The ZCU111 evaluation board features the Zynq® UltraScale+™ RFSoC ZCU28DR device.
This board enables the evaluation of the integrated RF-DAC and RF-ADC functionality, soft
decision forward error correction (SDFEC), and FPGA fabric and RFSoC features, such as the
quad core Arm® Cortex™-A53 processing system (PS) and the dual-core Arm Cortex-R5
real-time processors. The ZCU111 evaluation board is equipped with many of the common
board-level features needed for design development, such as DDR4 memory, networking
interfaces, FMC+ expansion port, and access to the new RF-FMC interface.
The Z C U111 eva luation b oard kit i ncludes a n out-of - the-box FMC XM500 balun transformer
add-on card to support signal analysis and loopback evaluation. This card includes
on-board high-frequency and low frequency baluns and SMAs for custom baluns and
filtering. For more information on this card, see Appendix D, HW-FMC-XM500.
Chapter 1
Additional Resources
See Appendix E, Additional Resources and Legal Notices for references to documents, files,
and resources relevant to the ZCU111 evaluation board.
ZCU111 Board User Guide6
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X-Ref Target - Figure 1-1
RFMC_ADC[06:07]
RFMC_ADC[00:01]
RFMC_ADC[04:05]
RFMC_ADC[02:03]
X21110-062118
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Chapter 1: Introduction
Block Diagram
The ZCU111 board block diagram is shown in Figure 1-1.
ZCU111 Board User Guide7
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Figure 1-1:ZCU111 Evaluation Board Block Diagram
Board Features
The ZCU111 evaluation board features are listed here. Detailed information for each feature
is provided in Board Component Descriptions in Chapter 3.
•XCZU28DR-2E, FFVG1517 package
•Form factor: rectangular 11.811 in. x 7.874 in. x 0.1 in.
•Configuration from:
Dual Quad SPI
°
Micro SD card
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°
USB-to-JTAG bridge
°
•Clocks
GTR_REF_CLK_DP 27 MHz
°
GTR_REF_CLK_USB3 26 MHz
°
GTR_REF_CLK_SATA 125 MHz
°
CLK_100 100 MHz
°
CLK_125 125 MHz
°
PS_REF_CLK 33.33 MHz
°
USER_MGT_SI570 (default 156.25 MHz)
°
USER_SI570 (default 300 MHz)
°
•PS DDR4 4 GB 64-bit SODIMM
•PL DDR4 4 GB 64-bit component (4x16-bit)
Chapter 1: Introduction
•PS GTR (bank 505) assignment
DisplayPort 1.2 transmit only (two GTR)
°
USB3 (one GTR)
°
SATA with M2 connector (one GTR)
°
•PL GTY assignment (16 total)
SFP28 (four, bank GTY128)
°
FMCP HSCP DP (four, bank GTY129)
°
FMCP HSCP DP (four, bank GTY130)
°
FMCP HSCP DP (four, bank GTY131)
°
•PL FMCP HSCP (FMC+) connectivity - full LA[00:33] bus
•PS MIO connectivity
PS MIO[0:5, 7:12]: dual Quad SPI flash memory
°
PS MIO[13]: PS_GPIO2
°
PS MIO[14:17]: two channels of I2C
°
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PS MIO[18:19]: UART (one of three FT4232 UART channels)
°
PS MIO[22:23]: PS_PB, PS_LED I/F
°
PS MIO[26]: platform management unit (PMU)
°
PS MIO[27:30]: DisplayPort control
°
PS MIO[32:37]: PMU_GPIO[0:5]
SendFeedback
°
PS MIO[38]: PS_GPIO1
°
PS MIO[44:51]: SD I/F
°
PS MIO[52:63]: USB3.0
°
PS MIO[64:77]: GEM3 Ethernet
°
•PL I/O connections:
PL-side user DIP switch (8-position)
°
PL-side CPU reset pushbutton
°
PL-side user LEDs (eight)
°
PL-side user pushbuttons (five, geographic N, S, E, W, C)
•Operational status LEDs (INIT, DONE, PS STATUS, PGOOD)
•Power management
•System controller (MSP430)
The ZCU111 provides a rapid prototyping platform using the XCZU28DR-2EFFVG1517
device. See the Zynq UltraScale+ RFSoC Data Sheet: Overview (DS889) [Ref 1] for a feature
set overview, description, and ordering information.
