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xiX MX200MG-CM-X4G2
Technical Manual
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XIMEA xiX MX089MG-SY-X2G2, xiX MX023CG-SY-X2G2, xiX MX031MG-SY-X2G2, xiX MX050CG-SY-X2G2, xiX MX089CG-SY-X2G2 Technical Manual

...
xiX
[ksi-x: or sai-ex:]
• PCI Express cameras for integration
Technical Manual
Version 1.3, August, 2018

1. Introduction

1.1. About This Manual

service or warranty case, please contact your local dealer or refer to XIMEA Support on our website:www.ximea.com/support The purpose of this document is to provide a description of the XIMEA xiX-Series cameras and to descri be t he correct way to
install related software and drivers and run it successfully. Please read this manual thoroughly before operating your new camera for the first time. Please follow all instructions and observe the warnings.
This docu ment is su bjec t to change without notice.

1.2. About XIMEA

XIMEA is one of the worldwide leaders for innovative cam era solutions with a 20-year history of research, develo pment and product ion of digital image acquisition syst ems. Based in Slovakia, Germany and the US and w ith a global distrib uto r network , XIMEA offers their cameras worldwi de. In close collaboration with customers XIMEA has deve loped a broad spectr um of technologies and cutting-edge, h ighly com petitive product s .
XIMEA's camera centric technolo gy portfolio comprises a broad spect rum of digital technologies, from data interfaces such as PCI express, USB 2.0, 3.0 and USB 3.1, t o cooled digital cameras with CCD and CMOS sensors, as well as X-ray came ras. XIMEA has t hree di vis ions – generic machine vision and integrated vision s ystems, scientific imaging and OEM/custom.
XIMEA ca meras find use in many industrial applications, such as motion control, robotics , or quality cont rol in m anufacturing. The broad spectrum of came ras also includes thermall y stabilized X-ray cameras, and specialty cameras for me dical applications, research, surveillance and defense.

1.2.1. Contact XIMEA

XIMEA is a worldwi de operating Company
Headquarters, S ales worldwide XIMEA GmbH
Am Mittelhafen 16 48155 Münster Germany
Tel: +49 (251) 202 408-0 Fax: +49 (251) 202 408-99
Internet www.ximea.com General inquiries info@ximea.com Sales sales@ximea.com Support support@ximea.com
Sales America XIMEA Corp.
8725 W 14th Ave, Ste 110 Lakewood, CO 80215 USA
Tel: +1 (303) 389-9838 Fax: +1 (303) 202-6350
R&D, Production XIMEA s.r.o.
Lesna 52 900 33 Marianka Slovakia
xiX - Technical Manual Ve rsio n 1.3 2

1.3. Standard Conformity

The xiX ca meras have been tes ted using the following eq uipment:
• List equipment: To be added

1.3.1. CE Conformity

To be added

1.3.2. For customers in the US: FCC Conformity

To be added

1.3.3. For customers in Canada

The xiX cameras comply with the Class A limits for radio noise emissions set out in Radio Interference Regulations.
xiX - Technical Manual Ve rsio n 1.3 3

1.3.4. RoHS Conformity

The xiX cameras comply with the requirements of the RoHS (Restriction of Hazardous Substances) Directive 2011/65/EU.

1.3.5. WEEE Conformity

The xiX cameras comply with the requirements of the WEEE (waste electrical and electronic equipment) Directive 2003/108/EC.

1.3.6. GenICam GenTL API

GenICam standard transport layer interface, gra bbing images.GenICam/GenTL provides an agnostic transport layer interface to acquire images o r other data and to com municate with a device. Each XIMEA camer a can be GenTL Producer.

1.4. Helpful Links

• XIMEA Homepage http://www.ximea.com/
• PCIe zone https://www.ximea.com/en/pci-express-camera/pcie-camera-zone
• xiAPI stable versions download https://www.ximea.com/support/documents/4
• xiAPI beta versions download https://www.ximea.com/support/documents/14
• Frequently Asked Questions http://www.ximea.com/support/wiki/allpr o d/Frequently_Asked_Questions
• Knowled g e Base http://www.ximea.com/support/wiki/allprod/Knowledge_Base
• Vision Libraries http://www.ximea.com/support /projects/vision-libraries/wiki
• XIMEA Registration http://www.ximea.com/en/products/register
• XIMEA Live Support http://www.ximea.com/support/wiki/allprod/XIMEA_Live_Support
• XIMEA General Terms & Conditions http://www.ximea.com/en/corporate/generaltc
xiX - Technical Manual Ve rsio n 1.3 4

