Agilent HSDL-3220 IrDA Service Manual

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Description

The HSDL-3220 is a new
generation low profile high speed
infrared transceiver module that
provides interface between logic
and IR signals for through-air,
serial, half-duplex IR data-link.
The module is fully compliant to
IrDA Physical Layer specification
version 1.4 low power from

9.6kbit/s to 4.0 Mbit/s (FIR) and
is IEC825-Class 1 Eye Safe.

V

CX2

CC

CX4

CX1

V

(6)

IOV

SD (5)

RXD (4)

TXD (3)

LED C (2)

R1

V

led

Figure 1. Functional block diagram of HSDL-3220.

LED A (1)

CX3

CC

(7)

CC

HSDL-3220

TRANSMITTER

GND (8)

RECEIVER

Agilent HSDL-3220 IrDA

®

Data Compliant Low Power

4.0 Mbit/s Infrared Transceiver

Data Sheet

Features

•

Fully compliant to IrDA 1.4 physical
layer low power specification from

9.6 kbit/s to 4.0 Mbit/s (FIR)

• Miniature package
– Height: 2.5 mm
– Width: 8.0 mm
– Depth: 3.0 mm

• Typical link distance > 50 cm

Guaranteed temperature performance,

•

o

to 70oC

-25

•

The HSDL-3220 can be shutdown
completely to achieve very low
power consumption. In the
shutdown mode, the PIN diode
will be inactive and thus produc­ing very little photocurrent even
under very bright ambient light.
It is also designed to interface to
input/output logic circuits as low
as 1.8V. These features are ideal
for mobile devices that require
low power consumption.

SHIELD

Critical parameters are guaranteed over
temperature and supply voltage

• Low power consumption

Low shutdown current

–
– Complete shutdown of TXD, RXD,
and PIN diode

• Excellent EMI performance

• Vcc supply 2.7 to 3.6 Volts

• Interfacing with I/O logic circuits as
low as 1.8 V

• Lead-free package

• LED stuck-high protection

• Designed to accommodate light loss
with cosmetic windows

• IEC 825-class 1 eye safe

• Lead-free and RoHS Compliant

Applications

• Mobile telecom
– Mobile phones
– Smart phones
– Pagers

• Data communication
– Pocket PC handheld products

– Personal digital assistants
– Portable printers

• Digital imaging
– Digital cameras
– Photo-imaging printers

• Electronic wallet

• Small industrial & medical
instrumentation
– General data collection devices
– Patient & pharmaceutical data
collection devices

1

2

3

4

5

6

7

8

Figure 2. Rear view diagram with pinout.

Application Support Information

The Application Engineering
Group is available to assist you
with the application design

associated with the HSDL -3220
infrared transceiver module. You
can contact them through your
local sales representatives for
additional details.

Order Information

Part Number Packaging Type Package Quantity

HSDL-3220-021 Tape and Reel Front View 2500

HSDL-3220-001 Tape and Reel Front View 500

I/O Pins Configuration Table

Pin Symbol Description I/O Type Notes

1 LED A LED Anode I 1

2 LED C LED Cathode 2

3 TXD Transmit Data. Active High. I 3

4 RXD Receive Data. Active Low. O 4

5 SD Shutdown. Active High. I 5

6 Vcc Supply Voltage 6

7 IOVcc Input/Output ASIC Vcc 7

8 GND Ground 8

- Shield EMI Shield 9

Marking Information

The unit is marked with the
letter “G” and “YWWLL” on the

shield where:

Y is the last digit of the year
WW is the work week
LL is the lot information

Recommended Application Circuit Components

Component Recommended Value Notes

R1 5.6Ω ± 5%, 0.25 watt for 2.7 ≤ Vled <3.3V

10Ω ± 5%, 0.25 watt for 3.3 ≤ Vled <4.2V
15Ω ± 5%, 0.25 watt for 4.2 ≤ Vled < 5.5V

CX1, CX4 0.47 µF ± 20%, X7R Ceramic 10

CX2, CX3 6.8 µF ± 20%, Tantalum 11

Notes:

1. Tied through external series resistor, R1, to regulated Vled from 2.7 to 5.5V. Please refer to table
above for recommended series resistor value.

2. Internally connected to LED driver. Leave this pin unconnected.

3. This pin is used to transmit serial data when SD pin is low. If this pin is held high for longer than
50 µs, the LED is turned off. Do NOT float this pin.

4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull-down
resistor is required. The pin is in tri-state when the transceiver is in shutdown mode. The receiver
output echoes transmitted signal.

5. The transceiver is in shutdown mode if this pin is high for more than 400 µs. On falling edge of
this signal, the state of the TXD pin sampled and used to set receiver low bandwidth (TXD=low)
or high bandwidth (TXD=high) mode. Refer to the section ”Bandwidth selection timing” for
programming information. Do NOT float this pin.

