NoticeInformation contained in this document is subject to change without notice.
All Rights Reserved. Reproduct ion, adaptation, or translati on without prior written
permission is prohibited, except as allowed under the copyright laws.
This material may be reproduced by or for the U.S. Government pursuant to the
Copyright License under the clause at DFARS 52.227-7013 (APR 1988).
Hewlett-Packard Company
Learning Products Department
24001 E. Mission
Liberty Lake, WA 99019-9599
U.S.A.
2
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Page 3
Manufacturer’s Declaration
This statement is provided to c omply with the req uiremen ts of t he German So und
Emission Directive, from 18 January 1991.
This product has a sound pressure emission (at the operator position) < 70 dB(A).
•Sound Pressure Lp < 70 dB(A).
•At Operator Position.
•Normal Operation.
•According to ISO 7779:1988/EN 27779:1991 (Type Test).
Herstellerbescheinigung
Diese Information steht im Zusammenhang mit den Anforderungen der
Maschinenlärminformationsverordnung vom 18 Januar 1991.
•Schalldruckpegel Lp < 70 dB(A).
•Am Arbeitsplatz.
•Normaler Betrieb.
•Nach ISO 7779:1988/EN 27779:1991 (Typprüfung).
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3
Page 4
Safety
Considerations
GENERAL
This product and related document ation must be revi ewed for familiariz ation with
safety markings and instructions before operation.
This product has been designed and tested in accordance with IEC Publication
1010, "Safety Requirements for Electronic Measuring Apparatus," and has been
supplied in a s af e condition. This ins tr u ct i on documentation con tai ns information
and warnings which must be followed by the user to ensure safe operation and to
maintain the product in a safe condition.
SAFETY EARTH GROUND
A uninterruptible safety earth ground must be provided from the main power
source to the product input wiring terminals, power cord, or supplied power cord
set.
CHASSIS GROUND TERMINAL
To prevent a potential shoc k hazard, always co nnect the rear-pa nel chassis gr ound
terminal to earth ground when operating this instrument from a dc power source.
SAFETY SYMBOLS
Indicates instrument damage ca n occur if ind icate d opera ting l imits are exceed ed.
A WARNING note denotes a hazard. It calls attention to a procedure,
practice, or the like, which, if not correctly performed or adhered to, could
result in personal injury. Do not proceed beyond a WARNING sign until the
indicated conditions are fully understood and met.
A CAUTION note denotes a hazard. It calls attention to an operation procedure,
practice, or the like, which, if not correctly performed or adhered to, cou ld resu lt
in damage to or destruction of part or all of the product. Do not proceed beyond
an CAUTION note until the indicated conditions are fully unde rstood and met.
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Page 5
Safety Considerations for this Instrument
WARNINGThis product is a Safety Class I instrument (provided with a protective
earthing ground incorporated in the power cord). The mains plug shall only
be inserted in a socket outlet provided with a protective earth contact. Any
interruption of the protective conductor inside or outside of the p roduct is
likely to make the product dangerous. Intentional interruption is
prohibited..
Whenever it is likely that the protection has been impaired, the instrument
must be made inoperative and be secured against any unintended operation.
If this instrument is to be energized via an autotransformer (for voltage
reduction), make sure the common terminal is connected to the earth
terminal of the power source.
If this product is not used as specified, the protection provided by the
equipment could be impaired. This product must be used in a normal
condition (in which all means for protection are intact) only.
No operator serviceable parts in this product. Refer servicing to qualified
personnel. To prevent electrical shock, do not remove covers.
Servicing instructions are for use by qualified personnel only. To avoid
electrical shock, do not perform any servicing unless you are qualified to do
so.
The opening of covers or removal of parts is likely to expose dangerous
voltages. Disconnect the product from all voltage sources while it is being
opened.
Adjustmen ts describe d i n t h e ma nual are performed with po w e r su p pl i e d t o
the instrument while protective covers are removed. Energy available at
many points may, if contacted, result in personal injury.
The power cord is connected to internal capacitors that my remain live for
5 seconds after disconnecting the plug from its power supply.
For Continued protection against fire hazard, replace the line fuse(s) only
with 250 V fuse(s) or the same current rating and type (for example, normal
blow or time delay). Do not use repaired fuses or short circuited
fuseholders.
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5
Page 6
CAUTION:Always use the three-prong ac power cord supplied with this product. Failure to ensure
adequate earth grounding by not using this cord may cause product damage.
This product is designed for use in Installation Category II and Pollution Degree
2 per IEC 1010 and IEC 664 respectively. For indoor use only.
This product has autorangi ng line voltage input, be sure the supply voltage is
within the specified range.
Ventilation Requirements: When installing the product in a cabinet, the
convection into and out of the product must not be restricted. The ambient
temperature (outside the cabinet) must be less than the maximum operating
temperature of the product by 4° C for every 100 watts dissipated in the cabinet.
If the total power dissipated in the cabin et is greater than 80 0 watts, then forced
convection must be used.
Product MarkingsCE - the CE mark is a registered trademark of the European Community. A CE
mark accompanied by a year indicated the year the design was proven.
CSA - the CSA mark is a registered trademark of the Canadian Standards
Association.
6
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Page 7
CERTIFICATIONHewlett-Packard Company certifies that this product met its published
specifications at the time of shipment from the factory. Hewlett-Packard further
certifies that its calibration measurements are traceable to the United States
National Institute of Standards and Technology, to the extent allowed by the
Institute’s calibration facility, and to the calibration facilities of other
International Standards Organization members
WARRANTYThis Hewlett-Packard instrument product is warra nted against defects in material
and workmanship for a period of one year from date of shipment. During the
warranty period, Hewlett-Packard Company will at its option, either repair or
replace products which prove to be defective.
For warranty service or repair, this product must be returned to a service facility
designated by HP. Buyer shall prepay shipping charges to HP and HP shall pay
shipping charges, duties, and taxes for products returned to HP from another
country.
HP warrants that its software and firmware designated by HP for use with an
instrument will execute its programming instructions when properly installed on
that instrument. HP does not warrant that the operation of the instrument, or
software, or firmware will be uninterrupted or error free.
LIMITATION OF
WARRANTY
EXCLUSIVE
REMEDIES
The foregoing warranty shall not apply to defects resulting from improper or
inadequat e maintenance by Buyer, Buyer-supplied soft ware or interfacing,
unauthorized modification or misuse, operation outside of the environmental
specifications for the product, or improper site preparation or maintenance.
NO OTHER WARRANTY IS EXPRESSED OR IMPLIED. HP SPECIFICALLY
DISCLAIMS THE IMPLIED WARRANTIES OF MERCHANTABILITY AND
FITNESS FOR A PARTICULAR PURPOSE.
THE REMEDIES PROVIDED HEREIN ARE BUYER’S SOLE AND
EXCLUSIVE REMEDIES. HP SHALL NOT BE LIABLE FOR ANY DIRECT,
INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES,
WHETHER BASE ON CONTRACT, TORT, OR ANY OTHER LEGAL
THEORY.
ASSISTANCEProduct maintenance agreements and other customer assistance agreements are
available for Hewlett -Packard products . For any assistance, contact your neares t
Hewlett-Packard Sales and Service Office.
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Page 8
DECLARATION OF CONFORMITY
according to ISO/IEC Guide 22 and EN 45014
Manufacturer’s Name:
Manufacturer’s Address:
Hewlett-Packard Co.
Spokane Division
24001 E. Mission Avenue
Liberty Lake, Washington 99019-9599
USA
declares that the product
Product Name:
Model Number:
Product Options:
CDMA Mobile Station Test Set
HP 8924C
This declaration covers al l optio ns of the abo ve
product.
conforms to the following Product specifications:
Safety:IEC 1010-1:1990+A1 / EN 61010-1:1993
CAN/CSA-C22.2 No. 1010.1-92
EMC:CISPR 11:1990/EN 55011:1991 Group 1, Class A
IEC 801-2:1984/EN 50082-1:1992 4 kV CD, 8 kV AD
IEC 801-3:1984/EN 50082-1:1992 3V/m
IEC 801-4:1988/EN 50082-1:1992 0.5 kV Sig. Lines, 1 kV Power Lines
Supplementary Information:
This product herewith complies wi th the requirements of the Low Voltage Directive
73/23/EEC and the EMC Directive 89/336/EEC.
Spokane, Washington USANovember 20, 1995
DateVince Roland/Quality Manager
European Contact: Your local Hewlett-Packard Sales and Service Office or Hewlett-Packard GmbH
Department ZQ/Standards Europe, Herrenberger Strasse 130, D-71034 Böblinger, Germany (FAX+49-7031-14-
8
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Page 9
DECLARATION OF CONFORMITY
according to ISO/IEC Guide 22 and EN 45014
Manufacturer’s Name:
Manufacturer’s Address:
Hewlett-Packard Co.
Spokane Division
24001 E. Mission Avenue
Liberty Lake, Washington 99019-9599
USA
declares that the product
Product Name:
Model Number:
Product Options:
CDMA Mobile Station Test Set
HP 8924E
This declaration covers al l optio ns of the abo ve
product.
conforms to the following Product specifications:
Safety:IEC 1010-1:1990+A1 / EN 61010-1:1993
CAN/CSA-C22.2 No. 1010.1-92
EMC:CISPR 11:1990/EN 55011:1991 Group 1, Class A
IEC 801-2:1984/EN 50082-1:1992 4 kV CD, 8 kV AD
IEC 801-3:1984/EN 50082-1:1992 3V/m
IEC 801-4:1988/EN 50082-1:1992 0.5 kV Sig. Lines, 1 kV Power Lines
Supplementary Information:
This product herewith complies wi th the requirements of the Low Voltage Directive
73/23/EEC and the EMC Directive 89/336/EEC.
Spokane, Washington USAMarch 27, 1998
DateVince Roland/Quality Manager
European Contact: Your local Hewlett-Packard Sales and Service Office or Hewlett-Packard GmbH
Department ZQ/Standards Europe, Herrenberger Strasse 130, D-71034 Böblinger, Germany (FAX+49-7031-14-
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9
Page 10
HP 8924C/E
Support Contacts
The documentation suppl ied with your t est set is an exce llent source of re feren ce,
applications, and service information. Please use these manuals if you are
experiencing technical problems:
If you have used the manuals and still have application questi ons , conta ct your
local HP Sales Representative.
Repair assistance is available for the HP 8924C/E CDMA Mobile Test Set from the
factory by phone and e-mail. Internal Hewlett-Packard users can contact the factory
When calling or writing for repair assistance, please have the following information
ready:
•Instrument model number (HP 8924C/E)
•Instrument Serial Number (tag located on the rear panel).
