ADLINK Express-HRR User Manual

Express-HRR

(Computer-on-Module)

Reference Manual

P/N 50-1Z100-1000

Notice Page

DISCLAIMER

ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for incidental or consequential damages or related expenses resulting from the use of this product, even if it has been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from time to time without obligation to notify any person of such revisions. If errors are found, please contact ADLINK at the address listed on this Notice Page.

TRADEMARKS

CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard, MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyBox, ReadyPanel, RuffSystem, and ReadySystem are trademarks of ADLINK Technology, Inc. All other marks are the property of their respective companies.

REVISION HISTORY

Revision Reason for Change Date

1000 Initial Release Nov/11

Audience

This manual provides reference only for computer design engineers, including but not limited to hardware and software designers and applications engineers. ADLINK Technology, Inc. assumes you are qualified to design and implement prototype computer equipment.

ii Reference Manual Express-HRR

Contents

Chapter 1 About This Manual ....................................................................................................1

Purpose of this Manual ....................................................................................................................1

References ..................................................................................................................................1

Chapter 2 Product Overview......................................................................................................3

COM Express Concept ...................................................................................................................3

COM Express Architecture .............................................................................................................4

Product Description..........................................................................................................................5

Module Features ........................................................................................................................5

Block Diagram ............................................................................................................................8

Major Components (ICs) .................................................................................................................9

Connectors, Headers, and Sockets ...............................................................................................11

Specifications.................................................................................................................................13

Physical Specifications ............................................................................................................13

Power Specifications ...............................................................................................................14

Environmental Specifications....................................................................................................14

Thermal/Cooling Requirements ................................................................................................15

Mechanical Specifications ........................................................................................................16

Chapter 3 Hardware .................................................................................................................17

Overview ........................................................................................................................................17

CPU ...............................................................................................................................................18

Graphics.........................................................................................................................................18

Memory .......................................................................................................................................18

Interrupt Channel Assignments .....................................................................................................19

Memory Map .................................................................................................................................20

I/O Address Map ...........................................................................................................................21

COM Express A-B Connector .......................................................................................................22

LPC Interface............................................................................................................................22

SATA Interface .........................................................................................................................22

USB Interface ...........................................................................................................................22

Power Interface ........................................................................................................................22

Power Management..................................................................................................................23

Video Interfaces........................................................................................................................23

Audio Interface ........................................................................................................................23

Ethernet Interface ....................................................................................................................23

I²C™ Bus ...............................................................................................................................23

PCI Express™ ..........................................................................................................................24

System Management Bus (SMBus) .........................................................................................24

GPIO.........................................................................................................................................24

COM Express C-D Connector ...................................................................................................27

Digital Display Interface (DDI) ..................................................................................................27

PCI Express™ ..........................................................................................................................27

PCI Express Graphics (PEG) ...................................................................................................28

SDVO........................................................................................................................................28

Watchdog Timer.............................................................................................................................31

TPM (Trusted Platform Module).....................................................................................................31

Hardware Voltage and Temperature Monitor ...............................................................................31

System Fan ...................................................................................................................................32

Express-HRR Reference Manual iii

Contents

Chapter 4 BIOS Setup .............................................................................................................. 33

Introduction.................................................................................................................................... 33

Entering BIOS Setup (VGA Display) ........................................................................................ 33

OEM Logo Screen (Splash Screen) .............................................................................................. 33

Logo Image Requirements....................................................................................................... 33

BIOS Setup Menus ....................................................................................................................... 34

BIOS Main Setup Screen ......................................................................................................... 34

BIOS Advanced Setup Screen................................................................................................. 35

BIOS Chipset Setup Screen..................................................................................................... 39

BIOS Boot Setup Screen ......................................................................................................... 41

BIOS Security Setup Screen.................................................................................................... 43

BIOS Save & Exit Setup Screen .............................................................................................. 44

Appendix A Technical Support .................................................................................................. 47

Index .................................................................................................................................................. 49

List of Figures

Figure 2-1. Mini, Compact, Basic and Extended Form Factors ................................................. 4

Figure 2-2. Functional Block Diagram ....................................................................................... 8

Figure 2-3. Component Locations (Top Side).......................................................................... 10