6. Regulated, 2.7 to 3.6 Volts.

7. Connect to ASIC logic controller Vcc voltage or supply voltage. The voltage at this pin must be
equal to or less than supply voltage.

8. Connect to system ground.

9. Connect to system ground via a low inductance trace. For best performance, do not connect
directly to the transceiver pin GND.

10. CX1 must be placed within 0.7 cm of the HSDL-3220 to obtain optimum noise immunity.

11. In environments with noisy power supplies, including CX2, as shown in Figure 1, can enhance
supply ripple rejection performance.

2

Bandwidth Selection Timing

The transceiver is in default SIR/
MIR mode when powered on.
User needs to apply the following
programming sequence to both
the SD and TXD inputs to enable
the transceiver to operate at FIR
mode.

SD/MODE

t

S

50%

V

V

IH

SD/MODE

V

IL

t

H

t

S

50%

t

H

IH

V

IL

V

IH

50%50%TXD

V

IL

Figure 3. Bandwidth selection timing at SIR/MIR mode. Figure 4. Bandwidth selection timing at FIR mode.

Setting the transceiver to SIR/MIR
Mode (9.6 kbit/s to 1.152 Mbit/s)

1. Set SD/Mode input to logic
HIGH

2. TXD input should remain at
logic LOW

3. After waiting for t

≥ 25 ns, set

S

SD/Mode to logic LOW, the
HIGH to LOW negative edge
transition will determine the
receiver bandwidth

4. Ensure that TXD input re­mains low for tH ≥ 100 ns, the
receiver is now in SIR/MIR
mode

5. SD input pulse width for mode
selection should be > 50 ns.

Setting the transceiver to FIR
(4.0 Mbit/s) Mode

1. Set SD/Mode input to logic
HIGH

2. After SD/Mode input remains
HIGH at > 25 ns, set TXD input
to logic HIGH, wait tS ≥ 25 ns
(from 50% of TXD rising edge
till 50% of SD falling edge)

3. Then set SD/Mode to logic
LOW, the HIGH to LOW
negative edge transition will
determine the receiver band­width

4. After waiting for tH ≥ 100 ns,
set the TXD input to logic LOW

5. SD input pulse width mode
selection should be > 50 ns.

Transceiver I/O Truth Table

50%50%TXD

V

IL

Inputs Outputs

TXD Light Input to Receiver SD LED RXD Note

High Don’t Care Low On Not Valid

Low High Low Off Low 12,13

Low Low Low Off High

Don’t Care Don’t Care High Off High

Notes:

12. In-band IrDA signals and data rates ≤ 4.0 Mbit/s

13. RXD logic low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity.

3

CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions
be taken in handling and assembly of this component to prevent damage and/or degradation which may
be induced by ESD.

Absolute Maximum Ratings

For implementations where case to ambient thermal resistance is ≤50°C/W.

Parameter Symbol Min. Max. Units Conditions

Storage Temperature T

Operating Temperature T

LED Anode Voltage V

Supply Voltage V

Input Voltage: TXD, SD/Mode V

Output Voltage: RXD V

DC LED Transmit Current I

Average Transmit Current I

S

A

LEDA

CC

I

O

(DC) 50 mA

LED

(PK) 200 mA ≤90 µs pulse width

LED

-40 +100 °C

-25 +70 °C

0 6.5 V

0 6.5 V

0 6.5 V

0 6.5 V

≤25% duty cycle

Recommended Operating Conditions

Parameter Symbol Min. Typ. Max. Units Conditions

Supply Voltage V

CC

Input/Output Voltage IOVcc 1.8 Vcc V

Logic Input Voltage
for TXD, SD/Mode

Logic High V

Logic Low V

Logic High

IH

IL

E

IH, min

Receiver Input Irradiance 0.020 mW/cm

E

IH, max

Logic Low E

LED (Logic High) Current I
Pulse Amplitude

IL

LEDA

Receiver Data Rate 0.0096 4.0 Mbit/s

Note :

14. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 ≤ λp ≤ 900 nm, and the pulse characteristics are

compliant with the IrDA Serial Infrared Physical Layer Link Specification v1.4.

2.7 3.6 V

IOVcc – 0.5 IOV

cc

0 0.4 V

0.0081 mW/cm

500 mW/cm

0.3 µW/cm

150 mA

V

2

9.6kbit/s ≤ in-band signals
≤1.152 Mbit/s

2

1.152 Mbit/s < in-band signals

≤ 4.0 Mbit/s

2

9.6 kbit/s ≤ in-band signals
≤ 4.0 Mbit/s

2

For in-band signals

[14]

[14]

[14]

[14]

4

Electrical and Optical Specifications

Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted.
Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C, Vcc set to 3.0V
and IOVcc set to 1.8V unless otherwise noted.

