ADLink MI-110 Manual

Page 1

MI-110

Mini-ITX Embedded Motherboard with Intel® Atom™
Processor N270 and Intel® 945GSE/ICH7M Chipset
User’s Manual
Manual Rev.: 2.00 Revision Date: October 2, 2009 Part No: 50-1Z012-1000
Advance Technologies; Automate the World.
Page 2
Revision Release Date Description of Change(s)
2.00 2009/10/02 Initial Release
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MI-110

Preface

Copyright 2009 ADLINK Technology Inc.
This document contains proprietary infor mation protected by copy­right. All rights are reserved. No part of this manual may be repro­duced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and function and does not represent a commitment on the part of the manufa cturer.
In no event will the manufacturer be liable for direct, indirect, spe­cial, incidental, or consequential damages arising out of the use or inability to use the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with the Euro­pean Union's Restriction of Hazardous Substances (RoHS) direc­tive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for ADLINK. We have enforced measures to ensure that our products, manu­facturing processes, components, and raw materials have as little impact on the environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product disposal and/or recovery programs prescribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification pur­poses only and may be trademarks and/or registered trademarks of their respective companies.
Preface iii
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Using this Manual

Audience and Scope

The MI-110 User’s Manual is intended for hardware technicians
and systems operators with knowledge of installing, configuring and operating industrial grade computers.

Manual Organization

This manual is organized as follows: Preface: Presents copyright notifications, disclaimers, trade-
marks, and associated information on the proper usage of this document and its associated product(s).
Chapter 1, Introduction: Introduces the MI-110, its features, applications, and specifications, including functional descriptions and board layout.
Chapter 2, Connectors & Jumpers: Provides technical informa­tion on connectors, jumpers and pin assignments for configuring the MI-110.
Chapter 3, Getting Started: Describes how to install components and drivers on the MI-110.
Chapter 4, BIOS Setup: Presents information and illustrations to help understand and configure the system BIOS.
Appendix A, Watchdog Timer: Presents information on under­standing and configuring the watchdog timer.
Appendix B, System Resources: Presents information on I/O mapping, IRQ routing, and resource allocation.
Important Safety Instructions: Presents safety instructions all users must follow for the proper setup, installation and usage of equipment and/or software.
Getting Service: Contact information for ADLINK’s worldwide offices.
iv Preface
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MI-110
Conventions
Take note of the following conventions used throughout this manual to make sure that users perform certain tasks and instructions properly.
Additional information, aids, and tips that help users perform tasks.
NOTE:
NOTE:
Information to prevent minor physical injury, component dam­age, data loss, and/or program corruption when trying to com-
CAUTION:
WARNING:
plete a task.
Information to prevent serious physical injury, component damage, data loss, and/or program corruption when trying to complete a specific task.
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MI-110

Table of Contents

Revision History...................................................................... ii
Preface.................................................................................... iii
Table of Contents.................................................................. vii
List of Figures........................................................................ ix
List of Tables.......................................................................... xi
1 Introduction ........................................................................ 1
1.1 Package Contents ............................................................... 1
1.2 Overview.............................................................................. 2
1.3 Features............................................................................... 2
1.4 Specifications....................................................................... 3
1.5 Block Diagram ..................................................................... 5
1.6 Functional Description ......................................................... 6
1.7 Power Consumption ............................ ... ... ... ... .... ... ... ... .... ... 9
1.8 Board Layout ..................................................................... 10
1.9 Mechanical Dimensions..................................................... 12
2 Connectors & Jumpers.................................................... 15
2.1 Rear I/O Connectors.......................................................... 15
2.2 Onboard Connectors ......................................................... 19
2.3 Jumper Settings................................................................. 27
3 Getting Started ................................................................. 31
3.1 System Memory................................................................. 31
3.2 Driver Installation................................................. ... ... ... .... . 32
4 BIOS Setup........................................................................ 33
4.1 Starting the BIOS.......................... ... .... ... ... ... ... .... ... ... ........ 33
Table of Contents vii
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4.2 Standard CMOS Features ................................................. 35
4.3 Advanced BIOS Features.................................................. 37
4.4 Advanced Chipset Features............................................... 42
4.5 Integrated Peripherals..................................... ... ... .... ... ... ... 44
4.6 Power Management Setup ................................................ 51
4.7 PnP/PCI Configurations..................................................... 54
4.8 PC Health Status ............................................................... 56
4.9 Frequency/Voltage Control............................. ... ... .... ... ... ... 57
4.10 Load Optimized Defaults.................................................... 58
4.11 Set Supervisor & User Password....................................... 59
4.12 Save & Exit Setup.............................................................. 60
4.13 Exit Without Saving............................................................ 61
A Appendix: Watchdog Timer..............................................63
A.1 WDT Programming Instructions...................... ... ... .... ... ... ... 63
B Appendix: System Resources..........................................65
B.1 System Memory Map......................................................... 65
B.2 Direct Memory Access Channels....................................... 66
B.3 Fixed I/O Map .................................................................... 67
B.4 Variable I/O Map................................................................ 68
B.5 Interrupt Request (IRQ) Lines............................................ 69
B.6 PCI Configuration Space Map ........................................... 71
B.7 PCI Interrupt Routing Map................................................. 72
Important Safety Instructions............................................... 73
Getting Service...................................................................... 75
viii Table of Contents
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MI-110

List of Figures

Figure 1-1: MI-110 Block Diagram .....................................................5
Figure 1-2: MI-110 Board Layout..................................................... 10
Figure 1-3: MI-110 Rear I/O Layout ................................................. 11
Figure 1-4: MI-110 Board Dimensions ............................................. 12
Figure 1-5: Rear I/O Faceplate Dimensions.....................................13
List of Figures ix
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xList of Figures
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MI-110

List of Tables

Table 1-1: MI-110 General Specifications.........................................4
Table 1-2: Intel® Atom™ N270 processor Power Consumption ......9
Table 1-3: MI-110 Board Layout Legend........................................ 11
Table B-1: System Memory Map..................................................... 65
Table B-2: Direct Memory Access Channels................................... 66
Table B-3: Fixed I/O Map................................................................ 67
Table B-4: Variable I/O Map............................................................68
Table B-5: IRQ Lines PIC Mode....................... ... ... ... ... .... ... ... ... .... .. 69
Table B-6: IRQ Lines APIC Mode....................... ... ... ... .... ... ...... .... .. 70
Table B-7: PCI Configuration Space Map.... .... ... ... ... ... .... ... ... ... .... .. 71
Table B-8: PCI Interrupt Routing Map.............................. ... ... ... .... .. 72
List of Tables xi
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xii List of Tables
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1 Introduction

This chapter will introduce the MI-110, its features, specifications, functional description, and mechanical layout.

1.1 Package Contents

Please check that your package contains the items below. If you discover damaged or missing items, please contact your vendor.
X MI-110 Mini-ITX Embedded Motherboard X I/O shield X 1x IDE cable X 2x SATA cable X 2x SATA power cable X 2x COM port cable with bracket X Driver CD X User’s Manual
MI-110
DO NOT install or apply power to equipment that is damaged or if there is missing/incomplete equipment. Retain the ship-
WARNING:
Introduction 1
ping carton and packing materials for inspection. Please con­tact your ADLINK dealer/vendor immediately for assistance. Obtain authorization from your dealer before returning any product to ADLINK.
Page 14

1.2 Overview

The ADLINK MI-110 is a Mini-ITX embedded motherboard based on the Intel® Atom™
processor N270 built on 45-nm process technology in Micro-FCBGA8 package and the Mobile Intel® 945GSE + ICH7M Express Chipset. The MI-110 is ideal for embedded applications requiring fanless operation and ultra-low power consumption in a standard small form factor motherboard with a complete set of I/O functions and high-bandwidth network connectivity. These features, combined with an SO-DIMM socket supporting DDR2-533 SDRAM up to 2 GB, IDE/SATA/CF storage interfaces, PCI and Mini PCIe expansion slots, VGA, DVI-I, dual­channel 18-bit LVDS, and audio interfaces make the MI-110 suit­able for medical, transportation, and other applic ations requ iring a low noise/power , space-saving, multiple display platform.

