
LSD4BT-K53x
Product Characteristics
·Working Frequency Band
- Working frequency band: 2402-2480MHz
·Ultra-low Power Consumption
- Support 2.7V-3.6V power supply
- Emission current: ≤20mA (10dBm power
configuration)
- Receiving current: ≤7.5mA (overall current)
- Sleep current: 400nA (SRAM not saving)
·High-link Budget
- Sensitivity-96dBm±1dBm (1Mbps, PER<30.8%)
- Emission power: Max.12dBm
·Memory Resources
- Internal 512kB Flash (the capacity that
the client can actually use is less than
512kB)
- 48kB on-chip SRAM, wherein 32kB can
sleep and save
·Compatibility
- Designed interface mode with side
plug-in and stamp holes compatible
·Mesh Functions
- Support BLE
- Support the Bluetooth SIG Mesh
- Support the exclusive Mesh of Telink
·Communication Interface
- 2 PWM / 4 GPIO / 1 UART ( Pin
multiplexing)
Applicable Scenes
- Smart phone and tablet peripherals;
- Bluetooth remote control;
- Sports and health tracking, health care;
- Wearables;
- Smart light control, smart home, smart
city;
- Logistics transportation tracking;
- Consumer electronics;
- Building automation
- Industrial control
K53BLEmesh Standard Module (PCB Antenna)
K53 series of low-power Bluetooth module is a high-performance Bluetooth module which is
developed based on the Telink low-power Bluetooth SOC TLSR8250 chip. The module adopts the
stamp-type and side plug-in interfaces, is exquisite and compact, is fully lead out via ports and convenient
to use, and helps the users omit the complicated RF hardware design, development and production links.
Therefore, the users can easily realize the development of Bluetooth application programs on that basis,
shorten the R&D cycle, and seize the market opportunities. This model is a pure hardware module that
excludes any software. If you need the edition with software, please notify in advance.
1 / 15

Thanks for choosing Lierda products. Please read through this Manual before using the
products. By using the products, you have understood and accept the terms and
instructions in this Manual.
Lierda Science & Technology Co., LTD reserves all legal rights to revise and explain the
terms and information provided, without prior notices.
Zhejiang Lierda IoT Technology Co., Ltd provides this document to support the product
design of users. Users should design their products according to the specifications and
parameters provided in the document.Lierda shall not bear any liability for personal injury
or property loss caused by improper operation of users. Lierda has the right to update the
document without notice.
The copyright of this document belongs to Lierda . Any person who reproduces and copy
this document without permission of our company will bear legal responsibility.
Copyright © Lierda Science & Technology Group Co.,Ltd reserves all rights.
Revision History
2 / 15

ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES
The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107
and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations.
Integration into devices that are directly or indirectly connected to AC lines must add with Class II
Permissive Change.
The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when
installed, then an additional permanent label must be applied on the outside of the finished product which
states: “Contains transmitter module FCC ID: 2AOFDLSD4BT-K5X ”. Additionally, the following
statement should be included on the label and in the final product’s user manual: “This device complies
with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may
not cause harmful interferences, and(2)this device must accept any interference received, including
interference that may cause undesired operation.”
The module is limited to installation in mobile or fixed applications. Separate approval is required for all
other operating configurations, including portable configuration with respect to Part 2.1093 and different
antenna configurations.
A module or modules can only be used without additional authorizations if they have been tested and
granted under the same intended end‐use operational conditions, including simultaneous transmission
operations. When they have not been tested and granted in this manner, additional testing and/or FCC
application filing may be required. The most straightforward approach to address additional testing
conditions is to have the grantee responsible for the certification of at least one of the modules submit a
permissive change application. When having a module grantee file a permissive change is not practical or
feasible, the following guidance provides some additional options for host manufacturers. Integrations
using modules where additional testing and/or FCC application filing(s) may be required are: (A) a module
used in devices requiring additional RF exposure compliance information (e.g., MPE evaluation or SAR
testing); (B) limited and/or split modules not meeting all of the module requirements; and (C) simultaneous
transmissions for independent collocated transmitters not previously granted together.
This Module is full modular approval, it is limited to OEM installation ONLY.
Integration into devices that are directly or indirectly connected to AC lines must add with Class II
Permissive Change.
(OEM) Integrator has to assure compliance of the entire end product incluld the integrated Module.
Additional measurements (15B) and/or equipment authorizations (e.g Verification) may need to be
addressed depending on co-location or simultaneous transmission issues if applicable.
(OEM) Integrator is reminded to assure that these installation instructions will not be made available to the
end user of the final host device.
3 / 15

CONTENTS
1 Specifications & Parameters
2 Dimensional Drawing and Pin Definitions
2.1 Dimensional Drawing
2.2 Pin Definitions
3 Basic Operations
3.1 Pins
....................................................................................................................................
..............................................................................................................................................
3.2 Notices to Hardware Layout
3.3 Antenna Clearance
4 Common Problems
..............................................................................................................................
..................................................................................................................
...........................................................................................
.................................................................................................................
............................................................................................................................
.......................................................................................................
......................................................................................................................
4.1 Communication Failure of Module in Near Distance
4.2 Abnormal Power Consumption of Module
..............................................................................
4.3 Insufficient Communication Distance of Module
4.4 Module Authentication
5 Production Guide
.................................................................................................................................
5.1 Production Guide
.............................................................................................................
......................................................................................................................
5.2 Requirements on Module Position on Bottom Plate
5.3 Opening Design of Steel Mesh
.................................................................................................
5.4 Standard Operation Procedure (SOP) of Reflow Soldering
6 Packaging
6.1 Packaging material
6.2 Package size
6.3 Packaging direction
............................................................................................................................................
....................................................................................................................
..............................................................................................................................
...................................................................................................................
..............................................................
....................................................................
................................................................
.....................................................
5
5
6
7
8
8
8
8
10
10
10
10
10
12
12
12
12
13
14
14
14
15
4 / 15

1 Specifications & Parameters
Initial frequency tolerance
(KHz)
Support customized frequency setting
Output power 10dBm,system timer 16MHz
Output power 0dBm,system timer 16MHz
Transmit power can be configured
through software
Meet the dimensional tolerance class C
All AVDD and DVDD with
same voltages
Max voltage of input pins
Table 1-1 Limit Parameters of Module
Table 1-2 Working Parameters1of Module
2 Dimensional Drawing and Pin Definitions
The physical diagram of LSD4BT-K53ASTD001 is as shown in Fig. 2-1. There will be a label on the
shield cover, and it shall be subject to the physical product.
1
The test is conducted at 25℃ in a shielded room environment.
5 / 15