cess times as f ast as 80 ns — Regulated voltage range: access times as fast

as 70 ns

■ Ultra low power consumption (typical values at

5 MHz)

— 200 nA Automatic Sleep mode current — 200 nA standby mode current — 7 mA read current — 15 mA program/erase current

■ Flexible sector architecture

— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and

fifteen 64 Kbyte sectors — Supports full chip erase — Sector Protection features:

A hardware method of locking a sector to

prevent any program or erase operations within

that sector

Sectors can be locked in-system or via

programming equipment

T emporary Sector Unprotect feat ure allows code

changes in previously locked sectors

■ Unlock Bypass Program Command

— Reduces overall programming time when

issuing multiple program command sequences

■ Top or bottom boot block configurations

available

■ Embedded Al gorithms

— Embedded Erase algorithm automatically

preprograms and erases the entire chip or any combination of designated sectors

— Embedded Program algorithm automatically

writes and verifies data at specified addresses

■ Minimum 1,000,000 write cycle guarantee per

sector

■ Package option

— 40-pin TSOP

■ Compatibility with JEDEC standards

— Pinout and software compatible with single-

power supply Flash

— Superior inadvertent write protection

■ Data# Polling and toggle bits

— Provides a software method of detecting

program or erase operation completion

■ Ready/Busy# pin (RY/BY#)

— Provides a hardware method of detecting

program or erase cycle completion

■ Erase Suspend/Erase Resume

— Suspends an erase operati on to read dat a from,

or program data to, a sector that is not being erased, then resumes the erase operation

■ Hardware reset pin (RESET#)

— Hardware method to reset the de vi ce to reading

array data

This document contains information on a product under development at Advanced Micro Devices. The information is intended to help you ev aluate this product. AMD reserves the right to change or dis continue work on thi s proposed product without notice.

Refer to AMD’s Website (www.amd.com) for the latest information.

Publication# 21524 Rev: B Amendment/+1 Issue Date: March 1998

PRELIMINARY

GENERAL DESCRIPTION

The Am29LV008B is an 8 Mbit, 3.0 volt-only Flash memory organized as 1,048,576 bytes. The device is offered in a 40-pin TSOP package. The byte-wide (x8)

data appears on DQ7–DQ0. This device requires only a single, 3.0 volt V and erase operations. A stand ard EPROM programmer can also be used to program and erase the device.

This device is manufactured using AMD’s 0.35 µm process technology, and offers all the features and benefits of the Am29LV008, which was manufactured using 0.5 µm process technology. In addition, the Am29LV008B features unlock bypass programming and in-system sector protection/unprotection.

The standard device offers access times of 70, 80, 90, and 120 ns, allowing high speed microprocessors to operate without wait s tates. To eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls.

The device requires only a single 3. 0 v o lt po wer sup- ply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations.

The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the command regis ter using standard micropr ocessor wri te timings. Register co ntents serve as input to an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices.

Device programming occurs by executing the program command sequence. This initiates the Embedded Program algorithm—an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. The Unlock Bypass mode facilitates faster programming times by requir ing only two write cycles to program data instead of four.

Device erasure occurs by ex ecuting the erase command sequence. This initiates the Embedded Erase algorithm—an i nternal algorithm that autom atically prepro grams the array (if it is not already programmed) before

supply to perform read, program,

executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin.

The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command.

The sector erase ar chitecture allo ws memo ry secto rs to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory.

Hardware data protection measures include a low

detector that automatically in hibits write opera-

tions during power transitions. The hardware sector protection feature disables both program and erase

operations in any combination of the sectors of memory. This can be achieved in-system or via programming equipment.

The Erase Suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. True background erase can thus be achieved.

The hardware RESET# pi n terminates any operation in progress and resets the internal state machine to reading array dat a. The RESET# pin ma y be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory.

The device offers two power-saving features. When addresses have been stable for a specified amount of time, the device enters the automatic sleep m ode. The system can also place the de vice into the standby mode. Power consumption is greatly reduced in both these modes.

