THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
CK TITAN
ICS9250-38
E
PSB
Revision : 1.0
CRT
Conn.
PAGE 16
LVDS
Conn.
PAGE 15
33
TV-Out
Conn.
PAGE 16
HDD Connec to r
CD-ROM Connec to r
22
11
USB & BlueTooth
VCH
TV-Out
Encoder
PAGE 21
PAGE 21
PAGE 20
DVOA Bus Interface
PAGE 15
DVOC Bus Interface
PAGE 15
Super I/O
NS PC87391
PAGE 32
ATA 66/100
Audio DJ
OZ163
Rev.C
PAGE 26
USB
LPC
GMCH-M
625 BGA
HUB
Interface
ICH3-M
421 BGA
Embedded
Controller
NS PC87591
PAGE 30
Memory Bus
PAGE 9,10,11
LAN
PCI BUS
PAGE 17,18
Almador-M
Kinnereth
82562ET
PAGE 25
IEEE-1394
Controller
PAGE 22
Mini PCI
Socket
PAGE 38
CardBus
OZ6933T
PAGE 23
Audio
Controller
ES1988
PAGE 27
SO-DIMM X2
BANK 0, 1, 2, 3
Slot 0/1
PAGE 24
EQ Circuit
PAGE 29
PAGE 14
Docking Connector
LAN
USB X 2
PARALLEL PORT
SERIAL PORT
DC-IN JACK
LINE OUT
EXT. MIC IN
CRT CONN.
PS/2 CONN.
PAGE 37
FAN on controller &
TEMP. sensing circuit
PAGE 36
DC/DC Interface
RTC Battery
PAGE 39
BATTERY
Charger
PAGE 42
POWER
Interface
PAGE 40,41,42,44
Parallel
PAGE 33PAGE 31
A
FIR
PAGE 33
FDD
PAGE 33
B
ROM
BIOS
Scan KB
PAGE 35
PS/2 Interface
PAGE 35
C
Mic Jack
PAGE 28
Audio Amplifier
PAGE 28
D
Compal Electronics, inc.
Title
SCHEMATIC, M/B LA-1011
SizeDocument NumberRev
Custom
401174
Date:Sheet
246Friday, September 21, 2001
E
of
1A
A
Voltage Rails
B
C
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
D
E
Power PlaneDescripti on
11
B+
+VCC_H_CORE
+VTT
VIN
Adapter power supply (19V)
AC or battery power rail for power circu it.
Core voltage for CPU
1.2V switched power rail for CPU AGTL Bus
S1S3S5
N/AN/AN/A
N/AN/AN/A
ONOFF
ONOFF
OFF
OFF
+1.5V_ALW1.5V always on power railONONON*
+1.5V_SWAGP 4 XONOFFOFF
+1.8V_ALW1.8V always on power railONONON*
+1.8V_SWOFF1.8V switched power railONOFF
ON+2.5V2.5V power railOFF
ON
+2-5V_MRIMM2.5V switched power railONOFFOFF
+3V_ALW
+3V
+3V_SW
+5V_ALW
+5V
22
+5V_SW
+12V_ALW
+12V_SW
RTCVCC
3.3V always on power rail
3.3V power rail
3.3V switched power rail
5V always on power rail
5V power railOFFON
12V always on power r ail
12V switched power rail
RTC power
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
OFF
ON
OFF
ON
OFF
ON
ON*
OFF
OFF
ON*
OFF5V switched power rail
ON*
OFF
ON
Note : ON* means that this power plane is ON only with AC power available, otherwise it is OFF.
External PCI Devices
DeviceIDSEL#REQ# / G NT #Interrupts
LAN
CardBus
Audio Controller
Mini-PCI
Mini-PCI(LAN)
33
IEEE-1394 Controller
(AD24 internal)
AD20
AD19
AD18
AD224PIRQD
AD160PIRQA
2
3
1
PIRQA/PIRQB
PIRQD
PIRQC
EC SM Bus1 address
Device
Smart Batte r y
EEPROM
0001 011X b
1010 000X b
EC SM Bus2 address
Device
MAX1617MEE
OZ163
Docking
DOT Board
1001 110X b
0011 0100 b
0011 011X b
XXXX XXXXb
ICH3 SM Bus address
Device
SODIMM
44
Clock Gen.