Figure 2-4. Component Locations (Bottom Side) .................................................................... 11

Figure 2-5. Connector Locations (Top Side)............................................................................ 12

Figure 2-6. Connector Locations (Bottom Side) ...................................................................... 13

Figure 2-7. Stack Heights of Cooling Assemblies (Side Views) .............................................. 15

Figure 2-8. Mechanical Dimensions (Top Side)....................................................................... 16

Figure 4-1. BIOS Main Setup Screen ...................................................................................... 34

Figure 4-2. BIOS Advanced Setup Screen .............................................................................. 35

Figure 4-3. BIOS Chipset Setup Screen.................................................................................. 39

Figure 4-4. BIOS Boot Setup Screen....................................................................................... 41

Figure 4-5. BIOS Security Setup Screen ................................................................................. 43

Figure 4-6. BIOS Save & Exit Setup Screen ........................................................................... 44

List of Tables

Table 2-1. COM Express Pin-out Types .................................................................................. 3

Table 2-2. Major Integrated Circuit Descriptions and Functions............................................... 9

Table 2-3. Module Connector and Socket Descriptions ......................................................... 11

Table 2-4. Weight and Footprint Dimensions ......................................................................... 13

Table 2-5. Power Supply Requirements ................................................................................ 14

Table 2-6. Environmental Requirements ................................................................................ 14

Table 2-7. ADLINK Optional Cooling Solutions ...................................................................... 15

Table 3-1. Interrupt Channel Assignments ............................................................................. 19

Table 3-2. Memory Map ......................................................................................................... 20

Table 3-3. I/O Address Map ................................................................................................... 21

Table 3-4. SMBus Reserved Addresses ................................................................................ 24

Table 3-5. COM Express A-B Connector Signal Descriptions................................................ 24

Table 3-6. COM Express C-D Connector Signal Descriptions ............................................... 28

Table 3-7. Optional System Fan (FAN1) ............................................................................... 32

Table 4-1. BIOS Setup Menus................................................................................................ 34

Table A-1. Technical Support Contact Information ................................................................. 47

iv Reference Manual Express-HRR

Chapter 1 About This Manual

Purpose of this Manual

This manual is for designers of systems based on the Express-HRR Computer-on-Module (COM). This manual contains information that permits designers to create an embedded system based on specific design requirements.

Information provided in this reference manual includes:

• Product Overview

• Hardware Specifications

• BIOS Setup Information

• Technical Support Information

Information not provided in this reference manual includes:

• Detailed chip specifications (refer to References section of this chapter for hyperlinks to chip

specifications)

• Internal component operation

• Internal registers or signal operations

• Bus or signal timing for industry standard busses and signals

• Pin-signal definitions for industry-standard interfaces

References

The following list of references may be helpful for you to complete your custom design successfully.

Specifications

• COM Express Specification Revision 2.0

Web site: http://www.picmg.org/

• PCIe Specification Revision 2.0

Web site: http://www.pcisig.com/specifications/pciexpress/base

• I

C Bus Specification Version 2.1

Specification: http://www.nxp.com/documents/other/39340011.pdf

• USB Specification Version 2.0

Web site: http://www.usb.org/developers

• SATA Specification Version 3.1

Web site: http://www.sata-io.org/

• LPC Specification Version 1.1

Web site: http://www.intel.com/design/chipsets/industry/lpc.htm

• SMBus Specification Version 2.0

Specification: http://smbus.org/specs/

• ADLINK Intelligent Device Interface (AIDI) Library User’s Manual (See Utilities section of Product

page)

Web site: http://www.adlinktech.com/Computer-on-Module/Com-Express/index.html

Express-HRR Reference Manual 1

Chapter 1 About This Manual

• AMI BIOS Aptio TSE User’s Guide

Datasheet: http://www.ami.com/support/doc/AMI_TSE_User_Manual_PUB.pdf

Chip Specifications

• Intel® Corporation and the Core™ i7 2nd Generation Mobile series CPU, featured as the integrated

processor core and graphics memory hub

Web site: http://www.intel.com/content/www/us/en/processors/core/CoreTechnicalResources.html

• Intel Corporation and the BD82QM67, 6 Series Express chipset, featured as the Platform Controller