Board Specifications
Dimensions
Height: 11.811 inches (30.0 cm)
Width: 7.874 inches (20.0 cm)
Thickness: 100.8 mil (0.2743 cm)
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Note:
A 3D model of this board is not available.
See ZCU111 board documentation for the XDC listing and board schematics.
Environmental
SendFeedback
Temperature
Operating: 0°C to +45°C
Storage: -25°C to +60°C
Humidity
10% to 90% non-condensing
Operating Voltage
Chapter 1: Introduction
+12 V
DC
ZCU111 Board User Guide10
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Board Setup and Configuration
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Board Component Location
Figure 2-1 shows the ZCU111 board component locations. Each numbered component
shown in the figure is keyed to Tab l e 2- 1. Ta ble 2 -1 identifies the components, references
the respective schematic (0381811) page numbers, and links to a detailed functional
description of the components and board features in Chapter 3.
IMPORTANT: Figure 2-1 is for visual reference only and might not reflect the current revision of the
board.
IMPORTANT: There could be multiple revisions of this board. The specific details concerning the
differences between revisions are not captured in this document. This document is not intended to be
a reference design guide and the information herein should not be used as such. Always refer to the
schematic, layout, and XDC files of the specific ZCU111 version of interest for such details.
Chapter 2
CAUTION! The ZCU111 board can be damaged by electrostatic discharge (ESD). Follow standard ESD
prevention measures when handling the board.
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X-Ref Target - Figure 2-1
1
00
Round callout references a component
on the front side of the board
Square callout references a component
on the back side of the board
18J89ZU28DR RFSoC U1 ADC bank 224 ADC_REXT selectOff9
On: bank 224 ADC_REXT pin AB8 = GND
Off: bank 224 ADC_REXT pin AB8 = 2.49K to GND
19J90ZU28DR RFSoC U1 DAC bank 228 DAC_REXT selectOff10
On: bank 228 DAC_REXT pin W8 = GND
Off: bank 228 DAC_REXT pin W8 = 2.49K to GND
20J101SPI CS select header66
1-2:
3-4:
5-6:
7-8:
21J111SPI SDO select header66
1-2:
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3-4:
5-6:
Table 2-2:Default Jumper Settings (Cont’d)
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Chapter 2: Board Setup and Configuration
Callout
Number
7-8:
22J110U92 12.8MHz TXCO powerOn67
On: U92 is on
Off: U92 is off
Ref DesFunctionDefault
Switches
Table 2-3:Default Switch Settings
Callout
Number
23SW6RFSoC U1 Mode 4-Pole DIP Switch001012
Switch OFF = 1 = High; ON = 0 = Low
Mode = SW6[4:1] = Mode[3:0]
JTAG = ON,ON,ON,ON = 0000
QSPI32 = ON,ON,OFF,ON = 0010
SD = OFF,OFF,OFF,ON = 1110
24SW2PS_PROG_B pushbutton
25SW3PS_POR_B pushbutton
Ref DesFunctionDefault
(1)
(1)
SW4PS_SRST_B pushbutton
(1)
Schematic
Page
Schematic
Page
12
12
12
26SW8
27SW8
28SW9GPIO pushbutton (geographic) GPIO_SW_N
SW10GPIO pushbutton (geographic) GPIO_SW_W
SW11GPIO pushbutton (geographic) GPIO_SW_C
SW12GPIO pushbutton (geographic) GPIO_SW_E
SW13GPIO pushbutton (geographic) GPIO_SW_S
29SW14
30SW15CPU_RESET pushbutton
31SW16Main power slide switchoff46
32SW19PS MIO22_BUTTON pushbutton
Notes:
1. Pushbutton switch default = open (not pressed).
MSP430 U42 5-Pole GPIO DIP switch
Switch Off = 1 = High; On = 0 = Low
RST_B pushbutton for MSP430 U42/MSP430
EMUL. cable J92
GPIO 8 -Pole D IP sw it ch
Switch Off = 0 = Low; On = 1 = High
1111132
(1)
(1)
(1)
(1)
(1)
(1)
0000000041
(1)
(1)
32
41
41
41
41
41
41
11
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Chapter 2: Board Setup and Configuration
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RFSoC Device Configuration
Zynq UltraScale+ XC ZU28 DR-2 E RFS oC de vices use a multi-stage boot process as described
in the “Boot and Configuration” chapter of the Zynq UltraScale+ Device Technical Reference Manual (UG1085) [Ref 3]. Switch SW6 configuration option settings are listed in Tabl e 2- 4 .
