Agilent 6N139, 6N138, HCPL-0701, HCPL-0700, HCNW139 User Guide

Low Input Current, High Gain
Optocouplers

Technical Data

6N139 6N138
HCPL-0701 HCPL-0700
HCNW139 HCNW138

Features

• High Current Transfer Ratio
– 2000% Typical (4500%
Typical for HCNW139/138)

• Low Input Current
Requirements – 0.5 mA

• TTL Compatible Output –

0.1 V VOL Typical

• Performance Guaranteed
over Temperature 0°C
to 70°C

• Base Access Allows Gain
Bandwidth Adjustment

• High Output Current –
60 mA

• Safety Approval

UL Recognized – 3750 V rms

for 1 Minute and 5000 V rms*

for 1 Minute per UL 1577
CSA Approved
IEC/EN/DIN EN 60747-5-2
Approved with V
V peak for HCNW139 and
HCNW138

• Available in 8-Pin DIP or
SOIC-8 Footprint or
Widebody Package

• MIL-PRF-38534 Hermetic
Version Available (HCPL­5700/1)

IORM

= 1414

Applications

• Ground Isolate Most Logic
Families – TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/
TTL, CMOS/LSTTL

• Low Input Current Line
Receiver

• High Voltage Insulation
(HCNW139/138)

• EIA RS-232C Line Receiver

• Telephone Ring Detector

• 117 V ac Line Voltage Status
Indicator – Low Input Power
Dissipation

• Low Power Systems –
Ground Isolation

Functional Diagram

NC

ANODE

CATHODE

NC

1

2

3

4

8

V

7

V

6

V

5

GND

Description

These high gain series couplers
use a Light Emitting Diode and an
integrated high gain photodetec­tor to provide extremely high
current transfer ratio between
input and output. Separate pins
for the photodiode and output
stage result in TTL compatible
saturation voltages and high
speed operation. Where desired
the VCC and VO terminals may be
tied together to achieve conven­tional photodarlington operation.
A base access terminal allows a
gain bandwidth adjustment to be
made.

CC

B

O

TRUTH TABLE

LED

ON

OFF

V



LOW
HIGH

O



*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only.
A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.

2

The 6N139, HCPL-0701, and
CNW139 are for use in CMOS,
LSTTL or other low power appli­cations. A 400% minimum current
transfer ratio is guaranteed over
0 to 70°C operating range for only

0.5 mA of LED current.

(1 TTL Unit load ). A 300%
minimum CTR enables operation
with 1 TTL Load using a 2.2 kΩ
pull-up resistor.

Selection for lower input current
down to 250 µA is available upon
request.

The SOIC-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface

mount processes.
The 6N138, HCPL-0700, and
HCNW138 are designed for use
mainly in TTL applications.
Current Transfer Ratio (CTR) is
300% minimum over 0 to 70°C
for an LED current of 1.6 mA

The HCPL-0701 and HCPL-0700
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.

The HCNW139 and HCNW138

are packaged in a widebody

encapsulation that provides creep-

age and clearance dimensions

suitable for safety approval by

regulatory agencies worldwide.

Selection Guide

Widebody

8-Pin DIP Package Hermetic

(300 Mil) Small Outline SO-8 (400 mil) Single and

Dual Single Dual Minimum Absolute Dual

Single Channel Channel Channel Single Input ON Maxi- Channel
Channel Package Package Package Channel Current Minimum mum Packages
Package HCPL- HCPL- HCPL- Package (I

4731

[1]

[1]

[1]

0701 0731 HCNW139 0.5 mA 400% 18 V
0700 0730 HCNW138 1.6 mA 300% 7 V

070A

[1]

073A

[1]

6N139 2731

6N138 2730

HCPL-4701

[1]

) CTR V

F

40 µA 800% 18 V

0.5 mA 300% 20 V 5701

CC

HCPL-

[1]
[1]

5700

[1]

5731

[1]

5730

Note:

1. Technical data are on separate Agilent publications.

3

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

6N139#XXXX

020 = 5000 V rms/1 Minute UL Rating Option*
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option

Option data sheets available. Contact your Agilent sales representative or authorized distributor for
information.

*For 6N139 and 6N138 only.
†Gull wing surface mount option applies to through hole parts only.

Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July
2001 and lead free option will use “-”

Schematic

2

ANODE

+

V

F

CATHODE

–
3

V

CC

8

I

CC

I

F

I

O

6

V

O

5

GND

SHIELD

I

B

7

V

B

Package Outline Drawings

8-Pin DIP Package (6N139/6N138)**

4

7.62 ± 0.25

(0.300 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

5° TYP.

