3. 関連仕様図 ·····································································································1
RELATED SPECIFICATION DRAWINGS ························································ 6
4. 関連規格類 ·····································································································1
RELATED TEST STANDARDS ········································································· 6
This connector is one of MDR board mount receptacle right angle series. And mating side has 2 rows of
female contacts with the pitch of 1.27mm and contact tails are arranged in 1.27mm×1.905mm staggered
grid. This connector can be mounted on the compatible PC board and mating with MDR plug connector
enable to have the electrical performance.
2. COMPATIBLE OBJECTS
2-1 COMPATIBLE CONNECTORS
3M BRAND MDR PLUG : 101XX-XXXX XX
2-2 COMPAIBLE PC BOARDS
PCB with solder plating hole
See RELATED SPECIFICATION DRAWINGS recommended hole pattern.
PRODUCT No.
PCB RETENSION
METHOD
PCB RETENSION
HOLE DIA.
PCB THICKNESS
102XX-520X XX
102XX-521X XX
102XX-524X XX
102XX-52AX XX
102XX-52BX XX
102XX-52EX XX
102XX-52DX XX
102XX-52FX XX
102XX-52GX XX
102XX-52HX XX
SCREW LOCK
GROUND LOCK TYPE1
GROUND LOCK TYPE2
GROUND LOCK TYPE3
φ 2.8 mm (recommended)
φ 2.8 mm
φ 3.2 mm
φ 2.6 mm
φ 2.8 mm
or φ 2.6 mm
2-3 COMPATIBLE PANELS
Thickness of panels: 2.0 mm Max. (Including with the thickness of washers)
See RELATED SPECIFICATION DRAWINGS for recommended panel cut-out.
3. RELATED SPECIFICATION DRAWINGS
See the drawings described in JNPD-0813.
3.9 mm Tail: 3.0 mm Max.
2.8 mm Tail: 1.6 mm Max.
2.3 mm Tail: 1.2 mm Max.
1.6 mm
0.6 mm or 1.2 mm
0.6 mm Min.
1.6 mm Max.
4. RELATED TEST STANDARDS
MIL-STD-202
JEIDA-38-1984
JIS C 0050
JNTM-0039, JNTM-0040
*JNTM: Test Method Standard of Sumitomo 3M for Electronic and Electrical Component Parts.
6
JNPS-0813 B
5. APPLICATION
PRODUCT NUMBER INFORMATION
102 XX – 5 2 X X PX
SOLDER TAIL
2 : 3.9mm
3 : 2.8mm
4 : 2.3mm
PLATING THICKNESS SUFFIX
PL : under Nickel Plating
CONTACT AREA / Gold Plating 0.2 µm Min.
TAIL AREA / Gold Flash Plating
with Lubricant Treatment
PE : under Nickel Plating
CONTACT AREA / Gold Plating 0.5 µm Min.
TAIL AREA / Gold Flash Plating
PC : under Nickel Plating
CONTACT AREA / Gold Plating 0.76 µm Min.
TAIL AREA / Gold Flash Plating
RETENTION FEATURE
0 : Lock Stand (M2.6mm) for Panel and Screw Lock (M2.6) for PC Board
1 : Lock Stand (M2.5mm) for Panel and Screw Lock (M2.5) for PC Board
4 : Lock Stand (No.4-40) for Panel and Screw Lock (No.4-40) for PC Board
A : Lock Stand (M2.6mm) for Panel and Ground Lock Type 1 for PC Board
B : Lock Stand (M2.5mm) for Panel and Ground Lock Type 1 for PC Board
D : Lock Stand (M2.6mm) for Panel and Ground Lock Type 2 for PC Board
E : Lock Stand (No.4-40) for Panel and Ground Lock Type 1 for PC Board
F : Lock Stand (M2.6mm) for Panel and Ground Lock Type 3 for PC Board
G : Lock Stand (M2.5mm) for Panel and Ground Lock Type 3 for PC Board
H : Lock Stand (No.4-40) for Panel and Ground Lock Type 3 for PC Board
TYPE
2 : Standard Body
PIN CONFIGURATIONS
5 : Board Mount Right Angle Type
CONTACT QUANTITY
XX : XX Pos. (Exception: 100 pos. is shown "A0".)
