Datasheet XCV800-6HQ240C, XCV800-6FG680I, XCV800-6FG680C, XCV800-6FG676I, XCV800-6FG676C Datasheet (XILINX)

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DS003-1 (v2.5 ) April 2, 2001 www.xilinx.com Module 1 of 4
Product Specification 1-800-255-7778 1
Features
Fast, high-density Field-Programmable Gate Arrays
- Densities from 50k to 1M system gates
- System performance up to 200 MHz
- Hot-swappable for Compact PCI
Multi-standard SelectIO™ interfaces
- 16 high-performance interface standards
- Connects directly to ZBTRAM devices
Built-in clock-management circuitry
- Four dedicated delay-locked loops (DLLs) for advanced clock control
- Four primary low-skew global clock distribution nets, plus 24 secondary local clock nets
Hierarchical memory system
- LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit Shift Register
- Configurable synchronous dual-ported 4k-bit RAMs
- Fast interfaces to external high-performance RAMs
Flexible architecture that balances speed and density
- Dedicated carry logic for high-speed arithmetic
- Dedicated multiplier support
- Cascade chain for wide-input functions
- Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset
- Internal 3-state bussing
- IEEE 1149.1 boundary-scan logic
- Die-temperature sensor diode
Supported by FPGA Foundation™ and Alliance Development Systems
- Complete support for Unified Libraries, Relationally
Placed Macros, and Design Manager
- Wide selection of PC and workstation platforms
SRAM-based in-system configuration
- Unlimited re-programmability
- Four programming modes
•0.22
m
m 5-layer metal process
100% factory tested
Description
The Virtex FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 5-layer-metal 0.22
m
m CMOS process. These advances make Virtex FPGAs powerful and flexible alterna­tives to mask-programmed gate arrays. The Virtex family comprises the nine members shown in Table 1.
Building on experience gained from previous generations of FPGAs, the Virtex family represents a revolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the Virtex family delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
0
Virtex™ 2.5 V Field Programmable Gate Arrays
DS003-1 (v2.5 ) April 2, 2001
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Product Specification
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Table 1: Virtex Field-Programmable Gate Array Family Members
Device System Gates CLB Array Logic Cells
Maximum
Available I/O
Block RAM
Bits
Maximum
SelectRAM+ Bits
XCV50 57,906 16x24 1,728 180 32,768 24,576 XCV100 108,904 20x30 2,700 180 40,960 38,400 XCV150 164,674 24x36 3,888 260 49,152 55,296 XCV200 236,666 28x42 5,292 284 57,344 75,264 XCV300 322,970 32x48 6,912 316 65,536 98,304 XCV400 468,252 40x60 10,800 404 81,920 153,600 XCV600 661,111 48x72 15,552 512 98,304 221,184 XCV800 888,439 56x84 21,168 512 114,688 301,056
XCV1000 1,124,022 64x96 27,648 512 131,072 393,216
Virtex 2.5 V Field Programmable Gate Arrays
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Virtex Architecture
Virtex devices feature a flexible, regular architecture that comprises an array of configurable logic blocks (CLBs) sur ­rounded by programmable input/output blocks (IOBs), all interconnected by a r ich hierarchy of fast, versatile rou ting resources. The abundance of routing resources permits the Virtex family to accommodate even the largest and most complex designs.
Virtex FPGAs are SRAM-based, and are customized by loading configuration data into internal memory cells. In some modes, the FPG A reads its own configuration data from an external PROM (master seria l mode). Otherwise, the configuration data is written into the FPGA (Select­MAP, slave serial, and JTAG modes).
The standard Xilinx Foundation and Alliance Series Development systems deliver complete d esign suppor t for Virtex, covering every aspect from behavioral and sche­matic entry, through simulation, automatic design transla­tion and implementati on, to the creati on, downloadin g, and readback of a configuration bit stream.
Higher Performance
Virtex devices provide better performance than previous generations of FPGA. Designs can achieve synchronous system clock rates up to 200 MHz including I/O. Virtex inputs and outputs comply fully with PCI specifications, and interfaces can be implemented that operate at 33 MHz or 66 MHz. Additionally, Virtex supports the hot-swapping requirements of Compact PCI.
Xilinx thoroughly benchmarked the Vir tex family. While per­formance is design-dependent, many designs operated internally at sp eeds in excess of 100 MHz and ca n ach ieve 200 MHz. Table 2 shows performance data for representa­tive circuits, using worst-case timing parameters.
