Zenith Data Systems MT2000 User Manual

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Server MT2000
User’s Guide
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Copyright © 1997 Zenith Data Systems Division, Packard Bell NEC, Inc. Copyright © 1997 NEC Computer S ys tems Divis ion , P ac k a rd Bell NE C, In c .
Trademarks
Adaptec is a registered trademar k of Adaptec Corporation DigiBoard is a trademark of DigiBoard Corporation INTEL is a registered trademar k of I nt el Corpor at ion Mylex is a registered trademark of M y lex Corporat ion MS-DOS is a registered trademar k of M icr osof t Corpor ation Pentium is a registered tradem ar k of I ntel Corporation PS/2 is a trademark of Int er nat ional Business Machines Corporation Other product and company names are registered trademar ks and trademarks of their respect ive holders.
Printed in the United States of America.
PN: 101843-01 6/97
REGULATORY INFORMATION
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC Rules. Th ese lim its are designed to provide reasonable protection agai nst harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy. If not installed and used according to this manual, th e equipm ent may cause harmful interference wi t h radio and televi sion communications. However, there is no guarantee that interference will not occur in any particular installation.
Note: To meet Class B emission limits, the user must observe the followin g requirem ents:
Use only shielded I/O cables to co nnect this digital dev ice with any per ipheral (such as a
printer, modem, monit or, et c.). The user is cautioned that changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate the equipment.
If this equi pment does cause interference with radio or television reception, which you can determi ne by turning the equipment off and on, tr y to correct the int erference by using one or more of the fol lowing measures :
Move the digital device away from the affected receiver.
Reposition (turn) the digital device with respect to the affected receiver.
Reorient the affected receiver's antenna.
Plug the digital device into a different AC outlet so the digital device and the receiver are on
different branch circuits. Disconnect and remov e any I/O cables that t he digital devic e does no t use. (Unter minated I/O
cables are a pot ential source of high RF emission le vels.) Plug the digital devic e into only a gr ounded out let rece ptacle. Do not use AC adapte r plugs.
(Removing or cutting the line cord ground may increase RF emission levels and may also present a lethal shock hazard to the user.)
If you need add itional help, consult yo ur dealer, manufactur er, or an e xperienc ed radio or
television te chnician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may no t cause harmful interf erence , and
(2) This device must accept any interference received, including interference that may cause
undesired operation.
Canadian Regulatory Information - This Class B digital apparatus m eets a ll requirements of the Canadian Interference-Causing Equipment Regulation.
Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada.
VDE Manufacturer's Declaration - Hiermit wird bescheinigt, daß dieses Gerät in Übereinstimmung mit den Bestimmungen der BMPT-AmtsblVfg 243/1991 funk-entstört ist. Der vorschriftsmäßige Betrieb mancher Geräte (z. B. Meßsender) kann allerdings gewissen Einschränkungen unterliegen. Beachten Sie deshalb die Hinweise in der Bedienungsanleitung.
Dem Bundesamt für Zulassungen in der Telekommunikation wurde das Inverkehrbringen dieses Gerätes angezeigt und die Berechtigung zur Überprüfung der Serie auf die Einhaltung der Bestimmungen eingeräumt.
This product complies to EN55022 Class B. To ensure continued compliance, only options that are EN55022 Class B can be added.
Safety Notices
Caution: To reduce the risk of electric shock which could cause personal injury, follow all safety notices. The symbols shown are used in your documentation and on your equipment to indicate safety hazards.
Warning: Lithium batteries can be dangerous. Improper handling of lithium batteries may result in an explosion. Dispose of lithium batteries as required by local ordinance or as normal waste if no local ordinance exists.
Warning: T he detachable power supply cords are inten ded to serve as disconnect devices.
Warning: This equipment uses 3-wire, grounded power cords. To prevent electrical hazards, do not remove or defeat the ground prong on the power cords. Replace a power cord if it gets damaged. Contact your dealer for an exact replacement.
