SPECIFICATION
IEEE 802.11 b/g/n 2.4GHz 1T1R WiFi with Bluetooth2.1
/3.0/4.0,with SDIO INTERFACE, and HS-UART MIXED INTERFACE
RL-SM02BD (Realtek RTL8723BS)
Combo Module
Version 1.0
http://www.rf-link.net
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PRODUCT DESCRIPTION
SM02BD is a small size and low profile of WiFi+BT combo module with LGA (Land-Grid
Array) footprint, board size is 12mm*12mm with module height of 2mm. It can be easily
manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile
device and consumer products. It provides GSPI/SDIO interface for WiFi to connect
with host processor and high speed UART interface for BT. It also has a PCM interface
for audio data transmissio n with direct link to external audio codec via BT controller.
The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO
technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.
SM02BD uses Realtek RTL8723BS, a highly integrated WiFi/BT single MODULE based on
advanced COMS process. RTL8723BS integrates whole WiFi/BT function blocks into
a chip, such as SDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except
fewer passive components remained on
PCB.
PRODUCT FEATURES
Operate at ISM frequency bands (2.4GHz)
GSPI/SDIO for WiFi and UART for Bluetooth
IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE
802.11e, IEEE 802.11h, IEEE 802.11i
Fully Qualified for Bluetooth 2.1 + EDR specification including both 2Mbps and
3Mbps modulation mode
Fully qualified for Bluetooth 3.0
Fully qualified for Bluetooth 4.0 Dual mode
Full –speed Bluetooth operation with Piconet and Scatternet support.
Enterprise level security which can apply WPA/WPA2 certification for WiFi.
WiFi 1 transmitter and 1 receiver allow data rates supporting up to
150 Mbps downstream and 150 Mbps upstream PHY rates
For WiFi/BT, it uses fixed path for WiFi and BT, which means one antenna assigned
for WiFi and the other is assigned for BT.
Support Bluetooth adaptive power management mechanism
Full-featured software utility for easy configuration and management
RoHS compliance
Low Halogen compliance
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Diagram
Temperature Limit Ratings
Parameter Minimum Maximum Units
Storage Temperature
Ambient Operating Temperature
Junction Temperature
-55 +125
0 70
0 125
℃
℃
℃
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PRODUCT SPECIFICATIONS
Main chipset :WiFi/BT Single Chip: Realtek RTL8723BS
Functional Specifications
WiFi:
EEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE
Standards
802.11e, IEEE 802.11h, IEEE 802.11i
BT: V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0
Bus Interface
Data Rate
Media Access Control
Modulation Techniques
Network Architecture
Operating Channel
WiFi: GSPI/SDIO BT: UART
802.11b: 11, 5.5, 2, 1 Mbps
802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps
802.11n:
MCS 0 to 7 for HT20MHz
MCS 0 to 7 for HT40MHz
BT:
1 Mbps for Basic Rate
2,3 Mbps for Enhanced Data Rate
6,9,12,18,24,36,48,54 Mbps for High Speed
WiFi: CSMA/CA with ACK
BT: AFH, Time Division
802.11b: CCK, DQPSK, DBPSK
802.11g: 64 QAM, 16 QAM, QPSK, BPSK
802.11n: 64 QAM, 16 QAM, QPSK, BPSK
BT: 8DPSK, π/4 DQPSK, GFSK
WiFi:
Ad-hoc mode (Peer-to-Peer )
Infrastructure mode
Software AP
WiFi Direct
BT:
Pico Net
Scatter Net
WiFi 2.4GHz:
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11: (Ch. 1-11) – United States
13: (Ch. 1-13) – Europe
14: (Ch. 1-14) – Japan
BT 2.4GHz:
Ch. 0 ~78
Frequency Range 2.400GHz ~ 2.4835 GHz