1.5. Table of Contents

1. Introduction ................................................................................................................................................................ 2
1.1. About This Manual ............................................................................................................................................. 2
1.2. About XIMEA ..................................................................................................................................................... 2
1.2.1. Contact XIMEA .......................................................................................................................................... 2
1.3. Standard Conformity .......................................................................................................................................... 3
1.3.1. CE Conformity ........................................................................................................................................... 3
1.3.2. For customers in the US: FCC Conformity ................................................................................................... 3
1.3.3. For customers in Canada ........................................................................................................................... 3
1.3.4. RoHS Conformity ....................................................................................................................................... 4
1.3.5. WEEE Conformity ...................................................................................................................................... 4
1.3.6. GenICam GenTL API .................................................................................................................................. 4
1.4. Helpful Links...................................................................................................................................................... 4
1.5. Table of Contents ............................................................................................................................................... 5
2. xiX Camera Series .................................................................................................................................................... 11
2.1. What is xiX ...................................................................................................................................................... 11
2.2. Advantages ..................................................................................................................................................... 11
2.3. PCI Express Vision Camera Applications ............................................................................................................ 12
2.4. Common features ............................................................................................................................................ 12
2.5. What is xSWITCH ............................................................................................................................................. 13
2.5.1. xSWITCH examples ................................................................................................................................. 15
2.6. Model Nomenclature ........................................................................................................................................ 16
2.7. Models Overview, sensor and models................................................................................................................ 17
2.8. Accessories ..................................................................................................................................................... 18
3. Hardware Specification ............................................................................................................................................. 19
3.1. Power Supply .................................................................................................................................................. 19
3.2. General Specification ....................................................................................................................................... 19
3.2.1. Environment ........................................................................................................................................... 19
3.2.2. Firmware / Host driver / API features ........................................................................................................ 19
3.3. Mounting points ............................................................................................................................................... 20
3.4. Lens Mount ..................................................................................................................................................... 21
3.4.1. Screws ................................................................................................................................................... 22
3.5. Optical path ..................................................................................................................................................... 23
3.5.1. Filter glasses .......................................................................................................................................... 23
3.5.2. Monochrome and near infrared extended camera models (MX X2G2 models only) ...................................... 23
3.5.3. Color camera models (MX X2G2 models only) ........................................................................................... 24
3.6. Model Specific Characteristics .......................................................................................................................... 25
3.6.1. MX023xG-SY-X2G2-Fx............................................................................................................................ 25
3.6.1.1. Sensor and camera parameters ................................................ ...................................................... 25
3.6.1.2. Quantum efficiency curves [%] ........................................................................................................ 26
3.6.1.3. Drawings MX023xG-SY-X2G2-FL (C-mount [with C/CS mount module B]) ......................................... 27
3.6.1.4. Drawings MX023xG-SY-X2G2-FV (C-mount [with C/CS mount module B]) ......................................... 27
3.6.1.5. Referenced documents ................................................................................................................... 28
3.6.1.6. Sensor features .............................................................................................................................. 28
3.6.2. MX031xG-SY-X2G2-Fx............................................................................................................................ 29
3.6.2.1. Sensor and camera parameters ................................................ ...................................................... 29
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3.6.2.2. Quantum efficiency curves [%] ........................................................................................................ 30
3.6.2.3. Drawings MX031xG-SY-X2G2-FL (C-mount [with C/CS mount module B]) ......................................... 31
3.6.2.4. Drawings MX031xG-SY-X2G2-FV (C-mount [with C/CS mount module B]) ......................................... 31
3.6.2.5. Referenced documents ................................................................................................................... 32
3.6.2.6. Sensor features .............................................................................................................................. 32
3.6.3. MX050xG-SY-X2G2-Fx............................................................................................................................ 33
3.6.3.1. Sensor and camera parameters ................................................ ...................................................... 33
3.6.3.2. Quantum efficiency curves [%] ........................................................................................................ 34
3.6.3.3. Drawings MX050xG-SY-X2G2-FL (C-mount [with C/CS mount module B]) ......................................... 35
3.6.3.4. Drawings MX050xG-SY-X2G2-FV (C-mount [with C/CS mount module B]) ......................................... 35
3.6.3.5. Referenced documents ................................................................................................................... 36
3.6.3.6. Sensor features .............................................................................................................................. 36
3.6.4. MX089xG-SY-X2G2-Fx............................................................................................................................ 37
3.6.4.1. Sensor and camera parameters ................................................ ...................................................... 37
3.6.4.2. Quantum efficiency curves [%] ........................................................................................................ 38
3.6.4.3. Drawings MX089xG-SY-X2G2-FL (C-mount [with C/CS mount module B]) ......................................... 39
3.6.4.4. Drawings MX089xG-SY-X2G2-FV (C-mount [with C/CS mount module B]) ......................................... 39
3.6.4.5. Referenced documents ................................................................................................................... 40
3.6.4.6. Sensor features .............................................................................................................................. 40
3.6.5. MX124xG-SY-X2G2-Fx............................................................................................................................ 41
3.6.5.1. Sensor and camera parameters ................................................ ...................................................... 41
3.6.5.2. Quantum efficiency curves [%] ........................................................................................................ 42
3.6.5.3. Drawings MX124xG-SY-X2G2-FL (C-mount [with C mount module B]) .............................................. 43
3.6.5.4. Drawings MX124xG-SY-X2G2-FV (C-mount [with C mount module B]) .............................................. 43
3.6.5.5. Referenced documents ................................................................................................................... 44
3.6.5.6. Sensor features .............................................................................................................................. 44
3.6.6. MX120xG-CM-X4G2-Fx .......................................................................................................................... 45
3.6.6.1. Sensor and camera parameters ................................................ ...................................................... 45
3.6.6.2. Quantum efficiency curves [%] ........................................................................................................ 46
3.6.6.3. Drawings MX120xG-CM-X4G2-FL................................................................................................... 47
3.6.6.4. Drawings MX120xG-CM-X4G2-FV .................................................................................................. 47
3.6.6.5. Referenced documents ................................................................................................................... 48
3.6.6.6. Sensor features .............................................................................................................................. 48
3.6.7. MX200xG-CM-X4G2-Fx .......................................................................................................................... 49
3.6.7.1. Sensor and camera parameters ................................................ ...................................................... 49
3.6.7.2. Quantum efficiency curves [%] ........................................................................................................ 50
3.6.7.3. Drawings MX200xG-CM-X4G2-FL................................................................................................... 51
3.6.7.4. Drawings MX200xG-CM-X4G2-FV .................................................................................................. 51
3.6.7.5. Referenced documents ................................................................................................................... 52
3.6.7.6. Sensor features .............................................................................................................................. 52
3.6.8. MX500xG-CM-X4G2-Fx .......................................................................................................................... 53
3.6.8.1. Sensor and camera parameters ................................................ ...................................................... 53
3.6.8.2. Quantum efficiency curves [%] ........................................................................................................ 54
3.6.8.3. Drawings MX500xG-CM-X4G2-FL................................................................................................... 55
3.6.8.4. Drawings MX500xG-CM-X4G2-FV .................................................................................................. 55
3.6.8.5. Referenced documents ................................................................................................................... 56
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3.6.8.6. Sensor features .............................................................................................................................. 56
3.7. User interface – LEDs ...................................................................................................................................... 57
3.8. xiX X2G2 Interface connector ............................................................................................................................ 58
3.8.1. Interface connector location ..................................................................................................................... 58
3.8.2. Pinning ................................................................................................................................................... 58
3.8.3. Inserting / detaching FPC cable................................................................................................................ 59
3.9. xiX X4G2 Interface connector ............................................................................................................................ 62
3.9.1. Interface connector location ..................................................................................................................... 62
3.9.2. Pinning ................................................................................................................................................... 62
3.9.3. Inserting / detaching FFC cable ................................................................................................................ 64
3.10. xiX Digital Input / Output (GPIO) Interface ........................................................................................................... 66
3.10.1. Optically isolated Digital Input .................................................................................................................. 66
3.10.1.1. Digital Input – signal levels ............................................................................................................. 66
3.10.1.2. Digital Input – Internal Schematic .................................................................................................... 67
3.10.1.3. Digital Input – Wiring ...................................................................................................................... 67
3.10.1.4. Digital Input – Timing ..................................................................................................................... 68
3.10.2. Optically isolated Digital Output ................................................................................................................ 68
3.10.2.1. Optically isolated Digital Output - General info .................................................................................. 68
3.10.2.2. Optically isolated Digital Output Delay .............................................................................................. 68
3.10.2.3. Optically isolated Digital Output – Internal schematic ........................................................................ 69
3.10.2.4. Digital Output – Wiring ................................................................................................................... 69
3.10.2.5. Digital Output – Timing ................................................................................................................... 74
3.10.3. Non-isolated Digital Lines ........................................................................................................................ 75
3.10.3.1. Non-isolated Digital Input/Output (INOUT) General info ...................................................................... 75
3.11. Heat Dissipation ............................................................................................................................................... 76
3.12. CBL-MX-X2G2-0M07/ CBL-MX-X2G2-0M10/ CBL-MX-X2G2-0M25/ CBL-MX-X2G2-0M50 ................................ 76
3.13. CBL-MX-X4G2-0M10 / CBL-MX-X4G2-0M25 / CBL-MX-X4G2-0M50 ................................................................ 76
3.14. MX camera adapters ........................................................................................................................................ 77