1.3 Features

X Mini-ITX form factor (170 mm x 170 mm) X Intel® Atom™ processor N270:
Z 1.6 GHz core frequency Z 533MHz FSB Z 512KB L2 cache
Z Micro-FCBGA8 package X DDR2-533 up to 2GB max. (1x 200-pin SODIMM socket) X Intel® GMA950 integrated in 945GSE supporting dual indepen-
dent display
Z Dsub-15 connector up to 2048x1536 @ 75Hz (QXGA)
Z DVI-I via Chrontel 7307C, up to 1600x1200 (UXGA)
Z Dual-channel 18-bit LVDS up to 1600x1200 (UXGA) X PCI and Mini PCIe expansion slots X 2x SATA ports 1.5Gb/s, 4x RS-232 serial ports X 2x GbE, 6x USB 2.0 (4 ext., 2 int.) X 2x Mini-DIN for PS/2 keyboard/mouse X RoHS compliant
2Introduction
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MI-110

1.4 Specifications

System
CPU Intel® Atom™ processor N270
• 1.6 GHz core frequency
• 512KB L2 cache
• Micro-FCBGA8 package
FSB • 533 MHz Chipset • Mobile Intel® 945GSE + ICH7M Express Chipset Memory • DDR2 533 SDRAM (2GB max.)
• 1x 200-pin SO-DIMM slot
BIOS • Award BIOS with 16 Mb Flash ROM TPM • TPM 1.2 via Infineon SLB 9635 TT 1.2 Audio • Realtek ALC888 HD Audio
• Line-in, line-out and mic-in
Watchdog Timer • 1-255 second/minute programmable Hardware Monitor • CPU/System temperature, fan speed and onboard DC
voltage
Operating System • Microsoft® Windows® XP/Vista
I/O Interfaces
Serial ATA • 2x Serial A TA ports with 1.5 Gb/s data transfer Parallel ATA • 1x 40-pin ATA-66/100 IDE port CompactFlash • 1x Type-II CF socket, shared with IDE port Onboard I/O • 6x USB 2.0 (4x external, 2x by pin header)
• 4x RS-232 serial ports (2x external, 2x by pin header)
Rear I/O • 2x RJ-45 LAN ports
• 4x USB 2.0 ports
• 2x RS-232 serial ports
• 1x D-Sub VGA conne ctor
• 1x DVI-I connector
• 2x PS2 keyboard/mouse ports
• 3x audio jacks (line-in, line-out and mic-in)
Expansion Slot s • 1x Mini PCIe slot
• 1x PCI slot
Introduction 3
Page 16
Display
Graphics Processor
VRAM • Shared system memory up to 224 MB CRT • Dsub-15 connector up to 2048x1536 @ 75Hz (QXGA) DVI • DVI-I via Chrontel 7307C, up to 1600x1200 (UXGA) LVDS • Dual-channel 18-bit LVDS up to 1600x1200 (UXGA)
Controller • Realtek 8111C GbE controller Ports • 2x RJ-45 Ethernet port
Form Factor • Mini-ITX Embedded Motherboard Dimensions • 170 mm x 170 mm (L x W) Operating Temp. • 0°C to 60°C Storage Temp. • -40ºC to 80ºC Rel. Humidity • 10 - 90% RH Safety • CE, FCC Class A
• Intel® GMA950 inte grated in 945GSE supporting dual independent display
Ethernet
Mechanical and Environment
Table 1-1: MI-110 General Specifications
4Introduction
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1.5 Block Diagram

CPU
Intel® Atom™
N270
1.6GHz 533 MHz FSB 512K L2 Cache
437-pin Micro-FCBGA8
533 MHz FSB
MI-110
CRT
DB-15
Dual Channel
18-bit LVDS
DVI
IDE / CF
SATA ports x2
USB 2.0
(Bracket x4, Internal x2)
KB/Mouse
KB/Mouse
RS-232x4
Chrontel 7307C
DVI Transmitter
Northbridge
Intel®945GSE GMCH
Southbridge
Intel® ICH7M
IDE
SATA
USB 2.0 LPC
Winbond
W83627DHG-A
LPC Super I/O
SPI
AC97
DMI Interface 2 GB/s
PCIe
Controller
PCI
Controller
Realtek ALC888
Audio Codec
Hardware
Monitor
SO-DIMM up to 2GB
DDRII 533MHz
PCIe x1 PCIe Mini slot
PCIe x1
I
e
P
C
PCI Bus
x
1
RTL8111C
RJ-45
RTL8111C
RJ-45
PCI 32-bit/
33MHz bus
Audio Jacks
Line-in, Line-out, Mic-in
SPI BIOS
Figure 1-1: MI-110 Block Diagram
Introduction 5
Page 18

1.6 Functional Description

Processor Support

The MI-110 embedded motherboard is equpped with the Intel® Atom™ N270 processor in Micro-FCBGA8 package. Implemented in 45nm process technology, the Intel® Atom™ N270 is power­optimized to deliver robust performance per watt for cost-effective embedded applications. Features include:
X 1.6 GHz core speed with 533 MHz FSB and 2.5 watts TDP X Hyper-Threading Technology X Enhanced Intel SpeedStep® Technology X Enhanced low-power sleep states (C1E, C2E, C4E) X Dynamic L2 cache sizing

Mobile Intel® 945GSE Express Chipset

The MI-110 is based on the Mobile Intel® 945GSE Express Chipset, consisting of the Intel® 82945GSE Graphics Memory Controller Hub and Intel® I/O Controller Hub 7-M. The chipset fea­tures power-efficient graphics with an integrated 32-bit 3D graph­ics engine based on Intel® Graphics Media Accelerator 950 architecture with SDVO, LVDS, and CRT display ports. It provides rich I/O capabilities and flexibility via high-bandwidth interfaces such as PCI Express, PCI, Serial ATA, and Hi-Speed USB 2.0 connectivity. It also includes a single channel for 400/533 MHz DDR2 system memory, and Intel® High Definition Audio interface.

DDR2 memory

To meet the requirements of memory-intensive applications, the MI-110 has a single-channel memory architecture supporting a DDR2 400/533 MHz SO-DIMM. The high-bandwidth memory specification, meets the requirements of the latest 3D graphics, multimedia, and network application, and boosts system perfor­mance by eliminating bottlenecks.
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MI-110

Intel® Graphics Media Accelerator GMA 950

The Intel® Graphics Media Accelerator (GMA) 950 provides an integrated 3D graphics engine delivering sophisticated graphics for large display applications. With support for DirectX 9 hardware acceleration, 400 MHz display clock, and up to 224 MB of video memory , the Intel GMA 95 0 provides a cost-e f fective and h igh-per­formance graphics solution. The MI-110 supports dual indepen­dent display technology, enabling different content to be displayed on two separate display terminals or a single workspace to be stretched across two display devices.

Gigabit Ethernet

The MI-110 is equipped with the PCI Express Realtek 8111C GbE controller.

Serial ATA

Storage is efficient and secure with the Serial ATA interface. Utiliz­ing the Intel® ICH7M, the MI-110 supports two Serial ATA devices capable of reading/writing data at up to 1.5 Gb/s. The SATA speci­fication improves chassis airflow via thinner and more flexible cables with lower pin count.

USB 2.0

The MI-110 incorporates the Universal Serial Bus (USB) 2.0 spec­ification that increases peripheral connection speed from 12 Mbps (USB 1.1) to 480 Mbps. USB 2.0 is backward compatible with USB 1.1.