Hub (PCH )

Datasheet: http://www.intel.com/Assets/PDF/datasheet/324645.pdf

• ON Semiconductor and the ADT7490-D chip, featured as the temperature monitor and fan controller

Datasheet: http://www.onsemi.com/pub_link/Collateral/ADT7490-D.PDF

• Atmel Corporation and the AT97SC3204T-U1A190, featured as the Trusted Platform Module (TPM),

integrated security module

Web sit e : http://www.atmel.com/products/Embedded/default.asp?category_id=172&family_id=620

• Atmel Corporation and the ATMEGA168V-10AU, featured as the Board Controller

Datasheet: http://www.atmel.com/dyn/resources/prod_documents/2545S.pdf

• Philips Corporation and the PCA9535BS chip, featured as the GPIO generator

Datasheet: http://www.datasheetcatalog.org/datasheet/philips/PCA9535.pdf

• Intel Corporation and the 82579LM chip used for the Gigabit Ethernet PHY transceiver

Datasheet: h

NOTE If you are unable to locate the datasheets using the links provided, search the internet

ttp://download.intel.com/design/network/datashts/82579.pdf

to find the manufacturer’s web site and locate the documents you need.

2 Reference Manual Express-HRR

Chapter 2 Product Overview

This introduction presents general information about the COM Express™ architecture and the Express-HRR Computer-on-Module (COM). After reading this chapter you should understand:

• COM Express concept

• COM Express architecture

• Express-HRR Product Description

• Express-HRR Major Components

• Express-HRR Connectors, Headers, and Sockets

• Express-HRR Specifications

COM Express Concept

COM Express is an open-industry standard, defined specifically for COM boards. Its creation provides the ability to make a smooth transition from legacy parallel interfaces to the newest technologies based on serial buses available today. COM Express modules are available in the following form factors:

• Mini 84mm x 55mm

• Compact 95mm x 95mm

• Basic 125mm x 95mm

• Extended 155mm x 110mm

The COM Express specification 2.0 defines seven different pinout types.

Table 2-1. COM Express Pin-out Types

Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports

Type 1 A-B Up to 6 1

Type 2 A-B C-D Up to 22 32 bit 1 1

Type 3 A-B C-D Up to 22 32 bit 3

Type 4 A-B C-D Up to 32 1 1

Type 5 A-B C-D Up to 32 3

Type 6 A-B C-D Up to 24 1

Type 10 A-B Up to 4 1

The Express-HRR utilizes the Basic form factor and the Type 6 pinout definition, featuring two high performance connectors that ensure stable data throughput. The Type 6 pinout removes the PCI interface signals and replaces them with DisplayPort, and HDMI display signals, thereby expanding the range of potential video peripherals beyond the familiar VGA, LVDS, and SDVO interfaces.

The COM board integrates all core components and is mounted onto an application specific baseboard. COM boards are legacy-free designs (no Super I/O, PS/2 keyboard, and PS/2 mouse) and provide most of the functional requirements for any application. These functions include, but are not limited to a rich complement of contemporary, high-bandwidth serial interfaces such as PCI Express, Serial ATA, USB 2.0, and Gigabit Ethernet. The robust thermal and mechanical concept of the COM board, combined with extended power management capabilities, is perfectly suited for all applications.

Express-HRR Reference Manual 3

Chapter 2 Product Overview

Baseboard designers can utilize as little or as many of the I/O interfaces as necessary. The baseboard can therefore provide all the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express modules are scalable, which means once an application has been created, the ability to diversify the product range is possible through the use of different performance class modules. Simply unplug one module and replace it with another. No redesign is necessary.

COM Express Architecture

The COM Express specification was developed by the PCI Industrial Computer Manufacturing Group (PICMG) in close collaboration with many leading companies across the embedded industry in order to find an implementation solution to handle upcoming new high-speed serial I/Os, processors, and chipsets. COM Express specifies four form factors, as well as seven different types of connector pinouts.

