XIMEA CB120CG-CM, CB120MG-CM, CB200MG-CM, CB200CG-CM, CB500MG-CM Technical Manual

...

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xiB xiB64

[ksi-bee: or sai-bee:]

• PCI Express camera series

Technical Manual

Version 1.06, August 2018

xiB & xiB-64 - Technical Manual Version 1.06

Headquarters Sales worldwide

XIMEA GmbH Am Mittlehafen 16

48155 Münster Germany

Tel: +49 (2501) 964 555-0 Fax: +49 (2501) 964 555-99

Sales America XIMEA Corp.

8725 W 14th Ave, Ste 110 Lakewood, CO 80215 USA

Tel: +1 (303) 389-9838 Fax: +1 (303) 202-6350

R&D, Production

XIMEA s.r.o. Lesna 52 900 33 Marianka Slovakia

1. Introduction

1.1. About This Manual

Dear customer, Thank you for purchasing a product from XIMEA. We hope that this manual can answer your questions, but should you have any further questions or if you wish to claim a

service or warranty case, please contact your local dealer or refer to the XIMEA Support on our website:

www.ximea.com/support

The purpose of this document is to provide a description of the XIMEA xiB and xiB64-Series cameras and to describe the correct way to install related software and drivers and run it successfully. Please read this manual thoroughly before operating your new camera for the first time. Please follow all instructions and observe the warnings.

This document is subject to change without notice.

1.2. About XIMEA

XIMEA is one of the worldwide leaders for innovative camera solutions with a 20-year history of research, development and production of digital image acquisition systems. Based in Slovakia, Germany and the US and with a global distributor network, XIMEA offers their cameras worldwide. In close collaboration with customers XIMEA has developed a broad spectrum of technologies and cutting-edge, highly competitive products.

XIMEA's camera centric technology portfolio comprises a broad spectrum of digital technologies, from data interfaces such as FireWire, USB 2.0, 3.0 and USB 3.1, PCIe and PCIe based aggregation to cooled digital cameras with CCD and CMOS sensors, as well as smart cameras with embedded PCs, and X-ray cameras. XIMEA has three divisions – generic machine vision and integrated vision systems, scientific imaging and OEM/custom.

XIMEA cameras find use in many industrial applications, such as motion control, robotics, or quality control in manufacturing. The broad spectrum of cameras also includes thermally stabilized X-ray cameras, and specialty cameras for medical applications, research, surveillance and defense.

1.2.1. Contact XIMEA

XIMEA is a worldwide operating Company

Internet www.ximea.com General inquiries info@ximea.com Sales sales@ximea.com Support support@ximea.com

xiB & xiB-64 - Technical Manual Version 1.06

1.3. Standard Conformity

The xiB cameras have been tested using the following equipment:

• Camera with lens Canon EF 50mm 1:1.8 and EF lens mount adapter

• IPASS

• 10 meter PCIe Gen2 x4, fiber optics cable, Samtec type PCIE-4G2-010.0-11 (XIMEA P/N: CBL-PCI-FIB- 10M0)

• 3 meter xiB series power/sync cable, 12 poles, type A65-3786 (revision 05) (XIMEA P/N: CBL-CBSYNC-3M0)

• Tripod adapter (XIMEA P/N: MECH-60MM-BRACKET-T)

• AC power adapter M+R Multitronik GmbH, Model BACS30M-24V-C8, 24V DC/1.25A (S/N:30240-0000198), (XIMEA P/N:

The xiB-64 models have not been certified, yet... Warning: Changes or modifications to the product may render it ineligible for operation under CE, FCC or other jurisdictions. XIMEA recommends using the above configuration to ensure compliance with the following standards:

1.3.1. CE Conformity

The xiB cameras described in this manual comply with the requirements of the

• EC EMC Directive 2004/108/EEC

Used harmonized European standards and technical specifications:

• EN 55022:2006 + A2:2010

• EN 55024:2010

• EN 60950-1

• EN 61000-6-2:2005 Electromagnetic compatibility (EMC). Generic standards. Immunity for industrial environments

• EN 61000-6-3:2007 + A1:2011

• EN 61000-6-4:2007 + A1:2011

• EN 61000-4-2:2009 Electrostatic discharge immunity test

• EN 61000-4-3:2006 + A2:2010

• EN 61000-4-4:2012 Electrical fast transient/burst immunity test

• EN 61000-4-6:2009 Immunity to conducted disturbances, induced by radio frequency fields

• EN 61000-6-1:2007 Generic standards – Immunity for residential, commercial and light-industrial environments

PCIe x4 cable, 7m length, MOLEX type 74546-0407 (XIMEA P/N: CBL-PCI-COP-7M0)

PCIe x4 cable, 3m length, MOLEX type 74546-0403, (XIMEA P/N: CBL-PCI-COP-3M0)

BACS30M-24-C8)

electromagnetic compatibility of equipment

Information technology equipment – Radio disturbance characteristics – Limits and methods of measurement

Information technology equipment - Immunity characteristics - Limits and methods of measurement

Information technology equipment – Safety – Part 1: General requirements

Generic standards – Emission standard for residential, commercial and light-industrial environments

Electromagnetic compatibility (EMC) - Part 6-4: Generic standards - Emission standard for industrial environments

Radiated, radio-frequency electromagnetic field immunity test

1.3.2. For customers in the US: FCC Conformity

The xiB cameras described in this manual have been tested and found to comply with Part 15 of the FCC rules, which states that:

Operation is subject to the following two conditions:

• This device may not cause harmful interference, and

• This device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for Class A digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the users will be required to correct the interference at their own expense.

xiB & xiB-64 - Technical Manual Version 1.06

• Ximea Homepage

http://www.ximea.com/

• xiB product page

https://www.ximea.com/en/pci-express-camera/pci-express-cameracmv12000-cmv20000

• PCI Express support page

https://www.ximea.com/support/wiki/xib/PCI_Express_camera_-_xiB

• Quick start guide

https://www.ximea.com/support/wiki/xib/Quick_Start_Guide

• xiAPI stable versions download

https://www.ximea.com/support/documents/4

• xiAPI beta versions download

https://www.ximea.com/support/documents/14

• Frequently Asked Questions

http://www.ximea.com/support/wiki/allprod/Frequently_Asked_Questions

• Knowledge Base

http://www.ximea.com/support/wiki/allprod/Knowledge_Base

• Vision Libraries

http://www.ximea.com/support/projects/vision-libraries/wiki

• XIMEA Registration

http://www.ximea.com/en/products/register

• XIMEA Live Support

http://www.ximea.com/support/wiki/allprod/XIMEA_Live_Support

• XIMEA General Terms &

Conditions

http://www.ximea.com/en/corporate/generaltc

You are cautioned that any changes or modifications not expressly approved in this manual could void your authority to operate this equipment under above jurisdictions. The shielded interface cable recommended in this manual must be used with this equipment in order to comply with the limits for a computing device pursuant to Subpart J of Part 15 of FCC Rules.

The xiB-64 models have not been certified, yet.

1.3.3. For customers in Canada

The xiB cameras comply with the Class A limits for radio noise emissions set out in Radio Interference Regulations. The xiB-64 models have not been certified, yet.

1.3.4. RoHS Conformity

The xiB & xiB-64 cameras comply with the requirements of the RoHS (Restriction of Hazardous Substances) Directive 2011/65/EU.

1.3.5. WEEE Conformity

The xiB and xiB-64 cameras comply with the requirements of the WEEE (waste electrical and electronic equipment) Directive 2003/108/EC.

1.3.6. GenICam GenTL API

GenICam standard transport layer interface, grabbing images. GenICam/GenTL provides an agnostic transport layer interface to acquire images or other data and to communicate with a device. Each XIMEA camera can be GenTL Producer.

1.4. Helpful Links

xiB & xiB-64 - Technical Manual Version 1.06

1.4.1. Table of Contents

1. Introduction ................................................................................................................................................................ 2

1.1. About This Manual ............................................................................................................................................. 2

1.2. About XIMEA ..................................................................................................................................................... 2

1.2.1. Contact XIMEA .......................................................................................................................................... 2

1.3. Standard Conformity .......................................................................................................................................... 3

1.3.1. CE Conformity ........................................................................................................................................... 3

1.3.2. For customers in the US: FCC Conformity ................................................................................................... 3

1.3.3. For customers in Canada ........................................................................................................................... 4

1.3.4. RoHS Conformity ....................................................................................................................................... 4

1.3.5. WEEE Conformity ...................................................................................................................................... 4

1.3.6. GenICam GenTL API .................................................................................................................................. 4

1.4. Helpful Links ..................................................................................................................................................... 4

1.4.1. Table of Contents ...................................................................................................................................... 5

2. xiB Camera Series ...................................................................................................................................................... 9

2.1. What is xiB ........................................................................................................................................................ 9

2.2. Advantages ....................................................................................................................................................... 9

2.3. PCI Express Vision Camera Applications ............................................................................................................ 10

2.4. Common features ............................................................................................................................................ 10

2.5. Model Nomenclature ........................................................................................................................................ 11

2.6. Models Overview, sensor and models ............................................................................................................... 12

2.7. Options ........................................................................................................................................................... 12

2.8. Accessories ..................................................................................................................................................... 13

3. Hardware Specification ............................................................................................................................................. 14

3.1. Power Supply .................................................................................................................................................. 14

3.2. General Specification ....................................................................................................................................... 14

3.2.1. Environment ........................................................................................................................................... 14

3.2.2. Firmware / Host driver / API features ........................................................................................................ 14

3.3. Lens Mount ..................................................................................................................................................... 15

3.4. Mounting points ............................................................................................................................................... 16

3.5. Optical path ..................................................................................................................................................... 16

3.6. Model Specific Characteristics .......................................................................................................................... 17

3.6.1. CB120xG-CM ......................................................................................................................................... 17

3.6.1.1. Sensor and camera parameters ...................................................................................................... 17

3.6.1.2. Quantum efficiency curves [%] ........................................................................................................ 18

3.6.1.3. Dimensional drawings CB120xG-CM ............................................................................................... 19

3.6.1.4. Referenced documents ................................................................................................................... 20

3.6.1.5. Sensor features.............................................................................................................................. 20

3.6.2. CB200xG-CM ......................................................................................................................................... 21

3.6.2.1. Sensor and camera parameters ...................................................................................................... 21

3.6.2.2. Quantum efficiency curves [%] ........................................................................................................ 22

3.6.2.3. Dimensional drawings CB200xG-CM ............................................................................................... 23

3.6.2.4. Referenced documents ................................................................................................................... 24

3.6.2.5. Sensor features.............................................................................................................................. 24

3.6.3. CB500xG-CM ......................................................................................................................................... 25

3.6.3.1. Sensor and camera parameters ...................................................................................................... 25

3.6.3.2. Quantum efficiency curves [%] ........................................................................................................ 26

3.6.3.3. Dimensional drawings CB500xG-CM (with and without EF mount) ..................................................... 27

3.6.3.4. Referenced documents ................................................................................................................... 28

3.6.3.5. Sensor features.............................................................................................................................. 28

3.6.4. CB013xG-LX-X8G3 ................................................................................................................................. 29

3.6.4.1. Sensor and camera parameters ...................................................................................................... 29

xiB & xiB-64 - Technical Manual Version 1.06

3.6.4.2. Quantum efficiency curves [%] ........................................................................................................ 30

3.6.4.3. Dimensional drawings CB013xG-LX-X8G3 ....................................................................................... 31

3.6.4.4. Referenced documents ................................................................................................................... 32

3.6.4.5. Sensor features.............................................................................................................................. 32

3.6.5. CB019xG-LX-X8G3 ................................................................................................................................. 33

3.6.5.1. Sensor and camera parameters ...................................................................................................... 33

3.6.5.2. Quantum efficiency curves [%] ........................................................................................................ 34

3.6.5.3. Dimensional drawings CB019xG-LX-X8G3 ....................................................................................... 35

3.6.5.4. Referenced documents ................................................................................................................... 36

3.6.5.5. Sensor features.............................................................................................................................. 36

3.6.6. CB120xG-CM-X8G3................................................................................................................................ 37

3.6.6.1. Sensor and camera parameters ...................................................................................................... 37

3.6.6.2. Quantum efficiency curves [%] ........................................................................................................ 38

3.6.6.3. Dimensional drawings CB120xG-CM-X8G3 ..................................................................................... 39

3.6.6.4. Referenced documents ................................................................................................................... 40

3.6.6.5. Sensor features.............................................................................................................................. 40

3.7. User interface – LEDs ...................................................................................................................................... 41

3.8. xiB, xiB-64 PCIe Interface ................................................................................................................................. 42

3.8.1. iPassTM Connector Location ..................................................................................................................... 42

3.9. Digital Input / Output (GPIO) Interface and Power ............................................................................................... 43

3.9.1. Location ................................................................................................................................................. 43

3.9.2. IO Connector Pinning .............................................................................................................................. 43

3.9.3. Power input ............................................................................................................................................ 45

3.9.4. Optically isolated Digital Input .................................................................................................................. 46

3.9.4.1. Optically isolated Digital Input - General info .................................................................................... 46

3.9.4.2. Digital Input – signal levels ............................................................................................................. 46

3.9.4.3. Digital Input – Internal Schematic .................................................................................................... 47

3.9.4.4. Digital Input – Wiring ...................................................................................................................... 47

3.9.4.5. Digital Input – Timing ..................................................................................................................... 48

3.9.5. Optically isolated Digital Output ................................................................................................................ 48

3.9.5.1. Optically isolated Digital Output - General info .................................................................................. 48

3.9.5.2. Optically isolated Digital Output Delay .............................................................................................. 48

3.9.5.3. Optically isolated Digital Output – Internal schematic ........................................................................ 49

3.9.5.4. Digital Output – Wiring ................................................................................................................... 49

3.9.5.5. Digital Output – Timing ................................................................................................................... 54

3.9.6. Non-isolated Digital Lines ........................................................................................................................ 55

3.9.6.1. Non-isolated Digital Input/Output (INOUT) General info ...................................................................... 55

3.10. Power supply input (AUX PWR) ......................................................................................................................... 55

3.11. CBL-PCI-COP-xx/ CBL-PCI-FIB-xx ..................................................................................................................... 56

3.12. PCIe host adapter cards ................................................................................................................................... 57

3.13. CBL-CB-PWR-SYNC-3M0 ................................................................................................................................ 58

3.14. CBL-MT-PWR-SYNC-3M0 ................................................................................................................................ 59

3.15. Tripod Adapter – MECH-60MM-BRACKET-T ...................................................................................................... 60

3.16. xiB-64 cooling – CB-X8G3-FAN-COOLER-KIT .................................................................................................... 61

3.17. xiB cooling – MECH-60MM-HEATSINK-KIT ........................................................................................................ 62

3.18. xiB Lens adapter – MECH-60MM-EF-ADAPTER ................................................................................................. 63

3.19. xiB Lens adapter – LA-C-MNT-60MM-xxx-KIT, .................................................................................................. 63

4. Operation ................................................................................................................................................................. 64

4.1. System Requirements ...................................................................................................................................... 64

4.1.1. Software Requirements ........................................................................................................................... 64

4.1.2. Hardware Requirements .......................................................................................................................... 64

4.1.2.1. System Configuration ..................................................................................................................... 64

xiB & xiB-64 - Technical Manual Version 1.06

4.1.2.2. Cables ........................................................................................................................................... 65

4.2. Video Formats ................................................................................................................................................. 66

4.2.1. Full Resolution ........................................................................................................................................ 66

4.2.2. ROIs – Region Of Interest ........................................................................................................................ 66

4.2.3. Downsampling Modes ............................................................................................................................. 66

4.2.3.1. Binning .......................................................................................................................................... 66

4.2.3.2. Skipping ........................................................................................................................................ 66

4.2.4. Image Data Output Formats ..................................................................................................................... 67

4.3. Acquisition modes ........................................................................................................................................... 68

4.3.1. Free-Run ................................................................................................................................................ 68

4.3.2. Trigger controlled Acquisition/Exposure .................................................................................................... 68

4.3.2.1. Triggered acquisition - single frame ................................................................................................ 69

4.3.2.2. Triggered acquisition - burst of frames ............................................................................................ 70

4.3.2.3. Exposure defined by trigger pulse length ......................................................................................... 70

4.4. Camera Parameters and Features ..................................................................................................................... 71

4.4.1. Exposure Time ........................................................................................................................................ 71

4.4.2. Gain ....................................................................................................................................................... 71

4.5. Host-Assisted Image Processing Parameters Available in xiAPI. .......................................................................... 71

4.5.1. Auto Exposure – Auto Gain ...................................................................................................................... 71

4.5.2. White Balance ........................................................................................................................................ 71

4.5.2.1. Assisted Manual White Balance ...................................................................................................... 71

4.5.2.2. Auto White Balance ........................................................................................................................ 71

4.5.3. Gamma .................................................................................................................................................. 71

4.5.4. Sharpness .............................................................................................................................................. 71

4.5.5. Color Correction Matrix ............................................................................................................................ 72

4.5.6. Sensor Defect Correction ......................................................................................................................... 72

4.5.7. HDR ....................................................................................................................................................... 73

5. Software .................................................................................................................................................................. 76

5.1. Accessing the Camera ..................................................................................................................................... 76

5.1.1. Proprietary API ........................................................................................................................................ 76

5.1.2. Standard Interface .................................................................................................................................. 76

5.1.2.1. GenICam ....................................................................................................................................... 76

5.1.3. Vision Library Integration ......................................................................................................................... 76

5.2. XIMEA CamTool ............................................................................................................................................... 77

