Northwood CPU / Fan / Thermal
CPU Decoupling
North Bridge Intel 845MP
DDR-SODIMM
Clock Genera to r
VGA ATI M7C/ Penal interface
VGA DDR SGRAM/ CRT & TVOUT CONNECTOR
South Bridge ICH3M
Card Bus Controller / Card Bus Socket
IEEE1394 VT6306 / PHY
LAN Controller RTL8100BL
Audio DJ OZ163
AC97 Codec_ALC2 0 1
Audio EQ_TAS3002
AMP & Audio Jack
HDD/CDROM
LPC EC_PC87591
BIOS & I/O Port
Printer/USB Port/TP
Dot Matrix LCD/FIR/Reset/PS
DC/DC Interface
Mimi-PCI & Docking
SIO VT1211
SD CONTROLLER/SOCKET/UNS E D GA T E S
5V/3V/12V
CHARGER
CPU_COR E
DETECTOR
DDR/Connector
Notes & PIR List
TITLE
TITLE
TITLETITLE
B
stencil not open:
J1
U24
PJP2
PJP4
C715
C716
PC155
C72
C94
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
C
D
Title
Size Document NumberRev
B
Date:Sheet
Comp a l Electro nics , In c .
SCHEMATIC, M/B LA -1302
401216
E
145Wednesday, May 29, 2002
of
1B
A
Compal confidential
Model Name : 888Z4/LA-1301 (Intel Northwood)
11
Power On/Off
Reset Circuit
page 29
DC/DC Interface
RTC Battery
page 30
22
+3VS +5VS +3VALW
Mini PCI
Socket
page 31page 21
* HSP Modem Card
* Combo for HSP Modem and
802.11b
* Controllerless Modem
* Combo for Controllerless
33
Modem and 802.11b
VID SELECT
/CPU_CORE Decouple
CAP.
CRT Connector
+3VS
LCDVDD
page 17
+5VS FOR INVERTER
TFT/HPA Panel
Interface
page 13
TV OUT
Connector
page 17
PCMCIA
S1_VCC+3VALW
Slot 0
page 21
S1_VPP
page 5
B
+3VS
ATI M7C
page
13,14,15
VIA VT6306
1394 ControllerCB1410
+5VALW
+12VALW
LPC BUS
+1.8VS
+1.5VS
+2.5VS
+2.5VS
SGRAM
8/16MB
+3VS
page 22
page 16
AC Link
C
+CPU_CORE
+1.2VS
Intel
Northwood Micro-FCPGA
page 3,4,5
+1.8VS
+1.5VS
+CPU_CORE
Brookdale-M
MCH-M
page6,7,8
PCI BUS
AD(0..31)
+1.8VS+3VS+3VALW+3V
+2.5V
MA(0..13)
MD(0..63)
HUB LINK
ICH3-M
421 BGA
page 18,19,20
D
+2.5V+2.5V
+3VS+3VS
page 9
DDR
SO-DIMM 0
(Bank 0,1)
DDR
SO-DIMM 1
(Bank 2,3)
DDR
Decoupling
+1.8VALW+CPU_CORE
Y1
14.318MHZ
+3VS
Clock Generator
W320-04/9508-05
+3VSUS
+3VRUN
page 10
page12
+1.25VS
TERMINATION
RESISTORS
page 11
+5VS+5VALW +3VALW
USB
Port 0,1
page 31
E
Block Diagram
New
USB
Port 2
Bluetooth
page 31
RJ45/RJ11
Jack
page 23
6-7A6-7A3A50mA
+3VALWP +5VALWP +2.5VALWP
Power Circuit
DC/DC
page 37,38,39,40,41
44
A
+3VALW OR +2.5VALW
LAN
RTL8100BL
page 23
+12VALWP
+1.25VP
+1.2VP
PCB1
LA-1302 PCB
3A
300mA
+3VS+3VALW
Super I/O
14M_5V
SMC47N227
page 35
+5VS
Touch Pad
page 31
PIO
page 31
+3VS
Smart Card
Connector
page 36
+3VS,+5VS
B
I/O Buffer
page 30
+3VALW
BIOS
page 30
SD
CONTROLLER
page 36
KeyBoard
NS87591
page 29
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
AC Link
+3VS AVDD+5VALW
AC97
KBD
page 29
+3VCD+5VAMP
Audio
EQ
page 26
Speaker
page 27
C
Codec
page 25
AMP
Jack
page 27
AC Link
+5VCD+5VS
OZ163
page 24
+5VS
+5VCD
CD-ROM
Connector
page 28
HDD
Connector
page 28
+5VCD
+3VCD
+5VAMP+5VALW
D
+5VALW
+3VALW
EN_CDPLAY#
Docking Connector
* DC-IN
* 2 USB Port
* TV Out (S Video)
* VGA Out