Vivado®, Xilinx SDK, or third-party tools can establish a JTAG connection to the Zynq
UltraScale+ RFSoC device through the FTDI FT4232 USB-to-JTAG/USB UART device (U34)
connected to micro-USB connector (J83).
Quad SPI
To boot from the dual Quad SPI nonvolatile configuration memory:
1. Store a valid Zynq UltraScale+ RFSoC boot image in the Quad SPI flash devices
connected to the MIO Quad SPI interface. See the ZCU111 Restoring Flash Tutorial
XTP515 [Ref 13] for information on programming the QSPI.
2. Set the boot mode pins SW6 [3:0] PS_MODE[3:0] as indicated in Ta b le 2 - 4 for Quad
SPI32.
3. Either power-cycle or press the power-on reset (POR) pushbutton. SW6 is callout 46 in
Figure 2-1.
SD
To boot from an SD card:
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1. Store a valid Zynq UltraScale+ RFSoC boot image file on to an SD card (and then plug
the SD card into ZCU111 board socket J100).
2. Set the boot mode pins SW6 [3:0] PS_MODE[3:0] as indicated in Ta b le 2 - 4 for SD.
3. Either power-cycle or press the power-on reset (POR) pushbutton. SW6 is callout 46 in
Figure 2-1.
Chapter 2: Board Setup and Configuration
SendFeedback
See the Zynq UltraScale+ Device Technical Reference Manual (UG1085) [Ref 3] for more
information about Zynq UltraScale+ RFSoC configuration options.
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Board Component Descriptions
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Overview
This chapter provides a detailed functional description of the board’s components and
features. Tab le 2-1 , pa ge 13 identifies the components, references the respective schematic
page numbers, and links to the corresponding detailed functional description in this
chapter. Component locations are shown in Figure 2-1, page 12.
Component Descriptions
Chapter 3
Zynq UltraScale+ XCZU28DR RFSoC
[Figure 2-1, callout 1]
The ZCU111 board is populated with the Zynq UltraScale+ XCZU28DR-2FFVG1517 RFSoC,
which combines a powerful processing system (PS) and programmable logic (PL) in the
same device. The PS in a Zynq UltraScale+ RFSoC features the Arm
64-bit quad-core processor and Cortex-R5 dual-core real-time processor.
For additional information on the Zynq UltraScale+ XCZU28DR-2FFVG1517 RFSoC, see the
Zynq UltraScale+ RFSoC Data Sheet (DS926) [Ref 2]. See the Zynq UltraScale+ Device
Technical Reference Manual (UG1085) [Ref 3] for more information about Zynq UltraScale+
RFSoC configuration options.
®
flagship Cortex®-A53
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Chapter 3: Board Component Descriptions
X20480-062118
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Encryption Key Battery Backup Circuit
The XCZU28DR RFSoC U1 implements bitstream encryption key technology. The ZCU111
board provides the encryption key backup battery circuit shown in Figure 3-1.
X-Ref Target - Figure 3-1
ZCU111 Board User Guide23
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Figure 3-1:Encryption Key Backup Circuit
The Seiko TS518FE rechargeable 1.5V lithium button-type battery B1 is soldered to the
board with the positive output connected to the XCZU28DR-2E RFSoC U1 V
Y23. The battery supply current I
specification is 150 nA maximum when board power is
BATT
CC_PSBATT
pin
off. B1 is charged from the UTIL_1V8 1.8V rail through a series diode with a typical forward
voltage drop of 0.38V and 4.7 ΩK current limit resistor. The nominal charging voltage is
1.42V.
Chapter 3: Board Component Descriptions
SendFeedback
I/O Voltage Rails
The XCZU28DR RFSoC PL I/O bank voltages on the ZCU111 board are listed in Tabl e 3-1 .