5.3. Supported Vision Libraries ................................................................................................................................ 79

5.3.1. Libraries maintained by XIMEA ................................................................................................................. 79

5.3.1.1. MathWorks MATLAB ...................................................................................................................... 79

5.3.1.2. MVTec HALCON ............................................................................................................................. 79

5.3.1.3. National Instruments LabVIEW Vision Library .................................................................................... 79

5.3.1.4. OpenCV ......................................................................................................................................... 79

5.4. XIMEA Windows Software Package ................................................................................................................... 80

5.4.1. Contents ................................................................................................................................................ 80

5.4.2. Installation .............................................................................................................................................. 80

5.5. XIMEA Linux Software Package ......................................................................................................................... 83

5.5.1. Contents ................................................................................................................................................ 83

5.5.2. Installation .............................................................................................................................................. 83

5.6. XIMEA macOS Software Package ...................................................................................................................... 85

5.6.1. Contents ................................................................................................................................................ 85

5.6.2. Installation .............................................................................................................................................. 85

5.6.3. Start XIMEA CamTool .............................................................................................................................. 86

5.7. Programming .................................................................................................................................................. 87

5.7.1. XIMEA APIs ............................................................................................................................................. 87

xiB & xiB-64 - Technical Manual Version 1.06

5.7.2. xiAPI Overview ........................................................................................................................................ 87

5.7.3. xiAPI Functions Description ...................................................................................................................... 87

5.7.4. xiAPI Parameters Description ................................................................................................................... 88

5.7.5. xiAPI Examples ....................................................................................................................................... 88

5.7.5.1. Connect Device .............................................................................................................................. 88

5.7.5.2. Parameterize Device ....................................................................................................................... 88

5.7.5.3. Acquire Images .............................................................................................................................. 89

5.7.5.4. Control Digital Input / Output (GPIO) ................................................................................................ 89

5.7.6. xiAPI Auto Bandwidth Calculation ............................................................................................................. 89

5.7.7. GenICam ................................................................................................................................................ 90

5.8. XIMEA Control Panel ........................................................................................................................................ 91

6. Appendix .................................................................................................................................................................. 92

6.1. Troubleshooting and Support ............................................................................................................................ 92

6.1.1. Worldwide Support .................................................................................................................................. 92

6.1.2. Before Contacting Technical Support ........................................................................................................ 92

6.1.3. Frequently Asked Questions ..................................................................................................................... 92

6.1.3.1. What is the real transfer speed? ...................................................................................................... 93

6.1.3.2. Why can I not achieve maximum transfer speed? ............................................................................. 93

6.2. Product service request (PSR) ........................................................................................................................... 93

6.2.1. Step 1 - Contact Support ......................................................................................................................... 93

6.2.2. Step 2 - Create Product Service Request (PSR) ......................................................................................... 93

6.2.3. Step 3 - Wait for PSR Approval ................................................................................................................ 93

6.2.4. Step 4 - Sending the camera to XIMEA ..................................................................................................... 93

6.2.5. Step 5 - Waiting for Service Conclusion .................................................................................................... 94

6.2.6. STEP 6 - Waiting for return delivery ......................................................................................................... 94

6.3. Safety instructions and precautions ................................................................................................................... 94

6.3.1. Disassembling ........................................................................................................................................ 94

6.3.2. Mounting / Screwing ............................................................................................................................... 94

6.3.3. Connections ........................................................................................................................................... 95

6.3.4. Power supply .......................................................................................................................................... 95

6.3.5. Environment / protect against water ......................................................................................................... 95

6.3.6. Recommended light conditions. ............................................................................................................... 95

6.3.7. Protect the optical components ................................................................................................................ 95

6.3.8. Mechanical loads .................................................................................................................................... 95

6.3.9. Camera / lens cleaning............................................................................................................................ 95

6.3.10. Protect against static discharge (ESD) ...................................................................................................... 95

6.3.11. Safety instructions for board level cameras ............................................................................................... 96

6.4. Warranty ......................................................................................................................................................... 96

6.5. Disclaimer of Warranty ..................................................................................................................................... 96

6.6. List Of Trademarks .......................................................................................................................................... 97

6.7. Standard Terms & Conditions of XIMEA GmbH ................................................................................................... 97

6.8. Copyright ...................................................................................................................................................... 101

6.9. Revision History ............................................................................................................................................. 102

7. Glossary ................................................................................................................................................................. 103

8. list of figures .......................................................................................................................................................... 104

9. list of tables ........................................................................................................................................................... 106

xiB & xiB-64 - Technical Manual Version 1.06

Industry standard interface

Off the shelf components can be used – no ‘frame grabber’

Optional EF lens mount

Canon lenses controllable from software (focus and aperture)

Small

Fits into places where no other camera can fit

Powerful

Up to 64Gb/s (xiB-64)

Fast

High speed, high frame rate: up to 3500+fps (depending on the camera model)

Robust

Full metal housing, no sheet metal covers

Connectivity

Programmable opto-isolated I/O, and non-isolated digital input and output. 4 status LEDs

Compatibility

Support for Windows, Linux and MacOS, various Image Processing Libraries

Software interfaces

GenICam / GenTL and highly optimized xiAPI SDK

Economical

Excellent value and price, low TCO and fast ROI

Low latency

Computer CPU not involved in data transfer, latency from camera to memory is low

2. xiB Camera Series

Figure 2-1 xiB and xiB-64 camera with heat sinks.

2.1. What is xiB

xiB [

ksi-bee: or sai-bee:]

• Small footprint

• High speed computer interface

• Sensors for xiB: 12, 20, and 50 Mpixel CMOSIS CMOS sensors

• Sensors for xiB-64: 1, 12 Mpixel CMOSIS and Luxima CMOS sensors

• frame rates: 50 MP @ 30 fps to 1 MP @ 3,500+ fps

The XiB camera line uses a PCI Express (PCIe) computer interface which eliminates the need for a framegrabber. Currently, PCIe generations 2 and 3 are implemented for the xiB and xiB-64 camera lines. As a result, low latency communication between the camera head and host computer is achieved. Direct Memory Access (DMA) engine is utilized for data transfer between the camera and PC memory, reducing the CPU load to almost negligible values compared to other protocols.

Off the shelf hardware can be used for camera to computer interfaces, but testing was limited to the items discussed in this manual. See section 3.10 - 3.12 for materials needed to interface your camera to the computer. Both copper (10m) and fiber optic (>100m) cables are available for interfaces.

2.2. Advantages

is a compact PCI express Industrial camera family with outstanding features:

table 2-1, advantages

xiB & xiB-64 - Technical Manual Version 1.06

Sensor Technology

CMOS, Global shutter

Acquisition Modes

Continuous, software and hardware trigger, limited fps, triggered exposure and burst, exposure controlled by trigger length

Partial Image Readout

ROI, Skipping and Binning modes supported (model specific)

Image data formats

8, 10 or 12 bit RAW pixel data

Color image processing

Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS

Hot/blemish pixels correction

On camera storage of more than 5000 pixel coordinates, host assisted correction

Auto adjustments

Auto white balance, auto gain, auto exposure

Flat field corrections

Host assisted pixel level shading and lens corrections

Image Data and Control Interface

iPass external PCIe connector (Gen2 x4 for xiB, and Gen3 x8 for xiB-64)

General Purpose I/O

2x opto-isolated input, 2x opto-isolated output, and 4 non-isolated I/O, 4X user configurable LEDs

Signal conditioning

Programmable debouncing time

Synchronization

Hardware trigger input, software trigger, exposure strobe output, busy output, ..

Housing and lens mount

Optional Canon EF mount available

Power requirements

12-24V input, 9-29W

Environment

Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 60°C storage Ingress Protection: IP40

Operating systems

Windows 10 (x86 and x64), Linux Ubuntu, MacOS 10.8

Software support

xiAPI SDK, adapters and drivers for various image processing packages

Firmware updates

Field firmware updatable

2.3. PCI Express Vision Camera Applications

• Automation

• High speed inspection

• Ultra-fast 3D scanning

• Material and Life science microscopy

• Ophthalmology and Retinal imaging

• Broadcasting

• Fast process capture, e.g. golf club swings

• Aerial Imaging

2.4. Common features

table 2-2, common features

Note: 1) Power consumption is model specific

xiB & xiB-64 - Technical Manual Version 1.06

2.5. Model Nomenclature

Part number convention for the different models:

xiB family CBxxxyG-zz

xiB-64 family CBxxxyG-zz-X8G3

CB xiB and xiB-64 family name xxx: Resolution in 0.1 MPixel. E.g. 1.3 MPixel Resolution: xxx = 013 y: y=C: color model

y=M: black & white model y=R: black & white, Infrared-extended model

G: Global shutter (all xiB & xiB-64 cameras are global shutter) zz: Vendor of the sensor

zz = CM: CMOSIS zz = LX: Luxima

xiB & xiB-64 - Technical Manual Version 1.06

Model Resolution

Pixel size

ADC [bit]

Sensor

diagonal

FPS

CB120MG-CM

b/w

4096 x 3072

5.5 µm

8/10/12

60 dB

28.1 mm

133

CB120CG-CM

Color

CB120RG-CM

b/w NIR

CB200MG-CM

b/w

5120 x 3840

6.4 µm

66 dB

41 mm

CB200CG-CM

Color

CB500MG-CM

b/w

7920 x 6004

4.6 µm

64 dB

45.6 mm

CB500CG-CM

Color

CB013MG-LX-X8G3

b/w

1280 x 864

13.7 µm

60 dB

21.1 mm

3500+ CB013CG-LX-X8G3

Color

CB019MG-LX-X8G3

b/w

1920 x 1080

10.0 µm

60 dB

22 mm

2500

CB019CG-LX-X8G3

Color

CB120MG-CM-X8G3

b/w

4096 x 3072

5.5 µm

8/10/12

60 dB

28.1 mm

330

CB120CG-CM-X8G3

Color

CB120RG-CM-X8G3

b/w NIR

2.6. Models Overview, sensor and models

table 2-3, models overview

Note: 1) Full resolution, RAW8 format

2.7. Options

Most models are available as a board level version, please inquire The Canon EF mount allows control of focus and aperture settings via software.

xiB & xiB-64 - Technical Manual Version 1.06

Item P/N

Description

MECH-60MM-BRACKET-T

xiB series tripod mounting bracket

MECH-60MM-EF-ADAPTER-KIT

xiB / xiT Canon EF-Mount Adapter

MECH-60MM-HEATSINK-KIT1

xiB Heatsink kit

CB-X8G3-FAN-COOLER-KIT1

xiB-64 Heatsing Fan Cooler with Screws Kit

LA-C-MNT-60MM-KIT

C-mount lens adapter kit without filter glass

LA-C-MNT-60MM-BK7-KIT

C-mount lens adapter kit with BK7 filter glass

LA-C-MNT-60MM-IR650-KIT

C-mount lens adapter kit with IR650 filter glass

CBL-CB-PWR-SYNC-3M0

3.0m xiB series I/O Sync and power cable

CBL-MT-PWR-SYNC-3M0

3.0m xiT/xiB-64 series I/O Sync and AUX power cable

PEX4-G2-COP

PCIe Gen.2 x4 extender host adapter for copper cables

PEX4-G2-COP-X2

PCIe Gen.2 x4 extender host adapter for copper cables, 2 ports.

PEX4-G2-FIB

PCIe Gen.2 x4 extender host adapter for fiber optics cables

PEX8-G3-X1-DOL

PCIe Gen.3 x8 extender host adapter for copper and fiber optics cables

PEX8-G3-X2-OSS

PCIe Gen.3 x8 dual port extender host adapter for copper and fiber optics cables

CBL-PCI-COP-1M0

1.0m PCIe Gen.2 x4, copper cable

CBL-PCI-COP-3M0

3.0m, PCIe Gen.2 x4, copper cable

CBL-PCI-COP-5M0

5.0m, PCIe Gen.2 x4, copper cable

CBL-PCI-COP-7M0

7.0m, PCIe Gen.2 x4, copper cable

CBL-PCI-FIB-10M0

10.0m, PCIe Gen.2 x4, fiber optics cable

CBL-PCI-FIB-20M0

20.0m, PCIe Gen.2 x4, fiber optics cable

CBL-PCI-X8G3-COP-3M0

3.0m PCIe Gen.3 x8, copper cable

CBL-PCI-FIB-10M0

10.0m PCIe Gen.2 x4, optical cable

CBL-PCI-FIB-20M0

20.0m PCIe Gen.2 x4, optical cable

CBL-PCI-X8G3-FIB-10M0

10.0m PCIe Gen.3 x8 optical cable

CBL-PCI-X8G3-FIB-20M0

20.0m PCIe Gen.3 x8 optical cable

BACS30M-24-C8

power supply (30W)

BACS60M-24-C8

xiB series power supply (60W, 24V)

Item P/N

Description

A-CB-X8G3-FAN-COOLER-KIT

Assembly Service for CB-X8G3-FAN-COOLER-KIT

A-MECH-60MM-EF-ADAPTER-KIT

Assembly Service for MECH-60MM-EF-ADAPTER-KIT

A-MECH-60MM-HEATSINK-KIT

Assembly Service for MECH-60MM-HEATSINK-KIT

A-LA-C-MNT-60MM-KIT

Assembly Service for LA-C-MNT-60MM-xxx-KIT

2.8. Accessories

The following accessories are available:

table 2-4, accessories

Notes: 1) This kits are sold separately, however it is possible to order assembling during production. These assemblies are sold separately. Additional assemblies purchased along with a camera can be added to the order at time of purchase for assembly with camera head. See table 2-5

table 2-5, assembly options

xiB & xiB-64 - Technical Manual Version 1.06

Description

Value

Optimal ambient temperature operation

+10 to +25 °C

Ambient temperature operation

+0 to +50 °C

Ambient temperature for storage and transportation

-25 to +70 °C

Relative Humidity, non-condensing

80 %

Description

Value

Interpolation

Proprietary

White balance coefficients ranges

0.0 to 3.9

Sharpness filter

-400 to 400 %

Gamma

0.3 to 1.0

Full color correction matrix (3+1)x3 coefficients ranges

-3.9 to 3.9

3. Hardware Specification

3.1. Power Supply

The xiB and xiB-64 cameras are powered via their respective sync cables (CBL-CB-PWR-SYNC-3M0 (xiB) and CBL-MT-PWRSYNC-3M0 (xiB-64)). See section 3.8 xiB, xiB-64 PCIe Interface for details on the camera connector and input requirements.

The power required to run the camera varies on the camera model from 9-29W. Ximea sells a power supply to run the cameras. PN: BACS30M-24-C8 or BACS60M-24-C8.

3.2. General Specification

3.2.1. Environment

table 3-1, environment

Housing temperature must not exceed +65°C. The following parameters are not guaranteed if the camera is operated outside the optimum range:

• Dark current

• Dynamic Range

• Linearity

• Acquisition and readout noise

• S/N ratio, durability

3.2.2. Firmware / Host driver / API features

table 3-2, firmware / API features

More details on API/SDK features are available at XIMEA support pages: http://www.ximea.com/support

xiB & xiB-64 - Technical Manual Version 1.06

3.3. Lens Mount

The xiB & xiB-64cameras are compatible with the Canon EF mount.

figure 3-1, xiB camera with/without the optional EF-Mount Adapter

The cameras are optionally delivered with or without outer EF-Mount Adapter. Note: The distance between the outer EF-Mount Adapter and the active sensor surface is 44 mm and when no EF-Mount

Adapter is included it is 13.4 mm.

Cameras with 4/3” or smaller sensor format can also be equipped with C-mount lens adapter.

xiB & xiB-64 - Technical Manual Version 1.06

3.4. Mounting points

Mounting points available to the customer are shown below. All are M4 thread. Four mounting points at the front panel are used for the EF-mount adapter when installed.

Figure 3-2, drawing demonstrating the mounting hole positions. Camera shown without EF mount.

3.5. Optical path

No filter glass is added by Ximea. All windows are applied by the sensor vendor – see sensor vendor data sheets for optical path details.

xiB & xiB-64 - Technical Manual Version 1.06

xiB model

CB120CG-CM

CB120MG-CM

CB120RG-CM

Sensor parameter

Part number

CMV12000-2E5C1PA

CMV12000-2E5M1PA

CMV12000-2E12M1PA

Color filter

RGB Bayer mosaic

None

Type

Global shutter

Pixel Resolution (W x H) [pixel]

4096 x 3072

Active area size (W x H) [mm]

22.5 x 16.9mm

Sensor diagonal [mm]

28.16mm

Optical format [inch]

1”

Pixel Size [µm]

5.5µm

ADC resolution [bit]

8, 10, 12

FWC [ke-]

13.5

Dynamic range [dB]

SNR Max [dB]

TBD

Conversion gain [e-/LSB12]

TBD

Dark noise [e-]

TBD

Dark current [e-/s]

22 @ RT 10-bit mode

DSNU [e-]

2 in 10-bit mode

PRNU %

<1.27%

Linearity [%]

TBD

Shutter efficiency

1/50,000

Micro lenses

Yes

Camera parameters

Digitization [bit]

8, 10, 12

Supported bit resolutions [bit/pixel]

8, 9, 10, 11, 12, 16

Exposure time (EXP)

0.019 – 3500 ms

Variable Gain Range (VGA) [dB]

0-12dB

Refresh rate (MRR) [fps]

133/103/86 at 8/10/12 bit

Power consumption

Stand by [W]

7.39

Maximum [W]

9.9

Dimensions/Mass

height [mm]

width [mm]

depth [mm]

36 (w/o EF-Mount Adapter)

mass [g]

159 (w/o EF-Mount Adapter)

3.6. Model Specific Characteristics

3.6.1. CB120xG-CM

3.6.1.1. Sensor and camera parameters

table 3-3, CB120xG-CM, sensor and camera parameters

Notes: 1) Analog gain has only discrete steps.