AMD’s Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effectiveness. The device electrically erases a ll bit s within a sector simultaneously via Fowler-Nordheim tunneling. The data is programmed using hot electron injection.

2 Am29LV008B

PRELIMINARY

PRODUCT SELECTOR GUIDE

Family Part Number Am29LV008B

Speed Options

Max access time, ns (t Max CE# access time, ns (tCE) 70 80 90 120 Max OE# access time, ns (tOE) 30 30 35 50

Regulated Voltage Range: VCC =3.0–3.6 V -70R

Full Voltage Range: VCC = 2.7–3.6 V -80 -90 -120

) 70 80 90 120

ACC

Note: See “AC Characte r ist ics ” for full specifications.

BLOCK DIAGRAM

DQ0

DQ7

–

Input/Output

Buffers

Data

Latch

RESET#

WE#

CE#

OE#

RY/BY#

State

Control

Command

PGM Voltage

Generator

Sector Switches

Erase Voltage

Generator

Chip Enable

Output Enable

Logic

STB

A0–A19

VCC Detector

Timer

STB

Address Latch

Y-Decoder

X-Decoder

Y-Gating

Cell Matrix

21524B-1

Am29LV008B 3

CONNECTION DIAGRAMS

PRELIMINARY

A16 A15 A14 A13 A12 A11

A9 A8

WE#

RESET#

RY/BY#

A18

A7 A6 A5 A4 A3 A2 A1

A17 V

NC A19 A10

DQ7 DQ6 DQ5 DQ4

DQ3 DQ2 DQ1 DQ0

CE#

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Standard TSOP

Reverse TSOP

40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21

A17 V

NC A19 A10 DQ7 DQ6 DQ5 DQ4 V

NC DQ3 DQ2 DQ1 DQ0 OE#

CE# A0

A16 A15 A14 A13 A12 A11 A9 A8 WE# RESET# NC RY/BY# A18 A7 A6 A5 A4 A3 A2 A1

4 Am29LV008B

21524B-2

PRELIMINARY

PIN CONFIGURATION

A0–A19 = 20 addresses DQ0–DQ7 = 8 data inputs/outputs CE# = Chip enable OE# = Output enable WE# = Write enable RESET# = Hardware reset pin, active low RY/BY# = Ready/Busy# output

= 3.0 volt-only single power supply

NC = Pin not connected internally

(see Product Selector Guide for speed options and voltage supply toleranc es)

= Device ground

LOGIC SYMBOL

A0–A19

CE# OE#

WE# RESET#

DQ0–DQ7

RY/BY#

21524B-3

Am29LV008B 5

PRELIMINARY

ORDERING INFORMATION Standard Pr od ucts

AMD standard products are available in s everal packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below.

CE-70RAm29LV008B T

OPTIONAL PROCESSING

Blank = Standard Processing B = Burn-in (Contact an AMD representative for more information)

TEMPERATURE RANGE

C=Commercial (0°C to +70°C) I = Industrial (–40°C to +85°C) E = Extended (–55°C to +125°C)

PACKAGE TYPE

E = 40-Pin Thin Small Outline Package (TSOP)

Standard Pinout (TS 040)

F = 40-Pin Thin Small Outline Package (TSOP)

Reverse Pinout (TSR040)

Am29LV008BT-70R, Am29LV008BB-70R

Am29LV008BT-80, Am29LV008BB-80

Am29LV008BT-90, Am29LV008BB-90

Am29LV008BT-120, Am29LV008BB-120

Valid Combinations

EC, EI, FC, FI

EC, EI, EE, FC, FI, FE

SPEED OPTION

See Product Selector Guide and Valid Combinations

BOOT CODE SECTOR ARCHITECTURE

T = Top Sector B = Bottom Sector

DEVICE NUMBER/DESCRIPTION

Am29LV008B 8 Megabit (1 M x 8-Bit) CMOS Flash Memory

3.0 Volt-only Read, Program, and Erase

Valid Combinations

Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations.