* 2 PS/2
* LAN
* Parallel Port
* Serial Port
* Line Out
* Headphone
* Microphone
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
2. Place decoupling cap 220PF near CPU.(Within
500mils)
45
RP112
8P4R_1K_0804
VDD1
ALERT
THERM
GND
W=15mil
12
+5VALW
+5VS
R246
R519
12
1K_0402
+3VALW
R83
10K_0402
12
R82
@0_0402
PROCHOT#
4
PROCHOT# 29MAINP37,40
1
6
4
5
PCIRST#6,13,18,21,22,23,29,34,35,36
@301_1%_0402
2
G
13
D
S
Q21
2N7002
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
3
R241
470_0402
12
Q23
3904
12
1
2
3
Q19
3904
1
3
2
R238
12
470_0402
H_THERMTRIP#
PROCHOT#
2
R248
0_0402
R244
1K_0402
+3VS
1
3
R242
470_0402
12
12
2
Q22
Q18
3904
3904
1
3
R237
2
12
Title
Size Document NumberRev
Date:Sheet
H_PROCHOT#
470_0402
Compal Electronics, Inc.
SCHEMATIC, M/B LA-1302
401216
1
4
of
1B
45Wednesday, May 29, 2002
Thermal Sensor ADM1032AR
H_THERMDA
R85
2200PF_0402
H_THERMDC
@0_0402
C122
R81
@0_0402
12
THERMDA_59129
THERMDC_59129
AA
EC_SMC224,29,34
EC_SMD224,29,34
Address:1001_100X
5
.1UF_0402
U56
2
D+
3
D-
8
SCLK
7
SDATA
ADM1032AR_SOP-8
R02
PIR1
C129
A
Layout note :
Place close to CPU, Use 2~3 vias per PAD.
Place .22uF caps underneath balls on solder side.
Place 10uF caps on the peripheral near balls.
Use 2~3 vias per PAD.
Please place these cap in the socket cavity area
+CPU_CORE
11
12
C357
10UF_6.3V_1206_X7R
+CPU_CORE
12
C347
10UF_6.3V_1206_X7R
12
C370
10UF_6.3V_1206_X7R
12
C367
10UF_6.3V_1206_X7R
12
C378
10UF_6.3V_1206_X7R
12
C376
10UF_6.3V_1206_X7R
12
C346
10UF_6.3V_1206_X7R
12
C345
10UF_6.3V_1206_X7R
Please place these cap on the socket north side
+CPU_CORE
12
C102
10UF_6.3V_1206_X7R
22
+CPU_CORE
12
C363
10UF_6.3V_1206_X7R
+CPU_CORE
12
C404
10UF_6.3V_1206_X7R
12
C379
10UF_6.3V_1206_X7R
12
C339
10UF_6.3V_1206_X7R
12
C331
10UF_6.3V_1206_X7R
12
C350
10UF_6.3V_1206_X7R
12
C352
10UF_6.3V_1206_X7R
12
C380
10UF_6.3V_1206_X7R
12
C340
10UF_6.3V_1206_X7R
12
C368
10UF_6.3V_1206_X7R
12
C428
10UF_6.3V_1206_X7R
B
12
C355
10UF_6.3V_1206_X7R
12
C358
10UF_6.3V_1206_X7R
12
C421
10UF_6.3V_1206_X7R
12
C397
10UF_6.3V_1206_X7R
C
Layout note :
Place close to CPU power and
ground pin as possible
(<1inch)
R02
12
C73
+
220UF_D2_4V_25m
12
C715
+
4SP560M
12
C79
.22UF_X7R
PIR2
12
+CPU_CORE
+CPU_CORE
+CPU_CORE
D
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
2. Place decoupling cap 220PF near MCH pin.(Within
500mils)
AGP_ST0
0=System memory is DDR
1=System memory is SDR
HD#[0..63] 3
+CPU_CORE
12
R_E
12
R_F
100_1%_0402
AGP_AD[0..31]13
AGP_C/BE#[0..3]13
AGP_ST[0..2]13
R223
49.9_1%_0402
R227
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
Layout note
Place R_J closely Ball
H3<40mil,Ball H3 to G3 trace
must
routing 1"
Place R620
closely pinJ28
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
A
B
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
C
D
Title
Size Document NumberRev
Date:Sheet
Comp a l Electro nics , In c .
