AMD 1207 User Manual

Thermal Design Guide for

Socket F (1207) Processors

32800Publication # 3.00Revision:

August 2006Issue Date:

Advanced Micro Devices

The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. The information contained herein may be of a preliminary or advance nature and is subject to change without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

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Trademarks

AMD, the AMD Arrow logo, and combinat ions ther eo f, are trad em arks of Adva nced Mic ro Devi ces , Inc . Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

32800 Rev. 3.00 August 2006

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Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Chapter 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

1.1 Summary of Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Chapter 2 Processor Thermal Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

2.1 Processor Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

2.2 Socket Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-Box (PIB)

Thermal Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.1 Motherboard Component Height Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.2 Thermal Solution Design Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

3.3 Sample Heat Sinks and Attachment Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

3.3.1 Backplate Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

3.3.2 Retention Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Chapter 4 Thermal Design of Custom 1U-2P Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

4.1 Motherboard Component Height Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

4.2 Thermal Solution Design Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

4.3 Sample Heat Sinks and Attachment Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

4.3.1 Backplate Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

4.3.2 Spring Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

4.3.3 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

4.3.4 Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

4.3.5 Thermal Interface Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

Chapter 5 Thermal Design of Custom 2U-4P Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

5.1 Motherboard Component Height Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

5.2 Thermal Solution Design Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

5.3 Sample Heat Sinks and Attachment Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

5.3.1 Backplate Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

5.3.2 Spring Clip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

5.3.3 Retention Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

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5.3.4 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

5.3.5 Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

5.3.6 Thermal Interface Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for

Socket F (1207) Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Appendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the

Socket F (1207) Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45

Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the

Socket F (1207) Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on

Socket F (1207) Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61

4 Contents

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Thermal Design Guide for Socket F (1207) Processors

List of Figures

Figure 1. The 1207-Pin Socket. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Figure 2. Motherboard Component Height Restrictions for Platforms Using the

AMD PIB Thermal Solution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on

Socket F (1207) Processors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Figure 4. Motherboard Component Height Restrictions for Custom 1U-2P Systems. . . . . . . . . .21

Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems. . . . . . . . . . . . . . . . .24

Figure 6. High Performance Heat Sink for Custom 1U-2P Systems . . . . . . . . . . . . . . . . . . . . . . .25

Figure 7. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor

in 90 nm Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Figure 8. Motherboard Component-Height Restrictions for Custom 2U-4P Systems. . . . . . . . . .29

Figure 9. Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F

(1207) Processors32

Figure 10. High Performance Heat Sink for Custom 2U-4P Systems . . . . . . . . . . . . . . . . . . . . . . .34

Figure 11. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor

in 90 nm Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Figure 12. Socket F (1207) PIB Board Component Height Restrictions. . . . . . . . . . . . . . . . . . . . .38

Figure 13. Socket F (1207) PIB Mounting Holes, Contact Pads, and No-Routing Zone . . . . . . . .39

Figure 14. Socket F (1207) PIB Socket Outline and Socket Window. . . . . . . . . . . . . . . . . . . . . . .40

Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . . . .41

Figure 16. Socket F (1207) PIB Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . . . .42

Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out. . . . . . . . . . . . . . . . . . . . . . . . . . . .43

Figure 18. Socket F (1207) 1U-2P Board Component Height Restrictions. . . . . . . . . . . . . . . . . . .46

Figure 19. Socket F (1207) 1U-2P Mounting Holes, Contact Pads, and No-Routing Zone . . . . . .47

Figure 20. Socket F (1207) 1U-2P Socket Outline and Socket Window. . . . . . . . . . . . . . . . . . . . .48

Figure 21. Socket F (1207) 1U-2P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .49

Figure 22. Socket F (1207) 1U-2P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .50

Figure 23. Socket F (1207) 1U-2P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

Figure 24. Socket F (1207) 2U-4P Board Component Height Restrictions. . . . . . . . . . . . . . . . . . .54

Figure 25. Socket F (1207) 2U-4P Mounting Holes, Contact Pads, and No-Routing Zone . . . . . .55

List of Figures 5

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Figure 26. Socket F (1207) 2U-4P Socket Outline and Socket Window. . . . . . . . . . . . . . . . . . . . .56