The four form factors are referred to as Mini, Compact, Basic, and Extended. The Mini form factor targets battery powered, mobile, and handheld system designs and features a footprint of just 84mm x 55mm. The Compact form factor is 95mm x 95mm, designed to match the requirements of small applications. The Basic module footprint is 125mm x 95mm and focuses on space-constrained, low power systems which typically do not contain more than one horizontal mounted SODIMM. The Extended footprint is slightly larger at 155mm x 110mm and supports up to two full-size, vertically mounted DIMM modules to accommodate larger memory configurations for high-performance CPUs, chipsets, and multiprocessor systems. The placement of the shielded 220-pin connectors and the mounting holes are identical between these four footprints.

Compact Form Factor

Mini Form Factor

Figure 2-1. Mini, Compact, Basic and Extended Form Factors

Basic Form Factor

Extended Form Factor

Note: Measurements are in millimeters

COM_FormFactors_b

4 Reference Manual Express-HRR

Chapter 2 Product Overview

Product Description

The Express-HRR is an exceptionally high integration, high performance, rugged Intel Core™ i7 processor based system compatible with the COM Express standard. This rugged and high quality module system contains all the component subsystems of an ATX motherboard.

The Intel Core i7 incorporates a multi processor core with an integrated Graphics Memory Hub (GMH), providing a high-performance processor, a memory controller for up to 16GB of SODIMM memory, and a graphics controller for LVDS, VGA, PCI Express graphics (PEG), SDVO, DisplayPort, and HDMI signals driven by the PCH.

The Intel BD82QM67 chipset provides controllers for the Platform Controller Hub (PCH) featuring eight USB 2.0 ports, four SATA ports, eight GPIO ports, and one Gigabit Ethernet interface (external magnetics required).

Expansion for additional system functions is possible on the Express-HRR through the PCIe and LPC expansion buses. The PCIe and LPC buses operate at clock speeds of 100MHz and 33MHz, respectively.

The Express-HRR is particularly well suited for either embedded or portable applications and meets the size, power consumption, temperature range, quality, and reliability demands of embedded system applications.

Module Features

• CPU

♦

Intel 1.5GHz (2610UE), 2.1GHz (2715QE), or 2.2GHz (2655LE), 2nd Generation Core i7 series processors

♦

DMI (Direct Media Interface) with 2 GB/s of bandwidth in each direction

♦

FDI (Flexible Display Interface) for carrying display traffic to the PCH

♦

Internal 256KB L2 cache

♦

Enhanced Intel SpeedStep® Technology (EIST)

• Memory

♦

Two standard 204-pin DDR3 SODIMM sockets

♦

Supports +1.5V DDR3, 1067/1333MHz RAM up to 16 GB total

♦

Supports ECC, unbuffered memory

• Expansion Buses

♦

PCIe between CPU/PCH and COM Express connectors

♦

LPC (Low Pin Count) for LPC devices

♦

I2C for fast mode I2C devices

• COM Express Interface

♦

SATA Interface

• Provides four SATA ports

• Supports up to 6 Gb/s transfer speed on two ports

• Supports up to 3 Gb/s transfer speed on all ports

• Supports Native Command Queuing

• Provides Auto Activate for DMA

• Supports Hot Plug features

Express-HRR Reference Manual 5

Chapter 2 Product Overview

♦

HD Audio

• Provides Intel HD Audio controller

• Supports Audio Docking

• Provides 32-bit sample depth

• Supports sample rates up to 192kHz

♦

USB Port Interface

• Supports two root USB hubs

• Supports eight EHCI USB 2.0 ports

• Supports legacy UHCI USB 1.1 signals

• Supports Per-Port-Disable

♦

Ethernet Interface

• Provides Intel 82579LM Ethernet PHY transceiver chip

• Supports one Gigabit Ethernet port

• Supports IEEE 802.3, 802.3u, 802.3z, and 802.3ab compatible physical layers

• Supports Auto-negotiation for speed, duplex mode, and flow control

• Supports half duplex at 10/100Mb/s or full duplex at 10/100/1000Mb/s

- Full-duplex mode supports transmit and receive frames simultaneously

- Supports IEEE 802.3x flow control in full duplex mode

- Half-duplex mode supports enhanced proprietary collision reduction mode

♦

Video Interfaces (VGA/LVDS/PEG/SDVO/DisplayPort/HDMI)