6 Am29LV008B

PRELIMINARY

DEVICE BUS OPERATIONS

This section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command register itself does not occupy any addressable memory loc ation. The register is composed of latches that store the commands, along with the address and data information needed to execute the command. The contents of the

Table 1. Am29LV008B Device Bus Operations

Operation CE# OE# WE# RESET# Addresses (Note 1) DQ0–DQ7

Read L L H H A Write L H L H A

Standby Output Disable L H H H X High-Z

Reset X X X L X High-Z Sector Protect (Note 2) L H L V

Sector Unprotect (Note 2) L H L V Temporary Sector Unprotect X X X V

Legend:

L = Logic Low = V

Notes:

1. Addresses are A19–A0.

2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector Protection/Unprotection” section.

, H = Logic High = VIH, VID = 12.0 ± 0.5 V, X = Don’t Care, AIN = Address In, DIN = Data In, D

VCC ±

0.3 V

register serve as inputs to the internal state machine. The state machine outputs d ictate the function of the device. Table 1 lists the device bus operations, the inputs and control lev els t he y requ ire , and t he resulting output. The following subsections describe each of these operations in further detail.

, D

= Data Out

OUT

VCC ±

0.3 V

IN IN

X High-Z

Sector Address, A6 = L,

A1 = H, A0 = L

Sector Address, A6 = H,

A1 = H, A0 = L

Requirements for Reading Array Data

To read array data from the outputs, the system must drive the CE# and OE# pins to V control and selects the device. OE# is the output control and gates array data to the output pins. WE# should remain at V

The internal state machine is set for reading arr ay data upon device power-up, or after a hardware reset. This ensures that no spurious alteration of the mem ory content occurs during the power transition. No command is neces sary in this mode to obtain ar ray data. Standard microprocessor read cycles that assert valid addresses on the device address inputs produce valid data on the device data outputs. The device remains enabled for read access until the command register contents are altered.

See “Reading Array Data” for more information. Refer to the AC Read Operations table fo r timing specifications and to Figure 13 for the timing waveforms. I the DC Characteristics table represents the active current specification for reading array data.

. CE# is the power

CC1

Writing Commands/Command Sequences

To write a command or command sequence (which includes programming data to the device and erasing sectors of memory), the system must drive WE# and CE# to V

The Am29LV008B is manufactured on AMD’s new 0.35 µm process technol ogy and offers an Unlock Bypass mode to facilitate faster programming. Once the device enters the Unlock Bypass mode, only two write cycles are required to program a byte, instead of four. Devices manufactured on AMD’s 0.5 µm process technology require a four-bus-cycle command sequence for each byte programmed. The “Byte Program Command Sequence” section has details on programm ing data to the device using both standard and U nlock Bypass command sequences.

An erase operation can erase one sect or, multiple sectors, or the entire device. Tables 2 and 3 indicate the address space that each sector occupies. A “sector address” consists of the address bits required to uniquely select a sector. The “Command Definitions”

, and OE# to VIH.

Am29LV008B 7

PRELIMINARY

section has details on erasing a sector or the entire chip, or suspending/resuming the erase operation.

After the system writes the autoselect command sequence, the devi ce enters the autoselect mode. The system can then read autoselect codes from the internal register (which is separate from the memory

array) on DQ7–DQ0. Standard read cycle timings apply in this mode. Refer to the Autoselect Mode and Autoselect Command Sequence sections for more information.

in the DC Characteristics table represents the

CC2

active current specification for the write mode. The “A C Characteristics” section contains timing specification tables and timing diagrams for w r ite operations.

Program and Erase Operation Status

During an erase or program operation, the system ma y check the status of the operation by reading the status bits on DQ7–DQ0. Standard read cycle timings and I

read specifications apply. Refer to “Write Operation Status” for more information, and to “AC Characteristics” for timing diagrams.

Standby Mode

When the system is not reading or writing to the device , it can place the device in the standby mode. In this mode, current consumption is great ly reduc ed, and the outputs are placed in the high impedance state, independent of the OE# input.

The device enters the CMOS standby mode when the CE# and RESET# pin s are both held at V

± 0.3 V.

