ZXTD09N50DE6E6
SuperSOT
DUAL 50V NPN SILICON LOW SATURATION SWITCHING TRANSISTOR
SUMMARY
V
=50V; R
CEO
DESCRIPTION
A dual NPN low saturation transistor combination contained in a single 6 lead
SOT23 package. Each transistor is the equivalent to the ZUMT619 device.
= 160m ;IC= 1A
SAT
FEATURES
Low Equivalent On Resistance
•
Low Saturation Voltage
•
I
=1A Continuous Collector Current
•
C
SOT23-6 package
•
APPLICATIONS
• LCD Backlighting inverter circuits
• Boost functions in DC-DC converters
•
ORDERING INFORMATION
DEVICE REEL SIZE
ZXTD09N50DE6TA
ZXTD09N50DE6TC
DEVICE MARKING
D619
(inches)
7 8mm embossed 3000 units
13 8mm embossed 10000 units
TAPE WIDTH
(mm)
B1
QUANTITY
PER REEL
C1
E1
SOT23-6
B2
C1
E1
C2
Top View
C2
E2
B1
E2
B2
ISSUE 2 - JUNE 2001
1
ZXTD09N50DE6
ABSOLUTE MAXIMUM RATINGS.
PARAMETER SYMBOL LIMIT UNIT
Collector-Base Voltage V
Collector-Emitter Voltage V
Emitter-Base Voltage V
Peak Pulse Current I
Continuous Collector Current I
Base Current I
Power Dissipation at TA=25°C (a)(d)
Linear Derating Factor
Power Dissipation at TA=25°C (a)(e)
Linear Derating Factor
Power Dissipation at TA=25°C (b)(d)
Linear Derating Factor
Operating and Storage Temperature Range T
CBO
CEO
EBO
CM
C
B
P
D
P
D
P
D
j:Tstg
50 V
50 V
5V
2A
1.0 A
200 mA
0.90
7.2
mW/°C
1.1
8.8
mW/°C
1.7
13.6
mW/°C
-55 to +150 °C
W
W
W
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT
Junction to Ambient (a)(d) R
Junction to Ambient (b)(d) R
Junction to Ambient (a)(e) R
θJA
θJA
θJA
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,
in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t⭐5 secs.
(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal
Impedance graph.
(d) For device with one active die.
(e) For device with two active die running at equal power.
2
139 °C/W
73 °C/W
113 °C/W
ISSUE 2 - JUNE 2001
ZXTD09N50DE6E6
ELECTRICAL CHARACTERISTICS (at T
= 25°C unless otherwise stated).
amb
PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS.
Collector-Base
Breakdown Voltage
Collector-Emitter
Breakdown Voltage
Emitter-Base Breakdown
Voltage
Collector Cut-Off Current I
Emitter Cut-Off Current I
Collector Emitter Cut-Off
Current
Collector-Emitter
Saturation Voltage
Base-Emitter
Saturation Voltage
Base-Emitter Turn-On
Voltage
Static Forward Current
Transfer
Ratio
Transition
Frequency
Output Capacitance C
Turn-On Time t
Turn-Off Time t
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
CBO
EBO
I
CES
V
CE(sat)
V
BE(sat)
V
BE(on)
h
FE
f
T
obo
(on)
(off)
50 V
I
= 100µA
C
50 V IC= 10mA*
5V
I
= 100µA
E
10 nA VCB= 40V
10 nA VEB=4V
24
60
120
160
10 nA V
35
80
200
270
mV
mV
mV
mV
= 40V
CES
= 100mA, IB= 10mA*
I
C
= 250mA, IB= 10mA*
I
C
= 500mA, IB= 10mA*
I
C
= 1A, IB= 50mA*
I
C
940 1100 mV IC= 1A, IB= 50mA*
850 1100 mV IC= 1A, VCE=2V*
200
300
200
75
20
420
450
350
130
60
=10mA, VCE=2V*
I
C
= 100mA, VCE=2 V*
I
C
= 500mA, VCE=2V*
I
C
= 1A, VCE=2V*
I
C
= 1.5A, VCE=2 V*
I
C
215 MHz IC= 50mA, VCE=10V
f= 100MHz
10 pF VCB= 10V, f=1MHz
150 ns VCC=10V,IC=1A
=100mA
I
425 ns
B1=IB2
*Measured under pulsed conditions. Pulse width=300µs. Duty cycle ≤ 2%
ISSUE 2 - JUNE 2001
3