Hardware Monitoring

A built-in, proactive hardware monitoring system monitors the CPU temperature, system fan speeds, and voltage levels to pre­vent overheating and/or component damage, effect timely failure detection, and ensure stable supply of current for critical mother­board components.
Introduction 7
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Watchdog Timer

The watchdog timer (WDT) monitors system operations based on user-defined configurations. The WDT can be programmed for dif­ferent time-out periods, such as from 1 to 255 seconds or from 1 to 255 minutes. The WDT generates a reset signal, then a reset request, after failure to strobe it within the programmed time period. A register bit may be enabled to indicate if the watchdog timer caused the reset event. The WDT register is cleared during the power-on sequence to enable the operating system to take appropriate action when the watchdog genera tes a reboot.
8Introduction
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MI-110

1.7 Power Consumption

Intel® Atom™ N270 processor, 1.6GHz, 512KB L2 cache, 533MHz FSB
T est Configuration
Memory Elpida DDR2 667MHz, 2GB Graphics Intel® Graphics Media Accelerator 950 SATA HD WD Caviar SE, WD1600JS-60NCB1, 160GB Power Supply Sunpower SPX-5600P1 500W
DOS (idle)
Power Req. +5VSB +12V Total
Current (mA) – 719.4 –
Watts (W) – – 8.633
Windows XP, Idle
Power Req. +5V +12V Total
Current (mA) – 695.8 –
Watts (W) – – 8.350
Windows XP, CPU Stress (Kpower)
Power Req. +5V +12V Total
Current (mA) – 890.0 –
Watts (W) – – 10.68
Windows XP, Total System Stress (Burnin)
Power Req. +5V +12V Total
Current (mA) – 860.5 –
Watts (W) – – 10.326
S4 Mode (Windows hibernate)
Power Req. +5V +12V Total
Current (mA) 162.8 – –
Watts (W) – – 0.814
S3 Mode
Power Req. +5V +12V Total
Current (mA) 252.2 – –
Watts (W) – – 1.261
Table 1-2: Intel® Atom™ N270 processor Power Consumption
Introduction 9
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1.8 Board Layout

Figure 1-2: MI-110 Board Layout
10 Introduction
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MI-110
AAFP1 Front Panel Audio pin
header
ATXPWR1 ATX Power connector JCOMPWR3/4 CHA_FAN System Fan connector JDIO Digital IO pin header
CLRTC Clear CMOS jumper JLVDS1 LVDS connector COM3/4 Serial Port pin headers SATA1/2 SA TA1/2 connectors F_PANEL1 System Panel pin header SODIMMA1 SO-DIMM socket IDE1 IDE connector SPDIF_OUT S/PDIF pin header JAMP1 Audio Amplifier connector SPI_JP1 SPI pin header JBLK1 LCD Inverter pin header USB45 USB4/5 pin header
Table 1-3: MI-110 Board Layout Legend
JCOMPWR1/2 COM1/2 RI, +12V and
+5V power select jumper COM3/4 RI, +12V and
+5V power select jumper
COM DVI
PS/2
KB/MS
Figure 1-3: MI-110 Rear I/O Layout
Introduction 11
VGACOM
Audio
RJ-45 + USB
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1.9 Mechanical Dimensions

Dimensions in mm
Figure 1-4: MI-110 Board Dimensions
12 Introduction
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MI-110
Dimensions in mm
Figure 1-5: Rear I/O Faceplate Dimensions
Introduction 13
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2 Connectors & Jumpers

The connectors and jumpers on the MI-110 allow you to connect and configure external devices. The following specify the pin assignments for connectors and jumper on the MI-110. Refer to
Figure 1-2: MI-110 Board Layout and Figure 1-3: MI-110 Rear I/O Layout for connector and jumper locations.

2.1 Rear I/O Connectors

PS/2 Mouse Port (green)

Pin # Signal Function
1MSDATAMouse Data 2 NC not connected 3 GND Ground 4+5V Power 5 CLK Clock 6 NC not connected
MI-110

PS/2 Keyboard Port (purple)

Pin # Signal Function
1 KBDATA Keyboard Data 2 NC not connected 3 GND Ground 4+5V Power 5 CLK Clock 6 NC not connected
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Serial Port Connectors (COM1/2)

Pin # RS-232
1 DCD, Data Carrier Detect 2 RXD, Receive Data 3 TXD, Transmit Data 4 DTR, Data Terminal Ready 5 GND, ground 6 DSR, Data Set Ready 7 RTS, Request to Send 8 CTS, Clear to Send
9
RI_Power,
Ring Indicator / Power*
*Note: See “Jumper Settings” on page 27 for RI/+5V/+12V selection.

VGA Connector.

Signal Name Pin # Pin # Signal Name
Red 1 2 Green
Blue 3 4 VCC pull-up GND 5 6 GND GND 7 8 GND VCC 9 10 GND
VCC pull-up 11 12 DDC2B DA TA
HSYNC 13 14 VSYNC
DDC2B CLK 15
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DVI-I Connector (CN2)
Pin # Signal Pin # Signal
1 TMDS Data2- 16 Hot Plug Detect 2 TMDS Data2+ 17 TMDS Data0­3 TMDS Data2/4 Shield 18 TMDS Data0+ 4 TMDS Data4- 19 TMDS Data0/5 Shield 5 TMDS Data4+ 20 TMDS Data5­6 DDC Cl ock 21 TMDS Data5+ 7 DDC Data 22 TMDS Clock Shield 8 Analog Vertical Sync 23 TMDS Clock + 9 TMDS Data1- 24 TMDS Clock -
10 TMDS Data1+ C1 Ana log Red
11 TMDS Data1/3 Shield C2 Analog Green 12 TMDS Data3- C3 Analog Blue 13 TMDS Data3+ C4 Analog Horizontal Sync 14 +5 V Power C5 Analog GND Return 15 GND
MI-110
Connectors & Jumpers 17
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USB Connectors

Pin # Signal Name
1Vcc 2 USB­3 USB+ 4GND

LAN Port (RJ-45)

This port allows gigabit connection to a Local Area Network (LAN) using a network hub. The LAN port comes with two LEDs to indi­cate link, activity and speed. Refer to the tables below for the LAN
port pin and LED definitions ..
Pin #
1 TX+ BI_DA+ 2 TX- BI_DA­3 RX+ BI_DB+ 4 -- BI_DC+ 5 -- BI_DC­6 RX- BI_DB­7 -- BI_DD+ 8 -- BI_DD-
Status Description Status Description
Orange Linked Orange 100 Mb connection
Blinking Data Activity Green 1 Gb connection
10BASE-
T/100BASE-TX
1000BASE-T
81
ACT/LINK SPEED
Off No Link Off 10 Mb connection

Audio I/O port

The three-jack audio I/O supports Line-In, Line-Out, and Mic-In functions. The blue Line-In jack onnects to an audio source such as a CD player. The green Line-Out port connects to a speaker or headphone, while the pink Mic-In jack connect s to a microphone.
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2.2 Onboard Connectors

Front Panel Audio Pin Header (AAFP1)

Pin # Signal Pin # Signal
1 MIC2_L 6 AGND 2 MIC2_R 7 FP_PRES# 3 MIC2_R 8 SRTN1 4 SENSE A 9 Key 5 LIN2_L 10 SRTN2

ATX Power Connector (ATXPWR1)

Pin # Signal Pin # Signal
1 +3.3V 11 +3.3V 2 +3.3V 12 -12V 3 GND 13 GND 4 +5V 14 PS-ON# 5 GND 15 GND 6 +5V 16 GND 7 GND 17 GND 8 PWRGD 18 NC 9 +5VSB 19 +5V
10 +12V 20 +5V
MI-110
1
2

System Fan Connector (CHA_FAN)

Pin # Signal
1 GND 2 Fan Power (+12V) 3 Fan Tachometer
Connectors & Jumpers 19
13
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Serial Port Connectors (COM3/4)

Pin # Signal Functions
1 DCD Data Carrier Detect 2 TXD Transmit Data 3 GND Ground 4 RTS Request to Send 5 RI_Power Ring Indicate, Power * 6 RXD Receive Data 7 DTR Data Terminal Ready 8 DSR Data Set Ready 9 CTS Clear to Send
10 NC Key
*Note: See “Jumper Settings” on page 27 for RI/+5V/+12V selection.
1
5
6
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System Panel Connector (F_PANEL1)

Pin # Signal Pin Group
1 HD_LED+ 2 HD_LED­3 GND 4 RESET 5 NC 6 PWR_LED+ 7 PWR_LED­8 PWR 9 GND
10 NC
Hard Disk LED
Reset Button
Power LED
Power Switch
MI-110
1
6
5
Connectors & Jumpers 21
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IDE Connector (IDE1)