Table 2: Performance for Common Circuit Functions
Function Bits Virtex -6
Register-to-Register
Adder
16 64
5.0 ns
7.2 ns
Pipelined Multiplier 8 x 8
16 x 16
5.1 ns
6.0 ns
Address Decoder 16
64
4.4 ns
6.4 ns 16:1 Multiplexer 5.4 ns Parity Tree 9
18 36
4.1 ns
5.0 ns
6.9 ns Chip-to-Chip HSTL Class IV 200 MHz LVTTL,16mA, fast slew 180 MHz
Virtex 2.5 V Field Programmable Gate Arrays
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DS003-1 (v2.5 ) April 2, 2001 www.xilinx.com Module 1 of 4
Product Specification 1-800-255-7778 3
Virtex Device/Package Combinations and Maximum I/O
Virtex Ordering Information
Table 3: Virtex Family Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)
Package XCV50 XCV100 XCV150 XCV200 XCV300 XCV400 XCV600 XCV800 XCV1000
CS144 94 94 TQ144 98 98 PQ240 166 166 166 166 166 HQ240 166 166 166 BG256 180 180 180 180 BG352 260 260 260 BG432 316 316 316 316 BG560 404 404 404 404 FG256 176 176 176 176 FG456 260 284 312 FG676 404 444 444 FG680 512 512 512
Figure 1: Virtex Ordering Information
XCV300 -6 PQ 240 C
Example:
Temperature Range C = Commercial (T
J
= 0°C to +85°C)
I = Industrial (T
J
= –40°C to +100°C)
Number of Pins
Device Type
Speed Grade
-4
-5
-6
Package Type BG = Ball Grid Array
FG = Fine-pitch Ball Grid Array PQ = Plastic Quad Flat Pack HQ = High Heat Dissipation QFP TQ = Thin Quad Flat Pack CS = Chip-scale Package
Virtex 2.5 V Field Programmable Gate Arrays
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Revision History
Virtex Data Sheet
The Virtex Data Sheet contains the following modules:
DS003-1, Virtex 2.5V FPGAs:
Introduction and Ordering Information (Module 1)
DS003-2, Virtex 2.5V FPGAs:
Functional Description (Module 2)
DS003-3, Virtex 2.5V FPGAs:
DC and Switching Characteristics (Module 3)
DS003-4, Virtex 2.5V FPGAs:
Pinout Tables (Module 4)
Date Version Revision
11/98 1.0 Initial Xilinx release. 01/99 1.2 Updated package drawings and specs. 02/99 1.3 Update of package drawings, updated specifications. 05/99 1.4 Addition of package drawings and specifications. 05/99 1.5 Replaced FG 676 & FG680 package drawings. 07/99 1.6 Changed Boundary Scan Information and changed Figure 11, Boundary Scan Bit
Sequence. Updated IOB Input & Output delays. Added Capacitance info for different I/O Standards. Added 5 V tolerant information. Added DLL Parameters and waveforms and new Pin-to-pin Input and Output Parameter tables for Global Clock Input to Output and Setup and Hold. Changed Configuration Information including Figures 12, 14, 17 & 19. Added device-dependent listings for quiescent currents ICCINTQ and ICCOQ. Updated IOB Input and Output Delays based on default standard of LVTTL, 12 mA, F ast Slew Rate . Added IOB Input Switching Characteristics Standard Adjustments.
09/99 1.7 Speed grade update to preliminary status, Power-on specification and Clock-to-Out
Minimums additions, “0” hold time listing explanation, quiescent current listing update, and Figure 6 ADDRA input label correction. Added T
IJITCC
parameter, changed T
OJIT
to
T
OPHASE
.
01/00 1.8 Update to speed.txt file 1.96. Corrections for CRs 111036,111137, 112697, 115479,
117153, 117154, and 117612. Modified notes for Recommended Operating Conditions (voltage and temperature). Changed Bank information for V
CCO
in CS144 package on p.43.
01/00 1.9 Updated DLL Jitter Parameter table and waveforms, added Delay Measurement
Methodology table for different I/O standards, changed buffered Hex line info and Input/Output Timing measurement notes.
03/00 2.0 New TBCKO v alues; corrected FG680 package connection drawing; new note about status
of CCLK pin after configuration. 05/00 2.1 Modified Pins not listed ...” statement. Speed grade update to Final status. 05/00 2.2 Modified Table 18. 09/00 2.3
Added XCV400 values to table under Minimum Clock-to-Out for Virtex Devices.
Corrected Units column in table under IOB Input Switching Characteristics.
Added values to table under CLB SelectRAM Switching Characteristics.
10/00 2.4
Corrected Pinout information for devices in the BG256, BG432, and BG560 packages in Table 18.
Corrected BG256 Pin Function Diagram.
04/01 2.5
Revised minimums for Global Clock Set-Up and Hold for LVTTL Standard, with DLL.
Converted file to modularized format. See Virtex Data Sheet section.
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