• Support the DisplayPort standard

• Support Graphics Performance Modulation Technology

• Support Intel Smart 2D Display Technology

• Support Graphics Render C-State

• Support Intel Seamless Display Refresh Rate Switching with eDP

• Provide an integrated RAMDAC with 32-bit color

• Provide digital HSYNC and VSYNC signals

• Support one SDVO port through Digital Port B at 200 MP/s (Megapixels/second)

• Support DisplayPort resolutions up to 2560x1600 at 60 Hz

• Support HDMI (with reduced blanking) resolutions up to 1920x1200 at 60 Hz

• Support VGA resolutions up to 2048x1536 bpp at 75Hz

• Provide 24-bit dual-channel LVDS output

• Support PCI Express Graphics (PEG)

6 Reference Manual Express-HRR

Chapter 2 Product Overview

• Miscellaneous

♦

Real Time Clock (RTC) with external replaceable battery

♦

Watchdog Timer (WDT)

♦

TPM (Trusted Platform Module)

♦

Hardware Voltage and Temperature Monitor

♦

Logo Screen (Splash)

Express-HRR Reference Manual 7

Chapter 2 Product Overview

Block Diagram

Figure 2-2 shows the functional components of the module.

24-bit, dual channel LVDS

VGA

USB 2.0 (8)

SATA (4)

Intel - HD Audio Link

PCIe X1 (6), Ports 1-6

TPM

VBATT (RTC)

Hardware

Monitor

GPIO

Generator

I2C EEPROM

I2C

LVDS DDC I2C

WDT

Board

Controller

PWR Management

Intel Core i7 2610UE 1.5GHz, 2715QE 2.1GHz,

2655LE 2.2GHz

(with integrated Processor Core

and Graphics Memory Hub)

DMI

LPC

SMBus

GPIO

SPI

BD82QM67

CPU

PCH Intel

FDI

PCIe X1 (1), Port 7

PCIe X1 (1), Port 8

1067/1333MHz,

1.5V, 16GB Max.

Channel - A

Channel - B

PCIe Graphics, 1X16; 2X8; 1X8 & 2X4 - PEG

SDVO / DisplayPort / HDMI

DisplayPort / HDMI

DDR3

SODIMM

Sockets (2)

BIOS

GLAN

COM Express Connector - Rows A and B

SPI

HD Audio

SATA (4)

LVD S

PCIe X1 (6) SMBus

USB 2.0 (8)

LPC

VGA

I2C

GPIO (8)

VBATT WDT

Gigabit

Ethernet

82579LM

Gb Ethernet

12V Input

5V Standby

Intel

COM Express Connector - Rows C and D

SDVO / DP / HDMI DP / HDMI

PCIe X1 (1)

PEG

12V Input

Express-HRR_blkdiag_a

Figure 2-2. Functional Block Diagram

8 Reference Manual Express-HRR

Chapter 2 Product Overview

Major Components (ICs)

Table 2-2 lists the major integrated circuits on the Express-HRR, including a brief description of each IC. Figures 2-3 and 2-4 show the locations of the major ICs.

Table 2-2. Major Integrated Circuit Descriptions and Functions

Chip Type Mfg. Model Description Function

CPU (U1) Intel Core i7 (2610UE,

2715QE, and

2655LE)

PCH (Platform Controller Hub [U3])

Hardware Monitor (U6) [on bottom side; see Figure 2-4

on page 11]

TPM (Trusted Platform Module [U7])

Board Controller (U8) [on bottom side; see

Figure 2-4 on page 11]

GPIO Generator (U9)

Gigabit Ethernet PHY Transceiver (U46)

Intel BD82QM67

(PCH)

ON Semiconductor

Atmel AT97SC3204-

Atmel ATMEGA168V-

Philips PCA9535BS Module providing 16

Intel 82579LM Ethernet PHY

ADT7490-D Remote Voltage and

U1A90

10AU

1.5GHz, 2.1GHz, or

2.2GHz processors with up to 8MB L3 cache

I/O hub providing Southbridge functions (standard I/O functions)