Pin # Signal Pin # Signal
1 Reset 2 Ground 3 Data 7 4 Data 8 5 Data 6 6 Data 9 7 Data 5 8 Data 10
9 Data 4 10 Data 11 11 Data 3 12 Data 12 13 Data 2 14 Data 13 15 Data 1 16 Data 14 17 Data 0 18 Data 15 19 Ground 20 ­21 Request 22 Ground 23 I/O Write 24 Ground 25 I/O Read 26 Ground 27 I/O Ready 28 Cable Select 29 DMA Ack 30 Ground 31 Interrupt Request 32 No Connect 33 Device Address 1 34 ATA 66/100 Detect 35 Device Address 0 36 Device Address 2 37 Chip Select 1 38 Chip Select 3 39 Device Active 40 Ground

Audio Amplifier connector (JAMP1)

Pin # Signal
1 AMP_L­2 AMP_L+ 3 AMP_R-
4 AMP_R+
22 Connectors & Jumpers
1
Page 35

LCD Inverter pin header (JBLK1)

Pin # Signal
1 +12V 2 GND 3 ENBKL 4 VR 5 +5V

Digital IO pin header (JDIO)

MI-110
1
Pin # Signal Pin # Signal
1 DIO GP20 2 DIO GP10 3 DIO GP21 4 DIO GP11 5 DIO GP22 6 DIO GP12 7 DIO GP23 8 DIO GP13
9 DIO GP24 10 DIO GP14 11 DIO GP25 12 DIO GP15 13 DIO GP26 14 DIO GP16 15 DIO GP27 16 DIO GP17 17 SMBCLK 18 SMBDATA 19 Ground 20 VCC
12
Connectors & Jumpers 23
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LVDS Flat Panel Connector (JLVDS1)

Pin # Signal Pin # Signal
2 +5V 1 +3.3V 4 +5V 3 +3.3V 6 SD_DDC 5 SC_DDC
8 GND 7 GND 10 LVDS0_P0 9 LVDS0_P1 12 LVDS0_N0 11 LVDS0_N1 14 GND 13 GND 16 LVDS0_P2 15 LVDS0_P3 18 LVDS0_N2 17 LVDS0_N3 20 GND 19 GND 22 LVDS1_P0 21 LVDS1_P1 24 LVDS1_N0 23 LVDS1_N1 26 GND 25 GND 28 LVDS1_P2 27 LVDS1_P3 30 LVDS1_N2 29 LVDS1_N3 32 GND 31 GND 34 LVDS0_CLKP 33 LVDS1_CLKP 36 LVDS0_CLKN 35 LVDS1_CLKN 38 GND 37 GND 40 +12V 39 +12V
24 Connectors & Jumpers
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SATA Connectors (SATA1-6)

Pin # Signal
1 GND 2 TXP 3 TXN 4 GND 5 RXN 6 RXP 7 GND

S/PDIF Pin Header (SPDIF_OUT)

Pin # Signal
1 +5V 2 NC 3 SPDIF0 4 GND
MI-110
1
7
1
Connectors & Jumpers 25
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SPI pin header (SPI_JP1)

Pin # Signal Pin # Signal
1 +3V ROM 2 GND 3 F_SPI_CS# 4 F_SPI_CLK 5 F_SPI_MISO 6 F_SPI_MOSI 7 SPI_HOLD# 8 NC

USB 2.0 Connector (USB45)

Pin # Signal Pin # Signal
1+5V2+5V 3 USB4- 4 USB5­5 USB4+ 6 USB5+ 7 GND 8 GND 9 Key 10 NC
1
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MI-110

2.3 Jumper Settings

Clear CMOS Jumper (CLRTC)

The CMOS RAM data contains the date / time and BIOS setting information. CMOS is powered by the onboard button cell battery. To erase the CMOS RAM data:
1. Unplug th e MI-110.
2. Short the CLRTC pins 2-3.
3. Remove the jumper cap from pins 2-3 and reinstall it to pins 1-2. Power up the system.
Connectors & Jumpers 27
Page 40

COM1 RI, +12V and +5V Function Select (JCOMPWR1/2)

These jumpers allows you to select COM1 RI, +5V an d +12V fun c­tions. Set JCOMPWR1 to pins 1-3 and JCOMPWR2 to pins 1-3 to select +5V power. Set JCOMPWR1 to pins 3-5 and JCOMPWR2 to pins 1-3 to select +12V power. Set JCOMPWR2 to pins 3-5 and JCOMPWR1 to open for RI selection.

COM2 RI, +12V and +5V Function Select (JCOMPWR1/2)

These jumpers allow you to select COM2 RI, +5V and +12V power. Set JCOMPWR1 to pins 2-4 and JCOMPWR2 to pins 2-4 to select +5V power. Set JCOMPWR1 to pins 4-6 and JCOMPWR2 to pins 2-4 to select +12V power. Set JCOMPWR2 to pins 4-6 and JCOMPWR1 to open for RI selection.
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MI-110

COM3 RI, +12V and +5V Function Select (JCOMPWR3/4)

These jumpers allow you to select COM3 RI, +5V and +12V power. Set JCOMPWR3 to pins 1-3 and JCOMPWR4 to pins 1-3 to select +5V power. Set JCOMPWR3 to pins 3-5 and JCOMPWR4 to pins 1-3 to select +12V powe r. Set JCOMPWR4 to pins 3-5 and JCOMPWR3 to open for RI selection.

COM4 RI, +12V and +5V Function Select (JCOMPWR3/4)

These jumpers allow you to select COM4 RI, +5V and +12V power. Set JCOMPWR3 to pins 2-4 and JCOMPWR4 to pins 2-4 to select +5V power. Set JCOMPWR3 to pins 4-6 and JCOMPWR4 to pins 2-4 to select +12V powe r. Set JCOMPWR4 to pins 4-6 and JCOMPWR3 to open for RI selection.
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30 Connectors & Jumpers
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3 Getting Started

This chapter provides information on how to install components to the MI-110 SBC.

3.1 System Memory

The MI-110 supports up to 2 GB of DDR2 400/533 SDRAM in one 200-pin SO-DIMM socket. See Figure 1-2 on page 10 for the SO-DIMM socket location.

Memory Module Installation

The DDR2 memory modules are notched to facilitate correct installation in the DIMM sockets.
Disconnect all power supply to the board before installing a memory module to prevent damaging the board and mem-
WARNING:
To install a memory module:
1. Locate the SO-DIMM slot on the motherboard.
ory module .
MI-110
2. Align the memory module on the socket, making sure that the notch matches the break on the socket.
3. Insert the module firmly into the slot until the retaining clips snap back inwards and the module is securely seated.
Getting Started 31
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3.2 Driver Installation

The MI-110 drivers for Windows XP 32-bit are located in the fol­lowing directories on the Driver CD, or can be downloaded from the ADLINK website (http://www.adlinktech.com):
Chipset X:\MI-110\CHIP\setup.exe Display X:\MI-110\VGA\Win2KXP\win2k_xp14311.exe LAN X:\MI-110\LAN\Win2KXP\setup.exe Audio X:\MI-110\Audio\Windows 32_64\WDM_R182.exe TPM X:\MI-110\TPM\setup.exe
Follow the instructions below to install the required MI-110 drivers:
1. Install the Windows operating system before installing any driver. Most standard I/O device drivers are installed during Windows installation.
2. Install the Chipset driver by running the program X:\MI-110\CHIP\setup.exe. Follow the instructions given and reboot when instructed.
3. Install the Display driver and utilities by running the program X:\MI-110\VGA\Win2KXP\win2k_xp14311.exe. Follow the instructions given and reboot when instructed.
4. Install the LAN driver by running the program X:\MI-110\LAN\Win2KXP\setup.exe. Follow the instructions given and reboot if required.
5. Install the Audio driver by running the program X:\MI-110\Audio\Windows 32_64\WDM_R182.exe. Follow the instructions given and reboot if required.
6. Install the TPM driver by running the program X:\MI-110\TPM\setup.exe. Follow the instructions given and reboot if required.
32 Getting Started
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4 BIOS Setup

The following chapter describes basic navigation for the Phoenix AwardBIOS Setup Utility.