2) Measured at 24V with connected 10m fiber optical PCIe cable CBL-PCI-FIB-10M0. Optical cable consumption is about 1.25W.

xiB & xiB-64 - Technical Manual Version 1.06

Binning/skipping

pixels

Bit/px

fps

1x1/1x1

4096 x 3072

133

1x1/2x2

2048 x 1536

446

2x2/1x1

2048 x 1536

200

1x1/1x1

4096 x 3072

110

1x1/2x2

2048 x 1536

446

2x2/1x1

2048 x 1536

267

1x1/1x1

4096 x 3072

1x1/2x2

2048 x 1536

443

2x2/1x1

2048 x 1536

267

10%

20%

30%

40%

50%

60%

350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050

Quantum Efficiency (%)

Wavelength (nm)

CMV12000 - Spectral Response

Monochrome Red Bayer Green Bayer Blue Bayer NIR

table 3-4, CB120xG-CM, standard readout modes

3.6.1.2. Quantum efficiency curves [%]

figure 3-3, CMV12000-mono, color and NIR, quantum efficiency curve, ©CMOSIS

xiB & xiB-64 - Technical Manual Version 1.06

3.6.1.3. Dimensional drawings CB120xG-CM

figure 3-4, dimensional drawing CB120xG-CM

figure 3-5, dimensional drawing CB120xG-CM, with EF-mount adapter

xiB & xiB-64 - Technical Manual Version 1.06

feature

Note

Binning

Yes 2x2

Skipping

Yes 2x2

ROI

Vertical cropping results in increased read speed, horizontal reduces data transfer

HW Trigger

Trigger with overlap (see 4.3.2 Trigger controlled Acquisition/Exposure)

HDR

Not available

3.6.1.4. Referenced documents

CMOSIS datasheet CMV12000 datasheet v2.11

3.6.1.5. Sensor features

table 3-5, sensor features available

xiB & xiB-64 - Technical Manual Version 1.06

xiB model

CB200CG-CM

CB200MG-CM

Sensor parameter

Part number

CMV20000-1E5C1PA

CMV20000-1E5M1PA

Color filter

RGB Bayer mosaic

None

Type

Global shutter

Pixel Resolution (W x H) [pixel]

5120 x 3840

Active area size (W x H) [mm]

32.8 x 24.6mm

Sensor diagonal [mm]

40.96mm

Optical format

Full frame

Pixel Size [µm]

6.4µm

ADC resolution [bit]

FWC [ke-]

Dynamic range [dB]

SNR Max [dB]

TBD

Conversion gain [e-/LSB12]

TBD

Dark noise [e-]

TBD

Dark current [e-/s]

125e-/s @ RT

DSNU [e-]

PRNU %

TBD

Linearity [%]

TBD

Shutter efficiency

1/50,000

Micro lenses

Yes

Camera parameters

Digitization [bit]

Supported bit resolutions [bit/pixel]

8, 9, 10, 11, 12, 16

Exposure time (EXP)

0.094 – 1050 ms

Variable Gain Range (VGA) [dB]

0- 2.551

Refresh rate (MRR) [fps]

32 @ 12 bit

Power consumption

Stand by [W]

6.6

Maximum [W]

9.0

Dimensions/Mass

height [mm]

width [mm]

depth [mm]

38 (w/o EF mount)

mass [g]

164 (w/o EF mount)

3.6.2. CB200xG-CM

3.6.2.1. Sensor and camera parameters

table 3-6, CB200xG-CM, sensor and camera parameters

Notes: 1) Analog gain has only several discrete steps.

2) Measured at 24V with connected 10m fiber optical PCIe cable CBL-PCI-FIB-10M0. Optical cable consumption is about 1.25W.

xiB & xiB-64 - Technical Manual Version 1.06

Binning/skipping

pixels

Bit/px

fps

1x1/1x1

5120 × 3840

8, 10, 12

32.5

10%

20%

30%

40%

50%

60%

70%

350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050

Quantum Efficiency (%)

Wavelength (nm)

CMV20000 - Spectral Response

Monochrome Red Bayer Green Bayer Blue Bayer

table 3-7, CB200xG-CM, standard readout modes

3.6.2.2. Quantum efficiency curves [%]

figure 3-6, CMV20000 mono and color, quantum efficiency curve, ©CMOSIS

xiB & xiB-64 - Technical Manual Version 1.06

3.6.2.3. Dimensional drawings CB200xG-CM

figure 3-7, dimensional drawing CB200xG-CM with EF-mount adapter

figure 3-8, dimensional drawing CB200xG-CM with EF-mount adapter

xiB & xiB-64 - Technical Manual Version 1.06

feature

Note

Binning

Skipping

ROI

Vertical cropping results in increased readout speed, horizontal reduces data transfer

HW Trigger

Trigger without overlap usable (see 4.3.2 Trigger controlled Acquisition/Exposure)

HDR

Supported

3.6.2.4. Referenced documents

CMOSIS datasheet CMV20000 v2.3_2

3.6.2.5. Sensor features

table 3-8, sensor features available

xiB & xiB-64 - Technical Manual Version 1.06

xiB model

CB500CG-CM

CB500MG-CM

Sensor parameter

Part number

CMV50000-1E3C1PA

CMV50000-1E3M1PA

Color filter

RGB Bayer mosaic

None

Type

Global shutter

Pixel Resolution (H × W) [pixel]

7920 x 6004

Active area size (H × W) [mm]

36.4 x 27.6

Sensor diagonal [mm]

45.72

Optical format [inch]

Slightly bigger than ‘full frame’

Pixel Size [µm]

4.6

ADC resolution [bit]

FWC [ke-]

14.5

Dynamic range [dB]

SNR Max [dB]

41.6

Conversion gain [e-/LSB12]

TBD

Dark noise [e-]

8.8

Dark current [e-/s]

DSNU [e-]

24.5

PRNU %

<1.0

Linearity [%]

TBD

Shutter efficiency 1/PLS

1/18000

Micro lenses

yes

Camera parameters

Digitization [bit]

Supported bit resolutions [bit/pixel]

8, 9, 10, 11, 12, 16

Exposure time (EXP)

TBD

Variable Gain Range (VGA) [dB]

0-12

Refresh rate (MRR) [fps]

32 @ 8-bit/pixel

Power consumption

typical [W]

Maximum [W]

9.5

Mechanical

height [mm]

width [mm]

depth [mm]

37.8 (w/o EF mount)

weight [g]

170 (w/o EF mount)

3.6.3. CB500xG-CM

3.6.3.1. Sensor and camera parameters

table 3-9, CB500xG-CM, sensor and camera parameters

Notes: 1) Analog gain has only several discrete steps.

xiB & xiB-64 - Technical Manual Version 1.06

Binning/skipping

pixels

Bit/px

fps

1x1/1x1

7920 × 6004

30.9

1x1/1x1

7920 × 6004

28.9

1x1/1x1

7920 × 6004

24.1

1x1/1x2

7920 × 3002

60.5

1x1/1x2

7920 × 3002

57.1

1x1/1x2

7920 × 3002

47.9

1x1/2x2

3960 × 3000

61.4

1x1/2x2

3960 × 3000

61.4

1x1/2x2

3960 × 3000

61.4

2x2/1x1

3960 × 3000

30.8

2x2/1x1

3960 × 3000

30.8

2x2/1x1

3960 × 3000

30.8

10%

20%

30%

40%

50%

60%

70%

350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050

Quantum Efficiency (%)

Wavelength (nm)

CMV50000 - Spectral Response

Monochrome Red Bayer Green Bayer Blue Bayer

table 3-10, CB500xG-CM, standard readout modes

3.6.3.2. Quantum efficiency curves [%]

figure 3-9 CMV50000 Quantum Efficiency ©CMOSIS

xiB & xiB-64 - Technical Manual Version 1.06

3.6.3.3. Dimensional drawings CB500xG-CM (with and without EF mount)

figure 3-10, dimensional drawing CB500xG-CM w/o EF-mount adapter

figure 3-11, dimensional drawing CB500xG-CM with EF-mount adapter

xiB & xiB-64 - Technical Manual Version 1.06

feature

Note

Binning

Yes, 2x2

Skipping

Yes, 2x2

ROI

Vertical cropping results in increased read speed, horizontal reduces data transfer

HW Trigger

Trigger with overlap usable (see 4.3.2 Trigger controlled Acquisition/Exposure)

HDR

Not available

3.6.3.4. Referenced documents

CMOSIS Datasheet CMV50000 v0.11

3.6.3.5. Sensor features

table 3-11, sensor features available

xiB & xiB-64 - Technical Manual Version 1.06

xiB-64 model

CB013CG-LX-X8G3

CB013MG-LX-X8G3

Sensor parameter

Part number

LUX13HSC

LUX13HSM

Color filter

RGB Bayer mosaic

None

Type

Global shutter

Pixel Resolution (W x H) [pixel]

1280 × 864

Active area size (W x H) [mm]

17.5 × 11.8

Sensor diagonal [mm]

21.2

Optical format [inch]

4/3”

Pixel Size [µm]

13.7

ADC resolution [bit]

FWC [ke-]

Dynamic range [dB]

SNR Max [dB]

TBD

Conversion gain [e-/LSB12]

TBD

Dark noise [e-]

Dark current [e-/s]

TBD

DSNU [e-]

TBD

PRNU %

<1.5

Linearity [%]

TBD

Shutter efficiency 1/PLS

TBD

Micro lenses

TBD

Camera parameters

Digitization [bit]

Supported bit resolutions [bit/pixel]

8, 9, 10, 11, 12, 16

Exposure time (EXP)

1µs – 1sec

Variable Gain Range (VGA) [dB]

0-18dB

Refresh rate (MRR) [fps]

3500 (10-bit)

Power consumption

typical [W]

TBD

Maximum [W]

TBD

Mechanical

height [mm]

width [mm]

depth [mm]

41 (w/o EF-mount adapter and active cooling)

weight [g]

268 (w/o EF-mount adapter and active cooling)

Binning/skipping

pixels

Bit/px

fps

1x1/1x1

1280 × 864

3500

3.6.4. CB013xG-LX-X8G3

3.6.4.1. Sensor and camera parameters

table 3-12, CB013xG-LX-X8G3, sensor and camera parameters

table 3-13, CB013xG-LX-X8G3, standard readout modes

xiB & xiB-64 - Technical Manual Version 1.06

10%

15%

20%

25%

30%

35%

400 450 500 550 600 650 700 750 800 850 900

Quantum Efficiency (%)

Wavelength (nm)

LUX13HS - Spectral Response

Monochrome

Red Bayer Green Bayer

Blue Bayer

3.6.4.2. Quantum efficiency curves [%]

figure 3-12, LUX13HS quantum efficiency chart ©Luxima

xiB & xiB-64 - Technical Manual Version 1.06

3.6.4.3. Dimensional drawings CB013xG-LX-X8G3

figure 3-13, dimensional drawing CB013xG-LX-X8G3 without EF-mount adapter

figure 3-14, dimensional drawing CB013xG-LX-X8G3 with EF-mount adapter and fan cooler unit

xiB & xiB-64 - Technical Manual Version 1.06

feature

Note

Binning

Skipping

ROI

Vertical cropping results in increased read speed, horizontal reduces data transfer

HW Trigger

Trigger with overlap usable (see 4.3.2 Trigger controlled Acquisition/Exposure)

HDR

Not available

3.6.4.4. Referenced documents

Luxima Datasheet LUX13_HS_Datasheet_V2.3

3.6.4.5. Sensor features

table 3-14, sensor features available

xiB & xiB-64 - Technical Manual Version 1.06

xiB-64 model

CB019CG-LX-X8G3

CB019MG-LX-X8G3

Sensor parameter

Part number

LUX19HSC

LUX19HSM

Color filter

RGB Bayer mosaic

None

Type

Global shutter

Pixel Resolution (W x H) [pixel]

1920 × 1080

Active area size (W x H) [mm]

19.2 × 10.8

Sensor diagonal [mm]

22.0

Optical format [inch]

4/3”

Pixel Size [µm]

ADC resolution [bit]

FWC [ke-]

Dynamic range [dB]

SNR Max [dB]

TBD

Conversion gain [e-/LSB12]

TBD

Dark noise [e-]

Dark current [e-/s]

TBD

DSNU [e-]

TBD

PRNU %

<1.5

Linearity [%]

TBD

Shutter efficiency 1/PLS

TBD

Micro lenses

TBD

Camera parameters

Digitization [bit]

Supported bit resolutions [bit/pixel]

8, 9, 10, 11, 12, 16

Exposure time (EXP)

1µs – 1sec

Variable Gain Range (VGA) [dB]

0-18dB

Refresh rate (MRR) [fps]

3500 (10-bit)

Power consumption

typical [W]

TBD

Maximum [W]

TBD

Mechanical

height [mm]

width [mm]

depth [mm]

41 (w/o EF-mount adapter and active cooling)

weight [g]

268 (w/o EF-mount adapter and active cooling)

Binning/skipping

pixels

Bit/px

fps

1x1/1x1

1920 × 1080

2500

3.6.5. CB019xG-LX-X8G3

3.6.5.1. Sensor and camera parameters

table 3-15, CB019xG-LX-X8G3, sensor and camera parameters

table 3-16, CB019xG-LX-X8G3, standard readout modes

xiB & xiB-64 - Technical Manual Version 1.06

3.6.5.2. Quantum efficiency curves [%]

TBD

figure 3-15, LUX19HS quantum efficiency chart ©Luxima

xiB & xiB-64 - Technical Manual Version 1.06

3.6.5.3. Dimensional drawings CB019xG-LX-X8G3

figure 3-16, dimensional drawing CB019xG-LX-X8G3 without EF-mount adapter

figure 3-17, dimensional drawing CB019xG-LX-X8G3 with EF-mount adapter and fan cooler unit

xiB & xiB-64 - Technical Manual Version 1.06

feature

Note

Binning

Skipping

ROI

Vertical cropping results in increased read speed, horizontal reduces data transfer

HW Trigger

Trigger with overlap usable (see 4.3.2 Trigger controlled Acquisition/Exposure)

HDR

Not available

3.6.5.4. Referenced documents

Luxima Datasheet LUX19_HS_Datasheet_V2.3

3.6.5.5. Sensor features

table 3-17, sensor features available

xiB & xiB-64 - Technical Manual Version 1.06

xiB model

CB120CG-CM-X8G3

CB120MG-CM-X8G3

CB120RG-CM-X8G3

Sensor parameter

Part number

CMV12000-2E5C1PA

CMV12000-2E5M1PA

CMV12000-2E12M1PA

Color filter

RGB Bayer mosaic

None

Type

Global shutter

Pixel Resolution (W x H) [pixel]

4096 x 3072

Active area size (W x H) [mm]

22.5 x 16.9mm

Sensor diagonal [mm]

28.16mm

Optical format [inch]

1”

Pixel Size [µm]

5.5µm

ADC resolution [bit]

8, 10, 12

FWC [ke-]

13.5

Dynamic range [dB]

SNR Max [dB]

TBD

Conversion gain [e-/LSB12]

TBD

Dark noise [e-]

TBD

Dark current [e-/s]

22 @ RT 10-bit mode

DSNU [e-]

2 in 10-bit mode

PRNU %

<1.27%

Linearity [%]

TBD

Shutter efficiency 1/PLS

1/50,000

Micro lenses

Yes

Camera parameters

Digitization [bit]

8, 10, 12

Supported bit resolutions [bit/pixel]

8, 9, 10, 11, 12, 16

Exposure time (EXP)

0.019 – 3500 ms

Variable Gain Range (VGA) [dB]

0-12dB 1

Refresh rate (MRR) [fps]

330 at 8 bit

Power consumption

Stand by [W]

20.5

Maximum [W]

29.1

Mechanical

height [mm]

width [mm]

depth [mm]

36 (w/o EF mount)

weight [g]

TBD

3.6.6. CB120xG-CM-X8G3

3.6.6.1. Sensor and camera parameters

table 3-18, CB120xG-CM-X8G3, sensor and camera parameters

Notes: 1) Analog gain has only several discrete steps.