(Note that this is a more restricted voltage range than

.) If CE# and RESET# ar e held a t VIH, but not within

± 0.3 V, the device will be in the standb y mode, b ut

the standby current will be greater. The device requires standard access time (t

) for read access when the

device is in either of these standby modes, before it is ready to read data.

If the device is deselected during erasure or programming, the device draws active current until the operation is completed.

In the DC Characteristics table, I

CC3

and I

CC4

repre-

sents the standby current s pecification.

Automatic Sleep Mode

The automatic sleep mode minimizes Flash device energy consumption. The device automatically

enables this mode when addres ses remain stable for t

+ 30 ns. The automatic sleep mode is inde-

ACC

pendent of the CE#, WE#, and OE# control signals. Standard address access timings provide new data when addresses are changed. While in sleep mode, output data is latched and always available to the system. I

in the DC Characteristics table represents

CC5

the automatic sleep mode current specification.

RESET#: Hardware Reset Pin

The RESET# pin provides a hardw are method of resetting the device to reading array data. When the RESET# pin is driven low for at least a period of t

, the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity.

Current is reduced for the duration of the RESET# pulse. When RESET# is held at V draws CMOS standby c urrent (I

but not within VSS±0.3 V, the standby current will

at V

±0.3 V, the device

). If RESET# is held

CC4

be greater. The RESET# pin may be tied to the system reset cir-

cuitry. A system reset would thus also reset the Flash memory, enabling the system to read the boot-up firmware from the Flash memory.

If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the internal reset operation is complete, which requires a time of t

(during Embedded Algorithms). The

READY

system can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is asserted when a program or erase operation is not executing (RY/BY# pin is “1”), the reset operation is completed within a time of t rithms). The system can read data t RESET# pin returns to V

(not during Embe dded Algo-

READY

after the

Refer to the AC Characteristics tables for RESET# parameters and to Figure 14 for the timing diagram.

Output Disable Mode

When the OE# input is at VIH, output from the device is disabled. The output pins are placed in t he high impedance state.

8 Am29LV008B

PRELIMINARY

Table 2. Am29LV008BT Top Boot Block Sector Address Table

Sector Size

Sector A19 A18 A17 A16 A15 A14 A13

SA00000XXX 64 00000h–0FFFFh SA10001XXX 64 10000h–1FFFFh SA20010XXX 64 20000h–2FFFFh SA30011XXX 64 30000h–3FFFFh SA40100XXX 64 40000h–4FFFFh SA50101XXX 64 50000h–5FFFFh SA60110XXX 64 60000h–6FFFFh SA70111XXX 64 70000h–7FFFFh SA81000XXX 64 80000h–8FFFFh

SA91001XXX 64 90000h–9FFFFh SA101010XXX 64 A0000h–AFFFFh SA111011XXX 64 B0000h–BFFFFh SA121100XXX 64 C0000h–CFFFFh SA131101XXX 64 D0000h–DFFFFh SA141110XXX 64 E0000h–EFFFFh SA1511110XX 32 F0000h–F7FFFh SA161111100 8 F8000h–F9FFFh SA171111101 8 FA000h–FBFFFh SA18111111X 16 FC000h–FFFFFh

(Kbytes)

Address Range

(in hexadecimal)

Table 3. Am29LV008BB Bottom Boot Block Sector Address Table

Sector Size

Sector A19 A18 A17 A16 A15 A14 A13

SA0000000X 16 00000h-03FFFh

SA10000010 8 04000h-05FFFh

SA20000011 8 06000h-07FFFh

SA300001XX 32 08000h-0FFFFh

SA40001XXX 64 10000h-1FFFFh

SA50010XXX 64 20000h-2FFFFh

SA60011XXX 64 30000h-3FFFFh

SA70100XXX 64 40000h-4FFFFh

SA80101XXX 64 50000h-5FFFFh

SA90110XXX 64 60000h-6FFFFh SA100111XXX 64 70000h-7FFFFh SA111000XXX 64 80000h-8FFFFh SA121001XXX 64 90000h-9FFFFh SA131010XXX 64 A0000h-AFFFFh SA141011XXX 64 B0000h-BFFFFh SA151100XXX 64 C0000h-CFFFFh SA161101XXX 64 D0000h-DFFFFh SA171110XXX 64 E0000h-EFFFFh SA181111XXX 64 F0000h-FFFFFh

