AMD Advanced Micro Devices AM29F400BT-90DWI1, AM29F400BT-90DWE1, AM29F400BT-90DWC1, AM29F400BT-90DTI1, AM29F400BT-90DPI1 Datasheet
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SUPPLEMENT
Am29F400B Known Good Die
4 Megabit (512 K x 8-Bit/256 K x 16-Bit)
CMOS 5.0 Volt-only, Boot Sector Flash Memory—Die Revision 1
DISTINCTIVE CHARACTERISTICS
■ Single power supply operation
— 5.0 volt-only operation for read, erase, and
program operations
— Minimizes system level requirements
■ Manufactured on 0.35 µm process technology
— Compatible with 0.5 µm Am29F400 device
■ High performance
— Acess time as fast as 70 ns
■ Low power consumption (typical values at 5
MHz)
— 1 µA standby mode current
— 20 mA read current (byte mode)
— 28 mA read current (word mode)
— 30 mA program/erase current
■ Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
seven 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and
seven 32 Kword sectors (word mode)
— Supports full chip erase
— Sector Protection features:
A hardware method of locking a sector to
prevent any program or erase operations within
that sector
Sectors can be locked via programming
equipment
T emporary Sector Unprotect feat ure allows code
changes in previously locked sectors
■ Top or bottom boot block configurations
available
■ Embedded Al gorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
■ Minimum 1,000,000 write cycle per sector
guaranteed
■ Compatibility with JEDEC standards
— Pinout and software compatible with single-
power-supply Flash
— Superior inadvertent write protection
■ Data# Polling and toggle bits
— Provides a software method of detecting
program or erase operation completion
■ Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting
program or erase cycle completion
■ Erase Suspend/Erase Resume
— Suspends an erase operati on to read dat a from,
or program data to, a sector that is not being
erased, then resumes the erase operation
■ Hardware reset pin (RESET#)
— Hardware method to reset the de vice t o reading
array data
Publication# 21258 Rev: B Amendment/+1
Issue Date: April 1998
SUPPLEMENT
GENERAL DESCRIPTION
The Am29F400B in Known Good Die (KGD) form is a
4 Mbit, 5.0 volt-only Flash memory. AMD defines KGD
as standard product in die form, tested for functionality
and speed. AMD KGD products have the same reliability and quality as AMD products in packaged form.
Am29F400B Features
The Am29F400B is a 4 M bit, 5.0 volt-only Flash
memory organized as 524,288 bytes or 262,144 words.
The word-wide data (x16) appears on DQ15–DQ0; the
byte-wide (x8) data appears on DQ7–DQ0. This device
is designed to be programmed in-system with the
standard system 5.0 volt V
not required for write or erase operations. The device
can also be programmed i n standard EPROM programmers.
This device is manufactured using AMD’s 0.35 µm
process technology, and offers all the f eatures and benefits of the Am29F400, which was manufactured using
0.5 µm process technology.
To eliminate bus contention the device has separate
chip enable (CE#), write enable (WE#) and output
enable (OE#) controls.
The device requires only a single 5. 0 v o lt po wer sup-
ply for both read and write functions. Internally generated and regulated voltages are provided for the
program and erase operations.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard. Commands are written to the command regis ter using
standard micropr ocessor wri te timings. Register co ntents serve as input to an internal state-machine that
controls the erase and programming circuitry. Write
cycles also internally latch addresses and data needed
for the programming and erase operations. Reading
data out of the device is similar to reading from other
Flash or EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the Embedded
Program algorithm—an internal algorithm that automatically times the program pulse widths and verifies
proper cell margin.
Device erasure occurs by executing the erase co mmand sequence. This initiates the Embedded Erase
algorithm—an inter nal algorithm that automatically
supply. A 12.0 V VPP is
CC
preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase
pulse widths and verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by observing the RY/BY#
pin, or by reading the DQ7 (Data# Polling) and DQ6
(toggle) status bits. After a program or erase cycle has
been completed, the device is ready to read array data
or accept another command.
The sector erase archite cture allo ws m emory sect ors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection meas ures include a low
detector that automatically in hibits write opera-
V
CC
tions during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of memory . This can be achie v ed via prog ramming equipment.
The Erase Suspend feature enables the user to put
erase on hold for any period of time to read data from,
or program data to, any sector that is not selected for
erasure. True background erase can thus be achieved.
The hardware RESET# pi n terminates any operation
in progress and resets the internal state machine to
reading array dat a. The RESET# pin ma y be tied to the
system reset circuitry. A system reset would thus also
reset the device, enabling the system microprocessor
to read the boot-up firmware from the Flash memory.
The system can place the devi ce into the standb y mode.
Pow er cons umption is g reatly r educed in this mode .
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effectiveness.
The device electrically erases all b i ts wi thin a se c tor
simultaneously via Fowler-Nordheim tunneling. The
data is programmed using hot electron injection.
ELECTRICAL SPECIFICATIONS
Refer to the Am29F400B data sheet, document
number 21505, for full electrical s pecifications on the
Am29F400B in KGD form.
2 Am29F400B Known Good Die
SUPPLEMENT
PRODUCT SELECTOR GUIDE
Family Part Number Am29F400B KGD
= 5.0 V ± 5% -75
V
Speed Option
Max access time, ns (t
) 70 90 120
ACC
CC
= 5.0 V ± 10% -90 -120
V
CC
Max CE# access time, ns (tCE) 70 90 120
Max OE# access time, ns (tOE) 30 35 50
DIE PHOTOGRAPH DIE PAD LOCATIONS
Orientation relative
to leading edge of
tape and reel
Orientation relative
to top left corner of
Gel-Pak
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AMD logo location
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Am29F400B Known Good Die 3
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