3.15. Tripod Adapter ................................................................................................................................................. 78
3.15.1. Tripod Adapter MX X2G2 (MECH-MC-BRACKET-KIT) ................................................................................. 78
3.15.2. Drawings ................................................................................................................................................ 78
3.15.3. Tripod Adapter MX X4G2 ......................................................................................................................... 79
3.15.4. Drawings ................................................................................................................................................ 79
3.16. xiX X4G2 Lens adapter – MECH-60MM-EF-ADAPTER ........................................................................................ 80
4. Operation ................................................................................................................................................................. 81
4.1. System Requirements ...................................................................................................................................... 81
4.1.1. Software Requirements ........................................................................................................................... 81
4.1.2. Hardware Requirements .......................................................................................................................... 81
4.1.2.1. System Configuration ..................................................................................................................... 81
4.2. Video Formats ................................................................................................................................................. 83
4.2.1. Full Resolution ........................................................................................................................................ 83
4.2.2. ROIs – Region Of Interest ........................................................................................................................ 83
4.2.3. Downsampling Modes ............................................................................................................................. 83
4.2.3.1. Binning .......................................................................................................................................... 83
4.2.3.2. Skipping ........................................................................................................................................ 83
4.2.4. Image Data Output Formats ..................................................................................................................... 84
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4.2.5. Digitization bit depth................................................................................................................................ 85
4.3. Acquisition modes............................................................................................................................................ 86
4.3.1. Free-Run ................................................................................................................................................ 86
4.3.2. Triggered Acquisition .............................................................................................................................. 86
4.3.2.1. Software Trigger ............................................................................................................................ 86
4.3.2.2. Hardware Trigger ........................................................................................................................... 86
4.3.2.3. Triggered acquisition - single frame ................................................................................................ 87
4.3.2.4. Triggered acquisition - burst of frames ............................................................................................ 88
4.3.2.5. Exposure defined by trigger pulse length.......................................................................................... 88
4.3.2.6. Multiple exposures in one frame...................................................................................................... 89
4.4. Camera Parameters and Features ..................................................................................................................... 90
4.4.1. Exposure Time ........................................................................................................................................ 90
4.4.2. Gain ....................................................................................................................................................... 90
4.5. Host-Assisted Image Processing Parameters Available in xiAPI. .......................................................................... 90
4.5.1. Auto Exposure – Auto Gain ...................................................................................................................... 90
4.5.2. White Balance ........................................................................................................................................ 90
4.5.2.1. Assisted Manual White Balance ...................................................................................................... 90
4.5.2.2. Auto White Balance ........................................................................................................................ 90
4.5.3. Gamma .................................................................................................................................................. 90
4.5.4. Sharpness .............................................................................................................................................. 90
4.5.5. Color Correction Matrix ............................................................................................................................ 91
4.5.6. Sensor Defect Correction ......................................................................................................................... 91
4.5.7. HDR ....................................................................................................................................................... 92
5. Software .................................................................................................................................................................. 95
5.1. Accessing the Camera ..................................................................................................................................... 95
5.1.1. Proprietary API ........................................................................................................................................ 95
5.1.2. Standard Interface .................................................................................................................................. 95
5.1.2.1. GenICam ....................................................................................................................................... 95
5.1.3. Vision Library Integration ..................................................................... .................................................... 95
5.2. XIMEA CamTool ............................................................................................................................................... 96
5.3. Supported Vision Libraries ................................................................................................................................ 98
5.3.1. Libraries maintained by XIMEA ................................................................................................................. 98
5.3.1.1. MathWorks MATLAB ...................................................................................................................... 98
5.3.1.2. MVTec HALCON ............................................................................................................................. 98
5.3.1.3. National Instruments LabVIEW Vision Library .................................................................................... 98
5.3.1.4. OpenCV ......................................................................................................................................... 98
5.4. XIMEA Windows Software Package ................................................................................................................... 99
5.4.1. Contents................................................................................................................................................. 99
5.4.2. Installation .............................................................................................................................................. 99
5.5. XIMEA Linux Software Package ....................................................................................................................... 102
5.5.1. Contents............................................................................................................................................... 102
5.5.2. Installation ............................................................................................................................................ 102
5.6. XIMEA macOS Software Package .................................................................................................................... 104
5.6.1. Contents............................................................................................................................................... 104
5.6.2. Installation ............................................................................................................................................ 104
5.6.3. Start XIMEA CamTool ............................................................................................................................ 105
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5.7. Programming................................................................................................................................................. 106
5.7.1. XIMEA APIs........................................................................................................................................... 106
5.7.2. xiAPI Overview ...................................................................................................................................... 106
5.7.3. xiAPI Functions Description .................................................................................................................... 106
5.7.4. xiAPI Parameters Description ................................................................................................................. 107
5.7.5. xiAPI Examples ..................................................................................................................................... 107
5.7.5.1. Connect Device ............................................................................................................................ 107
5.7.5.2. Parameterize Device ..................................................................................................................... 107
5.7.5.3. Acquire Images ............................................................................................................................ 108
5.7.5.4. Control Digital Input / Output (GPIO)............................................................................................... 108
5.7.6. xiAPI Auto Bandwidth Calculation ........................................................................................................... 109
5.7.7. GenICam .............................................................................................................................................. 109
5.8. XIMEA Control Panel ...................................................................................................................................... 110
6. Appendix ................................................................................................................................................................ 111
6.1. Troubleshooting and Support .......................................................................................................................... 111
6.1.1. Worldwide Support ................................................................................................................................ 111
6.1.2. Before Contacting Technical Support ...................................................................................................... 111
6.1.3. Frequently Asked Questions ................................................................................................................... 111
6.1.3.1. What is PCIe Gen2? ..................................................................................................................... 111
6.1.3.2. What is the real transfer speed? .................................................................................................... 112
6.1.3.3. Why can I not achieve maximum transfer speed? ........................................................................... 112
6.1.3.4. What voltage should be applied to Digital Input of xiX to turn it on/off? ............................................. 112
6.1.3.5. What is the implementation of Digital Output (VDO) of xiX? ............................................................. 112
6.2. Product service request (PSR) ......................................................................................................................... 113
6.2.1. Step 1 - Contact Support ....................................................................................................................... 113
6.2.2. Step 2 - Create Product Service Request (PSR) ....................................................................................... 113
6.2.3. Step 3 - Wait for PSR Approval .............................................................................................................. 113
6.2.4. Step 4 - Sending the camera to XIMEA ................................................................................................... 113
6.2.5. Step 5 - Waiting for Service Conclusion .................................................................................................. 113
6.2.6. STEP 6 - Waiting for return delivery........................................................................................................ 113
6.3. Safety instructions and precautions ................................................................................................................. 114
6.3.1. Disassembling ...................................................................................................................................... 114
6.3.2. Mounting / Screwing ............................................................................................................................. 114
6.3.3. Connections ......................................................................................................................................... 114
6.3.4. Power supply ........................................................................................................................................ 114
6.3.5. Environment / protect against water ....................................................................................................... 114
6.3.6. Recommended light conditions. ............................................................................................................. 114
6.3.7. Protect the optical components .............................................................................................................. 115
6.3.8. Mechanical loads .................................................................................................................................. 115
6.3.9. Camera / lens cleaning.......................................................................................................................... 115
6.3.10. Protect against static discharge (ESD) .................................................................................................... 115
6.4. Warranty ....................................................................................................................................................... 115
6.5. Disclaimer of Warranty ................................................................................................................................... 116
6.6. List Of Trademarks ........................................................................................................................................ 116
6.7. Standard Terms & Conditions of XIMEA GmbH ................................................................................................. 116
6.8. Copyright ...................................................................................................................................................... 121
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6.9. Revision History ............................................................................................................................................. 121
7. Glossary ................................................................................................................................................................. 122
8. list of figures .......................................................................................................................................................... 123
9. list of tables............................................................................................................................................................ 126
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2. xiX Camera Series