In the U.S.A. and Canada, the power cord must be a UL-listed detachable power cord (in Canada, CSA-certified), type ST or SJT, 16 AWG, 3-conduc t or, provide d wit h a m ol ded-on NEMA type 5-15 P plug cap at one end and a molded-on cord connector body at the other end. The cord length must not exceed 9 feet (2.7 meters).
Outside the U.S.A. and Canada, the plug must be rated for 250 VAC, 10 amp minimum, and must display an international agency approval marking. The cord must be suitable for use in the end-user country. Consult your dealer or the local electrical authorities if you are unsure of the type of power cord to use in your country. The voltage change occurs via a switch in the power supply.
Warning: Under no circumstances should the user attempt to disassemble the power supply. The power supply has no user-replaceable parts. Inside the power supply are hazardous voltages that can cause serious personal in jury. A defective power supply must be returned to your dealer.
Safety Notices for Users Outside of the U.S.A. and Canada
PELV (Protected Extra-Low Voltage) Integrity: To ensure the extra-low voltage integrity of the equipment, connect only equipment with mains-protected electrically-compatible circuits to the external ports.
Remote Earths: To prevent electrical shock, connect all local (individual office) computers and computer support equipment to the same electrical circuit of the building wiring. If you are unsure, check the building wiring to avoid remote earth conditions.
Earth Bonding: For safe operation, only connect the equipment to a building supply that is in accordance with current wiring regulations in your country. In the U.K., those regulations are the IEE.
G
Care and Handli ng
Use the following g uidelines to properly h andle and care for your system.
Protect the system from extremely low or high temperatures. Let the system warm (or cool) to room temperature before using it.
Keep the sy stem away fr om magnetic f orces.
Keep the system dry. Do not wash the system with a wet cloth or pour fluid into it.
Protect the system from being bumped or dropped.
ON
Check the system for condensation. If condensation exists, allow it to evaporate before powering on the system.
Keep the system away from dust, sand, and dirt.
raham

Bill GrahamContents

Chapter 1 Introduction
Chapter 2 Features
Chapter 3 Setup
Chapter 4 Configuring Your System
Chapter 5 Upgrades and Options
Chapter 6 Problem Solving
Appendix A Cabling
Appendix B Memory Configurat ions
Appendix C Option Boards
Appendix D Devices
Appendix E Network Operating Systems
Glossary
Equipment Log
Bill Graham
Chapter 1

Introduction

Contents
Organization ........................................................................ 1
Notational Conventions ......................................................... 3
Bill Graham
Organization
1-1
This guide tells you how to configure and upgrade your server. Its g oal is to familiarize you with your serv er and the tasks n ecessary f or system co nfiguratio n and upgrading.
Chapter 1
Introduc tion Introduces you to the purpose and structure of this guide.
Chapter 2
Features Gives you an over view of the server and describes majo r system co mponents.
Chapter 3
Setup  Tells you how to select a site, unpack the system, get familiar with the sy stem, make cable connections, and power on the system.
Chapter 4
Configuring Your System Tells you how to configure the system and provides instructions for running the System Configur ation Utility (SCU), the BIO S Setup Utility and the SCSISelect Utility. This chapter also tells you how to configure function select switches and system board ju mpers in or der to set specif ic operatin g parameters.
Chapter 5
Upgrades and Options Provides you w ith instructions for upgrading your system with optional processor, memory, options cards, and peripheral devices.
Chapter 6
Problem Solving Con tains helpful inf ormation for solving p roblems that migh t occur with you r system.
Introduction
1-2
Appendix A
System Cabling Inc ludes cabling in formation fo r the two onboard SCSI controllers and the RAID controller.
Appendix B
Memory Configurations  Defines the allowable memory configurations for your system.
Appendix C
Option Board s Reserves a section of your user’s guide to stor e add-in adapter board installation procedures.
Appendix D
Devices Reserves a section of your user’s guide to store add-on device installation procedures.
Appendix E
Network Operating Systems Re serves a sectio n of your user’s guide to store your Network Operating System Configuration Guide.
Glossary  Defin es the standar d acrony ms and technical terms used in this manual.
Equipment Log  Provides you with a sample equipment log for documenting the system config uration and updates.
