The following table shows the revision history for this document.
DateVersionRevision
03/20/20171.2
11/16/20161.1
05/11/20161.0
Added notes to Dimensions in Chapter 1. Updated SW6 default switch setting in
Table 2-2 and SD configuration setting in Table 2-4. Clarified SW6[4:1] boot mode pin
settings under Quad-SPI and SD in Chapter 2. Changed “DDR SODIMM Memory J1”
heading to “DDR Component Memory” in Table 3-4. Changed PS_REF_CLK frequency
from 33 MHz to 33.33 MHz in Table 3-12. Changed “UART2_RTS_O_B” to
“UART2_CTS_O_B” in Table 3-16. Replaced Figure 3-16. Changed “QSPI119 (LWR),
U120 (UPR)” heading to “MSP430 U41” in Table 3-17. Clarified references to
Figure 3-17 in Table 3-19 and Table 3-20. Added addresses to titles in Table 3-21 and
Table 3-22 and headings in Table 3-23 and Table 3-24. Changed “22” to “L22” in
Table 3-28. Updated GTH connectivity for Quad 128, Quad 228, Quad 229, and
Quad 23 under GTH Transceivers in Chapter 3. Updated bank assignments in
Figure 3-35. Added callout 44 to Switches in Chapter 3. Updated Xilinx websites in
Appendix D, Additional Resources and Legal Notices.
Updated device part number from XCZU9EG-2FFVB1156 to XCZU9EG-2FFVB1156I
throughout document. Updated board photos (Figure 2-1 and Figure 2-1) to rev 1.0.
Updated Table 2-1 and Table 2-3. Updated Chapter 3, Component Descriptions.
Updated Appendix B, Master Constraints File Listing.
The ZCU102 is a general purpose evaluation board for rapid-prototyping based on the
Zynq® UltraScale+
speed DDR4 SODIMM and component memory interfaces, FMC expansion ports,
multi-gigabit per second serial transceivers, a variety of peripheral interfaces, and FPGA
logic for user customized designs provides a flexible prototyping platform.
™
XCZU9EG-2FFVB1156I MPSoC (multiprocessor system-on-chip). High
Chapter 1
ZCU102 Evaluation Board User Guidewww.xilinx.com6
UG1182 (v1.2) March 20, 2017
X-Ref Target - Figure 1-1
Prototype Header
Display Port Aux
MSP430 GPIO IIC0
Connection
Pages 44, 56, 38
The ZCU102 board block diagram is shown in Figure 1-1. Page numbers in the block
diagram reference the corresponding page number(s) of schematic 0381701.
Figure 1-1:ZCU102 Evaluation Board Block Diagram
ZCU102 Evaluation Board User Guidewww.xilinx.com7
UG1182 (v1.2) March 20, 2017
Chapter 1: Introduction
SendFeedback
Board Features
The ZCU102 evaluation board features are listed here. Detailed information for each feature
is provided in Chapter 3, Board Component Descriptions.
•XCZU9EG-2FFVB1156I MPSoC
•PL V
for range in datasheet
CCINT
•Form factor for PCIe Gen2x4 Host, Micro-ATX chassis footprint
•Operational Status LEDs (power supply status, INIT, DONE, PG, JTAG status, DDR power
good)
•Power Management
The ZCU102 evaluation board provides designers a rapid prototyping platform utilizing the
XCZU9EG-2FFVB1156I device. The ZU9EG contains many useful processor system (PS) hard
block peripherals exposed through the Multi-use I/O (MIO) interface and a variety of FPGA
programmable logic (PL), high-density (HD) and high-performance (HP) banks. Table 1-1
lists a brief summary of the resources available within the ZU9EG. A feature set overview,
description, and ordering information is provided in the UltraScale Architecture and Product Overview (DS890) [Ref 1].
Table 1-1:Zynq UltraScale+ MPSoC ZCU9EG Features and Resources
FeatureResource Count
HD banks5 banks, total of 120 pins
HP banks4 banks, total of 208 pins
ZCU102 Evaluation Board User Guidewww.xilinx.com9
UG1182 (v1.2) March 20, 2017
MIO banks3 banks, total of 78 pins
PS-side GTR 6 Gb/s transceivers4 PS-GTRs
PL-side GTH 16.3 Gb/s transceivers24 GTHs
Effective LEs575K
Chapter 1: Introduction
SendFeedback
Table 1-1:Zynq UltraScale+ MPSoC ZCU9EG Features and Resources (Cont’d)
FeatureResource Count
Logic cells480K
CLB flip-flops548K
Max. distributed RAM8.8 Mb
Total block RAM32.1 Mb
DSP slices2,520
Board Specifications
Dimensions
Width: 9.350 in. (23.749 cm)
Length: 9.600 in. (24.384 cm)
Thickness: 0.104 in. (0.2642 cm)
Notes:
•A 3D model of this board is not available.