2.1. What is xiX

xiX [
ksi-x: or sai-ex:]]
• extremely small footprint
• sensors: 2.3 MP, 3.1 MP, 5.0 MP, 8.9 MP and 12.4 MP, b/w, color Sony sensors
as well as color, monochrome and some NIR AMS/CMOSIS sensors: CMV12000, CMV20000
• frame rates: 3.1 MP @ 218 fps to 20 MP @ 32 fps
The main point behind the xiX family is a flat all-in-one cable with fast data interface, power and trig gering signals. This is ideal for embedded and high-density applications. All standard co nnectors - like iPass, USB, Type-C - are much bigger than that and require 2 cables for data and power/IO.
The xiX camera line comes with two form factors. Small (1inch square) with smaller sensors and interface PCIe x2 Gen2 (10Gbits /s ) and C/CS lens mount. Large (60x60mm) with interface PCIe x4 Gen2 (20Gbit/s) and active Canon EF-mount.

2.2. Advantages

Industry standard interface PCI express Small Perfect size and customization options for Em bedded vision system applications Powerful 20Gb/s interface using standard PCI express hardware (X4G2 models) Fast High spe ed, high frame rate: >218fps at 3.1Mpix and 133fps at 12Mpix resolut ions Robust Full meta l ‘s emi-housed’ Lightwei ght Facilitates increased performance of ro botic arms and gimbals Connectivity Programmable opto-is olated I/O, and non-isolated digital input and output. 4 status LEDs Compatibility Support for Windows, Linux and MacOS, various Image Processi ng Libraries Software interfaces GenICa m / GenTL and highly optimized xiAPI SDK Economical Excellent value and price, low TCO and fast ROI Low latency Computer CPU not involved in data transfer, latency from camera t o memory is low Optimized transfer GPU-direc t (Linux only) ideal for setupd using GPU for image proces sing
table 2-1, advantag es
is an ultra-compact PCI express industrial ca mera family with outstanding features:
xiX - Technical Manual Ve rsio n 1.3 11

2.3. PCI Express Vision Camera Applications

• Automation
• Ultra-fast 3D scanning
• Miniature and fast robotic arms
• Mobile devices
• In-situ optical inspection camera
• Material and life science microscopy
• Ophthalmology and retinal imaging
• Broadcasting
• Fast process capture, e.g. golf club swings
• Intelli gent Transportations Systems (ITS) and traffic monitoring
• VR and AR
• Cinematography
• Sports
• Unmanned vehicles
• UAV / Drones etc.