0.254

(0.010

TYPE NUMBER

1.19 (0.047) MAX.

3.56 ± 0.13

(0.140 ± 0.005)

1.080 ± 0.320

(0.043 ± 0.013)

9.65 ± 0.25

(0.380 ± 0.010)

A XXXXZ



YYWW

5678

OPTION CODE*
DATE CODE

UR

UL

4321

RECOGNITION

1.78 (0.070) MAX.

4.70 (0.185) MAX.

2.92 (0.115) MIN.

0.65 (0.025) MAX.

2.54 ± 0.25

(0.100 ± 0.010)

0.51 (0.020) MIN.

DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS

"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

**JEDEC Registered Data.

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)

+ 0.076

- 0.051

+ 0.003)

- 0.002)

1.19

(0.047)

MAX.

1.080 ± 0.320

(0.043 ± 0.013)

LAND PATTERN RECOMMENDATION

9.65 ± 0.25

(0.380 ± 0.010)

6

7

8

1

2

2.54

(0.100)

BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).


NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

5

6.350 ± 0.25

(0.250 ± 0.010)

3

4

1.27 (0.050)

1.780

(0.070)

MAX.

3.56 ± 0.13

(0.140 ± 0.005)

0.635 ± 0.130

(0.025 ± 0.005)

(0.380 ± 0.010)

(0.300 ± 0.010)

0.635 ± 0.25

(0.025 ± 0.010)

1.016 (0.040)

9.65 ± 0.25

7.62 ± 0.25

10.9 (0.430)

2.0 (0.080)

0.254

(0.010

12° NOM.

+ 0.076

- 0.051

+ 0.003)

- 0.002)

5

Small Outline SO-8 Package (HCPL-0701/HCPL-0700)

8765

3.937 ± 0.127

(0.155 ± 0.005)

PIN ONE

0.406 ± 0.076

(0.016 ± 0.003)

3.175 ± 0.127

(0.125 ± 0.005)

TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)

*

5.207 ± 0.254 (0.205 ± 0.010)

DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.


NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.

XXX

YWW

*

5.080 ± 0.127

(0.200 ± 0.005)

4321

1.270

(0.050)

5.994 ± 0.203

(0.236 ± 0.008)

TYPE NUMBER
(LAST 3 DIGITS)

DATE CODE

BSC

1.524

(0.060)

7°

0 ~ 7°

LAND PATTERN RECOMMENDATION

0.64 (0.025)

0.432

45° X

(0.017)

(0.009 ± 0.001)

0.203 ± 0.102

(0.008 ± 0.004)

0.305

MIN.

(0.012)

7.49 (0.295)

1.9 (0.075)

0.228 ± 0.025

8-Pin Widebody DIP Package (HCNW139/HCNW138)

11.15 ± 0.15

(0.442 ± 0.006)

6

5

TYPE NUMBER
DATE CODE



3

4

1.55

(0.061)

MAX.

3.10 (0.122)

3.90 (0.154)

0.40 (0.016)

0.56 (0.022)

2.54 (0.100)
TYP.

1.78 ± 0.15

(0.070 ± 0.006)

7

8

HCNWXXXX

1

2

A 

YYWW

11.00

MAX.

(0.433)

9.00 ± 0.15

(0.354 ± 0.006)

10.16 (0.400)
TYP.

7° TYP.

5.10

MAX.

(0.201)

0.51 (0.021) MIN.

DIMENSIONS IN MILLIMETERS (INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

0.254

(0.010

+ 0.076

- 0.0051
+ 0.003)

- 0.002)

6

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)

1.78 ± 0.15

(0.070 ± 0.006)

11.15 ± 0.15

(0.442 ± 0.006)

6

3

2.54

(0.100)

BSC

5

(0.354 ± 0.006)

4

1.55

(0.061)

MAX.

9.00 ± 0.15

4.00

MAX.

(0.158)

(0.030 ± 0.010)

7

8

1

2

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

LAND PATTERN RECOMMENDATION

1.3

(0.051)

0.75 ± 0.25

(0.039 ± 0.006)

12.30 ± 0.30

(0.484 ± 0.012)

11.00

MAX.

(0.433)

1.00 ± 0.15

2.29

(0.09)

7° NOM.

