ZC706 Evaluation Board
for the Zynq-7000
XC7Z045
All Programmable SoC
User Guide
UG954 (v1.5) September 10, 2015
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The following table shows the revision history for this document.
DateVersionRevision
10/08/20121.0
11/21/20121.1
Initial Xilinx release.
Added additional user LED in ZC706 Evaluation Board Features section, Ta bl e 1- 1,
User I/O section, Figure 1-25, and Tab le 1- 28 . In Tab le 1- 1, added fan sink
information and updated notes for 10/100/1000 Ethernet PHY, user pushbuttons,
user DIP switch, and FPGA PROG pushbutton. Added Encryption Key Backup Circuit
section. Updated second paragraph in DDR3 SODIMM Memory (PL) section.
Updated second paragraph in SD Card Interface section. Updated Tab le 1- 11 .
Added U53 information to first paragraph in HDMI Video Output section. Added
fourth bullet to Real T ime Clock (RTC) section. Updated Figure 1-23. Added pin A17
to Tab le 1- 28 . Updated Figure 1-32. Replaced UCF in Appendix C. Added additional
reference to References in Appendix F.
ZC706 Evaluation Board User Guidewww.xilinx.com2
UG954 (v1.5) September 10, 2015
DateVersionRevision
SendFeedback
04/24/20131.2
07/31/20131.3
04/28/20151.4
Chapter 1, ZC706 Evaluation Board Features: Tab le 1-1 feature descriptions are now
linked to their respective sections in the book. Figure 1-2, Figure 1-33, and
Figure 1-34 were replaced. Table 1-2 was removed because it was a duplicate of
Tab le 1-1 1. Tab le 1- 2: Switch SW11 Configuration Option Settings was added. FMC
Connector JTAG Bypass, page 33 was updated. Default lane size information below
Figure 1-17 was changed. Figure 1-18PCI Express Lane Size Select Jumper J19 was
added. The names of pins 18 and 19 changed in Tabl e 1-1 7. The address of I
PMBUS_DATA/CLOCK changed in Tab le 1- 25 . Reference designator DS35 was added
to Ta bl e 1 -2 7. Callout numbers in the User I/O, page 57 section are now linked to
Tab le 1-1 . SW13 information was added to the section User Pushbuttons, page 59.
In Tab le 1-3 3, J5 pin H22 changed to XC7Z045 (U1) pin AH26 and H23 changed to
AH27. The section ZC706 Board Power System, page 72 was added. Voltage levels
were changed in VADJ Voltage Control, page 79. Tab le 1-3 7 was modified and
Tab le 1-3 8 was added.
Appendix A, Default Switch and Jumper Settings: The SW11 selection in Ta bl e A- 1
changed.
Appendix G, Regulatory and Compliance Information: A link to the master answer
record was added.
Updated Tabl e 1- 22 . Replaced the master User Constraints File (UCF) list in
Appendix C, Master Constraints File Listing with the master Xilinx Design
Constraints (XDC) list. Updated references throughout the document.
Updated “LMZ22000 Family Regulator Description” to LMZ31500 and LMZ31700
Family Regulator Description. Updated Ta bl e 1 -4, Tab le 1-7 , Tab le 1-1 3, Tab le 1- 23 ,
Tab le 1-2 8 through Ta bl e 1 -3 0, Ta bl e 1- 32 through Tab le 1-3 4, Tab le 1-3 6, and
Tab le A-2 . Added Figure A-1. Updated Appendix C, Master Constraints File Listing.
2
C bus
09/10/20151.5
Updated J48 header jumper setting (third row in Tab le 1 -7 ).
The ZC706 evaluation board for the XC7Z045 All Programmable SoC (AP SoC) provides a
hardware environment for developing and evaluating designs targeting the Zynq®-7000
XC7Z045-2FFG900C AP SoC. The ZC706 evaluation board provides features common to
many embedded processing systems, including DDR3 SODIMM and component memory, a
four-lane PCI Express® interface, an Ethernet PHY, general purpose I/O, and two UART
interfaces. Other features can be supported using VITA-57 FPGA mezzanine cards (FMC)
attached to the low pin count (LPC) FMC and high pin count (HPC) FMC connectors.
ZC706 Evaluation Board Features
Chapter 1
The ZC706 evaluation board features are listed in here. Detailed information for each
feature is provided in Feature Descriptions starting on page 14.