2.4. Common features

Sensor Technology CMOS, Global shutter Acquisition Modes Continu ous, software and hardware tri gger, fps limiting, triggered exposure and burst Partial Image Readout ROI, Skip ping and Binning modes supported (m odel specific) Image data formats 8, 10 or 12 bit RAW pixel data Color image proces sing Host based de-bayering, sharpening, Gamma, color matrix, true color CMS Hot/blemish pixels correction On camera storage of up to 5000 pixel coordinates, host assisted correction Auto adjustments Auto white balance, auto gain, auto exposure Flat field corrections Host assisted pixel level shading and lens correctio ns Image Data and Control Inte rface Ribbon cable and breakout board options to iPass e xternal PCIe connector General Purpose I/O X2G2 models - 1x opto-isolated input, 1x opto-isolate d output, and 2 non-isolated
bidirectional I/O, 4X user configurable LEDs X4G2 models - 2x opt o-isolated input, 2x opto-isolated output, and 4 non-isolated
bidirectional I/O, 4X user configurable LEDs Synchronization Hardwa re trigger input, sof tware trigger, exposure strobe output, busy output Housing and lens mount Standa rd C-mount convertible to CS mount, an d Ca non EF mount Power requirem ents Externa l power supply required of 12-24V DC Environment Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 60°C stor age Operating systems Windows 10 (x86 and x64), Windows 7 (x86 and x64), Linux Ubuntu, MacOS 10.8 Software support xiAPI SDK, adapters and drivers for vario us image processing packages Firmware updat es Field firmware updatable
table 2-2, common features
xiX - Technical Manual Ve rsio n 1.3 12

2.5. What is xSWITCH

Utilizing PCIe as a camera interface offers unique camera aggregation options, at extremely high bandwidths: multiple cameras can be efficient ly connected and their respective data streams bundled into a single copper or fiber optic cable connection to a host computer, writing directly to memory (DMA) at 64 Gbit/s. Flat-flex cables between the cameras and the xSWITCH allow the most compact integration in tight spaces.
figure 2-1, Example of aggre gation of many camera in to one cable
PCIe allows multi camera assembly in to one cable stream with other end connecte d to e xpa nsion slot in host computer. It is possible to chain several PCIe switches to create optimal infrastructure. Together with the cameras it is also possible to populate PCIe switch downstream ports with other controllers, like USB 3.0, UART, etc.
figure 2-2, PCI Express Topology
xiX - Technical Manual Ve rsio n 1.3 13
HIGHLIGH TS
• Maximum compactness: smallest form factor cameras and mini connectors allow closest sensor-to-sensor proximity
• Aggregation into one high bandwidth upstream ( up to 64Gbit/s)
• Full utilization of PCIe architecture with point-to-point c onnection and direct memory access
• Use of standard components allows simple assembly for the creation of a custom platform
• No need for external or ad ditional expansion backplanes
• Multiple example types of xSWITCH board are already designed
• Shape of the board can be can be tailore d precisely to application requirements
• Benefit from XIMEA´s unique experience and expertise in the field of PCIe
MIX AND MATCH
• Connect multiple va rious camera models and types of cameras to a single computer
• Select from wide range of sensor resolutions and frame rates
• Combine housed and board level camera types
• Choice of different number of PCIe lanes and PCIe standards (2, 4, 8 lanes / Gen2 or Gen3)
• Choice of various connectors: flat-flex option, board to board or iPass
• Choose between flat-flex connectors with vertical or horizo ntal orientation
• Bridge small or large distances of >100 m by selecting copper cable or optical fiber cable
xiX - Technical Manual Ve rsio n 1.3 14

2.5.1. xSWITCH examples

By offering xSWITCH, XIMEA provides a PCB design where qu antity, type, location and orientatio n of PCIe connectors can be varied to optimize the building of multi-camera systems. Multiple variations of these PCB designs already exist based on the concept of empowering rapid customization of the final assembly and thus enabling most daring of custome r applications.
For more information please contact our sales: info@ximea.com
figure 2-3, Variations of Switches for Embedded vision systems
xiX - Technical Manual Ve rsio n 1.3 15

2.6. Model Nomenclature

Part number convention for the different models:
MXxxxyG-zz-XaGb [-OPT] MX xiX family name xxx: Resol ution in 0.1 MPixel . E.g . 2.3 MPixel Resolution: xxx = 023
y: y=C: color model y=M: black & white model y=R: black & white, Infrared-extended model
G: Global shutter (all xiX cameras are global shutter) zz: Vendor of the sensor
zz = SY: Sony, CM: AMS/CMOSIS
[-OPT]: Options
OPT = FL: flexline variant, co nnector parallel to board, semi-housed OPT = FV: flexline variant, connector vertical to board, sem i-housed
XaGb: a = Number of PCIe lanes used, currently 2 or 4 lanes (b=2 or 4) for xiX cameras
b = PCIe generation, currently at Gen 2 (a=2) for the xiX cameras
xiX - Technical Manual Ve rsio n 1.3 16

