EGF10A THRU EGF10M
SURFACE MOUNT GLASS PASSIVATED JUNCTION HIGH EFFICIENT RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere
PATENTED
PATENTED
PATENTED
0.115(2.92)
0.090(2.28)
0.102(2.60)
0.079(2.00)
*Dimensions in inches and (millimeters)
DO-214AC
0.181(4.60)
0.157(4.00)
0.050(1.27)
0.030(0.76)
0.220(5.60)
0.190(4.83)
0.064(1.63)
0.050(1.27)
0.016(0.40)
0.006(0.15)
TM
FEATURES
*GPRC (Glass Passivated Rectifier Chip) inside
*Glass passivated cavity-free junction
*Ideal for surface mount automotive applications
*Superfast recovery time for high efficiency
*Built-in strain relief
*Easy pick and place
*High temperature soldering guaranteed: 260oC/10 seconds,
at terminals
*Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
MECHANICAL DATA
Case : JEDEC DO-214AC molded plastic over passivated chip
Terminals : Solder plated , solderable per MIL-STD-750,
Method 2026
Polarity : Color band denotes cathode end
Mounting Position : Any
Weight : 0.002 ounes , 0.064 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature
unless otherwise specified.
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at TA=75oC
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0 A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time (NOTE 1)
Typical junction capacitance (NOTE 2)
Typical thermal resistance (NOTE 3)
Operating junction and storage temperature range
NOTES :(1)Reverse recovery test condition : IF 0.5A, IR=1.0A, Irr=0.25A
(2)Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3)Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas.
TA=25oC
TA=125oC
TA=150oC
SYMBOLS
VRRM
VRMS
VDC
I (AV)
IFSM
VF
IR
trr
CJ
R JA
R JL
TJ,TSTG
A B D F G J M
50 100 200 300 400 600 1000
35 70 140 210 280 420 700
50 100 200 300 400 600 1000
30 25
1.0 1.25 1.7
5
30
50
50 75
-65 to +175 -55 to +150
EGF10
800
560
800
1.0
50
15
75
25
K
5
-
UNITS
Volts
Volts
Volts
Amps
Amps
Volts
uA
nS
pF
o
C / W
o
C
REV. : 0
Zowie Technology Corporation
RATINGS AND CHARACTERISTIC CURVES EGF10A THRU EGF10M
FIG.1 - FORWARD CURRENT DERATING CURVE
FIG.2 - MAXIMUM NON-REPETITIVE
PEAK FORWARD SURGE CURRENT
1.0
0.5
EGF10J~EGF10M
RESISTIVE OR
INDUCTIVE LOAD
EGF10A~EGF10G
CURRENT, AMPERES
AVERAGE FORWARD RECTIFIED
0
0 25 50 75 100 125 150 175
AMBIENT TEMPERATURE, oC
FIG.3 - TYPICAL INSTANTANEOUS
30
25
TJ=TJ max.
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
20
15
EGF10A~EGF10G
10
EGF10J~EGF10M
AMPERES
5
PEAK FORWARD SURGE CURRENT,
0
1 10 100
NUMBER OF CYCLES AT 60Hz
FIG.4 - TYPICAL REVERSE CHARACTERISTICS
FORWARD CHARACTERISTICS
10.00
1.00
PULSE WIDTH=300uS
1% DUTY CYCLE
100
10
AMPERES
0.10
1
CURRENT, MICROAMPERES
IINSTANTANEOUS FORWARD CURRENT,
0.01
EGF10J~EGF10M
EGF10G
EGF10A~EGF10F
0.40.2 0.6 0.8 1.0 1.2 1.4 1.81.6
INSTANTANEOUS REVERSE LEAKAGE
0.1
0 20
40 60 80 100 110
PERCENT OF RATED PEAK REVERSE VOLTAGE,%
TJ=125oC
TJ=150oC
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
FIG.5 - TYPICAL JUNCTION CAPACITANCE FIG.6 - TYPICAL TRANSIENT THERMAL IMPEDANCE
200
100
TJ = 25oC
100
C/W)
o
60
40
10
20
10
6
4
JUNCTION CAPACITANCE, pF
1
2
1
.1
.2 .4 1.0 2 4 10 20 40 100
REVERSE VOLTAGE, VOLTS
0.1
TRANSIENT THERMAL IMPEDANCE(
100101.00.100.01
t , PULSE DURATION, sec
REV. : 0
Zowie Technology Corporation