Zhejiang Lierda Internet of Things technology LSD4BT E66A User Manual

Lierda Science &

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Product

Product Name:

Name:

Name: E66

LSD4BT-E66

LSD4BT-E66 Series

User

User Manual

Lierda Science & Technology Group

E66

Standard

E66

Standard

E66 Standard

Standard Module

Manual

Module

Module (PCB

Series

(PCB

(PCB Antenna)

Antenna)

Product

Product Model:

File

File Version:

Model:

Model: LSD4BT-E66

Version:

Version: Rev0

LSD4BT-E66

Rev0

Rev0 4

4

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Serial

Revision Log Revised by

No.

1 Initial version

Update the communication distance of the

module, and add the power consumption

2

data under different connection and

broadcast intervals

Correct the working parameters of the

module, the transmittance state and the

basic frequency of CPU, distinguish the

3

different TRX current of the module in the

ACTIVE mode and in the SLEEP mode,

Revision

Revision History

History

Wang

Hongyang

Wang

Hongyang

Lierda Science & Technology Group

Wang

Hongyang

Reviewed

by

Sun

Xiangtao

Sun

Xiangtao

Sun

Xiangtao

File

Version

Rev01

Rev02

Rev03

Revision

Date

May 31,

2018

October

11, 2018

December

11, 2018

and add the power consumption data under

more time intervals

4 Add Module Authentication information

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Wang

Hongyang

18

Sun

Xiangtao

March

Rev0 4

1,2019

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Contents

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Chapter

Chapter 1

1

Overview

1

Overview

1 Overview

Overview ...................................................................................................................................... 4

1.1 Functional Characteristics of Module ............................................................................................... 4

1.2 Application Occasions ...................................................................................................................... 4

Chapter

Chapter 2

Chapter

Chapter 3

2

Specification

2

Specification

2 Specification

Specification &

3

Hardware

3

Hardware

3 Hardware

Hardware Layout

Layout

Layout and

&

Parameters

&

Parameters

& Parameters

Parameters ....................................................................................................... 4

and

Interface

and

Interface

and Interface

Interface Description

Description

Description ........................................................................... 7

3.1 Dimensions ....................................................................................................................................... 7

3.2 Interface Description ......................................................................................................................... 8

3.3 Module Authentication ....................................................................................................................10

Chapter

Chapter 4

4

Application

4

Application

4 Application

Application Instructions

Instructions

Instructions ........................................................................................................... 1 1

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4.1 Notices to Typical Application ........................................................................................................ 1 1

Chapter

Chapter 5

5

Production

5

Production

5 Production

Production Guidance

Guidance

Guidance ................................................................................................................ 1 3

5.1 Production Guide ............................................................................................................................ 1 3

5.2 Requirements on Positions of Module on Backplane ..................................................................... 1 4

5.3 Opening Design of Steel Mesh ....................................................................................................... 1 4

5.4 Standard Operation Procedure (SOP) for Reflow ........................................................................... 1 5

Chapter

Chapter 6

6

Product

6

Product

6 Product

Product Package

Package

Package ....................................................................................................................... 1 6

6.1 Packaging Method .......................................................................................................................... 1 6

6.2 Strip Size ......................................................................................................................................... 1 6

6.3 Product Direction ............................................................................................................................ 1 6

Reminder

Reminder ..................................................................................................................................................... 1 7

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Chapter

Chapter 1

1

Overview

1

Overview

1 Overview

Overview

E66 series of Bluetooth module is a low-energy and high-performance Bluetooth module which is

researched and developed based on the low-energy and high-performance Bluetooth SOC chip. The

module adopts the stamp hole-type interface, and is pre-reserved with two optional interfaces: PCB

antenna and external antenna; the module is in small size, is led out by full port, is convenient to use, and

can help you reduce the investment in software and hardware, and easily realize the development of

Bluetooth application.