•Installed options - if any (tag located on the rear panel).
•Instrument firmware revision (displayed at the top of the screen when the Test Set is
powered up, and is also displayed on the CONFIGURE screen).
Support Telephone
1 800 827 3848 (Spokane Division Service Assistance, U.S. only)
1 509 921 3848 (Spokane Division Service Assistance, International)
1 800 227 8164 (HP Direct Parts Ordering, U.S. only)
1 916 783 0804 (HP Service Parts Identification, U.S. & Intl.)
Electronic mail (Internet): Spokane_Service@spk.hp.com
cc:Mail: SERVICE, SPOKANE /HP-Spokane,desk1
Numbers:
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Page 11
Table 2Regional Sales and Service Offices
United States of America
U.S. Instrument Support Center
For Test & Measurement Equipment
Repair & Calibration.
Hewlett-Packard Company
Englewood, Colorado 80112
Telephone: (800) 403-0801
Fax: (888) 857-8161
South Eastern Europe
Sales and Service
Hewlett-Packard Ges. m.b.h.
Liebigasse 1
P.O. Box 72
A-1222 Vienna, Austria
Telephone: 43 222 2500 0
Telex: 13 4425
Asia
Sales and Service
Hewlett-Packard Asia Ltd.
22-30/F Peregrine Tower
Lippo Center
89 Queensway, Central
Hong Kong
G.P.O. Box 863 Hong Kong
United States of America
Customer Information Center
For Assistance On All HP Products.
Hewlett-Packard Company
Tel: (800) 752-0900
6:00 am to 5:00 pm Pacific Time
Parts Direct: 1-800-227-8164
European Multicountry Region
Sales and Service
Hewlett-Packard S.A.
P.O. Box 95
150, Route dv Nant_dl_AVRIL
CH-1217 Meyrin 2
Geneva, Switzerland
Telephone: (41/22) 780-8111
Fax: (41/22) 780-8542
Japan
Sales and Service
Yokogawa-Hewlett-Packard Ltd.
3-29-21, Taka ido-Higash i
Suginami-Ku, Tokyo 168
Telephone: 81 3 3331-6111
Fax: 81 3 3331-6631
Northern Europe
Sales and Service
Hewlett-Packard Nederland B.V.
Startbaan 16
1187 XR
Amstelveen, The Netherlands
P.O. Box 667
Telephone: 31/20 5476911 X 6631
Fax: 31-20-6471825NL
International Sales Branch
Headquarters
Sales and Service
Hewlett-Packard S.A.
39 Rue Veyrot
P.O. Box 365
1217 Meyrin 1
Geneva, Switzerland
Telephone: 852-848-7777
Fax: 852-868-4997
Australia, New Zealand
Sales and Service
Hewlett-Packard Ltd.
P.O. Box 221
31-41 Joseph Street
Blackburn, Victoria 3130
Telephone: (61/3) 895-28 95
Fax: (61/3) 898-9257
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11
Canada
Sales and Service
Hewlett-Packard (Canada) Ltd.
5150 Spectrum Way
Mississauga, Ontario L4W 5G1
Canada
Telephone: (416) 206-4725
Fax: (416) 206-4739
Telephone: 41-22-780-4111
Fax: 41-22-780-4770
Canada
Service Center
Hewlett-Packard Company
17500 Transcanada Highway
S. Serv Road
Kirkland, Quebec H9J 2X8
Canada
Telephone: (416) 206-3295
Page 12
Table 2Regional Sales and Service Offices (Continued)
Canada
Service Center
Hewlett-Packard Ltd.
11120 178 Street
Edmonton, Alberta T5S 1P2
Canada
Telephone: (403) 486-6666
Fax: (403) 489-8764
Latin America
Hewlett-Packard Company
LAHQ Mexico City
Col. Lomas de Virreyes
11000 Mexico D.F.
Mexico
Telephone: (52/5) 326-4000
Fax: (52/5) 202 7718
United Kingdom
Sales and Service
Hewlett-Packard Ltd.
Cain Road
Amen Corner
Bracknell, Berkshire
RG12 1HN
United Kingdom
Republic,Czechoslovakia
Denmark, Djibouti
East Germany, Egypt, Estonia, Ethiopia
Finland, France, French Guiana, French Indian Ocean Areas
Gabon, Gaza Strip, Georgia, Germany, Gozo, Greece
Hungary
Iceland, Indonesia, Iran, Iraq, Israel, Italy, Ivory Coast
Jordan
Kazakhstan, Korea, Kyrgystan
Latvia, Lebanon, Libya, Lithuania, Luxembourg
Macedonia, Madeira Islands, Malagasy Republic, Mali, Malta, Mauritania, Miquelon, Moldova, Mongolia,
Morocco, Mozambique
Nepal, Netherlands, Netherlands Antilles, Niger, Norway
Oman
Pakistan, Paraguay, Poland, Portugal
Rep. South Africa, Romania, Russia, Rwanda
Saudi Arabia (220V), S eneg al , S l ovak Rep ubl i c, Sl ov eni a, Somalia, Spain, Spanish Afri ca, Sri Lanka, St.Pierce
Islands
Sweden, Syria
Tajikistan, Thailand, Togo, Tunisia, Turkey, Turkmenistan
USSR, Ukraine, Uzbekistan
Western Africa, Western Sahara
Yugoslavia
Zaire
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Page 14
Plug Type
Earth
Ground
LineLine
Earth
Ground
LineNeutral
Used in the following locations
Peru
Plug Descriptions
male/female
HP Part #
(cable & plug)
Cable Descriptions
Straight/Straight8120-069890 inches, black
Plug Type
Used in the following locations
Switzerland
Plug Descriptions
male/female
Straight/Straight
Straight/90°
HP Part #
(cable & plug)
8120-2104
8120-2296
Cable Descriptions
79 inches, gray
79 inches, gray
14
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Page 15
Plug Type
125V
Earth
Ground
LineNeutral
Plug Descriptions
male/female
Straight/Straight
Straight/90°
Straight/Straight
HP Part #
(cable & plug)
8120-1378
8120-1521
8120-1751
Used in the following locations
American Samoa
Bahamas, Barbados, Belize, Bermuda, Brazil,
Caicos, Cambodia, Canada, Cayman Islands, Columbia, Costa Rica, Cuba
Dominican Republic
Ecuador, El Salvador
French West Indies
Guam, Guatemala, Guyana
Haiti, Honduras
Jamaica
Korea
Laos, Leeward and Windward Is., Liberia
Mexico, Midway Islands
Nicaragua
Other Pacific Islands
Panama, Philippines, Puerto Rico
Saudi Arabia (115V,127V), Suriname
Taiwan, Tobago, Trinidad, Trust Territories of Pacific Islands
Turks Island
United States
Venezuela, Vietnam, Virgin Islands of the US
Wake Island
Bahrain, British Indian Ocean Terr., Brunei
Canton, Cyprus
Enderbury Island, Equatorial Guinea
Falkland Islands, French Pacific Islands
Gambia, Ghana, Gibraltar, Guinea
Hong Kong
Ireland
Kenya, Kuwait
Macao, Malaysia, Mauritius
Nigeria
Qatar
Seychelles, Sierra Leone, Singapore, Southern Asia, Southern Pacific Islands, St. Helena, Sudan
Tanzania
Uganda, United Arab Emirates, United Kingdom
Yeman (Aden & Sana)
18
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Page 19
Plug Type
Line
Neutral
Earth
Ground
Used in the following locations
Argentina, Australia
China (People’s Republic)
New Zealand
Papua New Guinea
Uruguay
Western Samoa
Plug Descriptions
male/female
Straight/Straight
Straight/90°
HP Part #
(cable & plug)
8120-1369
8120-0696
Cable Descriptions
79 inches, gray
80 inches, gray
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Page 20
ATTENTION
Static Sensitive
Devices
This instrument was constructed in a n ESD (electro-static discharge) protected environment. This is
because most of the semi conductor devices used in this instrument are susceptible to damage by
static discharge.
Depending on the magnitude of the charge, device substrates can be punctured or destroyed by
contact or mere proximity of a static charge. The result can cause degradation of device
performance, early failure, or immediate destruction.
These charges are generated in numerous ways such as simple contact, separation of materials, and
normal motions of persons working with static sensitive devices.
When handling or servi cing equipment containing static s ensitive devi ces, adequat e precauti ons must
be taken to prevent device damage or destruction.
Only those who are thoroughly familiar with industry accepted techniques for handling static
sensitive devices should attempt to service circuitry with these devices.
In all instances, measures must be taken to prevent static charge build-up on work surfaces and
persons handling the devices.
20
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Page 21
In This BookChapter 1, I n troduction
A general description of what the Test Set does is included. Theory of Operation,
troubleshooting, repairing, calibrating, and verifying instrument performance are
discussed. Additional HP support information is provided.
Chapter 2, Troubleshooting
The process for isolating a fai lure to the fault y assembly is di scussed, in cluding how to
use the automated diagnostic routines.
Chapter 3, Repair
Illustrated disassembly/assembly drawings are provided to show the order of
disassembly and to identify the component designators for most assemblies.
Chapter 4, Periodic Adjustment
Automated calibration procedures for various Test Set functions are discussed,
including step-by-step procedures for using the automated calibration procedures.
Chapter 5, Performance Verification
Procedures are provided to verify the performance of each section of the Test Set.
Included are the necessary test instruments are their settings, instruments connections,
and the Test Set setup0 needed for each test.
Chapter 6, Specifications
Chapter 7, Service Screen
Chapter 8, Block Diagrams
Chapter 9, Replaceable Parts
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21
The warranted specifications of the Test Set are listed.
A description of the Service Screen and its ope ration is provided.
Diagrams are provided illustrating the general operation of major sections of the Test
Set. The diagrams also provide detailed illustrations of each assembly, including signal
functions and connector pi n numbers. This i nformation is used to b etter understand the
operation of the Test Set when manually troubleshooting (if the automated diagnostics
cannot identify a faulty assembly with high confidence).
Part numbers for each replaceable part are provided.
Page 22
Chapter 10, Diagnostic Descriptions
Test Set’s automated diagnostics are described. The descriptions help you understand
what has been checked by the diagnostics in case they cannot identify a probable f ailure
and you must troubleshoot further.