Introduction
Notational Conventions
The notation al conven tions listed below ar e used throughout this manual.
F1 A letter, nu mber, symbol, or word in CAPs represen ts a
key on your keyboard. For example, the instruction press F1 means press the key labeled F1 on your keyboard.
ENTER The ENTER key is interchan geably used as RET URN
and CARRIAGE RETURN. CTRL + ALT Two or th ree key n ames, separated by plus sign (s),
indicate multiple-key en tries. For example, CTRL + ALT + DEL means hold down the CTRL and ALT keys and press the DEL key.
1-3
The special notices listed below are used throughout this manual to emph asize specific in formation:
Warning : Warning in dicates a hazard th at can cause serious personal injury or death if the hazard is not avoided.
Caution: Caution indic ates a hazard that mig ht cause personal injury.
Notice: Notice indic ates the potential to d amage equipment or data is present if the user do es not take the nece ssary prec autions rec ommended by the Notice.
Note: Notes are use d to identify or amplify a point to the reader . A Note may be use d to emphasize a recommended sequence of steps.
Introduction
Chapter 2

Features

Contents
Overview............................................................................. 1
Expanding the Server as Needs Grow ................................ 2
Configuration Constraints ................................................. 3
System Feature Summary ................................................ 3
Chassis Front F eatures and Controls...................................... 6
Status LED Indicator Descriptions..................................... 8
Resetting the System....................................................... 9
Chassis Rear Featur es and Controls...................................... 10
Power Supply Stat us Lamp Descriptions ........................... 12
System Board Features........................................................ 13
Processor ...................................................................... 17
Memory ......................................................................... 17
Bus Master I/O Expansion Slots ....................................... 17
Real-Time Clock/Calendar ............................................... 18
BIOS .............................................................................18
Video............................................................................18
SCSI Controllers ............................................................19
Peripheral Controller ....................................................... 19
External Device Connect ors .............................................20
Keyboard and Mouse ...................................................... 20
Peripheral Devices ......................................................... 20
SCSI-2 Hard Drive Bays.................................................. 20
SCSI Drive Hot-swap Backplane ...................................... 22
Removable Media Drive Bays...........................................23
Power System .....................................................................24
Number of Power Supplies in a Configuration....................24
Server Security...................................................................24
Mechanical Locks and Monitoring.....................................25
Software Locks via the BIOS Setup..................................26
Hot Swap Power ..................................................................27
Hot Swap FAN ....................................................................28
Bill Graham
Overview
2-1
The MT
Server is a modular, multiprocessing server
2000
based on the I ntel Pentium® Pro chip set. The chip set incorp orates a modular scaleable arch itecture th at integrate s a 64-bit bus interfac e with a pr imary and secondary Peripheral Component Interconnect (PCI) bus and an Ex tended Indu stry Standar d Architec ture (EISA) bus. Th e architec ture supp orts Symmetric al Multiprocessing (SMP) and a variety of operating systems. Th e chassis and sy stem board hav e been designed to meet the needs of the server marketplace.
The combin ation of compu ting perfor mance, memo ry capacity, and integr ated I/O prov ides a high performan ce envir onment for many application s includin g networ k server s and multi-use r systems.
This server system is designed for use in applications where downtime must be minimized. To this end, the server includes or has the option to include the following:
Optional power system redundancy; in a system
configured with two power supplies, the system will continue to operate with a single power supply failure.
Self-con tained power supply un its that can be easily
installed or r emoved fr om the back of th e chassis. SCSI drive bays accessible from the front of the
chassis. Hot-swap SCSI disk drive back plane; a failed d rive
can be remo ved and a new drive installed without system power being turn ed off, if an optional Redundant Array of Independent Disks (RAID) controller modu le is installed.
High degree of SCSI disk fault tolerance and
advanced disk array man agement fe atures thro ugh the use of RAID (Redundant Array of Independent Disks) technology, if an optional Redundant Array of Independent Disks (RAID) controller module is installed.