•Zynq-7000 XC7Z045-2FFG900C AP SoC
•1 GB DDR3 memory SODIMM on the programmable logic (PL) side
•1 GB DDR3 component memory (four [256 Mb x 8] devices) on the processing system
(PS) side
•USB 2.0 ULPI (UTMI+ low pin interface) transceiver with micro-B USB connector
•Secure Digital (SD) connector
•USB JTAG interface via Digilent module with micro-B USB connector
•Clock sources:
Fixed 200 MHz LVDS oscillator (differential)
°
I2C programmable LVDS oscillator (differential)
°
Fixed 33.33 MHz LVCMOS oscillator (single-ended)
°
Subminiature version A (SMA) connectors (differential)
°
ZC706 Evaluation Board User Guidewww.xilinx.com7
UG954 (v1.5) September 10, 2015
SMA connectors for GTX transceiver clocking (differential)
°
•GTX transceivers
SendFeedback
FMC HPC connector (eight GTX transceivers)
°
FMC LPC connector (one GTX transceiver)
°
SMA connectors (one pair each for TX, RX and REFCLK)
°
PCI Express (four lanes)
°
Small form-factor pluggable plus (SFP+) connector
°
Ethernet PHY RGMII interface
°
•PCI Express endpoint connectivity
Gen1 4-lane (x4)
°
Gen2 4-lane (x4)
°
•SFP+ Connector
•Ethernet PHY RGMII interface with RJ-45 connector
Overview
•USB-to-UART bridge with mini-B USB connector
•HDMI codec with HDMI connector
I2C bus
•
I2C bus multiplexed to:
•
Si570 user clock
°
ADV7511 HDMI codec
°
M24C08 EEPROM (1 kB)
°
1-to-16 TCA6416APWR port expander
°
DDR3 SODIMM
°
RTC-8564JE real time clock
°
FMC HPC connector
°
FMC LPC connector
°
PMBUS data/clock
°
•Status LEDs:
ZC706 Evaluation Board User Guidewww.xilinx.com8
UG954 (v1.5) September 10, 2015
Ethernet status
°
TI Power Good
°
Linear Power Good
°
PS DDR3 Component Vtt Good
°
PL DDR3 SODIMM Vtt Good
°
FMC Power Good
SendFeedback
°
12V Input Power On
°
FPGA INIT
°
FPGA DONE
°
•User I/O:
Four (PL) user LEDs
°
Three (PL) user pushbuttons
°
One (PL) user DIP switch (4-pole)
°
Two Dual row Pmod GPIO headers
°
•AP SoC PS Reset Pushbuttons:
SRST_B PS reset button
°
POR_B PS reset button
°
Overview
•VITA 57.1 FMC HPC connector
•VITA 57.1 FMC LPC connector
•Power on/off slide switch
•Program_B pushbutton
•Power management with PMBus voltage and current monitoring through TI power
controller
•Dual 12-bit 1 MSPS XADC analog-to-digital front end
•Configuration options:
Dual Quad-SPI flash memory
°
USB JTAG configuration port (Digilent module)
°
Platform cable header JTAG configuration port
°
20-pin PL PJTAG header
°
ZC706 Evaluation Board User Guidewww.xilinx.com9
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-1
U1
Zync-7000 AP SoC
XC7Z045-2FFG900C
Processing
System
Programmable Logic
UG954_c1_01_1002012
JTAG Module
and
JTAG Header
Page 16
Dual Quad-SPI
Flash Memory
Page 21
PCIe
x 4-Lane
Page 42
SD Card
Connector
Page 22
FMC HPC
Connector
Pages 24-27
10/100/1,000
Ethernet PHY
(RGMII only)
Page 29, 30
USB 2.0 ULPI
Transceiver
and Connector
Page 31
Clock and
Reset/POR
Pushbuttons
Pages 15, 34
USB UART
and
Connector
Page 40
ARM PJTAG
Header
Page 39
Switches
LEDs and
Pushbuttons
Page 38
Mechanicals
Page 58
I2C
Real Time
Clock
Page 37
DDR3
SODIMM
Page 23
DDR3 Memory
4 x 256 Mb x 8
SDRAM
Pages 17-20
HDMI Codec
and
Connector
Pages 32, 33
I2C Multiplexer
and
I2C EEPROM
Page 36
XADC
Header
Page 35
Configurable
Clocks
Page 34
FMC LPC
Connector
Page 28
Note: Page numbers reference the page number of schematic 0381513.
SendFeedback
Overview
Block Diagram
The ZC706 evaluation board block diagram is shown in Figure 1-1.
Figure 1-1:ZC706 Evaluation Board Block Diagram
Board Layout
Figure 1-2 shows the ZC706 evaluation board. Each numbered feature that is referenced in
Figure 1-2 is described in Tab le 1- 1 with a link to detailed information provided under
Feature Descriptions starting on page 14.
Note: The image in Figure 1-2 is for reference only and might not reflect the current revision of the
board.
CAUTION! The ZC706 evaluation board can be damaged by electrostatic discharge (ESD). Follow ESD
prevention measures when handling the board.
ZC706 Evaluation Board User Guidewww.xilinx.com10
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-2
17
6
30
31
21
18
15
2
11
13
12
1
4
7
3
9
10
16
25
24
26
22
33
27
19
32
23
28
14
35
29
5
8
20
34
36
37
38
00
Square callout references a component
on the back side of the board
Round callout references a component
on the front side of the board
12V power input 2x6 connector J22MOLEX-39-30-106048
Overview
Schematic
0381513
Page Number
38
39
37, 39
48
38
24-27
28
48-57
35
16
16
Notes:
1. Jumper header locations are identified in Appendix A, Default Switch and Jumper Settings.
ZC706 Evaluation Board User Guidewww.xilinx.com13
UG954 (v1.5) September 10, 2015
Feature Descriptions
Application
Processor Unit (APU)
Common
Peripherals
Custom
Peripherals
Common Accelerators
Custom Accelerators
Memory
Interfaces
Processing
System
(PS)
Programmable
Logic
(PL)
Input Output
Peripherals
(IOP)
High-Bandwidth
AMBA
®
AXI Interfaces
UG954_c1_03_100112
Interconnect
SendFeedback
Feature Descriptions
Detailed information for each feature shown in Figure 1-2 and listed in Table 1 -1 is
provided in this section.
Zynq-7000 XC7Z045 AP SoC
[Figure 1-2, callout 1]
The ZC706 evaluation board is populated with the Zynq-7000 XC7Z045-2FFG900C AP SoC.
The XC7Z045 AP SoC consists of an integrated processing system (PS) and programmable
logic (PL), on a single die. The high-level block diagram is shown in Figure 1-3.
X-Ref Target - Figure 1-3
ZC706 Evaluation Board User Guidewww.xilinx.com14
UG954 (v1.5) September 10, 2015
Figure 1-3:High-Level Block Diagram
The PS integrates two ARM® Cortex™-A9 MPCore™ application processors, AMBA®
interconnect, internal memories, external memory interfaces, and peripherals including
USB, Ethernet, SPI, SD/SDIO,
and boots at power-up or reset.
A system level block diagram is shown in Figure 1-4.