Appendix A, Error Messages
22
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Page 23
Contents
1 Introduction
Test Set Description 56
Theory of Operation 58
Troubleshooting Strategy 65
Repair Process 66
Calibration and Performance Verification 67
HP 8924C/E Support Contacts 68
Hardware and Firmware Enhancements 69
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Page 24
Contents
2 Troubleshooting
How to Troubleshoot the Test Set 72
Step 1- Run the Power-up Diagnostics 74
Step 2- Run the Functional Diagnostics 75
Step 3 - Verify Test Set Functions 78
More About Step 1- Run the Power-Up Diagnostic 79
More About Step 2- Run the Functional Diagnostics 81
USER Keys 81
Frequently Encountered Error Messages 81
Timeouts 82
The Four Functional Diagnostics 82
Troubleshooting Aids 85
More about Step 4 - Verify Test Set Functioning 89
Isolating Input and Output Failures 97
Isolating the RF An alyzer 97
Isolating the RF Source 100
24
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Page 25
Contents
3 Repair
Before You Start 102
Recommended Torque 102
Tools 102
Ordering Replacement Parts 102
Downloading Calibration Data 103
Locating Assemblies 104
Disassembly and Replacement Procedures 105
Removing the External Covers 105
Removing the Front Panel Assembly: A1, A2, A3, A4, and A5 107
Replacing Keyboard Filter Assembly (A2) 111
Front Panel Disassembly 113
Removing Power Supply (A23) 122
Removing the Voltage Regulator (A20) and Fan (A21) 123
Removing the RF and AF Assembly Covers 124
Removing the Control Interface Assembly (A33) 125
Removing the Rear S ub-Panel (MP27) 126
Removing the Memor y Assembly (A17) 128
Remove the Oven Time Base (A38) 129
Remove the Audio Analyz er 1 Sub-assemblies (A35) 130
Fastening the Motherboard to the Chassis Base 132
Fastening the Internal Web to the Chassis 133
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25
Replacing the A16 Host Controller 135
Page 26
Contents
4 Periodic Ad justments
Introduction 138
Manual and Automated Adjustments 139
Calibration Equipment 140
10 MHz Oven Timebase Adjustmen t 140
Zeroing the DC_FM, DC Current, TX Power, and CDMA Power Functions 141
Running the Periodic Calibration Programs 142
Write-Protected Calibration Data 143
PER_CAL3 Routines 144
CDMA_CAL Routines 147
PCB_CAL Routine 148
26
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Page 27
Contents
Performance Verification
5 HP 8924C
Verifying Performance 150
Test Set Operation 150
Equipment 150
Test Equipment Operation 151
RF Gen FM Distortion
Performance Test 1 152
Description 152
Setup 152
Procedure 153
RF Gen FM Accuracy
Performance Test 2 154
Description 154
Setup 154
Procedure 155
RF Gen FM Flatness
Performance Test 3 156
Description 156
Setup 156
Procedure 157
RF Gen Residual FM
Performance Test 4 158
Description 158
Setup 158
RF Gen Duplex Output High Level Accuracy
Performance Test 5 161
Description 161
Setup 161
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27
RF Gen Duplex Output Low Level Accuracy
Performance Test 6 163
Page 28
Contents
Description 163
Setup 163
Procedure 164
RF Gen RF IN/OUT Level Accuracy
Performance Test 7 165
Description 165
Setup 165
Procedure 166
RF Gen Harmonics Spectral Purity
Performance Test 8 167
Description 167
Setup 167
Procedure 168
RF Gen Spurious Spectral Purity
Performance Test 9 169
Description 169
Setup 169
Procedure 170
AF Gen AC Level Accuracy
Performance Test 10 171
Description 171
Setup 171
AF Gen DC Level Accuracy
Performance Test 11 173
Description 173
Setup 173
Procedure 174
AF Gen Residual Distortion
Performance Test 12 175
Description 175
Setup 175
Procedure 176
28
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Page 29
Contents
AF Gen Frequency Accuracy
Performance Test 13 177
Description 177
Setup 177
Procedure 178
AF Analyzer AC Voltage Accuracy
Performance Test 14 179
Description 179
Setup 179
Procedure 180
AF Analyzer Residual Noise
Performance Test 15 181
Description 181
Setup 181
Procedure 182
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29
AF Analyzer Distortion, SINAD, and SNR Accuracy
Performance Test 16 183
Description 183
Setup 183
Procedure 184
AF Analyzer DC Level Accuracy
Performance Test 17 185
Description 185
Setup 185
Procedure 186
AF Analyzer Frequency Accuracy to 100 kHz
Performance Test 18 187
Description 187
Setup 187
Procedure 188
AF Analyzer Frequency Accuracy at 400 kHz
Performance Test 19 189
Page 30
Contents
Description 189
Setup 189
Procedure 190
Oscilloscope
Performance Test 20 191
Description 191
Setup 191
Procedure 192
RF Analyzer Level Accuracy
Performance Test 21 193
Description 193
Calibration Setup 193
Calibration Proce d ure 1 94
Measurement Setup 195
Measurement Procedur e 195
RF Analyzer FM Accuracy
Performance Test 22 197
Description 197
Setup 198
Procedure 199
RF Analyzer FM Distortion
Performance Test 23 200
Description 200
Setup 201
Procedure 202
RF Analyzer FM Bandwidth
Performance Test 24 203
Description 203
Setup 203
Procedure 205
RF Analyzer Residual FM
Performance Test 25 207
30
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Page 31
Contents
Description 207
Setup 207
Procedure 208
Spectrum Analyzer Image Rejection
Performance Test 26 209
Frequency Measurement 418
AC Voltage Measurement 419
DC Voltage Measurement 419
Distortion Mea sur e m en t 420
SINAD Measurement 421
Audio Filters 422
Variable Frequency Notch Filter 422
Audio Detectors 423
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Page 46
Contents
Oscilloscope Specifications (Analog Mode) 424
General 424
Signaling Specifications (Analog Mode) 425
General 425
DC Current M eter Specifications (Analog Mode) 426
General 426
CDMA Call Processing Functions 427
General 427
CDMA Generator Specifications 431
CDMA Channels 431
Frequency 431
Amplitude 432
CDMA Modulation 433
CDMA Analyzer Specifications 434
CDMA Average Power Measurement 434
CDMA Tuned Channel Power Measurement 436
CDMA Modulation Measurement 437
CDMA Frame Error Rate Measurement 438
CDMA Reverse Channel Spectr um Displ ay (HP 8924E: Optio n 102
required) 439
Description Of Miscellaneous Diagnostics (MSDIAGS3) 603
Introduction 603
External Reference Test 603
RF Input/Output Test 604
Self-Test 605
Description of the Digital Assembly Diagnostics
(CDMADIAG) 606
Introduction 606
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Contents
A Error Messages
52
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Contents
Index 633
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Contents
54
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1
Introduction
This manual explains how to re pair an d calib ra te the HP 892 4C/E CDMA Mobile
Station Test Set; called “the Test Set” throughout this manual.
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Chapter 1, Introduction
Test Set Description
Test Set Description
Several analog and digital test instruments are integrated into one package to test
Code Division Multiple Access (CDMA) digital cellular telephones and several
types of analog telephones (such as AMPS, NAMPS, and TACS). Some of the
instrument functions in the Test Set include:
•Synthesized AM, FM, and IQ modulation signal generator
•AM, FM, and IQ modulation analyzer
•Duplex offset generator
•SSB demodulator
•RF and audio power meters
•Audio and RF frequency counter and RF frequency error meter
•AC and DC voltmeter
•Distortion, SINAD, and signal-to-noise-ratio meters
•Two variable audio sources
•Oscilloscope
•Spectrum analyzer and tracking generator (optional on HP 8924E)
•Signaling encoder and decoder
•DC current meter
Some of these functions are directly replaceab le as semblies (such as th e s p ec tr um
analyzer); some fu nct ions are digitally derived from o the r assemblies (such as the
oscilloscope). There are about 40 replaceable assemblies - mostly plug-in printed
circuit boards.
Most instrument fun ctions can be cont rolled by front- panel (lo cal) cont rols and by
remote commands (using a connected controller). Power on/off, volume, and
squelch controls cannot be accessed remotely. Controls are grouped together on
display screens that are usually associated with a specific task (such as making a
call to a CDMA mobile phone).
An HP Instrument BASIC (IBASIC) computer is also built into the Test Set to
allow automa ted operation without using an external controller. T his computer
also has the ability to be a system controller to other test system instruments.
Refer to the Test Set’s User’s Guide for information on using th e IBASIC
computer (also referred to as the IBASIC controller).
56
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Front & Rear Panel Connections
Chapter 1, Introduction
Test Set Description
MAX
OO
CALL CONTROL
CDMA GENERATOR CONTROL
CDMA CALL CONTROL
Frequency Counter
Spectrum Analyzer*
HP 68020 Host Processor
DATA
INSTRU
ME
CDMA FUN
UD
CDM
CDM
SHI
DC Current
Signal Generator
Receiver
Signaling Encoder
Modulation Analyzer
* optional for HP 8924E
CDMA CALL CONTROL
CDMA SCRNS
CELL
CALL
CTRL
SPECTRUM
GEN
CTRL
CDMA SCRNS
ENCODER
RF
ANL
AF
ANL
SPEC ANL
RF
GEN
END
CALL
RANGE
RX
TEST
MSRPT
TX
TEST
DECODER
RX
TEST
ACP
TX
TEST
SCOPE
DUPLEX
CALLANS
USERDATA
k1’
k1
k2’
k2
k3’
k3
ASSIGN
k4
RELEASE
k5
FUNCTIONS
MSG
PRINTER
HELP
PRINT
DATA FUNCTIONS
REF SET
METER
INCR
INCR
: 10
SET
LO LIMITHI LIMIT
CURSOR
CONTROL
CANCELSHIFT
I/O CONFIG CONFIG
PREV TESTS
AVG
INCR X10
PUSH TO
SELECT
ADRS
LOCAL
789
456
123
0
YES
ON/OFF
INSTRUMEN T STATE
SAVE
RECALL
_
+
Ω
NO
%
ppm
dBµV
W
HOLD
MEAS
RESET
ENTER
dB
GHz
dBm
%
MHz
V
s
kHz
mV
ms
Hz
µV
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Chapter 1, Introduction
Theory of Operation
Theory of Operation
The Test Set is primarily an RF transceiver that operates in the 30 to 1000 MHz
range, and a group of instruments that analyze received signals. Several
modulation sources ar e available for testing a variety of cellular phones and other
types of radios. A modulation analyzer is used to measure various parameters on
the received signal from the radio-under-test. The oscilloscope and spectrum
analyzer provide additional received signal analysis.
The following information is very general. Refer to Chapter 9, Block Diagrams,
for detailed drawings for each assembly.
Internal
Operating System
A 68020 microprocessor acts as the “host” processor of the Test Set. It receives
commands from the front-panel controls and communicates directly with almost
every assembly inside the Test Set. The host is also in constant communication
with several other mic rop rocessors located in as se mb li es t hroughout the Test Set.