2) Measured at 24V with connected 10m fiber optical PCIe cable CBL-PCI-X8G3-FIB-10M0. Optical cable consumption is about 2.5W

xiB & xiB-64 - Technical Manual Version 1.06

Binning/skipping

pixels

Bit/px

fps

1x1/1x1

4096 x 3072

330

1x1/2x2

2048 x 1536

791

2x2/1x1

2048 x 1536

251

1x1/1x1

4096 x 3072

296

1x1/2x2

2048 x 1536

1049

2x2/1x1

2048 x 1536

267

1x1/1x1

4096 x 3072

130

1x1/2x2

2048 x 1536

528

2x2/1x1

2048 x 1536

267

10%

20%

30%

40%

50%

60%

350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050

Quantum Efficiency (%)

Wavelength (nm)

CMV12000 - Spectral Response

Monochrome Red Bayer Green Bayer Blue Bayer NIR

table 3-19, CB120xG-CM-X8G3, standard readout modes

3.6.6.2. Quantum efficiency curves [%]

figure 3-18, CMV12000-mono, color and NIR, quantum efficiency curve, ©CMOSIS

xiB & xiB-64 - Technical Manual Version 1.06

3.6.6.3. Dimensional drawings CB120xG-CM-X8G3

figure 3-19, dimensional drawing CB120xG-CM-X8G3 without EF-mount adapter

figure 3-20, dimensional drawing CB120xG-CM-X8G3 with EF-mount adapter and fan cooler unit

xiB & xiB-64 - Technical Manual Version 1.06

feature

Note

Binning

Yes 2x2

Skipping

Yes 2x2

ROI

Vertical cropping results in increased read speed, horizontal reduces data transfer

HW Trigger

Trigger with overlap (see 4.3.2 Trigger controlled Acquisition/Exposure)

HDR

Not available

3.6.6.4. Referenced documents

CMOSIS datasheet CMV12000 datasheet v2.11

3.6.6.5. Sensor features

table 3-20, sensor features available

xiB & xiB-64 - Technical Manual Version 1.06

LED

Color

Defaults

Note 1 Green

User configurable

Red

Exposure active

User configurable

Blue

Frame active

User configurable

Orange

Off

User configurable

LED

Color

Defaults

Blink

Off

Green

PCIe Lanes

x4 or x2

Link down

Red

PCIe Clock Present

–

PCIe Clock OK

No PCIe Clock

Blue

PCIe Clock Present

–

PCIe Clock OK

No PCIe Clock

Orange

PCIe Link Speed

Gen2

Gen1

Link down

LED

Color

Defaults

Blink

Off

Green

PCIe Lanes

x4 or x2 or x1

Link down

Red

PCIe Clock Present

–

PCIe Clock OK

No PCIe Clock

Blue

PCIe Clock Present

–

PCIe Clock OK

No PCIe Clock

Orange

PCIe Link Speed

Gen3

Gen1

Link down

3.7. User interface – LEDs

Four status LEDs are located on the back of the cameras, please see below.

figure 3-21, position status LEDs

The LEDs are programmable. Please note the following description:

table 3-21, LED output description after camera is opened in API

After camera has been connected in system the LEDs are showing PCIe link status. The meaning differs between xiB and xiB-64 slightly.

table 3-22, LED output description after computer boot up xiB.

table 3-23, LED output description after computer boot up xiB-64

xiB & xiB-64 - Technical Manual Version 1.06

Camera family

Connector

Signals

Mating parts

xiB

Molex - 75586-0010

PCI express

Cable assembly from Molex, Samtec

xiB-64

Molex – 75586-0002

PCI express

Cable assembly from Molex, Samtec

iPass connector

3.8. xiB, xiB-64 PCIe Interface

table 3-24, PCI express mating connector description

The iPassTM connector is used for high speed data transmission. Please note that many computers do not initialize PCIe buses that do not have devices plugged in upon boot. The camera needs

to be plugged in with power when the computer is booted up before use.

3.8.1. iPass

Connector Location

figure 3-22, position iPassTM connector

It is important that the power is turned off when inserting/detaching the cable. General ESD precautions need to be applied. Failing this requirement may lead to camera damage.

xiB & xiB-64 - Technical Manual Version 1.06

Connector

Signals

Mating Connectors

xiB I/O & Power 12-pin Hirose HR25-9TR-12SA(71)

Opto-isolated trigger input and non-isolated I/O plus camera power

Hirose HR25-9TP-12P (connector on cable side) Ximea PN: CBL-CB-PWR-SYNC-3M0 for 3m cable

xiB-64 I/O & Power 12-pin Alysium 60-30-1112

Opto-isolated trigger input and non-isolated I/O plus camera power

Alysium 60-41-1012, 60-41-1112,60-01-1012, 60-01-1112, 60-03-1012, 60-03-1112 Ximea PN: CBL-MT-PWR-SYNC-3M0 for 3m cable

IO/power connector

3.9. Digital Input / Output (GPIO) Interface and Power

PCIe xiB & xiB-64 cameras use the 12-pin connector for the GPIO interface and power. There are several input and output lines (both optically isolated and non-isolated). The xiB and xiB-64 do not use the same connector (though both are 12-pin).

table 3-25, GPIO mating connector description

3.9.1. Location

IO and power interface receptacle is located on the underside of the camera:

figure 3-23, position GPIO + power connector

It is important that the power is turned off when inserting/detaching the cable. General ESD precautions need to be applied. Failing this requirement may lead to camera damage.

3.9.2. IO Connector Pinning

xiB

figure 3-24, xiB IO connector pinout

xiB & xiB-64 - Technical Manual Version 1.06

Name

Signal

Technical description

GND

External grounds for power and non-isolated I/O

2 AUX PWR

Power supply input

12-24V

IN1

Opto-isolated Input 1

(<0.8 Low; 4-24 High)

IN2

Opto-isolated Input 2

(<0.8 Low; 4-24 High)

IN GND

Ground for Opto-Isolated Inputs (IN1, IN2)

6 INOUT1

Non-isolated I/O

LVTTL(3.3, 50µA)

INOUT2

Non-isolated I/O

LVTTL(3.3, 50µA)

OUT1

Opto- isolated Output 1

Open collector

OUT2

Opto- isolated Output 2

Open collector

OUT GND

Ground for Opto-Isolated Out (OUT1, OUT2)

INOUT3

Non-isolated I/O

LVTTL(3.3, 50µA)

INOUT4

Non-isolated I/O

LVTTL(3.3, 50µA)

Name

Signal

Technical description

IN2

Opto-isolated Input 2

(<0.8 Low; 4-24 High)

IN1

Opto-isolated Input 1

(<0.8 Low; 4-24 High)

OUT2

Opto-isolated Output 2

Open collector

OUT1

Opto-isolated Output 1

Open collector

AUX PWR

Power supply input

12-24V

GND

External grounds for power and non-isolated I/O

7 INOUT1

Non-isolated I/O

LVTTL(3.3, 50µA)

INOUT3

Non-isolated I/O

LVTTL(3.3, 50µA)

INOUT2

Non-isolated I/O

LVTTL(3.3, 50µA)

IN GND

Ground for Opto-Isolated Inputs (IN1, IN2)

OUT GND

Ground for Opto-Isolated Out (OUT1, OUT2)

INOUT4

Non-isolated I/O

LVTTL(3.3, 50µA)

I/O connector Pin Assignment:

table 3-26, xiB I/O connector Pin Assignment

xiB-64

figure 3-25, xiB-64 IO connector pinout

I/O connector Pin Assignment:

table 3-27, xiB-64 I/O connector Pin Assignment

xiB & xiB-64 - Technical Manual Version 1.06

GND

AUX_PWR

INOUT1

INOUT2

INOUT3 INOUT4

IN1

IN2

IN_GND

OUT1

OUT2

OUT_GND shield

It is recommended using twisted pair cables for both xiB & xiB-64 IOs. Each input and output should be twisted with its respective ground.

Figure 3-26 Recommended twisted pair configuration, xiB

3.9.3. Power input

The cameras require a DC input of +12 to +24V with a maximum of about 29W without lens control. Ximea offers a power supply which can plug into the CBL-CB-PWR-SYNC-3M0 or CBL-MT-PWR-SYNC-3M0 (power/sync cable) and provide DC power to the camera from an AC 120V-230V source.

xiB & xiB-64 - Technical Manual Version 1.06

Item

Parameter / note

Maximal input voltage

24V

Common pole

Effect of incorrect input terminal connection

Reverse voltage polarity protected

Effects when withdrawing/inserting input module under power

No damage, no lost data Maximum recommended cable length

Input level for logical 0

Voltage < 2.0V/Current 0mA to 0.3mA

Input level for logical 1

Voltage > 4.0V/Current 4mA to 6mA

Input debounce filter

Input delay – rising edge

1.7 +/-0.2µs (V

INPUT

=10V, T

AMBIENT

=25°C)

Input delay – falling edge

10.7 +/-0.2µs (V

INPUT

=10V, T

AMBIENT

=25°C)

Number of inputs

External trigger mapping

Yes

Input functions

Trigger, get current level (rising or falling edge are supported)

V-in-min [V]

V-in-max [V]

State

I-max [mA]

-24.0

2.0

Off (0)

0.0 – 0.3 mA (0mA nominal)

2.0

4.0

Transient

4.0

24.0

On (1)

4 – 6 mA (5mA nominal)

3.9.4. Optically isolated Digital Input

3.9.4.1. Optically isolated Digital Input - General info

table 3-28, Optically isolated digital input, general info Note: – 1) Propagation delay depends on voltage level, propagation jitter is significantly lower.

3.9.4.2. Digital Input – signal levels

Input levels are not IEC 61131-2, Type 1 as the ON state has been extended to support 5V TTL

table 3-29, digital info, signal levels

Note:

• Input level Vin represents amplitude of the input signal.

• Voltage levels referenced to common ground GND

xiB & xiB-64 - Technical Manual Version 1.06

VC C

D IG ITA L IN PUT

INPUT

FPG A _IN P UT

G ND ( Comm on I O Gr o un d)

62 0 R

10 0 R

10 K

49 K 9

GND

PLC Device

Input

Camera

GND (Common IO Ground)

Common

Output

Power Supply

3.9.4.3. Digital Input – Internal Schematic

The internal scheme of Digital Input signal flow inside the camera is below.

figure 3-27, digital input, interface schematic

3.9.4.4. Digital Input – Wiring

figure 3-28, digital input, interface wiring

xiB & xiB-64 - Technical Manual Version 1.06

Edge Type

Input Voltage [V]

Typ. delay [μs]

Rising 5 1.6

Rising

1.7

Falling 5 7.8

Falling

10.7

Falling

12.7

Item

Parameter / note

Maximal open circuit voltage

24V

Output port type

Open collector NPN

Protection

short-circuit / over-current / Reverse voltage

Protection circuit

PTC Resettable Fuse

Maximal sink current

25mA

Trip current

50mA – self restarting when failure mode current disconnected

Inductive loads

Effect of incorrect output terminal connection

Protected against reverse voltage connection

Maximal output dropout

1.7V, sink current 25mA

Number of outputs

Strobe output mapping

Yes

Output current

OFF -> ON

ON -> OFF

Note

2mA

0.55 µs

41 µs

OUTPUT

=5V, T

AMBIENT

=25°C

5mA

0.6 µs

43 µs

OUTPUT

=5V, T

AMBIENT

=25°C

10mA

0.88 µs

51 µs

OUTPUT

=11V, T

AMBIENT

=25°C

25mA

1.4 µs

51 µs

OUTPUT

=13V, T

AMBIENT

=25°C

3.9.4.5. Digital Input – Timing

Typical measured input delay between Digital Input to FPGA Input Measurements of input delays:

table 3-30, digital input, timing

Note: Measured at: Ambient Temperature 25°C

3.9.5. Optically isolated Digital Output

3.9.5.1. Optically isolated Digital Output - General info

table 3-31, Optically isolated digital output, general info

3.9.5.2. Optically isolated Digital Output Delay

xiB & xiB-64 - Technical Manual Version 1.06

Output state

Output switch state

Input state

Sourcing current

Pull up (energized)

OFF

Relaxing

Not energized

PTC Fuse

FPGA_OUTPUT

GND

10K

DIGITAL OUTPUT

GND (Common IO Ground)

Idrive=2mA

LOA D

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0 5 10 15 20 25 30

OUTPUT

(V)

OUTPUT

(mA)

Output Transfer Characteristic (Receptacle)

3.9.5.3. Optically isolated Digital Output – Internal schematic

Following scheme is the internal scheme of the Digital Output signal flow inside the camera.

figure 3-29, digital output, interface schematic

Output Transfer Characteristic When Output is in On state - typical transfer characteristic of output is as on following figure:

figure 3-30, digital output transfer characteristics

3.9.5.4. Digital Output – Wiring

Digital output has an open collector switching transistor with common IO Ground. In most cases a power source for external device must be provided.

Connecting Digital OUTPUT to a NPN-compatible PLC device input (biased)

xiB & xiB-64 - Technical Manual Version 1.06

Output state

Output switch state

Input state

Sourcing current

Pull down (energized)

OFF

Relaxing

Not energized

GND (Common IO Ground)

DIGITAL OUTPUT Common

PLC Device

Input

Camera

Power Supply

GND (Common IO Ground)

DIGITAL OUTPUT

Common

PLC Device

Input

Camera

Power Supply

GND (Common IO Ground)

DIGITAL OUTPUT IN-

PLC Device

IN+

Camera

Power Supply

figure 3-31, Connecting Digital OUTPUT to a NPN-compatible PLC device input (biased)

Important note:

• If using this configuration, take into account that Common Ground connection may be biased by power supply for Digital

Input!

Connecting Digital OUTPUT to a NPN-compatible PLC device input

This type of connection is possible only when opto-isolated input is used (bidirectional in some cases) or when only one general opto-isolated input is used.

figure 3-32, Connecting Digital OUTPUT to a NPN-compatible PLC device input - more bidirectional inputs used

Note:

• In this case a bidirectional opto-isolated input must be used

figure 3-33, Connecting Digital OUTPUT to a NPN-compatible PLC device - single input

xiB & xiB-64 - Technical Manual Version 1.06

Output state

Output switch state

Input state

Sinking current

Not energized

OFF

Relaxing

Pull up (energized)

psu input

input





psu

input

( ) ( )*

psu input input

P R V V I

GND (Common IO Ground)

DIGITAL OUTPUT

Common

PLC Device

Input

Camera

Power Supply

External pull up

Connecting Digital OUTPUT to a PNP-compatible device

figure 3-34, Connecting Digital OUTPUT to a PNP-compatible device

Pull up resistor can be calculated as follows:

Where:

power supply voltage. Must be higher than required input amplitude

required input amplitude

input driving current (corresponding to input amplitude)

Remember to use the appropriate resistor power rating

xiB & xiB-64 - Technical Manual Version 1.06

psu output led

led

V V V





psu

output

led

LED Colour

led

(typ.)

led

(max.)

Note

Standard Red

1.7V

2.1V Super Bright Red

1.85V

2.5V Low power Red

1.7V

2.0V Orange

2.0V

2.1V

Yellow

2.1V

2.2V Green

1.9V

2.5V

Emerald Green

2.1V

2.7V Blue

2.5V

3.7V White

2.8V

3.8V Infra-Red

1.3V

1.8V

Opto coupler

GND (Common IO Ground)

DIGITAL OUTPUT

Camera Power Supply

RLED

PSU

OUTPUT

Output Wiring Example: LED Driving

LED can be driven directly by camera digital output. A series resistor must be used to limit LED current.

figure 3-35, LED Driving

LED series resistor can be calculated by the following equation:

Where:

power supply voltage (5V to 24V)

voltage across digital output pins (see. 3.9.5.1 Optically isolated Digital Output - General info)

LED forward voltage (see table below)

LED current

Note:

• Remember to use the appropriate resistor power rating 

Typical LED forward voltage

󰇛

󰇜 





   󰇛



 



󰇜  



table 3-32, digital output, LED driving

xiB & xiB-64 - Technical Manual Version 1.06

GND (Common IO Ground)

DIGITAL OUTPUT

Camera

Power Supply

D RL

GND (Common IO Ground)

DIGITAL OUTPUT

Camera

Power Supply

Output Wiring Example: Inductive load (Relay) Driving

Do not connect inductive load RL directly to Camera Digital Output. A transistor must be used to prevent damage of the output. See image below for possible inductive load driving. Resistor R can be connected to Digital Outputs and power supply to provide the necessary bias current for transistor. You should also use an external diode to protect the transistor from over voltage while disconnecting an inductive load. Keep in mind that this connection has an inverted logic. Current will flow through the load at the start of the camera.

figure 3-36, Inductive load (Relay) Driving (inverted logic)

For positive logic you can use a second bipolar transistor.

figure 3-37, Inductive load (Relay) Driving (non-inverted logic)

xiB & xiB-64 - Technical Manual Version 1.06

Trigger polarity

Opto-isolated controller input

Output delay

Wiring

Description

Positive edge

Yes

0.5µs

figure 3-31

Negative edge

Yes

0.5µs

figure 3-33

Positive edge

155µs

figure 3-34

Not recommended in cases when short delay time is required. Output delay is much longer than in other wiring examples. Use external pull up in case that no pull up at controller input is used.

Negative edge

0.5µs

figure 3-34

Note that external pull up is not used in this case. Assume that internal pull up at the controller input is used.

Edge Type

Typ. delay [μs]

Off -> On

0.5

On -> Off

155

Output current

OFF->ON

ON->OFF

2mA

0.55μs

184μs

5mA

0.55μs

182μs

10mA

0.55μs

133μs

25mA

0.55μs

113μs

Output Wiring Example: Driving the trigger input of a strobe controller

The digital output can be used to drive a strobe controller according to the table below.