Features
2-2
Hardware monitors (temp erature an d voltage) an d
software mon itors to indic ate failures. Easy access to all parts for ser vice.
Expanding the Server as Needs Grow
The typic al minimum system co nfiguratio n could include the following:
Board set with system board an d proce ssor/memor y
board with o ne Pentiu m 32 MB memory .
Diskette dr ive
One SCSI hard drive
CD-ROM drive
Network add- in boards
One 330 Watt pow er supply
Pro microprocessor and
Features
SCSI drive bac kplane
Five ch assis hot swap fan mo dules (six fan s)
Onboard 1 M B video memor y.
As server/client needs grow, you can expand system processor capacity, memory, drives, an d the number of power supplies.
Processo r/memory board has a pr ocessor u pgrade
socket for an additional pr ocessor. The board may contain up to two processors.
System board h as two vide o memory u pgrade
sockets (512 K B each) for an additional 1 M B of video memor y.
Memory supports 8 EDO DIMM devices for a
minimum memory size of 32 MB; total is 1 G B.
System board h as three EISA slo ts, four P CI slots,
and one shared PCI\EISA slot for add-in boards. The system bo ard also has onbo ard extern al I/O (serial, parallel, video) in terfaces.
Chassis can ho ld 11 drives: 6 h ot-swap bays f or
3 1/2-inch ultra wide SCSI-2 hard drives; three 5 1/4-inch half-heig ht bays for r emovable media drives with a CD-ROM re ader already installed in one bay; and two 3 1/2-in ch half-h eight bays w ith a diskette driv e already installed in one bay.
Chassis suppor ts up to two pow er supplies. The
second power supply can be added to provide redundant power.
Configuration Constraints
Power supplies are hot-swappable and are easily removed an d installed.
2-3
The second optional power supply provides redu ndant power so th at if one of th e two power supplies fail, th e system will continu e to operate and the failed power supply can be hot swapped. That is the failed power supply is r emoved and r eplaced with out turn ing powe r off.
The system h as three 5 1/4- inch half- height bay s accessible from the front. These bays are convenient for diskette, tape, and CD-RO M drives (r emovable media) . Because of the EMI generated by hard drives, the increased susc eptibility to ESD, and coolin g requirements, hard drives shou ld not be installed in the 5 1/4-inc h half-h eight bays.
Features
2-4
System Feature Summary
The follow ing prov ides a summary of the system features:
Feature Description
System board an d processor/memory board
Add-in board suppor t Rail and back panel slots su ppo rt up to 8 add-in boards
3 1/2-inch diskette drive 3 1/2 diskette drive is externally accessible. Six location s f o r 3 1/2-inch
SCSI-2 hard drives
Hot swap-capable bac k p lane A hot swap-capable backplane is part of each 3 1/2-inc h
Three locations for removable media drives
System is intended for use with a system board and processor/memory board based on Pentium Pro processor technology; from one to two processors and up to 1 GB of memory usin g 128 MB DIMM s.
(three EISA, four PCI, and one shared PCI/EISA).
The hard disk drive bay can hold six 3 1/2-inch hot­swappable ultra wide SCSI-2 hard drives. The bay is secured behind a lockable metal EMI door; drives can be swapped in or out of the system without powering it down, if a Redundant Array of Independent Disks (RAID) controller module is installed. Th e array of drives allows easy setup of o ptio nal RAID applications.
drive bay assembly for SCSI drives. The backplane is designed for wide ultra SCSI-2 devices that use the industry standard 80-pin Single Connecto r Attach (SCA) connector. The backplane consists of two rows of three drive connectors.
Three externally accessible 5 1/4-inch half-height bays are available for diskette, CD-ROM, and/or tape drives.
Power supply One or tw o 330 Watt autorangin g power supplie s are
easily removed/installed for service. In a two-supply system, the second supply is redundant.
Hot swap-capable cooling fans
Each power supply has two integral cooling fans. Six more fans provide cooling for boards and drives.
Features
Security Mechanical: Key lock at the front and three metal
padlock loops (one at the back of each side panel and one across the botto m o f e ach power su pply and power supply cage). One intrusion sensor for the hot-swap SCSI drive bay EM I doo r and two power inter-lock sensors one on each side of the chassis.