Communications to the HP-IB, Serial, and Parallel ports are through the Control
Interface (A33) assembly to the host processor.
This processor is also the core for the internal IBASIC computer. The IBASIC
computer is used to load and run various software packages for automated radio
tests. It is also responsible for executing the internal diagnostic routines used to
troubleshoot a failing instrument.
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Chapter 1, Introduction
d
e
m
Theory of Operation
Instrument
Frequency
References
Rear-Panel
EVEN SEC
Input
External Jumper
Rear-Panel
10 MHz REF
OUTPUT
Most of the Test Set’s internal oscillators and counters are phase-locked to the
signal input fr om the re ar-panel REF INPUT po rt. T his signal is usu ally th e output
of the 10 MHz Oven Oscillator (A38) assembly, also available on the rear-panel.
The Reference Assembly (A27) is internally connected to the CDMA Reference
(A29), which is connected to the external reference. The CDMA Reference
provides the clocks for the CDMA assemblies, the AWGN (Additive White
Gaussian Noise) source, and the reference for the Reference Assembly. The
Reference Assembly provides the references for the analog assemblies.
If the message“
and frequency
Reference unlocked, check reference connection
” is displayed on the top of the Test Set’s screen, verify that a
good BNC cable (or factory jumpe r) is connected bet ween the REF INPUT and 10
MHz OVEN OUT ports. If the message is still displayed, make sure the
External Reference control on the CONFIGURE screen is set to
10.0000 MHz, and use a frequency counter to verify the presence and frequency
of the 10 MHz Oven’s Output signal. If an external reference is used, verify that
the reference frequency matches the
External Reference setting (±10 ppm),
and that the level is at 0 dbm (±3 dB).
External CDMA Timing
Reference Input
CDMA Reference (A29)
REF INPUT
10MHz Oven
Oscillator
(A38)
10 MHz
10 MHz
CDMA Clocks to the Receive and Optional DSP Assemblies, Protoco
Processor,
10 MHz
Cell Site Digital assemblies, Cell Site Analog Assembly,
LO/IF/DEMOD Assembly (A31)
1 MHz to Receiver Synthesizer
Reference Assembly
(A27)
1 MHz to Signal Generator Synthesiz
1 GHz to Output Assembly
20 MHz to Frequency Counter
20 MHz to Spectrum Analyzer
500 MHz to Receiver
10 MHz to Receiver (SSB and FM De
rear panel.
an
Figure 1 Reference Signal Generation
RF Analysis RF signals connected to the front panel RF IN/OUT port or ANTENNA IN port
go to the Input Assembly (A5) . The s ign al l eve l and RF fr equ enc y are measured,
and the level is adjusted using fixed step and variable attenuators.
OVER-POWER
DAMAGE!
The ANTENNA IN connector is only used for very low level signals (200 mW or
less), and cannot be used for Transmitter (TX) Power measurements. Exceeding
this limit may destroy this assembly! The RF IN/OUT connector is used to
measure direct mobile transmitter power up to 6.0 Watts.
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Chapter 1, Introduction
)
Theory of Operation
The Receiver 1st Mixer Assembly (A19) then mixes the signal with a local
oscillator signal from the Receiver Synthesizer Assembly (A28) to produce a
114.3 MHz or 614.3 MHz IF signal (depending on the frequency of the received
signal). The signal goes through a bandpass filter and then to the Receiver
Assembly (A30). .
If the IF is 614.3 MHz, the Receiver Assembly then mixes the signal with a
500 MHz LO signal from the Reference Assembly (A27 ) to get the 114.3 MHz IF.
If the IF from A28 is already 114.3 MHz, the signal bypasses this
downconversion.
The 114.3 MHz signal divides into two paths.
Input Assembly (A5)
RF IN/OUT
Power
Detector
ANTENNA
IN
Figure 2 Received Signal Downconversion
AM, FM, or SSB
Modulation
Analysis
For AM, FM, or SSB signals, the 114.3 MHz signal is downconverted to
10.7 MHz and routed through a user-selected IF bandpass filter (15 kHz or
230 kHz) that is centered around the 10.7 MHz IF. AM and SSB signals are
Receiver 1st Mixer Assembly (A19)
486-1026 MHz from
Receiver Synthesizer
Assembly
demodulated at this point; FM signals are downconverted to a 700 kHz IF before
(HP 8924E: FM
only)
demodulation. The demodulated signal is routed to the Audio Analyzer 1 (A35)
assembly for audio frequency filtering. This assembly is also connected to the
front-panel AUDIO IN connector for direct audio measurements. Several lowpass and high-pass filters can be selected, as well as a C-Message or optional
CCITT filter. Frequency and voltage measurements are then made on this signal
by the Measurement Assembly (A37) . The signal is then routed to the Audio
Anlayzer 2 (A36) assembly.
114.3 MHz
614.3 MHz
Receiver Assembly (A30)
114.3 MHz
500 MHz from
Reference Assembly
LO/IF Demod Assembly (CDMA Demod
AM, FM, SSB
Demodulation
114.3 MHz
The Audio Analyzer 2 assembly routes the signal through a user-selectable
detector. A variable frequency notch filter may also be selected for SINAD and
distortion measurements. The detector’s signal is then sent to several other
assemblies:
60
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Chapter 1, Introduction
Theory of Operation
•The Measurement Assembly, to measure and display the modulation level (such as FM
deviation) and provide the input to the oscilloscope.
•The Signaling Source and Analyzer (A15) assembly for signaling decoding.
•The rear-panel AUD MONITOR OUTPUT connector for external use of the
demodulated signal.
•The front-panel VOLUME control and internal Speaker to listen to the demodulated
signal.
Figure 3 AM, FM, and SSB Signal Demodulation and Filtering
CDMA Signal
Analysis
The 114.3 MHz IF also goes t o the LO/IF De mod (A13) asse mbly. This as sembly
provides a path to the Spectrum Analyzer (A32) for all RF signals, and also
provides down conversion for CDMA signals.
To downconvert the CDMA signal, the 114.3 MHz IF is mixed with a
117.9864 MHz LO to produce a 3.6864 MHz IF. (The LO signal is from an
oscillator that is phase locked to a 10 MHz signal from the CDMA Reference
module.)
Audio Analyzer 1 Assembly (A3
Selectable
Low-Pass
Filters
DC Volts and
Audio Frequency
Measurements
AUDIO IN
Selectable
High-Pass
Filters
The 3.6864 MHz signal goes to th e Receiv er DSP (A12) a nd Optiona l DSP (A1 1)
assemblies, and also goes through a variable-gain IF Amplifier and an IQ
Demodulator. The demodul ator p rovide s I and Q baseba nd sign als to the Cel l Sit e
Digital (A7 & A9) assemblies.
Under control from the Protocol Processor (A6) assembly, the Cell Site Digital
assemblies use the IQ information to set up and maintain calls to CDMA phones.
The Cell Site Digital 1 assembly also furnishes feedback to the LO/IF/DEMOD
assembly to control the level of the variable-gain IF Amplifier into the
demodulator.
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Chapter 1, Introduction
6
2
Theory of Operation
114.3MHz IF
from Receiver
LO/IF Demod Assembly (A31)
117.9864 MHz
The Receive DSP assemblies analyze the 3.6864 MHz signal to make IQ
modulation measurements, such as Rho, Timing Accuracy, Carrier Feedthrough,
and Phase Error.
To Spectrum Analyzer (A32)
3.6864 MHz
IQ
Demodulator
IF Gain Control
I data
Q data
Cell Site Digital Assemblies
IQ Decoding and CDMA Generat or
Data Coding
(A7,A9)
Receive/Opt. DSP Assemblies (A11,A1
CDMA IQ Modulation
Measurements
Protocol
Processor (A
Call Setup and
Control
Figure 4 Analyz ing CDMA Signals
RF Signal
Generation
The Signal Generator Synthesizer (A24) assembly creates a 500-1000 MHz
signal. The reference signal for the synthesiz er is suppl ied by the Ref erence (A2 7)
assembly. The synthesizer’s frequency is varied using a divider network in the
feedback circuit of the phase locked loop. Any FM modulation signal (from the
Modulation Distributi on (A34) ass embly), and th e frequenc y sweep signa l for the
Spectrum Analyzer and Tracking Generator, are integrated into this feedback
loop. If a CDMA signal is not being generated, the 500-1000 MHz signal is
passed through the I/Q Modulator (A25) assembly, bypassing the I/Q modulator.
IQ ModulationIf a CDMA signal is being generated, the signal is I/Q modulated in the I/Q
Modulator assembly, using data from the Cell Site Analog (A8) assembly. The
Cell Site Analog assembly gets its data from the two Ce ll Site Digital (A7 & A9)
assemblies, which are controlled by the Protocol Processor (A6) assembly. Up to
eight code channels of CDMA modulat ion data and nois e may be summed into the
IQ modulator at one time. The se chann els provide pho ne paging, sy nchroniza tion,
voice (traffic) transmission, and other CDMA system functions.
Final Frequency
Conversion and
Leveling
The Output (A26) assembly performs three tasks:
•Mixes or divides the 500-1000 MHz signal to produce signals below 500 MHz (down
to 0.4 MHz). A 1 GHz LO from the Reference (A27) assembly is used for mixing.
•Provides AM modulation (when selected).
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Chapter 1, Introduction
Theory of Operation
•Controls the signal level out of the assembly using an Automatic Level Control (ALC)
loop.
The signal out of the Output assembly is now at the user-selected frequency, and
contains any modulation that was selected (AM, FM, or CDMA), or is a
continuous wave (C W) sign al. The leve l has been adjus ted t o prov ide t he re quired
level (after going through the Input (A5) assembly).
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Chapter 1, Introduction
Theory of Operation
RF and DUPLEX
Outputs
Signal Generator Synthesizer (A24)
1 MHz from
Reference
Assembly
FM Mod. from
Mod. Dist.
Spec. Analyzer
Sweep
500-1000 MHz
Output Assembly (A26)
500-1000 MHz
The Input assembly receives the signal from the output assembly and routes it to
the selected output por t: RF IN/OUT or DUPLEX OUT. The signal first goes to a
variable attenuator for level control. If the DUPLEX OUT port is selected, the
signal then goes directly to that port without additional attenuation. If the RF IN/
OUT port is used as an output, the signal passes through additional attenuation
before reaching the port. This is why a greater signal level can be output through
the DUPLEX OUT port than through the RF IN/OUT port.