Table 1-1 Model Description

Model Description

PCB antenna. This model does not include software. For the product

LSD4BT-E66

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with software, please communicate with the salesman over the specific

model, MPQ and other information

1.1

Functional

1.1

Functional

1.1

1.1 Functional

Functional Characteristics

Characteristics

Characteristics of

of

Module

of

Module

of Module

Module

� Working voltage: 1.6~3.6V

Designed frequency: 2402MHz~2480MHz

�

Transmittance power: Max 7dBm

�

Ultra-high receiving sensitivity: -93 ± 1dBm

�

Ultra-far effective communication distance: 30m@0dBm

�

1.2

Application

1.2

Application

1.2

1.2 Application

Application Occasions

�

Chapter

Chapter 2

Main

Main Parameters

Smartphone and tablet peripherals

Wireless wearable Bluetooth equipment

Intelligent light control, smart home, smart city

2

Specification

2

Specification

2 Specification

Specification &

Parameters

Parameters Performance

Occasions

&

Parameters

&

Parameters

& Parameters

Parameters

Table 2-1 Limit Parameters of the Product

Performance

Performance Remarks

Remarks

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Minimum

Minimum Value

Value

Value Maximum

Maximum

Maximum Value

Power supply voltage (V) 1.6 3.6

Working temperature ( ℃ ) -40 +85

ESD (KV) 3 / All PINS, HBM MADE

Table 2-2 Working Parameters of the Module @ 25 ℃

Performance

Main

Parameters

Main

Parameters

Main

Main Parameters

Parameters

Minimum

Value

Typical

Value

Maximum

Value

Working voltage (V) 1.6 3.3 3.6

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Working temperature

-40 / +85 Normal communication

( ℃ )

Value

Remarks

The ripple of the power supply

requires the peak value to be

within 30mV

Working frequency

2402 / 2480 ISM frequency band

band (MHz)

Number of channels / 40 /

Transmittance state

(mA)

/ 10.5 /

ACTIVE

Power

Consumption

Transmittance state

(mA)

/ 6.58 /

SLEEP

Receiving state (mA)

/ 10.3 /

ACTIVE

Standard number of channels

under BLE Agreement

2402MHz, 0dBm@16M The

whole CPU works

2402MHz, 0dBm@16M Only

the RF part of the CPU works

2402MHz@16M The whole

CPU works

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Receiving state (mA)

2402MHz@16M Only the RF

/ 6.09 /

SLEEP

part of the CPU works

SLEEP ( μ A) / 2 /

Transmittance power (dBm) -15 / 7 Software configurable

PER<30.8%

Receiving sensitivity (dBm) / -93 /

(BER<0.1%)

Communication protocol BLE4.0/4.2

Interface Type 1.27mm of spacing, 3-sided stamp hole

Chip

Communication distance

1

30m@0dBm

configuration@0dBm

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1. “ Communication distance ” is affected by the measuring environment, air humidity and other

factors around. The distance is measured via the communication between the mobile phone and the module,

and is only for reference.

Table 2-3 Power Consumption of the Module under Different Broadcast Intervals

Mode

Mode Average

Average

Average Power

0dBm

Broadcast

mode

Power

Power Consumption

Consumption

Consumption (

(

μ

A)

(

μ

A)

( μ

μ A)

A) Broadcast

122.3 100

60.8 200

29.4 500

22.2 700

19.6 1000

12.1 2000

8.1 3000

6.7 5000

5.3 7000

4.4 10000

Broadcast

Broadcast Interval

Interval

Interval (ms)

(ms)

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Table 2-4 Power Consumption of the Module under Different Connection Intervals

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Mode

Mode Average

Average

Average Power

Power

Power Consumption

Consumption

Consumption (

(

μ

A)

(

μ

A)

( μ

μ A)

A) Connection

Connection

Connection Interval

Interval

Interval (ms)

(ms)

61.1 100

31.1 200

16.3 500

0dBm

14.7 700

Connection

12.1 1000

mode

8.9 2000

7.2 3000

6.6 4000

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Note: The power consumption data tested in the connection mode is tested via the non-data communication

between the mobile phone and the module.

Chapter

Chapter 3

3

Hardware

3

Hardware

3 Hardware

Hardware Layout

3.1

Dimensions

3.1

Dimensions

3.1

3.1 Dimensions

Dimensions

Layout

Layout and

and

Interface

and

Interface

and Interface

Interface Description

Description

The physical view of LSD4BT-E66 is as shown in the following Fig. 3-1:

Fig. 3-1 Physical View of LSD4BT-E66 Series of Module

When this product is designed, the tantalum capacitors and PCBs have optional material models. On

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the premise that the performance requirements are met, the appearance color may be different, and the

actual product shall prevail. The main materials (main chips, crystal oscillators, etc.) do not have any

substitutional models. Any change will be notified in advance.

