ADLINK HPERC-IBR-MC User Manual
HPERC-IBR-MC/MH
High Performance Extreme Rugged™ Computer System
User’s Manual
Manual Rev.: 0.20 Preliminary
Revision Date: May 5, 2015
Part No: 50-1Z178-1000
Advance Technologies. Automate the World.
Revision History
Revision Reason for Change Date
0.10 Preliminary draft 13-01-2015
0.20 Minor corrections 05-05-2015
ii Revision History
HPERC-IBR-M
Preface
© Copyright 2015 ADLINK Technology, Inc.
www.adlinktech.com
Disclaimer
Information in this document is provided in connection with ADLINK products. No license,
express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products,
ADLINK assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. If you intend to use ADLINK products in or as medical devices, you
are solely responsible for all required regulatory compliance, including, without limitation, Title
21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may
make changes to specifications and product descriptions at any time, without notice.
Trademarks
MS-DOS, Windows, Windows 95, Windows 98, Windows NT and Windows XP are trademarks of Microsoft Corporation. PS/2 is a trademark of International Business Machines, Inc.
Intel and Solid State Drive are trademarks of Intel Corporation. PC/104 is a registered trademark of the PC/104 Consortium. CoreModule is a registered trademark, and ADLINK, Little
Board, LittleBoard, MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard,
ReadyBox, ReadyPanel, RuffSystem, ReadySystem, and HPERC are trademarks of
ADLINK Technology, Inc. All other marks are the properties of their respective companies.
Audience
This manual provides reference only for computer design engineers, including but not limited
to hardware and software designers and applications engineers. ADLINK Technology, Inc.
assumes you are qualified to design and implement prototype computer equipment.
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iv Preface
HPERC-IBR-M
Table of Contents
Revision History................................................................................................................... ii
Preface................................................................................................................................. iii
List of Figures .................................................................................................................... vii
List of Tables....................................................................................................................... ix
1 HPERC-IBR-M Setup ........................................................................................................1
1.1 About the HPERC-IBR-M....................................................................................................... 1
1.2 Using this Guide..................................................................................................................... 1
1.3 Requirements......................................................................................................................... 1
1.4 Device/Peripheral Connections.............................................................................................. 1
1.5 Power Specifications............................ .... .......................................... ... ... ... .... ... ... ... ... .... ....... 2
1.6 Environmental Specifications................................................................................................. 3
1.7 What’s in the Box.... .... ... ... ... .... .......................................... ... ... .............................................. 4
1.8 Setup Steps ........................................................................................................................... 5
1.9 Setting Up the Work Space ................................................................................................... 5
1.10 Installing Mounting Screws.................................................................................................... 6
1.11 Connecting Peripherals.......................................................................................................... 8
1.12 P2 and P3 Military Connector........................................ .... ... ... ... ... ...................................... 10
1.12.1P2 Pin Definit ions ..................................... ... .... ... ... ... .......................................... ... .... ......11
1.12.2P3 Pin Definit ions ..................................... ... .... ... ... ... .......................................... ... .... ......14
1.13 Applying Power to the HPERC-IBR-M................................................................................. 19
2 Internal Components......................................................................................................21
2.1 HPERC-IBR-M Assembly Procedures................................................................................. 21
2.1.1 Tools Required ................................................................................................................21
2.1.2 Shutting Down the HPERC-IBR-M ..................................................................................21
2.1.3 Replacing the SSDs (Solid State Drives).........................................................................22
2.1.4 Replacing the SD (Secure Digital) Memory Card ............................................................23
2.1.5 Removing and installing the system cover plate on the HPERC-IBR-M enclosure.........24
2.1.6 Replacing the PCI/104-Express expansion module ........................................................25
2.1.7 Replacing the SODIMM memory........................................................ ... .... ... ... ... ... .... ...... 27
2.1.8 Replacing the Mini PCIe Card .........................................................................................30
Appendix A Sample Code............................................................................................... 31
Getting Service................................................................................................................... 33