4.1 Starting the BIOS

To enter the setup screen, follow these steps:
1. Power on the motherboard
2. Press the <Delete> key on your keyboard during the
Power-On-Self-Test (POST) to enter the Setup utility.
3. After you press the < Delete > key, the main BIOS Setup
Menu will be displayed.
MI-110
BIOS Setup 33
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Navigation

Use the keys described below to navigate through the BIOS Setup Utility
Key(s) Function Description
F1
Esc
← , → ↑ , ↓
Enter Brings up a selection menu for the highlighted field.
+ or PgUp Moves the cursor to the first field
- or PgDn Moves the cursor to the last field F5 Loads the previous values
F6, F7 Loads the fail-safe / optimized defaults
F10 Saves changes and exits Setup
Submenus
Note that a right pointer symbol (X) appears to the left of certain fields. This pointer indicates that you can display a submenu from this field. A sub-menu contains additional options for a field par am­eter. To display a sub-menu, move the highlight to the field and press <Enter>. The sub-menu appears. Use the legend keys to enter values and move from field to field within a sub-menu as you would within a menu. Use the <Esc> key to return to the main menu.
General help, only for Status Page Setup Menu and Option Page Setup Menu
Return to the main menu from a sub-menu or prompts you to quit the setup program.
Move to the item on the left or right Move to previous or next item
34 BIOS Setup
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MI-110

4.2 Standard CMOS Features

The main menu includes the following setup categories. Recall that some systems may not include all entries .
Date/Time
Use this option to change the system time and date. The date must be entered in MM/DD/YY format. The time is entered in HH:MM:SS format.
Note: The time is in 24-hour format. For example, 5:30 A.M. appears as
05:30:00, and 5:30 P.M. as 17:30:00.

IDE Channel 0/1 Master/Slave

This selection brings up the configuration submenu of the desig­nated device.
IDE HDD Auto-detection: Press Enter to auto-detect the HDD on the selected channel.
IDE Device Setup: None/Auto/Manual. Selecting 'manual' allows the user to set the remaining fields on the submenu.
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Capacity: Auto display disk size Disk drive capacity (approxi­mated).
Access Mode: CHS/LBA/Large/Auto Selects the access mode for a hard disk The following options are selectable only if the 'IDE Primary Master' item is set to 'Manual'
Cylinder: Min = 0 Max = 65535 Sets the number of cylinders for a hard disk.
Head: Min = 0 Max = 255 Sets the number of read/write heads Precomp: Min = 0 Max = 65535 Landing zone: Min = 0 Max = 65535 Sector: Min = 0 Max = 255 Number of sectors per track

Video

This category detects the type of adapter used for the primary monitor that matches your video display card and monitor.
X EGA / VGA: Enhanced Graphics Adapter/Video Graphics
Array. For EGA, VGA, SVGA, or PGA monitor adapters
X CGA 40: Color Graphics Adapter, power up in 40 column
mode
X CGA 80: Color Graphics Adapter, power up in 80 column
mode
X MONO: Monochrome adapter, includes high resolution
monochrome adapters

Halt On

Sets the system to halt on errors according to the system fu nctions specified in each option. Configuration options: [All Errors] [No Errors] [All, But Keyboard]

Memory

This category displays base memory, extended memory, and total memory detected during POST (Power On Self Test).
36 BIOS Setup
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MI-110

4.3 Advanced BIOS Features

This section allows users to configure the Advanced BIOS Fea­tures of the system.
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CPU Features

Delay Prior to Thermal
The Delay Prior To Thermal BIOS feature controls the activation of the Thermal Monitor's automatic mode. It allows you to determine when the Pentium 4's Thermal Monitor should be activated in auto­matic mode after the system boots. For example, with the default value of 16 Minutes, the BIOS activates the Thermal Monitor in automatic mode 16 minutes after the system starts booting up.
Limit CPUID MaxVal
Set Limit CPUID MaxVa1 to 3. This should be disabled for WinXP
C1E Function
CPU C1E function select
Execute Disable Bit
When disabled, forces the XD feature flag to always return 0
38 BIOS Setup
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Hard Disk Boot Priority

Sets hard disk boot device priority.
MI-110
CH0 S.
Primary SATA channel with Master Device. It will show the device model / type when SATA HDD or CD ROM connected.
Bootable Add-in Cards
"Bootable add-in cards" is an item on the HDD boot priority list.
Virus Warning
Enables or disables the virus warning.
CPU L1 & L2 Cache
Enables or disables the CPU L1 & L2 Cache. Enabling this feature speeds up memory access.
Hyper-Threading Technology
BIOS Setup 39
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Enables or disables the Hyper-Threading function of the CPU.
Quick Power On Self Test
Speeds up the Power On Self Test (POST). If enabled, the BIOS will shorten the test time or skip some check items during POST.
First/Second/Third Boot Device
Pressing <Enter> displays the Boot Device Menu. The BIOS will attempt to load the operating system from the selected devices in sequence.
Boot Other Device
Enables the BIOS to boot from a se cond or third de vice if booting from the first device fails. When disabled the BIOS will not attempt to boot from alternative devices.
Boot-Up NumLock Status
Selects the power on state for system NumLock. Options: On/Off
Gate A20 Option
Gate A20 is a device used to address memory above 1 MB. The options are Fast and Normal. The Fa st setting is controlled by a chipset specific method. Normal setting is controlled by keyboard controller or chipset hardware.
Security Option
Selects whether a password is required every time the system boots or only when setup is entered. Options include:
X System: The system will not boot without password access
and access to Setup will be denied if an incorrect password is entered at the prompt.
X Setup: The system will boot, but access to Setup will be
restricted without password access.
To disable security, select PASSWORD SETTINGS in the Main Menu. The user will then be prompted to enter a password. To dis­able security, DO NOT type anything, only press <Enter>. Once security is disabled, the system will boot and setup can be accessed.
APIC Mode
Enables or disables the APIC Mode.
40 BIOS Setup
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MI-110
MPS Version Co ntrol for OS
This option is only valid for multiprocessor motherboards as it specifies the version of the Multiprocessor Specification (MPS) that the motherboard will use. The MPS is a specification by which PC manufacturers design and build Intel architecture systems with two or more processors.
MPS 1.1 was the original specification. MPS version 1.4 adds extended configuration tables for improved support of multiple PCI bus configurations and greater expandability in the future. In addi­tion, MPS 1.4 introduces support for a secondary PCI bus without requiring a PCI bridge.
Small Logo (EPA) Show
This item allows you enabled/disabled display of the small EPA logo during POST.
BIOS Setup 41
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4.4 Advanced Chipset Features

DRAM Clock/Drive Control
When set to “BySPD”, the DRAM timing parameters are set according to DRAM SPD (Serial Presence Detect). When dis­abled, one can manually set the DRAM timing parameters using the sub items below. Set to “BySPD” if not sure.
CAS Latency Time
Controls the latency between the SDRAM Read command and the time data actually becomes available.
DRAM RAS# to CAS# Delay
Controls the latency between the DDR SDRAM active command and the read/write command.
DRAM RAS# Precharge
Controls the idle clocks after issuing a precha rge comma nd to the DDR SDRAM.
Precharge delay (tRAS)
This setting controls the precharge delay, which determines the timing delay for DRAM precharge.
System Memory Frequency
Allow to choose different frequency of memory module.
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MI-110
System BIOS Cacheable
Selecting “Enabled” allows caching of the system BIOS ROM at F0000h- FFFFFh, resulting in better system performance. How­ever, if any pro-gram writes data to this memory area, a system error may occur.
Video BIOS Cacheable
Selecting Enabled allows caching of the video BIOS ROM at F0000h-FFFFFh, resulting in better video performance. However, if any program writes to this memory area, a system error may result.
Memory Hole At 15M-16M
Enabling this feature reserves 15 MB to 16 MB memory address space for ISA expansion cards that specifically require this setting. This makes memory from 15 MB and up unavailable to the sys­tem. Expansion cards can only access memory up to 16 MB. The default setting is “Disabled”.
On-Chip Frame Buffer Size
The On-Chip Frame Buffer Size can be set as 1MB or 8MB. This memory is shared with the system memory.
DVMT Mode
Use this field to select the memory to allocate for video memory. The choices are “Fixed”, “DVMT” and “BOTH”.
DVMT/FIXED Memory Size
Specify the size of DVMT/system memory to allocate for video memory.
Boot Display
Options: VBIOS Default, CRT, LFP, CRT+LFP, EFP(DVI), CRT+EFP(DVI). (VBIOS Default: CRT, LFP: LVDS Flat Panel, EFP(DVI): DVI)
Panel Number (LVDS panel resolution)
Options: 640x480 18bit, 800x600 18bit, 1024x768 18bit, 1024x768 18bit/2 (dual channel).
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4.5 Integrated Peripherals