IQ Modulat or Assembly (A25)
500-1000 MHz
I&Q data
I&Q data
Level Control
I/Q Modulator
ADC &
Summing
RF
Amp
Automatic
AWGN (Noise) from
CDMA Reference
Cell Site
Analog (A8)
Input Assembly (A5)
Variable
Attenuator
DUPLEX
OUT
RF IN/OUT
div/n
Cell Site
Protocol
Processor
(A6)
250-500 MHz
div/2
250 kHz-250 MHz
1 GHz from Reference Assembly
Digital 1
(A9)
Cell Site
Digital 2
(A7)
4 channels of
1 channel of
Amplitude
Modulator
RF Amplitude
Adjust from
Host Controller
AM from Mod.
Distribution Assembly.
Figure 5 RF Generation Path Overview
64
To the Receiver
Assembly
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Troubleshooting Strategy
You can repair the Test Set yourself or send it to your local Hewlett-Packard
Customer Service Center. Before starting a repair, you should become familiar
with basic Test Set operation using the User’s Guide.
Troubleshooting relies on built-in diagnostics. Because some diagnostic results
may be ambiguous, further interpretation and testing may be required. There are
several diagnostic routines built into the Test Set:
•Power-up self-test diagnostics to test controller functioning. These are automatically
run when the instrument is turned on, and can also be run after the instrument has been
on.
•RF (Radio Frequency) assembly diagnostics.
•AF (Audio Frequency) assembly diagnostics.
•Digital assembly diagnostics for CDMA signals.
Chapter 1, Introduction
Troubleshooting Strategy
Troubleshooting hints in this manual include:
•Instructions on how to begin troubleshooting (see chapter 2, "Troubleshooting").
•Block diagrams and theory of operation (see chapter 11, "Block Diagrams").
•Detailed information about the built-in diagnostics (see chapter 14, "Diagnostics
Descriptions").
•Error message explanations (see Appendix A: Error Messages) .
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Chapter 1, Introduction
Repair Process
Repair Process
Repairing th e Test Set cons ists of:
•Identifying the faulty assembly (see chapter 2, "Troubleshooting")
•Ordering a replacement assembly (see chapter 12, "HP 8924C Replaceable Parts" or
chapter 13, "HP 8924E Replaceable Parts")
•Replacing the faulty assembly (see chapter 3, "Repair")
•Downloading calibration data (seechapter 3, "Repair")
•Performing periodic calibration (see chapter 4, "Periodic Adjustments")
•Verifying Test Set performance (see chapter 5, "HP 8924C Performance
Verification" or chapter 6, "HP 8924E Performance Verification")
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Calibration and Performance Verification
The Test Set pe riodically requires some maintenance to verify that it meets its
published specifications. Periodic Adjustments (calibration) consists of running
several built-in calibration programs, and should be performed every year. An
external frequency counter and dc voltmeter are required. (See
"Periodic Adjustments"
The Performance Verification tests in chapter 5 verify that the Test Set performs
as indicated in the Specifications. These tests should be performed if the Test
Set’s operation is suspect, even though it passes all internal diagnostic checks.
This ident ifies whether a problem actually exists in the Te st Set, or if an
application problem exists outside of the Test Set.
Several assemblies, when replaced, require running specific periodic calibration
procedures to create calibration factors for that assembly. In other cases, the
calibration data will be included with the replacement assembly on a memory
card. Instr uctions that come with the replacement assembly explain how to
download the calibr ation data. ( This is not considered pa rt of periodi c calibrat ion.)
).
Chapter 1, Introduction
Calibration and Performance Verification
chapter 4,
NOTE:When troubleshooting the Test Set, it is sometimes desirable to swap a known-good assembly
(perhaps from another Test Set) for a suspected-faulty assembly. If the swapped assembly
requires calibration data, most assemblies will operate well enough with the original
assembly’s calibration data to troubleshoot and run the diagn ostics. However, do not expect
the Test Set to meet its specifications. Also, some assemblies may appear to fail because of the
incorrect calibration data.
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Chapter 1, Introduction
HP 8924C/E Support Contacts
HP 8924C/E Support Contacts
The documentation suppli ed wi th your test set is an exc ell en t so urce of reference,
applications, and service information. Please use these manuals if you are
experiencing technical problems:
Assembly Level Repair08924-90061
CD ROM08924-90059
If you have used the manuals and still have application questions, contact your
local HP Sales Representative.
Repair assistance is available for the HP 8924C/E CDMA Mobile Test Set from
the factory by phone and e-mail. Internal Hewlett-Packard users can contact the
When calling or writing for repair assistance, please have the f ollowing infor mation ready:
•Instrument mode l numb e r (8924C/E)
•Instrument Serial Number (tag located on the rear panel).
•Installed options - if any (tag located on the rear panel).
•Instrument firmware revision (displayed at the top of the screen when the Test Set is
powered up, and is also displayed on the CONFIGURE screen).
Support Telephone
1 800 827 3848 (Spokane Division Service Assistance, U.S. only)
1 509 921 3848 (Spokane Division Service Assistance, International)
1 800 227 8164 (HP Direct Parts Ordering, U.S. only)
1 916 783 0804 (HP Service Parts Identification, U.S. & Intl.)
Numbers:
Electronic mail (Internet): Spokane_Service@spk.hp.com
cc:Mail: SERVICE, SPOKANE /HP-Spokane,desk1
68
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Hardware and Firmware Enhancements
The hardware and fi rmwar e of th e Te st Set are enhanced on a cont inuous basis. If
an assembly is replaced, it is recommended that the firmware be upgraded at the
same time. This is important if an assembly-level repair is performe d because
exchange assemblies, which may be of a later revision than the one being
replaced, may require a later revision of the firmware to function correctly.
Chapter 1, Introduction
Hardware and Firmware Enhancements
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Chapter 1, Introduction
Hardware and Firmware Enhancements
70
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2
Troubleshooting
This chapter tells how to isolate a problem to the defective assembly.
Troubleshooting is centered around the built-in diagnostics. If diagnostics can’t
identify the faulty assembly, supplementary information in the form of detailed
Block Diagrams (
descriptions of
chapter 11), Diagnost ics Descriptions (chapter 14), and
"Error Messages" on page 613 are provided.
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Chapter 2, Troubleshooting
How to Troubleshoot the Test Set
How to Troubleshoot the Test Set
This section explains the steps for troubleshooting the Test Set. Document the
result of each step in case you need to contact Hewlett-Packard for service
assistance.
ARE YOU SURE A
PROBLEM EXISTS?
Before troubleshooting the Test Set, you should attem pt to duplicate the problem
by performing the application where the suspected failure occurred. This is
especially important if the Test Set is being used in a new application where
misapplication, or incorrect operation of the Test Set may be invol ved.
If the Test Set fails in an application where it has worked correctly before, and
the unit-under-test is working correctly, a failure probably exists.
Step 1- Run the Power-up Diagnostic
On power-up, the Test Set runs a Self-Test Diagnostic. Most of the Test Set ’s digital
control functions are tested. The outcome of the test appears on the CRT (if operating)
and on four LEDs under the top cover.
Step 2- Run the Functional Diagnostic Routines
The RF, AF, Miscellaneous, and Digital diagnostic routines verify the proper
operation of most assemblies in the Test Set. If a problem is found, the suspected
faulty assembly is indicated, along with the level of confidence that replacing the
indicated module will correct the problem.
Step 3- Run the Periodic Calibration Routines
Operating parameters may drift over extended periods. Built-in calibration routines
adjust certain data latch settings to assure optimal Test Set operation. Applications
requiring operation at the limits of Test Set’s performance may fail if the Test Set is
not calibrated.
Step 4- Manual Troubleshooting
Suggestions of things to try include: using Performance Tests to verify specified
operation, and swapping assemblies.
These steps are illustrated on the next page. Instructions for performing these
steps are given in this chapter.
72
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If the Test Set powers-up normally, duplicate the application
where the problem exists to determine if the Test Set is not being
used properly or is being used beyond its warranted specifications
Chapter 2, Troubleshooting
How to Troubleshoot the Test Set
Does an image appear
No
on the display?
Yes
Do Power-up
Yes
Diagnostics
No
Run the Functional
Diagnostic routines.
Yes
Do diagnostics
indicate a failure?
No
Run the automated Periodic Adjustme nt/
Cal. routine.
Yes
Refer to figure 8, "Troubleshooting a Blank Display," on page
Refer to chapter 14, "Diagnostics Descriptions" and the
Error Messages information for probable causes.
If the reported confidence is high, replace the indicated assembly
and re-test. If confidence is medium or low, perform additional
checks (detailed in this chapter) to verify the failure.
Are any problems indicated
while calibrating?
Refer to the chapter 4, "Periodic Adjustments" and
"Error Messages" on page 613 for probable causes.
No
Perform any applicable performance tests.
Performance
test(s) failed?
Yes
Refer to the chapter 11 to isolate the failure; replace the suspected
assembly and re-test.
No
The Test Set is not failing.
Figure 6 Troubleshooting Flowchart
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Chapter 2, Troubleshooting
How to Troubleshoot the Test Set
Step 1- Run the Power-up Diagnostics
To start troubleshooting:
•Turn on the Test Set to automatically run the power-up diagnostics.
•After power-up, the top line of the Test Set’s display should show copyright
information and the firm ware revision code. The second line should disp lay
tests passed
•The CDMA CALL CONTROL screen should be displayed. Two conditions cause a
different screen to be displayed on power-up:
rA SAVE/RECALL register named POWERON was saved to automatically power-
up the box in a different state. Press the PRESET key before proceeding; this will
restore the Test Set to the factory power-up condition.
rThe
Autostart Test Procedure on Power-Up:
automatically run a loaded program. Press the SHIFT key, then press the CANCEL
key to stop the program. Press the PRESET key t o restore the Test Set to the factory
power-up condition.
All self
.
field is set to On to
To turn the autostart function off, press the TESTS key, then select
Execution Cond function (under the
autostart function is at the bottom of the screen; turn it
SET UP TEST SET:
Off
heading). The
.
If All self tests passed is displayed, run t he Funct ional Diagnos tics t o try
to locate the fault.
If the Test Set powers up with an error condition, or if the screen is blank:
"More About Step 1- Run the Power-Up Diagnostic" on page 79
.
See
74
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Chapter 2, Troubleshooting
How to Troubleshoot the Test Set
Step 2- Run the Functional Diagnostics
The Functional Diagnostics make measurements that test many of the circuits.
There are four Functional Diagnostics. The first three (Audio, RF, and CDMA
diagnostics) can be run in a loop mode after an initial setup. This is useful for
trapping intermittent failures. The fourth diagnostic (Miscellaneous Diagnostics)
requires a different setup for each test.