(Kbytes)

Address Range

(in hexadecimal)

Am29LV008B 9

PRELIMINARY

Autoselect Mode

The autoselect mode provides manufacturer and device identification, and sector protection ver ification,

through identifier codes output on DQ7–DQ0. This mode is primarily intended for progr amming equipment to automatically match a device to be progr ammed with its correspondi ng programming al gorithm. However, the autoselect codes can also be accessed in-system through the command register.

When using programming equipment, the autoselect mode requires V A9. Address pins A6, A1, and A0 must be as shown in

(11.5 V to 12.5 V) on address pin

Table 4. In addition, when verifying sector protec tion, the sector address must appear on the appropriate highest order address bits (see Tables 2 and 3). Table 4 shows the remaining address bits that are don’t care . When all necessary bits have been set as required, the programming equipment may then read the corresponding identifier code on DQ7–DQ0.

To access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in Table 5. This method does not require V details on using the autoselect mode.

Table 4. Am29LV008B Autoselect Codes (High Voltage Method)

A19

A12

Description CE# OE# WE#

Manufacturer ID: AMD L L H X X V Device ID: Am29LV0 08B T

(Top Boot Block) Device ID: Am29LV0 08B B

(Bottom Boot Block)

LLHXXV

LLHXXVIDXLXLH 37h

A13

A10 A9

. See “Command Definitions” for

A7 A6

XLXLL 01h

XLXLH 3Eh

A2 A1 A0

DQ7

DQ0

Sector Protection Verification L L H SA X V

L = Logic Low = VIL, H = Logic High = VIH, SA = Sector Address, X = Don’t care.

Sector Protection/Unprotection

The hardware sector protection feature disables both program and erase operations in any sect or. The hardware sector unprotection feature re-enables both program and erase operations in previously protected sectors.

The device is shipped with all s ectors unprotected. AMD offers the option of programming and protecting sectors at its factory prior to shipping the device

through AMD’s ExpressFlash™ Servic e. Contact an AMD representative for details.

It is possible to determine whether a sector is protected or unprotected. See “Autoselect Mode” for details.

Sector protection/unprotection can be implemented via

The primary method requires V only, and c an be implemented either in-system or via programming equipment. Figure 2 shows the algorithms and Figure 21 shows the waveform. This method uses standard microprocessor bus cycle timing. For sector unprotect, all unprotected sectors must first be protected prior to th e first s ector unprotec t write cycle.

The alternate method intended o nly for programming equipment requires V This method is compatible with programmer routines written for earlie r 3.0 volt-only AMD flash devices. Details on this method are provided in a supplement, publication number 20875. Contact an AMD representative to request a cop y.

two methods.

XLXHL

on the RESET# pin

on address pin A9 and OE#.

01h

(protected)

00h

(unprotected)

10 Am29LV008B

PRELIMINARY

Temporary Sector

Unprotect Mode

Increment

PLSCNT

START

PLSCNT = 1

RESET# = V

Wait 1 µs

First Write

Cycle = 60h?

Yes

Set up sector

address

Sector Protect:

Write 60h to sector

address with

A6 = 0, A1 = 1,

A0 = 0

Wait 150 µs

Verify Sector

Protect: Write 40h

to sector address

with A6 = 0,

A1 = 1, A0 = 0

START

Protect all sectors:

The indicated portion

of the sector protect

Reset

PLSCNT = 1

algorithm must be

performed for all

unprotected sectors

prior to issuing the

first sector

unprotect address

PLSCNT = 1

RESET# = V

Wait 1 µs

First Write

Cycle = 60h?

All sectors protected?