44 BIOS Setup
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On Chip IDE Device

IDE HDD Block Mode
If your IDE hard drive supports block mode select Enabled for automatic detection of the optimal number of block re ad/writes per sector the drive can support.
MI-110
IDE DMA Transfer Access
Use this field to enable or disable IDE DMA transfer access.
OnChip Primary/Seondary PCI IDE
The integrated peripheral controller contains an IDE interface with support for two IDE channels. Select Enabled to activate each channel separately.
IDE Primary/Secondary Master/Slave PIO/UDMA Mode
Two IDE devices may have a different Mode timing (0, 1, 2, 3,
4), which need to be independent. The default setting “Auto” will allow auto detection to ensure optimal performance.
On-Chip SerialATA
Options: Disabled, Auto, Combined Mode, Enhanced Mode, SATA only
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Onboard Device

Azalia Audio Select
Select [Disabled] if you do not want to use Azalia audio. Con­figuration options: [Enabled] [Disabled]
46 BIOS Setup
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Super I/O Device

MI-110
Power ON Function
This feature allows you to wake up the system using any of the listed options. The selections are “Hot KEY”, “Mouse Left”, “Mouse Right”, “Any KEY” and “BUTTON ONLY” (default).
KB Power ON Password
The system will ask for a password, after entering the correct password the keyboard can then be used.
Hot Key Power ON
Awaken the system by pressing the hot key button. The options are “Ctrl-F1”, “Ctrl-F2”, “Ctrl-F3” to “Ctrl-F8”.
Onboard Serial Port 1/2
The settings are “3F8/IRQ4”, “2F8/IRQ3”, “3E8/IRQ4”, “2E8/IRQ3”, and “Disabled” for the on-board serial connector.
Onboard Parallel Port
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This field sets the address of the on-board p arallel por t connec­tor. You can select “378/IRQ7”, “278/IRQ5”, “3BC/IRQ7”, or “Disabled”. If you install an I/O card with a parallel port, make sure there is no conflict in the address assignments. The single board computer can support up to three parallel ports.
PWRON After PWR-Fail
Determines which state the computer enters when AC power is restored after a power loss. The options for this value are On, Off, and Former-Sts.
Onboard LAN1/2 Boot ROM
Options: Enable, Disable.
Watchdog Timer Select
This option will determine watch dog timer. Options: Disabled, 10, 20, 30, 40 Sec. 1, 2, 4 Min.
Onboard Serial Port 3/4
Options: Disable, 3F8, 2F8, 3E8, 2E8
Serial Port 3/4 Use IRQ
Options: IRQ3, IRQ4, IRQ10, IRQ11
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USB Device Setting

MI-110
USB Controller
The options: Disabled, Enabled.
USB 2.0 Controller
The options: Disabled, Enabled.
USB Operation Mode
Allows you to configure the USB 2.0 controller in HiSpeed (480 Mbps) or Full Speed (12 Mbps). Configuration options: [Full/Low Speed] [HiSpeed]
USB Keyboard Function
The options: Disabled, Enabled.
USB Mouse Function
The options: Disabled, Enabled.
USB Storage Function
The options: Disabled, Enabled.
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Security Chip Configuration

TPM Support
The choices are “Enabled” and “Disabled”.
TPM Current Status
This item shows you the current TPM status.
TPM Status
The options are “No Change” / “Clear” / “Enable & Activate” / “Deactivate & Disable”.
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4.6 Power Management Setup

MI-110
ACPI Function
The options are “Enabled” and “Disabled”.
ACPI Suspend Type
This item allows you to set ACPI suspend type to S1/POS (Power On Suspend) or S3/STR (Suspend To RAM).
Run VGABIOS if S3 Resume
Select “Auto” to run VGA BIOS if S3 resume automatically. The “Yes” enables running VGA BIOS if S3 resume. The “No” disables this function.
Power Management
There are three selections for Power Management, and each of them has fixed mode settings.
X Min. Power Saving: Minimum power management, HDD
Power Down = 15 Min,
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X Max. Power Saving: Maximum power management, HDD
Power Down =1 Min
X User Defined: Allows you to set each mode individually .
When not disabled, each of the ranges are from 1 min. to 1 hr. except for HDD Power Down which rang es from 1 min. to 15 min. and disable.
Video Off Method
Use this to select the method to turn off the video. The options are “Blank Screen”, “V/H SYNC+ Blank”, and “DPMS”.
Video Off In Suspend
When the system is in suspend mode, the video will turn off. The options are “No” and “Yes”.
Suspend Type
Select the suspend type. The choice: Stop Grant, Pwron suspend.
MODEM Use IRQ
This determines the IRQ in which the MODEM can use. The options: NA, 3, 4, 5, 7, 9, 10, 11.
Suspend Mode
Enable/disable system suspend.
HDD Power Down
Select “1-15 mins” to enable HDD Power Down mode between 1 to 15 mins. Select “Disabled” to disable HDD Power Down func­tion.
Soft-Off by PWR-BTTN: Configures the power button:
X Instant-Off: The power button functions as a normal power-
on/-off button.
X Delay 4 Sec: The system is turned off if the power button is
pressed for more than four seconds. Pressing the button momentarily (for less than 4 seconds) will switch the system to “suspend” mode.
Wake-Up by PCI card
The options are “Enabled” and “Disabled”.
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MI-110
Power On by Ring
Select “Enabled” to power on the system from a soft off state by an input signal on the serial Ring Indicator (RI) line. The options are “Enabled” and “Disabled”.
USB KB Wake-Up from S3
When “Enabled”, enter any key to wake up the system from S3 state. The options are “Enabled” and “Disabled”.
Resume by Alarm
When “Enabled”, set the date and time at which the RTC (real­time clock) alarm awakens the system from suspend mode. The options are “Enabled” and “Disabled”.
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4.7 PnP/PCI Configurations

This section describes configuring the PCI (Personal Computer Interconnect) bus system. PCI is a system which allows I/O devices to operate at speeds nearing the speed the CPU itself uses when communicating with its own components.
Init Display First
This item allows you to choose the first display interface to initiate while booting. The choice is “PCI Slot” or “Onboard”.
Reset Configuration Data
The default is “Disabled”. Select Enabled to reset Extended Sys­tem Configuration Data (ESCD) if you have in st alled a new add-on card, and system configuration is in such a state that the OS can­not boot.
Resource Controlled By
The commands here are “Auto (ESCD)” or “Manual”. Choosing “Manual” requires you to choose resources from the following sub­menu. “Auto(ESCD)” automatically configures all of the boot and Plug and Play devices, but you must be using Windows 95 or above.
54 BIOS Setup
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MI-110
PCI/VGA Palette Snoop
This is set to “Disabled” by default.
INT Pin 1/2/3/4/5/6/7/8 Assignme nt
The options: Auto, 3, 4, 5, 7, 9, 10, 11
Maximum Payload Size
This allows you to set the maximum TLP payload size for PCI Express devices. The options are [128 bytes], [256 bytes], [512 bytes], [1024 bytes], [2048 bytes], and [4096 bytes].
BIOS Setup 55
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4.8 PC Health Status

Shutdown Temperature
Options: 60 °C/140 °F, 65 °C/149 °F, 70 °C/158 °F, Disabled
CPU Warning Temperature
Options: Disabled, 50 °C/122 °F, 53 °C/127 °F, 56 °C/133 °F, 60 °C/140 °F, 63 °C/145 °F, 66 °C/151 °F, 70 °C/158 °F
56 BIOS Setup
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4.9 Frequency/Voltage Control