2.7. Models Overview, sensor and models

1
Model MX023MG-SY-X2G2 b/w
MX023CG-SY-X2G2 Color MX031MG-SY-X2G2 b/w MX031CG-SY-X2G2 Color MX050MG-SY-X2G2 b/w MX050CG-SY-X2G2 Color MX089MG-SY-X2G2 b/w MX089CG-SY-X2G2 Color MX124MG-SY-X2G2 b/w MX124CG-SY-X2G2 Color
table 2-3, X2G2 models overview
Resolution Pixel size ADC [bit] DR
Optical
size
Sensor size
[mm]
FPS
1936 x 1216 5.86 µm 10/12 71.7 dB 1/1.2” 11.34x7.13 166
2064 x 1544 3.45 µm 8/10/12 70.8 dB 1/1.8” 7.23x5.33 218
2464 x 2056 3.45 µm 8/10/12 70.8 dB 2/3” 8.5x7.1 165
4112 x 2176 3.45 µm 8/10/12 70.5 dB 1” 14.19x7.51 95
4112 x 3008 3.45 µm 8/10/12 70.5 dB 1.1” 14.19x10.38 69
2
1
Model MX120MG-CM-X4G2 b/w
MX120CG-CM-X4G2 Color MX120RG-CM-X4G2 NIR MX200MG-CM-X4G2 b/w MX200CG-CM-X4G2 Color MX200MG-CM-X4G2 b/w MX200CG-CM-X4G2 Color
table 2-4, X4G2 models overview
Note: 1) In the model nam e please add
-FL for flat-flex cable connecting f rom t he bottom of the camera
-FV for flat-flex cable connecting perpendicular to the sensor
2) Full resolution, 8-bit RAW
Resolution Pixel size ADC [bit] DR
Sensor size
[mm]
Sensor
diagonal
FPS
4096 x 3072 5.5µm 8/10/12 60dB 22.53x16.9 28mm 133
5120 x 3840 6.4µm 12 66dB 32.76x24.58 41mm 32
7902 x 6004 4.6µm 12 64dB 36.35x27.62 45.6mm 30
2
xiX - Technical Manual Ve rsio n 1.3 17

2.8. Accessories

The following accessories are available:
Item P/N Description CBL-MX-X2G2-0M07 0.07m flat ribbon cable for PCIe Gen 2 x2 cable CBL-MX-X2G2-0M10 0.1m flat ribbon cable for PCIe Gen 2 x2 cable CBL-MX-X2G2-0M25 0.25m flat ribbon cable for PCIe Gen 2 x2 cable CBL-MX-X2G2-0M50 0.5m flat ribbon cable for PCIe Gen 2 x2 cable CBL-MX-X4G2-0M10 0.1m flat ribbon cable for PCIe Gen 2 x4 cable CBL-MX-X4G2-0M25 0.25m flat ribbon cable for PCIe Gen 2 x4 cable CBL-MX-X4G2-0M50 0.5m flat ribbon cable for PCIe Gen 2 x4 cable ADPT-MX-X2G2-IPASS-HOST-Fx ADPT-MX-X2G2-IPASS-TARGET-Fx2 Breakout board from X2G2 flat ribbon cable to iPass X2G2 ADPT-MX-X2G2-M2-Fx ADPT-MX-X2G2-M2SSD-Fx2 Breakout board from X2G2 flat ribbon cable to M.2 SSD socket ADPT-MX-X2G2-MINI-PCIE-Fx ADPT-MX-X2G2-PCIE-Fx ADPT-MX-X2G2-X4G2 Breakout board from X2G2 flat ribbon to X4G2 ribbon (both directions) ADPT-MX-X4G2-IPASS-HOST-Fx2 Breakout board from iPass X4G2 to X4G2 flat ribbon ADPT-MX-X4G2-IPASS-TARGET-Fx2Breakout board from X4G2 flat ribbon cable to iPass X4G2 ADPT-MX-X4G2-M2-Fx ADPT-MX-X4G2-MINI-PCIE-Fx ADPT-MX-X4G2-PCIE-Fx MECH-60MM-BRACKET-T xiB / xiX X4 G2 s eries tripod mounting bracket MECH-60MM-EF-ADAPTER-KIT MECH-MC-BRACKET-KIT xiX X2G2 / xiC series tripod mounting bracket
table 2-5, accessories
2
Breakout board from iPass X2G2 to X2G2 flat ribbon
2
2
2
2
2
2
Breakout board from M.2 to X2G2 ribbon cable
Breakout board from Mini P CIe to X2G2 flat ribbon Breakout board from PC Ie to X2G2 flat ribbon
Breakout board from M.2 to X4G2 ribbon cable Breakout board from Mini P CIe to X4G2 flat ribbon Breakout board from PC Ie to X4G2 flat ribbon
1
xiB / xiT Canon EF-Mount Ada pte r
Notes: 1) This kit is sold separately, however it is possible to order assembling during prod uction. These assemblies are
sold separately. Additional assemblies purchased along with a camer a can be added to the order at time of purchase for assembly with camera head. See table 2-6
2) Adapters are available in vertical (-FV) and horizontal orientation (-FL) of flat ribbon connector
Item P/N Description A-MECH-60MM-EF-ADAPTER-KIT1Assembly Service for MECH-60MM-EF-ADAPTER-KIT
table 2-6, assembly options
Notes: 1) Available only for MX120 and MX200 models.
xiX - Technical Manual Ve rsio n 1.3 18

3. Hardware Specification

3.1. Power Supply

The xiX cameras are powered via flex cable from an external power supply 12-24V with power consumption up to 10W max (without power needed for lens). Please read the c hapter3.8 xiX X2G2 Interface connector and 3.9 xiX X4G2 Interface connector regarding camera pi nout. Breakout board can be used to power cam era see3.14 MX came ra adapters

3.2. General Specification

3.2.1. Environment

Description Symbol Value Optimal ambient temperature operation
Ambient temperat ure ope ration Ambient temperature for storage and transportation Relative Humidity, non-con de nsing RH ≤ 80 %
table 3-1, environment
Housing temperat ure must not exceed +65°C. The following parameters are not guaranteed if th e camera is operated outside the optimum range:
• Dark cur rent
• Dynamic Range
• Linearity
• Acquisition and read out noise
• S/N ratio, durab ilit y
Please refer to chapter:3.11 Heat Dissipation
T
opt
T
max
T
storage
+10 to +25 °C 0 to +50 °C
-30 to +60 °C