P.S:Default Resistor & Capacitor's package are 0402.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
A
B
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
B
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
Place close to CPU, Use 2~3 vias per PAD.
Place .47uF caps underneath balls on solder side.
Place 10uF caps on the peripheral near balls.
Use 2~3 vias per PAD.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
A
B
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
C
D
SCHEMATIC, M/B LA-1011
SizeDocument NumberRev
Custom
401174
Date:Sheet
646Friday, September 21, 2001
E
of
1A
A
B
C
D
E
+VTT
GTL Reference Voltage
12
R62
Layout note :
1K_1%
1. Place R70 and R75 between and GMCH and CPU.
2. Place decoupling caps near CPU.(Within 500mils)
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
A
B
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
Strap Name Low High
DVOA_D0 Rese r ved 133MHz
DVOA_D1 IOQ D =2 I OQD=8
DVOA_D5 Desk t op Mobile
DVOA_D6 Dual Ended Term Single Ended Term
12
12
12
12
12
12
12
DVOA_CLK# 15
DVOA_CLK 15
DVOA_D[0..11] 15
12
DVOA_D6
DVOA_D5
DVOA_D1
DVOA_D0
Place R8, R234, R278
near VGA Connector.
DAC_VSYNC
DAC_HSYNC
TV_DDCDATA 15
TV_DDCCLK 15
12
C757
27PF
R59
12
680
DVOA_I2CDATA
DVOA_I2CCLK
DVOA_CLKINT
DVO_INTR#
TV_I2CDATA
TV_I2CCLK
12
C765
10PF
R91 10K
12
12
R8910K
R56 100K
12
12
R57 100K
R554 4.7K
12
12
R555 4.7K
H_BSEL0 5,8
12
C764
10PF
+3V_SW
+1.5V_SW
+3V_SW
VCC
Y
+3V_SW
5
4
R568
732_1%_0603
604_1%_0603
1.5V level clock
12
R569
12
DPMS_CLK
R29510K
12
R5510K
12
C452
.1UF
+VS_RIMMREF
Compal Electronics, inc.
Title
SCHEMATIC, M/B LA-1011
SizeDocument NumberRev
Custom
401174
D
Date:Sheet
1146Friday, September 21, 2001
E
1A
of
VS_RIMMREF
B
C
12
R294100_1%_0603
12
C454
.1UF
12
U60
1
NC
44
RTCCLK17,23,24
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
2
A
3
GND
NC7S14
A
A
B
C
D
E
Layout note :
Distri bute as close as possible
to GMCH Processor Quadrant .
+VTT
11
+VTT
+VTT
22
33
+VTT
+VTT
+VTT
+VTT
12
C100
.1UF
12
C109
.1UF
12
C65
+
150UF_D2_6.3V
12
C211
+
150UF_D2_6.3V
12
C64
+
150UF_D2_6.3V
12
C50
+
150UF_D2_6.3V
12
C156
.1UF
12
12
12
C87
.1UF
C86
.1UF
C173
.1UF
12
C537
.1UF
12
C89
.1UF
12
C414
+
150UF_D2_6.3V
12
C128
.1UF
12
C192
.1UF
12
C138
.1UF
12
C184
.1UF
12
12
12
12
12
C115
.1UF
C194
.1UF
C153
.1UF
12
C547
.1UF
C111
.1UF
C195
.1UF
12
12
12
C212
+
150UF_D2_6.3V
12
C116
.1UF
12
C199
.1UF
12
C159
.1UF
12
C84
.1UF
C113
.1UF
C206
.1UF
12
12
C142
.1UF
12
C88
.1UF
12
C117
.1UF
12
C204
.1UF
12
C171
.1UF
12
C187
.1UF
12
12
C132
C106
.1UF
.1UF
12
12
C112
C85
.1UF
.1UF
12
12
C143
C147
.1UF
.1UF
12
12
C172
C94
.1UF
.1UF
12
12
C189
C190
.1UF
.1UF
12
12
C191
C130
.1UF
.1UF
12
C114
C136
.1UF
.1UF
12
12
C151
C148
.1UF
.1UF
12
12
12
C161
C154
.1UF
.1UF
12
12
C155
C162
.1UF
.1UF
12
12
C188
C110
.1UF
.1UF
12
12
C226
C145
.1UF
.1UF
12
C174
C183
.1UF
.1UF
12
12
C140
C139
.1UF
.1UF
12
12
C134
C146
.1UF
.1UF
Layout note :
Distribute as close as possible
to VCCPCMOS_LM .