13.56

(0.534)

0.254

(0.010

+ 0.076

- 0.0051
+ 0.003)

- 0.002)

Solder Reflow Temperature Profile

300

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

ROOM

TEMPERATURE

200

160°C
150°C
140°C

100

TEMPERATURE (°C)

0

0

3°C + 1°C/–0.5°C

50 150100 200 250

2.5°C ± 0.5°C/SEC.

PREHEATING TIME

150°C, 90 + 30 SEC.

TIME (SECONDS)

PEAK

TEMP.

245°C

30

SEC.

SEC.

30

SOLDERING

TIME

200°C

50 SEC.

PEAK
TEMP.
240°C

PEAK

TEMP.

230°C

TIGHT
TYPICAL
LOOSE

Pb-Free IR Profile

T

p

217 °C

T

L

T

smax

T

smin

TEMPERATURE

150 - 200 °C

3 °C/SEC. MAX.

60 to 180 SEC.

RAMP-UP

t

s

PREHEAT

260 +0/-5 °C

TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE

t

p

15 SEC.

RAMP-DOWN
6 °C/SEC. MAX.

t

L

60 to 150 SEC.

7

25

NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T

= 200 °C, T

smax

Regulatory Information

The 6N139/138, HCNW139/138,
and HCPL-0701/0700 have been
approved by the following
organizations:

t 25 °C to PEAK

= 150 °C

smin

TIME

UL

Recognized under UL 1577,
Component Recognition Program,
File E55361.

CSA

Approved under CSA Component

IEC/EN/DIN EN 60747-5-2

Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(HCNW139/138 only)

Acceptance Notice #5, File CA

88324.

Insulation and Safety Related Specifications

8-Pin DIP Widebody

(300 Mil) SO-8 (400 Mil)

Parameter Symbol Value Value Value Units Conditions

Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals
Air Gap (External to output terminals, shortest
Clearance) distance through air.

Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals
Tracking (External to output terminals, shortest
Creepage) distance path along body.

Minimum Internal 0.08 0.08 1.0 mm Through insulation distance,
Plastic Gap conductor to conductor, usually
(Internal Clearance) the direct distance between the

photoemitter and photodetector
inside the optocoupler cavity.

Minimum Internal NA NA 4.0 mm Measured from input terminals
Tracking (Internal to output terminals, along
Creepage) internal cavity.

Tracking Resistance CTI 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)

Isolation Group IIIa IIIa IIIa Material Group

(DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

8

IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW139 and HCNW138)

Description Symbol Characteristic Units

Installation Classification per DIN VDE 0110/1.89, Table 1

for rated mains voltage ≤ 600 V rms I-IV
for rated mains voltage ≤ 1000 V rms I-III

Climatic Classification 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage V
Input to Output Test Voltage, Method b*

VPR = 1.875 x V

, 100% Production Test with tP = 1 sec, V

IORM

Partial Discharge < 5 pC

Input to Output Test Voltage, Method a*

VPR = 1.5 x V

, Type and Sample Test, V

IORM

tP = 60 sec, Partial Discharge < 5 pC

Highest Allowable Overvoltage*
(Transient Overvoltage, t

= 10 sec) V

ini

Safety Limiting Values

(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)

Case Temperature T
Current (Input Current IF, PS = 0) I
Output Power P

S,INPUT

S,OUTPUT

Insulation Resistance at TS, VIO = 500 V R

IORM

PR

PR

IOTM

S

S

1414 V peak

2652 V peak

2121 V peak

8000 V peak

175 °C
400 mA
700 mW

9

> 10

Ω

*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN
60747-5-2, for a detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in

application.

Absolute Maximum Ratings* (No Derating Required up to 85°C)

Parameter Symbol Min. Max. Units

Storage Temperature T
Operating Temperature** T
Average Forward Input Current I
Peak Forward Input Current I

(50% Duty Cycle, 1 ms Pulse Width)

Peak Transient Input Current I

(<1 µs Pulse Width, 300 pps)

Reverse Input Voltage V

HCNW139/138 3 V
Input Power Dissipation P
Output Current (Pin 6) I
Emitter Base Reverse Voltage (Pin 5-7) V

S

A

F(AVG)

FPK

F(TRAN)

R

I

O

EB

9

-55 125 °C

-40 85 °C

20 mA
40 mA

1.0 A

5V

35 mW
60 mA

0.5 V

Supply Voltage and Output Voltage V

CC

-0.5 18 V

(6N139, HCPL-0701, HCNW139)
Supply Voltage and Output Voltage V

CC

-0.5 7 V

(6N138, HCPL-0700, HCNW138)
Output Power Dissipation P
Total Power Dissipation P

O

T

100 mW
135 mW

Lead Solder Temperature (for Through Hole Devices) 260°C for 10 sec., 1.6 mm below seating plane

HCNW139/138 260°C for 10 sec., up to seating plane
Reflow Temperature Profile See Package Outline Drawings section

(for SOIC-8 and Option #300)

*JEDEC Registered Data for 6N139 and 6N138.
**0°C to 70°C on JEDEC Registration.