The dimensions of the module LSD4BT-E66 are as shown in the following Fig. 3-2:

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Fig. 3-2 Dimension Diagram of LSD4BT-E66 Series of Module

The dimensional tolerance which is not marked in the figure is subject to the standard GB/T1804-m.

3.2

Interface

3.2

Interface

3.2

3.2 Interface

Interface Description

The following figure shows the serial number of the pins of the module and describes the

corresponding pins:

Description

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Table 3-1 Functional Description of Pins of LSD4BT-E66 Series of Module

Module

Chip Pin Name Function Remarks

1 / NC

2 41 GND

3 23 P3/PADC GPIO

4 24 P4/PADC GPIO

5 25 P5/PADC GPIO

6 26 P6/PADC GPIO

7 27 P9 GPIO

8 28 P10 GPIO

Not connected

Grounded

9 29 P11 GPIO

10 18 VBAT

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Power supply

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11 41 GND

12 32 RSTN

13 6 SWCLK

14 7 SWD

Grounded

Reset

Programmed

15 34 P15 GPIO

16 35 P16 GPIO

17 36 P17 GPIO

18 37 P18 GPIO

19 38 P19 GPIO

20 39 P20 GPIO

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21 1 P24 GPIO

22 2 P25 GPIO

23 3 P26 GPIO

24 4 P27 GPIO

25 5 P28 GPIO

26 41 GND

27 10 ANT

Grounded

External

antenna

3.3

Module

3.3

Module

3.3

3.3 Module

Module Authentication

Authentication

This module has been certified by SRRC (China) and FCC (United States). CMIIT ID number is

xxxxxxxx, and FCC ID number is 2AOFDLSD4BT-E66A .

Three display modes of CMIIT ID and FCC ID are provided. The first shield laser scheme is

defaulted.

1.Shield shield laser: display module product serial number, CMIIT ID, FCC ID, RoHS logo, lierda

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registered trademark, CE certification logo, etc., with shield as the specific criterion;

2.Back label: display module product serial number, CMIIT ID, FCC ID, module P/N, lierda

registered trademark, etc, specific to the manufactured product;

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Fig. 3- 3 Back label

3.Display by the terminal device ： The SRRC ID, FCC ID, etc, can be referenced by the terminal

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device according to relevant standards.

Chapter

Chapter 4

4

Application

4

Application

4 Application

Application Instructions

4.1

Notices

4.1

Notices

4.1

4.1 Notices

Notices to

to

Typical

to

Typical

to Typical

Typical Application

Instructions

Application

1. Power Supply

It is suggested supplying power to the module with the DC regulated power supply. The ripple

coefficient of the power supply shall be smaller as possible, and the module shall be grounded reliably.

Please pay attention to the correct connection of the positive and negative poles of the power supply,

because reverse connection may lead to the permanent damage of the module;

2. Antenna Selection

2.1 PCB Antenna

The module is an on-board PCB antenna. During the layout of the board, please make sure the area

right below the antenna is completely clear, as shown in the following figure. The red part is the user’s

backplane area or the copper-clad area, the grey part is the clear area of the antenna of the user’s backplane,

and the boundary point of the clear area is the upper edge of the shielding cover. Make sure there is no any

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metal in 360 degrees around the antenna; otherwise, the radiation efficiency of the antenna will be affected,

and the communication distance will be greatly affected.

Fig. 4-1 Description of Clear Area of Antenna

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2.2 External Antenna

The module is connected with the external antenna through the stamp hole. It is suggested

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pre-reserving π matched network on the backplane. The external interface can be SMA or IPEX. As shown

in the following figure 4-2, for the RF wiring of the highlight part, it needs to lay the 50ohm impedance

line; the relationship between the width of the 50ohm impedance line, wiring and the copper-clad spacing,

board thickness is as shown in Figure 4-3.