802.11g@6Mbps
15dBm
802.11g@54Mbps
14dBm
802.11g@54Mbps
-71dBm
Transmit Output Power – 1x1
(Tolerance:±1.5dBm)
Receiver Sensitivity
Security
Operating Voltage
802.11b@11Mbps
16dBm
BT:
Max +10dBm
802.11b@11Mbps
-82dBm
BT:
-89dBm@1Mbps, -90dBm@2Mbps, -83dBm@3Mbps
WiFi :
WPA, WPA-PSK, WPA2, WPA2-PSK, WEP 64bit & 128bit, IEEE
802.11x, IEEE 802.11i
BT:
Simple Paring
3.3 V ±9% I/O supply voltage
802.11n
13dBm (MCS 0_HT20)
13dBm (MCS 7_HT20)
12dBm (MCS 0_HT40)
12dBm (MCS 7_HT40)
802.11n
-67dBm (MCS 7_HT20)
-64dBm (MCS 7_HT40)
OS supported
Power Consumption (3.3V)
(Typical)
Linux/Android
WiFi only
TX Mode: (Conituous mode)
85mA (MCS7/BW40/13dBm)
RX Mode: (Conituous mode)
75mA (MCS7/BW40/-60dBm)
Associated Idle with DT IM=1
2.1mA
Unassociated Idle:
0.1mA
RF disable Mode:
0.1mA
BT :
Inquiry & Page Scan:
0.9 mA
ACL no traffic:
7.5mA
SCO HV3:
15mA
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Mechanical
Dimensions (mm)
Length Width Height
12
(Tolerance:±0.2mm)
12
(Tolerance:±0.2mm)
1.6
(Tolerance:±0.2mm)
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MODULE PIN ASSIGNMENT
PIN Function Description
1 GND Grond
2 WIFI/BT_ANT WIFI/BT_ANT
3 NC NC
4 NC NC
5 NC NC
6 BT_WAKE HOST wake-up Bluetooth device
7 BT_HOST_WAKE Bluetooth device to wake-up HOST
8 NC NC
9 VABT 3.3V±0.1V(Main power voltage source input)
10 NC NC
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11 NC NC
Shared with GPIO9 This Pin Can Externally Shutdown the RTL8723BS
12 WL_DSI#
WLAN function when BT_DISn is Pulled Low. When this pin deasserted,
SDIO interface will be disabled. This pin can also support the WLAN Ra
dio-off function with host interface remaining connected.
13 WL_HOST_WAKE WLAN to wake-up HOST
14 SD_D2 SDIO data line 2
15 SD_D3 SDIO data line 3
16 SD_CMD SDIO command line
17 SD_CLK SDIO CLK line
18 SD_D0 SDIO data line 0
19 SD_D1 SDIO data line 1
20 GND Grond
21 NC NC
22 VDD_IO 3.3V±0.1V
23 NC NC
24 SUSCLK_IN
Shared with GPIO6. External 32K or RTC clock input with 1.8V ~ 3.3V
swing. This clock source is configured by BT and WL FW, respectively.
25 PCM_DOUT PCM Data output
26 PCM_CLK PCM Clock
27 PCM_DIN PCM data input
28 PCM_SYNC PCM sync signal
29 NC NC
30 26MHz_IN
Reference clock input 26MHz Active Crystals
(or if pin10/11 input ,pin30 NC )
31 GND Grond
32 NC NC
33 GND Grond
34 BT_DIS# General Purpose Input/Output Pin
35 NC NC
36 GND Grond
37 NC NC
38 NC NC
39 NC NC
40 NC NC
41 GND Grond
42 UART_OUT HOST Data output
43 UART_IN HOST Data input
44 UART_CTS HOST_CTS
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WIFI\BT RF Circuit reference pictures
注:1.以上虚线框的部分需要进行天线匹配，以实际天线匹配的电子元器件参数为准.
2.以上为 RF 走线要做 50 欧姆阻抗，走线不能走 90 度，走线长度不能超过 15mm.
Note: The RF part layout must do 50 Ωimpedance.，can't get the line go 90°，can't get the line longer than 15
mm.
SDIO interface Circuit reference pictures
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Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times
ENVIRONMENTAL
Operating
Operating Temperature: 0°C to +70 °C
Relative Humidity: 5-90% (non-condensing)
Storage
Temperature: -40°C to +80°C (non-operating)
Relevant Humidity: 5-95% (non-condensing)
MTBF caculation
Over 150,000hours
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Wireless module before the SMT note:
Wifi
模块贴片装机前注意事项：
1.When customers Open stencil must be sure the hole bigger to the
Wireless module plate, please press 1 to 1 and 0.7 mm is widened
to open outward, the thickness of 0.12 mm.