SCHEMATIC, M/B LA -1302
401216
745Wednesday, May 29, 2002
E
1B
of
5
4
3
2
1
Layout note :
Distribute as close as p ossi ble
to MCH Processor Quad rant.(between VTTFSB and VSS pin)
+CPU_CORE
DD
12
C336
.1UF_0402_X 5R
+CPU_CORE
12
C348
.1UF_0402_X 5R
+CPU_CORE
12
C374
10UF_6.3V_1206 _X5R
CC
Layout note :
Distribute as close as p ossi ble
to MCH Processor Quadrant.(between VCCAGP/VCCCORE
and VSS pin)
Processor system bus
12
C337
.1UF_0402_X 5R
12
C335
.1UF_0402_X 5R
12
10UF_6.3V_120 6_X5R
C365
12
C341
.1UF_0402_X5 R
12
C344
.1UF_0402_X5 R
AGP/CORE
12
C359
.1UF_0402_X5 R
12
C392
.1UF_0402_X5 R
12
C332
10UF_6.3V_120 6_X5R
12
C373
.1UF_0402_X 5R
12
C353
.1UF_0402_X 5R
Layout note :
Distribute as close as p ossi ble
to MCH Processor Quadrant .(between VCCSM and VSS pin)
+2.5V
12
C407
.1UF_0402_X5 R
+2.5V
12
C426
.1UF_0402_X5 R
+2.5V
12
C403
.1UF_0402_X5 R
+2.5V
12
C405
+
150UF_6.3V_D2
DDR Memory interface
12
C418
.1UF_0402_X 5R
12
C409
.1UF_0402_X 5R
12
C412
.1UF_0402_X 5R
12
C415
.1UF_0402_X 5R
12
C410
.1UF_0402_X 5R
12
C422
.1UF_0402_X 5R
12
C400
.1UF_0402_X 5R
12
C420
.1UF_0402_X 5R
12
C414
.1UF_0402_X 5R
12
C416
.1UF_0402_X5 R
12
C406
.1UF_0402_X5 R
12
C423
.1UF_0402_X5 R
12
C413
22UF_10V_1 206
12
C417
22UF_10V_12 06
+1.5VS
12
C349
.1UF_0402_X 5R
BB
+1.5VS
12
C398
10UF_6.3V_1206 _X5R
Layout note :
Distribute as close as p ossi ble
to MCH Processor Quadrant .(between VCCHL and VSS pin)
+1.8VS
AA
12
C391
10UF_6.3V_1206 _X5R
12
C360
.1UF_0402_X 5R
12
10UF_6.3V_120 6_X5R
Hub-Link
12
C395
.1UF_0402_X 5R
5
C401
12
C354
.1UF_0402_X5 R
12
C388
.1UF_0402_X5 R
12
C366
+
150UF_6.3V_D2
12
12
C375
.1UF_0402_X5 R
C396
.1UF_0402_X 5R
12
C369
.1UF_0402_X 5R
4
12
C382
.1UF_0402_X 5R
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
3
2
Title
SizeDocument NumberRev
Date:Sheet
Compal Electronics, Inc.
