3M 5419 User Manual
5419 Low Static Polyimide Film Tape
Product Data Sheet
Updated : March 1996
Supersedes : November 1993
Product Description
Physical Properties
Not for specification purposes
A translucent polyimide film
backed silicone adhesive
tape with unique and
extremely low electrostatic
discharge properties for
gold edge protection during
wave soldering of printed
circuit boards.
Adhesive Type
Backing
Thickness (ASTM D-3652)
Backing Thickness
Tape Colour
Shelf Life
Silicone
Polyimide
70 µm
30 µm
Gold
12 months from date of despatch by 3M when stored in the
original carton at 21°C (70°F) & 50 % Relative Humidity
Performance
Characteristics
Not for specification purposes
Adhesion to Stainless
Steel ASTM D-3330
Tensile Strength
ASTM D-3759
Elongation at Break
ASTM D-3759
Temperature Range
Maximum
Minimum
Dielectric Strength
Insulation Resistance
2.2 N/10mm
577.8 N/10mm
60 %
260 °C
-73 °C
7000 volts
6
>1*10
ohms
Date : March 1996
5419 Low Static Polyimide
Film Tape
2
Performance
Characteristics
Not for specification purposes
Additional Product
Information
Application Techniques
Static Charge
Removal from roll
Removal from PCB
5419 tape employs a
proprietary technology that
results in extremely low
electrostatic discharge at
unwind and removal from
the PCB. Conventional
polyimide tapes can
typically generate over
10,000 volts during use
which can damage board
mounted electronic
components.
Best results are attained
when applied to a clean, dry
and non dusty surface
above 0°C.
(Measured at 50% RH, 21° in an ESD Controlled
Environment.
< 150 volts
< 50 volts
5419 tape overcomes this
problem without any of the
typical drawbacks of
conventional "anti-static" or
"static-free" tapes (e.g.
variable adhesion and
opaqueness).
At room temperature the
properties of polyimide and
polyester film are similar.
However, as the
temperature increases or
decreases, to properties of
the polyimide film are less
affected than polyester.
Polyimide film does not
soften at elevated
temperatures, thus, the film
provides an excellent
release surface at elevated
temperatures.
To improve adhesion ensure
firm and even application
pressure is applied.
Applications
Mask for printed circuit
boards during wave solder
or solder dip process.
Used as release surface in
fabrication of parts cured at
elevated temperatures.
Features Advantages Benefits
Polyimide Film Dimensionally stable at high
temperatures.
Flame retardant and chemical
resistant.
Silicone Adhesive High temperature performance
reduces adhesive transfer.
Low Static Virtually eliminates circuit board
degradation due to electrostatic
discharge.
3M is a trademark of the 3M Company.
Values presented have been determined by standard test methods and are average values not to be used for specification purposes.
Our recommendations on the use of our products are based on tests believed to be reliable but we would ask that you conduct your own tests to
determine their suitability for your applications.
This is because 3M cannot accept any responsibility or liability direct or consequential for loss or damage caused as a result of our
recommendations.
Helps promote high productivity.
Protect surfaces, helping reduce
replacement.
Helps promote high productivity.
Reduces costly board waste due
to component failure.
Specialty Tapes & Adhesives
3M United Kingdom PLC
3M House,
28 Great Jackson Street,
Manchester,
M15 4PA
Customer Service :
Tel 0161 236 8500
Fax 0161 237 1105
3M Ireland
3M House, Adelphi Centre,
Upper Georges Street,
Dun Laoghaire,Co. Dublin,
Ireland
3M United Kingdom PLC 1996
Customer Service :
Tel (01) 280 3555
Fax (01) 280 3509
Loading...