Driving the trigger input of a strobe controller

table 3-33, digital output, wiring examples

3.9.5.5. Digital Output – Timing

Typical input delay between FPGA Output to Digital Output

table 3-34, digital output, typical timing

Note: Measured at conditions: V

OUTPUT

=18V, T

Output delay depending on output current:

table 3-35, digital output, current depending timing

Note: Measured at conditions: V

OUTPUT

=11V, T

AMBIENT

=27°C

=25°C

xiB & xiB-64 - Technical Manual Version 1.06

Item

Parameter/note

Number of digital lines

4, each line can be configured by application separately as input or output

Maximum input voltage

24V DC

Common pole

Yes, AUX power GND

Effect of incorrect input terminal connection

Reverse voltage polarity protected

Effects when withdrawing/inserting input module under power

No damage, no lost data Protection

Short-circuit/over-current/reverse voltage

Maximal output sink current

30µA, maximum advised load = 60kΩ

Inductive loads

Output level logical 0

<0.4V, Load 100kΩ

Output level logical 1

>2.5V, Load100kΩ

Output delay – rising edge

400ns, Load 100kΩ, threshold 2V

Output delay - falling edge

450ns, Load 100kΩ, threshold 0.5V

Input impedance – minimum

15kΩ

Input level for logical 0

<0.7V

Input level for logical 1

>3.3V

Input debounce filter

Input delay – rising edge

750ns, V

INPUT

=5V,T

AMBIENT

=25°C

Input delay – falling edge1

1200ns, V

INPUT

=5V,T

AMBIENT

=25°C

Input functions

Trigger, get current level; Rising or falling edge are supported for trigger

Output functions

Off, On, Exposure active, Frame active; Signal inversion supported

Item

Parameter/note

Supported voltage range

12-24V

Typical input current1

0.38A – 1.2A, @24V while acquiring

Maximum input current

0.42A – 1.3A, @24V

Protection

Over/under voltage protection

FPGA GPIO

100R10k1k0

10p

100k

GNDGNDGND

INOUT

3.9.6. Non-isolated Digital Lines

Non isolated Digital lines can be used as inputs or outputs compatible with TTL logic. These are high impedance pins so when used as output high impedance slave input has to be used.

figure 3-38, non isolated input/output, interface schematic

3.9.6.1. Non-isolated Digital Input/Output (INOUT) General info

Table 3-36, General info for non-isolated digital in/out trigger lines.

NOTE 1) Because of low input impedance of non-isolated input it is not possible to connect master slave of two cameras directly. Signal conditioning (buffer, opamp…) is required

3.10. Power supply input (AUX PWR)

table 3-37, digital output, typical timing

NOTE 1) Measured at conditions: V=24V, T

=24°C Power consumption is model dependent please refer to paragraph 3.6.

AMBIENT

xiB & xiB-64 - Technical Manual Version 1.06

3.11. CBL-PCI-COP-xx/ CBL-PCI-FIB-xx

1.0m / 3.0m / 5.0m / 7.0m / 10m / 20m PCIe cables Ximea offers a selection of different PCIe cables to interface the camera to the host computer. PCIe cables can be purchased in

copper or fiber optic form. Longer lengths (up to 100m) can be achieved with the fiber optic option, since the copper cables are limited to 7.0m (to 3.0m for PCIe Gen 3). Both cables interface with a PCIe adapter board for your PC – see section 3.12. Get the latest information on available accessories at: https://www.ximea.com/en/pci-express-camera/pci-express-camera-cmv12000-

cmv20000

figure 3-39, CBL-PEX4-COP-xM0 PCIe Gen.2 x4, copper cable

Figure 3-40, CBL-PEX4-FIB-xM0, PCIe Gen.3 x4, fiber optics cable

Figure 3-41, CBL-PEX8-FIB-xM0, PCIe Gen.3 x8, fiber optics cable

xiB & xiB-64 - Technical Manual Version 1.06

Description

PEX4-G2-COP

PCIe Gen.2 x4 extender host adapter for copper cables, 1 port

PEX4-G2-COP-X2

PCIe Gen.2 x4 extender host adapter for copper cables, 2 ports.

PEX4-G2-FIB

PCIe Gen.2 x4 extender host adapter for fiber optics cables, 1 port

PEX8-G3-X1-DOL

PCIe Gen.3 x8 extender host adapter for copper and fiber optics cables

PEX8-G3-X2-OSS

PCIe Gen.3 x8 dual port extender host adapter for copper and fiber optics cables

3.12. PCIe host adapter cards

Ximea offers several host adapter cards. Please check our website for the latest information on available cards for your PC.

https://www.ximea.com/support/wiki/xib/PCIe_host_adapters

Currently there are the following cards available.

Figure 3-42 PEX4-G2-COP PCIe Gen.2 x4 extender host adapter for copper cables

table 3-38, host adapter cards

xiB & xiB-64 - Technical Manual Version 1.06

Item

Description

65-00-1112 IO Series 65 12 pin male circular plug

A11-8861-UL20276 5STP#30 + 10C#30 [OD=5mm] Black

Heat shrinkable tube

Stripped and tinned leads

DC power in socket female (OD5.5/ID2.1) black

Shield wire

Cable label

Signal

GND

AUX PWR

IN1

IN2 5 IN GND

INOUT1

INOUT2

OUT1

OUT2

OUT GND

INOUT3

INOUT4

3.13. CBL-CB-PWR-SYNC-3M0

The following is a description of the power/sync cable for the xiB camera line. Get the latest information on available accessories at:

https://www.ximea.com/en/pci-express-camera/pci-express-camera-cmv12000-cmv20000

Cable drawing

figure 3-43, drawing sync cable – current revisions of this cable are 3m in length

Cable components

table 3-39, sync + power cable, components

figure 3-44, wiring sync cable CBL-CB-POWER-SYNC-3M0

xiB & xiB-64 - Technical Manual Version 1.06

Item

Description

Series60 Female Circular Plug 60-01-1112 IO <BLK>

TBA UL20276 4STP#28 + 4C#28 + 2C#24 [OD=6.80mm] <BLK>

Process end with wire end stripped and tin soldered

DC power in socket female (OD5.5/ID2.1) <BLK>

Cable label

Heat shrinkable tube

Signal

IN2 2 IN1 3 OUT2

OUT1

AUX PWR

GND

INOUT1

INOUT3

INOUT2

IN GND

OUT GND

INOUT4

3.14. CBL-MT-PWR-SYNC-3M0

The following is a description of the xiB-64 sync/power cable. Get the latest information on available accessories at:

https://www.ximea.com/en/pci-express-camera/pci-express-camera-cmv12000-cmv20000

Figure 3-45 drawing sync cable, current revisions of this cable are 3m in length

table 3-40, sync + power cable, components

Figure 3-46 Wiring diagram CBL-MT-POWER-SYNC-3M0

xiB & xiB-64 - Technical Manual Version 1.06

3.15. Tripod Adapter – MECH-60MM-BRACKET-T

Get the latest information on available accessories at:

xiB & xiB-64 series tripod mounting bracket

figure 3-47, mounting tripod adapter

Use 2x M4 screws provided with bracket as a kit for mounting. Bracket can be mounted on the bottom, top and sides of the camera.

xiB & xiB-64 - Technical Manual Version 1.06

3.16. xiB-64 cooling – CB-X8G3-FAN-COOLER-KIT

xiB-64 need to have proper cooling. Fan cooling element can be provided along with camera. Using hex 2.0 screw driver and 4 M2.5x14 can be attached or detached. When removing or inserting fan assembly please take

care not to damage spring pins used to connect the cooling unit to camera electronics.

figure 3-48, mounting fan cooling element CB-X8G3-FAN-COOLER

The following image depicts the mounting holes on the back of the camera to mount different cooling elements.

figure 3-49, rear mounting holes

xiB & xiB-64 - Technical Manual Version 1.06

3.17. xiB cooling – MECH-60MM-HEATSINK-KIT

xiB need to have proper cooling. Camera can be equipped with heatsink element MECH-60MM-HEATSINK as shown below. To mount MECH-60MM-HEATSINK it is necessary remove 4xM2 screws indicated in image below. These screws also hold the

camera together, so this step must be done with care. Place the heatsink as depicted and return the four M2 screws you removed - unless the heatsink kit comes with different screws. It is advised to use thermal grease between the camera and heatsink to improve heat dissipation from the camera head.

figure 3-50, mounting cooling element MECH-60MM-HEATSINK

xiB & xiB-64 - Technical Manual Version 1.06

3.18. xiB Lens adapter – MECH-60MM-EF-ADAPTER

xiB and xiB-64 cameras features active control interface for lenses with CANON EF-mount. For attaching such lens MECH-60MMEF-ADAPTER is required. Adapter is mounted using 4 front mount holes. Screws are included in MECH-60MM-EF-ADAPTER-KIT which can be purchased from XIMEA. Optionally camera can be assembled in production when the operation has been ordered along with camera (A-MECH-60MM-EF-ADAPTER-KIT).

figure 3-51, mounting lens adapter with CANON EF-mount (MECH-60MM-EF-ADAPTER)

3.19. xiB Lens adapter – LA-C-MNT-60MM-xxx-KIT,

xiB and xiB-64 cameras with 4/3” or smaller sensor can be equipped with C-mount lens adapter. With this adapter the C-mount lenses may be used. Adapter is mounted using 4 front mount holes. Optionally camera can be assembled in production when the operation has been ordered along with camera (A-LA-C-MNT-60MM-KIT). Mechanical dimensions of the LA-C-MNT-60MM-KIT assume usage of filter glass with thickness of 1mm and refraction index 1.4-1.55. Without filter glass the correct optical flange focal distance is not achieved.

figure 3-52, mounting lens adapter with C-mount (LA-C-MNT-60MM-KIT)

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4. Operation

For a proper operation of your xiB or xiB-64 camera there are certain requirements that have to be met. You will read more about these requirements in the following chapters, as well as a description of how to use a xiB camera. Please check our website for the most up to date information.

4.1. System Requirements

4.1.1. Software Requirements

The xiB & xiB-64 cameras are compatible with the following operating systems:

• Windows 10

• Windows 7 SP1

• Linux Ubuntu

• MacOS 10.8 or newer

All XIMEA cameras are compatible with the most advanced Vision and Image Processing Libraries. See chapter 5 Software for more information about the options to access a xiB cameras, as well as a list of currently supported

libraries and frameworks supported in Windows. For more information visit page: https://www.ximea.com/support/wiki/apis/APIs

4.1.2. Hardware Requirements

The XIMEA xiB & xiB-64 cameras are compatible with PCI express Generation 2 & 3. Please note details and the most recent info at:

https://www.ximea.com/support/wiki/xib/PCI_Express_camera_-_xiB

4.1.2.1. System Configuration

Minimum system configuration: For a basic operation of your xiB or xiB-64 camera with a PC the following minimum system configuration is required. Please note

that bandwidth and processing performance are tied to the hardware configuration and the minimum hardware configuration could lead to a reduced bandwidth and limited frame rate.

CPU: Intel i3 or better RAM: 2GB RAM or more Disc Space: 200 MB of free disc space Video: NVIDIA or Radeon graphics card 128MB or integrated on CPU Ports: Motherboard with PCIe x4-16 Gen 2(x8 Gen3 for xiB-64) slot for compatible PCIe host adapter

See 3.12 PCIe host adapter cards

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Recommended system configuration: For best processing performance and bandwidth we recommend to use the following system configuration. This is essential when

using the higher resolution models for achieving maximum frame rate.

CPU: Intel i7 RAM: 8GB RAM or more Disc Space: 400 MB of free disc space Video: NVIDIA or Radeon graphics card 128MB Ports: Motherboard with PCIe x4-16 Gen 2(x8 Gen3 for xiB-64) slot for compatible PCIe host adapter.

See 3.12 PCIe host adapter cards

4.1.2.2. Cables

The PCI express cable that you use with the xiB or xiB-64 camera is responsible for the supply of power and the data transfer to the PC. It is critical to use an industrial PCI express cable with the proper wiring and shielding. We recommend using the cables listed in section 3.11 CBL-PCI-COP-xx/ CBL-PCI-FIB-.

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4.2. Video Formats

4.2.1. Full Resolution

By default, each camera outputs a full resolution image based on its sensor specification.

4.2.2. ROIs – Region Of Interest

ROI, also called area-of-interest (AOI) or windowing, allows the user to specify a sub-area of the original sensor size for read-out. Depending on the sensor inside xiB & xiB-64 cameras support the definition of one single ROI by specifying the size (width and

height) as well as the position (based on upper left corner) of the of the sub-area. Please note 3.6 Model Specific Characteristics

4.2.3. Downsampling Modes

Downsampling describes the possibility of reducing the image resolution without affecting the sensors physical size, ie. without reducing the physical size of the sensing area. This feature is useful when optics are used, that are particularly fitted to a certain sensor size and if it is necessary to maintain the full image circle on the sensor.

Downsampling can be achieved in two ways: binning and skipping.

4.2.3.1. Binning

When binning is applied, the image is divided into cluster of k*l pixels, where all pixels in each cluster are interpolated and result in the value of one output pixel. For example, a 2*2 binning produces 2*2 pixel clusters and results in images with ¼ of the original resolution.

4.2.3.2. Skipping

When skipping is chosen, only every n-th pixel is used to create the output image. For example, with a 2x1 vertical skipping, every odd number line used and every even number line is skipped, resulting in an image with half its original vertical resolution. Skipping is a faster downsampling mode, but also introduces more aliasing effects.

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Mode

Description

RAW8

Raw sensor data, 8 Bit per pixel, single channel

RAW16

Raw sensor data, 16 Bit per pixel, single channel 10 or 12 Bit sensor output (LSB) with bit-shift up to 16 Bit

MONO8

Intensity output, 8 Bit per pixel, single channel

MONO16

Intensity output, 16 Bit per pixel, single channel

RGB24

RGB filtered output, 24 Bit per pixel, 3 channels Sequence: [Blue][Green][Red]

RGB32

RGBA filtered output, 32 Bit per pixel, 4 channels, Alpha channel equals 0. Sequence: [Blue][Green][Red][0]

RGB_PLANAR

RGB filtered output with planar-oriented channels. Format: [R][R]...[G][G]...[B][B]...

FRM_TRANSPORT_DATA

Data from transport layer (e.g. packed). This format is optimal when an efficient storage and later (offline) processing is required. Format is defined by XI_PRM_TRANSPORT_PIXEL_FORMAT

4.2.4. Image Data Output Formats

All modes are provided by the xiAPI or standard interfaces using the xiAPI (please note 5.1 Accessing the Camera). Each xiB or xiB-64 camera supports several Image Data Output Formats.

table 4-1, image formats,

Note1: For color modes RGB32 and RGB24 the image from sensor needs to be pre-processed (de-bayering). CPU load is higher in these modes. Setting this parameter will reset current region of interest. RGB24 is being processed from the RGB32 by removing the unused Alpha channel creating a slightly higher CPU load than the RGB32 format.

Note2: The color filtering (de-bayering) relies on the interpolation of adjacent pixels in order to create pixel in the target image. Pixels on the edges of the image are missing adjacent pixels and therefore cannot be used for the interpolation process. The result is a target image that is smaller than the source image (4 pixels on all sides).

Note3: For most formats the transport data can be packed. 12-bit pixel bit depth transfers only 12bit per pixel compared to 16bit per pixel when the data are not packed. In case of packed format the CPU load is higher due to unpacking of the image data. Available bandwidth is however used optimally.

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4.3. Acquisition modes

4.3.1. Free-Run

Also known as continuous acquisition. In this mode the sensor delivers a constant stream of image data at the maximum speed available by the current bandwidth, without any external trigger. Each image exposure is sequentially started automatically when possible.

For all sensors the exposure of the next frame overlaps with the data readout of the previous frame. This Overlapped mode gives the highest number of frames per second (FPS).

figure 4-1, acquisition mode - free run

In this mode the timing depends on the Exposure Time and Data Readout Time. All xiB & xiB-64 cameras support limiting of FPS. When set the camera will limit the frame rate so it does not exceed the set

value. Please see: Frame_Rate_Control: https://www.ximea.com/support/wiki/allprod/Frame_Rate_Control This is also applicable in case of triggered acquisition.

4.3.2. Trigger controlled Acquisition/Exposure

Unlike in the free-run, each image exposure can also be triggered with an input trigger signal. In this mode, the sensor waits in stage until the trigger signal arrives. Only then, the exposure of first frame is started, which is followed by the data readout. XIMEA cameras supports several triggered modes along with single image exposure after one trigger. The trigger signal can be either edge sensitive or level sensitive. In the case of ‘level sensitive’, it can be used to control length of exposure or acquisition itself.

Generally trigger sources can be divided into two groups:

Software Trigger

The trigger signal can be sent to the sensor using a software command. In this case, common system related latencies and jitter apply.

Hardware Trigger

A hardware trigger can be sent to the sensor using the digital input described in 3.9.4 Optically isolated Digital Input, or nonisolated ports configured as input described in 3.9.6 Non-isolated Digital Lines. Triggering by hardware is usually used to reduce latencies and jitter in applications that require the most accurate timing.

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4.3.2.1. Triggered acquisition - single frame

Sensors support exposure overlapped with readout. When the trigger period (t

) is longer than the exposure plus readout time,

tper

exposure is not overlapped with readout. However when the trigger period is decreased, the sensor will expose the images in overlap mode. In this case, the frame active signal will be constantly active. The trigger period has to be long enough so the exposure of next frame does not end sooner than readout of previous frame.

Sensor timing in Exposure Overlapped with Data Readout Mode

figure 4-2, acquisition mode – triggered with overlap

Description:

– Trigger (Digital Input) to Exposure Active (Digital Output)

eio

– Trigger (Digital Input) to start of exposure

exp

– Current Exposure Time set (XI_PRM_EXPOSURE)

exps

– Frame overhead time (FOT)

fot

– readout time (Readout Time)

– readout time of one row (Line period) depends on sensor settings

row

Conditions: Debounce on trigger input line and trigger delay are disabled.

The timing strongly depends on camera settings. Most of the times can be calculated using Camera performance calculator.

The delay between trigger input and start of exposure:





 



 



Where:

– Delay introduced by sensor itself. For most sensors the delay is constant.

sensdelay

Cameras with CMV50000 sensor have this time dependent on setting of the sensor. Namely it is line period and bandwidth limit.

– Delay inside camera caused by internal electronics. This depends on input type.

idelay

Please refer to: 3.9.4 Optically isolated Digital Input or 3.9.6 Non-isolated Digital Lines

The output signaling is then delayed the delay introduced from the output electronic.