SCHEMATIC, M/B LA-1302
401216
845Wednesday, May 29, 2002
1
1B
of
A
DDR_SDQ0
DDR_SDQ4
DDR_SDQ1
DDR_SDQ5
DDR_SDQ6
11
Layout note
Place these resistor
closely DIMM0,
all trace length<750mil
22
33
DDR_SDQ[0..63]7
DDR_SDQS[0..8]7
44
A
DDR_SDQS0
DDR_SDQ2
DDR_SDQ3
DDR_SDQ8
DDR_SDQ7
DDR_SDQ9
DDR_SDQ12
DDR_SDQS1
DDR_SDQ13
DDR_SDQ10
DDR_SDQ14
DDR_SDQ15
DDR_SDQ11
DDR_SDQ16
DDR_SDQ20
DDR_SDQ21
DDR_SDQ17
DDR_SDQ18
DDR_SDQS2
DDR_SDQ19
DDR_SDQ22
DDR_SDQ24
DDR_SDQ23
DDR_SDQ25
DDR_SDQ28
DDR_SDQS3
DDR_SDQ29
DDR_SDQ[0..63]
DDR_CB[0..7]7
DDR_CB[0..7]
DDR_SDQS[0..8]
DDR_SDQ56
DDR_SDQ51
DDR_SDQ60
DDR_SDQ57
DDR_SDQS7
DDR_SDQ61
DDR_SDQ62
DDR_SDQ58
DDR_SDQ63DDR_DQ63
DDR_SDQ59DDR_DQ59
B
RP42 4P2R_22
14
23
RP19 4P2R_22
14
23
RP43 4P2R_22
14
23
RP20 4P2R_22
14
23
RP44 4P2R_22
14
23
RP21 4P2R_22
14
23
RP45 4P2R_22
14
23
RP22 4P2R_22
14
23
RP46 4P2R_22
14
23
RP23 4P2R_22
14
23
RP47 4P2R_22
14
23
RP24 4P2R_22
14
23
RP48 4P2R_22
14
23
RP25 4P2R_22
14
23
RP49 4P2R_22
14
23
RP26 4P2R_22
14
23
RP61 4P2R_22
14
23
RP38 4P2R_22
14
23
RP62 4P2R_22
14
23
RP39 4P2R_22
14
23
RP63 4P2R_22
14
23
B
DDR_DQ0
DDR_DQ4
DDR_DQ1
DDR_DQ5
DDR_DQ6
DDR_DQS0
DDR_DQ2
DDR_DQ3
DDR_DQ8
DDR_DQ7
DDR_DQ9
DDR_DQ12
DDR_DQS1
DDR_DQ13
DDR_DQ10
DDR_DQ14
DDR_DQ15
DDR_DQ11
DDR_DQ16
DDR_DQ20
DDR_DQ21
DDR_DQ17
DDR_DQ18
DDR_DQS2
DDR_DQ19
DDR_DQ22
DDR_DQ24
DDR_DQ23
DDR_DQ25
DDR_DQ28
DDR_DQS3
DDR_DQ29
DDR_DQ56
DDR_DQ51
DDR_DQ60
DDR_DQ57
DDR_DQS7
DDR_DQ61
DDR_DQ62
DDR_DQ58
DDR_SDQ30
DDR_SDQ26
DDR_SDQ31
DDR_SDQ27
DDR_CB5
DDR_CB4
DDR_CB1
DDR_CB0
DDR_CB2
DDR_SDQS8
DDR_CB3
DDR_CB6
DDR_CB7
DDR_SDQ36
DDR_SDQ32
DDR_SDQ33
DDR_SDQ37
DDR_SDQ38
DDR_SDQS4
DDR_SDQ39
DDR_SDQ34
DDR_SDQ44
DDR_SDQ35
DDR_SDQ45
DDR_SDQ40
DDR_SDQS5
DDR_SDQ41
DDR_SDQ43
DDR_SDQ42
DDR_SDQ47
DDR_SDQ46
DDR_SDQ49
DDR_SDQ48
DDR_SDQ53
DDR_SDQ52
DDR_SDQ54
DDR_SDQS6
DDR_SDQ55
DDR_SDQ50
C
RP50 4P2R_22
14
23
RP27 4P2R_22
14
23
RP51 4P2R_22
14
23
RP28 4P2R_22
14
23
RP52 4P2R_22
14
23
RP29 4P2R_22
14
23
RP53 4P2R_22
14
23
RP40 4P2R_22
14
23
RP55 4P2R_22
14
23
RP32 4P2R_22
14
23
RP56 4P2R_22
14
23
RP33 4P2R_22
14
23
RP57 4P2R_22
14
23
RP34 4P2R_22
14
23
RP58 4P2R_22
14
23
RP35 4P2R_22
14
23
RP59 4P2R_22
14
23
RP36 4P2R_22
14
23
RP60 4P2R_22
14
23
RP37 4P2R_22
14
23
C
DDR_DQ30
DDR_DQ26
DDR_DQ31
DDR_DQ27
DDR_F_CB5
DDR_F_CB4
DDR_F_CB1
DDR_F_CB0
DDR_F_CB2
DDR_DQS8
DDR_F_CB3
DDR_F_CB6
DDR_F_CB7
DDR_DQ36
DDR_DQ32
DDR_DQ33
DDR_DQ37
DDR_DQ38
DDR_DQS4
DDR_DQ39
DDR_DQ34
DDR_DQ44
DDR_DQ35
DDR_DQ45
DDR_DQ40
DDR_DQS5
DDR_DQ41
DDR_DQ43
DDR_DQ42
DDR_DQ47
DDR_DQ46
DDR_DQ49
DDR_DQ48
DDR_DQ53
