Agilent HCPL-3180 User Guide

Functional Diagram

N/C

ANODE

CATHODE

N/C

1

2

3

4

SHIELD

V

8

CC

V

7

O

6

V

O

V

5

EE

Description

This family of devices consists of a
GaAsP LED. The LED is optically
coupled to an integrated circuit
with a power stage. These
optocouplers are ideally suited for

Agilent HCPL-3180

2.0 Amp Output Current
High Speed Gate Drive
Optocoupler

Data Sheet

Features

• 2.0 A minimum peak output current

• 250 kHz maximum switching speed

• High speed response:

• 10 kV/µs minimum Common Mode

• Under Voltage Lock-Out protection

• Wide operating temperature range:

• Wide VCC operating range:

• 20 ns typical pulse width distortion

high frequency driving of power
IGBTs and MOSFETs used in
Plasma Display Panels, high
performance DC/DC converters,
and motor control inverter
applications.

• Safety approvals:

200 ns maximum propagation delay
over temperature range

Rejection (CMR) at V

= 1500 V

CM

(UVLO) with hysteresis

–40°C to 100°C

10 V to 20 V

– UL approval, 3750 V

rms

for
1 minute
– CSA approval
– IEC/EN/DIN EN 60747-5-2
approval

Applications

• Plasma Display Panel (PDP)

• Distributed Power Architecture
(DPA)

• Switch Mode Rectifier (SMR)

• High performance DC/DC converter

• High performance Switching Power
Supply (SPS)

• High performance Uninterruptible
Power Supply (UPS)

• Isolated IGBT/Power MOSFET gate
drive

A 0.1 µF bypass capacitor must be connected between pins VCC and Ground.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to

prevent damage and/or degradation, which may be induced by ESD.

Ordering Information

Specify part number followed by option number (if desired).

Example:

HCPL-3180-XXXX

No option = Standard DIP package, 50 per tube.

300 = Gull Wing Surface Mount Option, 50 per tube.

500 = Tape and Reel Packaging Option, 1000 per reel.

Package Outline Drawings
HCPL-3180 Standard DIP Package

9.65 ± 0.25

(0.380 ± 0.010)

TYPE NUMBER

A XXXXZ

YYWW

1.19 (0.047) MAX.

060 = IEC/EN/DIN EN 60747-5-2, V

XXXE = Lead Free Option.

7.62 ± 0.25

5678

OPTION CODE*
DATE CODE

4321

1.78 (0.070) MAX.

(0.300 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

IORM

= 630 V

PEAK

.

2

3.56 ± 0.13

(0.140 ± 0.005)

1.080 ± 0.320

(0.043 ± 0.013)

4.70 (0.185) MAX.

2.92 (0.115) MIN.

0.65 (0.025) MAX.

2.54 ± 0.25

(0.100 ± 0.010)

0.51 (0.020) MIN.

+ 0.076

5° TYP.

DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS

"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

0.254

(0.010

- 0.051

+ 0.003)

- 0.002)

HCPL-3180 Gull Wing Surface Mount Option 300

9.65 ± 0.25

(0.380 ± 0.010)

6

7

8

5

LAND PATTERN RECOMMENDATION

1.016 (0.040)

1.19

(0.047)

MAX.

1.080 ± 0.320

(0.043 ± 0.013)

6.350 ± 0.25

(0.250 ± 0.010)

1

(0.100)

2.54
BSC

3

2

4

1.780

(0.070)

MAX.

3.56 ± 0.13

(0.140 ± 0.005)

(0.025 ± 0.005)

0.635 ± 0.130

DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

1.27 (0.050)

9.65 ± 0.25

(0.380 ± 0.010)

7.62 ± 0.25

(0.300 ± 0.010)

0.635 ± 0.25

(0.025 ± 0.010)

10.9 (0.430)

2.0 (0.080)

0.254

(0.010

12° NOM.

+ 0.076

- 0.051

+ 0.003)

- 0.002)

Solder Reflow Temperature Profile

300

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

200

160°C
150°C
140°C

3°C + 1°C/–0.5°C

100

TEMPERATURE (°C)

ROOM

TEMPERATURE

0

0

50 150100 200 250

2.5°C ± 0.5°C/SEC.

PREHEATING TIME
150°C, 90 + 30 SEC.

TIME (SECONDS)

PEAK

TEMP.

245°C

30

SEC.

SEC.

30

SOLDERING

TIME

200°C

50 SEC.

PEAK
TEMP.
240°C

PEAK

TEMP.

230°C

TIGHT
TYPICAL
LOOSE

3

Recommended Pb-Free IR Profile

T

p

217 °C

T

L

150 - 200 °C

T

smax

T

smin

TEMPERATURE

25

NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T

= 200 °C, T

smax

smin

260 +0/-5 °C

RAMP-UP

3 °C/SEC. MAX.

t

s

PREHEAT

60 to 180 SEC.

t 25 °C to PEAK

= 150 °C

TIME

TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE

t

p

20-40 SEC.

RAMP-DOWN
6 °C/SEC. MAX.

t

L

60 to 150 SEC.

Regulatory Information

The HCPL-3180 has been
approved by the following
organizations:

IEC/EN/DIN EN 60747-5-2

Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(Option 060 only)

UL

Approval under UL 1577,
component recognition program
up to V

= 3750 V

ISO

rms

. File

E55361.