Table 3-1:I/O Voltage Rails
XCZU28DR
PL bank 64VCC1V81.8VGPIO
PL bank 65VADJ_FMC
PL bank 66VADJ_FMC
PL bank 67VCC1V21.2VPL_DDR4_DQ[32:63]
PL bank 68VCCIV21.2VPL_DDR4_DQ[0:31], SFPx_TX_DISABLE, SYSMON_SDA/SCL
PL bank 69VCC1V21.2VPL_DDR4 ADDR/CTRL, PMOD0&1[0:7],MSP430_GPIO[0:3]
PL bank 84VCC1V81.8VADCIO[0:19], GPIO_SW[N,E,C,W]
PL bank 87VCC1V81.8VDACIO[0:19], GPIO_SW[S], SFP_SI5382_CLK_IN_SEL
PS bank 500VCC1V81.8VQSPI LWR/UPR, PS_GPIO2, I2Cx_SDA/SCL, UART0_RXD/TXD
PS bank 501VCC1V81.8VDP CTRL, PMU_GPO[0:5], SDIO I/F, PS_GPIO1
PS bank 502VCC1V81.8VUSB I/F, ENET I/F
PS bank 503VCC1V81.8VPS CONFIG I/F
PS bank 504VCC1V21.2VPS_DDR4 64-BIT SODIMM I/F
Notes:
1. The ZCU111 board is shipped with VADJ_FMC set to 1.8V by the MSP430 system controller.
Power Net
Name
(1)
(1)
VoltageConnected To
1.8VFMCP_HSPC LA BUS [0:16]
1.8VFMCP_HSPC LA BUS [17:32]
PS-Side: DDR4 SODIMM Socket
[Figure 2-1, callout 2]
The PS-side memory is wired to the Zynq UltraScale+ DDRC bank 504 hard memory
controller. A 64-bit single rank DDR4 SODIMM is inserted into socket J50. The ZCU111
board is shipped with a DDR4 SODIMM installed:
•Manufacturer: Micron
•Part Number: MTA4ATF51264HZ-2G6E1
•Description:
4 GByte 260-pin DDR4 SODIMM
°
Single rank x16
°
512 Mbit x 64-bit
°
Supports 1333 MT/s – 2666 MT/s
°
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Chapter 3: Board Component Descriptions
SendFeedback
The ZCU111 XCZU28DR RFSoC PS DDR interface maximum 2133 MT/s performance is
documented in the Zynq UltraScale+ RFSoC Data Sheet (DS926)[Ref 2].
The ZCU111 DDR4 SODIMM interface adheres to the constraints guidelines documented in
the PCB guidelines for DDR4 section of the UltraScale Architecture PCB Design User Guide
(UG583) [Ref 4]. The DDR4 SODIMM interface is a 40Ω impedance implementation. Other
memory interface details are also available in the UltraScale Architecture-Based FPGAs Memory IP LogiCORE IP Product Guide (PG150) [Ref 5]. For more details, see the Micron
MTA4ATF51264HZ-2G6E1 data sheet at the Micron website [Ref 15].
The connections between the DDR4 SODIMM socket J50 and XCZU28DR PS bank 504 are
referenced in Appendix B, Xilinx Design Constraints.
PL-Side: DDR4 Component Memory
[Figure 2-1, callout 3]
The 4 GB, 64-bit wide DDR4 memory system is comprised of four 512 Mb x 16 SDRAM, U80
and U94-U96.
•Manufacturer: Micron
•Part Number: MT40A512M16JY-075E
•Description:
8 Gb (512 Mb x 16)
°
1.2V 96-ball TFBGA
°
DDR4-2666
°
This memory system is connected to PL-side XCZU28DR banks 67, 68, and 69. The DDR4
0.6V VTT termination voltage is supplied from sink-source regulator U81.
The ZCU111 board DDR4 64-bit component memory interface adheres to the constraints
guidelines documented in the PCB guidelines for DDR4 section of UltraScale Architecture PCB Design User Guide (UG583) [Ref 4]. The ZCU111 DDR4 component interface is a 40Ω
impedance implementation. Other memory interface details are also available in the
UltraScale Architecture-Based FPGAs Memory IP LogiCORE IP Product Guide (PG150) [Ref 5].
For more details, see the Micron MTA4ATF51264HZ-2G6E1 data sheet at the Micron website
[Ref 15]
The connections between the DDR4 component memories and the XCZU28DR banks are
referenced in Appendix B, Xilinx Design Constraints.
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Chapter 3: Board Component Descriptions
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PSMIO
Tab l e 3- 2 provides PS MIO peripheral mapping implemented on the ZCU111 board. See the
Zynq UltraScale+ Device Technical Reference Manual (UG1085) [Ref 3] for more information
on PS MIO peripheral mapping.
