Very High CMR, Wide V
Gate Optocouplers
Technical Data
Logic
CC
HCPL-2201 HCPL-2202
HCPL-2211 HCPL-2212
HCPL-2231 HCPL-2232
HCPL-0201 HCPL-0211
HCNW2201 HCNW2211
Features
• 10 kV/µs Minimum Common
Mode Rejection (CMR) at
VCM = 1000 V
(HCPL-2211/2212/0211/
2232, HCNW2211)
• Wide Operating VCC Range:
4.5 to 20 Volts
• 300 ns Propagation Delay
Guaranteed over the Full
Temperature Range
• 5 Mbd Typical Signal Rate
• Low Input Current (1.6 mA
to 1.8 mA)
• Hysteresis
• Totem Pole Output (No
Pullup Resistor Required)
• Available in 8-Pin DIP,
SOIC-8, Widebody Packages
• Guaranteed Performance
from -40°C to 85°C
• Safety Approval
UL Recognized -3750 V rms
for 1 minute (5000 V rms
for 1 minute for
HCNW22XX) per UL1577
CSA Approved
IEC/EN/DIN EN 60747-5-2
Approved with V
V peak (HCPL-2211/2212 Option
060 only) and V
V peak (HCNW22XX only)
IORM
IORM
= 630
= 1414
• MIL-PRF-38534 Hermetic
Version Available
(HCPL-52XX/62XX)
Applications
• Isolation of High Speed
Logic Systems
• Computer-Peripheral
Interfaces
• Microprocessor System
Interfaces
• Ground Loop Elimination
• Pulse Transformer
Replacement
• High Speed Line Receiver
• Power Control Systems
Functional Diagram
HCPL-2201/11
HCPL-0201/11
HCNW2201/11
NC
1
2
ANODE
CATHODE
ANODE 1
CATHODE 1
CATHODE 2
3
4
NC GND
SHIELD
HCPL-2231/32
1
2
3
Description
The HCPL-22XX, HCPL-02XX,
and HCNW22XX are opticallycoupled logic gates. The
HCPL-22XX, and HCPL-02XX
contain a GaAsP LED while the
HCNW22XX contains an AlGaAs
LED. The detectors have totem
pole output stages and optical
receiver input stages with built-in
Schmitt triggers to provide logiccompatible waveforms, eliminating the need for additional
waveshaping.
A superior internal shield on the
HCPL-2211/12, HCPL-0211,
HCPL-2202/12
8
V
CC
V
7
O
NC
6
5
8
V
CC
V
7
O1
V
6
O2
NC
1
2
ANODE
CATHODE
3
4
NC GND
SHIELD
TRUTH TABLE
(POSITIVE LOGIC)
LED
HIGH
ON
LOW
OFF
8
V
CC
7
NC
6
V
O
5
V
O
ANODE 2 GND
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
4
SHIELD
5
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component
to prevent damage and/or degradation which may be induced by ESD.
2
HCPL-2232 and HCNW2211
guarantees common mode
transient immunity of 10 kV/µs at
a common mode voltage of 1000
volts.
Selection Guide
The electrical and switching
characteristics of the HCPL22XX, HCPL-02XX and
HCNW22XX are guaranteed from
-40°C to +85°C and a VCC from
4.5 volts to 20 volts. Low IF and
wide VCC range allow compatibility with TTL, LSTTL, and CMOS
logic and result in lower power
consumption compared to other
high speed couplers. Logic signals
are transmitted with a typical
propagation delay of 150 ns.
Small- Widebody
Minimum CMR Input 8-Pin DIP (300 Mil) Outline SO-8 (400 Mil) Hermetic
On- Single Dual Single Single Single and
dV/dt Current Channel Channel Channel Channel Dual Channel
(V/µs) VCM (V) (mA) Package Package Package Package Packages
1,000 50 1.6 HCPL-2200
[1,2]
HCPL-0201 HCNW2201
HCPL-2201
HCPL-2202
1.8 HCPL-2231
2,500 400 1.6 HCPL-2219
5,000
[3]
300
[3]
1.6 HCPL-2211 HCPL-0211 HCNW2211
[1,2]
HCPL-2212
1.8 HCPL-2232
1,000 50 2.0 HCPL-52XX
HCPL-62XX
Notes:
1. HCPL-2200/2219 devices include output enable/disable function.
2. Technical data for the HCPL-2200/2219, HCPL-52XX and HCPL-62XX are on separate Agilent publications.
3. Minimum CMR of 10 kV/µs with VCM = 1000 V can be achieved with input current, IF, of 5 mA.
[2]
[2]
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2211#XXXX
060 = IEC/EN/DIN EN 60747-5-2 V
300 = Gull Wing Surface Mount Option**
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact your Agilent sales representative or authorized distributor for information.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July 2001
and lead free option will use “-”
*For HCPL-2211/2212 only.
