ZHEJIANG REXENSE TECHNOLOGY RY12M02 User Manual
802.15.4/ ZigBee Module Datasheet
REX3SP
ZHEJIANG REXENSE TECHNOLOGY CO., LTD.
COPYRIGHT INFO
The information contained in this document is the proprietary information of Zhejiang
Rexense Technology Co., Ltd. (hereinafter referred as Rexense). The contents are
confidential and any disclosure to persons other than the officers, employees, agents or
subcontractors of the owner or licensee of this document, without the prior written consent
of Rexense, is strictly prohibited.
Further, no portion of this document may be reproduced, stored in a retrieval system, or
transmitted in any form or by any means, electronic or mechanical, including photocopying
and recording, without the prior written consent of Rexense, the copyright holder.
Rexense publishes this document without making any warranty as to the content contained
herein. Further Rexense reserves the right to make modifications, additions and deletions
to this document due to typographical errors, inaccurate information, or improvements to
products mentioned in the document at any time and without notice. Such changes will,
nevertheless be incorporated into new editions of this document
VERSION HISTORY
V1.0.0 2011/06/04 1st issue of preliminary document
V1.0.1 2012/08/30 Add the section of
Agency Certifications
www.rexense.com
1
Table of Contents
1. Introduction................................................................................................................................3
1.1 Summary...........................................................................................................................3
1.2 Applications.......................................................................................................................3
1.3 Key Features.....................................................................................................................3
1.4 Benefits.............................................................................................................................4
1.5 Abbreviations and Acronyms..........................................................................................4
1.6 Related Documents..........................................................................................................5
2. Product Overview.......................................................................................................................6
2.1 Overview...........................................................................................................................6
3. Specifications..............................................................................................................................8
3.1 Electrical Characteristics.................................................................................................8
3.1.1 Absolute Maximum Ratings.................................................................................8
3.1.2 Test Conditions......................................................................................................8
3.1.3 RF Characteristics.................................................................................................9
3.1.4 Microcontroller Characteristics............................................................................9
3.1.5 Module Interfaces characteristics.......................................................................9
3.2 Physical/Environmental Characteristics and Outline.................................................
3.3 Pin Configuration...........................................................................................................10
3.4 Power Mode Configuration...........................................................................................21
3.5 Antenna Specifications..................................................................................................24
3.5.1 PCB Antenna........................................................................................................24
3.5.2 Steel Antenna......................................................................................................25
3.5.3 U.FL Jack to SMA Antenna................................................................................26
3.6. Module Circuit Reference Design................................................................................28
3.6.1 SMD Module Reference Design (Single Voltage)............................................28
3.6.2 SMD Module Reference Design (Dual-Voltage)..............................................28
3.7 Module Test Instructions...............................................................................................29
3.8 Test Result of RF Performance.....................................................................................32
4. Agency Certifications............................................................................................................34
5. Contact Us.............................................................................................................................35
10
www.rexense.com
2
1. Introduction
1.1 Summary
REX3SP is an ultra-compact, low-power, high-sensitivity 2.4 GHz IEEE 802.15.4/ZigBee
module based on the innovative Rexense’s hardware platform. It is designed for wireless
sensing, control and data acquisition applications. Rexense 802.15.4/ ZigBee modules
eliminate the need for costly and time-consuming RF development, and shorten time to
market for a wide range of wireless applications.
®
1.2 Applications
Rexense 802.15.4/ ZigBee module is compatible with robust IEEE 802.15.4/ZigBee stack
that supports a self-healing, self-organizing mesh network, while optimizing network traffic
and minimizing power consumption. Rexense offers two stack configurations: Custom and
Transparent. Custom software can be provided to support reliable, scalable, and secure
wireless applications running on Rexense 802.15.4/ ZigBee modules. Transparent software
allows programming of the module via serial AT-command interface.