Temperature Monitor and Fan Controller

Complete turnkey security solution on a single chip

Micro controller for board functions

including I²C, Watchdog Timer, and LV DS

bits of GPIO expansion for I2C/SMBus applications

transceiver for 10T/100TX/1000T Gigabit Ethernet function

Provides integrated CPU, memory, and video

Provides I/O interfaces such as USB, SATA, and video

Provides system thermal protection

Provides an integrated, protected, nonvolatile solution for strong public key security, intellectual property protection, system integrity, authentication, and secure communications

Optimizes power consumption versus processor speed

Provides additional digital control lines

Provides a standard IEEE

802.3 Ethernet interface for Ethernet transfer rate up to 1000 Mb/s

Express-HRR Reference Manual 9

Chapter 2 Product Overview

Key: U1 - CPU U3 - PCH U7 - TPM U9 - GPIO Generator U46 - Gb Ethernet

Figure 2-3. Component Locations (Top Side)

U46

Express-HRR_Top_Comp_a

10 Reference Manual Express-HRR

Chapter 2 Product Overview

Key: U6 - Hardware Monitor U8 - Board Controller

Figure 2-4. Component Locations (Bottom Side)

Connectors, Headers, and Sockets

Table 2-3 describes the connectors, headers, and sockets shown in Figures 2-5 and 2-6.

Table 2-3. Module Connector and Socket Descriptions

Jack/Plug # Board

Access

J6A – Memory Top 204-pin socket for DDR3 SODIMM - Channel A

J6B – Memory Top 204-pin socket for DDR3 SODIMM - Channel B

CN1 – XDP Debug (see

Bottom 26-pin, 0.020" (0.50mm) right-angle debug port connector

Figure 2-6 on page 13.)

CN4 – LPC Debug Top 10-pin, .050" (1.27mm) female debug port header for

CN6 – COM Express A-B

Bottom 220-pin connector for Northbridge Video and Southbridge

(see Figure 2-6 on page 13.)

CN7 – COM Express C-D

Bottom 220-pin connector for Northbridge Video and Southbridge

(see Figure 2-6 on page 13.)

Description

for the CPU and PCH

issues such as Port 80 POST errors

I/O functions

Express-HRR_Bottom_Comp_a

Express-HRR Reference Manual 11

Chapter 2 Product Overview

Table 2-3. Module Connector and Socket Descriptions (Continued)

FAN1 – System Fan Top 3-pin, 0.049" (1.25mm) right-angle shrouded header

controlled by the Hardware Monitor for CPU and PCH cooling

SW1 – PCIe Bifurcation Switch (see Figure 2-6 on

Bottom 4-pin dip switch for selecting PCIe modes (positions 1,2 =

1x8, 2x4; 1,3 = reserved; 2,4 = 2x8; 3,4 = 1x16 [Default])

page 13.)

Key: J6A - Channel A SODIMM socket J6B - Channel B SODIMM socket FAN1 - CPU Fan CN4 - LPC

J6B

J6A

FAN1

CN4

Express-HRR_Top_Conn_a

Figure 2-5. Connector Locations (Top Side)

NOTE Pin 1 is shown as a black square on connectors in all illustrations.

12 Reference Manual Express-HRR

Chapter 2 Product Overview

Key: CN1 - XDP CN6 - COM Express A1-A110 and B1-B110 CN7 - COM Express C1-C110 and D1-D110 SW1 - PCI Express Bifurcation Switch

CN1

SW1

123

CN6

A B

CN7

C D

Figure 2-6. Connector Locations (Bottom Side)

Specifications

Physical Specifications

Table 2-4 lists the physical dimensions of the module.

Table 2-4. Weight and Footprint Dimensions

Item Dimension

Weight 0.09 kg (0.20 lb)

Height (overall) 9.20 mm (0.36 inches)

Board thickness 2.362 mm (0.093 inches)

Width 95.00 mm (3.74 inches)

Length 125.00 mm (4.92 inches)

Express-HRR_Bottom_Conn_a

NOTE Overall height is measured from the

upper board surface to the highest permanent component on the upper board surface. This measurement does not include the cooling solutions. The heights of the board with the cooling solutions are 36.50mm for the passive heatsink (without fan), 46.80mm for the active heatsink (with fan) and 11.00mm for the heatspreader.

Express-HRR Reference Manual 13

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