Figure 27. Socket F (1207) 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57

Figure 28. Socket F (1207) 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58

Figure 29. Socket F (1207) 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59

Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61

Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . .62

6 List of Figures

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Thermal Design Guide for Socket F (1207) Processors

List of Tables

Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors. . . . . . . . . . . .13

Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207)

PIB processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Table 3. Components for the Processor Thermal Reference Design for the AMD PIB

Thermal Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Table 4. Thermal Solution Design Requirements for Custom 1U-2P Systems . . . . . . . . . . . . . .22

Table 5. Components for the Processor Thermal Reference Design for Custom

1U-2P Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

Table 6. Fin Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

Table 7. Thermal Solution Design Requirements for Custom 2U-4P Systems . . . . . . . . . . . . . .30

Table 8. Components for the Processor Thermal Reference Design for Custom

2U-4P Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

Table 9. Chemical Element of SK7 Spring Steel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

Table 10. Fin Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

List of Tables 7

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8 List of Tables

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Revision History

Thermal Design Guide for Socket F (1207) Processors

Date Revision

July 2006 3.00 Initial Public release.

Description

Revision History 9

Thermal Design Guide for Socket F (1207) Processors

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10 Revision History

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Thermal Design Guide for Socket F (1207) Processors

Chapter 1 Introduction

This document specifies performance requirements for the design of thermal and mechanical solutions for socket F (1207) processors, utilizing AMD 64-bit technology. Detailed drawings, descriptions, and design targets are provided to help manufacturers, vendors, and engineers meet the requirements for the socket F (1207) processors.

1.1 Summary of Requirements

To allow optimal reliability of a processor, the thermal and cooling solution dissipates heat from that processor operating at the thermal design power. This document specifies the required values for the thermal and mechanical parameters of systems based on socket F (1207) processors.

Chapter 1 Introduction 11

Thermal Design Guide for Socket F (1207) Processors

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12 Introduction Chapter 1

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Chapter 2 Processor Thermal Solutions

This chapter describes the thermal solutions for systems based on socket F (1207) processors.

2.1 Processor Specifications

The objective of thermal solutions is to maintain the processor temperature within specified limits. Thermal performance, physical mounting, acoustic noise, mass, reliability, and cost must be considered during the design of a thermal solution.

Table 1 lists the pertinent processor specifications for a thermal solution design for systems based on socket F (1207) processors.

Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors

Symbol Description

Case

CPU

Form

Factor

Maximum case temperature

Processor contact area

Processor form factor

Maximum

Value

67°C - 72°C Consult the processor data sheet for the

thermal requirements specific to the processor.

32.5 mm x

32.5 mm LGA LGA form factor for socket F (1207)

Interfaces with heat sink

processors

Notes

Chapter 2 Processor Thermal Solutions 13

Thermal Design Guide for Socket F (1207) Processors

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2.2 Socket Description

Figure 1 shows a three-dimensional view of the 1207-pin socket used with socket F (1207) processors. This socket is based on LGA (land-grid array) technology . The LGA socket has 35 pads x 35 pads on a 1.1 mm pitch, with a 3.52 mm wide de-populated BGA (ball grid array) zone in the center, plus a 0.66 mm offset between the two BGA arrays. A small solder-ball makes the electrical and mechanical connection to the motherboard at each socket contact.

Figure 1. The 1207-Pin Socket

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Chapter 3 Thermal Design of Platforms Using

the AMD Processor-In-a-Box (PIB) Thermal Solution

This chapter describes the motherboard component height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for platforms using the AMD Processor-Ina-Box (PIB) thermal solution for socket F (1207) processors.

3.1 Motherboard Component Height Restrictions

The mounting solution for the heat sink calls for a standard motherboard keep-out region and mounting holes for the processor. Figure 2 shows an overview of the motherboard component height restrictions for platforms using the PIB thermal solution for socket F (1207) processors.

Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB

Thermal Solution

Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-

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Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 2 on page 15. This space permits heat sink designs with better thermal performance.

Appendix A on page 37 shows a complete, detailed set of keep-out drawings for the AMD PIB thermal solution for socket F (1207).