Recommended Operating Conditions

Parameter Symbol Min. Max. Units

Power Supply Voltage V
Forward Input Current (ON) I
Forward Input Voltage (OFF) V

F(ON)

F(OFF)

Operating Temperature T

CC

A

4.5 18 V

0.5 12.0 mA
0 0.8 V
070°C

10

Electrical Specifications

0°C ≤ TA ≤ 70°C, 4.5 V ≤ VCC ≤ 18 V, 0.5 mA ≤ I
specified. All Typicals at TA = 25°C. See Note 7.

Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note

Current Transfer CTR 6N139 400* 2000 5000 % IF = 0.5 mA V
Ratio HCPL-0701 VO = 0.4 V 4

HCNW139 400 4500

6N139 500* 1600 2600 IF = 1.6 mA

HCPL-0701

HCNW139 500 3000

300 1600 IF = 5.0 mA
200 850 IF = 12 mA

6N138 300* 1600 2600 IF = 1.6 mA

HCPL-0700

HCNW138 1500

Logic Low Output V

OL

6N139 0.1 0.4 V IF = 0.5 mA, V

Voltage HCPL-0701 IO = 2 mA

HCNW139

6N138 0.1 IF = 1.6 mA,

HCPL-0700 IO = 4.8 mA

HCNW138

Logic High I

OH

6N139 0.05 100 µAVO = V

Output Current HCPL-0701

HCNW139

6N138 0.1 250 VO = V

HCPL-0700

HCNW138

Logic Low Supply I

6N138/139 0.4 1.5 mA IF = 1.6 mA, VO = Open, 10 2

CCL

Current HCPL-0701/ V

0700

HCNW139 0.5 2
HCNW138

Logic High I

6N138/139 0.01 10 µAIF = 0 mA, VO = Open, 2

CCH

Supply Current HCPL-0701/ V

0700

HCNW139 1
HCNW138

Input Forward V

6N138 1.25 1.40 1.7* V TA = 25°CIF = 1.6 mA 4, 8

F

Voltage 6N139

HCPL-0701 1.75
HCPL-0700

HCNW139 1.0 1.45 1.85 TA = 25°C
HCNW138

0.95 1.95

Input Reverse BVR 5.0* V IR = 10 µA, TA = 25°C
Breakdown
Voltage

Temperature ∆V

Coefficient of ∆T

HCNW139 3.0 IR = 100 µA, TA = 25°C
HCNW138

F

A

Forward Voltage

Input C

IN

Capacitance HCNW139 90

HCNW138

*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at T

= 25°C and V

A

= 5 V, unless otherwise noted.

CC

≤ 12 mA, 0 V ≤ V

F(ON)

≤ 0.8 V, unless otherwise

F(OFF)

CC

CC

= 4.5 2, 3 1, 2,

= 4.5 1 2

IF = 1.6 mA,
IO = 8 mA

IF = 5.0 mA,
IO = 15 mA

0.2 IF = 12 mA,
IO = 24 mA

= 18 V IF = 0 mA 2

CC

= 7 V

CC

= 18 V

CC

= 18 V

CC

-1.8 mV/°CIF = 1.6 mA 8

60 pF f = 1 MHz, VF = 0 V

11

Switching Specifications (AC)

Over recommended operating conditions (TA = 0 to 70° C), VCC = 5 V, unless otherwise specified.

Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note

TA =25°C

Propagation t

PHL

Delay Time HCPL-0701 Rl = 4.7 kΩ 7, 9,
to Logic Low HCNW139 12
at Output

Propagation t

PLH

Delay Time HCPL-0701 Rl = 4.7 kΩ 7, 9,
to Logic High HCNW139 115 12
at Output

Common Mode |CMH| 1000 10000 V/µsIF = 0 mA, 13 5, 6
Transient TA = 25° C
Immunity at Rl = 2.2 kΩ
Logic High |VCM| = 10
Output Vp-p

Common Mode |CML| 1000 10000 V/µsIF = 1.6 mA, 13 5, 6
Transient TA = 25° C
Immunity at Rl = 2.2 kΩ
Logic Low |VCM| = 10
Output Vp-p

*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at T

= 25°C and VCC = 5 V, unless otherwise noted.