•ZCU102 board documentation (xdc listing, schematics, layout files and board outline/fab
drawings, etc.) is available on the web at: www.xilinx.com/zcu102
.
Environmental
Temp erature
Operating: 0°C to +45°C
Storage: -25°C to +60°C
Humidity
10% to 90% non-condensing
Operating Voltage
ZCU102 Evaluation Board User Guidewww.xilinx.com10
UG1182 (v1.2) March 20, 2017
+12 V
DC
Board Setup and Configuration
SendFeedback
Board Component Location
Figure 2-1 shows the ZCU102 board component locations. Each numbered component
shown in Figure 2-1 is keyed to Table 2-1. Table 2-1 identifies the components, references
the respective schematic page numbers, and links to a detailed functional description of the
components and board features in Chapter 3.
IMPORTANT: Figure 2-1 is for visual reference only and might not reflect the latest revision of the
board. (This user guide documents ZCU102 Rev. 1.0 and later.)
IMPORTANT: There could be multiple revisions of this board. The specific details concerning the
differences between revisions is not captured in this document. This document is not intended to be a
reference design guide and the information herein should not be used as such. Always refer to the
schematic and xdc of the specific ZCU102 version of interest for such details.
Chapter 2
CAUTION! Electrostatic discharge (ESD) can cause board damage. Follow standard ESD prevention
measures when handling the board.
ZCU102 Evaluation Board User Guidewww.xilinx.com11
U122, J98CAN1 (MIO 24-25) (bus transceiver/2x4 male header) TI SN65HVD232,
SW1Power On/Off Slide Switch (Power On/Off slide
switch)
Programming Options)
compatible PMOD modules, see [Ref 23]. MPSoC U1
Bank 50 GPIO 2x12 male pin proto header
SMA (MGTH interface SMA connectors)ROSENBERGER
J79-J80
5 pole C&K SDA05H1SBD38
E-Switch TL3301EP100QG12
SULLINS PBC36DAAN
C&K 1201M2S3AQE259
AWHW16G-0202-T-R
ASSMANN
AWHW20G-0202-T-R
SULLINS PBC36DAAN
32K10K-400L5
50
57
22
56
40
ZCU102 Evaluation Board User Guidewww.xilinx.com14
UG1182 (v1.2) March 20, 2017
X-Ref Target - Figure 2-2
;
SendFeedback
Chapter 2:Board Setup and Configuration
Default Switch and Jumper Settings
Figure 2-2 shows the board jumper header and DIP switch locations. Each numbered
component shown in the figure is keyed to Table 2-2 (for default switch settings) or
Table 2-3 (for default jumper settings). Both tables reference the respective schematic page
numbers.
ZCU102 Evaluation Board User Guidewww.xilinx.com15
UG1182 (v1.2) March 20, 2017
Figure 2-2:DIP Switch and Board Header Jumper Locations
Switches
SendFeedback
Table 2-2:Default Switch Settings
Chapter 2:Board Setup and Configuration
DIP
Switch
SW1Main Power SwitchOFF2959
Switch PS_MODE select
• ON = pull down =
• OFF = pull up = 1
SW6
SW8
SW13
• MODE[3:0] = 0010 (selects QSPI32)
MSP430 GPIO 5-POLE
•ON = GND
• OFF = Open
GPIO 8-POLE
• OFF = pull down
• ON = pull up
FunctionDefault
0
4: PS_MODE3
3: PS_MODE2
2: PS_MODE1
1: PS_MODE0
1: SW0
2: SW1
3: SW2
4: SW3
5: SW4
ON
ON
OFF
ON
OFF
OFF
OFF
OFF
OFF
All OFF2853
Figure 2-2
Callout
2612
2738
Schematic
Page
Jumpers
Table 2-3:Default Jumper Settings
JumperFunctionDefault
POR_OVERRIDE
J85
J12
J13
J90
• 1-2: Enable
•2-3: Disable
SYSMON I2C Address
• Open: SYSMON_VP_R floating
• 1-2: SYSMON_VP_P pulled down
SYSMON I2C Address
• Open: SYSMON_VN_R floating
• 1-2: SYSMON_VP_N pulled down
SYSMON VREFP
• 1-2: 1.25V VREFP connected to FPGA
• 2-3: VREFP connected to GND
2-313
1-223
1-233
1-243
Figure 2-2
Callout
Schematic
Page
ZCU102 Evaluation Board User Guidewww.xilinx.com16
UG1182 (v1.2) March 20, 2017