3.2 Thermal Solution Design Requirements

T able 2 provides the design-target specifications that must be met for the processor to operate reliably in a typical platform using the AMD PIB thermal solution for socket F (1207) processors.

Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB

processors

Symbol Description Maximum

L Length of heat sink 68 mm

W Width of heat sink 77 mm

H Height of heat sink 60 mm

clip

Notes:

1. This is the thermal resistance required for dual-core, 90-nm socket F (1207) processors. The thermal resistance requirement may vary depending on the product OPN. The user should consult the processor data sheet for the thermal requirements specific to the part.

2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied directly to the chassis for reliable shock and vibration performance.

Case-to-ambient thermal

resistance

Mass of heat sink

Clip force 75 lbs ±15 lbs

Local ambient temperature near

processor

0.26°C/W

450 g to 700 g

38°C

3.3 Sample Heat Sinks and Attachment Methods

The heat sink, fan, mounting spring clip, and thermal interface material used for the AMD PIB thermal solution for socket F (1207) processors are the same as the heat sink, fan, mounting spring clip, and thermal interface material used for systems based on the socket 940 processor.

The backplate and retention frame are different from those used in the socket 940 processor. The EMC shield implemented in the socket 940-based systems is not recommended for AMD PIB thermal solutions for socket F (1207) processors.

16 Thermal Design of Platforms Using the AMD Processor-In-a-

Chapter 3

Box (PIB) Thermal Solution

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Table 3 lists the parts used in the thermal reference design for the AMD PIB thermal solution for socket F (1207) processors.

Table 3. Components for the Processor Thermal Reference Design for the AMD PIB

Thermal Solution

Part Description Material Quantity

Heat sink Copper with aluminum fins 1 Heatpipe Sintered-powder copper 2 Fan Plastic 1 Spring clip SK7 heat treated spring steel 1 Retention frame Lexan, 20% glass-filled 2 Backplate Low-carbon steel, anti-corrosive

finish

Insulator Formex GK-17 1

Figure 3 on page 18 shows an exploded view of the thermal solution for platforms using an AMD PIB based on socket F (1207) processors.

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Thermal Design Guide for Socket F (1207) Processors

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Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on Socket F (1207)

Processors

3.3.1 Backplate Assembly

The backplate is mounted on the backside of the motherboard and enhances local stiffness to support shock and vibration loads acting on the heat sink. The backplate assembly prevents excessive motherboard warpage in the area near the processor. Without a backplate, excessive warpage could cause serious damage to electrical connections of the processor socket and integrated circuit packages surrounding the processor. The backplate also serves as a stiffener plate for the LGA socket.

The reference backplate is made from a 1/16-inch, hard-milled steel, has an overall thickness of 0.138 inch (3.5 mm), including stiffening ribs, and has a mounting-hole pitch of 3.5 inches. To accommodate the capacitors on the backside of the board, there is a square hole in the center of the backplate.

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Chapter 3

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Note: Do not cut entirely through the center rib. Doing so will compromise the stiffness of the

backplate.

The plate uses two PennEngineering (PEM) standoffs that serve multiple purposes. The PEM standoffs serve as attachment points for the retention frame screws. They also align the backplate properly to the motherboard. Features in the retention frame slide over the standoffs and allow the installation of the screws with a minimum chance of cross threading. Additionally, four M3.5 PEM standoffs in the backplate serve as attachment points for the socket.

The insulator prevents the backplate from electrically shorting to the motherboard. A pressuresensitive adhesive in the insulator keeps the backplate in place against the motherboard during assembly. The insulator also is thick enough to prevent any significant capacitive coupling between the motherboard and backplate.

3.3.2 Retention Frame

The plastic retention frame, made of 20% glass-filled Lexan, is a two-piece implementation rather than the single-piece frame used for socket 940. This change accommodates the larger foot-print of socket F (1207) processors.

The retention frame serves multiple purposes. The retention frame aligns the heat sink and provides a stop for the heat sink in large shock-force events. The retention frame and backplate are attached to the motherboard by the motherboard vendor. Two screws securely hold the backplate and retention frame together. The two mounting tabs on the retention frame serve as attachment points for the heat sink spring clip.

Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-

Box (PIB) Thermal Solution

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