Parameter Symbol Min. Typ. Max. Units Conditions

Receiver

Viewing Angle 2θ 30 °

Peak Sensitivity Wavelength λp 880 nm

RXD Output Voltage

Logic High V

Logic Low V

RXD Pulse Width (SIR)

RXD Pulse Width (MIR)

RXD Pulse Width (FIR)

[15]

[16]

[16]

tPW (SIR) 1 4.0 µs θ ≤ 15°, CL = 9 pF

tPW(MIR) 100 500 ns θ ≤ 15°, CL = 9 pF

tPW(FIR) 80 175 ns θ ≤ 15°, CL = 9 pF

RXD Rise and Fall Times tr, t

Receiver Latency Time

Receiver Wake Up Time

[17]

[18]

t

L

t

W

OH

OL

IOVCC – 0.2 IOV

0 0.4 V I

f

60 ns CL = 9 pF

VI

CC

= -200 µA, EI ≤ 0.3 µW/cm

OH

= 200 µA, EI ≥ 8.1 µW/cm

OL

25 50 µs

50 100 µs

2

2

Transmitter

Radiant Intensity IE

H

10 45 mW/sr I

= 150 mA, θ ≤ 15°, V

LEDA

V

≤ VIL, Ta=25°C

SD

TXD

≥ VIH,

Viewing Angle 2θ 30 60 °

Peak Wavelength λ

p

875 nm

Spectral Line Half Width ∆λ 35 nm

TXD Input Current

High I

Low I

LED ON Current I

H

L

LEDA

150 mA V

10 µAV

10 µA0 ≤ V

TXD Pulse Width (SIR) tPW (SIR) 1.5 1.6 1.8 µst

≥ V

TXD

IH

≤ V

TXD

IL

≥ VIH, R1=5.6ohm, Vled=3.0V

TXD

(TXD) = 1.6 µs at 115.2 kbit/s

PW

TXD Pulse Width (MIR) tPW(MIR) 148 217 260 ns tPW (TXD) = 217 ns at 1.152 Mbit/s

TXD Pulse Width (FIR) tPW(FIR) 115 125 135 ns tPW(TXD)=125 ns at 4.0 Mbit/s

Maximum Optical PW

TXD Rise and fall Time (Optical) t

[19]

t

PW(max.)

, t

r

f

50 100 µs

600 ns tPW(TXD) = 1.4 µs at 115.2 kbit/s
40 ns tPW (TXD) = 125 ns at 4.0 Mbit/s

LED Anode On-State Voltage V

ON(LEDA)

1.6 2.1 V I

=150 mA, V

LEDA

TXD≥VIH

Transceiver

Supply Current Shutdown I

Idle I

Notes:

15. For in-band signals from 9.6 kbit/s to 115.2 kbit/s, where 9 µW/cm

16. For in-band signals from 0.576 Mbit/s to 4.0 Mbit/s, where 22.5 µW/cm

17. Latency time is defined as the time from the last TxD light output pulse until the receiver has recovered full sensitivity.

18. Receiver wake up time is measured from Vcc power on or SD pin high to low transition to a valid RXD output.

19. The maximum optical PW is the maximum time the LED remains on when the TXD is constantly high. This is to prevent long turn on time of the LED
for eye safety protection.

CC1

CC2

0.1 1 µAV

≥ V

SD

1.8 3.0 mA VSD ≤ VIL, V

2

≤ EI ≤ 500 mW/cm2.

2

≤ EI ≤ 500 mW/cm2.

Ta= 25°C

IH,

TXD

≤ VIL, EI=0

5

t

t

V

OH

V

OL

90%

50%

10%

pw

LED ON

LED OFF

90%

50%

10%

pw

t

f

t

r

t

r

Figure 5. RxD output waveform. Figure 6. LED optical waveform.

SD

TXD

RX
LIGHT

LED

t

pw (MAX.)

RXD

t

RW

Figure 8. Receiver wakeup time waveform.Figure 7. TxD “Stuck On” protection waveform.

120

100

80

60

40

RADIANT INTENSITY (mW/sr)

20

(V)

LEDA

V

2.4

2.2

2.0

1.8

1.6

t

f

0

0.10 0.200.15 0.30 0.350.25

Figure 9. Radiant Intensity vs I

6

I

LEDA

(A)

LEDA

1.4

0.10 0.200.15 0.30 0.350.25

I

(A)

LEDA

.

Figure 10. V

LEDA

vs I

LEDA

.