A

6N139 5 25* 30 µsI

6N139 0.2 1* 2 µsI

= 0.5 mA, 5, 6, 2, 4

F

= 12 mA,

F

HCPL-0701 Rl = 270 Ω

HCNW139 11

6N138 1.6 10* 15 µsI

= 1.6 mA,

F

HCPL-0700 Rl = 2.2 kΩ

HCNW138 11

6N139 18 60* 90 µsI

6N139 2 7* 10 µsI

= 0.5 mA, 5, 6, 2, 4

F

= 12 mA,

F

HCPL-0701 Rl = 270 Ω

HCNW139 11

6N138 10 35* 50 µsI

= 1.6 mA,

F

HCPL-0700 Rl = 2.2 kΩ

HCNW138 70

12

Package Characteristics

Parameter Sym. Min. Typ.** Max. Units Test Conditions Fig. Note

Input-Output Momentary V
Withstand Voltage† TA = 25° C

Option 020 5000 3, 9
HCNW139
HCNW138

Resistance (Input-Output) R

Capacitance (Input-Output) C

**All typicals at TA = 25°C, unless otherwise noted.
†The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output
continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN60747-5-2 Insulation Characteristics Table (if
applicable), your equipment level safety specification or Agilent Application Note 1074 entitled “Optocoupler Input-Output Endurance
Voltage.”

3750 V rms RH < 50%, t = 1 min., 3, 8

ISO

12

I-O

10

Ω V

= 500 Vdc 3

I-O

RH < 45%

I-O

0.6 pF f = 1 MHz 3

Notes:

1. DC CURRENT TRANSFER RATI0
(CTR) is defined as the ratio of output
collector current, I
LED input current, IF, times 100%.

2. Pin 7 Open.

3. Device considered a two-terminal
device. Pins 1, 2, 3, and 4 shorted
together and Pins 5, 6, 7, and 8 shorted
together.

4. Use of a resistor between pin 5 and 7
will decrease gain and delay time.
Significant reduction in overall gain can
occur when using resistor values below
47 kΩ. For more information, please
contact your local HP Components
representative.

5. Common mode transient immunity in a
Logic High level is the maximum toler-

, to the forward

O

able (positive) dVCM/dt of the common
mode pulse, V
output will remain in a Logic High state
(i.e., V

> 2.0 V). Common mode

O

transient immunity in a Logic Low level
is the maximum tolerable (negative)
dV

/dt of the common mode pulse,

CM

V

, to assure that the output will

CM

remain in a Logic Low state (i.e.,

< 0.8 V).

V

O

6. In applications where dV/dt may exceed

50,000 V/µs (such as static discharge) a
series resistor, RCC, should be included
to protect the detector IC from
destructively high surge currents. The
recommended value is RCC = 220 Ω.

7. Use of a 0.1 µF bypass capacitor

connected between pins 8 and 5
adjacent to the device is recommended.

, to assure that the

CM

8. In accordance with UL 1577, each
optocoupler is proof tested by applying
an insulation test voltage 4500 V rms
for 1 second (leakage detection current
limit, I
formed before the 100% production test
shown in the IEC/EN/DIN EN
60747-5-2 Insulation Related
Characteristics Table, if applicable.

9. In accordance with UL 1577, each
optocoupler is proof tested by applying
an insulation test voltage > 6000 V rms
for 1 second (leakage detection current
limit, I
formed before the 100% production test
for partial discharge (method b) shown
in the IEC/EN/DIN EN 60747-5-2
Insulation Related Characteristics Table,
if applicable.

< 5 µA). This test is per-

I-O

< 5 µA). This test is per-

I-O

13

5.0 mA

50

4.5 mA

4.0 mA

25

– OUTPUT CURRENT – mA

O

I

0

V

= 5 V

CC

TA = 25° C

0 1.0 2.0

V

– OUTPUT VOLTAGE – V

O

3.5 mA

3.0 mA

2.5 mA

2.0 mA

1.5 mA

1.0 mA

0.5 mA

Figure 1. 6N138/6N139 DC Transfer
Characteristics.