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50ohm impedance control

IPEX block or SMA

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Fig. 4-2 Recommended Circuit of External Antenna

Recommended values of FR4 dual panel

(H=Board thickness, W=Line width, D=Spacing between wiring and copper-clad):

connector

H=1.0mm, W=0.8mm, D=0.2mm

H=1.0mm, W=1.0mm, D=0.254mm (Recommended)

H=1.2mm, W=1.0mm, D=0.2mm (Recommended)

H=1.6mm, W=1.0mm, D=0.2mm (Recommended)

Fig. 4-3 Recommended Wiring of 50ohm Impedance Line

3. Electrostatic Notices

The user shall pay attention to the electrostatic requirements (as shown in Table 2-1) of the product

when in design, and add the electrostatic prevention measures when designing the end products.

Chapter

Chapter 5

5

Production

5

Production

5 Production

Production Guidance

5.1

Production

5.1

Production

5.1

5.1 Production

Production Guide

Guidance

Guide

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It is suggested the stamp hole packaging module mounted by an SMT machine, and the mounting

shall be finished within 24 hours after unpacking. Otherwise, its need to repackage by vacuumizing, so as

to prevent poor mounting effect due to damp.

If the package includes a humidity indicator card, it is suggested judging if the module needs to be

baked according to the indication of the humidity indicator card. The baking conditions are as follows:

Baking temperature: 125 ℃ ± 5 ℃ ;

The alarm temperature is set to be 130 ℃ ;

SMT mounting can be carried out after the temperature cools down to be <36 ℃ under natural

conditions;

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If the product is unpacked for over 3 months, please pay special attention if the product is affected

with damp, because the PCB gold immersion process may lead to the oxidation of the land after more than

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3 months, and may lead to such problems as false welding and missing welding during the mounting

process.

In order to ensure the pass rate of reflow, it is suggested picking 10% of products for visual inspection

and AOI detection in the first time of mounting, so as to ensure the reasonableness of the furnace

temperature, device absorption method and placement method;

Operators at all stations must wear the anti-electrostatic gloves during the whole production process;

5.2

Requirements

5.2

Requirements

5.2

5.2 Requirements

Requirements on

on

Positions

on

Positions

on Positions

Positions of

of

Module

of

Module

of Module

Module on

on

Backplane

on

Backplane

on Backplane

Backplane

It is suggested the green oil thickness at the module position of the backplane be less than 0.02mm, so

as to prevent the phenomenon that the green oil is too thick, the module is blocked up and cannot be

effectively contacted with solder paste, and the welding quality is affected.

In addition, please do not place other devices within 2mm around the module position on the interface

board, so as to ensure the convenience for repairing the module.

5.3

Opening

5.3

Opening

5.3

5.3 Opening

Opening Design

Design

Design of

of

Steel

of

Steel

of Steel

Steel Mesh

Mesh

The thickness of the steel mesh on the backplane shall be selected by comprehensively considering

the packaging type of the devices in the board, and special attention shall be paid to the following

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requirements:

The land position of the module can be locally thickened to 0.15~0.20mm, so as to prevent void

solder;

5.4

5.4 Standard

Note: This SOP is only applicable to lead-free operation, and only for reference.

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Standard

Standard Operation

Code

Operation

Operation Procedure

Procedure

Procedure (SOP)

(SOP)

(SOP) for

for

Reflow

for

Reflow

for Reflow

Reflow

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Approved

by

Reflow

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Gener

Revie

ated

wed

by

Life

Gener

ation

Date

Operation

Items

Curve

Chart

Tempe

rature

Zone

Param

eters

Curve

Param

eters

Specificat

ion

Peak temperature

Material No.

