The information in this guide is subject to change without notice.
Acer Incorporated makes no representations or warranties, either expressed or implied, with respect to the
contents hereof and specifically disclaims any warranties of merchantability or fitness for any particular
purpose. Any Acer Incorporated software described in this manual is sold or licensed "as is". Should the
programs prove defective following their purchase, the buyer (and not Acer Incorporated, its distributor, or its
dealer) assumes the entire cost of all necessary servicing, repair, and any incidental or consequential
damages resulting from any defect in the software.
Acer is a registered trademark of Acer Corporation.
Intel is a registered trademark of Intel Corporation.
Other brand and product names are trademarks and/or registered trademarks of their respective holders.
III
Conventions
The following conventions are used in this manual:
SCREEN MESSAGESDenotes actual messages that
appear on screen.
NOTEGives bits and pieces of additional
information related to the current
topic.
WARNINGAlerts you to any damage that might
result from doing or not doing
specific actions.
CAUTIONGives precautionary measures to
avoid possible hardware or software
problems.
IMPORTANTReminds you to do specific actions
relevant to the accomplishment of
procedures.
NOTE: This symbol where placed in the Service Guide designates a compo nent tha t should
be recycled according to the local regulations.
IV
Preface
Before using this information and the product it supports, please read the following general information.
1.This Service Guide provides you with all technical information relating to the BASIC CONFIGURATION
decided for Acer's "global" product offering. To better fit local market requirements and enhance product
competitiveness, your regional office MAY have decided to extend the functionality of a machine (e.g.
add-on card, modem, or extra memory capability). These LOCALIZED FEATURES will NOT be covered
in this generic service guide. In such cases, please contact your regional offices or the responsible
personnel/channel to provide you with further technical details.
2.Please note WHEN ORDERING FRU PARTS, that you should check the most up-to-date information
available on your regional web or channel. If, for whatever reason, a part number change is made, it will
not be noted in the printed Service Guide. For ACER-AUTHORIZED SERVICE PROVIDERS, your Acer
office may have a DIFFERENT part number code to those given in the FRU list of this printed Service
Guide. You MUST use the list provided by your regional Acer office to order FRU parts for repair and
service of customer machines.
•ATI Radeon™ HD 4225 Graphics with 384 MB of dedicated system memory, supporting Unified
Video Decoder 2 (UVD2), OpenGL® 2.0, OpenEXR High Dynamic-Range (HDR) technology,
Shader Model 4.1, Microsoft® DirectX® 10.1
•Dual independent display support
•16.7 million colors
•External resolution / refresh rates:
•VGA port up to 2456 x 1536: 60 Hz
•HDMI™ port up to 1920 x 1080: 60 Hz
•MPEG-2/DVD decoding
•WMV9 (VC-1) and H.264 (AVC) decoding
•HDMI™ (High-Definition Multimedia Interface) with HDCP (High-bandwidth Digital Content
Protection) support
•Multi-in-1 card reader (SD™, MMC, MS, MS PRO, xD)
•Three USB 2.0 ports
•HDMI™ port with HDCP support
•External display (VGA) port
•Headphone/speaker/line-out jack
•Microphone-in jack
•Ethernet (RJ-45) port
•DC-in jack for AC adapter
Eco standards
•ENERGY STAR®
•WEEE
•RoHS
•Mercury free
Accessories
•In-box:
•Protective bag
•6-cell Li-ion battery pack
Chapter 13
•Optional:
•1 GB / 2 GB DDR3 1066 MHz soDIMM module·
•6-cell Li-ion battery pack·
•2-pin 40 W AC adapter
•External USB HDD
•External USB optical disc drive
Warranty
•One-year International Travelers Warranty (ITW)
Environment
•Temperature:
•Operating: 5°C to 35°C
•Non-operating: 20°C to 65°C
•Humidity (non-condensing):
•Operating: 20% to 80%
•Non-operating: 20% to 80%
NOTE: The specifications listed above are for reference only. The exact configuration of the PC depends on
the model purchased.
4Chapter 1
System Block Diagram
5 IN1
CARDREADER
BATTERY CHAGER
SYSTEM
5V/3V PCU
AMD C PU C ore
CPU_NB Core
Channel A
PWM FAN
UNBUFFERED
DDRIII SODIMM
SIDE PORT
DDRIII 128MB
AZALIA COD EC
CX20672
Mobile 2.5"HDD
P25
SMBUS
CPU
THERMAL SENSOR
P4
P15
P6
Headphone Jack
P4
MIC In Jack
Digital MIC
Speaker Header
P19
P19
P22
HDT
P4
LAN-AR8152L
3G
WLAN/WiMAX
SIM CARD
Bluetooth
USB PORT
(Left)(Lower Right)(Upper Right)
P20
P32
P33
P34
LVDS MUX
TMDS(PCIE 4x1)
DAC
PCIE GEN1
P23
P23
P23
P18
USB 2.0
06
P20
Keyboard
P18P18
P21
4
2
8
5
LVDS CON
HDMI CON
VGA CON
1
CCD
P24
NB CORE
P26
DDR 1.5VSUS
P27
+1.1V
(VLDT)
P28
P16
P16
P17
P16
73
USB PORT
P29
Discharge/+2.5V/
P30
VDDR
Thermal Protection
P31
P20
0
2
1
USB PORT
+1.8V
Geneva
AMD ASB2 CPU
K125 (Athlon SC) 12W HT1
K325 (Athlon DC) 12W HT1
(812 balls ; 27x27mm
RS880M
HyperTransport LINK0 CPU I/F
DX10 IGP
SIDE PORT MEMORY
LVDS
1X16 PCIE I/ F
1X4 PCIE I/F WITH SB
6X1 PCIE I/F
(21x21mm)
A-Link X4
SB820M
USB2.0(14)+1.1(2)
SATA III(6PORTS)
4X1PCIEGEN2I/F
PCI/PCI BDGE
INT. RTC
INT. CLK
EC
HD AUDIO
LPC I/F
ACPI 1.1
(23x23mm)
LPC
EC
TouchPad
SPI Flash
DDR III,800 MT/s
)
P2~5
HyperTransport LINK
16x16
DDRIII
P6~9
HD AUDIO I/F
SATA II I/F
P10~14
Winbond NPCE781L
Charger
P25
P26
Chapter 15
Notebook Tour
This section provides an overview of the features and functions of the notebook.
Top View
#IconItemDescription
1Acer Crystal Eye
webcam
2Display screenAlso called Liquid-Crystal Display (LCD), displays computer
3MicrophoneInternal microphone for recording sound.
4Power button/Turns the computer on and off.
5KeyboardFor entering data into your computer
6Chapter 1
Web camera for video communication. (only for certain
models)
output (configuration may vary by model).
#IconItemDescription
6Power*Indicates the computer’s power status.
Battery*Indicates the computer’s battery status.
1. Charging: The light shows amber when the light is
charging.
2. Fully charged: the light shows blue when in AC mode.
HDD indicatorIndicates when the HDD is active.
Communication
indicator*
7Click buttons
(left, and right)
8TouchpadTouch-sensitive pointing device which functions like a
9PalmrestComfortable support area for your hand when using the
NOTE: *Front panel indicators are visible even when the computer cover is closed.
Indicates the status of the 3G/Wireless LAN
communication.
Blue light onOrange light onNot lit
3G on / WiFi on
3G on / WiFi off
The left and right buttons function like the left and right
mouse buttons.
computer mouse.
computer.
3G off / WiFi on3G off / WiFi off
Closed Front View
#IconItemDescription
1Status IndicatorsLight-Emitting Diodes (LED) that light up to show the status
of the computer’s functions and components.
Left View
#IconItemDescription
2
3HDMIHDMI portSupports high definition digital video connections.
4
Chapter 17
External display
(VGA) port
Ventilation slotsEnable the computer to stay cool, even after prolonged
Connects to a display device (e.g. external, LCD monitor,
LCD projector).
use.
#IconItemDescription
5
6
USB 2.0 portConnects to USB 2.0 devices (e.g., USB mouse, USB
camera).
Multi-in-1 card
reader
Accepts Secure Digital (SD), MultiMediaCard (MMC),
Memory Stick (MS), Memory Stick PRO (MS PRO),
xDPicture Card (xD).
Note: Push to remove/install the card. Only one card can
operate at any given time.
Right View
#IconItemDescription
7Microphone jackAccepts inputs from external microphones.
10
11
Headphones/
speaker/line-out
jack
8
9
USB 2.0 portConnects to USB 2.0 devices (e.g., USB mouse, USB
DC-in jackConnects to an AC adapter.
Kensington lock
slot
Ethernet RJ-45)
port
Connects to audio line-out devices (e.g., speakers,
headphones).
camera).
Connects to a Kensington-compatible computer security
lock.
Connects to an Ethernet 10/100/1000-based network.
8Chapter 1
Base View
#IconItemDescription
Battery bayHouses the computer’s battery pack.
12
13
14
3G SIM card slotAccepts a 3G SIM card for 3G connectivity. (only for certain
Battery release latchReleases the battery for removal.
Note: The battery shown is for reference only. Your PC may
have a different battery depending on the model purchased.
models)
Hard disk bayHouses the computer’s hard disk (secured with screws)
15
Memory compartmentHouses the computer’s main memory.
16
17
Ventilation slots and
cooling fan
Battery lockLocks the battery in position
Enable the computer to stay cool, even after prolonged use.
Note: Do not cover or obstruct the opening the fan.
Indicators
The computer has several easy-to-read status indicators. The battery indicator is visible even when the
computer cover is closed.
Icon Function Description
PowerIndicates the computer’s power status.
BatteryInd icates the computer’s battery status.
1. Charging: The light shows amber when the light is charging.
2. Fully charged: the light shows blue when in AC mode.
HDD indicatorIndicates when the HDD is active.
Communication
indicator*
Indicates the status of the 3G/Wireless LAN communication.
Chapter 19
TouchPad Basics
The following items show you how to use the TouchPa d:
1
2
•Move your finger across the TouchPad (1) to move the cursor.
•Press the left (2) and right (3) buttons located beneath the TouchPad to perform selection and
execution functions. These two buttons are the equivalent of the left and right buttons on a mouse.
Tapping on the TouchPad is the same as clicking the left button.
ExecuteQuickly click twice.Tap twice (at the same speed
SelectClick once.Tap once.
DragClick and hold, then use
finger on the TouchPad to
drag the cursor.
Access
context menu
NOTE: When using the T ouchPad, keep it - and your fingers - dry and clean. The TouchPad is sensitive to
finger movement; hence, the lighter the touch, the better the response. Tapping too hard will not
increase the TouchPad’s responsiveness.
Click once.
3
as double-clicking a mouse
button).
Tap twice (at the same speed
as double-clicking a mouse
button); rest your finger on
the TouchPad on the second
tap and drag the cursor.
10Chapter 1
Using the Keyboard
Your computer has a close-to-full-sized keyboard and an embedded numeric keypad, separate cursor, lock,
function and special keys.
Lock Keys and embedded numeric keypad
The keyboard has three lock keys which you can toggle on and off.
Lock keyDescription
Caps LockWhen Caps Lock is on, all alphabetic characters typed are in uppercase.
Num Lock When Num Lock is on, the embedded keypad is in numeric mode. The keys
function as a calculator (complete with the arithmetic operators +, -, *, and /). Use
this mode when you need to do a lot of numeric data entry. A better solution
would be to connect an external keypad.
Scroll Lock <Fn> +
<F12>
When Scroll Lock is on, the screen moves one line up or down when you press
the up or down arrow keys respectively. Scroll Lock does not work with some
applications.
The embedded numeric keypad functions like a desktop numeric keypad. It is indicated by small characters
located on the upper right corner of the keycaps. To simplify the keyboard legend, cursor-control key symbols
are not printed on the keys.
Desired accessNum Lock onNum Lock off
Number keys on
embedded keypad
Cursor-control keys on
embedded keypad
Main keyboard keysHold <Fn> while typing letters on
Type numbers in a normal manner.
Hold <Shift> while using cursorcontrol keys.
embedded keypad.
Hold <Fn> while using cursorcontrol keys.
Type the letters in a normal
manner.
Chapter 111
Windows Keys
The keyboard has two keys that perform Windows-specific functions.
KeyDescription
Windows key Pressed alone, this key has the same effect as clicking on the Windows Start button;
it launches the Start menu. It can also be used with other keys to provide a variety of
functions:
<>: Open or close the S tart menu
<> + <D>: Display the desktop
<> + <E>: Open Windows Explore
<> + <F>: Search for a file or folder
<> + <L>: Lock your computer (if you are connected to a network domain), or
switch users (if you're not connected to a network domain)
<> + <M>: Minimizes all windows
<> + <R>: Open the Run dialog box
<> + <U>: Open Ease of Access Center
<> + <BREAK>: Display the System Properties dialog box
<> + <TAB>: Cycle through programs on the taskbar
<CTRL> + <> + <F>: Search for computers (if you are on a network)
Note: Depending on your edition of Windows 7, some shortcuts may not function as
described.
Application
key
This key has the same effect as clicking the right mouse button; it opens the
application's context menu.
12Chapter 1
Hot Keys
The computer employs hotkeys or key combinations to access most of the computer's controls like screen
brightness and volume output.
To activate hotkeys, press and hold the <Fn> key before pressing the other key in the hotkey combination.
HotkeyIconFunctionDescription
<Fn> + <F3>Wireless
communication switch
<Fn> + <F4>SleepPuts the computer in Sleep mode.
Enables/disables the Wireless function.
<Fn> + <F5>Display toggleSwitches display output between the display
screen, external monitor (if connected) and both.
<Fn> + <F6>Screen blankTurns the display screen backlight off to save
power. Press any key to return.
<Fn> + <F7>Touchpad toggleTurns the touchpad on and off.
<Fn> + <F8>Speaker toggleTurns the speakers on and off.
<Fn> + < >Brightness upIncreases the screen brightness.
<Fn> + < >Brightness downDecreases the screen brightness.
<Fn> + < >
<Fn> + < >
Volume upIncreases the sound volume.
Volume downDecreases the sound volume.
Chapter 113
Special Keys
You can locate the Euro symbol and the US dollar sign at the upper-center and/or bottom-right of your
keyboard.
The Euro symbol
1.Open a text editor or word processor.
2.Hold <Alt Gr> and then press the <5> key at the upper-center of the keyboard.
NOTE: Some fonts and software do not support the Euro symbol. See www.microsoft.com/typography/faq/
faq12.htm for more information.
The US dollar sign
1.Open a text editor or word processor.
2.Hold <Shift> and then press the <4> key at the upper-center of the keyboard.
NOTE: This function varies according to the language settings.
14Chapter 1
Hardware Specifications and Configurations
Processor
ItemSpecification
CPUAMD Geneva (V105 CPU)
TypeSingle Core
CPU PackageASB2 package
On-die Cache512 KB L2
Front Side Bus 2.0 GT/s HyperTran s po rt li nk
Processor Specifications
Item
CPU Fan True Value Table (UMA)
CPU Temperature
(Celsius)
43270028
53320031
62350034
72390037
82420037
CPU
Speed
CoresBus SpeedCache SizePackage
Fan Speed (RPM)SPL Spec (dBA)
Core
Voltage
Acer P/N
Throttling 50%: On= 100°C; OFF=85°C
OS shut down at 105°C; H/W shut down at 110°C
CPU Fan True Value Table (Discrete)
CPU Temperature
(Celsius)
38270028
50320031
60355034
67390034
78420037
Throttling 50%: On= 95°C; OFF=90°C
OS shut down at 100°C; H/W shut down at 80°C
North Bridge Chipset
ItemSpecification
ChipsetRS880M
Package•Single chip solution in 55nm, 1.1V low power CMOS
Fan Speed (RPM)SPL Spec (dBA)
technology.
•528-FCBGA package, 21mmx21mm.
Chapter 115
ItemSpecification
Features•CPU HyperTransport. Interface
•Supports 16-bit up/down HyperTransport (HT) 3.0 interface up
to 4.4 GT/s.
•Supports 1.6, 1.8, 2.0, and 2.2 GHz HT3 frequencies.
•Supports AMD AM3 and S1g3-socket CPUs, including the
AMD Phenom II and Caspian-series processors.
•Supports LDTSTOP interface and CPU link stutter mode.
ATI HyperMemory.
• Supports ATI HyperMemory.*.
* Note: Includes dedicated and shared memory. The amount of
HyperMemory available is determined by various factors.
For details, please consult your AMD CSS representative.
PCI ExpressR Interface
•Supports PCIe Gen2 (version 2.0).
•Optimized peer-to-peer and general purpose link performance.
•Highly flexible PCI Express implementation to suit a variety of
platform needs.
•A dual-port, x16 graphics interface.
•Supports programmable lane reversal for the graphics link to
ease motherboard layout when the end device does not
support lane reversal (not applicable to the RS880MC).
•Supports six general purpose lanes, for up to six devices on
specific ports.
A-Link Express II Interface
•One x4 A-Link Express II interface for connection to an AMD
Southbridge. The A-Link Express II is a proprietary interface
developed by AMD basing on the PCI Express Gen2 version
2.0 technology, with additional Northbridge-Southbridge
messaging functionalities.
•Supports programmable lane reversal to ease motherboard
layout.
2D Acceleration Features
•Highly-optimized 128-bit engine, capable of processing
multiple pixels per clock.
•Hardware acceleration of Bitblt, line drawing, polygon and
rectangle fills, bit masking, monochrome expansion, panning
and scrolling, scissoring, and full ROP support (including
ROP3).
•Optimized handling of fonts and text using AMD proprietary
techniques.
•Game acceleration including support for Microsoft's
DirectDrawR: Double Buffering, Virtual Sprites, Transp arent
Blit, and Masked Blit.
•Acceleration in 1/8/15/16/32-bpp modes:
•Pseudocolor mode for 8bpp
•ARGB1555 and RGB565 modes for 16bpp
•ARGB8888 mode for 32bpp
•Significant increase in the High-End Graphics WinBenchR
score due to capability for C18 color expansion.
•Setup of 2D polygons and lines.
16Chapter 1
Item (NB Cont.)Specification
Features•Support for GDI extensions:
•In Windows XP and Windows Vista: Alpha BL T, Transparent BLT, and
Gradient Fill.
•In Windows 7: Alpha BLT, Transparent BLT, Color Fill BLT, Stretch
BLT, and Clear Type BLT.
•Hardware cursor (up to 64x64x32bpp), with alpha channel for direct
support of Windows XP, Windows Vista andWindows 7 alpha cursor.
•3D Acceleration Features
•Fully DirectX 10.1 compliant, including full speed 32-bit floating point
per component operations
•Shader Model 4.1 geometry and pixel support in a unified shader
architecture:
•Full speed 32-bit floating point processing per component.
•High dynamic range rendering with floating point blending, texture
filtering and anti-aliasing support.
•High performance dynamic range computations
•Full anti-aliasing on render surfaces up to and including 128-bit
floating point formats.
•Support for OpenGLR 2.0
•Anti-Aliasing Filtering:
•2x/4x/8x modes.
•Sparse multi-sample algorithm with gamma correction, programmable
sample patterns, and centroid sampling.
•Temporal anti-aliasing.
•Adaptive anti-aliasing mode.
•Lossless color compression (up to 8:1) at all resolutions, up to and
including widescreen HDTV.
•Anisotropic Filtering:
•2x/4x/8x/16x modes
•Up to 128-tap texture filtering.
•Adaptive algorithm with performance (bi-linear) and quality (tri-linear)
options.
•Improved quality mode due to improved subpixel precision, higher
precision LOD computations, and rotationally invariant LOD
computations.
•Advanced Texture Compression (3Dc+. ):
•High quality 4:1 compression for normal maps and luminance maps.
•Works with any single-channel or two-channel data format.
•HW support to overcome "Small batch" issues in CPU limited
applications.
•3D resources virtualized to a 32-bit addressing space, for support of
large numbers of render targets and textures.
•New vertex cache and vertex fetch design, to increase vertex
throughput from previous generations.
•Full support of 64-bit and 128-bit textures and surfaces, which can be
4x to 8x faster than previous generation of HW.
•Up to 8K x 8K textures, including 128 bpp texture are supported.
Chapter 117
Item (NB Cont.)Specification
Features•New multi-level texture cache to give optimal performance,
•Fully associative texture, color, and Z cache design.
•New hierarchical Z and stencil buffers with early Z Test.
•New lossless Z-buffer compression for both Z and stencil.
•Fast Z-Buffer Clear.
•Z cache optimized for real-time shadow rendering.
•Z and color compression resources virtualized to a 32-bit
addressing space, for support of multiple render targets and
textures simultaneously.
Motion Video Acceleration Features
•Video scaling and fully programmable YCrCb to RGB color
space conversion for full-speed video playback and fully
adjustable color controls.
•Adaptive de-interlacing eliminates video artifacts caused by
displaying interlaced video on non-interlaced displays, and by
analyzing image and using optimal de-interlacing function on a
per-pixel basis.
•H.264 implementation is based on the ISO/IEC 14496-10 spec.
•VC-1 implementation is based on the SMPTE 421M spec.
•For the RS880MC: MPEG-2 decode acceleration for SD
contents:
•Hardware motion compensation.
•Hardware Inverse Discrete Cosine Transform.
•Multiple Display Features
General
•Resolution, refresh rates, and display data can be completely
independent for the two display paths.
•¡E Each display controller supports true 30 bits per pixel
throughout the display pipe.
•¡E Each display path supports VGA and accelerated modes,
video overlay, hardware cursor, hardware icon, and palette
gamma correction.
•Supports both interlaced and non-interlaced displays.
•Full ratiometric expansion ability is supported for source desktop
modes up to 1920 pixels/line.
•Maximum DAC frequency of 400 MHz.
•Supports 8, 16, 32, and 64-bpp depths for the main graphics
layer:
•For 32-bpp depth, supports xRGB 8:8:8:8, xRGB 2:10:10:10,
sCrYCb 8:8:8:8, and xCrYCb 2:10:10:10 data formats.
•For 64-bpp depth, supports xRGB 16:16:16:16 data format.
•Independent gamma, color conversion and correction controls
for main graphics layer.
•Support for DDC1 and DDC2B+ for plug and play monitors.
•8-bit alpha blending of graphics and video overlay.
18Chapter 1
Item (NB Cont.)Specification
Features•Hardwa r e cursor up to 64x64 pixels in 2 bpp, full color AND/XOR mix,
and full color 8-bit alpha blend.
•Hardware icon up to 128x128 pixels in 2 bpp, with two colors,
transparent, and inverse transparent. AND/XOR mixing. Supports 2x2
icon magnification.
•Virtual desktop support.
•Support for flat panel displays via VGA.
VGA Output
•Maximum resolutions supported by the VGA output for different refresh
rates are:
•2048x1536 @85Hz (pixel clock at 388.5MHz) for 4:3 format
•2560x1440 @75Hz (pixel clock at 397.25MHz) for 16:9 format
•2456x1536 @60Hz (pixel clock at 320MHz) for 16:10 format
•1.3.10 Integrated LVDS Interface
•Integrated dual-link 24-bit LVDS interface.
•805 Mbps/channel with 115 MHz pixel clock rate per link (230 MHz
maximum pixel clock).
•FPDI-2 compliant; compatible with receivers from National
Semiconductor, Texas Instruments, and THine.
•OpenLDI compliant excluding DC balancing.
•Programmable internal spread spectrum controller for the signals.
System Clocks
•Support for an external clock chip to generate side-port memory, PCIe,
and A-Link Express II clocks. Alternatively, inte rnal generation for these
clocks, with clock input from an SB800-series Southbridge, can be
used (subject to characterization with actual RS880M and SB800series devices).
Power Management Features
•Single chip solution in 55nm, 1.1V CMOS technology.
•Supports ACPI 2.0 for S0, S3, S4, and S5 states.
•Full IAPC (Instantly Available PC) power management support.
•Static and dynamic power management support (APM as well as ACPI)
with full VESA DPM and Energy Star compliance.
•The Chip Power Management Support logic supports four device power
states defined for the OnNow Architecture - On, Standby, Suspend, and
Off. Each power state can be achieved by software control bits.
•Hardware controlled intelligent clock gating enables clocks only to
active functional blocks, and is completely transparent to software.
•Support for Cool'n'Quiet. via FID/VID change.
•Support for AMD PowerNow!..
•Clocks to every major functional block are controlled by a unique
dynamic clock switching technique that is completely transparent to the
software. By turning off the clock to the block that is idle or not used at
that point, the power consumption can be significantly reduce d during
normal operation.
•Supports AMD Vari-Brig ht., ATI PowerXpress., and ATI PowerPlay.
(enhanced with the ATI PowerShift. feature).
•Supports dynamic lane reduction for the PCIe graphics interface when
coupled with an AMD-based graphics device, PC Design Guide
Compliance
Chapter 119
Item (NB Cont.)Specification
Features•The RS880M complies with all relevant Windows Logo Program
(WLP) requirements from Microsoft for WHQL certification.
Test Capability Features
The RS880M has a variety of test modes and capabilities that provide a
very high fault coverage and low DPM (Defect Per Million) ratio:
•Full scan implementation on the digital core logic through ATPG
(Automatic Test Pattern Generation Vectors).
•Dedicated test logic for the on-chip custom memory macros to
provide complete coverage on these modules.
•A JTAG test mode to allow board level testing of neighboring
devices.
•An EXOR tree test mode on all the digital I/O's to allow for proper
soldering verification at the board level.
•A VOH/VOL test mode on all digital I/O¡¦s to allow for proper
verification of output high and output low values at the board level.
•Access to the analog modules to allow full evaluation and
characterization.