DDR_DQ52
DDR_DQ54
DDR_DQS6
DDR_DQ55
DDR_DQ50
D
DDR_DQ4
DDR_DQ5
DDR_DQS0
DDR_DQ3
DDR_DQ7
DDR_DQ12
DDR_DQ13
DDR_DQS1
DDR_DQ14
DDR_DQ11
DDR_CLK17
DDR_CLK1#7
DDR_DQ20
DDR_DQ17
DDR_DQS2
DDR_DQ22
DDR_DQ23
DDR_DQ28
DDR_DQ29
DDR_DQS3
DDR_DQ26
DDR_DQ27
DDR_F_CB4
DDR_F_CB0DDR_F_CB1
DDR_DQS8
DDR_F_CB6
DDR_F_CB7
DDR_CLK07
DDR_CLK0#7
DIMM_SMDATA10,12
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
Place one cap close to every 2 pull up resistors termination to
+1.25V
22
+1.25VS
12
C193
.1UF_0402_X5R
+1.25VS
12
C202
.1UF_0402_X5R
12
C194
.1UF_0402_X5R
12
C515
.1UF_0402_X5R
12
C195
.1UF_0402_X5R
12
C203
.1UF_0402_X5R
12
C196
.1UF_0402_X5R
12
C514
.1UF_0402_X5R
12
C197
.1UF_0402_X5R
12
C204
.1UF_0402_X5R
12
C198
.1UF_0402_X5R
12
C504
.1UF_0402_X5R
12
C199
.1UF_0402_X5R
12
C207
.1UF_0402_X5R
12
C201
.1UF_0402_X5R
12
C205
.1UF_0402_X5R
12
C200
.1UF_0402_X5R
12
C513
.1UF_0402_X5R
12
C516
.1UF_0402_X5R
12
C206
.1UF_0402_X5R
+1.25VS
12
C512
33
44
.1UF_0402_X5R
+1.25VS
12
C214
.1UF_0402_X5R
+1.25VS
12
C224
.1UF_0402_X5R
+1.25VS
12
C229
.1UF_0402_X5R
12
C208
.1UF_0402_X5R
12
C215
.1UF_0402_X5R
12
C225
.1UF_0402_X5R
12
C231
.1UF_0402_X5R
A
12
C209
.1UF_0402_X5R
12
C216
.1UF_0402_X5R
12
C226
.1UF_0402_X5R
12
C232
.1UF_0402_X5R
12
C210
.1UF_0402_X5R
12
C217
.1UF_0402_X5R
12
C227
.1UF_0402_X5R
12
C230
.1UF_0402_X5R
12
C211
.1UF_0402_X5R
12
C218
.1UF_0402_X5R
12
C508
.1UF_0402_X5R
12
C212
.1UF_0402_X5R
12
C219
.1UF_0402_X5R
12
C228
.1UF_0402_X5R
B
12
C213
.1UF_0402_X5R
12
C220
.1UF_0402_X5R
12
C509
.1UF_0402_X5R
12
C233
.1UF_0402_X5R
12
C221
.1UF_0402_X5R
12
C507
.1UF_0402_X5R
12
C511
.1UF_0402_X5R
12
C222
.1UF_0402_X5R
12
C505
.1UF_0402_X5R
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
C
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
D
E
F
Title
Size Document NumberRev
Date:Sheet
Comp a l Electro nics , In c .
SCHEMATIC, M/B LA -1302
401216
G
1245Wednesday, May 29, 2002
H
1B
of
1
+1.5VS
10 mil
+3VS
+3VALW
12
R73
10K_0402
12
R79
@10K_0402
22PF_0402
12
R207
1K_0402
12
R209
1K_0402
R50
12
10K_0402
R64
12
10K_0402
R02 PIR5
12
R72
10K_0402
12
R546
10_0402
12
12
C721
+AGPREF
10 mil
PM_C3_STAT#
SUS_STAT#
C81
.1UF_0402
12
10UF_10V_0805
U6
1
X1/CLK
6
S0
R03 PIR 21
+3VS
12
C120
.1UF_0402
+3VS
L20
FBM-L11-201209-221
C98
12
2
VDD
4
CLK
87
SDS1
5
LEE
GND
3
SM560_SO-8
12
Close to U6
X1
4
OUT
VDD
1
GND
ST
SG-710ECK_27MHz_3.3V_20ppm
AA
BB
+3VS +3VS
CC
R80
@0_0402
DD
Divider ci rcui t f or 1.8Vdc XTALIN from 3. 3Vdc OSC out
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.