3. 関連仕様図 ·····································································································1
RELATED SPECIFICATION DRAWINGS ························································ 6
4. 関連規格類 ·····································································································1
RELATED TEST STANDARDS ········································································· 6
This connector is designed for IDC (Insulation Displacement Connector) connection with 1.27mm pitch
flat cable. This connector has 2 rows of plural U-elements at topside and 2 rows of contact tails at
bottom side.
Then, this connector has the function of electrical connection between cable and PC board or cable and
compatible IC socket (Plating Suffix : SC or S).
2. COMPATIBLE OBJECTS
2-1 WIRE ACCOMODATION
28 AWG Stranded *corresponding with UL Style 2651
2-2 COMPATIBLE BOARD
Thickness: 1.6mm ± 0.2mm
Through hole diameter: φ1.0mm ± 0.1mm
* Refer to the drawing 4U-0010-0940-6.
* In the case that (X)3406-0000 XX (14 pos.) or (X)3416-0000 XX (16 pos.) is mounted on the PC
board by soldering, more than 0.5mm thickness spacers (ex. plastic washer with high temperature
resistance) should be used for spacing between the connector body and PC board.
2-3 COMPATIBLE IC SOCKET
IS socket should have the compatibility with the following specification of the terminals.
PRODUCT No. LEAD LENGTH LEAD SECTION
(X)3406-0000 XX (14Pos.) and
(X)3416-0000 XX (16Pos.)
(X)3460-0000 XX (24Pos.)
(X)3508-0000 XX (40Pos.)
4.4 ± 0.3mm
* These connectors don't have standoff bumps.
3.8 ± 0.3mm
* Lower side from the bottom of the standoff
bumps (Height: 0.6mm).
3.9 ± 0.3mm
* Lower side from the bottom of the standoff
bumps (Height: 0.5mm).
* IC socket should be used for (X)3XXX-0000 SC
IC socket can not be used for (X)3XXX-0000 PR
and (X)3XXX-0000 S.
.
3. RELATED SPECIFICATION DRAWINGS
See the drawings described in JNPD-0846.
4. RELATED TEST STANDARDS
MIL-STD-202
JEIDA-38-1984
JIS C 0050
JNTM-0039, JNTM-0040
*JNTM: Test Method Standard of Sumitomo 3M for Electronic and Electrical Component Parts.
0.46 ± 0.05mm ×
0.36 ± 0.05mm
6
Page 4
JNPS-0846
5. APPLICATION
PRODUCT NUMBER INFORMATION
(X) 3XXX – 0 X 0 0 XX
PLATING SUFFIX
PR : U-ELEMENT AREA & TAIL AREA / Gold Flash Plating
SC : U-ELEMENT AREA / Nickel Plating
TAIL AREA / Gold Plating 0.2µm Min
S : U-ELEMENT AREA / Nickel Plating
TAIL AREA / Gold Plating 0.76µm Min.
SHAPE OF TAIL SECTION
0 : Rectangular Pin (0.46mm × 0.36mm)
CONTACT DISPOSITION
CONTACT QUANTITY
3406: 14P (Distance of terminal row : 7.62mm)
3416: 16P (Distance of terminal row : 7.62mm)
3460: 24P (Distance of terminal row : 15.24mm)
3508: 40P (Distance of terminal row : 15.24mm)
BODY COLOR
Blank : Gray (Contact Disposition : Standard)
D : Black (Contact Disposition : Mirror Image Type)
0 : Standard (Body Color : Gray)
1 : Mirror Image Type (Body Color : Black)
7
Page 5
JNPS-0846
6. QUALITY PERFORMANCE
6-1 RATING
ITEM RATING
CURRENT
VOLTAGE
TEMPERATURE
AC: 250V Max. / DC: 300V Max.
1.0A Max.
-55°C ~ 105°C
6-2 PHYSICAL SPECIFICATIONS * The value in ( ) is reference.
TEST
DESCRIPTION
VIBRATION
MECHANICAL
SHOCK
SOLDERABILITY
SOLDERING HEAT
RESISTANCE
REQUIREMENT TEST CONDITION
Electrical discontinuity:
Less than 1µs
Electrical discontinuity:
Less than 1µs
Wetting: 95% Min.
or
Zero cross time:
3 seconds Max.
Connector should not have
any defect portions after test.
Sweep Freq.: 10∼55Hz, Amplitude:
1.52mm(or 98 m/s2), Sweep Cycle:
1min., Sweep time: 2 hours Sweep in
each direction: (X,Y,Z)
490 m/s2, 11ms, Half sine shock pulse.
3 times / X,Y,Z directions (Total 18
times)
Solder: Sn-3Ag-0.5Cu
- Wetting Measurement:
245°C, 3 seconds
- Wetting Balance Method:
245°C
Dip soldering:
260°C, 10 seconds, 2 times or
263°C, 5 seconds, 2 times
* without Pre-heating
Soldering Iron:
Dependence on soldering conditions.
* It need the evaluation
under actual conditions.
RELATED
STANDARD
MIL-STD-
202F 101A
MIL-STD-
202E 213B
JNTM-0039
JIS C 0050
JNTM-0040
8
Page 6
JNPS-0846
6-3 ELECTRICAL SPECIFICATIONS
TEST
DESCRIPTION
DIELECTRIC
WITHSTANDING
VOLTAGE
INSULATION
RESIDENSE
CONTACT
RESISTANCE
REQUIREMENT TEST CONDITION
No appearance of arcing
and break down.
Leak current: 1mA Max.
The first letter, in stamped 3 letters on the connector body for lot numbering, identified the following
plating specs.
N
XX or n XX : PR plating
C
XX or c XX : SC plating
S
XX or s XX : S plating
* XX : two alphabet letters
8. PACKAGE & IDENTIFICATION
These products are packed with plastic tray and carton box for transit.
Carton box are identified by part number, quantity, maker name and lot number.
9
Page 7
JNPS-0846
9. STORAGE
This products shall be stored in a room, ambient temperature 5 ∼ 35°C, and ambient humidity
40 ∼ 70%.
10. ATTENTIONS
10-1 BOARD MOUNTING
In the case that (X)3406-0000 XX (14 pos.) or (X)3416-0000 XX (16 pos.) is mounted on the PC board
by soldering, more than 0.4mm thickness spacers (ex. plastic washer with high temperature resistance)
should be used for spacing between the connector body and PC board.
10-2 COMPATIBILITY WITH IC SOCKET
IC socket should be used for (X)3XXX-0000 SC and (X)3XXX-0000 S.
IC socket can not be used for (X)3XXX-0000 PR
.
10
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