I2C, CAN, UART, and GPIO. The PS runs independently of the PL
X-Ref Target - Figure 1-4
2x USB
2x GigE
2x SD
Zynq-7000 AP SoC
I/O
Peripherals
IRQ
IRQ
EMIO
SelectIO
Resources
DMA 8
Channel
CoreSight
Components
Programmable Logic
DAP
DevC
SWDT
DMA
Sync
Notes:
1) Arrow direction shows control (master to slave)
2) Data flows in both directions: AXI 32-Bit/64-Bit, AXI 64-Bit, AXI 32-Bit, AHB 32-Bit, APB 32-Bit, Custom
ACP
256K
SRAM
Application Processor Unit
TTC
System-
Level
Control
Regs
GigE
CAN
SD
SDIO
UART
GPIO
UART
CAN
I2C
SRAM/
NOR
ONFI 1.0
NAND
Processing System
Memory
Interfaces
Q-SPI
CTRL
USB
GigE
I2C
USB
SD
SDIO
SPI
SPI
Programmable Logic to
Memory Interconnect
MMU
FPU and NEON Engine
Snoop Controller, AWDT, Timer
GIC
32 KB
I-Cache
ARM Cortex-A9
CPU
ARM Cortex-A9
CPU
MMU
FPU and NEON Engine
Config
AES/
SHA
XADC
12-Bit ADC
Memory
Interfaces
512 KB L2 Cache & Controller
OCM
Interconnect
DDR2/3,
LPDDR2
Controller
UG954_c1_04_100112
32 KB
D-Cache
32 KB
I-Cache
32 KB
D-Cache
MIO
Clock
Generation
Reset
Central
Interconnect
General-Purpose
Por ts
High-Performance Ports
SendFeedback
Feature Descriptions
For additional information on Zynq-7000 SoC devices, see Zynq-7000 All Programmable
SoC Overview (DS190
(UG585
).
Figure 1-4:Zynq-7000 Block Diagram
) and Zynq-7000 All Programmable SoC Technical Reference Manual
Device Configuration
the Zynq-7000 XC7Z045 AP SoC uses a multi-stage boot process that supports both a
non-secure and a secure boot. The PS is the master of the boot and configuration process.
For a secure boot, the PL must be powered on to enable the use of the security block
located within the PL, which provides 256-bit AES and SHA decryption/authentication.
The ZC706 evaluation board supports these configuration options:
•PS Configuration: Quad-SPI flash memory
ZC706 Evaluation Board User Guidewww.xilinx.com15
UG954 (v1.5) September 10, 2015
•PS Configuration: Processor System Boot from SD Card (J30)
Feature Descriptions
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•PL Configuration: USB JTAG configuration port (Digilent module U30)
•PL Configuration: Platform cable header J3 and flying lead header J62 JTAG
configuration ports
TIP: Designs using serial configuration based on Quad-SPI flash memory can take advantage of
low-cost commodity SPI flash memory.
The JTAG configuration option is selected by setting SW11 (PS) as shown in Tab le 1 -2 and
SW4 (PL) as described in Programmable Logic JTAG Programming Options, page 31. SW11
is callout 29 in Figure 1-2.
The XC7Z045 AP SoC U1 implements bitstream encryption key technology. The ZC706
board provides the encryption key backup battery circuit shown in Figure 1-5. The Seiko
TS518FE rechargeable 1.5V lithium button-type battery B2 is soldered to the board with the
positive output connected to the XC7Z045 AP SoC U1 VCCBATT pin P9. The battery supply
current IBATT specification is 150 nA max when board power is off. B2 is charged from the
VCCAUX 1.8V rail through a series diode with a typical forward voltage drop of 0.38V and
4.7 K
Ω current limit resistor. The nominal charging voltage is 1.42V.
ZC706 Evaluation Board User Guidewww.xilinx.com16
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-5
SendFeedback
To XC7Z045 AP SoC
U1 Pin P9
(VCCBATT)
D7
40V
200 mW
FPGA_VBATT
B2
Feature Descriptions
NC
1
VCCAUX
3
BAS40-04
2
R9
4.70K 1%
1/16W
1
+
Lithium Battery
Seiko
TS518SE_FL35E
1.5V
2
GND
UG954_c1_05_041113
Figure 1-5:Encryption Key Backup Circuit
I/O Voltage Rails
There are eleven I/O banks available on the XC7Z045 AP SoC. The voltages applied to the
XC7Z045 AP SoC I/O banks used by the ZC706 evaluation board are listed in Tab le 1 -3.
Table 1-3:I/O Voltage Rails
XC7Z045 (U1)
Bank
PL Bank 0VCC3V3_FPGA3.3VAP SoC Configuration Bank 0
The memory module at J1 is a 1 GB DDR3 small outline dual-inline memory module
(SODIMM). It provides volatile synchronous dynamic random access memory (SDRAM) for
storing user code and data.
The DDR3 interface is implemented across the PL-side I/O banks. Bank 33 and bank 35 have
a dedicated DCI VRP/N resistor connection. An external 0.75V reference VTTREF_SODIMM is
provided for data interface banks. Any interface connected to these banks that requires the
VTTREF voltage must use this FPGA voltage reference. The connections between the DDR3
memory and the AP SoC are listed in Tab le 1- 4.