PRODUCT SERIES NAME
102 : MDR Receptacle
7
JNPS-0813 B
6. QUALITY PERFORMANCE
6-1 RATING
ITEM RATING
CURRENT
VOLTAGE
TEMPERATURE
AC: 150V Max. / DC: 200V Max.
0.5A Max.
-55°C ~ 85°C
6-2 PHYSICAL SPECIFICATIONS * The value in ( ) is reference.
TEST
DESCRIPTION
CONTACT
RETENTION FORCE
INSERTION &
WITHDRAWAL
FORCE
CONTACT
SOLDER ABILITY
SOLDERING HEAT
RESISTANCE
REQUIREMENT TEST CONDITION
7.85N (0.8 kgf) Min. Tensile speed 5mm / min.
Insertion Force:
1.47N (150 gf) Max.
Withdrawal Force:
0.39N (40 gf) Min.
Wetting: 95% Min.
or
Zero cross time:
3 seconds Max.
Connector should not have
any defect portions after test.
Tensile speed 5mm / min with
Compatible connector.
Spec. Value is estimated by one
contact pin.
Solder: Sn-3Ag-0.5Cu
- Wetting Measurement:
245°C, 3 seconds
- Wetting Balance Method:
245°C
Dip soldering:
260°C, 10 seconds, 2 times or
263°C, 5seconds, 2 times
* Pre-heat Condition:
Temp. of Components
100°C Max.
Duration 60 seconds Max.
Soldering iron:
390°C, 3 seconds, 2 times
RELATED
STANDARD
――――
――――
JNTM-0039
JIS C 0050
JNTM-0040
8
JNPS-0813 B
6-3 ELECTRICAL SPECIFICATIONS
TEST
DESCRIPTION
DIELECTRIC
WITHSTANDING
VOLTAGE
INSULATION
RESIDENSE
DISCONTINUITY
CONTACT
RESISTANCE
REQUIREMENT TEST CONDITION
No appearance of arcing
and break down.
Leak current: 1mA Max.
500MΩ Min.
Impressed voltage is AC 500V rms.
between adjacent two contacts for one
minute.
Impressed voltage is DC 500V between
adjacent two contacts for one minute.
Less than 1µs
- Vibration test
* as the part of 3M SEQUENCE-II
- Mechanical sock test
Initial /
for each plating spec.
35mΩ Max.
Contact resistance is measured
at Short Circuit.
Current: 1.5mA
Open Circuit Voltage: 20mV
by 4 terminal method.
* Measurement values include
the resistance of contact pins
as conductive material.
Change of contact
resistance after
evaluation tests/
for each plating spec.
± 25mΩ Max.
(1) PL Plating
3M SEQUENCE -I /
mating (30 cycles) Æ moisture
Æ salt spray
3M SEQUENCE -II /
thermal shock Æ humidity
Æ vibration
3M SEQUENCE -III /
thermal life
S GAS SEQUENCE /
H
2
mating (30 cycles)Æ H
S gas
2
DURABILITY /
300 cycles
MECHANICAL SHOCK /
(2) PE Plating
and PC Plating
3M SEQUENCE -I /
mating (50 cycles) Æ moisture
Æ salt spray
3M SEQUENCE -II /
thermal shock Æ humidity
Æ vibration
3M SEQUENCE -III /
thermal life
S GAS SEQUENCE /
H
2
mating (50 cycles)Æ H
S gas
2
DURABILITY /
500 cycles
* NOTE: See Table 1.
for environmental tests.
RELATED
STANDARD
――――
――――
See Table 1.
See Table 1.
9
JNPS-0813 B
Table 1: ENVIROMENTAL TEST
ITEM
TEST CONDITION RELATED STANDARD
MOISTURE
SALT SPRAY
THERMAL SHOCK
HUMIDITY
(STEADY STATE)
THERMAL LIFE
H2S GAS
VIBRATION
MECHANICAL
SHOCK
-10 ∼ 65°C, Relative Humidity 95% / 10 cycles
NaCl 5% solution, 35°C / 48 hours
-55°C→25°C→85°C→25°C / 5 cycles
40°C, Relative Humidity 95% / 96 hours
Steady Current: Current Rating × 110%, 85°C / 1000 hours