Table 3-2:MIO Peripheral Mapping
MIO[0:25] Bank 500MIO[26:51] Bank 501MIO[52:77] Bank 502
0QSPI26PMU IN52USB0
1QSPI27DPAUX53USB0
2QSPI28 DPAUX54USB0
3QSPI29DPAUX55USB0
4QSPI30 DPAUX56USB0
5QSPI31Not assigned/no connect57USB0
6Not assigned/no connect32PMU OUT 58USB0
7QSPI33PMU OUT 59USB0
8QSPI34PMU OUT 60USB0
9QSPI35PMU OUT 61USB0
10QSPI36PMU OUT 62USB0
11QSPI37PMU OUT 63USB0
12QSPI38GPIO64GEM3
13GPIO39SD165GEM3
14I2C040SD166GEM3
15I2C041SD167GEM3
16I2C142SD168GEM3
17I2C143Not assigned/no connect69GEM3
18UART044Not assigned/no connect70GEM3
19UART045SD171GEM3
20Not assigned/no connect46SD172GEM3
21Not assigned/no connect46SD173GEM3
22GPIO48SD174GEM3
23GPIO49SD175GEM3
24Not assigned/no connect50SD176MDI03
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25Not assigned/no connect51SD177MDI03
Chapter 3: Board Component Descriptions
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Quad SPI Flash Memory (MIO 0–12)
[Figure 2-1, callout 4]
The Micron dual MT25QU02GCBB8E12-0sit serial NOR flash Quad SPI flash memory can
hold the boot image for the RFSoC system. This interface is used to support QSPI32 boot
mode as defined in the Zynq UltraScale+ Device Technical Reference Manual (UG1085)
[Ref 3].
The dual Quad SPI flash memory located at U17/U18 provides 4 Gb of non-volatile storage
that can be used for configuration and data storage.
•Part number: MT25QU02GCBB8E12-0SIT (Micron)
•Supply voltage: 1.8V
•Datapath width: 8 bits
•Data rate: various depending on single, dual, or quad mode
The configuration and Quad SPI flash memory section of the Zynq UltraScale+ Device Technical Reference Manual (UG1085) [Ref 3] provides details on using the memory. For
more Quad SPI details, see the Micron MT25QU02GCBB8E12-0SIT data sheet at the Micron
website [Ref 15].
The connections between the Quad SPI flash memory and XCZU28DR PS bank 500 are
referenced in Appendix B, Xilinx Design Constraints.
GPIO (MIO 13, 38)
These two GPIO bits are connected to the U42 MSP430 system controller for general
purpose signaling or communications between the Zynq UltraScale+ RFSoC device and the
MSP430 system controller. These signals are level-shifted by TSX0108E U41. The
connections between the U42 system controller and the XCZU28DR RFSoC are listed in
Tab l e 3- 3.
Table 3-3:System Controller U42 GPIO Connections to XCZU28DR U1
XCZU28DR (U1)
Pin
E27MIO38_PS_GPIO1P1_619
R28MIO13_PS_GPIO2P1_720
Net Name
Pin NamePin #
MSP430 U42
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X-Ref Target - Figure 3-2
Zynq UltraScale+
RFSoc PS-Side
RFSoC PL-Side
I2C0
PS_I2C0
PS_I2C1
PL_I2C0
PL_I2C1
0x74
0
1
2
3
4
5
6
7
EEPROM
SI5341
USER_SI570
USER_MGT_S1570
SI5328
I2CSP1
RFMC
N.C.
12C
Mux
#1
0x75
0
1
2
3
4
5
6
7
FMC+ HSPC
N.C.
SYSMON (DNP resistors)
PS_DDR4_SODIMM
SFP283
SFP282
SFP281
SFP280
12C
Mux
#2
0x75
0
1
2
3
INA226 PMBus
N.C.
IRPS5401 PS + PL Voltage Controller PMBus
SYSMON
12C
Mux
#3
PMBus Cable
0x20
GPIO
Expander
U22 TCA6416A
System Controller
P3
P4
U42 MSP430
U23 PCA9544A
I2C0
J19
I2C1
U27 TCA9548A
U26 TCA9548A
I2C1
U1 XCZU28DR
L/S
U19
L/S
U20
L/S
U25
L/S
U24
X20530-062118
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Chapter 3: Board Component Descriptions
I2C0 (MIO 14-15), I2C1 (MIO 16-17)
Figure 3-2 shows a high-level view of the I2C0 and I2C1 bus connectivity.