•IDDQ mode support to allow chip evaluation through current leakage
measurements.
•These test modes can be accessed through the settings on the
instruction register of the JTAG circuitry.
•Additional Features
•Integrated spread spectrum PLLs on the memory and LVDS
Supports AMD mobile processors code-named “Champlain,” and “Geneva.”
*A-Link Express II interface to Northbridges
1-, 2-, or 4-lane A-Link Express II
*interface
Automatic detection of lane configuration on boot-up
Dynamic lane width up/down configuration on detecting bandwidth
requirement Supports transfer rate of up to 2.5 GT/s per lane.
*PCI ExpressR Controller
Two-lane PCI ExpressR (PCIeR) 1.x interface, supporting up to two general
purpose devices. Supported configurations include:
1x2
2x1
*PCI Host Bus Controller
Supports PCI bus at 33MHz
Supports PCI Rev. 2.3 specification
Supports up to 4 bus master devices
Supports 40-bit addressing
Interrupt steering supported for plugn-play devices
Supports concurrent PCI operations BIOS/hardware support to hide PCI device
Supports spread spectrum
*USB Controllers
4 OHCI and 3 EHCI host controllers to support 14 USB 2.0 ports and 2 dedicated
USB 1.1 ports
Supports ACPI S1 ~ S5 Supports legacy keyboard/mouse
USB debug port
*Supports port disable with individual control
*SMBus Controller
Supports SMBALERT # signal
*Interrupt Controller
Supports IOAPIC/X-IO APIC mode for 24 channels of interrupts
Supports 8259 legacy mode for 15 interrupts
Supports programmable level/edge triggering on each channels
Supports serial interrupt on quiet and continuous modes
*DMA Controller
Two cascaded 8237 DMA controllers
Supports LPC DMA
Supports type F DMA
*LPC host bus Controller
Supports LPC-based super I/O and flash devices
Supports two master/DMA devices
Supports TPM version 1.1/1.2 devices for enhanced security
Supports SPI devices and SPI ROM sharing
Supports a maximum SPI ROM size of 16MB
Chapter 121
Item (SB Cont.)Specification
Features*SATA Controller
Supports six Third generation SATA ports (compatible with devices running at 6
Gbits/s, 3 Gbit/s, and1.5 Gbit/s)
Complies with SATA 2.6 specification
Supports three modes of operation:
*IDE emulation mode
AHCI mode (compliant with AHCI specification revision 1.2)
RAID mode
*Any of the six ports can be configured to a lower transfer rate of 3 or 1.5 Gbit/s
for saving power.
Any of the six SATA ports can be configured to support Second generation e-
SATA port (compatible with devices running at 3 Gbit/s and 1.5 Gbit/s; Third
generation e-SATA not supported as per the SATA 3.0 Specification).
Supports DIPM, HIPM, hot plug, and NCQ in AHCI mode.
*AMD RAID Support
Supports integrated RAID 0 and RAID 1 functionality across all 6 ports
*AHCI Support
Supports AHCI hardware assist (version 1.2) to support advanced features such
as NCQ (Native Command Queuing), hotplug, and *Device or Host Initiated
Power Management (DIPM /HIPM)
*High Definition Audio
Four independent output streams (DMA)
Four independent input streams (DMA)
Multiple channels of audio output per stream
*Supports up to 4 codecs
Up to 192kHz sample rate and 32-bit audio
64-bit addressing capability for DMA bus master and MSI
Unified Audio Architecture (UAA) compatible
HD Audio registers can be located anywhere in the 64-bit address space
Supports 3.3V/1.5V dual-voltage interface for power saving
*Gigabit Ethernet Media Access
*Controller (GbE MAC)
Supports RGMII/MII interface to Ethernet PHY (for selected
BroadcomRtransceivers only)
10/100/1000Base-T full duplex or half duplex MAC
Supports Receive Side Scaling (RSS)
IPv4 and IPv6 Large Send Offload (LSO)
IPv4 and IPv6 Checksum Offload
Wake-on-LAN (WoL) support
*Timers
8254-compatible timer
Microsoft High Precision Event Timer (HPET)
ACPI power management timer
Watchdog timer
*Real Time Clock (RTC)
256-byte battery-backed CMOS RAM
Hardware supported century rollover
Hardware supported day-light saving feature
RTC battery monitoring feature
22Chapter 1
Item (SB Cont.)Specification
Features*Power Management
ACPI specification 3.0 compliant power management schemes
Supports CPU C1e, C2, C3, C3 pop-up, C4, and C5 states
Supports system S0, S1, S3, S4, and S5 states
Wakeup events for S1, S3, S4, and S5 generated by:
Any GEVENT pin
Any GPM pin
USB
Power Button
Internal RTC wakeup
SMI event
Consumer IR
CPU SMM support, generating SMI message upon power management events
CLKRUN# support for PCI power management Provides clock generator and
CPU
vSTPCLK# control Supports hardware monitoring and fan control
ALPM (HIPM) on SATA
DIPM on SATA
*Consumer IR
Media center infrared with wake from all states
Two transmitters
IR receiver and wideband learning receiver
*Hardware Monitoring
Temperature monitoring
Monitor temperature range from 0 to 95‹C, with an accuracy of +/-5‹C
Voltage monitoring
Fan control
Supports up to 5 fans
Access to ACPI Features through
SMBus
ASFBus
GPIO
*Integrated Clock Function
Provides 25MHz, 14.318MHz, and 48MHz clocks
Provides CPU_HT and NB_HT clocks
Provides graphics, A-Link Express II, and nine general PCIe Rclocks
System Memory
ItemSpecification
Memory size0MB (No on-board Memory)
DIMM socket number2 sockets
Supports memory size per socket1GB
Supports maximum memory size2GB
Supports DIMM typeDDR3
Supports DIMM Speed800 MHz
Sideport MemoryDDR3 128MB
Chapter 123
Hard Disk Drive Interface
ItemSpecification
Vendor & Model
Name
Capacity (GB)TBD
Bytes per sector512
Data heads1-4
Drive Format
Disks1-2
Spindle speed
(RPM)
Performance Specifications
Buffer size 8 MB
InterfaceSATA
DC Power Requirements
Voltage
tolerance
BIOS
Seagate
AB160314009
AB250315000
AB320325009
5V ±5%5V ±5%5V ±5%5V ±5%
HGST
AB545016015
AB545025015
AB545032018
Toshiba 65GX
AB001664001
AB002565002
AB003265002
5400
WD
AB1600BE048
AB2500BE036
AB3200BE041
ItemSpecification
BIOS vendorPhoenix
BIOS versionRelease 4.0
BIOS ROM typeFlash
Features•Flash ROM 4MB
•Support ISIPP
•Support Acer UI
•Support multi-boot
•Suspend to RAM (S3)/Disk (S4)
•V arious hot-key s for system control
•Support SMBIOS 2.3, PCI2.2.
•Refer to Acer BIOS specification.
•DMI utility for BIOS serial number configurable/asset tag
(also called Brightness)
Contrast Ratio400 typical
Response Time (Optical Rise
16 typ / 25 Max
Time/Fall Time) msec
Luminance Uniformity1.25 max. (5 points)
Electrical InterfaceLVDS
Support Color262K colors ( RGB 6-bit )
Temperature Range (°C)
Operating
Storage (shipping)
0 to +50
-20 to +60
Bluetooth 2.0
ItemSpecification
Bluetooth ControllerAR3011/BCM 2046/BC2070
Features•Fully Qu alified Bluetooth v2.1 with Class 2 specification RF output
power.
•Enhanced Data Rate (EDR) compliant.
•Full Piconet and Scatternet operation.
•Integrated PIFA Antenna with better RF performance.
•USB 2.0 compliant interface.
•F/W upgradable via Flash downloads.
•Very low power consumption.
•Support Coexistence with Intel WCS (Wireless Coexistence System)
& AFH (Adaptive Frequency Hopping).
Bluetooth 3.0
ItemSpecification
Bluetooth Controller
Features•The Broadco m BCM2070 Bluetooth module is compatible with
Bluetooth
•Core Specification,Version 2.1, available in the 2.4GHz (ISM) band,
and support Enhanced Data Rate (EDR) and Adaptive Frequency
Hopping
•(AFH) schemes. The chipset is a single-chip Bluetooth transceiver
and baseband processor, with highest level of integration and
eliminating most of critical external components, and thus minimizing
the module size and its cost.