Table 1-4:DDR3 SODIMM Socket J1 Connections to the XC7Z045 AP SoC
XC7Z045 (U1)
Pin
E10PL_DDR3_A0SSTL1598A0
B9PL_DDR3_A1SSTL1597A1
E11PL_DDR3_A2SSTL1596A2
A9PL_DDR3_A3SSTL1595A3
D11PL_DDR3_A4SSTL1592A4
B6PL_DDR3_A5SSTL1591A5
F9PL_DDR3_A6SSTL1590A6
E8PL_DDR3_A7SSTL1586A7
B10PL_DDR3_A8SSTL1589A8
Net NameI/O Standard
DDR3 SODIMM Memory J1
Pin NumberPin Name
ZC706 Evaluation Board User Guidewww.xilinx.com18
UG954 (v1.5) September 10, 2015
J8PL_DDR3_A9SSTL1585A9
Feature Descriptions
SendFeedback
Table 1-4:DDR3 SODIMM Socket J1 Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1)
Pin
D6PL_DDR3_A10SSTL15107A10/AP
B7PL_DDR3_A11SSTL1584A11
H12PL_DDR3_A12SSTL1583A12_BC_N
A10PL_DDR3_A13SSTL15119A13
G11PL_DDR3_A14SSTL1580A14
C6PL_DDR3_A15SSTL1578A15
F8PL_DDR3_BA0SSTL15109BA0
H7PL_DDR3_BA1SSTL15108BA1
A7PL_DDR3_BA2SSTL1579BA2
L1PL_DDR3_D0SSTL155DQ0
L2PL_DDR3_D1SSTL157DQ1
K5PL_DDR3_D2SSTL1515DQ2
J4PL_DDR3_D3SSTL1517DQ3
K1PL_DDR3_D4SSTL154DQ4
L3PL_DDR3_D5SSTL156DQ5
J5PL_DDR3_D6SSTL1516DQ6
K6PL_DDR3_D7SSTL1518DQ7
Net NameI/O Standard
DDR3 SODIMM Memory J1
Pin NumberPin Name
G6PL_DDR3_D8SSTL1521DQ8
H4PL_DDR3_D9SSTL1523DQ9
H6PL_DDR3_D10SSTL1533DQ10
H3PL_DDR3_D11SSTL1535DQ11
G1PL_DDR3_D12SSTL1522DQ12
H2PL_DDR3_D13SSTL1524DQ13
G5PL_DDR3_D14SSTL1534DQ14
G4PL_DDR3_D15SSTL1536DQ15
E2PL_DDR3_D16SSTL1539DQ16
E3PL_DDR3_D17SSTL1541DQ17
D4PL_DDR3_D18SSTL1551DQ18
E5PL_DDR3_D19SSTL1553DQ19
F4PL_DDR3_D20SSTL1540DQ20
F3PL_DDR3_D21SSTL1542DQ21
D1PL_DDR3_D22SSTL1550DQ22
D3PL_DDR3_D23SSTL1552DQ23
A2PL_DDR3_D24SSTL1557DQ24
B2PL_DDR3_D25SSTL1559DQ25
ZC706 Evaluation Board User Guidewww.xilinx.com19
UG954 (v1.5) September 10, 2015
Feature Descriptions
SendFeedback
Table 1-4:DDR3 SODIMM Socket J1 Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1)
Pin
B4PL_DDR3_D26SSTL1567DQ26
B5PL_DDR3_D27SSTL1569DQ27
A3PL_DDR3_D28SSTL1556DQ28
B1PL_DDR3_D29SSTL1558DQ29
C1PL_DDR3_D30SSTL1568DQ30
C4PL_DDR3_D31SSTL1570DQ31
K10PL_DDR3_D32SSTL15129DQ32
L9PL_DDR3_D33SSTL15131DQ33
K12PL_DDR3_D34SSTL15141DQ34
J9PL_DDR3_D35SSTL15143DQ35
K11PL_DDR3_D36SSTL15130DQ36
L10PL_DDR3_D37SSTL15132DQ37
J10PL_DDR3_D38SSTL15140DQ38
L7PL_DDR3_D39SSTL15142DQ39
F14PL_DDR3_D40SSTL15147DQ40
F15PL_DDR3_D41SSTL15149DQ41
F13PL_DDR3_D42SSTL15157DQ42
Net NameI/O Standard
DDR3 SODIMM Memory J1
Pin NumberPin Name
G16PL_DDR3_D43SSTL15159DQ43
G15PL_DDR3_D44SSTL15146DQ44
E12PL_DDR3_D45SSTL15148DQ45
D13PL_DDR3_D46SSTL15158DQ46
E13PL_DDR3_D47SSTL15160DQ47
D15PL_DDR3_D48SSTL15163DQ48
E15PL_DDR3_D49SSTL15165DQ49
D16PL_DDR3_D50SSTL15175DQ50
E16PL_DDR3_D51SSTL15177DQ51
C17PL_DDR3_D52SSTL15164DQ52
B16PL_DDR3_D53SSTL15166DQ53
D14PL_DDR3_D54SSTL15174DQ54
B17PL_DDR3_D55SSTL15176DQ55
B12PL_DDR3_D56SSTL15181DQ56
C12PL_DDR3_D57SSTL15183DQ57
A12PL_DDR3_D58SSTL15191DQ58
A14PL_DDR3_D59SSTL15193DQ59
A13PL_DDR3_D60SSTL15180DQ60
ZC706 Evaluation Board User Guidewww.xilinx.com20
UG954 (v1.5) September 10, 2015
Feature Descriptions
SendFeedback
Table 1-4:DDR3 SODIMM Socket J1 Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1)
Pin
B11PL_DDR3_D61SSTL15182DQ61
C14PL_DDR3_D62SSTL15192DQ62
B14PL_DDR3_D63SSTL15194DQ63
J3PL_DDR3_DM0SSTL1511DM0
F2PL_DDR3_DM1SSTL1528DM1
E1PL_DDR3_DM2SSTL1546DM2
C2PL_DDR3_DM3SSTL1563DM3
L12PL_DDR3_DM4SSTL15136DM4
G14PL_DDR3_DM5SSTL15153DM5
C16PL_DDR3_DM6SSTL15170DM6
C11PL_DDR3_DM7SSTL15187DM7
K2PL_DDR3_DQS0_NDIFF_SSTL1510DQS0_N