Table 2-3:Default Jumper Settings (Cont’d)
SendFeedback
Chapter 2:Board Setup and Configuration
JumperFunctionDefault
Reset Sequencer PS_POR_B
J20
J21
J22
J14
J15
J56
• OFF: No sequencer control of PS_POR_B
• 1-2: Sequencer can control PS_POR_B
Reset Sequencer PS_SRST_B
• OFF: No sequence control of PS_SRST_B
• 1-2: Sequencer can control PS_SRST_B
Reset Sequencer inhibit
• OFF: Sequencer normal operation
• 1-2: Sequencer inhibit (resets will stay
asserted)
ARM Debug VTREF
•Open: VTREF floating
• 1-2: VTREF = VCCOPS3 (1.8V)
ARM Debug VSUPPLY
• OFF: VSUPPLY floating
• 1-2: VSUPPLY = VCCOPS3 (1.8V)
VCCO_PSDDR_504 select
• 1-2: Switched DDR4 VDDQ
• 3-4: Direct DDR4 VDDQ
1-2512
1-2612
OFF712
1-2822
OFF922
1-21024
Figure 2-2
Callout
Schematic
Page
DDR4 Reset Suspend Enable
J159
J16SFP0 TX: 1-2:Disable; OFF: EnableOFF1234
J17SFP1 TX: 1-2:Disable; OFF: EnableOFF1234
J42SFP2 TX: 1-2:Disable; OFF: EnableOFF1434
J54SFP3 TX: 1-2:Disable; OFF: EnableOFF1534
J162
J110
J109
J112
• 1-2: Suspend disabled (Gate bypass)
• 2-3: Suspend enabled
PCIe PRSNT select
•1-2: x1
•3-4: x4
•5-6: GND (not used)
USB ULPI CVBUS Select
•1-2: DEVICE or OTG Mode
• 2-3: Host Mode
USB ULPI ID select
• 1-2: Connector ID
• 2-3: VDD33 ID
USB ULPI Shield GND select
•1-2: Capacitor
•2-3: GND
1-21124
5-61643
1-21751
2-31851
1-21951
ZCU102 Evaluation Board User Guidewww.xilinx.com17
UG1182 (v1.2) March 20, 2017
Table 2-3:Default Jumper Settings (Cont’d)
SendFeedback
Chapter 2:Board Setup and Configuration
JumperFunctionDefault
USB ULPI Device or Host select
J7
J113
J88
J38
J153
J9
• 1-2: HOST/OTG
•Open: Device
USB ULPI Device/Host or OTG select
• 1-2: Device or Host
•2-3: OTG
ARM Trace VTREF
• 1-2: 3.3V
•Open: 0V
ARM Trace power
• 1-2: 3.3V
•Open: 0V
Power inhibit
• OFF: rails power on normally
• 1-2: all rails (except UTIL) OFF
PS_DDR4_VPP_2V5 power inhibit (U39)
• OFF: rail powers on normally
• 1-2: PS_DDR4_VPP_2V5 OFF
OPEN2051
1-22151
1-22254
1-22354
OFF2459
OFF2577
Figure 2-2
Callout
Schematic
Page
J164 MSP430 firmware upgrade headerOFF2638
ZCU102 Evaluation Board User Guidewww.xilinx.com18
UG1182 (v1.2) March 20, 2017
Chapter 2:Board Setup and Configuration
SendFeedback
MPSoC Device Configuration
Zynq UltraScale+ XCZU9EG MPSoC devices use a multi-stage boot process documented in
the Boot and Configuration chapter of the Zynq UltraScale+ MPSoC Technical Reference Manual (UG1085) [Ref 2].
Switch SW6 configuration option settings are identified in Table 2-4.
Vivado, SDK, or third-party tools can establish a JTAG connection to the Zynq UltraScale+
MPSoC device through one of the three provided JTAG interfaces:
1. Xilinx platform USB or cable PC4 connector (J8)
2. ARM 20-pin JTAG connector (J6)
3. Digilent SMT2.5 USB-to-JTAG module with off-module micro-USB connector (J2)
Quad-SPI
Booting from the dual Quad-SPI nonvolatile configuration memory is accomplished by
storing a valid Zynq UltraScale+ MPSoC boot image into the Quad-SPI flash devices
connected to the MIO Quad-SPI interface, setting the boot mode pins SW6 [4:1] = QSPI32
(see Table 2-4), then either power-cycling or pressing the power-on reset (POR) pushbutton.
SW6 is callout 23 in Figure 2-1.
ZCU102 Evaluation Board User Guidewww.xilinx.com19
UG1182 (v1.2) March 20, 2017
SD
Booting from an SD card is accomplished by storing a valid Zynq UltraScale+ MPSoC boot
image file onto an SD card (plugged into SD socket J100) connected to the MIO SD
interface, setting the boot mode pins SW6 [4:1] = SD (see Table 2-4), then either
power-cycling or pressing the power-on reset (POR) pushbutton.