•Broadcom BCM2070 (50 pin BGA, single-chip Bluetooth transceiver
and base-band processor)
•Serial Flash Memory
•Bluetooth 2.1 compliant
•Point-to-multipoint operation
•External USB interface for data
•Onboard antenna and SMA RF connector
•Coexistence support
Chapter 125
Audio Codec and Amplifier
ItemSpecification
Audio
Controller
Package40-QFN
Features•Compliant with Intel High Definition Audio Specification Rev. 1.0
LAN Interface
LAN ChipsetATHEROS AR8152-AL1A-RL
Features•Integrated PHY for 10/100 Mbps
Keyboard
TypeACER AC7T_A10B AC7T Internal 17
Total number of keypads103/104/107
Windows logo keyYes
Internal & external keyboard work
simultaneously
Features•Supports application keys for Windows 7 version
•Spread Spectrum and 10-kV ESD withstand capability
ItemSpecification
•IEEE 802.3 Auto-Negotiation support
•IEEE 802.3 PHY compliance and compatibility
•Supports automatic MDI/MDIX functions
•Cable Diagnostic Test (CDT) for open, short cable, cable
length detection, and incorrect or mismatched
impedance
•Cable length to 180 meters
•Supports +/-100 ppm clock offset; Link stable with 3m +
180m + 3m test
•Link Period <1.5s
ItemSpecification
Yes
Media Card Reader
ItemSpecification
ChipsetAU6437-GBL -GR
PackageLQFP
Features•Fully compatible with USB2.0 High Speed and backward
compatible with USB1.1 specifications
•Supports multiple flash card interfaces, including SD/
MMC/xD/MS.
•Supports single LUN
•Supports both Windows and Mac OS
Camera
ItemSpecifications
Vendor and modelSUYIN/ Chicony/ Liteon
TypeCMOS image sensor with WXGA (resolution 1280X800)
InterfaceUSB Port
26Chapter 1
ItemSpecifications
Focusing range26.6cm ~ infinity (Chicony) 70cm (Suyin)
Dimensions (L x W x H
mm)
Sensor type1.0Mega CMOS Sensor
Pixel resolution1280X800
Pixel size3.0um X3.0um
Image size3.89mm(H) X 2.43mm(V)Part number
Wireless LAN
Vendor and modelFoxconn 4312/4314/HB95 BG/HB95 BGN or Lite on HB95 BGN/ Realtek
Features•Compatible with IEEE 802.11g standard . Integrated RF front end with high-
65 x 8 x 3.69 +0.11/-0.29 (H)
Specification
output PA , LNA, Rx/Tx switch
•The IEEE802.11g data rate provides for 54 auto fallback 48, 36, 24, 18, 12, 9, 6
and IEEE802.11b data rate provides for 11g auto fallback to 11, 5.5, 2 and
1Mbps.
•Support wireless data encryption with 64-bit, 128-bit WEP standard for security.
•Allows auto fallback data rate for optimized reliability, throughput and
transmission range.
•Supports Ad-hoc mode (peer-peer) and Infrastructure mode (client-server).
•Auto scan to find AP nearby and show signal strength for each channel.
•Support AES, TKIP, WPA, IEEE 802.1x and CCX.
•Support Quality of Service 802.11e.
•Dynamic Frequency Selection/Transmit Power Control (DFS/TPC) for
European operation.
•Support Site Survey.
Battery
Item
Vendor & model name
Battery Type
Pack capacity
Number of battery cell
Package configuration
3G
ItemSpecifications
Vendor and modelCDMA2000 ® 1X
TypeCDMA2000 1xEV-DO (Release0 and Rev.A)
InterfaceWCDMA (UMTS)
•Receive Diversity in CDMA2000 1X,CDMA2000 1xEV-DO and WCDMA
(UMTS)
•GSM Release 4
•GPRS/EGPRS Multi-slot Class12, Release 4
•Standalone GPS
I/O Interface
ItemSpecifications
Features•Color-coded connectors
•1 VGA port, 15 pins
•1 Microphone jack
•1 headphone/line-out jack
•3 External USB 2.0 connectors
•1 DC in jack
•1 RJ-45 jack for LAN
•5-in-1 Card Reader (MS, MS Pro, SD, MMC, xD)
•1 SIM Card connector
•1 HDMI port
28Chapter 1
Chapter 2
System Utilities
BIOS Setup Utility
The BIOS Setup Utility is a hardware configuration program built into your computer’s BIOS (Basic Input/
Output System).
Y our computer is already properly configured and optimized, and you do not need to run this utility . However, if
you encounter configuration problems, you may need to run Setup. Please also refer to Chapter 4
Troubleshooting when problem arises.
To activate the BIOS Utility, press F2 during POST (when Press <F2> to enter Setup message is prompted
on the bottom of screen).
Press F2 to enter setup. The default parameter of F12 Boot Menu is set to “disabled”. If you want to change
boot device without entering BIOS Setup Utility, please set the parameter to “enabled”.
Press <F12> during POST to enter multi-boot menu. In this menu, user can change boot device without
entering BIOS SETUP Utility.
Navigating the BIOS Utility
There are five menu options: Information, Main, Security, Boot, and Exit.
Follow these instructions:
•To choose a menu, use the left and right arrow keys.
•To choose an item, use the up and down arrow keys.
•To change the value of a parameter, press F5 or F6.
•Press Esc while you are in any of the menu options to go to the Exit menu.
•In any menu, you can load default settings by pressing F9. You can also press F10 to save any
changes made and exit the BIOS Setup Utility.
NOTE: You can change the value of a parameter if it is enclosed in square brackets. Navigation keys for a
particular menu are shown on the bottom of the screen. Help for parameters are found in the Item
Specific Help part of the screen. Read this carefully when making changes to parameter values. Please note that system information is subject to different models.
Chapter 229
Information
The Information screen displays a summary of your computer hardware information.
Pheonix SecureCore(tm) Setup Utility
MainBoot
CPU Type
CPU Type
CPU Speed
CPU Speed
IDE0 Model Name:
IDE0 Model Name:
IDE0 Serial Number:
IDE0 Serial Number:
System BIOS Version:
System BIOS Version:
VGA BIOS Version:
VGA BIOS Version:
Serial Number:
Serial Number:
Asset Tag Number:
Asset Tag Number:
Product Name:
Product Name:
Manufacturer Name:
Manufacturer Name:
UUID:
UUID:
SecurityInformation
AMD Athlon(tm) II
AMD Athlon(tm) II
Neo K325
Neo K325
1300 MHz
1300 MHz
ST9250315AS
ST9250315AS
5VCD1PDA
5VCD1PDA
V0.11
V0.11
ATi 010.094.001.045.035989
ATi 010.094.001.045.035989
ZH90SK01B100803E262500
ZH90SK01B100803E262500
S2.SBW0D.004
S2.SBW0D.004
Acer
Acer
991A7E04500A4E28BEA7C80AA9084002
991A7E04500A4E28BEA7C80AA9084002
Exit
Help
F1
Exit
ESC
NOTE: The system information is subject to different models.
ParameterDescription
CPU TypeThis field shows the CPU type and speed of the system.
CPU SpeedThis field shows the speed of the CPU.
IDE0 Model NameThis field shows the model name of HDD installed on primary IDE master.
IDE0 Serial NumberThis field displays the serial number of HDD installed on primary IDE master.
System BIOS VersionDisplays system BIOS version.
VGA BIOS VersionThis field displays the VGA firmware version of the system.
Serial NumberThis field displays the serial number of this unit.
Asset Tag NumberThis field displays the as set tag number of the system.
Product NameThis field shows product name of the system.
Manufacturer NameThis field displays the manufacturer of this system.
UUID NumberUniversally Unique Identifier (UUID) is an identifier standard used in software
Select Item
Select Menu
construction, standardized by the Open Software Foundation (OSF) as part of
the Distributed Computing Environment (DCE).
F5/F6
Enter
Change Values
SelectSubMenu
Setup Default
F9
Save and Exit
F10
30Chapter 2
Main
The Main screen allows the user to set the system time and date as well as enable and disable boot option
and recovery.
Pheonix SecureCure(tm) Setup Utility
Main
System Time:
System Time:
System Date:
System Date:
System Memory:
System Memory:
Video Memory:
Video Memory:
Quiet Boot:
Quiet Boot:
Network Boot
Network Boot
F12 Boot Menu
F12 Boot Menu
D2D Recovery
D2D Recovery
SATA Mode
SATA Mode
SecurityInformation
Boot
Exit
[09:39:54]
[09:39:54]
[04/02/2010]
[04/02/2010]
1024 MB
1024 MB
256 MB
256 MB
[Enabled]
[Enabled]
[Enabled]
[Enabled]
[Disabled]
[Disabled]
[Enabled]
[Enabled]
[AHCI Mode]
[AHCI Mode]
Item Specific Help
<Tab>, <Shift-Tab>, or
<Enter> selects field.
Help
F1
Exit
ESC
NOTE: The screen above is for your reference only. Actual values may differ.