K3PL_DDR3_DQS0_PDIFF_SSTL1512DQS0_P
H1PL_DDR3_DQS1_NDIFF_SSTL1527DQS1_N
J1PL_DDR3_DQS1_PDIFF_SSTL1529DQS1_P
D5PL_DDR3_DQS2_NDIFF_SSTL1545DQS2_N
E6PL_DDR3_DQS2_PDIFF_SSTL1547DQS2_P
Net NameI/O Standard
DDR3 SODIMM Memory J1
Pin NumberPin Name
A4PL_DDR3_DQS3_NDIFF_SSTL1562DQS3_N
A5PL_DDR3_DQS3_PDIFF_SSTL1564DQS3_P
K8PL_DDR3_DQS4_NDIFF_SSTL15135DQS4_N
L8PL_DDR3_DQS4_PDIFF_SSTL15137DQS4_P
F12PL_DDR3_DQS5_NDIFF_SSTL15152DQS5_N
G12PL_DDR3_DQS5_PDIFF_SSTL15154DQS5_P
E17PL_DDR3_DQS6_NDIFF_SSTL15169DQS6_N
F17PL_DDR3_DQS6_PDIFF_SSTL15171DQS6_P
A15PL_DDR3_DQS7_NDIFF_SSTL15186DQS7_N
B15PL_DDR3_DQS7_PDIFF_SSTL15188DQS7_P
G7PL_DDR3_ODT0SSTL15116ODT0
C9PL_DDR3_ODT1SSTL15120ODT1
G17PL_DDR3_RESET_BSSTL1530RESET_B
J11PL_DDR3_S0_BSSTL15114S0_B
H8PL_DDR3_S1_BSSTL15121S1_B
M10PL_DDR3_TEMP_EVE
NT
F7PL_DDR3_WE_BSSTL15113WE_B
SSTL15198EVENT_B
ZC706 Evaluation Board User Guidewww.xilinx.com21
UG954 (v1.5) September 10, 2015
Feature Descriptions
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Table 1-4:DDR3 SODIMM Socket J1 Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1)
Pin
E7PL_DDR3_CAS_BSSTL15115CAS_B
H11PL_DDR3_RAS_BSSTL15110RAS_B
D10PL_DDR3_CKE0SSTL1573CKE0
C7PL_DDR3_CKE1SSTL1574CKE1
F10PL_DDR3_CLK0_NDIFF_SSTL15103CK0_N
G10PL_DDR3_CLK0_PDIFF_SSTL15101CK0_P
D8PL_DDR3_CLK1_NDIFF_SSTL15104CK1_N
D9PL_DDR3_CLK1_PDIFF_SSTL15102CK1_P
Net NameI/O Standard
DDR3 SODIMM Memory J1
Pin NumberPin Name
The ZC706 DDR3 SODIMM interface adheres to the constraints guidelines documented in
the “Dynamic Memory” section of the Zynq-7000 All Programmable SoC PCB Design and Pin Planning Guide (UG933
). The ZC706 DDR3 SODIMM interface is a 40Ω impedance
implementation. For more details, see the MT8JTF12864HZ-1G6G1 data sheet [Ref 34].
DDR3 Component Memory (PS)
[Figure 1-2, callout 3]
The 1 GB, 32-bit wide DDR3 component memory system is comprised of four 256 Mb x 8
SDRAMs (Micron MT41J256M8HX-15E) at U2-U5. This memory system is connected to the
XC7Z045 AP SoC Processing System (PS) memory interface bank 502. The DDR3 0.75V VTT
termination voltage is sourced from linear regulator U27. The connections between the
DDR3 component memory and XC7Z045 AP SoC bank 502 are listed in Tab le 1 -5.
Table 1-5:DDR3 Component Memory Connections to the XC7Z045 AP SoC
Component Memory
XC7Z045 (U1) PinNet Name
Pin NumberPin NameRef. Des.
E26PS_DDR3_DQ0B3DQ0U2
A25PS_DDR3_DQ1C7DQ1U2
E27PS_DDR3_DQ2C2DQ2U2
E25PS_DDR3_DQ3C8DQ3U2
D26PS_DDR3_DQ4E3DQ4U2
B25PS_DDR3_DQ5E8DQ5U2
D25PS_DDR3_DQ6D2DQ6U2
B27PS_DDR3_DQ7E7DQ7U2
A27PS_DDR3_DQ8B3DQ8U3
A28PS_DDR3_DQ9C7DQ9U3
A29PS_DDR3_DQ10C2DQ10U3
ZC706 Evaluation Board User Guidewww.xilinx.com22
UG954 (v1.5) September 10, 2015
Feature Descriptions
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Table 1-5:DDR3 Component Memory Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1) PinNet Name
C28PS_DDR3_DQ11C8DQ11U3
D30PS_DDR3_DQ12E3DQ12U3
A30PS_DDR3_DQ13E8DQ13U3
D29PS_DDR3_DQ14D2DQ14U3
D28PS_DDR3_DQ15E7DQ15U3
H27PS_DDR3_DQ16B3DQ16U4
G27PS_DDR3_DQ17C7DQ17U4
H28PS_DDR3_DQ18C2DQ18U4
E28PS_DDR3_DQ19C8DQ19U4
E30PS_DDR3_DQ20E3DQ20U4
F28PS_DDR3_DQ21E8DQ21U4
G30PS_DDR3_DQ22D2DQ22U4
F30PS_DDR3_DQ23E7DQ23U4
K27PS_DDR3_DQ24B3DQ24U5
J30PS_DDR3_DQ25C7DQ25U5
J28PS_DDR3_DQ26C2DQ26U5
J29PS_DDR3_DQ27C8DQ27U5
Component Memory
Pin NumberPin NameRef. Des.