The applications include, but are not limited to:
Building automation & monitoring
z Lighting controls
z Wireless smoke and CO detectors
z Structural integrity monitoring
HVAC monitoring & control
Inventory management
Environmental monitoring
Security
Water metering
Industrial monitoring
z Machinery condition and performance monitoring
z Monitoring of plant system parameters such as temperature, pressure, flow, tank
level, humidity, vibration, etc.
Automated meter reading (AMR)
1.3 Key Features
Ultra compact size (31.60*20.70*3.90mm for REX3SP module)
High RX sensitivity (-104 dBm)
Outperforming link budget (123dB)
www.rexense.com
3
Wide Communication Distance: 2000m (Line of Sight)
Up to 20dBm output power
Very low power consumption:
z 0.4 µA in Sleep mode,
z 36 mA in RX mode,
z 170mA@20dBm in TX mode
Ample memory resources
z STM32W: 128K bytes Flash; 8K bytes RAM
z EM351/EM357: 128K/192K bytes Flash; 12K bytes RAM
Wide range of interfaces (both analog and digital):
z 24 spare GPIO, 4 spare IRQ lines
z 6 ADC lines
z UART with CTS/RTS control
z USART
z TWI
z SPI
z Capability to write own MAC address into the Flash
z Optional antenna reference designs
z IEEE 802.15.4 compliant transceiver
z 2.4 GHz ISM band
z Custom embedded software, including serial bootloader and AT command set
1.4 Benefits
Small physical footprint and low profile for optimum fit in even the smallest of devices
Best-in-class RF link range
Extended battery life
Easy prototyping with 4-layer PCB
Ample memory for user software application
Mesh networking capability
Easy-to-use low cost Evaluation Kit
Single source of support for HW and SW
Worldwide license-free operation
1.5 Abbreviations and Acronyms
ADC Analog-to -Digital Converter
API Application Programming Interface
DC Direct Current
DTR Data Terminal Ready
DIP Duap In-line package
EEPROM Electrically Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
www.rexense.com
4
GPIO General Purpose Input/Output
HAL Hardware Abstraction Layer
HVAC Heating, Ventilating and Air Conditioning
HW Hardware
TWI Inter-Integrated Circuit
IEEE Institute of Electrical and Electrionics Engineers
IRQ Interrupt Request
ISM Industrial, Scientific and Medical radio band
JTAG Digital interface for debugging of embedded device, also known as IEEE
1149.1 standard interface
MAC Medium Access Control layer
MCU Microcontroller Unit. In this document it also means the processor, which is
the core of ZigBee module
NWK Network layer
OEM Original Equipment Manufacturer
OTA Over-The-Air upgrade
PCB Printed Circuit Board
PER Package Error Ratio
PHY Physical layer
RAM Random Access Memory
RF Radio Frequency
RTS/CTS Request to Send/ Clear to Send
RX Receiver
SMA Surface Mount Assembly
SPI Serial Peripheral Interface
SW Software
TX Transmitter
UART Universal Asynchronous Receiver/Transmitter
USART Universal Synchronous/Asynchronous Receiver/Transmitter
USB Universal Serial Bus
ZDK ZigBee Development Kit
ZigBeePRO Wireless networking standards targeted at low-power applications
802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless PAN
1.6 Related Documents
[1] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless
Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate
Wireless Personal Area Networks (LR-WPANs)
[2] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
5
www.rexense.com
2. Product Overview
2.1 Overview
REX3SP is a low-power, high-sensitivity IEEE 802.15.4/ ZigBee-compliant module. This
multi-functional state-of-art occupies ultra-small space, which is comparable to a typical
size of a single chip. Based on a solid combination of Rexense’s latest MCU Wireless
hardware platform, Rexense 802.15.4/ ZigBee module offers superior radio performance,
ultra-low power consumption, and exceptional ease of integration.
Figure 2-1.