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vi
HPERC-IBR-M
List of Figures
Figure 1-1: i7-3517UE Peak In-Rush Current and Duration...............................................................2
Figure 1-2: HPERC-IBR-M Unit with Accessories..............................................................................4
Figure 1-3: Top and Front Views of “MH” Enclosure with Mounting Dimensions ...............................6
Figure 1-4: Top and Front Views of “MC” Enclosure with Mounting Dimensions ...............................7
Figure 1-5: Front View of HPERC-IBR-M I/O Panel...........................................................................8
Figure 1-6: P2 and P3 Military Interface Connector Pin Locations...................................................10
Figure 2-7: Exploded View of HPERC-IBR-M with SSDs.................................................................22
Figure 2-8: Exploded View of HPERC-IBR-M with SD Card ............................................................23
Figure 2-9: Exploded View of HPERC-IBR-M with System Cover Plate and Screws ......................24
Figure 2-10: Exploded View of HPERC-IBR-M with SSD Bracket and Screws..................................25
Figure 2-11: Exploded View of HPERC-IBR-M with PCI/104-Express Module and Screws ..............26
Figure 2-12: Top View of HPERC-IBR-M with Open Enclosure and Flexible Printed Circuit Screws 27
Figure 2-13: Exploded View of HPERC-IBR-M with Flexible Printed Circuit Connector ....................28
Figure 2-14: Exploded View of HPERC-IBR-M with interface board..................................................28
Figure 2-15: Exploded View of HPERC-IBR-M with SODIMM and Cover Plate ................................29
Figure 2-16: Top View of HPERC-IBR-M with Open Enclosure and Mini PCIe Card.........................30
List of Figures vii
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viii List of Figures
HPERC-IBR-M
List of Tables
Table 1-1: System Power Requirements ............................................................................................2
Table 1-2: Environmental Requirements .......................................................................... ... ...............3
Table 1-3: I/O Panel Connectors (Refer to Figure 1-5 for connector locations.).................................9
Table 1-4: P2 Military Connector Signals..........................................................................................11
Table 1-5: P3 Connector Pin Signals................................................................................................14
List of Tables ix
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x List of Tables
HPERC-IBR-M
1 HPERC-IBR-M Setup
1.1 About the HPERC-IBR-M
The HPERC products are intended for users of embedded systems requiring long life-cycles,
configuration control, and ruggedness in hardened military packages. HPERC models feature
Extreme Rugged™ computer boards available with varieties of processors and memory. An
optional operating system (OS) can be pre-loaded onto an optional internal storage device (two
2 ½" Solid State Drives (SSDs). Board Support Packages (BSPs) are provided on the optional
Support Software QuickDrive™ to support addition al OSs. Just use a USB memory to load your
application software and you are ready to use your system.
1.2 Using this Guide
This guide provides the most efficient way to set up your HPERC-IBR-M with your desired OS.
The instructions provided in this guide include:
X Removing the HPERC-IBR-M from the shipping container and inspecting the accesso-
ries
X Connecting peripherals to the HPERC-IBR-M
X Powering up the HPERC-IBR-M
X Opening the HPERC-IBR-M
X Replacing internal components
Information not provided in this User’s Guide includes:
X Board or Module specifications
X Board or Module header signals and descriptions
X Operating system programming or operating instructions
NOTE: Refer to OS manufacturers’ manuals for instructions when using OS software.
1.3 Requirements
The following peripherals and devices are needed to make full use of the HPERC-IBR-M.
X Peripherals (user-provided):
Z USB or PS/2 keyboard
Z USB or PS/2 mouse
Z Display monitor
NOTE: The items listed above are not available from ADLINK.
X Power Supply (optional):
Z AC Adapter (with plug-type mating cord)
1.4 Device/Peripheral Connections
X Ethernet (LAN) connections
X USB device connections
X At least one PCIe/104-Express expansion module
1
1.5 Power Specifications
Table 1-1 defines the current draw values of the HPERC-IBR-M, featuring either the 3517UE,
3555LE, or 3612QE i7 CPUs. The table captures In-Rush, Idle, and Burn-In-Test (BIT) currents
at +28V input voltage.
Table 1-1 lists the current draw values of the HPERC-IBR-M
Parameter 1.7GHz CPU (i7-3517UE) 2.5GHz CPU (i7-3555LE) 2.1GHz CPU (i7-3612QE)
Input Type
In-Rush Peak
Current and
Duration
Idle Current and
Power
(Windows 7)
BIT Current and
Power
Operating configurations:
X In-rush operating configuration includes one VGA monitor and 4GB DDR3-1333L RAM.
X Idle operating configuration includes the In-rush configurat ion as well as one SATA 3.5"
HDD with Windows XP and one USB keyboard and mouse.
X BIT (Burn-In-Test) operating configuration is the same as the Idle configuration
+28 VDC Regulated DC +28 VDC Regulated DC +28 VDC Regulated DC
See Figure 1-1 Not yet measured Not yet measured
0.79A (22.22W) Not yet measured Not yet measured
1.18A (32.96W) Not yet measured Not yet measured
Table 1-1: System Power Requirements
Figure 1-1: i7-3517UE Peak In-Rush Current and Duration
2
HPERC-IBR-M
1.6 Environmental Specifications
Table 1-2 provides the most efficient operating and storage condition ranges required for this
system.
NOTE: Extended temperature range available only on extended temperature tested (ETT)
systems.
Temperature Humidity
Standard Storage Extended Operating Non-operating
-20° to +65°C
(-4° to +149°F)
–55° to +85°C
(–67° to +185°F)
T able 1-2: Environmental Requirements
–40° to +75°C
(–40° to +167°F)
5% to 90%
relative humidity,
non-condensing
5% to 95%
relative humidity ,
non-condensing
3
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