 





 



Where:

– Delay inside camera caused by internal electronics. This depends on output type.

odelay

Please refer to: 3.9.5 Optically isolated Digital Output or 3.9.6 Non-isolated Digital Lines

For minimum trigger period (t

) the following applies. The next trigger after one is processed needs to be applied so the end of

tper

the triggered exposure does not overlap with the readout of the previous frame.



 󰇛 





󰇜  



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4.3.2.2. Triggered acquisition - burst of frames

Frame Burst Start In this mode each trigger pulse triggers defined number of exposed frames.

figure 4-3, triggered burst of frames – frame burst start, number of frames in burst set to 3

Frame Burst Active If trigger is level sensitive it can be used to control image acquisition.

figure 4-4, triggered burst of frames – frame burst active

Please see: Frame Burst Modes: https://www.ximea.com/support/wiki/allprod/Frame_Burst_Modes

4.3.2.3. Exposure defined by trigger pulse length

In this mode the exposure is defined by trigger pulse length. This can be used to achieve longer exposure than allowed by API. Also it can be used to trigger several images in sequence with different exposure time. Exposure time is measured and reported in image metadata.

figure 4-5, Exposure defined by trigger pulse length

Please see: Exposure Defined by Trigger Pulse Length:

https://www.ximea.com/support/wiki/allprod/Exposure_Defined_by_Trigger_Pulse_Length

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4.4. Camera Parameters and Features

4.4.1. Exposure Time

Also known as shutter speed. This parameter defines the length of the integration period for each frame. Most CMOS sensors generate the exposure interval internally. For some it is possible to control it by external signaling. The

sensor internal timing depends on the provided system clock. Most sensors use dividers to generate slower clocks for internal usage.

The minimum exposure time is defined mostly by row times, where the row time (TR) is dependent on various internal settings. Very few sensors support exposure times equal to zero. There is a defined minimum exposure time as well as minimum steps between possible exposure times. There is also a maximum exposure time, defined by sensor architecture.

4.4.2. Gain

The gain value influences the analog-to-digital conversion process of the image sensor pipeline and acts as a multiplier of the output signal. Using gain values greater than 0 will increase the pixel intensities but may also increase the overall noise level. For some camera models the gain can be set in discrete steps only.

4.5. Host-Assisted Image Processing Parameters Available in xiAPI.

4.5.1. Auto Exposure – Auto Gain

When AEAG is used, every captured image is evaluated for its mean intensity. Based on the result, the exposure and gain values are modified with the objective to achieve a target intensity level for the following image. Further, the maximum applicable exposure and gain values can be defined. Since both, exposure and gain, have an influence on the intensity, the ratio between those two parameters in their contribution to the algorithm can also be set (exposure priority).

4.5.2. White Balance

Only for color models: The white balance can be adjusted with three coefficients kR, kG and kB, one for each color channel. These coefficients can be set individually in order to increase or decrease each channel’s contribution and therefore allow the user to control the color tint of the image.

4.5.2.1. Assisted Manual White Balance

This feature measures the white balance a single time and sets the white balance coefficient to achieve a mean grey (neutral) tint. The measurement is performed on the central rectangle of the image, with 1/8th of its width and height. The function expects a

white sheet of paper exposed to 50% of the intensity values (8 Bit RGB values should be around 128) to be visible.

4.5.2.2. Auto White Balance

The white balance is measured across the full image for every 4th image that is acquired and the white balance coefficients are set to to achieve a neutral colour tint.

4.5.3. Gamma

Only for color models: As a part of the color filtering process, it is possible to adjust the gamma level of the image. The adjustment can be set separately for the luminosity and the chromaticity.

4.5.4. Sharpness

Only for color models: As a part of the color filtering process, it is possible to adjust the sharpness of the image.

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4.5.5. Color Correction Matrix

The color correction matrix is a 4x4-matrix which is applied on each pixel of an image in a host-assisted port-processing step. For example, this Matrix can be used to adjust the brightness, contrast, and saturation.

4.5.6. Sensor Defect Correction

During the manufacturing process, every camera is tested for various type of defects and a list of the measured defect pixels is created and stored in the camera’s non-volatile memory. This list is then used for the correction of acquired images during operation. The correction is inactive by default, but can be turned on by the user if a non-processed output is required.

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4.5.7. HDR

Some sensors offer the ability to acquire images with a higher dynamic range than the value presented in the specification. High dynamic range can be achieved by several means as part of the sensor output. The feature supported by CB200xG-CM camera is a piecewise linear response, a so-called multiple slope integration.

The dynamic range of a linear image sensor is limited by the saturation of the pixel. Different light intensities are shown in the figure below. All blue marked light intensities cause different signal levels and can be separated without saturation. All red marked intensities cause an overexposure and the info about the different light intensity above 100% is lost.

figure 4-6, image saturation example without HDR

Please note the exemplary corresponding positions 1 – 5 in the image with standard dynamic range:

figure 4-7, image example without HDR

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The dynamic range can be increased by dividing the integration (exposure time) in two or three phases (slopes), with different maximum saturation levels. The CB200xG-CM camera supports the dividing in three slopes.

To use this kind of HDR method the user has to define two pairs of parameters: (T1, SL1) and (T2, SL2).

• T1 and T2 define portions of the total exposure time and the length of the three timing phases.

• SL1 and SL2 define portions of the sensor saturation, so called kneepoint1 and kneepoint2.

Please note the figure below:

figure 4-8, image saturation example with HDR

Please note the exemplary corresponding positions 1 – 5 in the image with high dynamic range:

figure 4-9, image example with HDR

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Description of the multiple slope integration: Phase 1

• All pixels are integrated until they reach the defined saturation level of kneepoint1 (SL1).

• If the saturation level of kneepoint1 is reached, the integration stops. SL1 is the maximum saturation level for all pixels in

this phase.

Phase 2

• All pixels are integrated until they reach the defined saturation level of kneepoint2 (SL2).

• If the saturation level of kneepoint2 is reached, the integration stops. SL2 is the maximum saturation level for all pixels in

this phase.

Phase 3

• All pixels are integrated until the exposure time is reached. The pixel saturation may reach the maximum saturation level.

The main idea of this method is to reach an approx. logarithmic saturation curve. In order to achieve this goal phase2 always has a smaller slope than phase1 and phase3 smaller than phase 2. Thus, the signal response during phase1 is higher as during phase2. And the signal increase during phase2 is higher than during phase3.

As a result, darker pixels can be integrated during the complete integration time and the full sensor sensitivity can be exploited. Brighter pixels are limited at the knee points and lose a part of their integration time.

figure 4-10, HDR - approx. logarithmic saturation curve

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5. Software

5.1. Accessing the Camera

Depending on the target application, the user can choose between several ways of accessing and controlling the camera. These can be divided into two categories: a programmatic approach, through programming code, or an integrated approach, through a supported, GUI based software package. The programmatic approach is generally used for the development of a custom application or image processing pipeline. The integrated approach is favored, if the specific toolset of a certain software package is sufficient and the camera serves as an integrated capture device.

5.1.1. Proprietary API

All XIMEA cameras are supported by the same unified APIs (application programming interface). The API is a software interface between the camera system driver and the application. Different APIs are available for different programming environments, e.g. xiAPI (see 5.7.1 XIMEA APIs) for C/C++ developments and xiAPI.Net for C#/.Net based developments

5.1.2. Standard Interface

As an alternative to the proprietary API, the camera can be accessed through a set of standard interfaces. These interfaces decouple a specific hardware design (e.g. physical interface) of a camera from its control in software. Therefore multiple camera classes and types can be used in a unified way.

5.1.2.1. GenICam

GenICam/GenTL provides a camera-agnostic transport layer interface to acquire images or other data and to communicate with

a device. Each camera serves as a GenTL Producer which can be accessed in all software packages that are compatible with the GeniCam standard, as well as through custom developments which implement this standard interface.

5.1.3. Vision Library Integration

All XIMEA cameras are compatible with the most advanced vision and image processing libraries. For GUI based software packages, the cameras can be directly accessed without the need of programming. Code libraries are generally used in conjunction with one of our APIs, in order to add additional functionality (e.g. image processing, communication, data storage).

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5.2. XIMEA CamTool

The CamTool is a cross-platform application showcasing the features of all XIMEA camera families.

Short description It runs on Windows, Linux, macOS systems offering a substantial imaging tool set, which can be further extended with custom

modules using a plugin infrastructure. CamTool is based on Qt for the UI and xiAPI for the camera control. Its camera settings menu resembles the parameter set of the xiAPI

figure 5-1, CamTool Layout

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Functions

 to see live image from multiple XIMEA cameras connected  control the camera parameters  store of camera image and video  analyze the image properties  histogram and line profile  image averaging, image flip/mirror  software trigger timer, save/load camera and program settings  LUT (Look up table)  Lua scripting

CamTool allows to operate all connected cameras simultaneously. In this case all control are layered for the cameras. Basic controls are placed as tabs in upper part of the window. Image window can be detached from application if needed. Amount of visible camera controls depend on visibility level which can be set in EditOptions.

For more information please refer to: https://www.ximea.com/support/wiki/allprod/XIMEA_CamTool

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5.3. Supported Vision Libraries

For an up-to-date listing of the supported vision libraries and software packages, visit our web site

http://www.ximea.com/support/projects/vision-libraries/wiki.

5.3.1. Libraries maintained by XIMEA

All cameras listed in the section Products are supported with these libraries. XIMEA commits to update the API within twelve months after a new major release. XIMEA warranties backwards compatibility of these software packages for two major releases.

5.3.1.1. MathWorks MATLAB

MathWorks® is the leading developer and supplier of software for technical computing and Model-Based Design.

More: http://www.mathworks.de/ or https://www.ximea.com/support/wiki/vision-libraries/MathWorks_Matlab

5.3.1.2. MVTec HALCON

HALCON is the comprehensive standard software for machine vision with an integrated development environment (IDE) that is

used worldwide. More: http://www.mvtec.com/halcon/ or https://www.ximea.com/support/wiki/vision-libraries/MVTec_HALCON

5.3.1.3. National Instruments LabVIEW Vision Library

LabVIEW is a graphical programming environment.

More: http://www.ni.com/labview/

https://www.ximea.com/support/wiki/vision-libraries/National_Instruments_LabVIEW

5.3.1.4. OpenCV

OpenCV is an open source library of programming functions mainly aimed at real time computer vision, developed by Intel and

now supported by Willow Garage. More: http://opencv.willowgarage.com/wiki/

https://www.ximea.com/support/wiki/vision-libraries/OpenCV

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5.4. XIMEA Windows Software Package

XIMEA API Software Package can be installed on: Microsoft Windows 10, Microsoft Windows 8, Microsoft Windows 7 (and Microsoft Windows 7 Embedded), Microsoft Windows Server 2008 R2.

5.4.1. Contents

The package contains:

• OS Drivers of all XIMEA camera types for OS Microsoft Windows XP SP3 32bit, Windows 7 32/64 bit, Windows 8 32/64 bit,

Windows Server 2008 R2 x86-64, Windows 10 32/64 bit.

• APIs (xiAPI, xiAPI.NET, xiApiPtyhon)

• Examples

• CamTool

• xiCop

• GenTL Producer - for connection of GenTL Consumer applications.

• Vision Libraries integration demonstrations:

o NI LabView interface - xiLib

5.4.2. Installation

• Download and execute the XIMEA API Software Package installer (EXE-file, approximate size 100 MB):

http://www.ximea.com/downloads/recent/XIMEA_Installer.exe

• Read the License Agreement.

• Start the installer

Be sure that you have administrator privileges or start the Installer with administrator rights (right click and select “run as administrator):

figure 5-2, XIMEA Windows Software Package installation - 1

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• Select the Software components you want to install. You can uncheck the components you don't want to install, but it is

recommended to leave them all checked.

figure 5-3, XIMEA Windows Software Package installation - 2

• Specify the install location - you can leave the default location or change it to your desired location.

figure 5-4, XIMEA Windows Software Package installation - 3

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• Now the XIMEA API Software Package should start copying files, updating System Variables and installing drivers if

necessary.

figure 5-5, xiAPI installation, Windows - 4

• Installation is completed.

figure 5-6, xiAPI installation, Windows - 5

• Finish.

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5.5. XIMEA Linux Software Package

XIMEA Linux Software Package is tarred installer with files that can be run on Linux Ubuntu 14.04 and 16.04 (32 and 64 Bit) and newer releases.

5.5.1. Contents

The package contains:

• Driver (beta version) for XIMEA USB2 and USB3 cameras

• xiAPI

• Ximea CamTool

• Examples:

o xiSample - sample showing basic image acquisition in xiAPI

5.5.2. Installation

• Download XIMEA Linux Software Package

wget http://www.ximea.com/downloads/recent/XIMEA_Linux_SP.tgz

figure 5-7, XIMEA Linux Software Package installation - 1

• Untar

tar xzf XIMEA_Linux_SP.tgz cd package

• Start installation script

./install-pcie

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figure 5-8, XIMEA Linux Software Package installation - 2

1) Note: If logged in user is not root, you will be asked for your password to get root access, because the installation runs with

root account using sudo.

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5.6. XIMEA macOS Software Package

XIMEA macOS Software Package is native DMG installer that can be run on macOS 10.8 (Mountain Lion) or newer.

5.6.1. Contents

The package contains:

• Driver (beta version) for all XIMEA cameras

• xiAPI

• XIMEA CamTool

• Examples:

o xiSample - sample showing basic image acquisition in xiAPI

5.6.2. Installation

Before installing XIMEA macOS Software Package it may be necessary to modify security settings on your computer. The new feature of OS X 10.8 called GateKeeper can prevent you from using our macOS Software Package due to the fact that the current version is unsigned.

Open System Preferences application and click on Security & Privacy.

figure 5-9, XIMEA macOS Software Package installation - 1

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On the General Tab select the option Anywhere under Allow applications downloaded from:

figure 5-10, xiAPI installation, MacOS - 2

• Download XIMEA macOS Software. Package: http://www.ximea.com/downloads/recent/XIMEA_OSX_SP.dmg

• Mount it by double-clicking this file in Finder.

• Run the install script to install XiAPI on your macOS system

• A window with package contents will open.

5.6.3. Start XIMEA CamTool

• Connect camera

• Start Applications / XIMEA CamTool

• Start acquisition by clicking on orange triangle at upper left corner of CamTool

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5.7. Programming

5.7.1. XIMEA APIs

• xiAPI - Streamlined API. The standard API for C/C++ based projects, see 5.7.2 xiAPI Overview.

• xiAPI.NET - Managed .NET Common Language Runtime (CLR) API.

xiAPI.NET is designed as a wrapper around xiAPI and therefore shares most of its functionality.

• xiApiPython – Integrated API into PYTHON.

5.7.2. xiAPI Overview

xiAPI stands for XIMEA Application Programming Interface. It is a common interface for all XIMEA cameras.

Architecture API is a software interface between the camera system driver and application.

• On Windows: xiAPI is compiled into xiapi32.dll or xiapi64.dll

• On Linux: xiAPI is compiled into /usr/lib/libm3api.so

Installation xiAPI is part of all current XIMEA software packages for Windows, Linux and MacOS. For information on the software packages, see 5 Software

5.7.3. xiAPI Functions Description

The core of xiAPI consists of the following functions, which allow controlling of the camera functionality.

// get the number of discovered devices.

XI_RETURN xiGetNumberDevices(OUT DWORD *pNumberDevices);

// open interface

XI_RETURN xiOpenDevice(IN DWORD DevId, OUT PHANDLE hDevice);

// get parameter

XI_RETURN xiGetParam(IN HANDLE hDevice, const char* prm, void* val, DWORD * size, XI_PRM_TYPE * type);

// set parameter

XI_RETURN xiSetParam(IN HANDLE hDevice, const char* prm, void* val, DWORD size, XI_PRM_TYPE type);

// start the data acquisition

XI_RETURN xiStartAcquisition(IN HANDLE hDevice);

// acquire image and return image information

XI_RETURN xiGetImage(IN HANDLE hDevice, IN DWORD TimeOut, INOUT XI_IMG * img);

// stop the data acquisition

XI_RETURN xiStopAcquisition(IN HANDLE hDevice);

// close interface

XI_RETURN xiCloseDevice(IN HANDLE hDevice);

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5.7.4. xiAPI Parameters Description

For a complete list of available parameter, please visit the xiAPI online manual at

http://www.ximea.com/support/wiki/apis/XiAPI_Manual

Note: Since xiAPI is a unified programming interface for all of XIMEA‘s cameras, not all of the described parameters apply for every camera and sensor model.

All functions in xiAPI return status values in form of the XI_RETURN structure which is defined in xiApi.h. If a parameter is not supported by a certain camera, the return value will represent a respective error code (e.g. 106 - Parameter not supported).

5.7.5. xiAPI Examples

5.7.5.1. Connect Device

This example shows the enumeration of available devices. If any device was found the first device (with index 0) is opened.

HANDLE xiH = NULL;

// Get number of camera devices

DWORD dwNumberOfDevices = 0; xiGetNumberDevices(&dwNumberOfDevices);

if (!dwNumberOfDevices)

{ printf("No camera found\n"); } else {

// Retrieving a handle to the camera device

xiOpenDevice(0, &xiH);

}

5.7.5.2. Parameterize Device

This example shows how an exposure time is set. Next, the maximum possible downsampling rate is retrieved and the result is set as new downsampling rate.