Block Diagram
XTAL (Crystal Frequency 24MHz)
Power
Management
2.4GHz
Radio
ZigBee Chip
O-QPSK
Modem
IEEE802.15.4
MAC
Accelerator
128-bit AES
Encryption
Accelerator
Front-End
Module
Control
Data
SRAM
8kB
ARM CORTEX-M3
Matching
Network
Program
Flash
128kB
SPI
2-wire
serial
Timers
UART
12-bit ADC
Antenna
REX3SP Rexense 802.15.4/ ZigBee module complies with the FCC (Part 15), IC and ETSI
(CE) rules applicable to the devices radiating in uncontrolled environment.
REX3SP Rexense 802.15.4/ ZigBee module fully satisfies the requirements of the “Directive
2002/95/EC of the European Parliament and the Council of 27January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronic
6
www.rexense.com
equipment” (RoHS).
To jumpstart evaluation and development, Rexense also offers a complete set of evaluation
and development tools. The ZigBee Development Kit comes with everything you need to
develop and test your own applications.
www.rexense.com
7
3. Specifications
3.1 Electrical Characteristics
3.1.1 Absolute Maximum Ratings
Table 3-1 Absolute Maximum Ratings
Parameters Min Max
Voltage on any pin, except RESET with respect to Ground -0.3V VDD_PADS 0.3
DC Current per I/O Pins
Total current into VDD/VDDA power lines (source)
RF Input Power
40 mA
150 mA
+15 dBm
Note:
Absolute Maximum Ratings are the values beyond which damage to the module may occur.
Under no circumstances must the absolute maximum ratings given in this table be violated.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent
damage to the module.
This is a stress rating only. Functional operation of the module at these or other conditions,
beyond those indicated in the operational sections of this specification, is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
3.1.2 Test Conditions
Table 3-2 Test conditions (unless otherwise stated), VCC = 3.3V, Tamb = 25°C
Parameters Range Unit
Supply Voltage, VCC 3.0 to 3.6 V
Current Consumption: RX mode 36 mA
Current Consumption: TX mode 170 mA
Current Consumption: Radio is turned off, MCU is active 50% of the
time
Current Consumption: Power-down mode 0.4 μA
9.0 mA
www.rexense.com
8
3.1.3 RF Characteristics
Table 3-3 RF Characteristics
Parameters Condition Range Unit
Frequency Band 2400 to
2483.5
Numbers of Channels 16
Channel Number 0B~1A Hex
Channel Spacing 5 MHz
Module Transmitter Output Power -32 to +20 dBm
Receiver Sensitivity PER=1% -104 dBm
TX Output/ RX Input Nominal Impedance For unbalanced output 50 Ω
MHz
3.1.4 Microcontroller Characteristics
Table 3-4. Microcontroller Characteristics
Parameters Condition Range Unit
On-chip Flash Memory size 128/192K bytes
On-chip RAM size 8/12K bytes
Operation Frequency 24 MHz
3.1.5 Module Interfaces characteristics
Table 3-5. Module Interfaces characteristics
Parameters Condition Range Unit
UART Maximum Baud Rate 230400 bps
ADC Resolution/ Conversion Time In single conversion
mode
ADC Input Resistance >1 MΩ
ADC Reference Voltage (VREF) 1.2 V
ADC Input Voltage 0 - VREF V
I2C Maximum Clock 400 kHz
GPIO Output Voltage (High/Low) -8/ 4 mA 2.8/ 0.9 V
Real Time Oscillator Frequency 32.768 kHz
12/4096 Bits/µs
www.rexense.com
9
3.2 Physical/Environmental Characteristics and Outline
Table 3-6. Physical/Environmental Characteristics
Parameters Value Comments
Size 31.60*20.70*3.90mm
Weight 3.0g
Operating Temperature Range -40°C to +85°C
Operating Relative Humidity Range no more than 80%
Note: 1. Minor degration of clock stability may occur.
3.3 Pin Configuration
Figure 3-1． REX3SP Outline drawings
Figure 3-2. Recommended Footprint
www.rexense.com
The edge of the Mother Board
10
Loading...