3.2.2. Firmware / Host driver / API features

Description Value Interpolation methods SHT advanced White balance coefficients r anges 0.0 to 3.9 Sharpness filter -400 to 400 % Gamma 0.3 to 1.0 Full color correction matrix (3+1)x3 coefficients ranges -3.9 to 3.9
table 3-2, firmware / API features
More details on API/SDK features are available at XIMEA support pages: http://www.ximea.com/support
xiX - Technical Manual Ve rsio n 1.3 19

3.3. Mounting points

Cameras fe ature mounting threads enabli ng to be mounted on construction or via t ripod adapter to standard tripod. MX X2G2
figure 3-1, MX X2G2 mounting points (note 1: models MX089xG and MX124xG do not have this mounting hole)
MX X4G2
figure 3-2, MX X4G2 mounting points
xiX - Technical Manual Ve rsio n 1.3 20

3.4. Lens Mount

The xiX cameras have a couple lens mounts available. The smaller cameras (X2G2) have a C-mount, and the larger ones can optional ly be included with a Ca non EF mount.
figure 3-3, MX X2G2 position C/CS-Mount module B
The smaller cameras are delivered with C-mount back focal length. By removing the “C /CS-Mount module B” (see the figure above) the camera can be rebuilt to CS-mount compatibility. Effecti vely reducing the back focal distance and overall length of camera by 5mm. The required M2x8mm special screws are part of the camera delivery. The length of the lens thread is 6.5 mm.
Note: The distance between the threaded flange and the surface of the filter glass is 11.9 mm in case of C-Mount and 6.9 mm in case of CS -Mount. To avoid damaging of the filter glass, nothing may extend deepe r into the housing.
figure 3-4, MX X4G2 camera with /without the optional EF-Mount Adapter
The cameras are optionally delive red with or without outer EF-Mount Adapter. For more information refer to 3.16 xiX X4G2 Lens adapter – MECH-60MM-EF-ADAPTER Note: The distance between the outer EF-Mou nt Adapter and the active sensor surface is 44 mm and when no EF-Mount
Adapter is included it is 13.4 mm.
xiX - Technical Manual Ve rsio n 1.3 21

3.4.1. Screws

All mounting screws for MX X2G2 are customized M2 screws with different lengths. Technical details:
Material Steel Surface Black zinc Thread M2 Driver PH 00 Avail. Lengths 3mm – 24 mm
Drawings, e.g. w ith 10mm length:
table 3-3, custom screws, technical details
figure 3-5, xiX mounting screws
Note: Never excee d a maximum torque of 0.3Nm when fastening the M2 mo unting screws.
As mounting screws for MX X4G2 Sta ndard M4 screws can be used.
xiX - Technical Manual Ve rsio n 1.3 22

3.5. Optical path

3.5.1. Filter glasses

A filter glass is part of the optical path of the camera. This glass is placed on a layer of silicone, to keep dust out of the camera, but not glued. The conversion of C-mount to CS-mount (see section 3.4 Lens Mount) must be carried out carefully. Operating the camera without a lens mo unt is not intende d and can lead to dropping out of the filter glass a nd the entry of dust. . Do not use compressed air to clean the camera as this could push dust int o the camera. Distance from the flange to sensor is designed so the optical distance is 17.526mm – 0.2mm.
filter glass sensor cover glass sensor die
figure 3-6, Optical path section MX X2G2
MX X4G2 does not feature filterglass in the optical path

3.5.2. Monochrome and near infrared extended camera models (MX X2G2 models only)

Used filter brand BK7 AR2x Thickness 1.0±0.1 mm Coating Anti-reflex both sides
table 3-4, monochrome camera - filter glas s parameter
BK7 AR2x - Transmission Curve
100
90 80 70 60 50 40 30
Transmittance (%)
20 10
0
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050
Wavelength (nm)
figure 3-7, monochrome camera - filter glass transmission curve
xiX - Technical Manual Ve rsio n 1.3 23

3.5.3. Color camera models (MX X2G2 models only)

Used filter brand ICR650 Thickness 1.0±0.1 mm Coating NA
table 3-5, color camera - filte r glass parameter
ICR650 - Transmission Curve
100
90 80 70 60 50 40 30
Transmittance (%)
20 10
0
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050
Wavelength (nm)
figure 3-8, color camera - filter glass transmission curve
xiX - Technical Manual Ve rsio n 1.3 24