// Setting "exposure" parameter (10ms)

int time_us = 10000;

xiSetParam(xiH, XI_PRM_EXPOSURE, &time_us, sizeof(time_us), xiTypeInteger);

// Getting maxium possible downsampling rate

int dspl_max = 1;

xiGetParamInt(xiH, XI_PRM_DOWNSAMPLING XI_PRM_INFO_MAX, &dspl_max);

// Setting maxium possible downsampling rate

xiSetParamInt(xiH, XI_PRM_DOWNSAMPLING, dspl_max);

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Digital Output Exposure Active

Data Only

application

Digital Input

Trigger

5.7.5.3. Acquire Images

This example shows how the acquisition is started on the device with the handle xiH, ten images are acquired in a row and the acquisition is stopped.

xiStartAcquisition(xiH);

#define EXPECTED_IMAGES 10 for (int images=0;images < EXPECTED_IMAGES;images++)

{

// getting image from camera

xiGetImage(xiH, 5000, &image); printf("Image %d (%dx%d) received from camera\n", images, (int)image.width, (int)image.height);

}

xiStopAcquisition(xiH);

5.7.5.4. Control Digital Input / Output (GPIO)

Hardware Trigger and Exposure Active output In this setup each image is triggered by a Digital Input Trigger. After the image is triggered, it can be transferred using

xiGetImage. This setup ensures a low latency between the trigger signal and image Exposure start. This time should be less than 10µs.

figure 5-11, GPIO - schematic

HANDLE xiH; xiOpenDevice(0, & xiH);

// select trigger source

xiSetParamInt(xiH, XI_PRM_TRG_SOURCE, XI_TRG_EDGE_RISING);

// select input pin 1 mode

xiSetParamInt(xiH, XI_PRM_GPI_SELECTOR, 1); xiSetParamInt(xiH, XI_PRM_GPI_MODE, XI_GPI_TRIGGER)

// set digital output 1 mode

xiSetParamInt(xiH, XI_PRM_GPO_SELECTOR, 1); xiSetParamInt(xiH, XI_PRM_GPO_MODE, XI_GPO_EXPOSURE_ACTIVE);

xiStartAcquisition(handle1);

// Trigger signal should start image exposure within timeout

#define TIMEOUT_IMAGE_WAITING_MS 10000

xiGetImage(handle, TIMEOUT_IMAGE_WAITING_MS, &image);

// process image here…

Camera

PC with

5.7.6. xiAPI Auto Bandwidth Calculation

xiAPI uses Auto Bandwidth Calculation (ABC) before the opening of each camera by default. After the measurement, 90% of the measured value is used as the maximum allowed transfer speed of the camera to ensure the stability of transfer.

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It is important to set this parameter to XI_OFF to ensure highest possible data transfer speed. To disable ABC, the application should set parameter XI_PRM_AUTO_BANDWIDTH_CALCULATION to XI_OFF before the first

xiOpenDevice is used. This setting disabled ABC and the camera stream is not limited.

5.7.7. GenICam

For more information on programing according the GenICam standard, please visit the standard’s website at

http://www.emva.org/standards-technology/genicam/

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5.8. XIMEA Control Panel

The XIMEA Control Panel (xiCOP), is a diagnostics and management tool for all XIMEA cameras. xiCOP is currently only available for Windows operating system.

figure 5-12, xiCOP

Features

• Facilitates diagnostics of system performance bottlenecks.

xiCOP is capable of retrieving the system’s hardware tree, thus problematic hardware configurations can be identified.

• Diagnosis of firmware and software compatibility.

xiCOP checks relevant firmware and software versions and warns if a component is not up-to-date.

• List all currently attached XIMEA devices and their features.

• Suggests solution for diagnosed issues.

• One click update to the latest XIMEA API Software Package.

• One click update of firmware in selected cameras.

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Step no:

Description

Click on the button “Troubleshoot My System” and follow the instructions that are suggested.

If step 1 does not lead to a positive result, please click the button “Save diagnostics”. Keep the diagnostic file ready for providing it to support.

Contact your local dealer where you bought the camera either by phone or by email for first level support. He will decide if he can help you immediately or if more information is necessary for initiating the next steps.

6. Appendix

6.1. Troubleshooting and Support

This chapter explains how to proceed, if you have issues in getting your xiB or xiB-64 camera to a proper operation. At first, please make sure, that you have installed the latest version of the following XIMEA software:

• XIMEA Windows Software Package http://www.ximea.com/downloads/recent/XIMEA_Installer.exe

Please make sure, that you have connected your xiB or xiB-64 camera with the corresponding PCIe cable to appropriate port on your PCIe host adapter card. Ensure that the connections are carefully locked. Follow the instructions described in chapter 5.2 XIMEA CamTool (run the xiB or xib-64 camera with the XIMEA CamTool). If this does not at first work, please check all your connections to the camera (power and PCIe) and then try the latest 'beta' version of API with the most recent fixes:

https://www.ximea.com/downloads/recent_beta/XIMEA_Installer.exe

In case that you still have issues, please read the following chapters.

6.1.1. Worldwide Support

We offer worldwide first level support to you by our partners. Please refer to your local dealer if you need technical support for your xiB or xiB-64 camera.

6.1.2. Before Contacting Technical Support

There are a few steps to take before contacting your local dealer for technical support. In case you cannot display images from your xiB or xiB-64 camera, please open the XIMEA xiCOP software (please see 5.8 XIMEA Control Panel). It will immediately start searching for connected cameras. Your camera will appear in the XIMEA camera list on the upper left side of the xiCOP window if it is connected properly and your PCIe host interface meets the minimum system requirements described in 4.1 System

Requirements. If the camera does not appear, please proceed with the following steps:

table 6-1, use xiCOP before contacting technical support

6.1.3. Frequently Asked Questions

In this manual, we can list only a few FAQ. For more and updated information, please also note:

• Frequently Asked Questions http://www.ximea.com/support/wiki/allprod/Frequently_Asked_Questions

• Knowledge Base http://www.ximea.com/support/wiki/allprod/Knowledge_Base

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Interface

Transfer speed

Usable bandwidth

System costs

IEEE1394A

400 Mbit/s

45 MByte/sec

Medium

CameraLink base

2.04 Gbit/s

255 MByte/sec

High

GigE

1024 Mbit/s

100 MByte/sec

Medium

USB 2.0

480 Mbit/s

49 MByte/sec

Low

USB 3.0

5 Gbit/s

450 MByte/sec

Low

USB 3.1 (gen1)

5 Gbit/s

450 MByte/sec

Low

PCIe gen2 x2

8 Gbit/s

Low

PCIe gen2 x4

16Gbit/s

Low

PCIe gen3 x8

64Gbit/s

Low

6.1.3.1. What is the real transfer speed?

xiB-64 camera can deliver up to 8Gbyte/sec. This requires that certain conditions are met, see 4.1 System Requirements. Maximum transfer speeds of different interfaces:

table 6-2, interface depending transfer rates

6.1.3.2. Why can I not achieve maximum transfer speed?

In order to reliably achieve maximum transfer speed it is necessary to verify that you are using recommended hardware (please see 4.1 System Requirements), and that all software requirements are met.

xiCOP (please see 5.8 XIMEA Control Panel) - XIMEA Control Panel free software tool, facilitates the task of verification of XIMEA camera installations.

6.2. Product service request (PSR)

If you experienced any unexpected behavior of your xiB or xiB-64 camera, please follow the steps described below:

6.2.1. Step 1 - Contact Support

If your xiB or xiB-64 camera is not working as expected, please contact your local dealer for troubleshooting the product and determine the eligibility of a Product Service Request (PSR).

In case you were asked to create a PSR by your local contact, please continue to STEP 2 NOTE: Your product must be UNDER WARRANTY in order to qualify for a free repair or replacement.

6.2.2. Step 2 - Create Product Service Request (PSR)

• Read the XIMEA General Terms & Conditions http://www.ximea.com/en/corporate/generaltc

• Open the XIMEA Product Service Request form http://www.ximea.com/support/projects/service/issues/new

• Fill in all fields

• Confirm with the button „Create“

6.2.3. Step 3 - Wait for PSR Approval

Our support personnel will verify the PSR for validity. If your PSR is valid, it will be approved for sending the camera to us. This is done usually within 24 business hours. After that you

will get a PSR Approval email (sent to the email address that you have entered in the field “Contact person – email”). The email contains:

• shipping instructions

• attached document containing the Product Service Request Number (PSRN)

When you received the PSR Approval email - please continue to Step 4. In case your PSR was rejected – please do not send your camera to XIMEA.

6.2.4. Step 4 - Sending the camera to XIMEA

If possible, send the camera back in the original package. If not possible, please pack the camera in a way that it cannot be damaged during shipment and send it back as described in the PSR Approval email that you have received.

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Operation

Repair costs paid by

Return delivery costs paid by

repaired in warranty

XIMEA

replaced in warranty

XIMEA

repaired for cost

Customer

not repaired and returned

Customer

not repaired and discarded if requested by customer

6.2.5. Step 5 - Waiting for Service Conclusion

Once we have received the camera, we will send you a notification. The XIMEA Service will then check the status of the camera that you have sent for a possible repair. Depending on warranty conditions, product status and agreement one of the following operations will be performed:

table 6-3, service operations overview

If the camera will be returned, you will receive the tracking number. In this case, please continue to step 6

6.2.6. STEP 6 - Waiting for return delivery

After you have received the return shipment, please confirm it by changing the status of the PSR to “Received by customer”.

6.3. Safety instructions and precautions

This chapter describes safety instructions and precautions valid for xiB & xiB-64 cameras and special considerations regarding XIMEA board level cameras. In order to avoid harm or damage your xiB or xiB-64 camera, please handle it like described in this manual, paying special attention to the cautions shown in the following table:

6.3.1. Disassembling

Do not disassemble the camera except removing lens mount, see 3.3 Lens Mount. and removing cooling elements. There are no switches or parts inside the cameras that requires any kind of mechanical adjustment. Please note that the warranty

is voided by opening the camera housing.

6.3.2. Mounting / Screwing

Use only the designated threaded holes for mounting the camera. Please note the camera / bracket drawings in chapter 3.6 Model Specific Characteristics and 3.15 Tripod Adapter – MECH-60MM-BRACKET-T

Use only the specified screws and torques when fastening, see 0

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Mounting points.

6.3.3. Connections

Use only recommended connectors and cables. Please check the system requirements described in 4.1 System Requirements.

6.3.4. Power supply

See 3.1 Power Supply. Camera requires external power supply.

6.3.5. Environment / protect against water

Use camera in acceptable environment only, please note the descriptions in 3.2.1 Environment. Protect the camera against contact with water. Do not let camera get wet. Damages may be caused by:

• Overheating

• Contact with water

• Operation in an environment with condensing humidity

• Mechanical shock

6.3.6. Recommended light conditions.

Do not expose the camera to light sources with intense energy, e.g. laser beams or X-ray. Light intensity or exposure time exceeding the saturation of the sensor may damage the sensor irreparably. This may occur e.g. in

the following situations:

• High-energy laser light hitting the sensor directly

• Bright light sources hitting the sensor directly (burn-in)

• Camera is exposed to X-rays

The warranty does not cover damaged cameras caused by X-ray applications or too much light / laser light.

6.3.7. Protect the optical components

Do not touch the optical components with hard or abrasive objects. When handling the camera, avoid touching the lenses and filter glasses. Fingerprints or other impurities may affect the image

quality and may damage the surfaces. Mount / dismount lenses and additional filters only in a dust free environment. Do not use compressed air as this could push dust into the camera (and lenses).

6.3.8. Mechanical loads

Avoid excessive shaking, throwing, dropping or any kind of mishandling of the device.

6.3.9. Camera / lens cleaning

Please follow instructions described below.

• Use only optical quality tissue / cloth (dry cotton) a standard camera lens cleaning kit, if you must clean a lens or filter. Do

not apply excessive force.

• Use only optics cleaner (e.g. 60% ethyl alcohol, 40% ether). Never use aggressive cleaners like gasoline or spirits. Such

cleaners may destroy the surface.

• Do not use compressed air.

6.3.10. Protect against static discharge (ESD)

Image sensors and the PCB are easily damaged by static discharge (ESD).

• Please use anti-static gloves, clothes and materials. Also use conductive shoes.

• wear an ESD protection wrist strap.

• Install a conductive mat on the floor and / or working table to prevent the generation of static electricity.

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6.3.11. Safety instructions for board level cameras

Abuse or misapplication of the board level camera may result in limited warranty or cancelation of warranty. Due to the exposed electronics, special rules apply:

• Only qualified personnel are allowed to handle, install and operate the board level cameras.

• Board level cameras are delivered without housing. Handle the PCB and the sensor with care. Do not bend the boards. Do

not touch the components or contacts on a board. Hold the board by its edges only.

• Protect the board level camera against static discharge (see 6.3.10 Protect against static discharge (ESD)).

• Do not hold any components of your board level cameras against your clothing, even if you are wearing a wrist strap.

• Do not remove the board level camera from its anti-static packaging unless your body is grounded.

• To protect the boards from radiation of other modules or devices a housing or shielding may be required.

• Be sure that the board level camera has no contact to any electrical source before mounting or making connections to the

board level camera.

• Do not connect or disconnect any cables or use the board level camera during an electrical storm.

• Avoid any mechanical forces to the board level cameras, especially torsional, tensile and compressive forces. Any of these

forces may result in damage of the board level cameras.

• Always use clean boards.

• To protect the boards from dirt like dust or liquids always use the board level cameras in clean room environment or use a

protective housing.

6.4. Warranty

In addition to the provisions of Article VIII of the Standard Terms & Conditions of XIMEA GmbH (see 6.7 Standard Terms & Conditions of XIMEA GmbH) the following additions and specifications apply:

XIMEA warrants to the Original Purchaser that the Camera provided is guaranteed to be free from material and manufacturing defects for a period of two years. Should a unit fail during this period, XIMEA will, at its option, repair or replace the damaged unit. Repaired or replaced Products are covered for the remainder of the original Product warranty period.

Please note our explanations regarding the usage and handling of board level cameras and related restrictions of warranty (see

6.3.11 Safety instructions for board level cameras). Warranty is void if any proprietary labeling is removed. This warranty does not apply to units that, after being examined by XIMEA,

have been found to have failed due to customer abuse, mishandling, alteration, improper installation or negligence. If the original camera module is housed within a case, removing the case for any purpose voids this warranty. This warranty does not apply to damage to any part of the optical path resulting from removal or replacement of the protective glass or filter over the camera, such as scratched glass or sensor damage. If the camera is disassembled, reworked or repaired by anyone other than a recommended service person, XIMEA or its suppliers will take no responsibility for the subsequent performance or quality of the camera.

XIMEA expressly disclaims and excludes all other warranties, express, implied and statutory, including, but without limitation, warranty of merchantability and fitness for a particular application or purpose. In no event shall XIMEA be liable to the Original Purchaser or any third party for direct, indirect, incidental, consequential, special or accidental damages, including without limitation damages for business interruption, loss of profits, revenue, data or bodily injury or death except in case of willful misconduct by XIMEA or employees of XIMEA.

6.5. Disclaimer of Warranty

In addition to the provisions of Article XII of the Standard Terms & Conditions of XIMEA GmbH (see 6.7 Standard Terms & Conditions of XIMEA GmbH) the following apply:

Although XIMEA has taken care to ensure the accuracy of the information contained herein it accepts no responsibility for the consequences of any use thereof and also reserves the right to change the specification of goods without notice.

XIMEA does not assume any liability for damage that is the result of improper use of its products or failure to comply with the operating manuals or the applicable rules and regulations.

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6.6. List Of Trademarks

XIMEA, xiC xiQ, xiMU, xiB, xiB-64, xiX, xSWITCH, xPLATFORM, xEC, xEC-II, xiCool, xiRAY, xiCe and CURRERA are trademarks or registered trademarks of XIMEA GmbH in Germany, Slovakia, USA and other countries.

Microsoft, Windows, Windows 10, Windows 8, Windows 7, Windows Vista, and Windows XP are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Apple, the Apple logo, Macintosh, MacOS, OS X, Bonjour, the Bonjour logo and the Bonjour symbol are trademarks of Apple Computer, Inc. Linux is a trademark of Linus Torvalds. The USB3 Vision is trademark owned by the AIA.

All other brands, service provision brands and logos referred to are brands, service provision brands and logos belonging to their respective owners.

6.7. Standard Terms & Conditions of XIMEA GmbH

General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry ("Grüne Lieferbedingungen" – GL)* for commercial transactions between businesses recommended by ZVEI-Zentralverband Elektrotechnik- und Elektronikindustrie e. V. as of June 2011

Article I: General Provisions

1. Legal relations between Supplier and Purchaser in connection with supplies and/or services of the Supplier (hereinafter referred to as "Supplies") shall be solely governed by the present GL. The Purchaser's general terms and conditions shall apply only if expressly accepted by the Supplier in writing. The scope of delivery shall be determined by the congruent mutual written declarations.

2. The Supplier herewith reserves any industrial property rights and/or copyrights pertaining to its cost estimates, drawings and other documents (hereinafter referred to as "Documents"). The Documents shall not be made accessible to third parties without the Supplier's prior consent and shall, upon request, be returned without undue delay to the Supplier if the contract is not awarded to the Supplier. Sentences 1 and 2 shall apply mutatis mutandis to the Purchaser's Documents; these may, however, be made accessible to those third parties to whom the Supplier has rightfully subcontracted Supplies.

3. The Purchaser has the non-exclusive right to use standard software and firmware, provided that it remains unchanged, is used within the agreed performance parameters, and on the agreed equipment. Without express agreement the Purchaser may make one back-up copy of standard software.