**Gull wing surface mount option applies to through hole parts only.
Schematic
V
CC
V
O
GND
V
V
I
CC
8
I
F
2
+
V
F
–
3
SHIELD
HCPL-2201/02/11/12
HCPL-0201/11
HCNW2201/11
I
O
5
= 630 V peak Option*
IORM
I
F1
1
+
F1
–
2
SHIELD
3
–
F2
+
4
I
F2
SHIELD
HCPL-2231/32
I
CC
V
CC
8
I
O1
V
O1
7
I
O2
V
O2
6
GND
5
Package Outline Drawings
8-Pin DIP Package (HCPL-2201/02/11/12/31/32)
3
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
5° TYP.
0.254
(0.010
+ 0.076
- 0.051
+ 0.003)
- 0.002)
TYPE NUMBER
1.19 (0.047) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
9.65 ± 0.25
(0.380 ± 0.010)
A XXXXZ
YYWW
5678
OPTION CODE*
DATE CODE
UR
UL
RECOGNITION
4321
1.78 (0.070) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2201/02/11/12/31/32)
1.19
(0.047)
MAX.
1.080 ± 0.320
(0.043 ± 0.013)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
6
7
8
1
2
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
5
6.350 ± 0.25
(0.250 ± 0.010)
3
4
1.27 (0.050)
1.780
(0.070)
MAX.
3.56 ± 0.13
(0.140 ± 0.005)
0.635 ± 0.130
(0.025 ± 0.005)
(0.380 ± 0.010)
(0.300 ± 0.010)
0.635 ± 0.25
(0.025 ± 0.010)
1.016 (0.040)
9.65 ± 0.25
7.62 ± 0.25
10.9 (0.430)
2.0 (0.080)
0.254
(0.010
12° NOM.
+ 0.076
- 0.051
+ 0.003)
- 0.002)
4
Small-Outline SO-8 Package (HCPL-0201/11)
8765
3.937 ± 0.127
(0.155 ± 0.005)
PIN ONE
0.406 ± 0.076
(0.016 ± 0.003)
3.175 ± 0.127
(0.125 ± 0.005)
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
*
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
XXX
YWW
*
5.080 ± 0.127
(0.200 ± 0.005)
4321
1.270
(0.050)
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
BSC
1.524
(0.060)
0 ~ 7°
7°
LAND PATTERN RECOMMENDATION
0.64 (0.025)
0.432
45° X
(0.017)
0.203 ± 0.102
(0.008 ± 0.004)
0.305
MIN.
(0.012)
7.49 (0.295)
1.9 (0.075)
0.228 ± 0.025
(0.009 ± 0.001)
8-Pin Widebody DIP Package (HCNW2201/11)
11.15 ± 0.15
(0.442 ± 0.006)
6
5
TYPE NUMBER
DATE CODE
3
4
1.55
(0.061)
MAX.
3.10 (0.122)
3.90 (0.154)
0.40 (0.016)
0.56 (0.022)
2.54 (0.100)
TYP.
1.78 ± 0.15
(0.070 ± 0.006)
7
8
HCNWXXXX
1
2
A
YYWW
11.00
MAX.
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
10.16 (0.400)
TYP.
7° TYP.
5.10
MAX.
(0.201)
0.51 (0.021) MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254
(0.010
+ 0.076
- 0.0051
+ 0.003)
- 0.002)
5
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11)
11.15 ± 0.15
(0.442 ± 0.006)
7
8
6
5
LAND PATTERN RECOMMENDATION
1.78 ± 0.15
(0.070 ± 0.006)
9.00 ± 0.15
(0.354 ± 0.006)
1
3
2
2.54
(0.100)
BSC
4
1.55
(0.061)
MAX.
4.00
(0.158)
MAX.
0.75 ± 0.25
(0.030 ± 0.010)
1.3
(0.051)
(0.039 ± 0.006)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
12.30 ± 0.30
(0.484 ± 0.012)
11.00
MAX.
(0.433)
1.00 ± 0.15
2.29
(0.09)
(0.534)
7° NOM.
13.56
0.254
(0.010
+ 0.076
- 0.0051
+ 0.003)
- 0.002)
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
ROOM
TEMPERATURE
200
160°C
150°C
140°C
3°C + 1°C/–0.5°C
100
TEMPERATURE (°C)
0
0
50 150100 200 250
2.5°C ± 0.5°C/SEC.
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME (SECONDS)
PEAK
TEMP.
245°C
30
SEC.
SEC.
30
SOLDERING
TIME
200°C
50 SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
TIGHT
TYPICAL
LOOSE