ZTE MC2261 V2 Users Manual

HARDWARE DEVELOPMENT GUIDE OF

MODULE PRODUCT

Version: V2.1

Date: 2016-04-18

MC2261_V2

Website: www.ztewelink.com

E-mail: ztewelink@zte.com.cn

Hardware Development Guide of Module Product

MC2261

LEGAL INFORMATION

By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed

to have agreed to the following terms. If you don’t agree to the following terms, please stop using the document.

proprietary information. Without the prior written permission of ZTEWelink, no entity or individual is allowed to reproduce, transfer,

distribute, use and disclose this document or any image, table, data or other information contained in this document.

is the registered trademark of ZTEWelink. The name and logo of ZTEWelink are ZTEWelink’s trademark o r

registered trademark. Meanwhile, ZTEWelink is granted to use ZTE Corporation’s registered trademark. The other products or

company names mentioned in this document are the trademark or registered trademark of their respective owner. Without the prior

written permission of ZTEWelink or the third-party oblige, no one is allowed to read this document.

The product meets the design requirements of environmental protection and personal security. The storage, use or disposal of

products should abide by the product manual, relevant contract or the laws and regulations of relevant country.

ZTEWelink reserves the right to make modifications on the product described in this document without prior notice, and keeps

the right to revise or retrieve the document any time.

If you have any question about the manual, please consult the company or its distributors promptly.

Hardware Development Guide of Module Product

MC2261

Version

Date

Description

V1.0

2010-11-30

First published

V1.1

2010-12-20

Modify Table 2-1

V1.2

2011-02-22

Update image

V1.3

2011-02-25

Change Operational Temperature Range

V1.4

2011-03-07

Modify Table 2-1 and power management

V1.5

2011-03-29

Modify content of 3.1 power management and 5.2.5 antenna matching

V1.6

2011-04-25

Modify 2.1 (add note), 3.5(add new content)

V1.7

2011-06-15

Modify the email for supports.

V1.8

2011-11-25

Define pin 57 MO_RI

V1.9

2014-09-25

Update the format and template of module

Add the name of all the Figures and Tables

Update the picture of the module

Update the Figure 4-1 of NMM22-5017 connector

Update chapter 3.1 of power

Update the pins of 35&36

V2.0

2014-09-28

Update chapter 3.1 of power

Update the pins of 35

V2.1

2016-04-18

Add PID information in chapter 1.1

REVISION HISTORY

Hardware Development Guide of Module Product

MC2261

Post

9/F, Tower A, Hans Innovation Mansion,

North Ring Rd., No.9018, Hi-Tech Industrial Park,

Nanshan District, Shenzhen.

Web

www.ztewelink.com

Phone

+86-755-26902600

E-Mail

ztewelink@zte.com.cn

ABOUT THIS DOCUMENT

A. Application Range

R&D personnel using CDMA modules to make the second development

B. Reading Note

The symbols below are the reading notes you should pay attention on:

: Warning or Attention

: Note or Remark

CONTACT INFORMATION

Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips,

and press releases

Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone, website, instant

messaging, E-mail and on-site.

Hardware Development Guide of Module Product

MC2261

Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a

mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must

comply with laws and regulations restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The

operation of wireless appliances in an aircraft is forbidden to prevent interference with communication

systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device

offers a Airplane Mode which must be enabled prior to boarding an aircraft.

Switch off your wireless device when in hospitals or clinics or other health care facilities. These

requests are designed to prevent possible interference with sensitive medical equipment.

GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and

cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While

you are in this condition and need emergent help, please remember using emergency call. In order to make

or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate

cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and

transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or

other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices

such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including

fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air

contains chemicals or particles such as grain, dust or metal powders.

SAFETY INFORMATION

The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any

cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety

information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not

so, ZTEWelink does not take on any liability for customer failure to comply with these precautions.

Hardware Development Guide of Module Product

MC2261

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not

cause harmful interference, and (2) this device must accept any interference received, including interference that may cause

undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment

generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause

harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning

the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

 Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that

to which the receiver is connected.

 Consult the dealer or an experienced radio/TV technician for help.

FCC Caution:

 Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to

operate this equipment.

 This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be

installed and operated with minimum distance 20cm between the radiator & your body.

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and

users, and the maximum antenna gain allowed for use with this device is 4.8 dBi.

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible

for testing their end-product for any additional compliance requirements required with this module installed

IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with

another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In

these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and

obtaining a separate FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained

between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID:

Q78-ZTEMC2261”. The grantee's FCC ID can be used only when all FCC compliance requirements are met.

Hardware Development Guide of Module Product

MC2261

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in

the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory

information/warning as show in this manual.

Hardware Development Guide of Module Product

MC2261

CONTENTS

1. Mechanical Interface ............................................................................................................................................... 11

1.1. Physical Features ........................................................................................................................................................................ 11

1.2. Mechanical size .......................................................................................................................................................................... 11

2. Electrical Interface ................................................................................................................................................... 14

2.1. Pin Assignments ......................................................................................................................................................................... 14

2.2. Digital logic characteristics ......................................................................................................................................................... 16

3. Applications 17

3.1. Power Management ................................................................................................................................................................... 17

3.2. GPIO ................................................................................................................................................................................. 17

3.3. USB ................................................................................................................................................................................. 17

3.4. UART ................................................................................................................................................................................. 18

3.5. Powering the Module Using the MDB ........................................................................................................................................ 19

4. Antenna Interface .................................................................................................................................................... 21

4.1. Antenna Installation ................................................................................................................................................................... 21

4.2. Antenna Pad ............................................................................................................................................................................... 21

4.3. Antenna connector ..................................................................................................................................................................... 22