3.6. Model Specific Characteristics

3.6.1. MX023xG-SY-X2G2-Fx

3.6.1.1. Sensor and camera p arameters
xiX model MX023CG-SY-X2G2-Fx MX023MG-SY-X2G2-Fx Sensor parameter Model name IMX174LQJ-C IMX174LLJ-C Color filter RGB Bayer mosaic None Type Global shutter, o verlap mode Pixel Resolution (H × V) [pixel] 1936 x 1216 Active area size (H × V) [mm] 11.314 x 7.12 Sensor dia go nal [mm] 13.39 Optical format [inch] 1/1.2 Pixel Size (H × V) [µm] 5.86 x 5.86 ADC resolution [bit] 10, 12 FWC [ke-] 30.5 Dynamic range [dB] 71.7 SNR Max [dB] 45 Conversion gain [e-/LSB12] 8.1 Dark noise [e-] 7.36 Dark current [e-/s] 3 DSNU [e-] 1.1 PRNU [%] 0.4 Linearity [%] 0.5 Camera parameters Digitization [bit] 10, 12 Supported bit resolutions [bit/pixel] 8, 10, 12 Exposu re time (EXP) 19µs to 30sec, in steps of 4.96µs Variable Gain Rang e (VGA) [dB] 0-24 Refresh rate (MRR) [fps] 166
Power consumption typical [W] 2.87 Maximum [W] 2.95 Dimensions/Mass height [mm] 26.4 width [mm] 26.4 depth (-FL/-FV) [mm] 30.9 (with C/CS Mount module B)
mass (-FL/-FV) [g] 30 (with C/CS Mount module B)
table 3-6, MX023xG-SY-X2G2-Fx, se nsor and c amera parameters
1
25.9 (without C/ CS Mount module B)
25.8 (without C/ CS Mount module B)
Notes:
1) Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be ca lculated in:
Camera performance calculator: https://www.ximea.com/support/attachments/download/7828/Camera_Performance_Calculator.xlsm
xiX - Technical Manual Ve rsio n 1.3 25
Color model Mono mode Binning/skipping pixels fps Bit/px
Yes Yes 1x1 1936 x 1216 166 8 Yes Yes 1x1 1936 x 1216 166 10 Yes Yes 1x1 1936 x 1216 129 12
table 3-7, MX023xG-SY-X2G2-Fx, su pported standard readout modes
3.6.1.2. Quantum efficiency curves [%]
IMX174 - Spectral Response
90% 80% 70% 60% 50% 40% 30% 20%
Quantum Efficiency (%)
10%
0%
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050
Monochrome Red Bayer Green Bayer Blue Bayer
Wavelength (nm)
figure 3-9, IMX174-mono, quantum efficiency curve, ©SONY
xiX - Technical Manual Ve rsio n 1.3 26
3.6.1.3. Drawings MX023xG-SY-X2G2-FL (C-mount [with C/CS mount module B])
figure 3-10, dimensiona l drawing MX023x G-SY-X2G2-FL, C-Mount housing
3.6.1.4. Drawings MX023xG-SY-X2G2-FV (C-mount [with C/CS mount module B])
figure 3-11, dimensional dra wing MX023xG-S Y-X 2G2 -FV, C-Mount hous ing
xiX - Technical Manual Ve rsio n 1.3 27
3.6.1.5. Referenced docume nts
Sony Datasheet IMX174LQJ-C_E_TechnicalDatasheet_REv0.3 (01/06/14) Sony Datasheet IMX174LLJ-C_E_data_sheet_E14315 (01/06/14)
3.6.1.6. Sensor features
feature Note Binni ng No Skip pi ng Not supported ROI Vertical cropping results in increased read speed, horizontal reduces data tr ansfer HW Trigger HDR Not available
table 3-8, sensor features available
Trigger without o verlap usable (see 4. 3.2 Triggered Ac quisition)
xiX - Technical Manual Ve rsio n 1.3 28

3.6.2. MX031xG-SY-X2G2-Fx

3.6.2.1. Sensor and camera p arameters
xiX model MX031CG-SY-X2G2-Fx MX031MG-SY-X2G2-Fx Sensor parameter Model name IMX252LQR-C IMX252LLR-C Color filter RGB Bayer mosaic None Type Global shutter, o verlap mode Pixel Resolution (H × V) [pixel] 2064 x 1544 Active area size (H × V) [mm] 7.12 x 5.33 Sensor dia go nal [mm] 8.89 Optical format [inch] 1/1.8 Pixel Size (H × V) [µm] 3.45 × 3.45 ADC resolution [bit] 8, 10, 12 FWC [ke-] 9.9 Dynamic range [dB] 70.9 SNR Max [dB] 40.3 Conversion gain [e-/LSB12] 2.67 Dark noise [e-] 2.32 Dark current [e-/s] 2.1 DSNU [e-] 0.7 PRNU [%] 0.65 Linearity [%] 0.5 Camera parameters Digitization [bit] 83, 10, 12 Supported bit resolutions [bit/pixel] 8, 10, 12 Exposu re time (EXP) 1µs2 to 30sec, in steps of 5.29µs Variable Gain Rang e (VGA) [dB] 0-24 Refresh rate (MRR) [fps] 218 Power consumption typical [W] 3.64 Maximum [W] 3.72 Dimensions/Mass height [mm] 26.4 width [mm] 26.4 depth [mm] 30.8 (with C/CS Mount module B)
mass [g] 30 (with C/CS Mount module B)
table 3-9, MC031xG-SY-X2G2-Fx, sensor and camera parameters
1
25.8 (without C/ CS Mount module B)
25.8 (without C/ CS Mount module B)
Notes:
1) Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be ca lculated in:
Camera performance calculator: https://www.ximea.com/support/attachments/download/7828/Camera_Performance_Calculator.xlsm
2) From 1 µs to 14 µs t he step is 1µs and the sensor is operating in special mode. This exposure times are not achieva ble for exposure co ntrolled by trigger pulse length.
3) Saturation level in 8bit digitization is only ¼ of 10bit and 12bit mode (see 4.2.5 Digitization bit depth)
xiX - Technical Manual Ve rsio n 1.3 29
Color model Mono model Binning/skipping (H X V) pixels fps Bit/px
Yes Yes 1x1 / 1x1 2064 x 1544 218 8 Yes Yes 1x1 / 1x1 2064 x 1544 193 10 Yes Yes 1x1 / 1x1 2064 x 1544 119 12 Yes Yes 1x1 / 1x2 2064 x 772 426 8 Yes Yes 1x1 / 2x1 1032 x 1544 218 8 Yes Yes 1x1 / 2x2 1032 x 772 426 8
No Yes 1x2 / 1x1 2064 x 772 426 8
No Yes 1x2 / 2x1 1032 x 772 426 8 Yes Yes 1x1 / 2x2 1032 x 772 378 10 Yes Yes 1x1 / 2x2 1032 x 772 233 12
table 3-10, MC031 xG-S Y, supported standard readout mod es
Notes:
1) Defined for ban dwidth 900MB/s.Camera performance calculator:
https://www.ximea.com/support/attachments/download/7828/Camera_Performance_Calculator.xlsm
3.6.2.2. Qua ntum efficiency curves [%]
IMX252- Spectral Response
70%
60%
50%
40%
30%
20%
Quantum Efficiency (%)
10%
0%
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050
Wavelength (nm)
figure 3-12, IMX252-mono and color, quantum efficiency curves, ©SONY
Monochro me Red Bayer Green Bayer Blue Bayer
xiX - Technical Manual Ve rsio n 1.3 30
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