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Soaking

temperature

位号

Used

Amount

Tool/Equipment

Thermometer

Thermometric plate

High temperature-resistant

gloves

Tin fusion

temperature

Slope of increase

Used

Amount

No Date

Slope of reflow

Revision Contents

Slope of cooling

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Chapter

Chapter 6

6

Product

6

Product

6 Product

Product Package

6.1

Packaging

6.1

Packaging

6.1

6.1 Packaging

Packaging Method

Package

Method

■ Tape □ Foam □ Electrostatic bag

6.2

Strip

6.2

6.2 Strip

Size

Strip

Size

Strip Size

Size

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Technical

Requirement 1

Reference Size

Technical Requirements:

1. The accumulative error of every 10 driving holes shall be within ± 0.2;

2. The side bend within 250MM must be no more than 1;

3. Material of carrier tape: Black PS, thickness: 0.30 ± 0.05;

4. The surface impedance is from 106to 1011ohm;

6.3

Product

6.3

Product

6.3

6.3 Product

Product Direction

5. Each roll is packed by a 21m 13 elements

6. A0 and B0 shall be measured at 0.3mm upwards at the bottommost of the inner side of the die cavity, and K0 refers to the inner depth. The unmarked R angle is 0.3

7. The product meets the standard EIA-481;

8. The product is required to meet “ ROHS ” ;

Direction

’’

plastic tray, and can contain 1000 Pcs

Client No.: LSD4BT-E66ASTD001

Ver sion

Revision Contents

The placement direction of the tape packaging module is as shown in the following figure:

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Protecting tape

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Carrier tape rubber wheel

Reminder

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Product information label

Carrier tape

Oval hole

Cover tape

Round hole

Discharge direction

Welcome to use the products of Lierda Science & Technology Group Co., Ltd.. Prior to the use of our

Depression

products, please first read this reminder; if you have started to use the Instructions, you will be considered

as having read and accepted the reminder.

Lierda Science & Technology Group Co., Ltd. reserves the final interpretation and revision rights

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over all attached materials, and any modification of them will not be further notified.

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FCC Statement：

This device complies with part 15 of the FCC rules Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must accept

any interference received, including interference that may cause undesired operation.

NOTE: The manufacturer is not responsible for any radio or TV interference caused by

unauthorized modifications to this equipment. Such modifications could void the user’s authority

to operate the equipment.

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable

protection against harmful interference in a residential installation. This equipment generates

uses and can radiate radio frequency energy and, if not installed and used in accordance with the

instructions, may cause harmful interference to radio communications. However, there is no

guarantee that interference will not occur in a particular installation. If this equipment does cause

harmful interference to radio or television reception, which can be determined by turning the

equipment off and on, the user is encouraged to try to correct the interference by one or more of

the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

-Consult the dealer or an experienced radio/TV technician for help

- This device and its antenna(s) must not be co-located or operating in conjunction with any other

antenna or transmitter.

RF Exposure Information and Statement :

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled

environment. This equipment should be installed and operated with minimum distance of 20 cm

between the radiator and your body. This transmitter must not be co-located or operating in

conjunction with any other antenna or transmitter

Instructions to the OEM/Integrator:

This module has been granted modular approval for mobile applications. OEM integrators for

host products may use the module in their final products without additional FCC certification if

they meet the following conditions. Otherwise, Additional FCC approvals must be obtained.

 The OEM must comply with the FCC labeling requirements. If the module’s label is not

visible when installed, then an additional permanent label must be applied on the outside of

the finished product which states: ”Contains transmitter module FCC

ID:2AOFDLSD4BT-E66A,Additionally, the following statement should be included on the label

and in the final product’s user manual:

“This device complies with Part 15 of the FCC Rules. Operation is subject to the following

two conditions: (1) This device may not cause harmful interferences, and (2) this device

must accept any interference received, including interference that may cause undesired

operation.”

 The user’s manual for the host product must clearly indicate the operating requirements and

conditions that must be observed to ensure compliance with current FCC RF exposure

guidelines.

 The final host / module combination may also need to be evaluated against the FCC Part 15B

criteria for unintentional radiators in order to be properly authorized for operation as a Part

15 digital device.

 This Module is full modular approval, it is limited to OEM installation ONLY.

 The module is limited to installation in mobile application.

 A separate approval is required for all other operating configurations, including portable

configurations with respect to Part 2.1093 and difference antenna configurations.

 The OEM integrator is responsible for ensuring that the end-user has no manual instruction

to remove or install module.

 The Grantee will provide guidance to the Host Manufacturer for compliance with the Part

15B requirements if requested.

Zhejiang Lierda Internet of Things technology LSD4BT E66A User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual