ZC706 Evaluation Board
for the Zynq-7000
XC7Z045
All Programmable SoC
User Guide
UG954 (v1.5) September 10, 2015
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The following table shows the revision history for this document.
DateVersionRevision
10/08/20121.0
11/21/20121.1
Initial Xilinx release.
Added additional user LED in ZC706 Evaluation Board Features section, Ta bl e 1- 1,
User I/O section, Figure 1-25, and Tab le 1- 28 . In Tab le 1- 1, added fan sink
information and updated notes for 10/100/1000 Ethernet PHY, user pushbuttons,
user DIP switch, and FPGA PROG pushbutton. Added Encryption Key Backup Circuit
section. Updated second paragraph in DDR3 SODIMM Memory (PL) section.
Updated second paragraph in SD Card Interface section. Updated Tab le 1- 11 .
Added U53 information to first paragraph in HDMI Video Output section. Added
fourth bullet to Real T ime Clock (RTC) section. Updated Figure 1-23. Added pin A17
to Tab le 1- 28 . Updated Figure 1-32. Replaced UCF in Appendix C. Added additional
reference to References in Appendix F.
ZC706 Evaluation Board User Guidewww.xilinx.com2
UG954 (v1.5) September 10, 2015
DateVersionRevision
SendFeedback
04/24/20131.2
07/31/20131.3
04/28/20151.4
Chapter 1, ZC706 Evaluation Board Features: Tab le 1-1 feature descriptions are now
linked to their respective sections in the book. Figure 1-2, Figure 1-33, and
Figure 1-34 were replaced. Table 1-2 was removed because it was a duplicate of
Tab le 1-1 1. Tab le 1- 2: Switch SW11 Configuration Option Settings was added. FMC
Connector JTAG Bypass, page 33 was updated. Default lane size information below
Figure 1-17 was changed. Figure 1-18PCI Express Lane Size Select Jumper J19 was
added. The names of pins 18 and 19 changed in Tabl e 1-1 7. The address of I
PMBUS_DATA/CLOCK changed in Tab le 1- 25 . Reference designator DS35 was added
to Ta bl e 1 -2 7. Callout numbers in the User I/O, page 57 section are now linked to
Tab le 1-1 . SW13 information was added to the section User Pushbuttons, page 59.
In Tab le 1-3 3, J5 pin H22 changed to XC7Z045 (U1) pin AH26 and H23 changed to
AH27. The section ZC706 Board Power System, page 72 was added. Voltage levels
were changed in VADJ Voltage Control, page 79. Tab le 1-3 7 was modified and
Tab le 1-3 8 was added.
Appendix A, Default Switch and Jumper Settings: The SW11 selection in Ta bl e A- 1
changed.
Appendix G, Regulatory and Compliance Information: A link to the master answer
record was added.
Updated Tabl e 1- 22 . Replaced the master User Constraints File (UCF) list in
Appendix C, Master Constraints File Listing with the master Xilinx Design
Constraints (XDC) list. Updated references throughout the document.
Updated “LMZ22000 Family Regulator Description” to LMZ31500 and LMZ31700
Family Regulator Description. Updated Ta bl e 1 -4, Tab le 1-7 , Tab le 1-1 3, Tab le 1- 23 ,
Tab le 1-2 8 through Ta bl e 1 -3 0, Ta bl e 1- 32 through Tab le 1-3 4, Tab le 1-3 6, and
Tab le A-2 . Added Figure A-1. Updated Appendix C, Master Constraints File Listing.
2
C bus
09/10/20151.5
Updated J48 header jumper setting (third row in Tab le 1 -7 ).
The ZC706 evaluation board for the XC7Z045 All Programmable SoC (AP SoC) provides a
hardware environment for developing and evaluating designs targeting the Zynq®-7000
XC7Z045-2FFG900C AP SoC. The ZC706 evaluation board provides features common to
many embedded processing systems, including DDR3 SODIMM and component memory, a
four-lane PCI Express® interface, an Ethernet PHY, general purpose I/O, and two UART
interfaces. Other features can be supported using VITA-57 FPGA mezzanine cards (FMC)
attached to the low pin count (LPC) FMC and high pin count (HPC) FMC connectors.
ZC706 Evaluation Board Features
Chapter 1
The ZC706 evaluation board features are listed in here. Detailed information for each
feature is provided in Feature Descriptions starting on page 14.
•Zynq-7000 XC7Z045-2FFG900C AP SoC
•1 GB DDR3 memory SODIMM on the programmable logic (PL) side
•1 GB DDR3 component memory (four [256 Mb x 8] devices) on the processing system
(PS) side
•USB 2.0 ULPI (UTMI+ low pin interface) transceiver with micro-B USB connector
•Secure Digital (SD) connector
•USB JTAG interface via Digilent module with micro-B USB connector
•Clock sources:
Fixed 200 MHz LVDS oscillator (differential)
°
I2C programmable LVDS oscillator (differential)
°
Fixed 33.33 MHz LVCMOS oscillator (single-ended)
°
Subminiature version A (SMA) connectors (differential)
°
ZC706 Evaluation Board User Guidewww.xilinx.com7
UG954 (v1.5) September 10, 2015
SMA connectors for GTX transceiver clocking (differential)
°
•GTX transceivers
SendFeedback
FMC HPC connector (eight GTX transceivers)
°
FMC LPC connector (one GTX transceiver)
°
SMA connectors (one pair each for TX, RX and REFCLK)
°
PCI Express (four lanes)
°
Small form-factor pluggable plus (SFP+) connector
°
Ethernet PHY RGMII interface
°
•PCI Express endpoint connectivity
Gen1 4-lane (x4)
°
Gen2 4-lane (x4)
°
•SFP+ Connector
•Ethernet PHY RGMII interface with RJ-45 connector
Overview
•USB-to-UART bridge with mini-B USB connector
•HDMI codec with HDMI connector
I2C bus
•
I2C bus multiplexed to:
•
Si570 user clock
°
ADV7511 HDMI codec
°
M24C08 EEPROM (1 kB)
°
1-to-16 TCA6416APWR port expander
°
DDR3 SODIMM
°
RTC-8564JE real time clock
°
FMC HPC connector
°
FMC LPC connector
°
PMBUS data/clock
°
•Status LEDs:
ZC706 Evaluation Board User Guidewww.xilinx.com8
UG954 (v1.5) September 10, 2015
Ethernet status
°
TI Power Good
°
Linear Power Good
°
PS DDR3 Component Vtt Good
°
PL DDR3 SODIMM Vtt Good
°
FMC Power Good
SendFeedback
°
12V Input Power On
°
FPGA INIT
°
FPGA DONE
°
•User I/O:
Four (PL) user LEDs
°
Three (PL) user pushbuttons
°
One (PL) user DIP switch (4-pole)
°
Two Dual row Pmod GPIO headers
°
•AP SoC PS Reset Pushbuttons:
SRST_B PS reset button
°
POR_B PS reset button
°
Overview
•VITA 57.1 FMC HPC connector
•VITA 57.1 FMC LPC connector
•Power on/off slide switch
•Program_B pushbutton
•Power management with PMBus voltage and current monitoring through TI power
controller
•Dual 12-bit 1 MSPS XADC analog-to-digital front end
•Configuration options:
Dual Quad-SPI flash memory
°
USB JTAG configuration port (Digilent module)
°
Platform cable header JTAG configuration port
°
20-pin PL PJTAG header
°
ZC706 Evaluation Board User Guidewww.xilinx.com9
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-1
U1
Zync-7000 AP SoC
XC7Z045-2FFG900C
Processing
System
Programmable Logic
UG954_c1_01_1002012
JTAG Module
and
JTAG Header
Page 16
Dual Quad-SPI
Flash Memory
Page 21
PCIe
x 4-Lane
Page 42
SD Card
Connector
Page 22
FMC HPC
Connector
Pages 24-27
10/100/1,000
Ethernet PHY
(RGMII only)
Page 29, 30
USB 2.0 ULPI
Transceiver
and Connector
Page 31
Clock and
Reset/POR
Pushbuttons
Pages 15, 34
USB UART
and
Connector
Page 40
ARM PJTAG
Header
Page 39
Switches
LEDs and
Pushbuttons
Page 38
Mechanicals
Page 58
I2C
Real Time
Clock
Page 37
DDR3
SODIMM
Page 23
DDR3 Memory
4 x 256 Mb x 8
SDRAM
Pages 17-20
HDMI Codec
and
Connector
Pages 32, 33
I2C Multiplexer
and
I2C EEPROM
Page 36
XADC
Header
Page 35
Configurable
Clocks
Page 34
FMC LPC
Connector
Page 28
Note: Page numbers reference the page number of schematic 0381513.
SendFeedback
Overview
Block Diagram
The ZC706 evaluation board block diagram is shown in Figure 1-1.
Figure 1-1:ZC706 Evaluation Board Block Diagram
Board Layout
Figure 1-2 shows the ZC706 evaluation board. Each numbered feature that is referenced in
Figure 1-2 is described in Tab le 1- 1 with a link to detailed information provided under
Feature Descriptions starting on page 14.
Note: The image in Figure 1-2 is for reference only and might not reflect the current revision of the
board.
CAUTION! The ZC706 evaluation board can be damaged by electrostatic discharge (ESD). Follow ESD
prevention measures when handling the board.
ZC706 Evaluation Board User Guidewww.xilinx.com10
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-2
17
6
30
31
21
18
15
2
11
13
12
1
4
7
3
9
10
16
25
24
26
22
33
27
19
32
23
28
14
35
29
5
8
20
34
36
37
38
00
Square callout references a component
on the back side of the board
Round callout references a component
on the front side of the board
12V power input 2x6 connector J22MOLEX-39-30-106048
Overview
Schematic
0381513
Page Number
38
39
37, 39
48
38
24-27
28
48-57
35
16
16
Notes:
1. Jumper header locations are identified in Appendix A, Default Switch and Jumper Settings.
ZC706 Evaluation Board User Guidewww.xilinx.com13
UG954 (v1.5) September 10, 2015
Feature Descriptions
Application
Processor Unit (APU)
Common
Peripherals
Custom
Peripherals
Common Accelerators
Custom Accelerators
Memory
Interfaces
Processing
System
(PS)
Programmable
Logic
(PL)
Input Output
Peripherals
(IOP)
High-Bandwidth
AMBA
®
AXI Interfaces
UG954_c1_03_100112
Interconnect
SendFeedback
Feature Descriptions
Detailed information for each feature shown in Figure 1-2 and listed in Table 1 -1 is
provided in this section.
Zynq-7000 XC7Z045 AP SoC
[Figure 1-2, callout 1]
The ZC706 evaluation board is populated with the Zynq-7000 XC7Z045-2FFG900C AP SoC.
The XC7Z045 AP SoC consists of an integrated processing system (PS) and programmable
logic (PL), on a single die. The high-level block diagram is shown in Figure 1-3.
X-Ref Target - Figure 1-3
ZC706 Evaluation Board User Guidewww.xilinx.com14
UG954 (v1.5) September 10, 2015
Figure 1-3:High-Level Block Diagram
The PS integrates two ARM® Cortex™-A9 MPCore™ application processors, AMBA®
interconnect, internal memories, external memory interfaces, and peripherals including
USB, Ethernet, SPI, SD/SDIO,
and boots at power-up or reset.
A system level block diagram is shown in Figure 1-4.
I2C, CAN, UART, and GPIO. The PS runs independently of the PL
X-Ref Target - Figure 1-4
2x USB
2x GigE
2x SD
Zynq-7000 AP SoC
I/O
Peripherals
IRQ
IRQ
EMIO
SelectIO
Resources
DMA 8
Channel
CoreSight
Components
Programmable Logic
DAP
DevC
SWDT
DMA
Sync
Notes:
1) Arrow direction shows control (master to slave)
2) Data flows in both directions: AXI 32-Bit/64-Bit, AXI 64-Bit, AXI 32-Bit, AHB 32-Bit, APB 32-Bit, Custom
ACP
256K
SRAM
Application Processor Unit
TTC
System-
Level
Control
Regs
GigE
CAN
SD
SDIO
UART
GPIO
UART
CAN
I2C
SRAM/
NOR
ONFI 1.0
NAND
Processing System
Memory
Interfaces
Q-SPI
CTRL
USB
GigE
I2C
USB
SD
SDIO
SPI
SPI
Programmable Logic to
Memory Interconnect
MMU
FPU and NEON Engine
Snoop Controller, AWDT, Timer
GIC
32 KB
I-Cache
ARM Cortex-A9
CPU
ARM Cortex-A9
CPU
MMU
FPU and NEON Engine
Config
AES/
SHA
XADC
12-Bit ADC
Memory
Interfaces
512 KB L2 Cache & Controller
OCM
Interconnect
DDR2/3,
LPDDR2
Controller
UG954_c1_04_100112
32 KB
D-Cache
32 KB
I-Cache
32 KB
D-Cache
MIO
Clock
Generation
Reset
Central
Interconnect
General-Purpose
Por ts
High-Performance Ports
SendFeedback
Feature Descriptions
For additional information on Zynq-7000 SoC devices, see Zynq-7000 All Programmable
SoC Overview (DS190
(UG585
).
Figure 1-4:Zynq-7000 Block Diagram
) and Zynq-7000 All Programmable SoC Technical Reference Manual
Device Configuration
the Zynq-7000 XC7Z045 AP SoC uses a multi-stage boot process that supports both a
non-secure and a secure boot. The PS is the master of the boot and configuration process.
For a secure boot, the PL must be powered on to enable the use of the security block
located within the PL, which provides 256-bit AES and SHA decryption/authentication.
The ZC706 evaluation board supports these configuration options:
•PS Configuration: Quad-SPI flash memory
ZC706 Evaluation Board User Guidewww.xilinx.com15
UG954 (v1.5) September 10, 2015
•PS Configuration: Processor System Boot from SD Card (J30)
Feature Descriptions
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•PL Configuration: USB JTAG configuration port (Digilent module U30)
•PL Configuration: Platform cable header J3 and flying lead header J62 JTAG
configuration ports
TIP: Designs using serial configuration based on Quad-SPI flash memory can take advantage of
low-cost commodity SPI flash memory.
The JTAG configuration option is selected by setting SW11 (PS) as shown in Tab le 1 -2 and
SW4 (PL) as described in Programmable Logic JTAG Programming Options, page 31. SW11
is callout 29 in Figure 1-2.
The XC7Z045 AP SoC U1 implements bitstream encryption key technology. The ZC706
board provides the encryption key backup battery circuit shown in Figure 1-5. The Seiko
TS518FE rechargeable 1.5V lithium button-type battery B2 is soldered to the board with the
positive output connected to the XC7Z045 AP SoC U1 VCCBATT pin P9. The battery supply
current IBATT specification is 150 nA max when board power is off. B2 is charged from the
VCCAUX 1.8V rail through a series diode with a typical forward voltage drop of 0.38V and
4.7 K
Ω current limit resistor. The nominal charging voltage is 1.42V.
ZC706 Evaluation Board User Guidewww.xilinx.com16
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-5
SendFeedback
To XC7Z045 AP SoC
U1 Pin P9
(VCCBATT)
D7
40V
200 mW
FPGA_VBATT
B2
Feature Descriptions
NC
1
VCCAUX
3
BAS40-04
2
R9
4.70K 1%
1/16W
1
+
Lithium Battery
Seiko
TS518SE_FL35E
1.5V
2
GND
UG954_c1_05_041113
Figure 1-5:Encryption Key Backup Circuit
I/O Voltage Rails
There are eleven I/O banks available on the XC7Z045 AP SoC. The voltages applied to the
XC7Z045 AP SoC I/O banks used by the ZC706 evaluation board are listed in Tab le 1 -3.
Table 1-3:I/O Voltage Rails
XC7Z045 (U1)
Bank
PL Bank 0VCC3V3_FPGA3.3VAP SoC Configuration Bank 0
The memory module at J1 is a 1 GB DDR3 small outline dual-inline memory module
(SODIMM). It provides volatile synchronous dynamic random access memory (SDRAM) for
storing user code and data.
The DDR3 interface is implemented across the PL-side I/O banks. Bank 33 and bank 35 have
a dedicated DCI VRP/N resistor connection. An external 0.75V reference VTTREF_SODIMM is
provided for data interface banks. Any interface connected to these banks that requires the
VTTREF voltage must use this FPGA voltage reference. The connections between the DDR3
memory and the AP SoC are listed in Tab le 1- 4.
Table 1-4:DDR3 SODIMM Socket J1 Connections to the XC7Z045 AP SoC
XC7Z045 (U1)
Pin
E10PL_DDR3_A0SSTL1598A0
B9PL_DDR3_A1SSTL1597A1
E11PL_DDR3_A2SSTL1596A2
A9PL_DDR3_A3SSTL1595A3
D11PL_DDR3_A4SSTL1592A4
B6PL_DDR3_A5SSTL1591A5
F9PL_DDR3_A6SSTL1590A6
E8PL_DDR3_A7SSTL1586A7
B10PL_DDR3_A8SSTL1589A8
Net NameI/O Standard
DDR3 SODIMM Memory J1
Pin NumberPin Name
ZC706 Evaluation Board User Guidewww.xilinx.com18
UG954 (v1.5) September 10, 2015
J8PL_DDR3_A9SSTL1585A9
Feature Descriptions
SendFeedback
Table 1-4:DDR3 SODIMM Socket J1 Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1)
Pin
D6PL_DDR3_A10SSTL15107A10/AP
B7PL_DDR3_A11SSTL1584A11
H12PL_DDR3_A12SSTL1583A12_BC_N
A10PL_DDR3_A13SSTL15119A13
G11PL_DDR3_A14SSTL1580A14
C6PL_DDR3_A15SSTL1578A15
F8PL_DDR3_BA0SSTL15109BA0
H7PL_DDR3_BA1SSTL15108BA1
A7PL_DDR3_BA2SSTL1579BA2
L1PL_DDR3_D0SSTL155DQ0
L2PL_DDR3_D1SSTL157DQ1
K5PL_DDR3_D2SSTL1515DQ2
J4PL_DDR3_D3SSTL1517DQ3
K1PL_DDR3_D4SSTL154DQ4
L3PL_DDR3_D5SSTL156DQ5
J5PL_DDR3_D6SSTL1516DQ6
K6PL_DDR3_D7SSTL1518DQ7
Net NameI/O Standard
DDR3 SODIMM Memory J1
Pin NumberPin Name
G6PL_DDR3_D8SSTL1521DQ8
H4PL_DDR3_D9SSTL1523DQ9
H6PL_DDR3_D10SSTL1533DQ10
H3PL_DDR3_D11SSTL1535DQ11
G1PL_DDR3_D12SSTL1522DQ12
H2PL_DDR3_D13SSTL1524DQ13
G5PL_DDR3_D14SSTL1534DQ14
G4PL_DDR3_D15SSTL1536DQ15
E2PL_DDR3_D16SSTL1539DQ16
E3PL_DDR3_D17SSTL1541DQ17
D4PL_DDR3_D18SSTL1551DQ18
E5PL_DDR3_D19SSTL1553DQ19
F4PL_DDR3_D20SSTL1540DQ20
F3PL_DDR3_D21SSTL1542DQ21
D1PL_DDR3_D22SSTL1550DQ22
D3PL_DDR3_D23SSTL1552DQ23
A2PL_DDR3_D24SSTL1557DQ24
B2PL_DDR3_D25SSTL1559DQ25
ZC706 Evaluation Board User Guidewww.xilinx.com19
UG954 (v1.5) September 10, 2015
Feature Descriptions
SendFeedback
Table 1-4:DDR3 SODIMM Socket J1 Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1)
Pin
B4PL_DDR3_D26SSTL1567DQ26
B5PL_DDR3_D27SSTL1569DQ27
A3PL_DDR3_D28SSTL1556DQ28
B1PL_DDR3_D29SSTL1558DQ29
C1PL_DDR3_D30SSTL1568DQ30
C4PL_DDR3_D31SSTL1570DQ31
K10PL_DDR3_D32SSTL15129DQ32
L9PL_DDR3_D33SSTL15131DQ33
K12PL_DDR3_D34SSTL15141DQ34
J9PL_DDR3_D35SSTL15143DQ35
K11PL_DDR3_D36SSTL15130DQ36
L10PL_DDR3_D37SSTL15132DQ37
J10PL_DDR3_D38SSTL15140DQ38
L7PL_DDR3_D39SSTL15142DQ39
F14PL_DDR3_D40SSTL15147DQ40
F15PL_DDR3_D41SSTL15149DQ41
F13PL_DDR3_D42SSTL15157DQ42
Net NameI/O Standard
DDR3 SODIMM Memory J1
Pin NumberPin Name
G16PL_DDR3_D43SSTL15159DQ43
G15PL_DDR3_D44SSTL15146DQ44
E12PL_DDR3_D45SSTL15148DQ45
D13PL_DDR3_D46SSTL15158DQ46
E13PL_DDR3_D47SSTL15160DQ47
D15PL_DDR3_D48SSTL15163DQ48
E15PL_DDR3_D49SSTL15165DQ49
D16PL_DDR3_D50SSTL15175DQ50
E16PL_DDR3_D51SSTL15177DQ51
C17PL_DDR3_D52SSTL15164DQ52
B16PL_DDR3_D53SSTL15166DQ53
D14PL_DDR3_D54SSTL15174DQ54
B17PL_DDR3_D55SSTL15176DQ55
B12PL_DDR3_D56SSTL15181DQ56
C12PL_DDR3_D57SSTL15183DQ57
A12PL_DDR3_D58SSTL15191DQ58
A14PL_DDR3_D59SSTL15193DQ59
A13PL_DDR3_D60SSTL15180DQ60
ZC706 Evaluation Board User Guidewww.xilinx.com20
UG954 (v1.5) September 10, 2015
Feature Descriptions
SendFeedback
Table 1-4:DDR3 SODIMM Socket J1 Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1)
Pin
B11PL_DDR3_D61SSTL15182DQ61
C14PL_DDR3_D62SSTL15192DQ62
B14PL_DDR3_D63SSTL15194DQ63
J3PL_DDR3_DM0SSTL1511DM0
F2PL_DDR3_DM1SSTL1528DM1
E1PL_DDR3_DM2SSTL1546DM2
C2PL_DDR3_DM3SSTL1563DM3
L12PL_DDR3_DM4SSTL15136DM4
G14PL_DDR3_DM5SSTL15153DM5
C16PL_DDR3_DM6SSTL15170DM6
C11PL_DDR3_DM7SSTL15187DM7
K2PL_DDR3_DQS0_NDIFF_SSTL1510DQS0_N
K3PL_DDR3_DQS0_PDIFF_SSTL1512DQS0_P
H1PL_DDR3_DQS1_NDIFF_SSTL1527DQS1_N
J1PL_DDR3_DQS1_PDIFF_SSTL1529DQS1_P
D5PL_DDR3_DQS2_NDIFF_SSTL1545DQS2_N
E6PL_DDR3_DQS2_PDIFF_SSTL1547DQS2_P
Net NameI/O Standard
DDR3 SODIMM Memory J1
Pin NumberPin Name
A4PL_DDR3_DQS3_NDIFF_SSTL1562DQS3_N
A5PL_DDR3_DQS3_PDIFF_SSTL1564DQS3_P
K8PL_DDR3_DQS4_NDIFF_SSTL15135DQS4_N
L8PL_DDR3_DQS4_PDIFF_SSTL15137DQS4_P
F12PL_DDR3_DQS5_NDIFF_SSTL15152DQS5_N
G12PL_DDR3_DQS5_PDIFF_SSTL15154DQS5_P
E17PL_DDR3_DQS6_NDIFF_SSTL15169DQS6_N
F17PL_DDR3_DQS6_PDIFF_SSTL15171DQS6_P
A15PL_DDR3_DQS7_NDIFF_SSTL15186DQS7_N
B15PL_DDR3_DQS7_PDIFF_SSTL15188DQS7_P
G7PL_DDR3_ODT0SSTL15116ODT0
C9PL_DDR3_ODT1SSTL15120ODT1
G17PL_DDR3_RESET_BSSTL1530RESET_B
J11PL_DDR3_S0_BSSTL15114S0_B
H8PL_DDR3_S1_BSSTL15121S1_B
M10PL_DDR3_TEMP_EVE
NT
F7PL_DDR3_WE_BSSTL15113WE_B
SSTL15198EVENT_B
ZC706 Evaluation Board User Guidewww.xilinx.com21
UG954 (v1.5) September 10, 2015
Feature Descriptions
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Table 1-4:DDR3 SODIMM Socket J1 Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1)
Pin
E7PL_DDR3_CAS_BSSTL15115CAS_B
H11PL_DDR3_RAS_BSSTL15110RAS_B
D10PL_DDR3_CKE0SSTL1573CKE0
C7PL_DDR3_CKE1SSTL1574CKE1
F10PL_DDR3_CLK0_NDIFF_SSTL15103CK0_N
G10PL_DDR3_CLK0_PDIFF_SSTL15101CK0_P
D8PL_DDR3_CLK1_NDIFF_SSTL15104CK1_N
D9PL_DDR3_CLK1_PDIFF_SSTL15102CK1_P
Net NameI/O Standard
DDR3 SODIMM Memory J1
Pin NumberPin Name
The ZC706 DDR3 SODIMM interface adheres to the constraints guidelines documented in
the “Dynamic Memory” section of the Zynq-7000 All Programmable SoC PCB Design and Pin Planning Guide (UG933
). The ZC706 DDR3 SODIMM interface is a 40Ω impedance
implementation. For more details, see the MT8JTF12864HZ-1G6G1 data sheet [Ref 34].
DDR3 Component Memory (PS)
[Figure 1-2, callout 3]
The 1 GB, 32-bit wide DDR3 component memory system is comprised of four 256 Mb x 8
SDRAMs (Micron MT41J256M8HX-15E) at U2-U5. This memory system is connected to the
XC7Z045 AP SoC Processing System (PS) memory interface bank 502. The DDR3 0.75V VTT
termination voltage is sourced from linear regulator U27. The connections between the
DDR3 component memory and XC7Z045 AP SoC bank 502 are listed in Tab le 1 -5.
Table 1-5:DDR3 Component Memory Connections to the XC7Z045 AP SoC
Component Memory
XC7Z045 (U1) PinNet Name
Pin NumberPin NameRef. Des.
E26PS_DDR3_DQ0B3DQ0U2
A25PS_DDR3_DQ1C7DQ1U2
E27PS_DDR3_DQ2C2DQ2U2
E25PS_DDR3_DQ3C8DQ3U2
D26PS_DDR3_DQ4E3DQ4U2
B25PS_DDR3_DQ5E8DQ5U2
D25PS_DDR3_DQ6D2DQ6U2
B27PS_DDR3_DQ7E7DQ7U2
A27PS_DDR3_DQ8B3DQ8U3
A28PS_DDR3_DQ9C7DQ9U3
A29PS_DDR3_DQ10C2DQ10U3
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UG954 (v1.5) September 10, 2015
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Table 1-5:DDR3 Component Memory Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1) PinNet Name
C28PS_DDR3_DQ11C8DQ11U3
D30PS_DDR3_DQ12E3DQ12U3
A30PS_DDR3_DQ13E8DQ13U3
D29PS_DDR3_DQ14D2DQ14U3
D28PS_DDR3_DQ15E7DQ15U3
H27PS_DDR3_DQ16B3DQ16U4
G27PS_DDR3_DQ17C7DQ17U4
H28PS_DDR3_DQ18C2DQ18U4
E28PS_DDR3_DQ19C8DQ19U4
E30PS_DDR3_DQ20E3DQ20U4
F28PS_DDR3_DQ21E8DQ21U4
G30PS_DDR3_DQ22D2DQ22U4
F30PS_DDR3_DQ23E7DQ23U4
K27PS_DDR3_DQ24B3DQ24U5
J30PS_DDR3_DQ25C7DQ25U5
J28PS_DDR3_DQ26C2DQ26U5
J29PS_DDR3_DQ27C8DQ27U5
Component Memory
Pin NumberPin NameRef. Des.
K30PS_DDR3_DQ28E3DQ28U5
M29PS_DDR3_DQ29E8DQ29U5
L30PS_DDR3_DQ30D2DQ30U5
M30PS_DDR3_DQ31E7DQ31U5
C27PS_DDR3_DM0B7DM0U2
C26PS_DDR3_DQS0_PC3DQS0_PU2
B26PS_DDR3_DQS0_ND3DQS0_NU2
B30PS_DDR3_DM1B7DM1U3
C29PS_DDR3_DQS1_PC3DQS1_PU3
B29PS_DDR3_DQS1_ND3DQS1_NU3
H29PS_DDR3_DM2B7DM2U4
G29PS_DDR3_DQS2_PC3DQS2_PU4
F29PS_DDR3_DQS2_ND3DQS2_NU4
K28PS_DDR3_DM3B7DM3U5
L28PS_DDR3_DQS3_PC3DQS3_PU5
L29PS_DDR3_DQS3_ND3DQS3_NU5
L25PS_DDR3_A0K3A0U2, U3, U4, U5
K26PS_DDR3_A1L7A1U2, U3, U4, U5
ZC706 Evaluation Board User Guidewww.xilinx.com23
UG954 (v1.5) September 10, 2015
Feature Descriptions
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Table 1-5:DDR3 Component Memory Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1) PinNet Name
L27PS_DDR3_A2L3A2U2, U3, U4, U5
G25PS_DDR3_A3K2A3U2, U3, U4, U5
J26PS_DDR3_A4L8A4U2, U3, U4, U5
G24PS_DDR3_A5L2A5U2, U3, U4, U5
H26PS_DDR3_A6M8A6U2, U3, U4, U5
K22PS_DDR3_A7M2A7U2, U3, U4, U5
F27PS_DDR3_A8N8A8U2, U3, U4, U5
J23PS_DDR3_A9M3A9U2, U3, U4, U5
G26PS_DDR3_A10H7A10U2, U3, U4, U5
H24PS_DDR3_A11M7A11U2, U3, U4, U5
K23PS_DDR3_A12K7A12U2, U3, U4, U5
H23PS_DDR3_A13N3A13U2, U3, U4, U5
J24PS_DDR3_A14N7A14U2, U3, U4, U5
M27PS_DDR3_BA0J2BA0U2, U3, U4, U5
M26PS_DDR3_BA1K8BA1U2, U3, U4, U5
M25PS_DDR3_BA2J3BA2U2, U3, U4, U5
K25PS_DDR3_CLK_PF7CKU2, U3, U4, U5
Component Memory
Pin NumberPin NameRef. Des.
J25PS_DDR3_CLK_NG7CK_BU2, U3, U4, U5
M22PS_DDR3_CKEG9CKEU2, U3, U4, U5
N23PS_DDR3_WE_BH3WE_BU2, U3, U4, U5
M24PS_DDR3_CAS_BG3CAS_BU2, U3, U4, U5
N24PS_DDR3_RAS_BF3RAS_BU2, U3, U4, U5
F25PS_DDR3_RESET_BN2RESET_BU2, U3, U4, U5
N22PS_DDR3_CS_BH2CS_BU2, U3, U4, U5
L23PS_DDR3_ODTG1ODTU2, U3, U4, U5
N21PS_VRN
M21PS_VRP
L22VTTVREF_PS
L24VTTVREF_PS
The ZC706 DDR3 component interface adheres to the constraints guidelines documented in
the DDR3 Design Guidelines section of Zynq-7000 All Programmable SoC PCB Design and Pin Planning Guide (UG933
). The ZC706 DDR3 component interface is a 40Ω impedance
implementation. For more details, see the MT41J256M8HX-15E data sheet [Ref 34].
ZC706 Evaluation Board User Guidewww.xilinx.com24
UG954 (v1.5) September 10, 2015
Quad-SPI Flash Memory
SendFeedback
[Figure 1-2, callout 4]
The Quad-SPI flash memory located at U58 and U59 provides 2 x 128 Mb of nonvolatile
storage that can be used for configuration and data storage.
•Part number: S25FL128SAGMFIR01 (Spansion)
•Supply voltage: 1.8V
•Datapath width: 4 bits
•Data rate: Various depending on Single/Dual/Quad mode
The connections between the SPI flash memory and the XC7Z045 AP SoC are listed in
Tab le 1- 6.
Table 1-6:Quad-SPI Flash Memory Connections to the XC7Z045 AP SoC
Feature Descriptions
XC7Z045 (U1)
Pin NameBankPin NumberPin NumberPin NameRef. Des.
PS_MIO6500D24QSPI0_CLK
PS_MIO5500C24QSPI0_IO3
PS_MIO4500E23QSPI0_IO2
PS_MIO3500C23QSPI0_IO1
PS_MIO2500F23QSPI0_IO0
PS_MIO1500D23QSPI0_CS_B
PS_MIO9500A24QSPI1_CLK
PS_MIO13500F22QSPI1_IO3
PS_MIO12500E21QSPI1_IO2
PS_MIO11500A23QSPI1_IO1
PS_MIO10500E22QSPI1_IO0
PS_MIO0500F24QSPI1_CS_B
Schematic
Net Name
Quad-SPI Flash MemoryQSPI Device
16CU58J74.2
1DQ3_HOLD_BU58J73.2
9WP_BU58J72.2
8DQ1U58J71.2
15DQ0U58J70.2
7S_BU58N/A
16CU59N/A
1DQ3_HOLD_BU59 N/A
9WP_BU59N/A
8DQ1U59N/A
15DQ0U59N/A
7S_BU59N/A
The configuration section of the Zynq-7000 All Programmable SoC Technical Reference
Manual UG585
, provides details on using the Quad-SPI flash memory.
MIO Select
Header
ZC706 Evaluation Board User Guidewww.xilinx.com25
UG954 (v1.5) September 10, 2015
Figure 1-6 shows the connections of the linear Quad-SPI flash memory on the ZC706
evaluation board. For more details, see the Spansion S25FL128SAGMFIR01 data sheet
[Ref 16].
X-Ref Target - Figure 1-6
SendFeedback
Feature Descriptions
VCCP1V8VCC3V3_PSVCCP1V8
C39
1
0.1UF
25V
2
X5R
GND
QSPI0_IO3
QSPI0_CS_B
QSPI0_IO1
C40
1
0.1UF
25V
2
X5R
C714
1
R531
1
R207
1
330
1/10W
2
5%
0
1/10W
2
5%
R527
1
DNP
DNP
2
DNP
R528
1
DNP
DNP
2
DNP
2
GND
0.1UF
25V
X5R
S25FL128SAGMFIR01
QSPI0_CLK
QSPI0_IO0
QSPI0_IO2
NC
NC
NC
NC
1
DQ3_HOLD_B
2
VCC
3
NC0
4
NC1
5
NC2
6
NC3
7
S_B
8
DQ1
DQ0
NC7
NC6
NC5
NC4
VSS
DQ2_VPP_WP_B
16
C
15
14
13
NC
12
NC
11
NC
10
9
SO16_50P300X413U58
GND
VCCP1V8VCC3V3_PSVCCP1V8
C715
1
R532
1
R208
1
330
1/10W
2
5%
0
1/10W
2
5%
R530
1
DNP
DNP
2
DNP
R529
1
DNP
DNP
2
DNP
0.1UF
25V
2
X5R
QSPI1_IO3
QSPI1_CS_B
QSPI1_IO1
S25FL128SAGMFIR01
NC
NC
NC
NC
1
DQ3_HOLD_B
2
VCC
3
NC0
4
NC1
5
NC2
6
NC3
7
S_B
8
DQ1
DQ2_VPP_WP_B
DQ0
NC7
NC6
NC5
NC4
VSS
16
C
15
14
13
NC
12
NC
11
NC
10
9
SO16_50P300X413U59
GND
Figure 1-6:128 Mb Quad-SPI Flash Memory
QSPI1_CLK
QSPI1_IO0
QSPI1_IO2
UG954_c1_06_073013
ZC706 Evaluation Board User Guidewww.xilinx.com26
UG954 (v1.5) September 10, 2015
Feature Descriptions
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USB 2.0 ULPI Transceiver
[Figure 1-2, callout 19]
The ZC706 evaluation board uses a Standard Microsystems Corporation USB3320 USB 2.0
ULPI Transceiver at U12 to support a USB connection to the host computer. A USB cable is
supplied in the ZC706 evaluation kit (Standard-A connector to host computer, Micro-B
connector to ZC706 evaluation board connector J2). The USB3320 is a high-speed USB 2.0
PHY supporting the UTMI+ low pin interface (ULPI) interface standard. The ULPI standard
defines the interface between the USB controller IP and the PHY device which drives the
physical USB bus. Use of the ULPI standard reduces the interface pin count between the USB
controller IP and the PHY device.
The USB3320 is clocked by a 24 MHz crystal. Consult the SMSC USB3320 data sheet for
clocking mode details [Ref 17].
The interface to the USB3320 transceiver is implemented through the IP in the XC7Z045
AP SoC Processor System.
Tab le 1- 7 describes the jumper settings for the USB 2.0 circuit. Bold text identifies the
default OTG mode settings.
Table 1-7:USB Jumper Settings
HeaderFunctionShunt PositionNotes
J11
J10
J48
J50
J49
J51
USB PHY resetShunt ON = USB PHY reset
Shunt OFF = USB PHY normal operation
V
5V Supply Shunt ON = Host or OTG mode
BUS
RVBUS selectPosition 1–2 = Device mode only (10 KΩ )
CVBUS selectPosition 1-2 = OTG and Device mode 1 μF
Cable ID selectPosition 1-2 = A/B cable detect
USB Micro-BPosition 1-2 = Shield connected to GND
Shunt OFF = Device mode
Position 2–3 = OTG or Host mode (1 KΩ )
Position 2-3 = Host mode 120 μF
Position 2-3 = ID not used
Position 2-3 = Shield floating
Clean reset requires external
debouncing
Overvoltage protection
V
load capacitance
BUS
Used in OTG mode
ZC706 Evaluation Board User Guidewww.xilinx.com27
UG954 (v1.5) September 10, 2015
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The connections between the USB Micro-B connector at J2 and the PHY at U12 are listed in
Tab le 1- 8.
Table 1-8:USB Connector Pin Assignments and Signal Definitions Between J2 and U12
USB Connector
J1
Net NameDescription
PinName
1VBUSUSB_VBUS_SEL+5V from host system22
2D_NUSB_D_NBidirectional differential serial data (N-side)19
3D_PUSB_D_PBidirectional differential serial data (P-side)18
5GNDGNDSignal ground33
The connections between the USB 2.0 PHY at U12 and the XC7Z045 AP SoC are listed in
Tab le 1- 9.
Table 1-9:USB 2.0 ULPI Transceiver Connections to the XC7Z045 AP SoC
XC7Z045 (U1)
Schematic Net NameUSB3320 (U12) Pin
Pin NameBankPin Number
PS_MIO36501H17USB_CLKOUT1
PS_MIO31501H21USB_NXT2
PS_MIO32501K17USB_DATA03
PS_MIO33501G22USB_DATA14
USB3320 (U12)
Pin
PS_MIO34501K18USB_DATA25
PS_MIO35501G21USB_DATA36
PS_MIO28501L17USB_DATA47
PS_MIO37501B21USB_DATA59
PS_MIO38501A20USB_DATA610
PS_MIO39501F18USB_DATA713
PS_MIO30501L18USB_STP29
PS_MIO29501E8USB_DIR31
PS_MIO7500D5USB_RESET_B_AND27 (via AND gate U13)
For additional information on the Zynq-7000 AP SoC device USB controllers, see Zynq-7000
All Programmable SoC Overview (DS190
Reference Manual (UG585
).
) and Zynq-7000 All Programmable SoC Technical
ZC706 Evaluation Board User Guidewww.xilinx.com28
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-7
SendFeedback
8
8
8
8
8
8
8
Feature Descriptions
Figure 1-7 shows the USB 2.0 ULPI transceiver circuitry. Note that the shield for the USB
Micro-B connector (J2) can be tied to GND by a jumper on header J51 pins 1–2 (default).
The USB shield can optionally be connected through a capacitor to GND by installing a
capacitor (body size 0402) at location C335 and jumping pins 2-3 on header J51.
9
9
USB_CLKOUT
USB_NXT
USB_DATA0
USB_DATA1
USB_DATA2
USB_DATA3
USB_DATA4
VCCP1V8
3 PLACES
31
2 PLACES
VCCMIO
C70
C71
C74
1
0.1UF
2
25V
GND
USB3320_QFN32
1
CLKOUT_1
2
NXT_2
3
DATA0_3
DATA1_4
5
DATA2_5
6
DATA3_6
7
DATA4_7
8
REFSEL0_8
U12
USB_DIR
USB_STP
USB_RESET_B
1
29
VDD18_30
REFSEL1_11
12
NC
STP_29
NC_12
27
28
VDD18_28
DATA7_13
14
1341526
USB_DATA7
8
RESETB_27
REFSEL2_14
SPK_L_15REFCLK_26
NC
R389
1/10W
R403
1625
NC
261
1.0M
1/10W
XO_25
SPK_R_16
VCC3V3
5%
CTR_GND_33
USB3320_QFN32
1
2
2
RBIAS_23
VBUS_22
VBAT_21
VDD33_P
CPEN33_17
1
1
2
2
32
31
30
DIR_31
VDDIO_32
DATA6_10
DATA5_9
9
10
11
USB_DATA5
USB_DATA6
8
8
C496
1
18PF
2
50V
NPO
GND
24
USB_ID
23
ID_23
22
21
20
USB_D_N
19
DM_19
USB_D_P
18
DP_18
17
33
GND
DS25
21
LED-RED-SMT
X2
21
C497
1
24.000MHZ
18PF
2
50V
NPO
GND
R178
8.06K
1/10W
1%
2
1
31
USB_VDD33
27
31
C209
1
31
2.2UF
6.3V
2
GND
1
R267
10.0K
1/10W
2
1
1-2 = DEVICE MODE
2-3 = HOST OR OTG MODE
USB HOST POWER
MIC2025_SOP8
18
ENOUT2
2
FLG
3
GND
4
NC
NC1
U22
GND
GND
2
1
2
3
VCC5V0
2125V
GND
R359
1.00K
1/16W
J48
7
IN
6
OUT1
5
NC2
SOP127P500X600_8
C72
0.1UF
USB_VBUS_SEL
NC
1
2
VCC5V0
1
2
GND
J10
C76
0.1UF
25V
USB_VBUS_SEL
C380
1
1UF
2
16V
J50
X5R
CVBUS Select:
1-2: OTG Mode
2-3: Host Mode
GND
ON = HOST OR OTG MODE
OFF = DEVICE MODE
1
C469
150UF
2
10V
TANT
GND
L11
FERRITE-220
C447
12
1
5.6UF
2
10V
12
FERRITE-220
GND
27
C75
1
0.1UF
27
2
25V
L12
J49
1
3
2
C484
1
120UF
20V
TANT
2
GND
1-2 = A/B CABLE DETECT
2-3 = ID NOT USED
USB_D_N
USB_D_P
1
2
3
USB_ID
USB_VDD33
1
2
3
4
5
ZX62D_AB_5P8
VBUS
D_N
D_P
ID
GND
27
GND
27
SHLD1
SHLD2
SHLD3
SHLD4
SHLD5
9
7
8
6
10
J51
UG954_c1_07_041113
SHLD6
11
123
J2
1
C335
2
DNP
GND
Figure 1-7:USB 2.0 ULPI Transceiver
SD Card Interface
[Figure 1-2, callout 5]
The ZC706 evaluation board includes a secure digital input/output (SDIO) interface to
provide user-logic access to general purpose nonvolatile SDIO memory cards and
peripherals. Information for the SD I/O card specification can be found at the SanDisk and
SD card websites [Ref 18], [Ref 19].
The SDIO signals are connected to XC7Z045 AP SoC PS bank 501 which has its VCCMIO set
to 1.8V. A MAX13035E high-speed logic-level translator (U11) is used between XC7Z045 AP
SoC 1.8V PS bank 501 and the 3.3V SD card connector (J30).
ZC706 Evaluation Board User Guidewww.xilinx.com29
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-8
SendFeedback
Feature Descriptions
Figure 1-8 shows the connections of the SD card interface on the ZC706 evaluation board.
VCCP1V8
1
2
R28
4.7 KΩ
1/10W
5%
1
R29
4.7 KΩ
1/10W
2
5%
VCC3V3_PS
1
2
GND
C41
0.1 μF
25V
X5R
GND
67840-8001
1
CD_DAT3
2
CMD
3
VSS1
4
VDD
5
CLK
6
VSS2
7
DAT0
8
DAT1
9
DAT2
10
DETECT
11
PROTECT
12
DETECT_PROTECT
J30
IOGND2
IOGND1
GNDTAB4
GNDTAB3
GNDTAB2
GNDTAB1
UG954_c1_08_041113
18
17
16
15
14
13
GND
SDIO_CD_DAT322
22SDIO_CMD
22 SDIO_CLK
SDIO_DAT022
22 SDIO_DAT1
SDIO_DAT222
SDIO_SDDET8
SDIO_SDWP8
Figure 1-8:SD Card Interface
Tab le 1- 10 lists the SD card interface connections to the XC7Z045 AP SoC
Table 1-10:SDIO Connections to the XC7Z045 AP SoC
XC7Z045 (U1) Pin
Level Shifter (U11)SDIO Connector (J30)
Schematic
Pin NameBank
Pin
Number
Net Name
PS_MIO15500C22SDIO_SDWPN/AN/A11PROTECT
1.8V Side
Pin
3.3V Side
Pin
Pin
Number
Name
Pin
PS_MIO14500B22SDIO_SDDETN/AN/A10DETECT
PS_MIO41501J18SDIO_CMD_LS4202CMD
PS_MIO40501B20SDIO_CLK_LS9195CLK
PS_MIO44501E20SDIO_DAT2_LS1239DAT2
PS_MIO43501E18SDIO_DAT1_LS7168DAT1
PS_MIO42501D20SDIO_DAT0_LS6187DAT0
PS_MIO45501H18SDIO_CD_DAT3_LS3221CD_DAT3
ZC706 Evaluation Board User Guidewww.xilinx.com30
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-9
SendFeedback
J3
U30
J62
Programmable Logic JTAG Programming Options
[Figure 1-2, callout 6]
The ZC706 evaluation board JTAG chain is shown in Figure 1-9.
SPST Bus Switch
U31
J5
FMC LPC
Connector
TDI
TDO
JTAG
Header
TDO
TDI
JTAG
Module
TDO
TDI
JTAG
Header
TDO
TDI
U45
U46
U47
3:1
Analog
Switch
ON
12
SW4
SPST Bus Switch
U32
N.C.N.C.
J37
FMC HPC
Connector
TDI
TDO
3.3V3.3V
U10
SN74AVC2T245
and
SN74LV541APWR
Buffers
TDITDO
Feature Descriptions
U1
Zynq-7000
XC7Z045
AP SoC
TDI
TDO
UG954_c1_09_041113
Figure 1-9:JTAG Chain Block Diagram
Programmable Logic JTAG Select Switch
[Figure 1-2, callout 35]
The PL JTAG chain can be programmed by three different methods made available through
a 3-to-1 analog switch (U45, U46, and U47) controlled by a 2-position DIP switch at SW4.
Figure 1-10 shows the JTAG analog switches and DIP switch SW4.
ZC706 Evaluation Board User Guidewww.xilinx.com31
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-10
SendFeedback
Feature Descriptions
VCC3V3
To J3
Parallel Cable or
Platform Cable
(14 pins)
To U30
USB-to-JTAG
Digilent bridge
To J62
Parallel Cable
(20 Pins)
14PIN_JTAG_TDI
14PIN_JTAG_TMS
14PIN_JTAG_TCK
DIGILENT_TDI
DIGILENT_TMS
DIGILENT_TCK
20PIN_JTAG_TDI
20PIN_JTAG_TMS
20PIN_JTAG_TCK
U45
TS5A3359
ANALOG SWITCH
1
NO0
2
NO1
3
NO2
4
GND
U46
TS5A3359
ANALOG SWITCH
1
NO0
2
NO1
3
NO2
4
GND
U47
TS5A3359
ANALOG SWITCH
1
NO0
2
NO1
3
NO2
4
GND
SP3T
SP3T
SP3T
IN1
IN2
IN1
IN2
IN1
IN2
COM
COM
COM
V+
V+
V+
VCC3V3
43
SW4
SDA02H1SBD
6
5
7
8
6
5
7
8
6
5
7
8
JTAG_SEL_1
JTAG_SEL_2
R21
4.7kΩ
0.1 W
5%
R20
4.7kΩ
0.1 W
5%
GND
12
JTAG_TDI
JTAG_TMS
JTAG_TCK
ZC706 Evaluation Board User Guidewww.xilinx.com32
UG954 (v1.5) September 10, 2015
UG954_c1_10_041113
Figure 1-10:PL JTAG Programming Source Analog Switch
DIP switch SW4[1:2] setting 10 selects the 14-pin header J3 for configuration using either a
Parallel Cable IV (PC4) or Platform Cable USB II. DIP switch SW4 setting 01 selects the
USB-to-JTAG Digilent bridge U30 for configuration over a Standard-A to Micro-B USB cable.
DIP switch SW4 setting 11 selects the JTAG 20-pin header at J62. The four JTAG signals TDI,
TDO, TCK, and TMS would be connected to J62 through flying leads from a JTAG cable. The
3-to-1 analog switch settings are shown in Tabl e 1-1 1.
When an FPGA mezzanine card (FMC) is attached to HPC J37 or LPC J5 it is automatically
added to the JTAG chain through electronically controlled single-pole single-throw (SPST)
switches U32 and U31 respectively. The SPST switches are normally closed and transition to
an open state when an FMC is attached. Switch U32 adds an attached FMC to the JTAG chain
as determined by the FMC_HPC_PRSNT_M2C_B signal. Switch U31 adds an attached FMC to
the JTAG chain as determined by the FMC_LPC_PRSNT_M2C_B signal. The attached FMC
card must implement a TDI-to-TDO connection through a device or bypass jumper for the
JTAG chain to be completed to the AP SoC U1.
Switch 1
DIP Switch SW4
(1)
JTAG_SEL_1 Switch 2
00
10
01
11
(1)
JTAG_SEL_2
The JTAG connectivity on the ZC706 board allows a host computer to download bitstreams
to the AP SoC using the Xilinx® iMPACT software. In addition, the JTAG connector allows
debug tools such as the Vivado serial I/O analyzer or a software debugger to access the
SoC. The iMPACT software tool can also indirectly program the linear QSPI flash memory. To
accomplish this, the iMPACT software configures the SoC with a temporary design to access
and program the QSPI memory device.
Clock Generation
[Figure 1-2, callouts 7, 8, and 9]
The ZC706 evaluation board provides four clock sources for the XC7Z045 AP SoC.
Tab le 1- 12 lists the source devices for each clock.
ZC706 Evaluation Board User Guidewww.xilinx.com33
UG954 (v1.5) September 10, 2015
Table 1-12:ZC706 Evaluation Board Clock Sources
SendFeedback
Clock NameClock SourceDescription
Feature Descriptions
System ClockU64
User ClockU37
User SMA Clock J67(P), J68(N)
PS ClockU24
GTX SMA REF ClockJ36(P), J31(N)
Jitter Attenuated ClockU60
Tab le 1- 13 lists the pin-to-pin connections from each clock source to the XC7Z045 AP SoC.
Table 1-13:Clock Connections, Source to XC7Z045 AP SoC
1. PS-side and GTX nets do not have an assigned I/O standard.
USRCLK_P
USER_SMA_CLOCK_P
USER_SMA_CLOCK_N
PS_CLK
SMA_MGT_REFCLK_P
SMA_MGT_REFCLK_N
SI5324_OUT_C_N
SI5324_OUT_C_P
REC_CLOCK_C_N
REC_CLOCK_C_P
SI5324_INT_ALM_LS
SI5324_RST_LS
LVDS_25AF14
LVDS_25AD18
LVDS_25AD19
NA(1)A22 (Bank 500)
NA(1)W8
NA(1)W7
NA(1)AC7
NA(1)AC8
LVDS_25AE20
LVDS_25AD20
LVCMOS25AJ25
LVCMOS25W23
System Clock
[Figure 1-2, callout 7]
ZC706 Evaluation Board User Guidewww.xilinx.com34
UG954 (v1.5) September 10, 2015
Feature Descriptions
UG954_c1_11_041113
GND
VCC2V5
SIT9102
200 MHz
Oscillator
OE
NC
GND
VCC
OUT_B
OUT
1
2
3
6
5
4
U64
R322
100Ω
1/20W 5%
SYSCLK_P
SYSCLK_N
C89
0.1 µF 10V
X5R
1
2
2
1
SendFeedback
The system clock source is an LVDS 200 MHz oscillator at U64. It is wired to a multi-region
clock capable (MRCC) input on programmable logic (PL) bank 34. The signal pair is named
SYSCLK_P and SYSCLK_N and each signal is connected to U1 (pins H9 and G9, respectively)
on the XC7Z045 AP SoC.
For more details, see the SiTime SiT9102 data sheet [Ref 20].
Programmable User Clock
[Figure 1-2, callout 8]
The ZC706 evaluation board has a programmable low-jitter 3.3V LVDS differential oscillator
(U37) connected to the MRCC inputs of bank 10. This USRCLK_P and USRCLK_N clock signal
pair is connected to XC7Z045 AP SoC U1 pins AF14 and AG14, respectively. On power-up
the user clock defaults to an output frequency of 156.250 MHz. User applications can
change the output frequency within the range of 10 MHz to 810 MHz through an I
interface. Power cycling the ZC706 evaluation board reverts the user clock to the default
frequency of 156.250 MHz.
The ZC706 board provides a pair of SMAs for differential user clock input into PL Bank 9 (see
Figure 1-13). The P-side SMA J67 signal USER_SMA_CLOCK_P is connected to U1 pin AD18,
with the N-side SMA J68 signal USER_SMA_CLOCK_N connected to U1 pin AD19. Bank 9
Vcco is VADJ_FPGA, a variable voltage (1.8V, 2.5V, 3.3V) depending on the ZC706 FMC
interface banks voltage. The USER_SMA_CLOCK input voltage swing should not exceed the
board VADJ_FPGA voltage setting.
X-Ref Target - Figure 1-13
ZC706 Evaluation Board User Guidewww.xilinx.com36
UG954 (v1.5) September 10, 2015
Figure 1-13:User SMA Clock
UG954_c1_13_041113
Feature Descriptions
SendFeedback
Processing System Clock Source
The Processing System (PS) clock source is a 1.8V LVCMOS single-ended fixed
33.33333 MHz oscillator at U24. It is wired to PS bank 500, pin A22 (PS_CLK), on the
XC7Z045 AP SoC.
For more details, see the SiTime SiT8103 data sheet [Ref 20].
GTX SMA Clock (SMA_MGT_REFCLK_P and SMA_MGT_REFCLK_N)
[Figure 1-2, callout 10]
The ZC706 board includes a pair of SMA connectors for a GTX clock wired to GTX Quad bank
111. This differential clock has signal names SMA_MGT_REFCLK_P and SMA_REFCLK_N,
which are connected to AP SoC U1 pins W8 and W7 respectively.
•External user-provided GTX reference clock on SMA input connectors
•Differential Input
ZC706 Evaluation Board User Guidewww.xilinx.com37
UG954 (v1.5) September 10, 2015
Figure 1-15 shows this AC-coupled clock circuit.
SendFeedback
X-Ref Target - Figure 1-15
J36
SMA
Connector
J31
GND
SMA
Connector
C145
0.01 μF 25V
X7R
C144
0.01 μF 25V
X7R
Feature Descriptions
SMA_MGT_REFCLK_PSMA_MGT_REFCLK_C_P
SMA_MGT_REFCLK_NSMA_MGT_REFCLK_C_N
GND
UG954_c1_15_041113
Figure 1-15:GTX SMA Clock Source
Jitter Attenuated Clock
[Figure 1-2, callout 11]
The ZC706 board includes a Silicon Labs Si5324 jitter attenuator U60 on the back side of the
board. AP SoC user logic can implement a clock recovery circuit and then output this clock
to a differential I/O pair on I/O bank 9 (REC_CLOCK_C_P, AP SoC U1 pin AD20 and
REC_CLOCK_C_N, AP SoC U1 pin AE20) for jitter attenuation. The jitter attenuated clock
(Si5324_OUT_C_P, Si5324_OUT_C_N) is then routed as a reference clock to GTX Quad 110
inputs MGTREFCLK1P (AP SoC U1 pin AC8) and MGTREFCLK1N (AP SoC U1 pin AC7).
The primary purpose of this clock is to support CPRI/OBSAI applications that perform clock
recovery from a user-supplied SFP/SFP+ module and use the jitter attenuated recovered
clock to drive the reference clock inputs of a GTX transceiver. The jitter attenuated clock
circuit is shown in Figure 1-16.
ZC706 Evaluation Board User Guidewww.xilinx.com38
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-16
UG954_c1_16_041113
R89
4.7 KΩ 5%
SI5324_VCC
Si5324C-C-GM
Clock Multiplier/
Jitter Attenuator
VDD3
GND
XB
XA
NC5
32
6
30
29
28
U60
CKOUT1_N
7
33
CKOUT1_P
C137
0.1 μF 25V
X5R
C136
0.1 μF 25V
X5R
SI5324_XTAL_XA
GND2
GND1
XB
XA
X4
114.285 MHz
20 ppm
SI5324_OUT_C_N
SI5324_OUT_C_P
SI5324_OUT_N
SI5324_OUT_P
SI5324_XTAL_XB
GND
NC4
2
1
3
4
C138
0.1 μF 25V
X5R
C141
0.1 μF 25V
X5R
REC_CLOCK_P
REC_CLOCK_N
REC_CLOCK_C_P
REC_CLOCK_C_N
16
17
R251
100Ω
CKIN1_P
CKIN1_N
NCNC12
13
CKIN2_P
CKIN2_N
10
5
VDD2
VDD1
14
NC3
9
NC2
2
NC1
NC
NC
NC
NC
NC
35
34
NC
NC
CKOUT2_P
CKOUT2_N
SI5324_INT_ALM3
NC 4
NC 11
NC 15
NC 18
19
20
SI5324_RST1
21
31
GND2
9
GND1
31
A2_SS
31
A1
24
A0
22
RTC SI5324_SCL
SCL
23
RTC SI5324_SDA
SDA_SDO
27
NC
SDI
36
CMODE
GND
GND4
GND3
LOL
RATE1
RATE0
C2B
INT_C1B
CS_CA
RST_B
37
GNDPAD
0.1W
1%
SendFeedback
Feature Descriptions
See the Silicon Labs Si5324 data sheet [Ref 21].
GTX Transceivers
[Figure 1-2, callout 12]
ZC706 Evaluation Board User Guidewww.xilinx.com39
UG954 (v1.5) September 10, 2015
The ZC706 board provides access to 16 GTX transceivers:
•Four of the GTX transceivers are wired to the PCI Express x4 endpoint edge connector
•Eight of the GTX transceivers are wired to the FMC HPC connector (J37)
•One GTX transceiver is wired to the FMC LPC connector (J5)
(P4) fingers
•One GTX transceiver is wired to SMA connectors (RX: J32, J33 TX: J35, J34)
•One GTX transceiver is wired to the SFP/SFP+ Module connector (P2)
Figure 1-16:Jitter Attenuated Clock
Feature Descriptions
SendFeedback
•One GTX transceiver is unused and is wired in a capacitively coupled TX-to-RX loopback
configuration
The GTX transceivers in Zynq-7000 series AP SoCs are grouped into four channels described
as Quads. The reference clock for a Quad can be sourced from the Quad above or Quad
below the GTX Quad of interest. There are four GTX Quads on the ZC706 board with
connectivity as shown here:
•Quad 109:
MGTREFCLK0 - FMC_HPC_GBTCLK0_M2C clock
°
MGTREFCLK1 - not connected
°
Contains 4 GTX transceivers allocated to FMC_HPC_DP[3:0]_C2M_P/N
Contains 4 GTX transceivers allocated to PCIe lanes 0-3
°
ZC706 Evaluation Board User Guidewww.xilinx.com40
UG954 (v1.5) September 10, 2015
Tab le 1- 14 lists the GTX Banks 109 and 110 interface connections between the AP SoC U1
SendFeedback
and FMC HPC connector J37.
Table 1-14:AP SoC GTX Banks 109 and 110 Interface Connections to FMC HPC J37
Feature Descriptions
Transceiver
Bank
GTX_BANK_109
AP SoC U1
Pin
AP SoC U1 Pin NameSchematic Net Name
Connected
Number
AK10MGTPTXP0_109FMC_HPC_DP0_C2M_PC2
AK9MGTPTXN0_109FMC_HPC_DP0_C2M_NC3
AH10MGTPRXP0_109FMC_HPC_DP0_M2C_PC6
AH9MGTPRXN0_109FMC_HPC_DP0_M2C_NC7
AK6MGTPTXP1_109FMC_HPC_DP1_C2M_PA22
AK5MGTPTXN1_109FMC_HPC_DP1_C2M_NA23
AJ8MGTPRXP1_109FMC_HPC_DP1_M2C_PA2
AJ7MGTPRXN1_109FMC_HPC_DP1_M2C_NA3
AJ4MGTPTXP2_109FMC_HPC_DP2_C2M_PA26
AJ3MGTPTXN2_109FMC_HPC_DP2_C2M_NA27
AG8MGTPRXP2_109FMC_HPC_DP2_M2C_PA6
AG7MGTPRXN2_109FMC_HPC_DP2_M2C_NA7
AK2MGTPTXP3_109FMC_HPC_DP3_C2M_PA30
AK1MGTPTXN3_109FMC_HPC_DP3_C2M_NA31
AE8MGTPRXP3_109FMC_HPC_DP3_M2C_PA10
Pin
Connected
Device
FMC HPC
J37
AE7MGTPRXN3_109FMC_HPC_DP3_M2C_NA11
(1)
(1)
D4
D5
AD10MGTREFCLK0P_109FMC_HPC_GBTCLK0_M2C_C_P
AD9MGTREFCLK0N_109FMC_HPC_GBTCLK0_M2C_C_N
AF10MGTREFCLK1P_109NCNANA
AF9MGTREFCLK1N_109NCNANA
ZC706 Evaluation Board User Guidewww.xilinx.com41
UG954 (v1.5) September 10, 2015
Feature Descriptions
SendFeedback
Table 1-14:AP SoC GTX Banks 109 and 110 Interface Connections to FMC HPC J37 (Cont’d)
Transceiver
Bank
GTX_BANK_110
AP SoC U1
Pin
AP SoC U1 Pin NameSchematic Net Name
Connected
Number
AH2MGTPTXP0_110FMC_HPC_DP4_C2M_PA34
AH1MGTPTXN0_110FMC_HPC_DP4_C2M_NA35
AH6MGTPRXP0_110FMC_HPC_DP4_M2C_PA14
AH5MGTPRXN0_110FMC_HPC_DP4_M2C_NA15
AF2MGTPTXP1_110FMC_HPC_DP5_C2M_PA38
AF1MGTPTXN1_110FMC_HPC_DP5_C2M_NA39
AG4MGTPRXP1_110FMC_HPC_DP5_M2C_PA18
AG3MGTPRXN1_110FMC_HPC_DP5_M2C_NA19
AE4MGTPTXP2_110FMC_HPC_DP6_C2M_PB36
AE3MGTPTXN2_110FMC_HPC_DP6_C2M_NB37
AF6MGTPRXP2_110FMC_HPC_DP6_M2C_PB16
AF5MGTPRXN2_110FMC_HPC_DP6_M2C_NB17
AD2MGTPTXP3_110FMC_HPC_DP7_C2M_PB32
AD1MGTPTXN3_110FMC_HPC_DP7_C2M_NB33
AD6MGTPRXP3_110FMC_HPC_DP7_M2C_PB12
Pin
Connected
Device
FMC HPC
J37
AD5MGTPRXN3_110FMC_HPC_DP7_M2C_NB13
AA8MGTREFCLK0P_110FMC_HPC_GBTCLK1_M2C_P
AA7MGTREFCLK0N_110FMC_HPC_GBTCLK1_M2C_N
AC8MGTREFCLK1P_110SI5324_OUT_C_P
AC7MGTREFCLK1N_110SI5324_OUT_C_N
Notes:
1. AP SoC U1 GTX input clock nets are capacitively coupled to the FMC HPC J37 pins.
2. AP SoC U1 GTX input clock nets are capacitively coupled to the SI5324C Recovery Clock U60 output pins.
(2)
(2)
(1)
(1)
B20
B21
28
29
SI5324C
U60
ZC706 Evaluation Board User Guidewww.xilinx.com42
UG954 (v1.5) September 10, 2015
Tab le 1- 15 lists the GTX Bank interface connections between the AP SoC U1 and FMC LPC
SendFeedback
connector J5.
Table 1-15:AP SoC GTX Bank 111 Interface Connections to FMC LPC J5
Feature Descriptions
Transceiver
Bank
GTX_BANK_11
1
AP SoC U1
Pin
Number
AB2MGTPTXP0_111FMC_LPC_DP0_C2M_PC2
AB1MGTPTXN0_111FMC_LPC_DP0_C2M_NC3
AC4MGTPRXP0_111FMC_LPC_DP0_M2C_PC6
AC3MGTPRXN0_111FMC_LPC_DP0_M2C_NC7
Y2MGTPTXP1_111SMA_MGT_TX_PJ35.1
Y1MGTPTXN1_111SMA_MGT_TX_NJ34.1
AB6MGTPRXP1_111SMA_MGT_RX_P
AB5MGTPRXN1_111SMA_MGT_RX_N
W4MGTPTXP2_111SFP_TX_P18
W3MGTPTXN2_111SFP_TX_N19
Y6MGTPRXP2_111SFP_RX_P13
Y5MGTPRXN2_111SFP_RX_N12
V2MGTPTXP3_111(capacitively coupled to AA4)U1.AA4
V1MGTPTXN3_111(Cooperatively coupled to AA3)U1.AA3
AA4MGTPRXP3_111See Pin V2 loopbackU1.V2
AA3MGTPRXN3_111See Pin V1 loopbackU1.V1
U8MGTREFCLK0P_111FMC_LPC_GBTCLK0_M2C_C_P
U7MGTREFCLK0N_111FMC_LPC_GBTCLK0_M2C_C_N
W8MGTREFCLK1P_111SMA_MGT_REFCLK_P
W7MGTREFCLK1N_111SMA_MGT_REFCLK_N
AP SoC U1 Pin
Name
Schematic Net Name
(2)
(2)
(2)
(2)
Connected
Pin
J32.1
J33.1
(1)
D4
(1)
D5
J36.1GTX
J31.1
Connected
Device
FMC LPC
J5
GTX TX/RX
SMA
SFP+
Conn. P2
AP SoC U1
GTX
Loopback
FMC LPC
J5
REFCLK
SMA
Notes:
1. AP SoC U1 GTX input clock nets are capacitively coupled to the FMC LPC J5 pins.
2. AP SoC U1 GTX input nets are capacitively coupled to the RX and MGT_REFCLK SMA pins.
ZC706 Evaluation Board User Guidewww.xilinx.com43
UG954 (v1.5) September 10, 2015
For additional information on Zynq-7000 GTX transceivers, see 7 Series FPGAs GTX/GTH
Transceivers User Guide (UG476
).
Feature Descriptions
UG954_c1_18_041113
PCIE_PRSNT_BPCIE_PRSNT_X1
PCIE_PRSNT_X4
J19
1
3
2
4
SendFeedback
PCI Express Endpoint Connectivity
[Figure 1-2, callout 13]
The 4-lane PCI Express edge connector performs data transfers at the rate of 2.5 GT/s for a
Gen1 application and 5.0 GT/s for a Gen2 application. The PCIe transmit and receive signal
data paths have a characteristic impedance of 85Ω ±10%. The PCIe clock is routed as a
100Ω differential pair.
The XC7Z045-2FFG900C AP SoC (-2 speed grade) included with the ZC706 board supports
up to Gen2 x4.
The PCIe clock is input from the edge connector. It is AC coupled to the AP SoC through the
MGTREFCLK0 pins of Quad 112. PCIE_CLK_Q0_P is connected to AP SoC U1 pin N8, and the
_N net is connected to pin N7. The PCI Express clock circuit is shown in Figure 1-17.
X-Ref Target - Figure 1-17
P4
PCI Express
Eight-Lane
Edge connector
OE
GND
REFCLK+
REFCLK-
GND
A12
A13
A14
A15
PCIE_CLK_Q0_C_P
PCIE_CLK_Q0_C_N
GND
C352
0.01μF 25V
X7R
PCIE_CLK_Q0_P
PCIE_CLK_Q0_N
C353
0.01μF 25V
X7R
UG954_c1_17_041113
X-Ref Target - Figure 1-18
Figure 1-17:PCI Express Clock
PCIe lane width/size is selected by jumper J19 (Figure 1-17). The default lane size selection
is 4-lane (J19 pins 3 and 4 jumpered).
Figure 1-18:PCI Express Lane Size Select Jumper J19
ZC706 Evaluation Board User Guidewww.xilinx.com44
UG954 (v1.5) September 10, 2015
Feature Descriptions
SendFeedback
Tab le 1- 17 lists the GTX Bank 112 interface connections between the AP SoC U1 and PCIe
4-lane connector P4.
Table 1-16:AP SoC GTX Bank 112 Interface Connections to PCIe 4-Lane Connector P4
Transceiver
Bank
GTX_BANK_112T2MGTPTXP0_112PCIE_TX3_PA29 (1)
AP SoC U1 Pin
Number
T1MGTPTXN0_112PCIE_TX3_NA30 (1)
V6MGTPRXP0_112PCIE_RX3_PB27
V5MGTPRXN0_112PCIE_RX3_NB28
R4MGTPTXP1_112PCIE_TX2_PA25 (1)
R3MGTPTXN1_112PCIE_TX2_NA26 (1)
U4MGTPRXP1_112PCIE_RX2_PB23
U3MGTPRXN1_112PCIE_RX2_NB24
P2MGTPTXP2_112PCIE_TX1_PA21 (1)
P1MGTPTXN2_112PCIE_TX1_NA22 (1)
T6MGTPRXP2_112PCIE_RX1_PB19
T5MGTPRXN2_112PCIE_RX1_NB20
N4MGTPTXP3_112PCIE_TX0_PA16 (1)
N3MGTPTXN3_112PCIE_TX0_NA17 (1)
P6MGTPRXP3_112PCIE_RX0_PB14
AP SoC U1 Pin Name Schematic Net Name
PCIe 4-Lane Conn. P4
Pin Number
P5MGTPRXN3_112PCIE_RX0_NB15
N8MGTREFCLK0P_112PCIE_CLK_QO_PA13 (1)
N7MGTREFCLK0N_112PCIE_CLK_QO_NA14 (1)
R8MGTREFCLK1P_112NCNA
R7MGTREFCLK1N_112NCNA
Notes:
1. PCIE_TXn_P/N and PCIE_CLK_Q0_P/N are capacitively coupled to the PCIe edge connector P4.
For additional information about Zynq-7000 PCIe functionality, see 7SeriesFPGAs Integrated Block for PCI Express Product Guide for Vivado Design Suite (
information about the PCI Express standard is available [Ref 22].
PG054). Additional
ZC706 Evaluation Board User Guidewww.xilinx.com45
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-19
SendFeedback
Feature Descriptions
SFP/SFP+ Module Connector
[Figure 1-2, callout 14]
The ZC706 board contains a small form-factor pluggable (SFP/SFP+) connector and cage
assembly P2 that accepts SFP or SFP+ modules. Figure 1-19 shows the SFP/SFP+ module
connector circuitry.
15
16
10
11
14
1
17
20
21
22
23
24
25
26
27
28
29
30
31
32
P2
VCCR
VCCT
VEER_1
VEER_2
VEER_3
VEET_1
VEET_2
VEET_3
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
SFP+ Module
Connector
74441-0010
RD_N
RD_P
TD_P
TD_N
TX_FAULT
TX_DISABLE
MOD_ABS
SFP_RX_N
12
SFP_RX_P
13
SFP_TX_P
18
SFP_TX_N
19
SFP_IIC_SDA
4
SDA
SFP_IIC_SCL
5
SCL
SFP_TX_FAULT
2
SFP_TX_DISABLE_TRANS
3
SFP_MOD_DETECT
6
SFP_LOS
8
LOS
SFP Enable
GND
SFP_RS1
9
RS1
SFP_RS0
7
RS0
J17
12
HDR_1X2
R84
4.7KΩ
4.7KΩ
VCC3V3
R87
R83
4.7KΩ
Q12
NDS331N
3
460 mW
SFP_TX_DISABLE
1
2
HDR_1X3
J38 J39
1
2
3
VCC3V3
R85
4.7KΩ
R86
4.7KΩ
VCC3V3
1
2
3
HDR_1X1
R88
4.7KΩ
1
1
1
J22
J21
J20
C198
22μF
VCC3V3
C134
0.1μF
L6
4.7μH
3.0 A
C199
22μF
VCC3V3
GND
L7
4.7μH
3.0 A
SFP_VCCR
SFP_VCCT
C135
0.1μF
GND
ZC706 Evaluation Board User Guidewww.xilinx.com46
UG954 (v1.5) September 10, 2015
1-2: FULL BW RX
2-3: LOW BW RX
Figure 1-19:SFP+ Module Connector
Tab le 1- 17 lists the SFP+ module RX and TX connections to the AP SoC.
GNDGND
1-2: FULL BW TX
2-3: LOW BW TX
UG954_c1_19_041113
Table 1-17:AP SoC U1 to SFP+ Module Connections
SendFeedback
Feature Descriptions
AP SoC (U1) PinSchematic Net name
SFP+ Module (P2)
PinName
Y5SFP_RX_N12RD_N
Y6SFP_RX_P13RD_P
W4SFP_TX_P18TD_P
W3SFP_TX_N19TD_N
AA18SFP_TX_DISABLE_TRANS3TX_DISABLE
Tab le 1- 18 lists the SFP+ module control and status connections to the AP SoC.
Table 1-18:SFP+ Module Control and Status Connections
SFP Control/ Status
Signal
SFP_TX_FAULTTest Point J23
SFP_TX_DISABLEJumper 17
SFP_MOD_DETECTTest Point J24
SFP_RS0Jumper 56
Board Connection
High = Fault
Low = Normal operation
Off = SFP Disabled
On = SFP enabled
High = Module not present
Low = Module present
Jumper pins 1-2 = Full RX bandwidth
Jumper pins 2-3 = Reduced RX bandwidth
SFP_RS1Jumper 55
SFP_LOSTest Point J25
Jumper pins 1-2 = Full TX bandwidth
Jumper pins 2-3 = Reduced TX bandwidth
High = Loss of receiver signal
Low = Normal operation
For additional information about the enhanced Small Form Factor Pluggable (SFP+)
module, see the SFF-8431 specification [Ref 23].
10/100/1000 Mb/s Tri-Speed Ethernet PHY (PL)
[Figure 1-2, callout 15]
The ZC706 evaluation board uses the Marvell Alaska PHY device (88E1116R) at U51 for
Ethernet communications at 10 Mb/s, 100 Mb/s, or 1000 Mb/s. The board supports RGMII
mode only. The PHY connection to a user-provided Ethernet cable is through a Halo
HFJ11-1G01E RJ-45 connector (P3) with built-in magnetics.
On power-up, or on reset, the PHY is configured to operate in RGMII mode with PHY
address 0b00111 using the settings shown in Tab le 1- 19. These settings can be overwritten
via software commands passed over the MDIO interface.
ZC706 Evaluation Board User Guidewww.xilinx.com47
UG954 (v1.5) September 10, 2015
Table 1-19:Board Connections for PHY Configuration Pins
SendFeedback
U51 PinSettingConfiguration
CONFIG (64)VCCP1V8PHYAD[1]=1PHYAD[0]=1
CONFIG1 (1)PHY_LED0PHYAD[3]=0PHYAD[2]=1
GNDENA_XC=0PHYAD[4]=0
Feature Descriptions
CONFIG2 (2)
CONFIG3 (3)
PHY_LED0ENA_XC=0PHYAD[4]=1
VCCP1V8ENA_XC=1PHYAD[4]=1
GNDRGMII_TX=0RGMII_RX=0
PHY_LED0RGMII_TX=0RGMII_RX=1
PHY_LED1RGMII_TX=1RGMII_RX=0
VCCP1V8RGMII_TX=1RGMII_RX=1
The Ethernet connections from the XC7Z045 AP SoC at U1 to the 88E1116R PHY device at
U51 are listed in Table 1 -20 .
Table 1-20:Ethernet Connections, XC7Z045 AP SoC to the PHY Device
XC7Z045 (U1) Pin
M88E1116R PHY U51
Schematic
Pin NameBank
PS_MIO53501C18PHY_MDIO45MDIO
PS_MIO52501D19PHY_MDC48MDC
PS_MIO16501L19PHY_TX_CLK60TX_CLK
PS_MIO21501J19PHY_TX_CTRL63TX_CTRL
PS_MIO20501M20PHY_TXD362TXD3
Pin
Number
Net Name
PinName
ZC706 Evaluation Board User Guidewww.xilinx.com48
UG954 (v1.5) September 10, 2015
PS_MIO19501J20PHY_TXD261TXD2
PS_MIO18501K20PHY_TXD159TXD1
PS_MIO17501K21PHY_TXD058TXD0
PS_MIO22501L20PHY_RX_CLK53RX_CLK
PS_MIO27501G20PHY_RX_CTRL49RX_CTRL
PS_MIO26501M17PHY_RXD355RXD3
PS_MIO25501G19PHY_RXD254RXD2
PS_MIO24501M19PHY_RXD151RXD1
PS_MIO23501J21PHY_RXD050RXD0
Ethernet PHY Clock Source
A 25.00 MHz 50 ppm crystal at X1 is the clock source for the 881116R PHY at U51.
Figure 1-20 shows the clock source.
X-Ref Target - Figure 1-20
UG954_c1_20_041113
GND
R355
DNP
C495
18 pF 50V
NPO
C494
18 pF 50V
NPO
PHY XTAL OUT
X1
25.00 MHz
50 PPM
PHY XTAL IN
3
4
1
2
1
2
12
12
NC
NC
SendFeedback
Feature Descriptions
Figure 1-20:Ethernet PHY Clock Source
The data sheet can be obtained under NDA with Marvell. Contact information can be found
at their website [Ref 24].
For additional information on the Zynq-7000 AP SoC device gigabit Ethernet controller, see
Zynq-7000 All Programmable SoC Overview (DS190
Technical Reference Manual (UG585
).
) and Zynq-7000 All Programmable SoC
ZC706 Evaluation Board User Guidewww.xilinx.com49
UG954 (v1.5) September 10, 2015
USB-to-UART Bridge
[Figure 1-2, callout 17]
The ZC706 evaluation board contains a Silicon Labs CP2103GM USB-to-UART bridge device
(U52) which allows a connection to a host computer with a USB port. The USB cable is
supplied in the ZC706 evaluation kit (Standard-A end to host computer, Type Mini-B end to
ZC706 evaluation board connector J21). The CP2103GM is powered by the USB 5V provided
by the host PC when the USB cable is plugged into the USB port on the ZC706 evaluation
board.
The CP2013GM TX and RX pins are wired to the UART_1 IP block within the XC7Z045 AP SoC
PS I/O Peripherals set. The XC7Z045 AP SoC supports the USB-to-UART bridge using two
signal pins: Transmit (TX) and Receive (RX).
Silicon Labs provides royalty-free Virtual COM Port (VCP) drivers for the host computer.
These drivers permit the CP2103GM USB-to-UART bridge to appear as a COM port to
communications application software (for example, TeraTerm or HyperTerm) that runs on
the host computer. The VCP device drivers must be installed on the host PC prior to
establishing communications with the ZC706 evaluation board.
The USB Connector pin assignments and signal definitions between J21 and U52 are listed
in Tab le 1 -21 .
Table 1-21:USB Connector J21 Pin Assignments and Signal Definitions
SendFeedback
Feature Descriptions
USB Connector (J21)
CP2103GM (U52)
Net NameDescription
PinNamePinName
1VBUSUSB_UART_VBUS+5V VBUS Powered
2D_NUSB_UART_D_NBidirectional differential serial data (N-side)4D –
3D_PUSB_UART_D_PBidirectional differential serial data (P-side)3D +
5GNDUSB_UART_GNDSignal ground
7REGIN
8VBUS
2GND1
29CNR_GND
Tab le 1- 22 lists the USB connections between the XC7Z045 AP SoC PS Bank 501 and the
CP2103 UART bridge.
Table 1-22:XC7Z045 AP SoC to CP2103 Connections
XC7045 AP SoC (U1)
Pin Name Bank PINFunction Direction IOSTANDARDPIN Function Direction
Refer to the Silicon Labs website for technical information on the CP2103GM and the VCP
drivers [Ref 21].
For additional information on the Zynq-7000 AP SoC device UART controller, see Zynq-7000
All Programmable SoC Overview (DS190
Reference Manual (UG585
).
) and Zynq-7000 All Programmable SoC Technical
HDMI Video Output
[Figure 1-2, callout 18]
The ZC706 evaluation board provides a high-definition multimedia interface (HDMI®)
video output using an Analog Devices ADV7511KSTZ-P HDMI transmitter at U53. The HDMI
transmitter U53 is connected to the XC7Z045 AP SoC PL-side banks 12 and 13 and its output
is provided on a Molex 500254-1927 HDMI type-A receptacle at P1. The ADV7511 supports
1080P 60Hz, YCbCr 4:4:4 encoding via 24-bit input data mapping.
The ZC706 evaluation board supports the following HDMI device interfaces:
Programming information for the RTC-8564JE is available in the RTC-8564JE/NB Application Manual[Ref 29].
Figure 1-23 shows the real time clock circuit.
X-Ref Target - Figure 1-23
IIC_RTC_SDA
IIC_RTC_SCL
IIC_RTC_IRQ_1_B
VADJ
R270
10.0 KΩ
0.1W
U26
7
SDA
6
SCL
10
INT
RTC-8564JE
Real Time Clock
Module
CLKOE
CLKOUT
VCC
GND
1
J60
YELLOW
16
15
14
13
GND
VCC3V3VCC2V5
D4
BAT54T1G
30V 400 mW
D6
BAT54T1G
30V 400 mW
C350
0.01μF
25V
X7R
GND
1
2
GND
D5
BAT54T1G
30V 400 mW
R501
4.7 KΩ
0.1WW
B3
Panasonic
ML621S/DN
3V
UG954_c1_23_041113
Figure 1-23:Real Time Clock Circuit
Real time clock connections to the XC7Z045 AP SoC and the PCA9548 8-Channel bus switch
are listed in Tab le 1 -26 . Refer to Tab le 1 -25 for the RTC I
2
C address.
Table 1-26:Real Time Clock Connections
RTC-8564JE (U16) PinNet Name Connects To
6IIC_RTC_SCLU65.11 (PCA9548 SC4)
7IIC_RTC_SDAU65.10 (PCA9548 SD4)
ZC706 Evaluation Board User Guidewww.xilinx.com55
UG954 (v1.5) September 10, 2015
10IIC_RTC_IRQ_1_B U1.AA17 (XC7Z045 AP SoC PL BANK 10)
Information about the RTC-8564JE is available at the Epson Electronics America website
[Ref 30].
Status and User LEDs
SendFeedback
Tab le 1- 27 defines the status and user LEDs.
Table 1-27:Status LEDs
Feature Descriptions
Reference
Designator
DS1
DS2
DS3
DS8
DS9
DS10
DS11
DS13
DS15
DS16
DS20
DS21
DS22
DS23
DS24
Net NameLED ColorDescription
POR
FPGA_INIT_B
DONE
GPIO_LED_LEFT
GPIO_LED_CENTER
GPIO_LED_RIGHT
VCCINT
VCC1V5_PL
VADJ_FPGA
VCC3V3_FPGA
PS_DDR_LINEAR_PG
SODIMM_DDR_LINEAR_PG
VCC12_P
PWRCTL1_FMC_PG_C2M
CTRL1_PWRGOOD
RED
GRN/RED
GRN
GRN
GRN
GRN
GRN
GRN
GRN
GRN
GRN
GRN
GRN
GRN
GRN
Processor System Power-ON reset is active
Green: FPGA initialization was successful
Red: FPGA initialization is in progress
FPGA bit file download is complete
Geographically LEFT located user LED
Geographically CENTER located user LED
Geographically RIGHT located user LED
VCCINT voltage on indicator
VCC1V5_PL voltage on indicator
VADJ_FPGA voltage on indicator
VCC3V3 voltage on indicator
VTTDDR_PS voltage on indicator
VTTDDR_SODIMM voltage on indicator
VCC12_P voltage on indicator
FMC power good INDICATOR
Power Controller controlled voltage regulator
outputs are all ≥ their minimum “good”
threshold
ZC706 Evaluation Board User Guidewww.xilinx.com56
UG954 (v1.5) September 10, 2015
DS25
DS26
DS27
DS28
DS29
DS30
DS35
U22_FLG
LINEAR_POWER_GOOD
VCCAUX
PHY_LED0
PHY_LED1
PHY_LED2
GPIO_LED_0
RED
GRN
GRN
GRN
GRN
GRN
GRN
USB 2.0 MOSFET power switch fault
MGTAVCC, MGTAVTT, MGTVCCAUX voltage
regulator outputs are all ≥ their minimum
“good” threshold
VCCAUX voltage on indicator
Ethernet PHY LED0
Ethernet PHY LED1
Ethernet PHY LED2
General Purpose user LED
Feature Descriptions
SendFeedback
Ethernet PHY User LEDs
[Figure 1-2, callout 21]
The three Ethernet PHY user LEDs shown in Figure 1-24 are located near the RJ45 Ethernet
jack P3. The on/off state for each LED is software dependent and has no specific meaning at
Ethernet PHY power on.
Refer to the Marvell 881116R Alaska Gigabit Ethernet transceiver data sheet for details
concerning the use of the Ethernet PHY user LEDs. They are referred to in the data sheet as
LED0, LED1, and LED2. See the data sheet and other product information for the Marvell
881116R Alaska Gigabit Ethernet Transceiver [Ref 24].
X-Ref Target - Figure 1-24
VCC3V3
3
1
2
GNDGNDGND
UG954_c1_24_041113
386
261Ω
0.1W
DS30
Q4
NDS331N
460 mW
PHY LED 0
VCC3V3
3
1
2
388
261Ω
0.1W
DS28
Q6
NDS331N
460 mW
PHY LED1
VCC3V3
3
1
2
387
261Ω
0.1W
DS29
Q5
NDS331N
460 mW
PHY LED 2
Figure 1-24:Ethernet PHY User LEDs
User I/O
[Figure 1-2, callout 22–24]
The ZC706 evaluation board provides the following user and general purpose I/O
capabilities:
The ZC706 evaluation board supports four user LEDs connected to XC7Z045 AP SoC Banks
11, 33, and 35. Figure 1-25 shows the user LED circuits.
X-Ref Target - Figure 1-25
LEFT
VCC3V3
2
1
2
1
3
1
2
DS8
R390
261Ω
0.1W
1%
Q7
NDS331N
460 mW
GPIO_LED_
GND
CENTER
VCC3V3
2
1
2
1
3
1
2
DS9
R391
261Ω
0.1W
1%
Q8
NDS331N
460 mW
GND
GPIO_LED_
RIGHT
VCC3V3
2
1
2
1
3
1
2
DS10
R392
261Ω
0.1W
1%
Q9
NDS331N
460 mW
GND
VCC3V3
2
DS35
1
2
R544
261Ω
0.1W
1
1%
3
Q30
1
GPIO_LED_0GPIO_LED_
NDS331N
460 mW
2
GND
UG954_c1_25_041113
Figure 1-25:User LEDs
Tab le 1- 28 lists the user LED connections to XC7Z045 AP SoC U1.
Table 1-28:User LED Connections to XC7Z045 AP SoC U1
XC7Z045 AP SoC (U1) PinNet NameI/O StandardLED Reference
ZC706 Evaluation Board User Guidewww.xilinx.com58
UG954 (v1.5) September 10, 2015
Y21GPIO_LED_LEFTLVCMOS25DS8
G2GPIO_LED_CENTERLVCMOS25DS9
W21GPIO_LED_RIGHTLVCMOS25DS10
A17GPIO_LED_0LVCMOS25DS35
X-Ref Target - Figure 1-26
VADJ
GPIO_SW_LEFT
R66
4.7 kΩ
0.1 W
5%
GND
4
32
1
SW7
VADJ
GPIO_SW_CENTER
R72
4.7 kΩ
0.1 W
5%
GND
4
32
1
SW9
UG954_c1_26_041113
VADJ
GPIO_SW_RIGHT
R67
4.7 kΩ
0.1 W
5%
GND
4
32
1
SW8
VCC1V5_PL
PL_CPU_RESET
R516
1.00K
1/16 W
1%
GND
1
32
1
SW13
SendFeedback
Feature Descriptions
User Pushbuttons
[Figure 1-2, callout 23]
Figure 1-26 shows the user pushbutton circuits.
Tab le 1- 29 lists the user pushbutton connections to XC7Z045 AP SoC U1.
Table 1-29:User Pushbutton Connections to XC7Z045 AP SoC U1
XC7Z045 AP SoC (U1) PinNet NameI/O StandardPushbutton Reference
AK25GPIO_SW_LEFTLVCMOS25SW7
K15GPIO_SW_CENTERLVCMOS25SW9
R27GPIO_SW_RIGHTLVCMOS25SW8
A8PL_CPU_RESETLVCMOS15SW13
Figure 1-26:User Pushbuttons
ZC706 Evaluation Board User Guidewww.xilinx.com59
UG954 (v1.5) September 10, 2015
GPIO DIP Switch
UG954_c1_27_041113
SDA02H1SBD
SW12
VADJ
8
7
GPIO_DIP_SW0
GPIO_DIP_SW1
R70
4.7 kΩ
0.1 W
5%
R71
4.7 kΩ
0.1 W
5%
1
2
R68
4.7 kΩ
0.1 W
5%
R69
4.7 kΩ
0.1 W
5%
GND
GPIO_DIP_SW2
GPIO_DIP_SW3
6
5
3
4
1
2
1
2
1
2
1
2
SendFeedback
Figure 1-27 shows the GPIO DIP switch circuit.
X-Ref Target - Figure 1-27
Figure 1-27: GPIO DIP Switch
Feature Descriptions
ZC706 Evaluation Board User Guidewww.xilinx.com60
UG954 (v1.5) September 10, 2015
Tab le 1- 30 lists the GPIO DIP switch connections to XC7Z045 AP SoC U1.
Table 1-30:GPIO DIP Switch Connections to XC7Z045 AP SoC at U1
XC7Z045 AP S0C (U1) PinNet NameI/O StandardDIP Switch SW12 Pin
AB17GPIO_DIP_SW0LVCMOS251
AC16GPIO_DIP_SW1LVCMOS252
AC17GPIO_DIP_SW2LVCMOS253
AJ13GPIO_DIP_SW3LVCMOS254
User PMOD GPIO Headers
[Figure 1-2, callout 26]
The ZC706 evaluation board GPIO 2 x 6 male headers J57 and J58 support Digilent Pmod
Peripheral Modules. J57 pins (IIC_PMOD_[0:7]) are connected to the TI TCA6416APWR I2C
expansion port device U16. J58 pins (PMOD1_[0:7]) are connected to the TI TXS0108E
3.3V-to-VADJ level-shifter U40.
See the Digilent website for information on Digilent Pmod Peripheral Modules [Ref 35].
Information about the TCA641APWR and TXS0108E devices is available at the Texas
Instruments website [Ref 26].
The ZC706 evaluation board power switch is SW1. Sliding the switch actuator from the Off
to On position applies 12V power from J22 a 6-pin mini-fit connector. Green LED DS22
illuminates when the ZC706 evaluation board power is on. See Power Management for
details on the onboard power system.
Feature Descriptions
UG954_c1_30_041113
VCC12_P_IN
VCC12_P
R171
2.15kΩ
.1W
1%
INPUT_GND
1
2
3
4
SW1
GND
C568
330 μF
25V
C319
1μF
25V
GND
DS22
5
6
J22
1
2
3
4
5
6
12V
N/C
COM
12V
N/C
COM
INPUT_GND
U18 50Ω
1
3
8
7
6
5
1
2
1
2
1
2
SendFeedback
CAUTION! Do NOT plug a PC ATX power supply 6-pin connector into J22 on the ZC706 Evaluation
Board. The ATX 6-pin connector has a different pinout than J22. Connecting an ATX 6-pin connector
into J22 will damage the ZC706 Evaluation Board and void the board warranty.
The ZC706 evaluation kit provides the adapter cable shown in Figure 1-29 for powering the
ZC706 board from the ATX power supply 4-pin peripheral connector. The Xilinx part number
for this cable is 2600304, and is equivalent to Sourcegate Technologies part number
AZCBL-WH-1109-RA4. For information on ordering this cable, see [Ref 36].
X-Ref Target - Figure 1-29
To ATX 4-Pin Peripheral
Power Connector
To J22 on ZC706 Board
UG954_c1_29_041113
Figure 1-29:ATX Power Supply Adapter Cable
Figure 1-30 shows the power connector J22, power switch SW1 and indicator LED DS22.
X-Ref Target - Figure 1-30
ZC706 Evaluation Board User Guidewww.xilinx.com63
UG954 (v1.5) September 10, 2015
Figure 1-30:Power On/Off Switch SW1
Program_B Pushbutton
[Figure 1-2, callout 28]
Switch SW10 grounds the XC7Z045 AP SoC PROG_B pin when pressed. This action clears the
programmable logic configuration. The FPGA_PROG_B signal is connected to XC7Z045
AP SoC U1 pin Y9.
See 7 Series FPGAs Configuration User Guide, (UG470
7 series FPGAs.
) for further details on configuring the
Figure 1-31 shows SW10.
UG954_c1_32_041113
MAX16025
Dual Voltage Monitor
and Sequencer
2
3
6
13
9
4
U8
7
8
TH1
12
11
10
15
17
14
16
5
TH0
TOL
MR_B
EN2
EN1
IN2
IN1
GND
EPAD
CRESET
CDLY2
CDLY1
OUT2
OUT1
RST_B
1
VCC
VCCP1V8
R177
8.06 KΩ
0.1W
1%
R264
10.0 Ω
0.1W
1%
VCCP1V8
R265
10.0 KΩ
0.1W
1%
R149
249Ω
0.1W
1%
R176
8.06 KΩ
0.1W
1%
R256
10.0 KΩ
0.1W
1%
R263
10.0 KΩ
0.1W
1%
R262
10.0 KΩ
0.1W
1%
R261
10.0 K
0.1W
1%
J7
1
2
SW3
1
2
SW2
GND
VCCP1V8
PS_POR_B
PS_SRST_B
C8
DNP
DNP
xxx
C7
0.1 µf
25V
X5R
C6
270pF
25V
X5R
GND
VCC3V3_PS
DS1
GND
PS_POR_B_SW
PS_SRST_B_SW
1
2
3
J44
VCCP1V8
R266
10.0 KΩ
0.1W
1%
1
2
3
J43
PS_POR_B
PS_SRST_B
VCC3V3
C8 = DNP, SRST delay = 35 µS
C6 = 270 pF, POR delay = 1.08 mS
SendFeedback
X-Ref Target - Figure 1-31
FPGA_PROG B
VCC3V3
R73
4.7 kΩ
0.1 W
5%
SW10
2
13
Feature Descriptions
4
X-Ref Target - Figure 1-32
UG954_c1_31_041113
GND
Figure 1-31:PROG_B Pushbutton SW10
PS Power-On and System Reset Pushbuttons
Figure 1-32 shows the reset circuitry for the processing system.
Depressing and then releasing pushbutton SW1 causes PS_POR_B_SW to strobe low.
PS_POR_B: This reset is used to hold the PS in reset until all PS power supplies are at the
required voltage levels. It must be held Low through PS power-up. PS_POR_B should be
generated by the power supply power-good signal.
ZC706 Evaluation Board User Guidewww.xilinx.com64
UG954 (v1.5) September 10, 2015
Figure 1-32:PS Power On and System Reset Circuitry
Feature Descriptions
SendFeedback
Depressing and then releasing pushbutton SW3 causes PS_SRST_B_SW (connected to the
XC7Z045 AP SoC U1 dedicated PS Bank 500 pin D21) to strobe low.
PS_SRST_B: This reset is used to force a system reset. It can be tied or pulled High, and can
be High during the PS supply power ramps.
See Zynq-7000 All Programmable SoC Technical Reference Manual (UG585
concerning the resets.
) for information
FPGA Mezzanine (FMC) Card Interface
[Figure 1-2, callout 30 and 31]
The ZC706 evaluation board supports the VITA 57.1 FPGA Mezzanine Card (FMC)
specification by providing subset implementations of the high pin count (HPC) connector at
J37 and low pin count (LPC) version at J5. Both connectors use a 10 x 40 form factor. The
HPC connector is populated with 400 pins, while the LPC connector is partially populated
with 160 pins. The connectors are keyed so that a mezzanine card, when installed in either
of these FMC connectors on the ZC706 evaluation board, faces away from the ZC706 board.
Connector Type:
•Samtec SEAF Series, 1.27 mm (0.050 in) pitch. Mates with SEAM series connector
More information about SEAF series connectors is available at the Samtec website [Ref 31].
More information about the VITA 57.1 FMC specification is available at the VITA FMC
Marketing Alliance website [Ref 37].
HPC Connector J37
[Figure 1-2, callout 30]
The 400-pin HPC connector defined by the FMC specification (Figure B-2, page 91)
provides connectivity for up to:
•160 single-ended or 80 differential user-defined signals
•10 GTX transceivers
•2 GTX clocks
•4 differential clocks
•159 ground and 15 power connections
The connections between the HPC connector at J37 and AP SoC U1 (Ta ble 1 -32 ) implements
a subset of this connectivity:
•34 differential user-defined pairs (34 LA pairs, LA00–LA33)
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UG954 (v1.5) September 10, 2015
•8 GTX transceivers
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•2 GTX clocks
•2 differential clocks
•159 ground and 15 power connections
Feature Descriptions
The ZC706 board V
voltage for the J37 and J5 connectors is determined by the FMC V
ADJ
power sequencing logic described in the Power Management, page 77.
Note:
HPC FMC (J37) GA0 = GA1 = 0 = GND.
Tab le 1- 32 shows the J37 HPC FMC to AP SoC U1 connections.
Table 1-32:J37 HPC FMC Connections to XC7Z045 AP SoC U1
1. No I/O standards are associated with MGT connections.
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UG954 (v1.5) September 10, 2015
Feature Descriptions
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ZC706 Board Power System
The ZC706 board hosts a power system based on the Texas Instruments (TI) UCD90120A
power supply sequencer and monitor, and the LMZ31500 and LMZ31700 family voltage
regulators.
UCD90120A Description
The UCD90120A is a 12-rail PMBus/I2C addressable power-supply sequencer and monitor.
The device integrates a 12-bit ADC for monitoring up to 12 power-supply voltage inputs.
Twenty-six GPIO pins can be used for power supply enables, power-on reset signals,
external interrupts, cascading, or other system functions. Twelve of these pins offer pulse
width modulation (PWM) functionality. Using these pins, the UCD90120A offers support for
margining and general purpose PWM functions.
The TI Fusion Digital Power™ designer software is provided for device configuration. This
PC-based graphical user interface (GUI) offers an intuitive interface for configuring, storing,
and monitoring all system operating parameters.
LMZ31500 and LMZ31700 Family Regulator Description
The LMZ31520 SIMPLE SWITCHER® power module is a step-down DC-DC solution capable
of driving up to 20A load. The LMZ31520 module can accept an input voltage rail between
3V and 14.5V and deliver an adjustable and highly accurate output voltage as low as 0.6V.
The LMZ31506 SIMPLE SWITCHER® power module is a step-down DC-DC solution capable
of driving up to 6A load. The LMZ31506 module can accept an input voltage rail between 3V
and 14.5V and deliver an adjustable and highly accurate output voltage as low as 0.6V. In
older documentation this regulator was known as the TI TPS84621.
The LMZ31710 SIMPLE SWITCHER® power module is a step-down DC-DC solution capable
of driving up to 10A load. The LMZ31710 module can accept an input voltage rail between
4.5V and 17V and deliver an adjustable and highly accurate output voltage as low as 0.6V.
These modules only requires two external resistors plus external capacitors to provide a
complete power solution. These modules offer the following protection features: thermal
shutdown, programmable input under-voltage lockout, output over-voltage protection,
short-circuits protection, output current limit, and each allows startup into a pre-biased
output.
The LMZ31710 sync input allows synchronization over the 200 kHz to 1,200 kHz switching
frequency range and up to six modules can be connected in parallel for higher load
currents.
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UG954 (v1.5) September 10, 2015
Tab le 1- 34 shows the ZC706 board TI power system configuration for controller U48.
SendFeedback
Table 1-34:ZC706 TI Controller U48 Power System Configuration
Feature Descriptions
Sequencer
Regulator Type, U#Voltage Current
PageContentsNet Name
49UCD90120A
Schematic Page
50Addr 101, Rail 1VCCINTLMZ31520 U42
U48 PMBus
51Addr 101, Rail 2VCCAUX, VCC1V8LMZ31710 U98
Addr 101
5 Rails
52Addr 101, Rail 3VCC1V5_PLLMZ31506 U85
53Addr 101, Rail 4VADJ_FPGA,VADJLMZ31506 U86
54Addr 101, Rail 5VCC3V3_FPGA,VCC3V3LMZ31710 U15
Notes:
ZC706 boards prior to Rev. 2.0 implemented different voltage regulators for VCCINT, VCCAUX/VCC1V8, VCC1V5_PL,
VADJ_FPGA/VADJ and VCC3V3_FPGA/VCC3V3. Refer to UG954 v1.3 and earlier, and to the schematic for the particular version
of the ZC706 board prior to Rev. 2.0. Notes on ZC706 boards prior to Rev. 2.0:
1. VCCINT is implemented utilizing 2xLMZ22008 8A components (U42, U43) in parallel which provides 16A capability.
2. The 1.8V rails are supplied from a LMZ22010 10A component (U98).
3. VCC1V5_PL and the 2.5V rails are supplied from TPS84621 6A components (U85, U86).
4. The 3.3V rails are supplied from a LMZ22010 10A component (U15).
(1)
(2)
(3)
(2)
(4)
1.0V16A
1.8V10A
1.5V6A
2.5V6A
3.3V10A
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UG954 (v1.5) September 10, 2015
Figure 1-33 shows the power system for UCD90120A U48 controller.
SendFeedback
X-Ref Target - Figure 1-33
UCD90120A Controller U48
GPIO (out)
FPWM (out)
ADC (in)
ADC (in)
GPIO (out)
GPIO (out)
FPWM (out)
ADC (in)
ADC (in)
GPIO (out)
FPWM (out)
ADC (in)
ADC (in)
GPIO (out)
FPWM (out)
ADC (in)
ADC (in)
FMC_ADJ_SEL[1:0]
[ 1 0 ]
0
0
0
1
1
0
1
1
GPIO (out)
GPIO (out)
FPWM (out)
ADC (in)
ADC (in)
Rail Enable
PWM Margin
Current Sense
Voltage Sense
Low Pwr Select
Rail Enable
PWM Margin
Current Sense
Voltage Sense
Rail Enable
PWM Margin
Current Sense
Voltage Sense
Rail Enable
PWM Margin
Current Sense
Voltage Sense
FMC_ADJ_SEL[1:0]
Rail Enable
PWM Margin
Current Sense
Voltage Sense
Dual 4-to-1 Mux
U66
I0B
I1B
I2B
I3B
S[1:0]
YB
12V
VCCINT 1.0V Nom.
Input
Filter
V
Input
Filter
V
Input
Filter
V
Input
Filter
V
Input
Filter
V
LMZ31520
Vin
EN
fb
FB
U42
Vout
VCCAUX 1.8V Nom.
LMZ31710
Vin
EN
fb
FB
U98
Vout
VCC1V5_PL 1.5V Nom.
LMZ31506
Vin
EN
fb
FB
U85
Vout
VADJ_FPGA 2.5V Nom.
LMZ31506
Vin
EN
fb
FB
U86
Vout
VCC3V3 FPGA 3.3V Nom.
LMZ31710
Vin
EN
fb
FB
U15
Vout
Bulk Filter Caps
Low Power || Radj
Low = 1.0V (Default)
High = 0.9V
Bulk Filter Caps
Bulk Filter Caps
Bulk Filter Caps
Bulk Filter Caps
Feature Descriptions
VCCINT 1.0V
Sense Connected
at Point of Load
VCC1V8 1.8V
VCCAUX 1.8V
Sense Connected
at Point of Load
VCC1V5_PL 1.5V
Sense Connected
at Point of Load
VADDJ 2.5V
VADJ_FPGA 2.5V
Sense Connected
at Point of Load
VCC3V3 3.3V
VCC3V3 FPGA 3.3V
Sense Connected
at Point of Load
Notes:
1. Capacitors labeled Cf are bulk filter capacitors.
2. Voltage Sense is connected a point of load.
ZC706 Evaluation Board User Guidewww.xilinx.com74
UG954 (v1.5) September 10, 2015
UG954_c1_33_041615
Figure 1-33:ZC706 TI UCD90120A Controller U48 Power System
Feature Descriptions
SendFeedback
The LMZ31520, LMZ31506, and LMZ31710 adjustable voltage regulators have their output
voltage set through an external resistor. The regulator topology on the ZC706 board
permits the TI UCD90120A module to monitor rail voltage and current. Voltage margining at
+5% and -5% is also implemented.
Each voltage regulator’s external V
setting resistor is calculated and implemented as if
OUT
the regulator is stand-alone. The TI UCD90120A module has two ADC inputs allocated per
voltage rail, one input for the remote voltage sense connection, the other for the current
sense resistor op amp output voltage connection. The TI UCD90120A ADC full scale input is
2.5V. The remote voltage feedback is scaled to approximately 2V if it exceeds 2V, that is, the
V
CCO_VADJ
rail for the 2.5V and 3.3V modes, and the FPGA_3V3 rail also at 3.3V are
resistor-attenuated to scale the remotely sensed voltage at a ratio of 0.606 to give
approximately 2V at the ADC input pin for a 3.3V remote sense value. Rails below 2V are not
scaled.
Each rail’s current sense op amp has its gain set to provide approximately 2V maximum at
the TI UCD90120A ADC input pin when the rail current is at its expected maximum current
level, as can be seen in the U48 controller power system figure (Figure 1-33).
The TI UCD90120A module has an assignable group of GPIO pins with PWM capability. Each
controller “channel” has a PWM GPIO pin wired to the associated voltage regulator V
The external V
setting resistor is also wired to this pin. The PWM GPIO pin is configured
OUT
ADJ
pin.
in 3-state mode. This pin is not driven unless a Margin command is executed. The Margin
command is available within the TI Fusion Digital Power™ designer software.
During the margin-High or Low operation, the PWM GPIO pin drives a voltage into the
voltage regulator V
V
moving to the margin +5% or -5% voltage commanded.
OUT
pin, which causes a slight voltage change resulting in the regulator
ADJ
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UG954 (v1.5) September 10, 2015
XADC Power System Measurement
The ZC706 board XADC interface includes power system voltage and current measuring
capability. The V
voltage measurement capability. Other rails are measured through an external Analog
Devices ADG707BRU multiplexer U6. Each rail has a separate TI INA333 op amp strapped
across its series current sense resistor Kelvin terminals. This op amp has its gain adjusted to
give approximately 1V at the expected full scale current value for the rail.
CCINT
and V
rail voltages are measured using the XADC internal
CCAUX
X-Ref Target - Figure 1-34
Notes:
1. _XADC_P/N = Remote Voltage Sense
2. _XADC_CS_P/N = Current Sense From OP Amp
UG954_c1_34_041113
U1
U6
3.3 Scaled to 0.825V
ADG707BRU
Bank 35
ADIP L13
DA
DB
10PF
A0
A1
A2
3.01K
1.00K
GND
49.9
49.9
A[2:0]
P14 17
P15 18
P16 19
S1A/B
S2A/B
S3A/B
S4A/B
S5A/B
S6A/B
S7A/B
S8A/B
VCC3V3_FPGA_SENSE_P
VCC3V3_FPGA_XADC_P
VCC3V3_FPGA_SENSE_N
VADJ 2.5V Scaled to 0.625V
3.01K
1.00K
GND
VCC3V3_FPGA_SENSE_P
VCC3V3_FPGA_XADC_P
VCC3V3_FPGA_SENSE_N
Scaled to 0.75V
3.01K
1.00K
GND
VCC3V3_FPGA_SENSE_P
VCC3V3_FPGA_XADC_P
VCC3V3_FPGA_SENSE_N
VCCINT_XADC_CS_P/N
VCCAUX_XADC_CS_P/N
VCC1V5_PL_XADC_P/N
VCC1V5_PL_XADC_CS_P/N
VADJ_FPGA_XADC_P/N
VADJ_FPGA_XADC_CS_P/N
VCC3V3_PL_XADC_P/N
VCC3V3_PL_XADC_CS_P/N
AD1N K13
U16
XC7Z045
TCA6416APWR
12C Port
Expander
SendFeedback
Feature Descriptions
Figure 1-34 shows the XADC external MUX block diagram.
See Tab le 1-3 5 which lists the ZC706 XADC power system voltage and current measurement
details for the external MUX U6.
The ZC706 board uses power regulators and a PMBus-compliant system controller from
Texas Instruments to supply core and auxiliary voltages. The Texas Instruments Fusion
Digital Power graphical user interface is used to monitor the voltage and current levels of
the board power modules.
The PCB layout and power system design meet the recommended criteria described in
Zynq-7000 All Programmable SoC PCB Design and Pin Planning Guide (UG933
).
The ZC706 evaluation board power distribution diagram is shown in Figure 1-35.
Note: Page numbers reference the pages
on schematic 0381513
12V
PWR
Jack
J22
U42p. 50
U48p. 49
p. 48
Switching Dual
VCC1V5_PS 1.5V @ 2.5A
U104p. 55
Switching Dual
VCCPINT 1.0V @ 1.5A
U104p. 55
Switching Dual
VCC3V3_PS 3.3V @ 2.5A
U105p. 55
Switching Dual
VCCP1V8 1.8V @ 1.5A
U105p. 55
Linear Regulator
V33D_CTL1 3.3V @ 0.25A
U20p. 49
Switching Regulator
VCC5V0 5.0V @ 2A
U44p. 56
UG954_c1_35_031615
SendFeedback
X-Ref Target - Figure 1-35
Feature Descriptions
The ZC706 evaluation board uses power regulators and PMBus compliant PWM system
controllers from Texas Instruments to supply the core and auxiliary voltages listed in
TPS74901RGWU923A 0.8V - 3.6V Adj. Linear RegulatorVCCAUX_IO2.00V57
TPS74901RGWU933A 0.8V - 3.6V Adj. Linear RegulatorMGTAVCC1.00V57
TPS74901RGWU943A 0.8V - 3.6V Adj. Linear RegulatorMGTAVTT1.20V57
TPS74901RGWU953A 0.8V - 3.6V Adj. Linear RegulatorMGTVCCAUX1.80V57
TL1963A U19 1.5A 1.21V - 3.3V Adj. Linear RegulatorVCC2V5 2.50V57
TPS79433 U20 0.25A 3.3V Fixed Linear RegulatorV33D_CTL13.30V49
LMZ31704RVQ
Power Rail
Net Name
(2)
(3)
(4)
(5)
Power Rail
Volta ge
1.00V50
1.80V51
2.50V53
3.30V54
Schematic
Page
Notes:
1. VCCINT max. current is 16A
2. VCCBRAM 1.0V is also sourced from the Vccint rail
3. VCC1V8 1.80V is also sourced from the Vccaux rail
4. VADJ (1.80V/2.50V/3.30V) for the FMC connectors is also sourced from the Vadj_fpga rail
5. VCC3V3 3.30V is also sourced from the Vcc3v3_fpga rail
6. Paralleled dual LMZ22008TZ (U42/U43) 8A 0.8V - 6V Adj. Switching Regulators on ZC706 board versions prior to Rev. 2.0
7. LMZ22010TZ (U98 VCCAUX, U15 VCC3V3_FPGA) 10A 0.8 - 6V Adj. Switching Regulators on ZC706 board versions prior to Rev.
2.0
8. LMZ12002TZ U44 2A 0.8 - 6V Adj. Switching Regulator on ZC706 board versions prior to Rev. 2.0
VADJ Voltage Control
The V
FMC_VADJ_ON_B signal wired to header J18 is sampled by the TI UCD90120A controller
U48. If a jumper is installed on J18 signal FMC_VADJ_ON_B is held Low, and the TI controller
U48 energizes the V
rail is set to 2.5V. When the ZC706 evaluation board is powered on, the state of the
ADJ
rail at power on.
ADJ
ZC706 Evaluation Board User Guidewww.xilinx.com79
UG954 (v1.5) September 10, 2015
Feature Descriptions
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Because the rail turn on decision is made at power on time based on the presence of the J18
jumper, removing the jumper at J18 after the board is powered up does not affect the 2.5V
power delivered to the V
rail and it remains on.
ADJ
A jumper installed at J18 is the default setting.
In this mode the user can control when to turn on V
2.5V, 3.3V). With V
off the XC7Z045 AP SoC still configures and has access to the TI
ADJ
and to which voltage level (1.8V,
ADJ
controller PMBUS along with the FMC_VADJ_ON_B signal. The combination of these allows
the user to develop code to command the V
default setting of 2.5V. Once the new V
ADJ
controller U48, the FMC_VADJ_ON_B signal can be driven low by the user logic and the V
rail comes up at the new V
powers up in the V
off (no jumper on J18 at ZC706 power up) mode turns on the V
ADJ
voltage level. Installing a jumper at J18 after a ZC706 board
ADJ
The FMC_VADJ_ON_B signal is connected to the TCA6416APWR I
rail to be set to something other than the
ADJ
voltage level has been programmed into TI
ADJ
2
C port expander U16 pin
ADJ
rail.
13 (see Figure 1-28). The XC7Z045 AP SoC is thus able to drive the FMC_VADJ_ON_B signal
by writing to the I²C port expander U16.
2
The I
C port expander IIC_PORT_EXPANDER SDA/SCL bus is wired to the PCA9548ARGER I2C
U65 bus switch (see I2C Bus, page 53).
Documentation describing PMBUS programming for the UCD90120A power controller is
available at the website [Ref 26].
AP SoC Programmable Logic (PL) Voltage Control
All PL and PS power rails are enabled by default. When the ZC706 board is powered on, the
state of the PL_PWR_ON signal wired to 2-pin header J66 is sampled by the TI UCD90120A
controller U48. If a jumper is not installed on J66, signal PL_PWR_ON is held high, and the
TI controller U48 energizes all the PL and PS power rails.
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UG954 (v1.5) September 10, 2015
Because the rail turn on decision is made at power on time based on the presence of the J66
jumper, installing the jumper at J66 after the board is powered up does not affect power
delivered to the any PS or PL rails, all rails remain on.
A jumper not installed at J66 is the default setting.
If a jumper is installed on J66 when the ZC706 board is powered on, signal PL_PWR_ON is
held low, and the ZC706 board does not energize the PL side power rails at power on.
Monitoring Voltage and Current
Voltage and current monitoring and control are available for selected power rails through
Texas Instruments' Fusion Digital Power Designer graphical user interface. The onboard TI
power controller (U48 at address 101) is accessed through the PMBus connector J4, which
is provided for use with the TI USB Interface Adapter PMBus pod (TI part number EVM
USB-TO-GPIO), which can be ordered from the Texas Instruments website [Ref 27] and
Feature Descriptions
SendFeedback
associated TI Fusion Digital Power Designer GUI (downloadable from the TI site [Ref 28].
This is the simplest and most convenient way to monitor the voltage and current values for
the power rails listed in Table 1 -37 .
In the table, the Power Good (PG) On Threshold is the setpoint at or above which the
particular rail is deemed "good". The PG Off Threshold is the setpoint at or below which the
particular rail is no longer deemed "good". The controller internally OR's these per rail PG
conditions together and drives an output PG pin high only if all active rail PG states are
"good". The On and Off Delay and parameters are relative to when the board power on-off
slide switch SW12 is turned on and off.
Tab le 1- 37 Power Rail Specifications for UCD90120A PMBus controller at Address 101
defines the voltage and current values for each power rail controlled by the UCD90120A
U48.
IMPORTANT: In Ta b le 1- 37, the values defined in the Shutdown columns are the voltage and current
thresholds that cause the regulator to shut down if the value is exceeded.
Table 1-37:Power Rail Specifications for UCD90120A PMBus Controller at Address 101
DeviceAddressRail
Nominal
Voltage
Power
Good
On
Power
Good
Off
Turn
On
Delay
(ms)
(2)
Turn
Off
Delay
(ms)
Shutdown
Over
Voltage
(1)
Over
Current
101d1VCCINT1.0000.9000.850
2VCCAUX1.8001.6201.530
UCD90120A
U48
Notes:
1. The values defined in these columns are the voltage and current thresholds that cause the regulator to shut down if the value
is exceeded.
2. See Tab le 1- 39 for rail turn on dependency details.
3VCC1V5_PL1.5001.3501.275
4VADJ_FPGA2.5002.2502.125
5 VCC3V3_FPGA3.3002.9702.805
0.025.0
5.020.0
5.010.0
5.05.0
5.015.0
1.15011.50
2.0706.91
1.7253.50
2.8753.50
3.7956.91
The ZC706 power system rail turn on timing is not strictly controlled through the Turn On
Delay shown in Tab le 1- 37. The Ta ble 1 -37 Turn On Delay delay values are applied after the
preceding rail has reached 90% of its nominal voltage. See Tab le 1- 38 for rail turn on
dependency details.
ZC706 Evaluation Board User Guidewww.xilinx.com81
UG954 (v1.5) September 10, 2015
Feature Descriptions
SendFeedback
Table 1-38:Power Rail Sequence On Dependencies for UCD90120A PMBus Controller at Address 101
DeviceAddressRail
1VCCINT1.0001Turn on at board power-on
2VCCAUX1.80025ms after VCCINT hits 90%
UCD90120A101d
5 VCC3V3_FPGA3.300 35ms after VCCAUX hits 90%
3VCC1V5_PL1.50045ms after VCC3V3 hits 90%
4VADJ_FPGA2.50055ms after VCC1V5_PL hits 90%
Cooling Fan
The XC7Z045 AP SoC cooling fan connector is shown in Figure 1-36.
X-Ref Target - Figure 1-36
Keyed Fan Header
22_11_2032
J61
R369
1.00K
1/16W
SM FAN PWM
1
2
3
1%
VADJ
1
2
Nominal
Voltage
Turn On OrderTurn On Timing
VCC12_P
R279
1
10.0K
1/10W
2
1%
1 2
SM FAN TACH
R278
10.0K
1/10W
1%
D2
R190
1
4.75K
1/10W
2
1%
2
1
MM3Z2V7B
2.7V
460MW
2 4
D1
1
DL4148
100V
2
460MW
Q1
1
1.3W
NDT3055L
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UG954 (v1.5) September 10, 2015
3
GNDGND
UG954_c1_36_073013
Figure 1-36:Cooling Fan Circuit
When V
is modified from a default of 2.5V to 1.8V or a lower V
ADJ
setting, the AP SoC U1
ADJ
cooling fan turns off. Transistor Q1 is used to switch on the fan and has a max VGS of 2V,
hence the fan is not guaranteed to work at 1.8V or lower V
setting. See [Ref 15].
ADJ,
The fan turns on when the ZC706 is powered up due to pull-up resistor R369. The
SM_FAN_PWM and SM_FAN_TACH signals are wired to XC7Z045 AP SoC U1 pins AB19 and
X-Ref Target - Figure 1-37
SendFeedback
Feature Descriptions
AA19 respectively, enabling the user to implement their own fan speed control IP in the
AP SoC PL logic.
More information about the power system components used by the ZC706 evaluation
board are available from the Texas Instruments digital power website [Ref 32].
XADC Analog-to-Digital Converter
[Figure 1-2, callout 33]
The XC7Z045 AP SoC provides an Analog Front End XADC block. The XADC block includes
a dual 12-bit, 1 MSPS Analog-to-Digital Convertor (ADC) and on-chip sensors. See 7Series
FPGAs and Zynq-7000 All Programmable SoC XADC Dual 12-Bit 1 MSPS Analog-to-Digital
Converter User Guide (UG480
Figure 1-37 shows the XADC block diagram.
U1
XC7Z020
AP SoC
VCCADC
)for details on the capabilities of the analog front end.
VCCAUX
Ferrite Bead
1
To J54
XADC_VCC
100 nF
Close to
Package Pins
XADC_AGND
J53
XADC_VCC Header J40
2
3
10 μF
1.8V 150 mV max
U14
ADP123
In
Out
Gnd
XADC_VCC5V0 To Header J63
Ferrite Bead
J14
10 μF
VCC5V0
To
Header
J63
Dual Use IO
(Analog/Digital)
100Ω
1 nF
100Ω
100Ω
1 nF
100Ω
VAUX0P
VAUX0N
VAUX8P
VAUX8N
GNDADC
V
REFP
V
REFN
V
V
DXP
DXN
XADC_AGND
XADC_VREFP
100 nF
Close to
Package Pins
100Ω
P
1 nF
N
100Ω
1
2
3
XADC_AGND
To Header J63
XADC_VREF
J52
XADC_AGND
To
Header
J63
U38
(1.25V)
OutIn
10 μF
XADC_AGND
Connection
Figure 1-37:XADC Block Diagram
REF3012
Gnd
Star Grid
1
2
3
Ferrite Bead
J12
J54
XADC_VCC
J13
GND
UG8954_c1_37_041715
ZC706 Evaluation Board User Guidewww.xilinx.com83
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-38
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Feature Descriptions
The ZC706 evaluation board supports both the internal XC7Z045 AP SoC sensor
measurements and the external measurement capabilities of the XADC. Internal
measurements of the die temperature, VCCINT, VCCAUX, and VCCBRAM are available.
Jumper J52 can be used to select either an external voltage reference (VREF) or on-chip
voltage reference for the analog-to-digital converter.
For external measurements an XADC header (J63) is provided. This header can be used to
provide analog inputs to the XC7Z045 AP SoC's dedicated VP/VN channel, and to the
VAUXP[0]/VAUXN[0], VAUXP[8]/VAUXN[8] auxiliary analog input channels. Simultaneous
sampling of Channel 0 and Channel 8 is supported.
A user-provided analog signal multiplexer card can be used to sample additional external
analog inputs using the 4 GPIO pins available on the XADC header as multiplexer address
lines. Figure 1-38 shows the XADC header connections.
VCC1V5_PL
XADC_VCC5V0
XADC_VN
XADC_VAUX0P
XADC_VAUX8N
XADC_DXP
XADC_VREF
XADC_GPIO_1
XADC_GPIO_3
J63
2
1
4
3
6
5
8
7
10
9
11
13
15
17
19
12
14
16
18
20
XADC_VCC_HEADER
XADC_VP
XADC_VAUX0N
XADC_VAUX8P
XADC_DXN
XADC_GPIO_0
XADC_GPIO_2
Figure 1-38:XADC Header (J63)
Tab le 1- 39 describes the XADC header J40 pin functions.
Table 1-39:XADC Header J63 Pinout
Net Name
VN, VP1, 2Dedicated analog input channel for the XADC.
XADC_VAUX0P, N3, 6
XADC_VAUX8N, P7, 8
DXP, DXN9, 12Access to thermal diode.
XADC_AGND4, 5, 10Analog ground reference.
XADC_VREF111.25V reference from the board.
XADC_VCC5V013Filtered 5V supply from board.
XADC_VCC_HEADER14Analog 1.8V supply for XADC.
J63 Pin
Number
Auxiliary analog input channel 0. Also supports use as I/O inputs when anti
alias capacitor is not present.
Auxiliary analog input channel 8. Also supports use as I/O inputs when anti
alias capacitor is not present.
XADC_AGNDXADC_AGND
Description
GND
UG954_c1_38_041113
ZC706 Evaluation Board User Guidewww.xilinx.com84
UG954 (v1.5) September 10, 2015
VCC1V5_PL15VCCO supply for bank which is the source of DIO pins.
Table 1-39:XADC Header J63 Pinout (Cont’d)
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Feature Descriptions
Net Name
GND16Digital Ground (board) Reference
XADC_GPIO_3, 2, 1, 0
J63 Pin
Number
19, 20, 17,
18
Description
Digital I/O. These pins should come from the same bank. These IOs should
not be shared with other functions because they are required to support
three-state operation.
ZC706 Evaluation Board User Guidewww.xilinx.com85
UG954 (v1.5) September 10, 2015
Appendix A
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Default Switch and Jumper Settings
The default switch and jumper settings for the ZC706 evaluation board are provided in this
appendix.
Switches
[Figure 1-2, callout 24]
Default switch settings are listed in Tabl e A-1 . The locations of the ZC706 jumper headers
called out in Tab le A -2 are shown in Figure A-1.
Table A-1:Default Switch Settings
SwitchFunctionDefaultSelects
SW1Board main power On-Off Slide Switch
SW42-pole SPST DIP Switch, JTAG mode select
signals JTAG_SEL_[1:2]
SW115-pole DPDT DIP Switch, PS Boot Mode select
signals MIO[6:2]_SELECT
SW124-pole SPST DIP Switch, user signals
GPIO_DIP_SW[0:3], poles [1:4]
OFF
10
All Down
All OFF
Delivered in OFF position
JTAG = cable connector J3
JTAG flat cable header J3
All = 0 (4.7K p/d to GND)
Figure 1-2
Callout
27
34
29
24
ZC706 Evaluation Board User Guidewww.xilinx.com86
UG954 (v1.5) September 10, 2015
Jumpers
SendFeedback
[Figure 1-2, callout 24]
Default jumper positions are listed in Tabl e A-2 .
Table A-2:Default Jumper Settings
Jumpers
Jumper
Callout
JumperFunction
HDR_1 X 2
1J6
J65
2J7U8 MAX16025 POR Device Reset MR_B pin 13 logic
3J8JTAG Header J62 pin 2 can be connected to 3.3VOPENJ62 pin 2 is NC16
4J9U51 Ethernet PHY CONFIG2 pin 2 1K pull-down to
5J10U12 USB3320 2.0 Host/OTG or Device Select
6J11U12 USB3320 2.0 RESET HeaderOPENU12 not held in RESET31
Figure B-1 shows the pinout of the FPGA mezzanine card (FMC) low pin count (LPC)
connector defined by the VITA 57.1 FMC specification. For a description of how the ZC706
evaluation board implements the FMC specification, see FPGA Mezzanine (FMC) Card
Figure B-2 shows the pinout of the FPGA mezzanine card (FMC) high pin count (HPC)
connector defined by the VITA 57.1 FMC specification. For a description of how the ZC706
evaluation board implements the FMC specification, see FPGA Mezzanine (FMC) Card
Interface, page 65 and HPC Connector J37, page 65.
The master Xilinx Design Constraints (XDC) file template for the ZC706 board provides for
designs targeting the ZC706 evaluation board. Net names in the constraints listed below
correlate with net names on the latest ZC706 evaluation board schematic. Users must
identify the appropriate pins and replace the net names with net names in the user RTL. See
Vivado Design Suite User Guide: Using Constraints (UG903
For detailed I/O standards information required for a particular interface, users can refer to
the constraint files generated by tools like the Memory Interface Generator (MIG) and Base
System Builder (BSB).
) for more information.
Appendix C
The FMC connectors J37 and J5 are connected to 2.5V V
cards implement different circuitry, the FMC bank I/O standards must be uniquely defined
by each customer.
Note:
Xilinx Zynq-7000 All Programmable SoC ZC706 Evaluation Kit product page (www.xilinx.com/zc706
for the latest pins constraints file.
The constraints file listed in this appendix might not be the latest version. Always refer to the