K30PS_DDR3_DQ28E3DQ28U5
M29PS_DDR3_DQ29E8DQ29U5
L30PS_DDR3_DQ30D2DQ30U5
M30PS_DDR3_DQ31E7DQ31U5
C27PS_DDR3_DM0B7DM0U2
C26PS_DDR3_DQS0_PC3DQS0_PU2
B26PS_DDR3_DQS0_ND3DQS0_NU2
B30PS_DDR3_DM1B7DM1U3
C29PS_DDR3_DQS1_PC3DQS1_PU3
B29PS_DDR3_DQS1_ND3DQS1_NU3
H29PS_DDR3_DM2B7DM2U4
G29PS_DDR3_DQS2_PC3DQS2_PU4
F29PS_DDR3_DQS2_ND3DQS2_NU4
K28PS_DDR3_DM3B7DM3U5
L28PS_DDR3_DQS3_PC3DQS3_PU5
L29PS_DDR3_DQS3_ND3DQS3_NU5
L25PS_DDR3_A0K3A0U2, U3, U4, U5
K26PS_DDR3_A1L7A1U2, U3, U4, U5
ZC706 Evaluation Board User Guidewww.xilinx.com23
UG954 (v1.5) September 10, 2015
Feature Descriptions
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Table 1-5:DDR3 Component Memory Connections to the XC7Z045 AP SoC (Cont’d)
XC7Z045 (U1) PinNet Name
L27PS_DDR3_A2L3A2U2, U3, U4, U5
G25PS_DDR3_A3K2A3U2, U3, U4, U5
J26PS_DDR3_A4L8A4U2, U3, U4, U5
G24PS_DDR3_A5L2A5U2, U3, U4, U5
H26PS_DDR3_A6M8A6U2, U3, U4, U5
K22PS_DDR3_A7M2A7U2, U3, U4, U5
F27PS_DDR3_A8N8A8U2, U3, U4, U5
J23PS_DDR3_A9M3A9U2, U3, U4, U5
G26PS_DDR3_A10H7A10U2, U3, U4, U5
H24PS_DDR3_A11M7A11U2, U3, U4, U5
K23PS_DDR3_A12K7A12U2, U3, U4, U5
H23PS_DDR3_A13N3A13U2, U3, U4, U5
J24PS_DDR3_A14N7A14U2, U3, U4, U5
M27PS_DDR3_BA0J2BA0U2, U3, U4, U5
M26PS_DDR3_BA1K8BA1U2, U3, U4, U5
M25PS_DDR3_BA2J3BA2U2, U3, U4, U5
K25PS_DDR3_CLK_PF7CKU2, U3, U4, U5
Component Memory
Pin NumberPin NameRef. Des.
J25PS_DDR3_CLK_NG7CK_BU2, U3, U4, U5
M22PS_DDR3_CKEG9CKEU2, U3, U4, U5
N23PS_DDR3_WE_BH3WE_BU2, U3, U4, U5
M24PS_DDR3_CAS_BG3CAS_BU2, U3, U4, U5
N24PS_DDR3_RAS_BF3RAS_BU2, U3, U4, U5
F25PS_DDR3_RESET_BN2RESET_BU2, U3, U4, U5
N22PS_DDR3_CS_BH2CS_BU2, U3, U4, U5
L23PS_DDR3_ODTG1ODTU2, U3, U4, U5
N21PS_VRN
M21PS_VRP
L22VTTVREF_PS
L24VTTVREF_PS
The ZC706 DDR3 component interface adheres to the constraints guidelines documented in
the DDR3 Design Guidelines section of Zynq-7000 All Programmable SoC PCB Design and Pin Planning Guide (UG933
). The ZC706 DDR3 component interface is a 40Ω impedance
implementation. For more details, see the MT41J256M8HX-15E data sheet [Ref 34].
ZC706 Evaluation Board User Guidewww.xilinx.com24
UG954 (v1.5) September 10, 2015
Quad-SPI Flash Memory
SendFeedback
[Figure 1-2, callout 4]
The Quad-SPI flash memory located at U58 and U59 provides 2 x 128 Mb of nonvolatile
storage that can be used for configuration and data storage.
•Part number: S25FL128SAGMFIR01 (Spansion)
•Supply voltage: 1.8V
•Datapath width: 4 bits
•Data rate: Various depending on Single/Dual/Quad mode
The connections between the SPI flash memory and the XC7Z045 AP SoC are listed in
Tab le 1- 6.
Table 1-6:Quad-SPI Flash Memory Connections to the XC7Z045 AP SoC
Feature Descriptions
XC7Z045 (U1)
Pin NameBankPin NumberPin NumberPin NameRef. Des.
PS_MIO6500D24QSPI0_CLK
PS_MIO5500C24QSPI0_IO3
PS_MIO4500E23QSPI0_IO2
PS_MIO3500C23QSPI0_IO1
PS_MIO2500F23QSPI0_IO0
PS_MIO1500D23QSPI0_CS_B
PS_MIO9500A24QSPI1_CLK
PS_MIO13500F22QSPI1_IO3
PS_MIO12500E21QSPI1_IO2
PS_MIO11500A23QSPI1_IO1
PS_MIO10500E22QSPI1_IO0
PS_MIO0500F24QSPI1_CS_B
Schematic
Net Name
Quad-SPI Flash MemoryQSPI Device
16CU58J74.2
1DQ3_HOLD_BU58J73.2
9WP_BU58J72.2
8DQ1U58J71.2
15DQ0U58J70.2
7S_BU58N/A
16CU59N/A
1DQ3_HOLD_BU59 N/A
9WP_BU59N/A
8DQ1U59N/A
15DQ0U59N/A
7S_BU59N/A
The configuration section of the Zynq-7000 All Programmable SoC Technical Reference
Manual UG585
, provides details on using the Quad-SPI flash memory.
MIO Select
Header
ZC706 Evaluation Board User Guidewww.xilinx.com25
UG954 (v1.5) September 10, 2015
Figure 1-6 shows the connections of the linear Quad-SPI flash memory on the ZC706
evaluation board. For more details, see the Spansion S25FL128SAGMFIR01 data sheet
[Ref 16].
X-Ref Target - Figure 1-6
SendFeedback
Feature Descriptions
VCCP1V8VCC3V3_PSVCCP1V8
C39
1
0.1UF
25V
2
X5R
GND
QSPI0_IO3
QSPI0_CS_B
QSPI0_IO1
C40
1
0.1UF
25V
2
X5R
C714
1
R531
1
R207
1
330
1/10W
2
5%
0
1/10W
2
5%
R527
1
DNP
DNP
2
DNP
R528
1
DNP
DNP
2
DNP
2
GND
0.1UF
25V
X5R
S25FL128SAGMFIR01
QSPI0_CLK
QSPI0_IO0
QSPI0_IO2
NC
NC
NC
NC
1
DQ3_HOLD_B
2
VCC
3
NC0
4
NC1
5
NC2
6
NC3
7
S_B
8
DQ1
DQ0
NC7
NC6
NC5
NC4
VSS
DQ2_VPP_WP_B
16
C
15
14
13
NC
12
NC
11
NC
10
9
SO16_50P300X413U58
GND
VCCP1V8VCC3V3_PSVCCP1V8
C715
1
R532
1
R208
1
330
1/10W
2
5%
0
1/10W
2
5%
R530
1
DNP
DNP
2
DNP
R529
1
DNP
DNP
2
DNP
0.1UF
25V
2
X5R
QSPI1_IO3
QSPI1_CS_B
QSPI1_IO1
S25FL128SAGMFIR01
NC
NC
NC
NC
1
DQ3_HOLD_B
2
VCC
3
NC0
4
NC1
5
NC2
6
NC3
7
S_B
8
DQ1
DQ2_VPP_WP_B
DQ0
NC7
NC6
NC5
NC4
VSS
16
C
15
14
13
NC
12
NC
11
NC
10
9
SO16_50P300X413U59
GND
Figure 1-6:128 Mb Quad-SPI Flash Memory
QSPI1_CLK
QSPI1_IO0
QSPI1_IO2
UG954_c1_06_073013
ZC706 Evaluation Board User Guidewww.xilinx.com26
UG954 (v1.5) September 10, 2015
Feature Descriptions
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USB 2.0 ULPI Transceiver
[Figure 1-2, callout 19]
The ZC706 evaluation board uses a Standard Microsystems Corporation USB3320 USB 2.0
ULPI Transceiver at U12 to support a USB connection to the host computer. A USB cable is
supplied in the ZC706 evaluation kit (Standard-A connector to host computer, Micro-B
connector to ZC706 evaluation board connector J2). The USB3320 is a high-speed USB 2.0
PHY supporting the UTMI+ low pin interface (ULPI) interface standard. The ULPI standard
defines the interface between the USB controller IP and the PHY device which drives the
physical USB bus. Use of the ULPI standard reduces the interface pin count between the USB
controller IP and the PHY device.
The USB3320 is clocked by a 24 MHz crystal. Consult the SMSC USB3320 data sheet for
clocking mode details [Ref 17].
The interface to the USB3320 transceiver is implemented through the IP in the XC7Z045
AP SoC Processor System.
Tab le 1- 7 describes the jumper settings for the USB 2.0 circuit. Bold text identifies the
default OTG mode settings.
Table 1-7:USB Jumper Settings
HeaderFunctionShunt PositionNotes
J11
J10
J48
J50
J49
J51
USB PHY resetShunt ON = USB PHY reset
Shunt OFF = USB PHY normal operation
V
5V Supply Shunt ON = Host or OTG mode
BUS
RVBUS selectPosition 1–2 = Device mode only (10 KΩ )
CVBUS selectPosition 1-2 = OTG and Device mode 1 μF
Cable ID selectPosition 1-2 = A/B cable detect
USB Micro-BPosition 1-2 = Shield connected to GND
Shunt OFF = Device mode
Position 2–3 = OTG or Host mode (1 KΩ )
Position 2-3 = Host mode 120 μF
Position 2-3 = ID not used
Position 2-3 = Shield floating
Clean reset requires external
debouncing
Overvoltage protection
V
load capacitance
BUS
Used in OTG mode
ZC706 Evaluation Board User Guidewww.xilinx.com27
UG954 (v1.5) September 10, 2015
Feature Descriptions
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The connections between the USB Micro-B connector at J2 and the PHY at U12 are listed in
Tab le 1- 8.
Table 1-8:USB Connector Pin Assignments and Signal Definitions Between J2 and U12
USB Connector
J1
Net NameDescription
PinName
1VBUSUSB_VBUS_SEL+5V from host system22
2D_NUSB_D_NBidirectional differential serial data (N-side)19
3D_PUSB_D_PBidirectional differential serial data (P-side)18
5GNDGNDSignal ground33
The connections between the USB 2.0 PHY at U12 and the XC7Z045 AP SoC are listed in
Tab le 1- 9.
Table 1-9:USB 2.0 ULPI Transceiver Connections to the XC7Z045 AP SoC
XC7Z045 (U1)
Schematic Net NameUSB3320 (U12) Pin
Pin NameBankPin Number
PS_MIO36501H17USB_CLKOUT1
PS_MIO31501H21USB_NXT2
PS_MIO32501K17USB_DATA03
PS_MIO33501G22USB_DATA14
USB3320 (U12)
Pin
PS_MIO34501K18USB_DATA25
PS_MIO35501G21USB_DATA36
PS_MIO28501L17USB_DATA47
PS_MIO37501B21USB_DATA59
PS_MIO38501A20USB_DATA610
PS_MIO39501F18USB_DATA713
PS_MIO30501L18USB_STP29
PS_MIO29501E8USB_DIR31
PS_MIO7500D5USB_RESET_B_AND27 (via AND gate U13)
For additional information on the Zynq-7000 AP SoC device USB controllers, see Zynq-7000
All Programmable SoC Overview (DS190
Reference Manual (UG585
).
) and Zynq-7000 All Programmable SoC Technical
ZC706 Evaluation Board User Guidewww.xilinx.com28
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-7
SendFeedback
8
8
8
8
8
8
8
Feature Descriptions
Figure 1-7 shows the USB 2.0 ULPI transceiver circuitry. Note that the shield for the USB
Micro-B connector (J2) can be tied to GND by a jumper on header J51 pins 1–2 (default).
The USB shield can optionally be connected through a capacitor to GND by installing a
capacitor (body size 0402) at location C335 and jumping pins 2-3 on header J51.