2.Can't get the wifi module bare hands when needs,must we wear
the gloves and static ring.
3.The furnace temperature according to the size of the customer the
mainboard ,generally like to stick on a tablet standard temperature
of 250 + - 5,can do 260 + - 5.
Storage and use Wifi module control should pay attention to
the following matters:
1.Module of the storage life of vacuum packaging：
1-1.Storage life： 12 months. Storage conditions:<40 . Relative ℃
humidity:<90%R.H.
1-2.After this bag is opened , devices that will be subjected to
infrared reflow, vapor-phase reflow, or equivalent processing must
be :
1-3.Check the humidity card :stored at
20%RH.If :≦ 30%~40%(pink)or greater than 40%(red).Labeling
module has moisture absorption.
① Mounthed within 168 hours at factory conditions of:
t 30%≦℃， 60%R.H.≦
② Once opened, the workshop the preservation of life for
168 hours.
1-4.If baking is required,devices may be baked for:
① Modules must be to remove module moisture problem.
② Baking temperature: 125 , 8 hours.℃
③ After baking, put proper amount of desiccant to seal
packages.
1-5.Module vacuum packing 2000 PCS per disc.
2.Module reel packaging items as follows.
2-1.Storage life： 12 months. Storage conditions:<40 . Relative ℃
humidity:<90%R.H.
2-2.Module apart packing after 168 hours，To launch patch need to
bake, to remove the module hygroscopic, baking temperature
conditions：125℃，8hours.
2-3.Reel packing 2000 PCS or 1000 PCS per disc.
3.Module pallet packaging items as follows：
3-1.Storage life ： 3 months. Storage conditions:<40 . Relative ℃
humidity:<90%R.H.
3-2.Module if not used within 48 hours, before launch the need for
baking, baking temperature: 125 , 8℃ hours.
3-3.Pallet packaging each plate is 100 PCS to 1000 PCS or 2000
PCS shipment.
1.客户在开钢网时一定要将 wifi 模块焊盘的孔开大，请按 1 比 1 再向
外扩大 0.7mm 比例开钢网，厚度按 0.12mm.
2.有需要拿 wifi 模块时不可以光手去拿，一定要戴上手套以及静电环.
3.过炉温度要根据客户主板的大小而定，一般像平板电脑上的标准温
度为250+-5°，也可以做到260+-5°
Wifi
模块储存及使用管制应注意事项如下：
1.模块的真空包装之储存期限：
1-1.保存期限：12个月，储存环境条件：温度在：<40℃，相对湿度：
<90%R.H.
1-2.模块包装被拆后，SMT 组装之时限：
1-3.检查湿度卡：显示值应小于30%（蓝色），如 ：30%~40%(粉红色）
或者大于40%（红色）表示模块已吸湿气.
① 工厂环境温度湿度管制： 30%≦℃， 60%R.H≦ 。
② 拆封后，车间的保存寿命为 168 小时.
1-4.如在拆封后的 168 个小时内未使用完，需要烘烤，烘烤条件如下：
① 模块须重新烘烤，以除去模块吸湿问题.
② 烘烤温度条件：125℃，8 小时.
③ 烘烤后，放入适量的干燥剂再密封包装.
1-5.模块真空包装每盘 2000pcs，真空包装图片<1>
2.模块卷盘包装事项如下：
2-1.保存期限：12个月，储存环境条件：温度在：<40℃，相对湿度：
<90%R.H.
2-2.模块拆开包装168小时后，如要上线贴片需要重新烘烤，以除去模
块吸湿问题，烘烤温度条件：125℃，8小时。
2-3.卷盘包装标准为每盘 2000pcs，也可以 1000pcs.
3.模块托盘包装事项如下：
3-1.保存期限：3个月，储存环境条件：温度在：<40℃，相对湿度：
<90%R.H.
3-2.模块如在 48 小时内未使用，在上线之前需要进行烘烤，烘烤温度
条件：125℃，8 小时。
3-3.托盘包装每盘为 100pcs，以 1000pcs 或 2000pcs 出货.
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