4. Partial deliveries are allowed, unless they are unreasonable to accept for the Purchaser.

5. The term „claim for damages" used in the present GL also includes claims for indemnification for useless expenditure.

Article II: Prices, Terms of Payment, and Set-Off

1. Prices are ex works and excluding packaging; value added tax shall be added at the then applicable rate.

2. If the Supplier is also responsible for assembly or erection and unless otherwise agreed, the Purchaser shall pay the agreed remuneration and any incidental costs required, e. g. for traveling and transport as well as allowances.

3. Payments shall be made free Supplier's paying office.

4. The Purchaser may set off only those claims which are undisputed or non- appealable.

Article III: Retention of Title

1. The items pertaining to the Supplies ("Retained Goods") shall remain the Supplier's property until each and every claim the Supplier has against the Purchaser on account of the business relationship has been fulfilled. If the combined value of the Supplier's security interests exceeds the value of all secured claims by more than 20 %, the Supplier shall release a corresponding part of the security interest if so requested by the Purchaser; the Supplier shall be entitled to choose which security interest it wishes to release.

2. For the duration of the retention of title, the Purchaser may not pledge the Retained Goods or use them as security, and resale shall be possible only for resellers in the ordinary course of their business and only on condition that the reseller receives payment from its customer or makes the transfer of property to the customer dependent upon the customer fulfilling its obligation to effect payment.

3. Should Purchaser resell Retained Goods, it assigns to the Supplier, already today, all claims it will have against its customers out of the resale, including any collateral rights and all balance claims, as security, without any subsequent declarations to this effect being necessary. If the Retained Goods are sold on together with other items and no individual price has been agreed with

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respect to the Retained Goods, Purchaser shall assign to the Supplier such fraction of the total price claim as is attributable to the price of the Retained Goods invoiced by Supplier.

4. (a) Purchaser may process, amalgamate or combine Retained Goods with other items. Processing is made for Supplier. Purchaser shall store the new item thus created for Supplier, exercising the due care of a diligent business person. The new items are considered as Retained Goods.

(b) Already today, Supplier and Purchaser agree that if Retained Goods are combined or amalgamated with other items that are not the property of Supplier, Supplier shall acquire co-ownership in the new item in proportion of the value of the Retained Goods combined or amalgamated to the other items at the time of combination or amalgamation. In this respect, the new items are considered as Retained Goods.

(c) The provisions on the assignment of claims according to No. 3 above shall also apply to the new item. The assignment, however, shall only apply to the amount corresponding to the value invoiced by Supplier for the Retained Goods that have been processed, combined or amalgamated.

(d) Where Purchaser combines Retained Goods with real estate or movable goods, it shall, without any further declaration being necessary to this effect, also assign to Supplier as security its claim to consideration for the combination, including all collateral rights for the prorate amount of the value the combined Retained Goods have on the other combined items at the time of the combination.

5. Until further notice, Purchaser may collect assigned claims relating to the resale. Supplier is entitled to withdraw Purchaser's permission to collect funds for good reason, including, but not limited to delayed payment, suspension of payments, start of insolvency proceedings, protest or justified indications for overindebtedness or pending insolvency of Purchaser. In addition, Supplier may, upon expiry of an adequate period of notice disclose the assignment, realize the claims assigned and demand that Purchaser informs its customer of the assignment.

6. The Purchaser shall inform the Supplier forthwith of any seizure or other act of intervention by third parties. If a reasonable interest can be proven, Purchaser shall, without undue delay, provide Supplier with the information and/or Documents necessary to assert the claims it has against its customers.

7. Where the Purchaser fails to fulfill its duties, fails to make payment due, or otherwise violates its obligations the Supplier shall be entitled to rescind the contract and take back the Retained Goods in the case of continued failure following expiry of a reasonable remedy period set by the Supplier; the statutory provisions providing that a remedy period is not needed shall be unaffected. The Purchaser shall be obliged to return the Retained Goods. The fact that the Supplier takes back Retained Goods and/or exercises the retention of title, or has the Retained Goods seized, shall not be construed to constitute a rescission of the contract, unless the Supplier so expressly declares.

Article IV: Time for Supplies; Delay

1. Times set for Supplies shall only be binding if all Documents to be furnished by the Purchaser, necessary permits and approvals, especially concerning plans, are received in time and if agreed terms of payment and other obligations of the Purchaser are fulfilled. If these conditions are not fulfilled in time, times set shall be extended reasonably; this shall not apply if the Supplier is responsible for the delay.

2. If non-observance of the times set is due to: (a) force majeure, such as mobilization, war, terror attacks, rebellion or similar events (e. g. strike or lockout); (b) virus attacks or other attacks on the Supplier’s IT systems occurring despite protective measures were in place that complied

with the principles of proper care; (c) hindrances attributable to German, US or otherwise applicable national, EU or international rules of foreign trade law or to

other circumstances for which Supplier is not responsible; or (d) the fact that Supplier does not receive its own supplies in due time or in due form such times shall be extended accordingly.

3. If the Supplier is responsible for the delay (hereinafter referred to as "Delay") and the Purchaser has demonstrably suffered a loss therefrom, the Purchaser may claim a compensation as liquidated damages of 0.5 % for every completed week of Delay, but in no case more than a total of 5 % of the price of that part of the Supplies which due to the Delay could not be put to the intended use.

4. Purchaser's claims for damages due to delayed Supplies as well as claims for damages in lieu of performance exceeding the limits specified in No. 3 above are excluded in all cases of delayed Supplies, even upon expiry of a time set to the Supplier to effect the Supplies. This shall not apply in cases of liability based on intent, gross negligence, or due to loss of life, bodily injury or damage to health. Rescission of the contract by the Purchaser based on statute is limited to cases where the Supplier is responsible for the delay. The above provisions do not imply a change in the burden of proof to the detriment of the Purchaser.

5. At the Supplier's request, the Purchaser shall declare within a reasonable period of time whether it, due to the delayed Supplies, rescinds the contract or insists on the delivery of the Supplies.

6. If dispatch or delivery, due to Purchaser's request, is delayed by more than one month after notification of the readiness for dispatch was given, the Purchaser may be charged, for every additional month commenced, storage costs of 0.5 % of the price

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of the items of the Supplies, but in no case more than a total of 5 %. The parties to the contract may prove that higher or, as the case may be, lower storage costs have been incurred.

Article V: Passing of Risk

1. Even where delivery has been agreed freight free, the risk shall pass to the Purchaser as follows: (a) if the delivery does not include assembly or erection, at the time when it is shipped or picked up by the carrier. Upon the

Purchaser's request, the Supplier shall insure the delivery against the usual risks of transport at the Purchaser's expense; (b) if the delivery includes assembly or erection, at the day of taking over in the Purchaser's own works or, if so agreed, after a

successful trial run.

2. The risk shall pass to the Purchaser if dispatch, delivery, the start or performance of assembly or erection, the taking over in the Purchaser's own works, or the trial run is delayed for reasons for which the Purchaser is responsible or if the Purchaser has otherwise failed to accept the Supplies.

Article VI: Assembly and Erection Unless otherwise agreed in written form, assembly and erection shall be subject to the following provisions:

1. Purchaser shall provide at its own expense and in due time: (a) all earth and construction work and other ancillary work outside the Supplier's scope, including the necessary skilled and

unskilled labor, construction materials and tools; (b) the equipment and materials necessary for assembly and commissioning such as scaffolds, lifting equipment and other

devices as well as fuels and lubricants; (c) energy and water at the point of use including connections, heating and lighting; (d) suitable dry and lockable rooms of sufficient size adjacent to the site for the storage of machine parts, apparatus, materials,

tools, etc. and adequate working and recreation rooms for the erection personnel, including sanitary facilities as are appropriate in the specific circumstances; furthermore, the Purchaser shall take all measures it would take for the protection of its own possessions to protect the possessions of the Supplier and of the erection personnel at the site;

(e) protective clothing and protective devices needed due to particular conditions prevailing on the specific site.

2. Before the erection work starts, the Purchaser shall unsolicitedly make available any information required concerning the location of concealed electric power, gas and water lines or of similar installations as well as the necessary structural data.

3. Prior to assembly or erection, the materials and equipment necessary for the work to start must be available on the site of assembly or erection and any preparatory work must have advanced to such a degree that assembly or erection can be started as agreed and carried out without interruption. Access roads and the site of assembly or erection must be level and clear.

4. If assembly, erection or commissioning is delayed due to circumstances for which the Supplier is not responsible, the Purchaser shall bear the reasonable costs incurred for idle times and any additional traveling expenditure of the Supplier or the erection personnel.

5. The Purchaser shall attest to the hours worked by the erection personnel towards the Supplier at weekly intervals and the Purchaser shall immediately confirm in written form if assembly, erection or commissioning has been completed.

6. If, after completion, the Supplier demands acceptance of the Supplies, the Purchaser shall comply therewith within a period of two weeks. The same consequences as upon acceptance arise if and when the Purchaser lets the two week period expire or the Supplies are put to use after completion of agreed test phases, if any.

Article VII: Receiving Supplies The Purchaser shall not refuse to receive Supplies due to minor defects.

Article VIII: Defects as to Quality The Supplier shall be liable for defects as to quality ("Sachmängel", hereinafter referred to as "Defects",) as follows:

1. Defective parts or defective services shall be, at the Supplier's discretion, repaired, replaced or provided again free of charge, provided that the reason for the Defect had already existed at the time when the risk passed.

2. Claims for repair or replacement are subject to a statute of limitations of 12 months calculated from the start of the statutory statute of limitations; the same shall apply mutatis mutandis in the case of rescission and reduction. This shall not apply where longer periods are prescribed by law according to Sec. 438 para. 1 No. 2 (buildings and things used for a building), Sec. 479 para. 1 (right of recourse), and Sec. 634a para. 1 No. 2 (defects of a building) German Civil Code ("Bürgerliches Gesetzbuch"), in the case of intent, fraudulent concealment of the Defect or non-compliance with guaranteed characteristics (“Beschaffenheitsgarantie”). The legal provisions regarding suspension of the statute of limitations ("Ablaufhemmung", "Hemmung") and recommencement of limitation periods shall be unaffected.

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3. Notifications of Defect by the Purchaser shall be given in written form without undue delay.

4. In the case of notification of a Defect, the Purchaser may withhold payments to an amount that is in a reasonable proportion to the Defect. The Purchaser, however, may withhold payments only if the subject-matter of the notification of the Defect involved is justified and incontestable. The Purchaser has no right to withhold payments to the extent that its claim of a Defect is timebarred. Unjustified notifications of Defect shall entitle the Supplier to demand reimbursement of its expenses by the Purchaser.

5. The Supplier shall be given the opportunity to repair or to replace the defective good ("Nacherfüllung") within a reasonable period of time.

6. If repair or replacement is unsuccessful, the Purchaser is entitled to rescind the contract or reduce the remuneration; any claims for damages the Purchaser may have according to No. 10 shall be unaffected.

7. There shall be no claims based on Defect in cases of insignificant deviations from the agreed quality, of only minor impairment of usability, of natural wear and tear, or damage arising after the passing of risk from faulty or negligent handling, excessive strain, unsuitable equipment, defective civil works, inappropriate foundation soil, or claims based on particular external influences not assumed under the contract, or from non-reproducible software errors. Claims based on defects attributable to improper modifications or repair work carried out by the Purchaser or third parties and the consequences thereof are likewise excluded.

8. The Purchaser shall have no claim with respect to expenses incurred in the course of supplementary performance, including costs of travel, transport, labor, and material, to the extent that expenses are increased because the subject matter of the Supplies has subsequently been brought to another location than the Purchaser's branch office, unless doing so complies with the normal use of the Supplies.

9. The Purchaser's right of recourse against the Supplier pursuant to Sec. 478 BGB is limited to cases where the Purchaser has not concluded an agreement with its customers exceeding the scope of the statutory provisions governing claims based on Defects. Moreover, No. 8 above shall apply mutatis mutandis to the scope of the right of recourse the Purchaser has against the Supplier pursuant to Sec. 478 para. 2 BGB.

10. The Purchaser shall have no claim for damages based on Defects. This shall not apply to the extent that a Defect has been fraudulently concealed, the guaranteed characteristics are not complied with, in the case of loss of life, bodily injury or damage to health, and/or intentionally or grossly negligent breach of contract on the part of the Supplier. The above provisions do not imply a change in the burden of proof to the detriment of the Purchaser. Any other or additional claims of the Purchaser exceeding the claims provided for in this Article VIII, based on a Defect, are excluded.

Article IX: Industrial Property Rights and Copyrights; Defects in Title

1. Unless otherwise agreed, the Supplier shall provide the Supplies free from third parties' industrial property rights and copyrights (hereinafter referred to as "IPR") with respect to the country of the place of delivery only. If a third party asserts a justified claim against the Purchaser based on an infringement of an IPR by the Supplies made by the Supplier and used in conformity with the contract, the Supplier shall be liable to the Purchaser within the time period stipulated in Article VIII No. 2 as follows:

(a) The Supplier shall choose whether to acquire, at its own expense, the right to use the IPR with respect to the Supplies concerned or whether to modify the Supplies such that they no longer infringe the IPR or replace them. If this would be impossible for the Supplier under reasonable conditions, the Purchaser may rescind the contract or reduce the remuneration pursuant to the applicable statutory provisions;

(b) The Supplier's liability to pay damages is governed by Article XII; (c) The above obligations of the Supplier shall apply only if the Purchaser (i) immediately notifies the Supplier of any such claim

asserted by the third party in written form, (ii) does not concede the existence of an infringement and (iii) leaves any protective measures and settlement negotiations to the Supplier's discretion. If the Purchaser stops using the Supplies in order to reduce the damage or for other good reason, it shall be obliged to point out to the third party that no acknowledgement of the alleged infringement may be inferred from the fact that the use has been discontinued.

2. Claims of the Purchaser shall be excluded if it is responsible for the infringement of an IPR.

3. Claims of the Purchaser are also excluded if the infringement of the IPR is caused by specifications made by the Purchaser, by a type of use not foreseeable by the Supplier or by the Supplies being modified by the Purchaser or being used together with products not provided by the Supplier.

4. In addition, with respect to claims by the Purchaser pursuant to No. 1 a) above, Article VIII Nos. 4, 5, and 9 shall apply mutatis mutandis in the event of an infringement of an IPR.

5. Where other defects in title occur, Article VIII shall apply mutatis mutandis.

6. Any other claims of the Purchaser against the Supplier or its agents or any such claims exceeding the claims provided for in this Article IX, based on a defect in title, are excluded.

Article X: Conditional Performance

XIMEA CB120CG-CM, CB120MG-CM, CB200MG-CM, CB200CG-CM, CB500MG-CM Technical Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Introduction

1.1. About This Manual

1.2. About XIMEA

1.2.1. Contact XIMEA

1.3. Standard Conformity

1.3.1. CE Conformity

1.3.2. For customers in the US: FCC Conformity

1.3.3. For customers in Canada

1.3.4. RoHS Conformity

1.3.5. WEEE Conformity

1.3.6. GenICam GenTL API

1.4. Helpful Links

1.4.1. Table of Contents

2. xiB Camera Series

2.1. What is xiB

2.2. Advantages

2.3. PCI Express Vision Camera Applications

2.4. Common features

2.5. Model Nomenclature

2.6. Models Overview, sensor and models

2.7. Options

2.8. Accessories

3. Hardware Specification

3.1. Power Supply

3.2. General Specification

3.2.1. Environment

3.2.2. Firmware / Host driver / API features

3.3. Lens Mount

3.4. Mounting points

3.5. Optical path

3.6. Model Specific Characteristics

3.6.1. CB120xG-CM

3.6.1.1. Sensor and camera parameters

3.6.1.2. Quantum efficiency curves [%]

3.6.1.3. Dimensional drawings CB120xG-CM

3.6.1.4. Referenced documents

3.6.1.5. Sensor features

3.6.2. CB200xG-CM

3.6.2.1. Sensor and camera parameters

3.6.2.2. Quantum efficiency curves [%]

3.6.2.3. Dimensional drawings CB200xG-CM

3.6.2.4. Referenced documents

3.6.2.5. Sensor features

3.6.3. CB500xG-CM

3.6.3.1. Sensor and camera parameters

3.6.3.2. Quantum efficiency curves [%]

3.6.3.3. Dimensional drawings CB500xG-CM (with and without EF mount)

3.6.3.4. Referenced documents

3.6.3.5. Sensor features

3.6.4. CB013xG-LX-X8G3

3.6.4.1. Sensor and camera parameters

3.6.4.2. Quantum efficiency curves [%]

3.6.4.3. Dimensional drawings CB013xG-LX-X8G3

3.6.4.4. Referenced documents

3.6.4.5. Sensor features

3.6.5. CB019xG-LX-X8G3

3.6.5.1. Sensor and camera parameters

3.6.5.2. Quantum efficiency curves [%]

3.6.5.3. Dimensional drawings CB019xG-LX-X8G3

3.6.5.4. Referenced documents

3.6.5.5. Sensor features

3.6.6. CB120xG-CM-X8G3

3.6.6.1. Sensor and camera parameters

3.6.6.2. Quantum efficiency curves [%]

3.6.6.3. Dimensional drawings CB120xG-CM-X8G3

3.6.6.4. Referenced documents

3.6.6.5. Sensor features

3.7. User interface – LEDs

3.8. xiB, xiB-64 PCIe Interface

3.9. Digital Input / Output (GPIO) Interface and Power

3.9.1. Location

3.9.2. IO Connector Pinning

3.9.3. Power input

3.9.4. Optically isolated Digital Input

3.9.4.1. Optically isolated Digital Input - General info

3.9.4.2. Digital Input – signal levels