+1.8V_SW
12
C74
+
22UF_1206_10V
12
C224
.1UF
Layout note :
Distribute as close as possible
to GMCH Local Memory Quadrant .
+1.8V_SW
12
C133
82PF
12
+
22UF_1206_10V
C82
12
C135
.1UF
Layout note :
Distribute as close as possible
to GMCH AGP/DVO Quadrant .
+1.5V_SW
12
+
22UF_1206_10V
C165
12
12
C97
C157
.1UF
.1UF
Layout note :
Distribute as close as possible
to GMCH System Memory Quadrant .
+3V
12
+
22UF_1206_10V
C221
12
12
C202
C203
.1UF
.1UF
12
C120
.1UF
12
12
C131
C137
.1UF
82PF
12
12
C123
C168
.1UF
82PF
12
12
C214
C201
.1UF
82PF
12
C121
.01UF
12
12
C197
C118
.1UF
.1UF
12
12
C141
C193
.1UF
82PF
12
12
C236
C213
.1UF
82PF
12
C122
.01UF
12
12
12
12
12
12
C175
C126
C185
C181
.1UF
.1UF
82PF
12
12
C209
.1UF
12
C208
82PF
C240
.1UF
C125
.1UF
.1UF
12
12
C239
C220
.1UF
.1UF
12
C180
C186
82PF
.1UF
12
12
12
12
C215
82PF
C238
.1UF
C244
.1UF
C237
.1UF
12
C242
.1UF
Layout note :
+VTT
12
C66
+
150UF_D2_6.3V
44
12
C49
+
150UF_D2_6.3V
12
C67
+
150UF_D2_6.3V
12
C415
+
150UF_D2_6.3V
Distribute as close as possible
to IO Quadrant .
+3V
12
C235
+
22UF_1206_10V
12
C241
.1UF
12
C225
.1UF
Compal Electronics, inc.
Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
A
B
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
C
D
SCHEMATIC, M/B LA-1011
SizeDocument NumberRev
Custom
401174
Date:Sheet
1246Friday, September 21, 2001
E
of
1A
A
B
C
D
E
11
SM_D_MA[0..12]10SM_MA[0..12] 14
SM_D_MA3
SM_D_MA2
SM_D_MA1
SM_D_MA0
22
33
SM_D_MA5
SM_D_MA4
SM_D_MA7
SM_D_MA6
SM_D_MA9
SM_D_MA8
SM_D_MA10
SM_D_MA11
SM_D_MA12
RP3
18
27
36
45
8P4R_10
RP5
18
27
36
45
8P4R_10
RP4
18
27
36
45
8P4R_10
12
R147 10
SM_MA3
SM_MA2
SM_MA1
SM_MA0
SM_MA5
SM_MA4
SM_MA7
SM_MA6
SM_MA9
SM_MA8
SM_MA10
SM_MA11
SM_MA12
Layout note :
One .1uF cap per power pin .
Place each cap close to SODIMM(DIMM 0) pin .
+3V
12
12
12
C462
.1UF
+3V
12
C417
+
22UF_1206_10V
12
C475
C465
.1UF
.1UF
C491
.1UF
12
C566
.1UF
Layout note :
One .1uF cap per power pin .
Place each cap close to SODIMM(DIMM 1) pin .
+3V
12
12
12
C461
.1UF
+3V
12
C416
+
22UF_1206_10V
12
C521
C489
.1UF
.1UF
C574
.1UF
12
C586
.1UF
12
12
C592
C579
.1UF
.1UF
12
12
C606
C593
.1UF
.1UF
12
12
C494
C602
.1UF
.1UF
12
12
C495
C481
.1UF
.1UF
12
12
C613
.1UF
12
C543
.1UF
12
C598
.1UF
12
C553
.1UF
12
C584
C556
.1UF
.1UF
12
12
C591
C601
.1UF
.1UF
12
12
C540
C528
.1UF
.1UF
12
12
C611
C619
.1UF
.1UF
12
12
C492
.1UF
12
C575
.1UF
12
C479
C464
.1UF
.1UF
12
12
C467
C470
.1UF
.1UF
44
Compal Electronics, inc.
Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
A
B
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.