The table below describes the parameters in this screen. Settings in boldface are the default and suggested
parameter settings.
ParameterDescriptionFormat/Option
System TimeSets the system time. The hours are displayed with 24-
System DateSets the system date.Format MM/DD/YYYY
System MemoryThis field reports the memory size of the system.
Video Memory
Quiet BootThis will hide POST messages while booting. Option: Enabled or Disabled
Network BootEnables, disables the system boot from LAN (remote
F12 Boot MenuEnables, disables Boot Menu during POST.Option: Disabled or Enabled
D2D RecoveryEnables, disables D2D Recovery function. The function
SATA ModeControl the mode in which the SATA controller should
Select Item
Select Menu
hour format.
Memory size is fixed to 4096MB.
Shows the video memory size. VGA Memory size=32 MB
server).
allows the user to create a hidden partition on hard disc
drive to store operation system and restore the system
to factory defaults.
operate.
F5/F6
Enter
Change Values
SelectSubMenu
Setup Default
F9
Save and Exit
F10
Format: HH:MM:SS
(hour:minute:second)
(month/day/year)
N/A
N/A
Option: Enabled or Disabled
Option: Enabled or Disabled
Option: AHCI mode or IDE
mode
Chapter 231
Security
The Security screen contains parameters that help safeguard and protect your computer from unauthorized
use.
Phoenix SecureCore(tm) Setup Utility
Information
Supervisor Password Is:
Supervisor Password Is:
User Password Is:
User Password Is:
HDD Password Is:
HDD Password Is:
Set Supervisor Password
Set Supervisor Password
Set User Password
Set User Password
Set HDD Password
Set HDD Password
Password on boot:
Password on boot:
MainBoot
Security
Clear
Clear
Clear
Clear
Clear
Clear
[Enter]
[Enter]
[Enter]
[Enter]
[Enter]
[Enter]
[Disabled]
[Disabled]
Exit
Item Specific Help
Supervisor Password
controls access to the
setup utility.
Help
F1
Exit
ESC
The table below describes the parameters in this screen. Settings in boldface are the default and suggested
parameter settings.
ParameterDescriptionOption
Supervisor Password IsShows the setting of the Supervisor passwordClear or Set
User Password IsShows the setting of the user password.Clear or Set
HDD Password IsShows the setting of the HDD passwordClear or Set
Set Supervisor PasswordPress Ente r to set the supervisor password. When
Set User PasswordPress Enter to set the user password. When user
Set HDD PasswordPress Enter to set the HDD password. When set this
Password on bootDefines whether a password is required or not for the
Select Item
Select Menu
set, this password protects the BIOS Setup Utility
from unauthorized access. The user can not either
enter the Setup menu nor change the value of
parameters.
password is set, this password protects the BIOS
Setup Utility from unauthorized access. The user can
enter Setup menu only and does not have right to
change the value of parameters.
protects the HDD from unauthorized access.
system to boot completely.
F5/F6
Enter
Change Values
SelectSubMenu
Setup Default
F9
Save and Exit
F10
Disabled or
Enabled
NOTE: When you are prompted to enter a password, you have three tries before the system halts. Don’t forget
the password. If you forget the password, you may have to reset the computer.
Setting a Password
Follow these steps as you set the user or the supervisor password:
32Chapter 2
1.Use the ↑ and ↓ keys to highlight the Set Supervisor Password parameter and press the Enter key. The
Set Supervisor Password box appears:
Set Supervisor Password
Enter New Password [ ][ ]
Confirm New Password [ ]
2.Type a password in the “Enter New Password” field. The password length can not exceeds 8
alphanumeric characters (A-Z, a-z, 0-9, not case sensitive). Retype the password in the “Confirm New
Password” field.
IMPORTANT:Be very careful when typing your password because the characters do not appear on the screen.
3.Press Enter. After setting the password, the computer sets the User Password parameter to “Set”.
4.If desired, you can opt to enable the Password on boot parameter.
5.When you are done, press F10 to save the changes and exit the BIOS Setup Utility.
Removing a Password
Follow these steps:
1.Use the ↑ and ↓ keys to highlight the Set Supervisor Password parameter and press the Enter key. The
Set Password box appears:
Set Supervisor Password
Enter Current Password [ ][ ]
Enter New Password [ ]
Confirm New Password [ ][ ]
2.Type the current password in the Enter Current Passwor d fi el d an d press Enter.
3.Press Enter twice without typing anything in the Enter New Password and Confirm New Password fields.
The computer then sets the Supervisor Password parameter to “Clear”.
4.When you have changed the settings, press u to save the changes and exit the BIOS Setup Utility.
Chapter 233
Changing a Password
1.Use the ↑ and ↓ keys to highlight the Set Supervisor Password parameter and press the Enter key. The
Set Password box appears.
Set Supervisor Password
Enter Current Password [ ][ ]
Enter New Password [ ]
Confirm New Password [ ][ ]
2.Type the current password in the Enter Current Passwor d fi el d an d press Enter.
3.Type a password in the Enter New Password field. Retype the password in the Confirm New Password
field.
4.Press Enter. After setting the password, the computer sets the User Password parameter to “Set”.
5.If desired, you can enable the Password on boot parameter.
6.When you are done, press F10 to save the changes and exit the BIOS Setup Utility.
If the verification is OK, the screen will display as following.
Setup Notice
Changes have been saved.
[Continue][Continue]
The password setting is complete after the user presses Enter.
If the current password entered does not match the actual current password, the screen will show you the
Setup Warning.
Setup Warning
Invalid Password.
[Continue][Continue]
If the new password and confirm new password strings do not match, the screen displays the following
message.
Setup Warning
Passwords do not match.
Re-enter password.
[Continue][Continue]
34Chapter 2
Boot
This menu allows the user to decide the order of boot devices to load the operating system. Bootable devices
includes the USB diskette drives, the onboard hard disk drive and the DVD drive in the module bay.
Phoenix SecureCore(tm) Setup Utility
Information
Boot priority order:
Boot priority order:
MainBoot
Security
Exit
Item Specific Help
1. IDE HDD : ST9250315AS-(S1)
1. IDE HDD : ST9250315AS-(S1)
2. IDE1 CD:
2. IDE1 CD:
3. USB FDC:
3. USB FDC:
4. PCI BEV: Atheros Boot Agent
4. PCI BEV: Atheros Boot Agent
5. USB HDD:
5. USB HDD:
6. USB CDROM:
6. USB CDROM:
7. USB KEY:
7. USB KEY:
Excluded from boot order:
Excluded from boot order:
F1
ESC
Help
Exit
Select Item
Select Menu
F5/F6
Enter
Change Values
SelectSubMenu
Use < > or < > to select
a device, then press
<F6> to move it up the
List, or <F5> to move
it down the list. Press
<Esc> to escape the
menu.
Setup Default
F9
Save and Exit
F10
Chapter 235
Exit
The Exit screen allows you to save or discard any changes you made and quit the BIOS Utility.
Phoenix SecureCore(tm) Setup Utility
InformationMain
Exit Saving Changes
Exit Saving Changes
Exit Discarding Changes
Exit Discarding Changes
Load Setup Defaults
Load Setup Defaults
Discard Changes
Discard Changes
Save Changes
Save Changes
Security
Boot
Exit
Item Specific Help
Exit System Setup and
save your changes to
CMOS.
Help
F1
Exit
ESC
The table below describes the parameters in this screen.
ParameterDescription
Exit Saving ChangesExit System Setup and save your changes to CMOS.
Exit Discarding
Changes
Load Setup DefaultLoad default values for all Setup item.
Discard ChangesLoad previous values from CMOS for all Setup items.
Save ChangesSave Setup Data to CMOS.
Select Item
Select Menu
Exit utility without saving setup data to CMOS.
F5/F6
Enter
Change Values
SelectSubMenu
F9
F10
Setup Default
Save and Exit
36Chapter 2
BIOS Flash Utility
The BIOS flash memory update is required for the following conditions:
•New versions of system programs
•New features or options
•Restore a BIOS when it becomes corrupted.
Chapter 237
DOS Flash Utility
Perform the following steps to use the DOS Flash Utility:
1.Press F2 during boot to enter the Setup Menu.
2.Select Boot Menu to modify the boot priority order, for example, if using USB HDD to Update BIOS, move
USB HDD to position 1.