CSA

Approval under CSA Component
Acceptance Notice #5, File CA

88324.

IEC/EN/DIN EN 60747-5-2 Insulation Characteristics (HCPL-3180 Option 060)

Description Symbol HCPL-3180 Unit

Installation classification per DIN EN 0110 1997-04
for rated mains voltage ≤ 150 V
for rated mains voltage ≤ 300 V
for rated mains voltage ≤ 600 V

rms
rms
rms

Climatic Classification 55/100/21
Pollution Degree (DIN EN 0110 1997-04) 2
Maximum Working Insulation Voltage V

IORM

Input to Output Test Voltage, Method b*
V

x 1.875=VPR, 100% Production Test with V

IORM

PR

tm=1 sec, Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*

V

x 1.5=VPR, Type and Sample Test, tm=60 sec, V

IORM

PR

Partial Discharge < 5 pC

Highest Allowable Overvoltage V
(Transient Overvoltage t

= 10 sec)

ini

IOTM

Safety-limiting values – maximum values allowed in the
event of a failure.
Case Temperature T
Input Current** I
Output Power** P

Insulation Resistance at TS, VIO = 500 V R

* Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section IEC/EN/DIN

EN 60747-5-2 for a detailed description of Method a and Method b partial discharge test profiles.

** Refer to the following figure for dependence of PS and IS on ambient temperature.

S

S,INPUT

S, OUTPUT

S

I - IV
I - III

I-II

630 V

1181 V

945 V

6000 V

175 °C
230 mA
600 mW

9

>10

peak

peak

peak

peak

Ω

4

800

S

700
600
500
400

, INPUT CURRENT – I

S

300
200

100

OUTPUT POWER – P

0

0

25

50 75 100

TS – CASE TEMPERATURE – °C

125

PS (mW)
IS (mA)

150 175

200

Insulation and Safety Related Specifications

Parameter Symbol HCPL-3180 Units Conditions

Minimum External Air Gap L(101) 7.1 mm Measured from input terminals to output
(Clearance) terminals, shortest distance through air.

Minimum External Tracking L(102) 7.4 mm Measured from input terminals to output
(Creepage) terminals, shortest distance path along body.

Minimum Internal Plastic Gap 0.08 mm Through insulation distance conductor to
(Internal Clearance) conductor, usually the straight line distance

thickness between the emitter and detector.

Tracking Resistance CTI >175 V DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking Index)

Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1)

Note: Option 300 – surface mount classification is Class A in accordance with CECC 00802.

Absolute Maximum Ratings

Parameter Symbol Min. Max. Units Note

Storage Temperature T
Junction Temperature T
Average Input Current I
Peak Transient Input Current I

S

J
F(AVG)
F(TRAN)

(<1 µs pulse width, 300 pps)
Reverse Input Voltage V
“High” Peak Output Current I
“Low” Peak Output Current I
Supply Voltage VCC-V
Output Voltage V
Output Power Dissipation P
Total Power Dissipation P

R
OH(PEAK)
OL(PEAK)

EE
O(PEAK)
O
T

Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile See Package Outline Drawings section

-55 125 °C

-40 125 °C
25 mA 1

1.0 A

5V

2.5 A 2

2.5 A 2

-0.5 25 V

0VCCV

250 mW 3
295 mW 4

5

Recommended Operating Conditions

Parameter Symbol Min. Max. Units Note

Power Supply VCC-V
Input Current (ON) I
Input Voltage (OFF) V
Operating Temperature T

F(ON)

F(OFF)

A

EE

10 20 V
10 16 mA

-3.0 0.8 V

-40 100 °C

Electrical Specifications (DC)

Over recommended operating conditions unless otherwise specified.

Test

Parameter Symbol Min. Typ. Max. Units Conditions Fig. Note

High Level Output Current I

OH

0.5 A VO = VCC- 4 2, 3, 17 5

2.0 A VO = VCC-10 2, 3, 17 2

Low Level Output Current I

OL

0.5 A VO = VEE+2.5 5, 6, 18 5

2.0 A VO = VEE+10 5, 6, 18 2
High Level Output Voltage V
Low Level Output Voltage V
High Level Supply Current I

OH
OL

CCH

VCC-4 V IO = -100 mA 1, 3, 19 6, 7

0.5 V IO = 100 mA 4, 6, 20

3.0 6.0 mA Output Open 7, 8
IF = 10 to 16 mA

Low Level Supply Current I

CCL

3.0 6.0 mA Output Open 7, 8
VF = 3.0 to 0.8 mA

Threshold Input Current I

FLH

8.0 mA

Low to High IO = 0 mA, 9, 15, 21
Threshold Input Voltage V

FHL

0.8 V VO > 5 V

High to Low
Input Forward Voltage V

F

Temperature Coefficient of DVF/DT

1.2 1.5 1.8 V IF = 10 mA 16

A

–1.6 mV/°CIF = 10 mA

Input Forward Voltage
UVLO Threshold V

UVLO+

V

UVLO–

UVLO Hysteresis UVLO
Input Reverse Breakdown BV

R

HYST

5VI

7.9 V IF = 10 mA,

7.4 V VO > 5 V 22, 33

0.5 V

= 10 µA

R

Voltage
Input Capacitance C

IN

60 pF f = 1 MHz,

VF = 0 V

6