See the Zynq UltraScale+ MPSoC Technical Reference Manual (UG1085) [Ref 2] for more
information about Zynq UltraScale+ MPSoC configuration options.
Board Component Descriptions
SendFeedback
Overview
This chapter provides a detailed functional description of the board’s components and
features. Table 2-1, page 13 identifies the components, references the respective schematic
page numbers, and links to the corresponding detailed functional description in this
chapter. Component locations are shown in Figure 2-1, page 12.
Component Descriptions
Chapter 3
Zynq UltraScale XCZU9EG MPSoC
[Figure 2-1, callout 1]
The ZCU102 board is populated with the Zynq UltraScale+ XCZU9EG-2FFVB1156I MPSoC
which combines a powerful processing system (PS) and user-programmable logic (PL) into
the same device. The processing system in a Zynq UltraScale+ MPSoC features the ARM®
flagship Cortex®-A53 64-bit quad-core processor and Cortex-R5 dual-core real-time
processor.
Production ZCU102 Evaluation boards will ship with -2LE speed grade devices. Support of
multiple speed grades requires voltage adjustments.
The PL-side V
in Table 3-1 to support multiple Zynq UltraScale+ MPSoC speed grades.
Table 3-1:Recommended Operating Conditions
SymbolDescriptionMin.Typ.MaxUnits
Programmable Logic (PL)
V
CCINT
supply will be user adjustable via PMBUS with the voltage ranges shown
CCINT
Internal supply voltage.
For -1LI and -2LE devices: internal supply voltage.
For -3E devices: internal supply voltage.
0.8250.8500.875V
0.6980.7200.742V
0.8730.9000.927V
ZCU102 Evaluation Board User Guidewww.xilinx.com20
UG1182 (v1.2) March 20, 2017
X-Ref Target - Figure 3-1
RPU
256 KB
OCM
LPD-DMA
CSU
PMU
Processing System
Cortex-R5
32 KB I/D
128 KB TCM
Cortex-R5
32 KB I/D
128 KB TCM
4 x 1GE
APU
Cortex-A53
32 KB I/D
Cortex-A53
32 KB I/D
Cortex-A53
32 KB I/D
Cortex-A53
32 KB I/D
GIC
SCU
ACP1 MB L2
GPU
Mali-400 MP2
64 KB L2
2 x USB 3.0
NAND x8
ONFI 3.1
2 x SD3.0/
eMMC4.51
Quad-SPI
x 8
2 x SPI
2 x CAN
2 x I2C
2 x UART
GPIOs
SYSMON
MIO
Central
Switch
FPD-DMA
PCIe
Gen4
DisplayPort
v1.2 x1, x2
2 x SATA
v3.1
PCIe Gen2
x1, x2, or x4
SHA3
AES-GCM
RSA
Processor
System
BPU
DDRC (DDR4/3/3L, LPDDR3/4)
Programmable
Logic
128 KB RAM
PL_LPD
HP
GIC
RGMII
ULPI
PS-GTR
SMMU/CCI
GFC
USB 3.0
SGMII
Low Power Switch
To ACP
Low PowerFull Power
Battery
Power
32-bit/64-bit
64-bit
MS
128-bit
MS
LPD_PLHPCHPM
GTY
Quad
GTH
Quad
Interlaken
100G
Ethernet
ACE
DisplayPort
Video and
Audio Interface
Low-latency
Peripheral Port
Low-latency
Peripheral Port
;
SendFeedback
Chapter 3:Board Component Descriptions
The top-level block diagram is shown in Figure 3-1.
ZCU102 Evaluation Board User Guidewww.xilinx.com21
The Zynq UltraScale+ MPSoC PS block has three major processing units:
Cortex-A53 application processing unit (APU)-ARM v8 architecture-based 64-bit
°
quad-core multiprocessing CPU.
Cortex-R5 real-time processing unit (RPU)-ARM v7 architecture-based 32-bit dual
°
real-time processing unit with dedicated tightly coupled memory (TCM).
Mali-400 graphics processing unit (GPU)-graphics processing unit with pixel and
°
geometry processor and 64 KB L2 cache.
The Zynq UltraScale+ MPSoC PS has four high-speed serial I/O (HSSIO) interfaces
supporting the following protocols:
Integrated block for PCI Express® interface-PCIe™ base specification version 2.1
°
compliant.
SATA 3.1 specification compliant interface.
°
DisplayPort interface-implements a DisplayPort source-only interface with video
°
resolution up to 4K x 2K-30 (300 MHz pixel rate).
USB 3.0 interface-compliant to USB 3.0 specification implementing a 5 Gb/s line
°
rate.
Serial GMII interface-supports a 1 Gb/s SGMII interface.
°
The PS and PL can be coupled with multiple interfaces and other signals to effectively
integrate user-created hardware accelerators and other functions in the PL logic that are
accessible to the processors. They can also access memory resources in the processing
system. The PS I/O peripherals, including the static/flash memory interfaces share a
multiplexed I/O (MIO) of up to 78 MIO pins. Zynq UltraScale+ MPSoCs can also use the I/O
in the PL domain for many of the PS I/O peripherals. This is done through an extended
multiplexed I/O interface (EMIO).and boots at power-up or reset.
For additional information on Zynq UltraScale+ MPSoC devices, see the UltraScale
Architecture and Product Overview (DS890) [Ref 1], and the Zynq UltraScale+ MPSoC
Technical Reference Manual (UG1085) [Ref 2] for more information about Zynq UltraScale+
MPSoC configuration options.
ZCU102 Evaluation Board User Guidewww.xilinx.com22
UG1182 (v1.2) March 20, 2017
Chapter 3:Board Component Descriptions
;
SendFeedback
Encryption Key Backup Circuit
The XCZU9EG MPSoC U1 implements bitstream encryption key technology. The ZCU102
board provides the encryption key backup battery circuit shown in Figure 3-2
X-Ref Target - Figure 3-2
ZCU102 Evaluation Board User Guidewww.xilinx.com23
UG1182 (v1.2) March 20, 2017
Figure 3-2:Encryption Key Backup Circuit
The Seiko TS518FE rechargeable 1.5V lithium button-type battery B1 is soldered to the
board with the positive output connected to the XCZU9EG MPSoC U1 V
The battery supply current I
specification is 150 nA maximum when board power is off.
BATT
CC_PSBATT
pin AA22.
B1 is charged from the UTIL_1V8 1.8V rail through a series diode with a typical forward
voltage drop of 0.38V and 4.7 ΩK current limit resistor. The nominal charging voltage is
1.42V.
Chapter 3:Board Component Descriptions
SendFeedback
I/O Voltage Rails
There are nine PL I/O banks available on the XCZU9EG MPSoC. The voltages applied to the
XCZU9EG MPSoC I/O banks used by the ZCU102 board are listed in Table 3-2.
QSPI LWR, QSPI UPR, UART1, MIO_I2C0, MIO_I2C1,
MIO_RXD/TXD, CAN IF
MIO_SD IF, MIO_PMU IF, MIO_DP IF
MIO_ENET, MIO_USB
PS CONFIGURATION IF
DDR4 SODIMM IF
ZCU102 Evaluation Board User Guidewww.xilinx.com24
UG1182 (v1.2) March 20, 2017
Notes:
1. The ZCU102 board is shipped with V
ADJ_FMC
set to 1.8V by the MSP430 system controller.
PS-Side: DDR4 SODIMM Socket
[Figure 2-1, callout 2]
The PS-side memory is wired to the Zynq UltraScale+ DDRC hard memory controller. A
64-bit single rank DDR4 SODIMM with ECC (72-bit) is inserted into socket J1. The ZCU102
is shipped with a DDR4 SODIMM installed:
•Manufacturer: Kingston
•Part Number: KVR21SE15S8/4
•Description:
4GByte DDR4 SODIMM
°
Single Rank x8
°
512Mbit x 72-Bit
°
PC4-2133 260-Pin
°
Chapter 3:Board Component Descriptions
SendFeedback
The ZCU102 supports full power-off suspend mode where only the system controller and
the PS-side DDR4 SODIMM memory are powered. The DDR4 memory is kept in a
self-refresh state and has its reset input controlled by the system controller such that the
memory is not reset when waking-up from suspend mode. DDR4 SODIMM standard right
angle Socket J1 connections are identified in Table 3-3.
Table 3-3:DDR4 SODIMM Socket J1 Connections to FPGA PS DDR Bank 504
XCZU9EG
(U1) Pin
AP29
AP30
AP26
AP27
AP25
AN24
AM29
AM28
AM26
AM25
AL28
AK27
AJ25
AL25
AH26
Net Name
DDR4 SODIMM Memory J1
Pin NumberPin Name
DDR4_SODIMM_A0144A0
DDR4_SODIMM_A1133A1
DDR4_SODIMM_A2132A2
DDR4_SODIMM_A3131A3
DDR4_SODIMM_A4128A4
DDR4_SODIMM_A5126A5
DDR4_SODIMM_A6127A6
DDR4_SODIMM_A7122A7
DDR4_SODIMM_A8125A8
DDR4_SODIMM_A9121A9
DDR4_SODIMM_A10146A10/AP
DDR4_SODIMM_A11120A11
DDR4_SODIMM_A12119A12
DDR4_SODIMM_A13158A13
DDR4_SODIMM_BA0150BA0
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UG1182 (v1.2) March 20, 2017
AG26
AK28
AH27
AP20
AP18
AP19
AP17
AM20
AM19
AM18
AL18
AP22
AP21
AP24
DDR4_SODIMM_BA1145BA1
DDR4_SODIMM_BG0115BG0
DDR4_SODIMM_BG1113BG1
DDR4_SODIMM_DQ08DQ0
DDR4_SODIMM_DQ17DQ1
DDR4_SODIMM_DQ220DQ2
DDR4_SODIMM_DQ321DQ3
DDR4_SODIMM_DQ44DQ4
DDR4_SODIMM_DQ53DQ5
DDR4_SODIMM_DQ616DQ6
DDR4_SODIMM_DQ717DQ7
DDR4_SODIMM_DQ828DQ8
DDR4_SODIMM_DQ929DQ9
DDR4_SODIMM_DQ1041DQ10
Chapter 3:Board Component Descriptions
SendFeedback
Table 3-3:DDR4 SODIMM Socket J1 Connections to FPGA PS DDR Bank 504 (Cont’d)
XCZU9EG
(U1) Pin
AN23
AL21
AL22
AM23
AL23
AL20
AK20
AJ20
AK18
AG20
AH18
AG19
AG18
AG21
AH21
Net Name
DDR4 SODIMM Memory J1
Pin NumberPin Name
DDR4_SODIMM_DQ1142DQ11
DDR4_SODIMM_DQ1224DQ12
DDR4_SODIMM_DQ1325DQ13
DDR4_SODIMM_DQ1438DQ14
DDR4_SODIMM_DQ1537DQ15
DDR4_SODIMM_DQ1650DQ16
DDR4_SODIMM_DQ1749DQ17
DDR4_SODIMM_DQ1862DQ18
DDR4_SODIMM_DQ1963DQ19
DDR4_SODIMM_DQ2046DQ20
DDR4_SODIMM_DQ2145DQ21
DDR4_SODIMM_DQ2258DQ22
DDR4_SODIMM_DQ2359DQ23
DDR4_SODIMM_DQ2470DQ24
DDR4_SODIMM_DQ2571DQ25
AG24
AG23
AK22
AJ21
AJ22
AK23
AG31
AG30
AG29
AG28
AJ30
AK29
AK30
AJ29
AE27
AF28
AF30
DDR4_SODIMM_DQ2683DQ26
DDR4_SODIMM_DQ2784DQ27
DDR4_SODIMM_DQ2866DQ28
DDR4_SODIMM_DQ2967DQ29
DDR4_SODIMM_DQ3079DQ30
DDR4_SODIMM_DQ3180DQ31
DDR4_SODIMM_DQ32174DQ32
DDR4_SODIMM_DQ33173DQ33
DDR4_SODIMM_DQ34187DQ34
DDR4_SODIMM_DQ35186DQ35
DDR4_SODIMM_DQ36170DQ36
DDR4_SODIMM_DQ37169DQ37
DDR4_SODIMM_DQ38183DQ38
DDR4_SODIMM_DQ39182DQ39
DDR4_SODIMM_DQ40195DQ40
DDR4_SODIMM_DQ41194DQ41
DDR4_SODIMM_DQ42207DQ42
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UG1182 (v1.2) March 20, 2017
AF31
AD28
DDR4_SODIMM_DQ43208DQ43
DDR4_SODIMM_DQ44191DQ44
Chapter 3:Board Component Descriptions
SendFeedback
Table 3-3:DDR4 SODIMM Socket J1 Connections to FPGA PS DDR Bank 504 (Cont’d)
XCZU9EG
(U1) Pin
AD27
AD29
AD30
AH33
AJ34
AH34
AH32
AK34
AK33
AL32
AL31
AG33
AG34
AF32
AF33
Net Name
DDR4 SODIMM Memory J1
Pin NumberPin Name
DDR4_SODIMM_DQ45190DQ45
DDR4_SODIMM_DQ46203DQ46
DDR4_SODIMM_DQ47204DQ47
DDR4_SODIMM_DQ48216DQ48
DDR4_SODIMM_DQ49215DQ49
DDR4_SODIMM_DQ50228DQ50
DDR4_SODIMM_DQ51229DQ51
DDR4_SODIMM_DQ52211DQ52
DDR4_SODIMM_DQ53212DQ53
DDR4_SODIMM_DQ54224DQ54
DDR4_SODIMM_DQ55225DQ55
DDR4_SODIMM_DQ56237DQ56
DDR4_SODIMM_DQ57236DQ57
DDR4_SODIMM_DQ58249DQ58