Phoenix SecureCore(tm) Setup Utility
Information
Boot priority order:
Boot priority order:
MainBoot
Security
Exit
Item Specific Help
1. IDE HDD : ST9250315AS-(S1)
1. IDE HDD : ST9250315AS-(S1)
2. IDE1 CD:
2. IDE1 CD:
3. USB FDC:
3. USB FDC:
4. PCI BEV: Atheros Boot Agent
4. PCI BEV: Atheros Boot Agent
5. USB HDD:
5. USB HDD:
6. USB CDROM:
6. USB CDROM:
7. USB KEY:
7. USB KEY:
Excluded from boot order:
Excluded from boot order:
Help
F1
Exit
ESC
3.Execute the FLASH.BAT batch file to update BIOS. Or enter C:\ Flash it bios ver.fd/dc
The flash process begins as shown.
Select Item
Select Menu
F5/F6
Enter
Change Values
SelectSubMenu
Use < > or < > to select
a device, then press
<F6> to move it up the
List, or <F5> to move
it down the list. Press
<Esc> to escape the
menu.
Setup Default
F9
Save and Exit
F10
4.In flash BIOS, the message Please do not remove AC Power Source displays.
NOTE: If the AC power is not connected, the following message displays.
Plug in the AC power to continue.
38Chapter 2
5.Flash is complete when the message Flash programming complete displays.
Chapter 239
WinFlash Utility
Perform the following steps to use the WinFlash Utility:
1.Double click the WinFlash executable.
2.Click OK to begin the update. A progress screen displays.
3.When the process is complete, close all programs and applications and reboot the system.
40Chapter 2
Remove HDD/BIOS Password Utilities
This section provide you with removing HDD/BIOS method:
Remove HDD Password:
When the user keys in the wrong password three times, the system reports the following error code to user.
To unlock the HDD password, perform the following steps:
1.Press Enter to display the Select Item screen.
2.Select Enter Unlock Password and press Enter.
An Unlock Password displays.
3.Make a note of the key, 76943488 in the example.
4.Boot up the system to a removable bootable drive containing DOS and the UnlockHD.EXE program and
open a DOS prompt. For instructions on changing boot priority see “Boot” on page 35.
5.From the DOS prompt, enter the UnlockHD.EXE command and input the key to create an unlock code.
Make a note of the result, for example 46548274.
6.Reboot to the hard disk and wait for the error code to reappear.
7.Press Enter to display the Select Item screen.
8.Select Enter Unlock Password and press Enter.
9.Enter the unlock code generated by UnlockHD.EXE.
10. Save and exit the BIOS to complete the process.
Chapter 241
Removing BIOS Passwords:
If you key in the wrong Supervisor Password three times, System Disabled displays on the screen. See the
image below.
To reset the BIOS password, run clnpwd.exe as follows:
1.From a DOS prompt, Execute clnpwd.exe
2.Press 1 or 2 to clean the desired password shown on the screen.
The onscreen message determines whether the function is successful or not.
42Chapter 2
Miscellaneous Utilities
Using Boot Sequence Selector
Boot Sequence Selector allows the boot order to be changes without accessing the BIOS. To use Boot
Sequence Selector, perform the following steps:
1.Enter into DOS.
2.Execute BS.exe to display the usage screen.
3.Select the desired boot sequence by entering the corresponding sequence, for example, enter BS2 to
change the boot sequence to HDD|CD ROM|LAN|Floppy.
Using DMITools
The DMI (Desktop Management Interface) Tool copies BIOS information to eeprom to be used in the DMI pool
for hardware management.
When the BIOS displays Verifying DMI pool data it is checking the table correlates with the hardware before
sending to the operating system (Windows, etc.).
To update the DMI Pool, perform the following steps:
1.Enter into DOS.
2.Execute dmitools.exe. The following messages show dmitools usage:
IMPORTANT:The following write examples (2 to 5) require a system reboot to take effect
Chapter 243
Example 1: Read DMI Information from Memory
Input:
dmitools /r
Output:
Manufacturer (Type1, Offset04h): Acer
Product Name (Type1, Offset05h): Aspire one xxxxx
Serial Number (Type1, Offset07h): 01234567890123456789
UUID String (Type1, Offset08h): xxxxxxxx-xxxx-xxxx-xxxx-xxxxxxxxxxxx
Asset Tag (Type3, Offset04h ) : Acer Asstag
Example 2: Write Product Name to EEPROM
Input:
dmitools /wp Acer
Example 3: Write Serial Number to EEPROM
Input:
dmitools /ws 01234567890123456789
Example 4: Write UUID to EEPROM
Input:
dmitools /wu
Example 5: Write Asset Tag to EEPROM
Input:
dmitools /wa Acer Asstag
Using the LAN MAC Utility
Perform the following steps to write MAC information to eeprom:
1.Use a text editor, for example Notepad, to edit the MAC.CFG file as shown:
•WriteData= '001122334455' <------- MAC value
•StartAddr=7A <------- MAC address
•W r iteLeng=6 <------- MAC value length
•KeepByte=0 <------- can be any value
2.Boot into DOS.
3.Execute MAC.BAT to write MAC information to eeprom.
44Chapter 2
Chapter 3
Machine Disassembly and Replacement
This chapter contains step-by-step procedures on how to disassemble the notebook computer for
maintenance and troubleshooting.
Disassembly Requirements
To disassemble the computer, you need the following tools:
•Wrist grounding strap and conductive mat for preventing electrostatic discharge
•Flat screwdriver
•Philips screwdriver
•Plastic flat screwdriver
•Plastic tweezers
NOTE: The screws for the different components vary in size. During the disassembly process, group the
screws with the corresponding components to avoid mismatch when putting back the components.
Related Information
The product previews seen in the disassembly procedures may not represent the final product color or
configuration.
IMPORTANT: Cable paths and positioning may not represent the actual mode l. During the removal and
replacement of components, ensure all available cable channels and clips are used and that the cables are
replaced in the same position.
Replacement Requirements
NOTE: Cabling and components require adhesive to be applied during the replacement and reassembly
process.
NOTE: During manufacture a cyanoacrylate glue is used provided by Holdtite Adhesives LTD. This is not a
specified requirement. The reassembler is free to select an alternative appropriate adhesive.
Chapter 345
Pre-disassembly Instructions
Before proceeding with the disassembly procedure, make sure that you do the following:
1.Turn off the power to the system and all peripherals.
2.Unplug the AC adapter and all power and signal cables from the system.
3.Place the system on a flat, stable surface.
46Chapter 3
Disassembly Process
The disassembly process is divided into the following sections:
•External components disassembly
•Main unit disassembly
•LCD module disassembly
The flowcharts provided in the succeeding disassembly sections illustrate the entire disassembly sequence.
Observe the order of the sequence to avoid damage to any of the hardware components. For example, if you
want to remove the Mainboard, you must first remove the Keyboard, and LCD Module then disassemble the
inside assembly frame in that order.
2.Slide the battery lock/unlock latch to the unlock position.
3.Slide and hold the battery release latch to the release position (1), then slide out the battery pack from the
main unit (2).
2
1
NOTE: The battery has been highlighted with a yellow oval as shown in the above image. Please detach the
battery and follow local regulations for disposal.
Chapter 349
Removing the Dummy Card
1.Press the dummy card in to allow it to spring out.
2.Pull the dummy card out.
50Chapter 3
Removing the Base Door
1.See “Removing the Battery Pack” on page 49.
2.Remove the seven (7) screws.
StepScrewQuantityScrew Type
Base Door
Disassembly
3.Lift the base door up at the finger indentation location provided in the bottom cover.
M2.5*5 (red call
out)
7
Chapter 351
Removing the DIMM Module
1.See “Removing the Battery Pack” on page 49.
2.See “Removing the Base Door” on page 51.
3.Push the memory module clips outwards.
4.Pull the memory module out.
52Chapter 3
Removing the Hard Disk Drive Module
1.See “Removing the Battery Pack” on page 49.
2.See “Removing the Base Door” on page 51.
3.Detach the WLAN module antennas from the WLAN board.
4.Detach the 3G module antennas from the 3G board.
5.Remove the WLAN antennas from the cable channel.
Chapter 353
6.Remove both the WLAN and 3G antennas from the cable channel. Take care to lift the cable away from
the metal guide (green callout) at the corner of the HDD module.
7.Grasp the tab and pull upwards while using the opposite hand to guide the HDD out of the bay.
54Chapter 3
8.Pull the HDD module out of the connector.
9.Remove four (4) screws from the HDD bracket.
StepScrewQuantityScrew Type
HDD Bracket
Disassembly
10. Remove the brackets from the HDD.
Chapter 355
M3*3Ni4
Removing the WLAN Module
1.See “Removing the Battery Pack” on page 49.
2.See “Removing the Base Door” on page 51.
3.Detach the two (2) cables from the Wireless LAN module.
IMPORTANT:Take note of the Main (black) and Auxiliary (white) connectors.
4.Remove the one (1) screw. Ensure the cables are well clear of the module.