BIOS: Password enable.
Software: utilities, setup BIOS Setup, System Configuration Utility , SCSISelect
Utility and Event Log Reader .
2-5
Features
2-6
Chassis Front Features and Contr ols
Figur e 2-1 shows th e server front ch assis features an d controls.
Figure 2-1. Front Chassis Features And Controls
C B
F G H I J
K
L
A
E
D
Features
A Key lock Secures both front external doors.
2-7
B Load/eject button , CD-ROM
reader
C Activity light, CD-ROM reader When lit, drive is in use. D Ejector button, 3 1/2-inch
diskette drive
E Activity lig ht, 3 1/2-inc h
diskette drive
F DC power switch (convex
button)
G Reset switch (concave button) Press to cause a hard reset to the system; the power-
H Power-on LED, green When green, powe r is present in system (+5 and +12
I System alarm LED When green the system is OK. See Table 2-1 for a
J Drive activity LED When green, internal disk drives are being accessed.
Press to load CD an d e je ct CD.
Press to eject diskette.
When lit, drive is in u se.
Press to turn system DC power on or off.
on self test (POST) will run..
VDC). When off, power is turned off or power source is disrupted. See T able 2- 1 fo r a list and description of the LED system status indicato rs.
list and description of the LED sy ste m status indicators.
See Table 2-1 for a list and description of the LED system status indicators.
K LCD pan e l Displays information about processor type an d
system failure s (e rror and diag nostic infor matio n ) .
L SCSI drive status LEDs Left to right: Dr ive present/power on; drive active ;
drive faulty. Each drive has three LEDs visible above the bay from the front. See Table 2-2 for a list of SCSI disk drive status LED indicator descriptions.
Features
2-8
Status LED Indicator Descriptions
Table 2-1 lists the sy stem status LED indic ators along with a descr iption of each LED indicator . Table 2-2 lists the disk dr ive status LED pan el indicator s along with a description of each LED indicator.
Table 2-1. System Status LED Indicators
LED Status Description Response
Power Status Off Power OFF None required (normal)
Green Power ON None required (normal) Amber System power supply failure Replace failed power
supply module.
System Status Off Power OFF None required (normal)
Green No alarms None required ( nor m al) Amber Abnormal condition
(see Table 2-3).
Disk Status Off Not accessing disk drives None required (normal)
Amber Internal disk drive failure Replace disk drive Green Accessing disk drives None required (normal)
Replace failing part.
Table 2-2. Disk Dr i ve Status LED Panel Indicators
LED Status Description Response
Disk Drive Power
Disk Drive Activity
Disk Drive Status
Off Disk drive power is OFF None required (normal)
Green Disk drive power is ON None required (normal) Off Not accessing disk drives None required (normal)
On Accessing disk drives None required (normal Off No alarms None required ( nor m al)
Amber Internal disk drive failure Replace disk drive.
Features
Table 2-3. System Status Abnormal Conditions
LED (Amber) Conditions
System Status Unit fan alarm
Memory multi-bit error (SERR) P6 bus error SERR) Thermal sensor (from SCSI distr ibut ion board) Temperature (hecet a) Voltage (heceta) CPU thermal trip (heceta) Chassis intrusion (front cover) PCI PERR# (OPB/ESC detect ) PCI SERR# CPU interna l error WDT IOCHK
Resetting the System
There are several ways to reset the system:
Reset button - p ressing th is button clear s system
memory, restarts POST, and reloads th e operating system. Power on/off - turning the power off and then on
with the po wer button on the fr ont of the sy stem has the same eff ect as pushin g the Reset bu tton, except th at power is halted to all peripherals.
2-9
Features
2-10
Chassis Rear Features and Contr ols
Figur e 2-2 shows th e server rear ch assis features an d controls.