5. RF Interface ........................................................................................................................................................ 24

5.1. Overview ................................................................................................................................................................................. 24

5.2. Antenna Subsystem .................................................................................................................................................................... 25

5.2.1. Antenna Specifications .................................................................................................................................................... 25

5.2.2. Cable Loss ........................................................................................................................................................................ 25

5.2.3. Antenna Gain Minimum Requirements ........................................................................................................................... 25

5.2.4. Antenna Gain Maximum Requirements........................................................................................................................... 25

5.2.5. Antenna Matching ........................................................................................................................................................... 25

5.2.6. PCB Design Considerations .............................................................................................................................................. 26

5.2.7. Other Precautions ............................................................................................................................................................ 26

5.2.8. Grounding ........................................................................................................................................................................ 26

6. Test Capabilities ....................................................................................................................................................... 27

6.1. Test Description ......................................................................................................................................................................... 27

6.2. CDMA Test Equipment and Tools ............................................................................................................................................... 29

6.3. RF Performance Requirements .................................................................................................................................................. 30

6.3.1. CDMA2000 1X RF Rx Specification ................................................................................................................................... 30

6.3.2. CDMA2000 1X RF Tx Specification: .................................................................................................................................. 30

6.4. Environmental Reliability Requirement ..................................................................................................................................... 31

6.4.1. High Temperature Operation Test ................................................................................................................................... 31

6.4.2. Low Temperature Operation Test .................................................................................................................................... 31

6.4.3. High Temperature Storage Test ....................................................................................................................................... 32

Hardware Development Guide of Module Product

MC2261

6.4.4. Low Temperature Storage Test ........................................................................................................................................ 32

6.4.5. High Temperature High Humidity Operation Test ........................................................................................................... 32

6.4.6. Temperature Concussion Test ......................................................................................................................................... 32

6.5. Electro Magnetic Compatibility .................................................................................................................................................. 33

6.5.1. ESD Immunity Test ........................................................................................................................................................... 33

6.5.2. Radiated Emissions Test ................................................................................................................................................... 33

Hardware Development Guide of Module Product

MC2261

TABLES

Table 1–1 Major Technical Parameters ................................................................................................................................................ 11

Table 2–1 MC2261 Module 68-pin Electrical Interface ........................................................................................................................ 14

Table 2–2 Baseband digital I/O characteristics for VDD_PX = 1.8 V nominal ....................................................................................... 16

Table 2–3 Baseband digital I/O characteristics for VDD_PX = 2.85 V nominal ..................................................................................... 16

Table 3–1 Input Power Characteristics ................................................................................................................................................. 17

Table 4–1 Return Loss in the Active Band ............................................................................................................................................. 21

Table 4–2 Product specifications of NMM22-5017 connector ............................................................................................................. 22

Table 4–3 Product specifications of SSMB-50TKE-10 connector .......................................................................................................... 23

Table 5–1 The requirement of dual band antenna ............................................................................................................................... 25

Table 6–1 CDMA2000 1X RF Rx Specification ....................................................................................................................................... 30

Table 6–2 CDMA2000 1X RF Tx Specification ....................................................................................................................................... 30

Table 6–3 High Temperature Operation Test ....................................................................................................................................... 31

Table 6–4 Low Temperature Operation Test ........................................................................................................................................ 31

Table 6–5 High Temperature Storage Test ........................................................................................................................................... 32

Table 6–6 Low Temperature Storage Test ............................................................................................................................................ 32

Table 6–7 High Temperature High Humidity Operation Test ............................................................................................................... 32

Table 6–8 Temperature Concussion Test ............................................................................................................................................. 32

Table 6–9 ESD Immunity Test ............................................................................................................................................................... 33

Table 6–10 Radiated Emissions Test ..................................................................................................................................................... 33

Hardware Development Guide of Module Product

MC2261

FIGURES

Figure 1–1 MC2261 TOP SIDE ............................................................................................................................................................... 12

Figure 1–2: MC2261 BOTTOM SIDE ......................................................................................................................................................... 12

Figure 1–3 MC2261 Module Illustration ............................................................................................................................................... 13

Figure 3–1 Powered by VBAT and VPH_PWR pin ................................................................................................................................. 17

Figure 3–2 USB Typical Circuit .............................................................................................................................................................. 18

Figure 3–3 Wire serial level conversion circuit ..................................................................................................................................... 18

Figure 3–4 wire serial level conversion circuit ...................................................................................................................................... 18

Figure 3–5 wire serial level conversion circuit .................................................................................................................................... 19

Figure 3–6 Module Development Board Illustration ............................................................................................................................ 19

Figure 3–7 First method to connect the module to RF test equipment ............................................................................................... 20

Figure 3–8 Second method to connect the module to RF test equipment ........................................................................................... 20

Figure 4–1 Specification of NMM22-5017 connector ........................................................................................................................... 22

Figure 4–2 Specification of SSMB-50TKE-10 ......................................................................................................................................... 23

Figure 5–1 CDMA Connector ................................................................................................................................................................ 24

Figure 5–2 CDMA Connector on daughter board ................................................................................................................................. 24

Figure 5–3 Antenna Matching Circuit ................................................................................................................................................... 26

Figure 6–1 CDMA Connector ................................................................................................................................................................ 27

Figure 6–2 Module Development Board Illustration ............................................................................................................................ 27

Figure 6–3 First method to connect the module to RF test equipment ............................................................................................... 28

Figure 6–4 Second method to connect the module to RF test equipment ........................................................................................... 28

Figure 6–5 First method to connect the module to RF antenna ........................................................................................................... 29

Figure 6–6 Second method to connect the module to RF antenna ...................................................................................................... 29

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