Functional Diagnostics should pinpoint faults in the AF, RF, and CDMA-related
circuits to the faulty assembly. When a measurement is out-of-limits, the
diagnostics post a mess age suggesti ng which assembly t o replace and the certainty
(low, medium, or high) of that suggestion. Before ordering replacement parts
(especially when the certainty is medium or low) or if you have difficulty in
understanding or running the Functional Diagnostics,
Run the Functional Diagnostics" on page 81
NOTE:The measurement limits of the Functional Diagnostic tests are valid only at r oom temperature;
(to run the Audio Diagnostics)
(to run the RF Diagnostics)
(to run the Miscellaneous Diagnostics)
(to run the CDMA Diagnostics)
SET UP TEST SET:
to view measurements only on the display.
to print the test results as well as display them on the CRT. The printer
Define Testing
Conditions
3. Set the
4. Set the
routines.
•
•
•
•
5. Under the
(Execution Conditions) screen.
6. Set
•
•
field to
field to load one of the diagnostic
area, select Execution Cond to access the TESTS
:
ROM
.
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Chapter 2, Troubleshooting
How to Troubleshoot the Test Set
is configured later in this procedure
7. Under
Output Results For:
•Select
•Select
8. Under
If Unit-Under-Test Fails:
•Select
•Select
9. Under
Test Procedure Run Mode:
All
to display (and print) all test information.
Failures
Continue
Stop
to only display (and print) failed test points.
to continue to the next test point.
to pause testing at that point.
•Select
•Select
10. Under
Autostart Test Procedure on Power-Up:,
Off
is
.
CONFIGURE A
PRINTER
Only perform this next step if you want to print test results to a printer, otherwise
go to step 16.
11. Press the TESTS key to return to the TESTS (Main Menu) screen.
12. Under
SET UP TEST SET:
Setup) screen.
13. Under
14. Set the
PRINT SETUP:
Printer Port:
If an HP-IB printer i s used, y ou need to enter the printer’s two- di gi t bus add ress when
Printer Adrs
the
press the SHIFT key, then the PREV key to access the I\O CONFIGURE screen, and
Mode
set the
15. Under
PAGE CONTROL:
FF at End:
and
Begin Testing16. Select the
Enter SHIFT-CANCEL to abort.
17. Choose the test or tests to run by selecting Up or
choosing
time, you should run “All xxx Tests” (xxx=Audio, RF, or CDMA).
18. Follow the instructions on the screen.
19. As the tests run, you can alter test execution conditions by selecting:
Continuous
Single Step
field appears (Example; enter 01 for bus address 701). Also,
field to
Control
) parameters if necessary.
Run Test
Select
field (or press K1) and wait for the “
. When running the Audio, RF, or CDMA diagnostics for the first
to run the tests continuously.
to pause after each measurement.
verify that the setting
Printer Setup
, select
, select the
Model:
of printer to use.
to access the TESTS (Printer
for the rear-panel connector your printer is connected to.
.
, set the
Lines/Page
: and Form Feed (
FF at Start:
Loading program -
” message to go away.
Down
to move the pointer and then
,
•Loop to run the test continuously.
•Pause to pause the tests.
•Stp Fail (stop-on-failure) to pause the tests when a failure is detected.
•Sgl Step (single-step) to pause the test after each measurement.
76
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Chapter 2, Troubleshooting
How to Troubleshoot the Test Set
1
2
5
USER
K1
K2
K3
K4
K5
Figure 7 Running the Functional Diagnostics
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Chapter 2, Troubleshooting
How to Troubleshoot the Test Set
If all Functional Diagnostics pass: Verify that the Test Set is functioning. Got to
step 3 below.
If any Functional Diagnostic fails: See "More About Step 2- Run the Functional
Diagnostics" on page 81
Step 3 - Verify Test Set Functions
Suggestions:
•Run all or a selected group of the Performance Tests. See chapter 5, "HP 8924C
Performance Verification" or .chapter 6, "HP 8924E Performance Verification"
•Run selected Periodic Calibration procedures. See chapter 4, "Periodic
Adjustments".
.
•Swap suspected assemblies with known-good ones. See "Swapping Known-Good
Assemblies" on page 94.
78
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More About Step 1- Run the Power- Up Diagnostic
More About Step 1- Run the Power-Up Diagnostic
If the Test Set powers up with the message:
Chapter 2, Troubleshooting
”All self tests passed.”
it is still possible to ha ve the follow ing digital
problems:
•Intermittent failure in any digital assembly.
•Input or output failure on any I/O port of the A14 Host Serial I/O assembly.
•Key failure (other than stuck keys) on the A1 Keyboard.
If all Self-Test Diagno stics pass, and th e fro nt-pan el key s and k nob work, you can
assume that the digital control assemblies work.
If the Test Set powers up with the message:
”One or more self-tests failed. Error code:<hexadecimal
error code>”
541
for further details on troubleshooting with the Self-Test Diagnostic.
If the Test Set fails to power-up at all:
•If there is no image on the display, see figure 8, "Troubl eshooting a Blank Di splay,"
on page 80.
•If an error message appears and remains in the center of the display, or if the Test Set
does not respond to any keys or HP-IB commands, the Test Set may be configured to
power-up to a custom procedure (r ather than the default screen) and that procedure may
have errors. This feature is initiated by setting
(Execution Conditions) screen. To correct this fault, turn the power off, then the power
on while holding down the MEAS RESET and Hz keys until an image appears on the
screen. Note: this will erase all existing programs and Save/Recall settings.
:See "Description Of Self-Test Diagnostic," in chapter 14, on page
Autostart
to
On
from the TESTS
•If the Test Set does not power-up properly, but the fan operates and the power supply
voltages are correct on the Filter regulator (A20) outputs, the Host Controller (A16 )
may be failing. It may be possible to run the Self-Test Diagnostic and read the test
results using the diagnostic LEDs on the Host Controller assembly. See "Description
Of Self-Test Diagnostic," in chapter 14, on page 541 for details.
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Chapter 2, Troubleshooting
More About Step 1- Run the Power-Up Diagnostic
Power up with
cover on.
Look through the rear panel for a
No
Fan runs?
lit LED on the Power Supply. If the
LED is not lit, the Power Supply is
faulty or is not getting mains power.
Yes
Beeps?
Yes
Remove instrument cover
and the cover over the A16
Host Controller. Turn
power off then back on.
LEDs DS1 to DS4 on
A16 light on power
up?*
LED flash sequence
indicates faulty CRT
Drive (A22)?
*
No
Power up again.
Is the intensity no rmal
then fades out?
No
At power
down does the
display flash?
Yes
Check rear-panel
CRT VIDEO OUTPUT.
Video OK?
No
Yes
No
Yes
No
Yes
No
Remove the instrument cover and the cover over the A16 Host
Controller. Turn power off then back on. Check TP 2 (top edge
of A16) for +5V. If +5V is presen t, the A1 6 assembly is f a ulty.
Controller (A16) or
memory bad (A17).
*The LEDs should all come on immediately after
power up, and then go off sev era l se conds after a beep is heard.
Replace the CRT Drive
(A22) assembly.
*The power up diagnostic LED seque nce
is described in chapter 11 - Diagnostics Descriptions.
Press [SHIFT] [TESTS]
[7] [ENTE R].
Faulty interconnect cable
or bad high voltage power
supply (A23) or CRT
(A3).
500 mV/div
Faulty CRT drive (A22).
Yes
Faulty CRT (A3).
Figure 8 Troubleshooting a Blank Display
80
500 µs/div
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More About Step 1- Run the Power- Up Diagnostic
More About Step 2- Run the Functional Diagnostics
USER Keys
The numbered control fields in the upper-right corner of the TESTS screens
correspond to the USER keys to the right of the screen.
Frequently Encountered Error Messages
Error messages that appear on the second line of the Test Set’s displ ay fr equently
occur while the Functional Diagnostics are running. The most complete and
general list of error messages is in the Error Messages chapter of the Test Set’s
User’s Guide . Some messages relating specifically to troubleshooting can be
found in the Error Messages chapter of this manual. Some of the messages you
can expect to occur while running the Functional Diagnostics are as follows:
Chapter 2, Troubleshooting
Functional Diagnostics measurements commonly generate the message
”Direct latch write occurred. Cycle power when done
servicing.”
The message appears the first time the diagnostic pro gram directly
addresses a latch. T he message s hould be i gnored unt il you wis h to make a n ormal
(not a diagnostic) measurement with the Test Set. To clear this message the Test
Set should be turned off and back on again.
The message
”Printer does not respond.” usually indicates that one or
more settings on the TESTS (Printer Setup) screen are set wrong for your printer.
Also, check that the printer’s power is on and that it is correctl y cabled. For HP-IB
printers make su re the prin ter i s cor rectl y addr essed . If a seri al pr inter is used, yo u
may have to change the serial communication settings on the I/O CONFIGURE
screen (press SHIFT then PREV to get to this screen). The message times-out
after a few seconds, a nd the output dest ination is change d to CRT by the progr am.
Some error messages you might encounter when running the Functional
Diagnostics are the following:
”ERROR 173 IN XXXX Active/system controller req’d” (where
”XXXX” represents a line number) indicates that the Test Set’s internal IBASIC
computer must be set as a system controller for some reason. This usually
indicates that the
HP-IB but the Mode field on the I/O CONFIGURE screen is set to
set to
Talk&Lstn instead of Control. Change the mode setting to Control and run
Printer Port field of the TESTS (Printer Setup) screen was
the diagnostic again.
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Chapter 2, Troubleshooting
More About Step 1- Run the Power-Up Diagnostic
Timeouts
Certain failures may cause a frequency or voltage reading to timeout, that is, the
time required for t he measurement will be unreasonably long. I f a timeout occurs ,
measurement execution will stop and an error message will be displayed.
•If frequency or voltage readings have been successfully made before the timeout, the
assembly currently being tested or a multiplexer o n the A37 Measurement assembly
may be at fault.
•If most measurements fail, the A27 Reference assembly may be faulty in supplying
clock signals to the A37 Measurement assembly.
•Re-run the test to see if the timeout is intermittent.
The Four Functional Diagnostics
The Functional Diagnostics are contained in four independent program files.
Before ordering a replacement assembly based on the diagnostics, you should
read the descriptions of the diagnostic tests.
Descriptions"
. See also chapter 11, "Block Diagrams".
See chapter 14, "Diagnostics
Audio Diagnostics (AFDIAGS3)
This program tests the audio functions of the following assemblies:
•A36 Audi o Analyzer 2
•A35 Audi o Analyzer 1
•A34 Modulation Distribution
•A15 Signalling Source/Analyzer (AF Generators 1 and 2 only)
•A37 Measurement (only a few selected inputs)
After initial cabling, all tests can be run in a loop mode without further
intervention. This makes it easier to catch intermittent failures.