Figure 2-2. Rear Chassis Features And Controls
C
A
S
C
D E
G
F
I
N
P R
O Q
H J
M K
L
Features
C
C
B
2-11
A AC input power
connector
B Power supplies (two
shown)
C Security padlock loops One on each side at the top rear of the chassis, one on the
D Keyboard PS/2-compatible 6-pin mini-DIN connector. E Mouse PS/2-compatible 6-pin mini-DIN connector. F Reserved G COM2 COM2 serial port 9-pin connector. H COM1 COM1 serial port 9-pin connector. I External-SCSI Narrow-SCSI 50-pin connector J Function select
switches
K Dump butto n See Configuring Switch and Jumper Settings in Chapter 4
One at the top o f the power su pply cage that su pplie s AC power for all the power supplies.
Possible configurations, installed from left most bay: 1 supply (nonredundant)
2 supplies (one r e dundant)
power supply cage, and one on each power supply module..
See Configuring Switch and Jumper Settings in Chapter 4 of this User’s Guide.
of this User’s Guide.
L VGA VGA monitor 15-pin connector. M Printer LPT1 25-pin Centronics-compatible parallel port
connector.
N PCI slots Four PCI add-in board slot locations. O Knocko uts Available to route SCSI signals to peripheral box e s. P PCI/EISA slot One PCI or EISA add-in board slot location. Q Knocko uts Available to route SCSI signals to peripheral box e s. R EISA slots Three EISA add-in board slot location s. S P o wer supply status
lamps
See Table 2-4 for status description s.
Features
2-12
Power Supply Status Lamp Descriptions
Table 2-4 lists the pow er supply status lamps.
Table 2-4. Power Supply Status
LED Status Description Response
DC Power Off Power is Off None required (norm al)
Green Power is On None required (norm al)
Alarm Off No alarm None required (normal)
Amber Powe r failure
Abnormal power temperatur e Power FAN alarm DC-Power alar m
Replace power supply Clean air passages Replace power supply Replace power supply
Features
System Board Featur es
The board se t includes th e system board an d one processo r/memory board. Fig ures 2-3 an d 2-4 show th e major compo nents on th e system board and processor /memory boar d, while th e following summarizes the bo ard set featur es.
Board set summary Feature description
2-13
Multiple processor support
Upgradable memor y Eight DIM M sockets on th e processor/me mo ry board,
Add-in board support Three dedicated EISA bus slots on th e system board. Four
SCSI controller Two onboard SCSI-2; ultra wide SCSI channel and narrow
BIOS Flash memory-based BIOS (Basic Input/Output System ) and
Video Integrated super VGA controller ships with 1 MB of video
External device connectors
Clock Real-time clock/calendar (RTC).
Two processor sockets; up to two Pentium Pro microprocessors on one processor/memory board.
supporting up to 1 GB memory using 128 MB DIMMs.
dedicated 32-bit PCI slots on the system board. One shar e d PCI/EISA slot on the system board. P rimary and secondary bus architecture.
SCSI channel support (PCI-based).
Setup utilities.
memory. F o r optional 1 MB of video memory, two onboard upgrade so ckets (512 KB eac h) are available th at i ncreases total video memor y size to 2 MB.
Onboard connectors for two serial ports, parallel port, narrow SCSI port, PS/2-compatible keyboard and mouse, and VGA monitor.
System hardware monitoring
Configuration utilities
Detects chassis intrusion and contains sensors for temperature, voltage, and fan failure.
System Configuration Utility (SCU), SCSISelect Utility, and Event Log Re ade r.
Features
2-14
Figure 2-3. System Board Connector and Component Locations
A B C D E F
Features
EISA expansion slots
PCI expansion slots
Reserved
I/O riser board connector
Optional Video DRAM sockets
Configuration jumpers (see Figure 4-2)
2-15
G H I J K L M N O P Q
Narrow SCSI connector
Wide SCSI connector
Front panel connector
Dis kette con n ector
Reserved
Processor/Memory board connector
Speaker connector
Fan connector
Real time clock battery
Non-volatile memory
SCSI status connector
Features
2-16
Figure 2-4. Processor/Memory Board Connector and Component Locations
A B C D
DIMM sockets
First processor
Second processor
DC to DC converters
Features
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