MI-110
Auto Detect PCI Clk
This allows you to enable or disable auto detect PCI clock. Options: Enabled, Disabled.
Spread Spectrum
This setting allows you to reduce EMI by modulating the signals the CPU generates so that the spikes are reduced to flatter curves. This is achieved by varying the frequency slightly so that the signal does not use any particular frequency for more than a moment. Options: Enabled, Disabled.
CPU/Host/SRC/PCI Clock
Options: Default, 133/100/33
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4.10 Load Optimized Defaults

Use this menu to load the BIOS default values that are factory set­tings for optimal performance system operations. Press “Y” to loa d the default values setting for optim al performance system opera­tions.
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MI-110

4.11 Set Supervisor & User Password

These two options set the system password. Supervisor Password sets a password that will be used to protect the system and Setup utility. User Password sets a password that will be used exclu­sively on the system. To specify a password, highlight the type you want and press < Enter >. The “Enter Password:” message prompts you on the screen. Type the password, up to eight char­acters in length, and press < Enter >. The system confirms your password by asking you to type it again. After setting a password, the screen automatically returns to the main screen.
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4.12 Save & Exit Setup

This option allows you to determine whet her to accept a ny modifi­cations or not. Typing Y will quit the setup utility and save all changes into the CMOS memory. Typing “N” will return to the Setup Utility Main Screen.
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MI-110

4.13 Exit Without Saving

Select this option to exit the Setup utility without saving the changes you have made in this session. Typing “Y” will quit the Setup utility without saving any modifications. Typing “N” will return to the Setup utility.
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Appendix A - Watchdog Timer

The programming instructions for the MI-110’s Watchdog Timer are as follows.

A.1 WDT Programming Instructions

Unlock W83627DHG-A:
outportb(0x2E, 0x87) ;Unlock Super I/O
Select Logical Device:
outportb(0x2E, 0x07) ;Select device number register outportb(0x2F, 0x08) ;Set to Logical Device 8
Activate WDT:
outportb(0x2E, 0x30) ;Select WDTO# activate register outportb(0x2F, 0x01) ;Enable watchdog
Set Seconds or Minutes:
outportb(0x2E, 0xF5) ;Select WDTO# control register outportb(0x2F, mode)
;where mode=0x00(Sec) or 0x08(Min)
MI-110
Set base timer:
outportb(0x2E, 0xF6) ;Select WDTO# counter register outportb(0x2F, timeout) ;where timeout=0x00~0xFF
Reset timeout counter:
outportb(0x2E, 0xF6) ;Select WDTO# counter register outportb(0x2F, timeout) ;where timeout=0x00~0xFF}
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64 Watchdog Timer
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Appendix B - System Resources

B.1 System Memory Map

MI-110
Address Range
(decimal)
(4GB-2MB)
(4GB-18MB) – (4GB-17MB-1)
(4GB-20MB) – (4GB-19MB-1)
15MB – 16MB
960 K – 1024 K F0000 – FFFFF 64 KB System BIOS Area
896 K – 960 K E0000 – EFFFF 64 KB Extended System BIOS Area
768 K – 896 K C0000 – DFF FF 128 KB
640 K – 768 K A0000 – BFFFF 128 KB Video Buffer & SMM space
0 K – 640 K 00000 – 9FFFF 640 KB DOS Area
Note: Whole D0000H segment except PXE occupied area can be for­warded to ISA bus.
Address Range
(hex)
FFE00000 –
FFFFFFFF
FEE00000 –
FEEFFFFF
FEC00000 –
FECFFFFF
F00000 –
FFFFFF
Table B-1: System Memory Map
Size Description
2 MB High BIOS Area
1 MB FSB Interrupt Memory Space
1 MB APIC Configuration Space
1 MB ISA Hole
PCI expansion ROM area C0000 – CBFFF: Onboard VGA BIOS CC000 – CCFFF: Intel 82566DM PXE option ROM when onboard LAN boot ROM is enabled.
System Resources 65
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B.2 Direct Memory Access Channels

Channel Number Data Width System Resource
08-bits 18-bits
28-bits 38-bits
Parallel port
Diskette drive
Parallel port 4 8-bits Direct memory access controller 5 16-bits Open 6 16-bits Open 7 16-bits Open
Table B-2: Direct Memory Access Channels
Note(1): DMA channel 1/3 is selected when using parallel port. Floppy
(Winbond default uses DMA 02) and parallel port cannot be used at the same time.
(1)
(1)
(1)
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B.3 Fixed I/O Map

Hex Range Device
000-01F DMA controller 1, 82C37 equivalent
020-02D and
030-03F 02E-02F LPC SIO (W83627) configuration index/data registers
040-042-043 Timer/Counter
4E-4F N/A
061 NMI controller
60,62,64,66 N/A (MicroController)
070-077 Real Time Clock Controller
080-9F DMA Controller, or LPC or PCI
0A0-0AD and
0B4-0BD
0B2 and 0B3 Power Management
0C0-0DF DMA controller
0F0
0170-177 SATA Controller, or PCI
01F0-1F7 SATA Controller, or PCI
0376 SATA Controller, or PCI 03F6 SATA Controller, or PCI
04D0-4D1 Interupt Controller
0CF9 Reset Generator
Interrupt controller 1, 8259 equivalent
Interrupt controller
Read PCI and Master Abord, Write FERR#/IGNNE#/ Interrupt Controller
MI-110
Table B-3: Fixed I/O Map
System Resources 67
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B.4 Variable I/O Map

Hex Range Device
400 ACPI Anywhere in 64KB I/O Space USB UHCI Controller #1 Anywhere in 64KB I/O Space USB UHCI Controller #2 Anywhere in 64KB I/O Space USB UHCI Controller #3 Anywhere in 64KB I/O Space USB UHCI Controller #4 Anywhere in 64KB I/O Space USB UHCI Controller #5
500 SMBUS
460 TCO
480 GPIO
378-37F Parallel Port
3F8/2F8/3E8/2E8 Serial Port 1 Serial Port 2
3E8/2E8 Serial Port 3, Serial Port 4
290 Hardware Monitor
Table B-4: Variable I/O Map
68 System Resources
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B.5 Interrupt Request (IRQ) Lines

IRQ Lines PIC Mode

MI-110
IRQ#
0 System timer N/A No 3
4
5
8
9
10
11
13 Numeric data processor 14 Primary IDE controller
Note(1): These IRQs can be used for PCI devices when onboard device is disabled. If IRQ is from ISA, user must reserve IRQ for ISA in BIOS setup menu.
Typical Interrupt
Resource
Communications port (COM2)
Communications port (COM1)
Intel® 82801G (ICH7) SMBus controller - 27DA
System CMOS / Real-time clock
Microsoft ACPI-compliant system
Communications port (COM3)
Communications port (COM4)
Table B-5: IRQ Lines PIC Mode
Connected to Pin Note
IRQ3 via SERIRQ, IRQ3 at ISA bus
IRQ4 via SERIRQ, IRQ4 at ISA bus
IRQ10 via SERIRQ, IRQ10 at ISA bus
IRQ11 via SERIRQ, IRQ11 at ISA bus
Note (1)
Note (1)
Note (1)
Note (1)
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IRQ Lines APIC Mode