NOTE:The measurement limits of the Functional Diagnostic tests are valid only at room temperature;
that is, 20 to 25°C or 65 to 75°F.
When a test fails, a diagnosis is given in three parts:
•A diagnostic code .
•The name of the assembly or assemblies most likely to have failed.
•A rating (high, medium, or low) of the confidence of the diagnosis.
Before ordering an assembly based on the diagnosis, you should read the
description of the diagnostic test and details of the diagnosis based on the
diagnostic code.
"Block Diagrams"
See chapter 14, "Diagnostics Descriptions". See also chapter 11,
.
82
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Chapter 2, Troubleshooting
More About Step 1- Run the Power- Up Diagnostic
RF Diagnostics (RFDIAGS3)
This program tests the RF functions of the following assemblies:
•A19 Receiver 1st Mixer
•A26 Output
•A24 Signal Generator Synthesizer
•A27 Reference
•A30 Receiver
•A28 Receiver Synthesizer
•A32 Spectrum Analyzer
•A5 Input
Some tests require cabling before the RF Diagnostics can be run; but all tests can
be run in a loop mode without further intervention. Running in loop mode makes
it easier to catch intermittent failures.
NOTE:The measurement limits of the Functional Diagnostic tests are valid only at r oom temperature;
that is, 20 to 25°C or 65 to 75°F.
When a test fails, a diagnosis is given in two parts:
•The name of the assembly or assemblies most likely to have failed.
•A rating (high, medium, or low) of the confidence of the diagnosis.
The diagnosis given by the RF Diagnostics should be verified by other means
before ordering and replacing parts. This particularly applies to the Spectrum
Analyzer, Receiver, and Receiver Mixer assemblies. Some suggestions for doing
this are as follows:
•Become familiar with the block diagram and theory of operation of the assemblies in
chapter 11, "Block Diagrams".
•Read the description of the diagnostic test in chapter 14, "Diagnostics Descriptions".
•Follow the suggestions in "Further Isolating RF Failures" on page 96 later in this
chapter.
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Chapter 2, Troubleshooting
More About Step 1- Run the Power-Up Diagnostic
Miscellaneous Diagnostics ( MSDIAGS3)
This program verifies the following:
• The ability of the A27 Reference to detect the presence of the A29 CDMA Reference
signal and its ability to lock to that signal.
•The integrity of the front-panel RF IN/OUT, DUPLEX OUT, and ANT IN connectors.
•The Self-Test Diagnostics, and power supply voltages. The Self-Test Diagnostics are
described in detail in "Description Of Self-Test Diagnostic" on page 541.
•Serial bus communication
The Miscellaneous Diagnostics cannot be run in a loop mode.
CDMA Diagnostics (CDMADIAG)
This program tests the following parameters:
•CDMA Reference (A29): 20MHz VCXO tune voltage and phase-lock status,
19.6608MHz VCXO tune voltage and phase-lock status, and AWGN (noise) source’s
status.
•LO/IF Demod (A31): 117.9864MHz local oscillator (LO) bias and tune voltage,
3.686MHz IF sense, 114.3MHz IF sense, Spectrum Analyzer path sense, supply
voltages references, and IQ Demodulator LO tune voltage and sense.
•IQ Modulator (A25): RF Input detection, IQ output detection, baseband I and Q
detection, I signal gain, various modulator control levels.
•Cell Site Analog (A8): Cell Site 1&2 video DAC references, Cell Site 1 I and Q gain
control DAC voltage, I and Q summing amplifier outputs.
84
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More About Step 1- Run the Power- Up Diagnostic
Troubleshooting Aids
Refer to following tabl e to dete rmine whi ch Diagnos tic Tes ts, Per formance Tests,
and Periodic Self Calibration Adjustments apply to an assembly. Downloading
calibration data is discussed in
Table 4Relating Assemblies To Troubleshooting Aids
chapter 3, "Repair," on page 101.
Chapter 2, Troubleshooting
Troubleshooting with
Ref.
Des.
Assembly
Name
Diagnostics (Chapter 2)
Power-
Up Self
a
Tests
ROM
A1KeyboardXMS DIAGS3:
Performance
Verification
(Chapter 5)
Periodic
Adjustments
Cal
(Chapter 4)
No
(Self Test)
A2Keyboard FiltersNo
A3CRT No
A4 AttenuatorMS DIAGS3:
Yes
(RF In/Out)
A5Input RF DIAGS3:
(Input)
A6Protocol
Processor
A7Cell Site
Digital 2
XMS DIAGS3:
(Self-Test)
XMS DIAGS3:
(Self_Test)
RF Generator
(Level
Accuracy)
Receiver Mixer
b
Attenuator
Generic Cable
PCB_CALNo
Yes
No
Cal-
Data
Needed
After
Repl ?
A8Cell Site Analog CDMADIAG
(Cell Site)
Power Sensor
Zero
PCB_CAL
A9Cell Site
Digital 1
XMS DIAGS3:
(Self Test)
PCB_CALNo
A10Vocoder
(Option)
A11 DSP Receiver
(Optional)
A12 DSP ReceiverNo
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85
Yes
No
Page 86
Chapter 2, Troubleshooting
More About Step 1- Run the Power-Up Diagnostic
Table 4Relating Assemblies To Troubles hooting Aids (Continued)
Troubleshooting with
Ref.
Des.
A14Host
Serial I/O
Assembly
Name
Diagnostics (Chapter 2)
Power-
Up Self
Tests
a
ROM
XMS DIAGS3:
(Self Test)
Interface
A15Signaling
Source/Analyzer
XAF DIAGS3:
(Audio
Frequency
Generators 1
and 2)
A16Host
Controller
XMS DIAGS3:
(Self Test)
A17MemoryXMS DIAGS3:
(Self Test)
A19Receiver
1st Mixer
RF DIAGS3:
(Receiver)
A20Filter/ RegulatorMS DIAGS3:
(Self-Test)
Performance
Verification
(Chapter 5)
Periodic
Adjustments
Cal
(Chapter 4)
Needed
Repl ?
No
No
No
No
Receiver MixerYes
No
Cal-
Data
After
A21FanNo
A22CRT DriveXMS DIAGS3:
(Self Test)
A23Power
Supply
MS DIAGS3:
(Self Test)
Connections
A24Signal
Generator
Synthesizer
A25I/Q
Modulator
86
RF DIAGS3:
(Signal
Generator
Synthesizer)
CDMADIAG
(I/Q Mod)
RF Generator:
(Harmonic and
Spurious
Spectral Purity)
I/Q Mod
PCB_CAL
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No
No
Yes
Yes
Page 87
More About Step 1- Run the Power- Up Diagnostic
Table 4Relating Assemblies To Troubles hooting Aids (Continued)
Chapter 2, Troubleshooting
Troubleshooting with
Ref.
Des.
Assembly
Name
Diagnostics (Chapter 2)
Power-
Up Self
a
Tests
ROM
A26OutputRF DIAGS3:
(Output)
A27ReferenceRF DIAGS3:
(Reference)
A28Receiver
Synthesizer
RF DIAGS3:
(Receiver
Synthesizer)
A29CDMA
Reference
CDMADIAG
(CDMA Ref.)
A30ReceiverRF DIAGS3:
(Receiver)
Performance
Verification
(Chapter 5)
AF Generator:
(AM Accuracy)
RF Generator:
(Residual FM)
RF Analyzer:
(Residual FM)
RF Analyzer:
(AM
Accuracy and
FM Accuracy)
Periodic
Adjustments
Cal
(Chapter 4)
Attenuator
Needed
Repl ?
Yes
Generic Cable
Timebase
Yes
Reference
Yes
Power
Yes
Sensor Zero
PCB_CAL
Receiver MixerYes
Cal-
Data
After
A31LO/IF DemodCDMADIAG
(LO/IF
Demod)
A32Spectrum
Analyzer
(8924E Option)
A33Control
Interface
A34Modulation
Distribution
XMS DIAGS3:
RF DIAGS3:
(Spectrum
Analyzer)
(Self Test)
AF DIAGS3:
(Mod
Distribution
Internal Paths)
A35Audio
Analyzer 1
AF DIAGS3:
(Audio Analyzer 1 Internal Paths)
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87
Spectrum
Analyzer
AF Generator:
(AC Level
Accuracy)
Receiver MixerNo
Receiver MixerYes
Yes
AF Gen Gain EXT
No
Mod Path Gain
Audio Analyzer Offset
Audio
No
Analyzer
Offset
Page 88
Chapter 2, Troubleshooting
More About Step 1- Run the Power-Up Diagnostic
Table 4Relating Assemblies To Troubles hooting Aids (Continued)
Ref.
Des.
Assembly
Name
A36Audio
Analyzer 2
A37Measurement
Troubleshooting with
Diagnostics (Chapter 2)
Power-
Up Self
a
Tests
AF DIAGS3:
(Audio
Analyzer 2)
c
XMS DIAGS3:
(Self Test)
ROM
Performance
Verification
(Chapter 5)
AF Analyzer:
(AC Voltage
Periodic
Adjustments
(Chapter 4)
VFN
(a must)
Accuracy)
OscilloscopeVoltmeter
Reference
Cal
Cal-
Data
Needed
After
Repl ?
Yes
Yes
A38Oven OscillatorTimebase AdjustNo
A3937-Pin
No
Filter
A40MotherboardNo
a.Besides checking the assemblies marked X, the power-up self test checks the serial data lines which the controller uses to send control signals to and receive status signals from the RF and AF assemblies.
b.HP 8924E: Required if Spectrum Analyzer is installed.
c.Measurement checked indirectly by all diagnostics.
88
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More about Step 4 - Verify Test Set Functioning
More about Step 4 - Verify Test Set Functioning
See "Locating the Out-Of-Lock (OOL) Indicators" on page 89
Out-of-lock (OOL) LEDs light when a phase-locked loop inside an assembly is failing.
The Signal Generator Synthesizer (A24), Receiver Synthesizer (A28), CDMA Reference
(A29), and LO/IF Demod (A31) assemblies have these LEDs mounted close to the top of
the modules. The location of each LED is labeled on the assembly.
Chapter 2, Troubleshooting
RCVR SYNTH
SIG GEN SYN TH
CDMA REFERENCE (2)
LO/IF DEMOD(2)
Figure 9 Locating the Out-Of-Lock (OOL) Indicators
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Page 90
Chapter 2, Troubleshooting
More about Step 4 - Verify Test Set Functioning
Isolating Out-of-Lock Conditions
If more than one OOL indicator is lit.
CDMA Reference and LO/IF Demod: If the CDMA Reference is unlocked, the
LO/IF Demod assembly will be unlocked, since its reference comes from the
CDMA Reference. Verify that the CDMA Reference (A29) is working correctly
before troubleshooting the LO/IF Demod assembly.
