Product Specification
IEEE 802.11b/g/n 1T1R SDIO WiFi Module
WIFI MODULE
ZAPO
Shenzhen ZAPO Technology Co., LTD.
S1
CONTENT
0 REVESION HISTORY ......................................................................................................................... 3
0.1 MODEL NO DEFINITION .............................................................................................................. 3
1 INTRODUCTIONS .............................................................................................................................. 4
1.1 OVERVEIW.................................................................................................................................... 4
1.2 PRODUCT FEATURES ................................................................................................................. 4
2 GENERAL SPECIFICATION ............................................................................................................... 5
2.1 WIFI RF SPECIFICATION ............................................................................................................. 5
2.2 POWER CONSUMPTION ............................................................................................................. 6
3 MECHANICAL SPECIFICATION ........................................................................................................ 6
3.1 OUTLINE DRAWING ..................................................................................................................... 6
3.2 SPECIFICATION OF SHIELDING CASE ...................................................................................... 6
3.3 PIN DEFINITION ........................................................................................................................... 7
3.4 RECOMMENDED FOOTPRINT .................................................................................................... 7
4 ENVIRONMENTAL REQUIREMENTS ............................................................................................... 8
4.1 OPERATING & STORAGE CONDITIONS .................................................................................... 8
4.2 RECOMMENDED REFLOW PROFILE ......................................................................................... 8
4.3 NOTICE .......................................................................................................................................... 9
5 PACKING INFORMATION .................................................................................................................. 9
5.1 BLISTER PACKAGING .................................................................................................................. 9
5.2 COILING PACKAGING .................................................................................................................. 9
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0. Revision History
REV NO Date Modifications Approved Drafted
Rev1.0 May 11,2012 XJ Hu
Rev1.1 Dec 30,2013 SJ LI
Rev1.2 Jul.30,2014
0.1. Model No Definition
Example: F89ESSM23-W1
Add KCC mark, and shielding
case
SYMEN SJ LI
F 89E S S M 2 3-W 1
Manufacturer: FN-LINK
IC Part NO: RTL8723BS
IC Version: D
Interface: S SDIO, U USB, E PCI-E
Product Type: M Module, D Dongle
Product NO: 1, 2, 3….
Voltage: 3 3.3Vdc, 5 5Vdc
Antenna: W External, B Print ANT
Control NO: 0, 1, 2….
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