Figure 3-2:I2C0 and I2C1 Bus Connectivity Overview
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X-Ref Target - Figure 3-3
TCA6416A
P00
P01
P02
P04
P05
P06
MAX6643_OT_B
MAX6643_FANFAIL_B
MI026_PMU_INPUT_LS
SFP28_SI5328_INT_ALM
IIC_MUX_RESET_B
GEM3_EXP_RESET_B
SDA/
SCL
BANK 500
PS I2C0
MIO15/
MIO14
U1
BANK 64
PL I2C0
AW16/AT16
U1
MPS430
U42
22 P3_0
23 P3_1
L/S
U19
0x20
P10
P11
P12
P16
P17
FMC_HSPC_PRSNT_M2C_B
CLK_SPI_MUX_SEL0
CLK_SPI_MUX_SEL1
IRPS5401_ALERT_B
INA226_PMBUS_ALERT
U20
TCA6416A
SDA/
SCL
0x75
INA226_PMBUS_SCA/SCL
Not Connected
IRPS5401_PMBUS_SDA/SCL
SYSMON_SCA/SCL
U23
SD0/SC0
SD1/SC1
SD2/SC2
SD3/SC3
U22
I2C0_SDA/SCL
L/S
X20531-062118
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Chapter 3: Board Component Descriptions
I2C0 (MIO 14-15)
[Figure 2-1, callout 13]
The I2C bus I2C0 connects the RFSoC U1 PS bank 500, PL bank 64, and the system controller
U42 to a GPIO 16-bit port expander (TCA6416A U22) and I2C switch (PCA9544A U23). The
port expander enables controlling resets and power system enable pins, and accepting
various alarm inputs without requiring the PL-side to be configured. The I2C0 bus also
provides access to the PMBus power controllers and the INA226 power monitors via the
U23 PCA9544A switch. TCA6416A U22 is pin-strapped to respond to I2C address 0x20. The
PCA9544A U23 switch is set to 0x75.
The devices on each port of the I2C0 U22 TCA6416A port expander are listed in Tab l e 3- 4 ,
and the devices on each bus of the I2C0 U23 PCA9544A switch are listed in Ta bl e 3 - 5.
Figure 3-3 shows a high-level view of the I2C0 bus connectivity represented in Ta bl e 3 -4
and Tab le 3-5 .
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Figure 3-3:I2C0 Bus Topology
Chapter 3: Board Component Descriptions
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Table 3-4:I2C0 Port Expander TCA6416A U22 Addr. 0x20 Connections
TCA6416A
Connected To
U22
Schematic Net Name
Pin
Name
SDA23I2C0_SDA
SCL22I2C0_SCL
P00 4MAX6643_OT_B9OT_BU52MAX6643
P01 5MAX6643_FANFAIL_B4FANFAIL_BU52MAX6643
P02 6MIO26_PMU_INPUT_LS G25PS_MIO26U1XCZU28DR
P04 8SFP_SI5382_INT_ALM12INTRBU48SI5382A
P05 9IIC_MUX_RESET_B3RESET_BU26,U27TCA9548A
P06 10GEN3_EXP_RESET_B2BU14SN74LVC1G08
P1013FMCP_HSPC_PRSNT_M2C_B
P1114CLK_SPI_MUX_SEL014S0U97IDTQS3VH253QG8
Pin
No.
Pin
No.
4OEU45NC7SZ66P5X
H2PRSNT_M2C_LJ26(H)ASP_184329_01
Z1PRSNT_M2C_LJ26(Z)ASP_184329_01
Pin Name
Refer to connections shown inFigure 3-3.
TCA6416A U22 Addr. 0x20
Reference
Designator
Device
P1215CLK_SPI_MUX_SEL12S1U97IDTQS3VH253QG8
11INT2_BU23PCA9544A
P1619IRPS5401_ALERT_B
P1720INA226_PMBUS_ALERT
17ALERT_BU53,U55,U57IRPS5401
17SALERT_BU68,U70,U74,U75IR38060
4INT0_BU23PCA9544A
3ALERT
3ALERT
U3,U59-U61
U63-U66
INA226
U67,U69,U71,U73,
U77,U79
ZCU111 Board User Guide30
UG1271 (v1.1) August 6, 2018www.xilinx.com
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