DDR4_SODIMM_DQ59250DQ59
AD31
AD32
AD34
AD33
AN31
AP31
AP32
AP33
AM31
AM33
AM34
AL33
AN17
AM21
AK19
AH24
AH31
DDR4_SODIMM_DQ60232DQ60
DDR4_SODIMM_DQ61233DQ61
DDR4_SODIMM_DQ62245DQ62
DDR4_SODIMM_DQ63246DQ63
DDR4_SODIMM_CB092CB0/NC
DDR4_SODIMM_CB191CB1/NC
DDR4_SODIMM_CB2101CB2/NC
DDR4_SODIMM_CB3105CB3/NC
DDR4_SODIMM_CB488CB4/NC
DDR4_SODIMM_CB587CB5/NC
DDR4_SODIMM_CB6100CB6/NC
DDR4_SODIMM_CB7104CB7/NC
DDR4_SODIMM_DM0_B12DM0_N/DBI0_N
DDR4_SODIMM_DM1_B33DM1_N/DBI1_N
DDR4_SODIMM_DM2_B54DM2_N/DBI2_N
DDR4_SODIMM_DM3_B75DM3_N/DBI3_N
DDR4_SODIMM_DM4_B178DM4_N/DBI4_N
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AJ31
DDR4_SODIMM_DM5_B199DM5_N/DBI5_N
DDR4_SODIMM_DM6_B220DM6_N/DBI6_N
Chapter 3:Board Component Descriptions
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Table 3-3:DDR4 SODIMM Socket J1 Connections to FPGA PS DDR Bank 504 (Cont’d)
XCZU9EG
(U1) Pin
AE34
AN34
AN18
AN19
AN21
AN22
AH19
AJ19
AH22
AH23
AH28
AH29
AE28
AE29
AJ32
Net Name
DDR4 SODIMM Memory J1
Pin NumberPin Name
DDR4_SODIMM_DM7_B241DM7_N/DBI7_N
DDR4_SODIMM_DM8_B96DM8_N/DBI8_N/NC
DDR4_SODIMM_DQS0_T13DQS0_T
DDR4_SODIMM_DQS0_C11DQS0_C
DDR4_SODIMM_DQS1_T34DQS1_T
DDR4_SODIMM_DQS1_C32DQS1_C
DDR4_SODIMM_DQS2_T55DQS2_T
DDR4_SODIMM_DQS2_C53DQS2_C
DDR4_SODIMM_DQS3_T76DQS3_T
DDR4_SODIMM_DQS3_C74DQS3_C
DDR4_SODIMM_DQS4_T179DQS4_T
DDR4_SODIMM_DQS4_C177DQS4_C
DDR4_SODIMM_DQS5_T200DQS5_T
DDR4_SODIMM_DQS5_C198DQS5_C
DDR4_SODIMM_DQS6_T221DQS6_T
AK32
AE32
AE33
AN32
AN33
AN27
AN26
AL27
AL26
AN29
AJ27
AM30
AJ26
AM24
AK24
AK25
AG25
DDR4_SODIMM_DQS6_C219DQS6_C
DDR4_SODIMM_DQS7_T242DQS7_T
DDR4_SODIMM_DQS7_C240DQS7_C
DDR4_SODIMM_DQS8_T97DQS8_T
DDR4_SODIMM_DQS8_C95DQS8_C
DDR4_SODIMM_CK0_C139CK0_C
DDR4_SODIMM_CK0_T137CK0_T
DDR4_SODIMM_CK1_C140CK1_C/NF
DDR4_SODIMM_CK1_T138CK1_T/NF
DDR4_SODIMM_CKE0109CKE0
DDR4_SODIMM_CKE1110CKE1
DDR4_SODIMM_ODT0155ODT0
DDR4_SODIMM_ODT1161ODT1
DDR4_SODIMM_RAS_B152RAS_N/A16
DDR4_SODIMM_CAS_B156CAS_N/A15
DDR4_SODIMM_WE_B151WE_N/A14
DDR4_SODIMM_ACT_B114ACT_N
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UG1182 (v1.2) March 20, 2017
AF22
AF20
DDR4_SODIMM_ALERT_B116ALERT_N
DDR4_SODIMM_PARITY143PARITY
Chapter 3:Board Component Descriptions
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Table 3-3:DDR4 SODIMM Socket J1 Connections to FPGA PS DDR Bank 504 (Cont’d)
XCZU9EG
(U1) Pin
AN28
AL30
Net Name
DDR4_SODIMM_CS0_B149CS0_N
DDR4_SODIMM_CS1_B157CS1_N
DDR4 SODIMM Memory J1
Pin NumberPin Name
The ZCU102 DDR4 SODIMM interface adheres to the constraints guidelines documented in
the PCB Guidelines for DDR4 section of UltraScale Architecture PCB Design Guide (UG583)
[Ref 3] The ZCU102 DDR4 SODIMM interface is a 40Ω impedance implementation. Other
memory interface details are also available in the UltraScale Architecture FPGAs Memory Interface Solutions Guide (PG150) [Ref 4].