9
9
USB_CLKOUT
USB_NXT
USB_DATA0
USB_DATA1
USB_DATA2
USB_DATA3
USB_DATA4
VCCP1V8
3 PLACES
31
2 PLACES
VCCMIO
C70
C71
C74
1
0.1UF
2
25V
GND
USB3320_QFN32
1
CLKOUT_1
2
NXT_2
3
DATA0_3
DATA1_4
5
DATA2_5
6
DATA3_6
7
DATA4_7
8
REFSEL0_8
U12
USB_DIR
USB_STP
USB_RESET_B
1
29
VDD18_30
REFSEL1_11
12
NC
STP_29
NC_12
27
28
VDD18_28
DATA7_13
14
1341526
USB_DATA7
8
RESETB_27
REFSEL2_14
SPK_L_15REFCLK_26
NC
R389
1/10W
R403
1625
NC
261
1.0M
1/10W
XO_25
SPK_R_16
VCC3V3
5%
CTR_GND_33
USB3320_QFN32
1
2
2
RBIAS_23
VBUS_22
VBAT_21
VDD33_P
CPEN33_17
1
1
2
2
32
31
30
DIR_31
VDDIO_32
DATA6_10
DATA5_9
9
10
11
USB_DATA5
USB_DATA6
8
8
C496
1
18PF
2
50V
NPO
GND
24
USB_ID
23
ID_23
22
21
20
USB_D_N
19
DM_19
USB_D_P
18
DP_18
17
33
GND
DS25
21
LED-RED-SMT
X2
21
C497
1
24.000MHZ
18PF
2
50V
NPO
GND
R178
8.06K
1/10W
1%
2
1
31
USB_VDD33
27
31
C209
1
31
2.2UF
6.3V
2
GND
1
R267
10.0K
1/10W
2
1
1-2 = DEVICE MODE
2-3 = HOST OR OTG MODE
USB HOST POWER
MIC2025_SOP8
18
ENOUT2
2
FLG
3
GND
4
NC
NC1
U22
GND
GND
2
1
2
3
VCC5V0
2125V
GND
R359
1.00K
1/16W
J48
7
IN
6
OUT1
5
NC2
SOP127P500X600_8
C72
0.1UF
USB_VBUS_SEL
NC
1
2
VCC5V0
1
2
GND
J10
C76
0.1UF
25V
USB_VBUS_SEL
C380
1
1UF
2
16V
J50
X5R
CVBUS Select:
1-2: OTG Mode
2-3: Host Mode
GND
ON = HOST OR OTG MODE
OFF = DEVICE MODE
1
C469
150UF
2
10V
TANT
GND
L11
FERRITE-220
C447
12
1
5.6UF
2
10V
12
FERRITE-220
GND
27
C75
1
0.1UF
27
2
25V
L12
J49
1
3
2
C484
1
120UF
20V
TANT
2
GND
1-2 = A/B CABLE DETECT
2-3 = ID NOT USED
USB_D_N
USB_D_P
1
2
3
USB_ID
USB_VDD33
1
2
3
4
5
ZX62D_AB_5P8
VBUS
D_N
D_P
ID
GND
27
GND
27
SHLD1
SHLD2
SHLD3
SHLD4
SHLD5
9
7
8
6
10
J51
UG954_c1_07_041113
SHLD6
11
123
J2
1
C335
2
DNP
GND
Figure 1-7:USB 2.0 ULPI Transceiver
SD Card Interface
[Figure 1-2, callout 5]
The ZC706 evaluation board includes a secure digital input/output (SDIO) interface to
provide user-logic access to general purpose nonvolatile SDIO memory cards and
peripherals. Information for the SD I/O card specification can be found at the SanDisk and
SD card websites [Ref 18], [Ref 19].
The SDIO signals are connected to XC7Z045 AP SoC PS bank 501 which has its VCCMIO set
to 1.8V. A MAX13035E high-speed logic-level translator (U11) is used between XC7Z045 AP
SoC 1.8V PS bank 501 and the 3.3V SD card connector (J30).
ZC706 Evaluation Board User Guidewww.xilinx.com29
UG954 (v1.5) September 10, 2015
X-Ref Target - Figure 1-8
SendFeedback
Feature Descriptions
Figure 1-8 shows the connections of the SD card interface on the ZC706 evaluation board.
VCCP1V8
1
2
R28
4.7 KΩ
1/10W
5%
1
R29
4.7 KΩ
1/10W
2
5%
VCC3V3_PS
1
2
GND
C41
0.1 μF
25V
X5R
GND
67840-8001
1
CD_DAT3
2
CMD
3
VSS1
4
VDD
5
CLK
6
VSS2
7
DAT0
8
DAT1
9
DAT2
10
DETECT
11
PROTECT
12
DETECT_PROTECT
J30
IOGND2
IOGND1
GNDTAB4
GNDTAB3
GNDTAB2
GNDTAB1
UG954_c1_08_041113
18
17
16
15
14
13
GND
SDIO_CD_DAT322
22SDIO_CMD
22 SDIO_CLK
SDIO_DAT022
22 SDIO_DAT1
SDIO_DAT222
SDIO_SDDET8
SDIO_SDWP8
Figure 1-8:SD Card Interface
Tab le 1- 10 lists the SD card interface connections to the XC7Z045 AP SoC
Table 1-10:SDIO Connections to the XC7Z045 AP SoC
XC7Z045 (U1) Pin
Level Shifter (U11)SDIO Connector (J30)
Schematic
Pin NameBank
Pin
Number
Net Name
PS_MIO15500C22SDIO_SDWPN/AN/A11PROTECT
1.8V Side
Pin
3.3V Side
Pin
Pin
Number
Name
Pin
PS_MIO14500B22SDIO_SDDETN/AN/A10DETECT
PS_MIO41501J18SDIO_CMD_LS4202CMD
PS_MIO40501B20SDIO_CLK_LS9195CLK
PS_MIO44501E20SDIO_DAT2_LS1239DAT2
PS_MIO43501E18SDIO_DAT1_LS7168DAT1
PS_MIO42501D20SDIO_DAT0_LS6187DAT0
PS_MIO45501H18SDIO_CD_DAT3_LS3221CD_DAT3
ZC706 Evaluation Board User Guidewww.xilinx.com30
UG954 (v1.5) September 10, 2015
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