IRQ# Typical Interrupt Resource Connected to Pin Note
0 System Timer 3 Communications port (COM2)
4 Communications port (COM1)
Intel® 82801G (ICH7) SMBus
5
controller - 27DA System CMOS /
8
Real-time clock
9 Microsoft ACPI-compliant system
10 Communications port (COM3)
11 Communications port (COM4) 13 Numeric data processor
14 Primary IDE controller 16 PCI standard PCI-to-PCI bridge
Standard Universal PCI to USB Host
16
Controller
18 PCI standard PCI-to-PCI bridge
Realtek RTL8168C/8111C PCI-E
18
Gigabit Ethernet NIC Standard Universal PCI to USB Host
18
Controller
19 PCI standard PCI-to-PCI bridge
Realtek RTL8168C/8111C PCI-E
19
Gigabit Ethernet NIC #2 Standard Universal PCI to USB Host
19
Controller Standard Universal PCI to USB Host
23
Controller Standard Universal PCI to USB Host
23
Controller
IRQ3 via SERIRQ, IRQ3 at ISA bus
IRQ4 via SERIRQ, IRQ4 at ISA bus
IRQ10 via SERIRQ, IRQ10 at ISA bus
IRQ11 via SERIRQ, IRQ11 at ISA bus
Note (1)
Note (1)
Note (1)
Note (1)
T ab le B-6: IRQ Lines APIC Mode
Note (1): These IRQs can be used for PCI devices when onboard
device is disabled. If IRQ is from ISA, user must reserve IRQ for ISA in BIOS setup menu.
70 System Resources
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B.6 PCI Configuration Space Map

Bus # Device # Function # Routing Description
00 00 00 Internal Intel Host Bridge 00 02 00 Internal Intel VGA-compatible Controller 00 02 01 Internal Intel Other Display Controller 00 1B 00 Internal Unknown Device 00 1C 00 Internal Intel PCI-to-PCI Bridge 00 1C 02 Internal Intel PCI-to-PCI Bridge 00 1C 03 Internal Intel PCI-to-PCI Bridge 00 1D 00 Internal Intel UHCI USB Controller 00 1D 01 Internal Intel UHCI USB Controller 00 1D 02 Internal Intel UHCI USB Controller 00 1D 03 Internal Intel UHCI USB Controller 00 1D 07 Internal Intel USB v2.0 Controller 00 1E 00 Internal 00 1F 00 Internal Intel ISA Bridge 00 1F 02 Internal Intel IDE Controller 00 1F 03 Internal Intel SMBus Device 02 00 00 Internal Realtek Ethernet Controller 03 00 00 Internal Realtek Ethernet Controller
Intel Subtractive Decode P2P Bridge
MI-110
Table B-7: PCI Configuration Space Map
System Resources 71
Page 84

B.7 PCI Interrupt Routing Map

INT Line INT1 INT2 INT3 INT4
Intel VGA compatible Controller X
Intel Multimedia device X Intel PCI-to-PCI Bridge X Intel PCI-to-PCI Bridge X
Intel PCI-to-PCI Bridge X Intel UHCI USB Controller X Intel UHCI USB Controller X Intel UHCI USB Controller X Intel UHCI USB Controller X
Intel USB v2.0 Controller X
Intel IDE Controller X
Intel SMBus Device X Realtek Ethernet Controller X Realtek Ethernet Controller X
Table B-8: PCI Interrupt Routing Map
72 System Resources
Page 85
MI-110

Important Safety Instructions

For user safety, please read and follow all instructions, WARNINGS, CAUTIONS, and NOTES marked in this manual
and on the associated equipment before handling/operating the equipment.
X Read these safety instructions carefully. X Keep this user’s manual for future reference. X Read the specifications section of this manual for detailed
information on the operating environment of this equipment.
X When installing/mounting or uninstalling/removing
equipment:
Z Turn off power and u nplug any power cords/cables.
X To avoid electrical shock and/or damage to equipment:
Z Keep equipment away from water or liquid sources;
Z Keep equipment away from high heat or high humidity;
Z Keep equipment properly ventilated (do not block or
cover ventilation openings);
Z Make sure to use recommended voltage and powe r
source settings;
Z Always install and operate equipment near an easily
accessible electrical socket-outlet;
Z Secure the power cord (do not place any obje ct on /ove r
the power cord);
Z Only install/attach and operate equipment on stable
surfaces and/or recommended mountings; and,
Z If the equipment will not be used for long periods of time,
turn off and unplug the equipment from its power source.
Important Safety Instructions 73
Page 86
X Never attempt to fix the equipment. Equipmen t sho u ld on ly
be serviced by qualified personnel.
A Lithium-type battery may be provided for uninterrupted, backup or emergency power.
Risk of explosion if battery is replaced with one of an incorrect
WARNING:
type. Dispose of used batteries appropriately.
X Equipment must be serviced by authorized technicians
when:
Z The power cord or plug is damaged; Z Liquid has penetrated the equipment; Z It has been exposed to high humidity/moisture; Z It is not functioning or does not function according to the
user’s manual;
Z It has been dropped and/or damaged; and/or, Z It has an obvious sign of breakage.
74 Important Safety Instructions
Page 87
MI-110

Getting Service

Contact us should you require any service or assistance.
ADLINK Technology Inc.
Address: 9F, No.166 Jian Yi Road, Chungho City,
Taipei County 235, Taiwan
؀קᗼխࡉؑ৬ԫሁ 166 ᇆ 9 ᑔ Tel: +886-2-8226-5877 Fax: +886-2-8226-5717 Email: [email protected]
Ampro ADLINK Technology Inc.
Address: 5215 Hellyer Avenue, #110, San Jose, CA 95138, USA Tel: +1-408-360-0200 Toll Free: +1-800-966-5200 (USA only) Fax: +1-408-360-0222 Email: [email protected]
ADLINK Technology Beijing
Address: ࣫ҀᏖ⍋⎔Ϟഄϰ䏃 1 োⲜ߯ࡼ࡯໻ E ᑻ 801 ᅸ
(100085)
Rm. 801, Power Creative E, No. 1, B/D
Shang Di East Rd., Beijing 100085, China Tel: +86-10-5885-8666 Fax: +86-10-5885-8625 Email: [email protected]
ADLINK Technology Shanghai
Address: Ϟ⍋Ꮦⓩ⊇⋒催⾥ᡔᓔথ䩺∳䏃 333 ো 39 ᐶ 4 ሖ
(200233) Tel: +86-21-6495-5210 Fax: +86-21-5450-0414 Email: [email protected]
ADLINK Technology Shenzhen
Address: ⏅ഇᏖቅ⾥ᡔು催ᮄϗ䘧᭄ᄫᡔᴃು
A1 󰶀 2 ὐ C  (518057)
2F, C Block, Bld. A1, Cyber-Tech Zone,
Gao Xin Ave. Sec 7, High-Tech Industrial Park S.,
Shenzhen, 518054 China Tel: +86-755-2643-4858 Fax: +86-755-2664-6353 Email: [email protected]
Getting Service 75
Page 88
ADLINK Technology Inc. (German Liaison Office)
Address: Nord Carree 3, 40477 Duesseldorf, Germany Tel: +49-211-495-5552 Fax: +49-211-495-5557 Email: [email protected]
ADLINK (French Liaison Office)
Address: 15 rue Emile Baudot, 91300 MASSY Cedex, France Tel: +33 (0) 1 60 12 35 66 Fax: +33 (0) 1 60 12 35 66 Email: [email protected]
ADLINK Technology Japan Corporation
Address: 151-0072 ᧲ㇺ󰶇⼱඙ᐈ䊱⼱㩷
1-1-2 ᦺᣣ↢๮ᐈ䊱⼱䊎䊦 8F Asahiseimei Hatagaya Bldg. 8F
1-1-2 Hatagaya, Shibuya-ku, Tokyo 151-0072, Japan Tel: +81-3-4455-3722 Fax: +81-3-5333-6040 Email: [email protected]
ADLINK Technology Inc. (Korean Liaison Office)
Address: 昢殾柢 昢爎割 昢爎壟 1506-25 穢壊 B/D 2 猻
2F, Hando B/D, 1506-25, Seocho-Dong,
Seocho-Gu, Seoul, 137-070, Korea Tel: +82-2-2057-0565 Fax: +82-2-2057-0563 Email: [email protected]
ADLINK Technology Singapore Pte Ltd.
Address: 84 Genting Lane #07-02A, Cityneon Design Centre,
Singapore 349584 Tel: +65-6844-2261 Fax: +65-6844-2263 Email: [email protected]
ADLINK Technology Singapore Pte Ltd. (Indian Liaison Office)
Address: No. 1357, "Anupama", Sri Aurobindo Marg, 9th Cross, JP Nagar Phase I, Bangalore - 560078, India Tel: +91-80-65605817 Fax: +91-80-22443548 Email: [email protected]
76 Getting Service
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