1000

100

0.01

– FORWARD CURRENT – mA

F

I

0.001

I

F

+

V

F

–

10

TA = 85°C

1.0
TA = 70°C

0.1

1.1 1.2 1.3 1.4
VF – FORWARD VOLTAGE – V

TA = 25°C
TA = 0°C
TA = -40°C

85°C

2000

1600

1200

800

400

0

CTR – CURRENT TRANSFER RATIO – %

0.1 1.0

VCC = 5 V

= 0.4 V

V

O

IF – FORWARD CURRENT – mA

Figure 2. Current Transfer Ratio vs.
Forward Current 6N138/6N139.

40

IF = 0.5 mA
R

35
30
25
20
15
10

– PROPAGATION DELAY – µs

5

P

t

1.61.5

0

-60 -20

= 4.7 kΩ

L

1/f = 50 µs

-40

0

20 40

TA – TEMPERATURE – °C

70°C
25°C
70°C

-40°C

t

PLH

t

PHL

60 80

100

10

TA = 85° C

1.0
TA = 70° C

0.1

– OUTPUT CURRENT – mA

O

I

10

0.01

0.01 0.1 10

IF – INPUT DIODE FORWARD CURRENT – mA

TA = 25° C
TA = 0° C
TA = -40° C

1

Figure 3. 6N138/6N139 Output
Current vs. Input Diode Forward
Current.

24

IF = 1.6 mA

= 2.2 kΩ

R

21
18
15
12

– PROPAGATION DELAY – µs

P

t

100

L

1/f = 50 µs

9
6
3

0

-40

-60 -20

TA – TEMPERATURE – °C

0

20 40

t

PLH

t

PHL

60 80

100

Figure 4. Input Diode Forward
Current vs. Forward Voltage.

4

IF = 12 mA

= 270 kΩ

R

L

1/f = 50 µs

3

2

1

– PROPAGATION DELAY – µs

P

t

0

-40

-60 -20

0

TA – TEMPERATURE – °C

20 40

t

PLH

t

PHL

60 80

Figure 7. Propagation Delay vs.
Temperature.

Figure 5. Propagation Delay vs.
Temperature.

1.6

0

IF = 1.6 mA

20 40

60 80

100

1.5

1.4

1.3

– FORWARD VOLTAGE – V

F

V

1.2

-60 -20

-40

TA – TEMPERATURE – °C

Figure 8. Forward Voltage vs.
Temperature.

Figure 6. Propagation Delay vs.
Temperature.

100

T

= 25° C

A

10

TIME – µs

IF – ADJUSTED FOR V

1

100

0.1 1.0
RL – LOAD RESISTANCE – kΩ

Figure 9. Nonsaturated Rise and Fall
Times vs. Load Resistance.

t

f

t

r

= 2 V

OL

10

14

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

– LOGIC LOW SUPPLY CURRENT – mA

0

04

CCL

I

V

= 18 V

CC

2

IF – FORWARD CURRENT

6

810

V

CC

12 14

= 5 V

Figure 10. Logic Low Supply Current
vs. Forward Current.

S

1000

900
800

WIDEBODY

PS (mW)
I

(mA)

S

700
600

, INPUT CURRENT – I

500

S

400
300
200
100

0

16

0

OUTPUT POWER – P

50

12525 75 100 150

TS – CASE TEMPERATURE – °C

175

Figure 11. Thermal Derating Curve,
Dependence of Safety Limiting Value
with Case Temperature per IEC/EN/DIN
EN 60747-5-2.

I

F

0

V

O

(SATURATED

RESPONSE)

t

PHL

V

O

(NON-SATURATED

RESPONSE)

t

f

1.5 V 1.5 V

90%

10%

10%

Figure 12. Switching Test Circuit.

90%

t

5 V

V

OL

PLH

5 V

t

r

PULSE

GEN.

Z = 50 Ω

O

t = 5 ns

r

10% DUTY CYCLE

I/f < 100 µs

I MONITOR

F

I

F

1

2

3

4

R

M

8

7

6

0.1 µF

5

* INCLUDES PROBE AND
FIXTURE CAPACITANCE

R

L

+5 V

V

O

C

= 15 pF*

L

15

t

, tf = 16 ns

10%

r

t

f

10 V

V

CM

0 V

90% 90%

10%

t

r

I

F

1

B

A

2

3

V

O

SWITCH AT A: I = 0 mA

V

O

SWITCH AT B: I = 1.6 mA

F

F

5 V

V

OL

V

FF

4

Figure 13. Test Circuit for Transient Immunity and Typical Waveforms.

V

CM

+

–

PULSE GEN.

RCC(SEE NOTE 6)

8

7

6

5

+5 V

R

L

V

O

www.agilent.com/semiconductors

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Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-4109EN
January 22, 2004
5989-0289EN