DDR4 Component Memory
[Figure 2-1, callout 3]
The 4 Gb, 16-bit wide DDR4 memory system is comprised of one 256 Mb x 16 SDRAM
(Micron MT40A256M16GE-075E) at U2. This memory system is connected to the PL-side
XCZU9EG bank 64. The DDR4 0.6V VTT termination voltage is supplied from sink-source
regulator U35. The connections between the DDR4 memory and XCZU9EG bank 64 are
listed in Table 3-4.
Table 3-4:DDR4 Component Memory Connection to the XCZU9EG MPSoC
XCZU9EG
(U1) Pin
AM8
AM9
AP8
AN8
AK10
AJ10
AP9
AN9
AP10
AP11
AM10
AL10
AM11
AL11
Net NameI/O Standard
DDR4_A0SSTL12_DCI P3 A0
DDR4_A1SSTL12_DCI P7 A1
DDR4_A2SSTL12_DCI R3 A2
DDR4_A3SSTL12_DCI N7 A3
DDR4_A4SSTL12_DCI N3 A4
DDR4_A5SSTL12_DCI P8 A5
DDR4_A6SSTL12_DCI P2 A6
DDR4_A7SSTL12_DCI R8 A7
DDR4_A8SSTL12_DCI R2 A8
DDR4_A9SSTL12_DCI R7 A9
DDR4_A10SSTL12_DCI M3 A10/AP
DDR4_A11SSTL12_DCI T2 A11
DDR4_A12SSTL12_DCI M7 A12/BC_B
DDR4_A13SSTL12_DCI T8 A13
DDR4 Component Memory
Pin NumberPin Name
ZCU102 Evaluation Board User Guidewww.xilinx.com29
UG1182 (v1.2) March 20, 2017
AK12
DDR4_BA0SSTL12_DCI N2 BA0
Chapter 3:Board Component Descriptions
SendFeedback
Table 3-4:DDR4 Component Memory Connection to the XCZU9EG MPSoC (Cont’d)
XCZU9EG
(U1) Pin
AJ12
AK7
AJ7
AJ9
AL5
AN7
AP7
AM3
AK8
AP1
AH9
AK9
AP2
AK4
AK5
Net NameI/O Standard
DDR4 Component Memory
Pin NumberPin Name
DDR4_BA1SSTL12_DCI N8 BA1
DDR4_BG0SSTL12_DCI M2 BG0
DDR4_A14_WE_BSSTL12_DCI L2 WE_B/A14
DDR4_A16_RAS_BSSTL12_DCI L8 RAS_B/A16
DDR4_A15_CAS_BSSTL12_DCI M8 CAS_B/A15
DDR4_CK_TDIFF_SSTL12 K7 CK_T
DDR4_CK_CDIFF_SSTL12 K8 CK_C
DDR4_CKESSTL12_DCI K2 CKE
DDR4_ACT_BSSTL12_DCI L3 ACT_B
DDR4_PARSSTL12_DCI T3 PAR
DDR4_RESET_B_LSLVCMOS18 P1 RESET_B
DDR4_ODTSSTL12_DCI K3 ODT
DDR4_CS_BSSTL12_DCI L7 CS_B
DDR4_DQ0POD12_DCI G2 DQL0
DDR4_DQ1POD12_DCI F7 DQL1
AN4
AM4
AP4
AP5
AM5
AM6
AK2
AK3
AL1
AK1
AN1
AM1
AP3
AN3
AN6
AP6
AL3
DDR4_DQ2POD12_DCI H3 DQL2
DDR4_DQ3POD12_DCI H7 DQL3
DDR4_DQ4POD12_DCI H2 DQL4
DDR4_DQ5POD12_DCI H8 DQL5
DDR4_DQ6POD12_DCI J3 DQL6
DDR4_DQ7POD12_DCI J7 DQL7
DDR4_DQ8POD12_DCI A3 DQU0
DDR4_DQ9POD12_DCI B8 DQU1
DDR4_DQ10POD12_DCI C3 DQU2
DDR4_DQ11POD12_DCI C7 DQU3
DDR4_DQ12POD12_DCI C2 DQU4
DDR4_DQ13POD12_DCI C8 DQU5
DDR4_DQ14POD12_DCI D3 DQU6
DDR4_DQ15POD12_DCI D7 DQU7
DDR4_DQS0_TDIFF_POD12 G3 DQSL_T
DDR4_DQS0_CDIFF_POD12 F3 DQSL_C
DDR4_DQS1_TDIFF_POD12 B7 DQSU_T
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UG1182 (v1.2) March 20, 2017
AL2
DDR4_DQS1_CDIFF_POD12 A7 DQSU_C
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