Receiver Synthesizer and Signal Generator Synthesizer: If both assemblies are
unlocked, the Reference (A27) is the probable cause, since it provides the
reference for both assemblies.
90
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CDMA Reference (A29) Unlocked
1. Verify that the rear-panel 10 MHz Oven Out signal is at 10 MHz, and at a level of
0 dBm ±3 dB into 50 Ω.
2. Connect a BNC cable between the 10 MHz Oven Out and REF IN ports.
3. Press the SHIFT key, then press the TESTS key to access the CONFIGURE screen.
4. Set the
5. If the OOL indicator is lit on the CDMA Reference (A29) assembly, replace the
assembly and re-test.
.
External Reference
Chapter 2, Troubleshooting
More about Step 4 - Verify Test Set Functioning
field to
10.0000 MHz
(if not already set).
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Chapter 2, Troubleshooting
More about Step 4 - Verify Test Set Functioning
LO/IF Demod (A31) Unlocked
This assembly is phase-locked to a signal from the CDMA Reference. If the
CDMA Reference is out-of-lock, troubleshoot that assembly first before
proceeding.
1. Turn the Test Set off.
2. Remove the rear assemblies cover (two assembly pry tools are removed in the process).
3. Use the pry tools to remove the LO/IF Demod assembl y.
4. Turn the Test Set on.
5. Verify that a 10 MHz signal of about 0 dBm is present on pin 19 of J72. This is the
reference signal from the CDMA Reference assembly.
6. If the signal is present, replace the LO/IF Demod assembly.
If the 10 MHz signal is not present, an open or shorted trace on the Motherboard
assembly (A40) may be the cause. Check for continuity between J72 pin 19 (under the
LO/IF Demod assembly) and J69 pin 19 (under the CDMA Reference assembly), and
verify that the trace is not shorted to ground.
92
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Page 93
Receiver Synthesizer (A28) Unlocked
1. Turn the Test Set off.
2. Remove the rear assemblies cover (two assembly pry tools are removed in the process).
3. Use the pry tools to remove the Receiver Synthesizer assembly.
4. Turn the Test Set on.
5. Verify that a 1 MHz signal of about - 1 dBm is present on pin 3 of J40. This is the
reference signal from the Reference assembly.
6. If the signal is present, replace the Receiver Synthesizer assembly.
If the 1 MHz signal is not present, the Reference (A27) assembly is pro bably faulty. It
is also possible that an open or shorted trace on the Motherboard assembly (A40)
exists. Check for continuity between J40 pin 3 (under the Receiver Synthesizer) and
J34 pin 2 (under the Reference assembly), and verify that the trace is not shorted to
ground.
Signal Generator Synthesizer (A24) Unlocked
1. Turn the Test Set off.
2. Remove the rear assemblies cover (two assembly pry tools are removed in the process).
3. Use the pry tools to remove the Receiver Synthesizer assembly.
4. Turn the Test Set on.
5. Verify that a 1 MHz signal of
signal from the Reference assembly.
6. If the signal is present, replace the Signal Generator Synthesizer assembly.
Chapter 2, Troubleshooting
More about Step 4 - Verify Test Set Functioning
≥ −20
dBm is present on pin 3 of J31. Th is is the referen ce
If the 1 MHz signal is not present, the Reference (A27) assembly is pro bably faulty. It
is also possible that an open or shorted trace on the Motherboard assembly (A40)
exists. Check for continuity between J31 pin 3 (under the Signal Generator
Synthesizer) and J34 pin 1 (unde r the Refer ence assem bly), and ver ify that the trace is
not shorted to ground.
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Chapter 2, Troubleshooting
More about Step 4 - Verify Test Set Functioning
Swapping Known-Good Assemblies
Swapping a known-good assembly for a suspected faulty assembly performed
Most swapped assemblies which use calibration data will operate well enough
with the original assembly’s calibration data to troubleshoot and to run the
diagnostics; do not ex pect the Tes t Set to meet its speci fications . Some assembli es
may appear to fail because of incorrect calibration data. It is also important to
keep track of the original assemblies in the Test Set. If calibration data is lost, the
assembly will have to be sent back to the factory.
Calibration data is generally stored in a socketed EEPROM on the A16 Host
Controller. If the con troller is rep laced or swapped, the original EEPROM must be
put in the new Test Set’s Controller. Should the EEPROM lose its data, the entire
instrument will require a fac tory recalibration.
The assemblies that require down-loaded calibration data from a memory card
are:
•A19 Receiver 1st Mixer
•A26 Output
•A24 Signal Generator Synthesizer
•A27 Reference
•A30 Receiver
•A28 Receiver Synthesizer
•A32 Spectrum Analyzer (optional in some Test Sets)
•A37 Measurement
•A33 HP-IB/RS-232/Current Sense
•A5 Input
•A4 Attenuator
Of these assemblies the A5 Input is the least likely candidate for a successful
assembly swap.
The A32 Spectrum Analyzer may also pose difficulties. To verify operation, first
set the Spectrum Analyzer’s
field to
Dupl. This directs the Tracking Generator to the DUPLEX OUT port.
Connect the DUPLEX port to the ANT IN port. Set the
Center Freq to 501 MHz, and the Span to 1 GHz. You should see a
the
(roughly) flat line across the screen, varying about 4dB. “
truncated
” may appear - but does not indicate a problem.
RF Gen controls to Track, and the Port/Sweep
Main control to Ant. Set
Generator sweep
94
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Chapter 2, Troubleshooting
More about Step 4 - Verify Test Set Functioning
Some assemblies require that a periodic calibration procedure be run. These are:
•A36 Audio Analyzer 2 (variable-frequency notch filter null if present)
•A35 Audi o Analyzer 1 (D C offset)
•A34 Modulation Distribution (DC offset, extern al amplifier gain)
•A27 Reference (time base frequency)
•A37 Measurement (voltage references)
•A29 CDMA Reference
•A31 LO/IF Demod
•A25 IQ Modulator
•A8 Cell Site Analog
For general troubleshooting, these assemblies can generally be swapped without
an immediate need of recalibration.
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Chapter 2, Troubleshooting
Further Isolating RF Failures
Further Isolating RF Failures
Isolating failures in the RF assemblies of the Test Set can be difficult. One
problem is that the RF Diagnostics sometimes use the built-in RF analyzer to test
the built-in RF source, and vice versa. This is necessary to make the diagnostics
self-contained, that is, they run without external equipment.
Before using the helps in this section, run all of the RF Diagnostics (
About Step 2- Run the Fu nctional Di agnost ics," in chapter 2, o n page 8 1
see "More
) It will also
be helpful to become familiar with:
•the RF source and analyzer block diagrams and theory of operation in chapter 11,
"Block Diagrams"
•the description of the RF and Miscellaneous Diagnostic tests in chapter 14,
"Diagnostics Descriptions".
Some general-purpose, RF test equipment will be needed:
•RF signal generator
•RF modulation analyzer or spectrum analyzer.
96
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Isolating Input and Output Failures
If all RF diagnostic tests pass, there could still be a problem with the input and
output paths (including reverse-power and overpower protection). Run the
Miscellaneous Diagnostics test titled RF Input Output Test. A failure indicates
that the input section or front-panel connection is faulty.
Isolating the RF Analyzer
The RF Analyzer function uses the following assemblies. (Refer to block
diagrams in
•A5 Input
•A19 Receiver First Mixer
•A30 Rece iver 1st
chapter 11, "Block Diagrams".)
Chapter 2, Troubleshooting
Further Isolating RF Failures
•A28 Receiver Synthesizer
•A32 Spectrum Analyzer
•A29 CDMA Reference and A27 Reference (for downconversion).
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Chapter 2, Troubleshooting
Further Isolating RF Failures
To isolate an RF Analyzer problem:
•On the Test Set:
•Press PRESET.
•Press the SHIFT key, then press the TESTS key to access the CONFIGURE screen.
rSet the
rSet the
RF Display
RF Offset
field to
field to
Freq
Off
.
.
•Locate the ANLG SCRNS (Analo g Screens) group of keys and pres s the TX TES T
key (to go to the analog TX TEST screen).
rSet the
Tune Mode
Auto
to
. This enables the Test Set to automatically tune
the receiver to a strong RF signal.
rSet the
Input Port
to
RF IN
.
•On the external RF signal generator:
•Set the frequency to 100 MHz CW.
•Set the amplitude to 0 dBm.
•Connect the output to the Test Set’s RF IN/OUT connector.
•Set the RF signal generator frequency to 100, 500 , and 9 00 MHz. For each fr equen c y,
the Test Set’s measurements should read as follows:
•TX POWER should read approximately 0.001 W for each frequency.
•TX FREQUENCY should read 100, 500, and 900 MHz respectively.
•Press the SHIFT key, then press the RF GEN key to access the analog Spectrum
Analyzer. Observe the level and frequency of the signal. Press PREV to return to
the TX TEST screen.
98
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Chapter 2, Troubleshooting
Further Isolating RF Failures
Refer to the block diagrams in chapter 11, "Block Diagrams". The down
conversion frequencies for the three input frequencies are shown in the following
table.
Table 5Deriving Output Frequencies
Input
Frequency
(MHz)
First LO
Frequency
(MHz)
IF From
First Mixer
100714.3614.3
500614.3114.3
900785.7114.3
(MHz)
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Chapter 2, Troubleshooting
Further Isolating RF Failures
Isolating the RF Source
The RF Generator function uses the following assemblies. Refer to the block
diagrams in
•A27 Reference and A29 CDMA Reference
•A24 Signal Generator Synthesizer
•A26 Output
•A5 Input
To isolate t he RF Source:
•On the Test Set:
•Press PRESET.
•Press the SHIFT key, then press the TESTS key to access the CONFIGURE screen.
chapter 11, "Block Diagrams".
rSet the
rSet the
•Locate the ANLG SCRNS group of keys and press the RX TEST key (to go t o the
analog RX TEST screen).
•Set
•Set
•Set
•On the external RF modulation analyzer or spectrum analyzer:
•Set the tuning for a 600 MHz, 0 dBm input signal.
•Connect the analyzer’s input to the Test Set’s DUPLEX OUT connector.
•Set the Test Set’s
external RF analyzer should read as follows:
•Power should read approximately 0.001 W for each frequency.
Frequency should read 600, 300, and 150 MHz respectively.
RF Display
RF Offset
RF Gen Freq
Amplitude
Output Port
to
RF Gen Freq
field to
600 MHz
to
0 dBm
Dupl
to
field to
Freq
.
Off
.
.
.
.
to 600, 300, and 150 MHz. For each frequency, the
100
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