Set up first sector

address

Sector Unprotect:

Write 60h to sector

address with

A6 = 1, A1 = 1,

A0 = 0

Wait 15 ms

Yes

Temporary Sector

Unprotect Mode

PLSCNT

= 25?

Yes

Device failed

Sector Protect

Algorithm

Read from

sector address

with A6 = 0,

A1 = 1, A0 = 0

Data = 01h?

Protect another

sector?

Remove V

from RESET#

Write reset

command

Sector Protect

complete

Yes

Verify Sector

Unprotect: Write

40h to sector

Increment

PLSCNT

Yes

PLSCNT

= 1000?

Yes

Device failed

Sector Unprotect

address with

A6 = 1, A1 = 1,

A0 = 0

Read from

sector address

with A6 = 1,

A1 = 1, A0 = 0

Data = 00h?

Last sector

verified?

Remove V

from RESET#

Yes

Set up

next sector

address

Algorithm

Write reset

command

Sector Unprotect

complete

Figure 1. In-System Sector Protect/Unprotect Algorithms

Am29LV008B 11

21524B-4

PRELIMINARY

Temporary Sector Unprotect

This feature allows temporary unpr otection of previously protected sectors to change data in-system. The Sector Unprotect mode is activated by setting the RESET# pin to V

Notes:

1. All protected sectors unprotected.

2. All previously protected sectors are protected once again.

. During this mode, formerly protected

START

RESET# = V

(Note 1)

Perform Erase or

Program Operations

RESET# = V

Temporary Sector

Unprotect Completed

(Note 2)

21524B-5

sectors can be programmed or erased b y selecting the sector addresses. Once V

is removed from the RE-

SET# pin, all the previously protected sectors are protected again. Figure 2 shows the algorithm, and Figure 20 shows the tim ing diagrams, for this feature.

against inadverten t writes (refer to Table 5 for command definitions). In addition, the following hardwar e data protection mea sures prevent accidental erasure or programming, which might otherwise be caused by spurious system level signals during V

power-up

and power-down transitions, or from system noise.

Low V

When V cept any write cycles. This protects data during V

Write Inhibit

is less than V

, the device does not ac-

LKO

power-up and power-down. The command register and all internal program/erase circuits are disabled, and the device resets. Subsequent writes are ignored until V is greater than V

. The system must provide the

LKO

proper signals to the control pins to prevent unintentional writes when V

is greater than V

LKO

Write Pulse “Glitch” Protection

Noise pulses of less than 5 ns (typical) on OE#, CE# or WE# do not initiate a write cycle.

Logical Inhibit

Write cycles are inhibited by holding any one of OE# =

, CE# = VIH or WE# = VIH. To initiate a write cycle,

CE# and WE# must be a logical zero while OE# is a logical one.

Figure 2. Temporary Sector Unprotect Operation

Hardware Data Protection

The command sequence requirement of unlock cycles for programming or erasing provides data protection

COMMAND DEFINITIONS

Writing specific address and data commands or sequences into the command register initiates device operations. Table 5 defin es the v al i d regist er command sequences. Writing incorrect address and data values or writing them in the improper sequence resets the device to reading array data.

All addresses are latched on the falling edge of WE# or CE#, whichever happens later. All data is latched on the rising edge of WE# or CE#, whichever happens first. Refer to the appropriate timing diagrams in the

“AC Characteristics” section.

Reading Array Data

The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device is also ready to read array

Power-Up Write Inhibit

If WE# = CE# = V

and OE# = VIH during power up , the

device does not accept commands on the rising edge of WE#. The internal state mac hine is automatically reset to reading array data on power-up.

data after comp leting an Embedded Program o r Embedded Erase algorithm.

After the device accepts an Era se Suspend command, the device enters the Erase Suspend mode. The system can read array data using the standard read timings, except that if it reads at an address within erase-suspended sectors, the device outputs status data. After completing a program ming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See “Erase Suspend/Erase Resume Commands” for more information on this mode.

must

The system

issue the reset command to reenable the device for reading array data if DQ5 goes high, or while in the autoselect mode. See the “Reset Command” section, next.

12 Am29LV008B

+ 26 hidden pages