StepScrewQuantityScrew Type
WLAN Module
Disassembly
56Chapter 3
M2.5*3Ni1
5.Pull the WLAN module out and away.
Chapter 357
Removing the 3G Module
1.See “Removing the Battery Pack” on page 49.
2.See “Removing the Base Door” on page 51.
3.Detach the two (2) cables from the 3G module.
NOTE: Take note of the Main (blue) and Auxiliary (yellow) connectors.
4.Remove the two (2) screws. Ensure the cables are well clear of the module.
StepScrewQuantityScrew Type
3G Module
Disassembly
58Chapter 3
2
5.Pull the 3Gmodule out and away.
Chapter 359
Main Unit Disassembly Process
IMPORTANT: Cable paths and positioning may not represent the actual mode l. During the removal and
replacement of components, ensure all available cable channels and clips are used and that the cables are
replaced in the same position.
NOTE: The product previews seen in the disassembly procedures may not represent the final product color or
configuration.
Main Unit Disassembly Flowchart
Remove External
Modules before
proceeding
Remove
Keyboard
Remove
Upper Cover
Remove
LCD Module
Remove
Mainboard
Remove
Bluetooth Module
Remove
Touchpad Board
Remove
RTC Battery
Remove
Speakers
Remove
Thermal Module
Screw List
StepScrewQuantityPart No.
Remove Upper Cover
60Chapter 3
StepScrewQuantityPart No.
Remove Lower Cover
Remove Switch Board
Remove Power
Module
Remove I/O Board
Remove Bluetooth
Module
Remove Mainboard
Remove Power Jack
Assembly
Chapter 361
Removing the Keyboard
IMPORTANT: The keyboard is easily warped or damage d during the removal process. Take care not to use
excessive force when removing to prevent damage.
1.See “External Module Disassembly Process” on page 48.
2.Using the plastic pry, press in the five (5) latches along the top of the keyboard to release the keyboard
from the cover.
NOTE: The keyboard will spring up slightly when all retaining clips are unlocked.
3.Flip the keyboard over.
62Chapter 3
4.Detach the keyboard FPC.
a.Unlock the FPCb.Pull the keyboard away
a
b
Chapter 363
Removing the Upper Cover
1.See “Removing the Keyboard” on page 62.
2.Unlock and disconnect the Toucpad board FFC.
3.Peel back the adhesive tape on the LVDS connector . Disconnect the LVDS cable.
64Chapter 3
4.Remove the seventeen (17) screws in the upper cover.
StepScrewQuantityScrew Type
Upper Cover
Disassembly
M2*2.5 (red call out)6
M2*5 (blue call out)11
5.Turn the computer over and remove the nine (9) screws in the lower cover.
StepScrewQuantityScrew Type
Lower Cover
Disassembly
(red call out)4
(blue call out)5
Chapter 365
6.Disconnect the HDD connector from the chassis.
7.Pry the upper cover apart from the lower cover starting along the bottom edge. Lift the upper cover away.
.
66Chapter 3
Removing the Touchpad Board
1.See “Removing the Upper Cover” on page 64.
2.Pull the end of the touchboard FFC through the upper cover.
3.Unlock the touchpad FFC connector.
4.Disconnect the touchpad FFC.
Chapter 367
Removing the Bluetooth Module
1.See “Removing the Upper Cover” on page 64.
2.Disconnect the Bluetooth module cable from the mainboard.
3.LIft the Bluetooth module away from the computer.
4.Detach the Bluetooth module cable from the module.
68Chapter 3
Removing the LCD Module
1.See “Removing the Upper Cover” on page 64.
2.Disconnect the LVDS cable and remove it from the cable channel.
3.Pass the WLAN and 3G antennas through the chassis.
Chapter 369
4.Remove two (2) screws from the hinge.
StepScrewQuantityScrew Type
LCD Module Hinge
Disassembly
5.Lif the LCD assembly clear of the chassis.
M2.5*52
70Chapter 3
Removing the Mainboard
1.See “Removing the Upper Cover” on page 64.
2.See “Removing the Touchpad Board” on page 67.
3.See “Removing the Mainboard” on page 71.
4.Turn the computer over and disconnect the power cable from the mainboard.
5.Remove the one (1) screw on the main board.
StepScrewQuantityScrew Type.
Main Board
Disassembly
Chapter 371
M2.5*51
6.Lift the main board out of the assembly. Lift the I/O edge up first then pull out the external connector edge.
NOTE: The CPU is integrated on the mainboard.
72Chapter 3
Removing the Thermal Module
1.See “Removing the Mainboard” on page 71.
2.Disconnect the thermal module fan connector.
3.Loosen the four (4) captive screws.
Chapter 373
4.Lift the thermal module away from the main board.
NOTE: Circuit boards >10 cm² have been highlighted with a yellow rectangle as shown in the
previous image. Please detach the circuit board and follow local regulations for disposal.
74Chapter 3
Removing the Speakers
1.See “Removing the Mainboard” on page 71.
2.Remove the adhesive tape from the speaker cable.
3.Remove four (4) screws from the power assembly bracket.
StepScrewQuantityScrew Type
Speaker Disassembly4
Chapter 375
4.Lift the speakers clear of the lower cover.
76Chapter 3
LCD Module Disassembly Process
IMPORTANT: Cable paths and positioning may not represent the actual mode l. During the removal and
replacement of components, ensure all available cable channels and clips are used and that the cables are
replaced in the same position.
NOTE: The product previews seen in the disassembly procedures may not represent the final product color or
configuration.
NOTE: See “Removing the Bluetooth Module” on page 68 for instructions on how to remove the LCD module.
LCD Module Disassembly Flowchart
Remove LCD
Panel fr om Main
Unit before
proceeding
Remove
LCD Bezel
Remove
Camera Module
Remove
LCD Panel
Remove
LCD Cover
Hinges
Screw List
StepScrewQuantityPart No.
Remove LCD
Bezel
Remove LCD
Panel
Remove Left
Hinge
Remove Right
Hinge
Chapter 377
Removing the LCD Bezel
1.See “Removing the Touchpad Board” on page 67.
2.Remove the two (2) bezel screw covers and screws.
StepScrewQuantityScrew Type
Remove LCD BezelM2.5*42
3.Pry open the bottom corners and along the bottom edge.
78Chapter 3
4.Pry the bezel away from the top and then work around the corners.
5.Lift the bezel off the module.
Chapter 379
Removing the Camera Board
1.See “Removing the LCD Bezel” on page 78.
2.Pull up the camera board.
3.Disconnect the camera connector.
80Chapter 3
Removing the LCD Panel
1.See “Removing the Camera Board” on page 80.
2.Remove the four (4) screws of the LCD panel.
StepScrewQuantityScrew Type
Remove LCD Panel M2x34
3. Lift the panel clear of the cover.
Chapter 381
4.Peel the LVDS cable and mylar off the LCD panel as shown.
5.Disconnect the L VDS cable.
82Chapter 3
Removing the LCD Cover Hinges
1. See “Removing the LCD Panel” on page 81.
2.Remove four (4) screws from the LCD cover hinges.
StepScrewQuantityScrew Type
Remove Cover Hinges4
3.Remove the right and left LCD cover hinges.
Chapter 383
LCD Reassembly Procedure
NOTE: During manufacture a cyanoacrylate glue is used provided by Holdtite Adhesives LTD. This is not a
specified requirement. The reassembler is free to select an alternative appropriate adhesive.
Replacing the LCD Cover Hinges
1.See “Replacing the LCD Cover Hinges” on page 84.
2.Place the right and left LCD cover hinges in the cover.
3.Secure the hinges using four (4) screws.
84Chapter 3
Replacing the LCD FPC Cable
1.Connect the FPC cable connector.
2.Adhere the FPC cable to the panel.
Chapter 385
Replacing the LCD Panel
3.Place the LCD panel in the cover.
4.Replace the four (4) screws, while ensuring the cables pass through the hinge correctly.
StepScrewQuantityScrew Type
LCD Panel Assembly4
86Chapter 3
Replacing the Camera Board
1.Connect the camera cable to the board as shown.
2.Press the camera board into the cover.
Chapter 387
Replacing the LCD Bezel
1.Place the LCD bezel on the cover.
2.Ensure the cables are correctly exiting the hinges.
88Chapter 3
3.Press down on the top middle edge of the bezel to engage the locking clips. Press down on the bezel
edge working simultaneously around the edges to the bottom.
4.Replace the two (2) bezel screws and screw covers.
StepScrewQuantityScrew Type
Replace LCD BezelM2.5*42
Chapter 389
Main Unit Reassembly Process
Replacing the Speakers
1.Place the speakers in the upper cover.
2.Secure the speakers using four (4) screws.
90Chapter 3
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