Xicor X84256 Technical data

查询X84256供应商



Preliminary
256K MPS

X84256

µPort Saver EEPROM

FEATURES

• Up to 10MHz data transfer rate

• 25ns Read Access Time

• Direct Interface to Microprocessors and
Microcontrollers
—Eliminates I/O port requirements
—No interface glue logic required
—Eliminates need for parallel to serial converters

• Low Power CMOS
—2.5V–5.5V and 5V ±10% Versions
—Standby Current Less than 1µA
—Active Current Less than 3mA

• Byte or Page Write Capable
—64-Byte Page Write Mode

• Typical Nonvolatile Write Cycle Time: 2ms

• High Reliability
—1,000,000 Endurance Cycles
—Guaranteed Data Retention: 100 Years

• Small Packages Options
—8, 16-Lead SOIC Packages
—14-Lead TSSOP Packages
—8-Lead XBGA Packages

DESCRIPTION

The µPort Saver memories need no serial ports or spe­cial hardware and connect to the processor memory bus.
Replacing bytewide data memory, the µPort Saver uses
bytewide memory control functions, takes a fraction of
the board space and consumes much less power.
Replacing serial memories, the µPort Saver provides all
the serial benefits, such as low cost, low power, low volt­age, and small package size while releasing I/Os for
more important uses.

The µPort Saver memory outputs data within 25ns of an
active read signal. This is less than the read access time
of most hosts and provides “no-wait-state” operation.
This prevents bottlenecks on the bus. With rates to 10
MHz, the µPort Saver supplies data faster than required
by most host read cycle specifications. This eliminates
the need for software NOPs.

The µPort Saver memories communicate over one line
of the data bus using a sequence of standard bus read
and write operations. This “bit serial” interface allows the
µPort Saver to work well in 8-bit, 16 bit, 32-bit, and 64-bit
systems.



EEPROM

BLOCK DIAGRAM

System Connection

P0/CS

Ports
Saved

P1/CLK
P2/DI
P3/DO

µP
µC

DSP

ASIC
RISC

A15

A0
D7

D0

OE

WE

A Write Protect (WP

) pin prevents inadvertent writes to

the memory .
Xicor EEPROMs are designed and tested for applica-

tions requiring extended endurance. Inherent data reten­tion is greater than 100 years.

Internal Block Diagram

MPS

WP

CE

I/O

OE

WE

COMMAND

DECODE

AND

CONTROL

LOGIC

DEC

H.V. GENERATION

TIMING & CONTROL

X

Y DECODE

DATA REGISTER

EEPROM

ARRAY
32K x 8

Xicor, Inc. 1998 Patents Pending

1

Characteristics subject to change without notice

X84256 Preliminary

PIN CONFIGURATIONS

Drawings are to the same scale, actual package siz es are
shown in inches:

8-LEAD SOIC

V
NC

OE
WE

V

NC
NC
NC
NC

OE

WE

I/O
CE

V
WP

V

NC
NC
NC
NC
NC

OE

WE

CC

CC

SS

CC

8

7

6
5

8

7

6
5

V

CE

I/O

WP

V

SS

CE

V

CC

NC

WE
OE

CE

V

14-LEAD TSSOP

I/O
NC

NC
NC
WP

SS

16-LEAD SOIC

I/O
NC

NC
NC
NC
WP

SS

1

2
3
4

1
2

3
4

5
6

7

8-LEAD XBGA

14
13

12
11

10

1

2

X84256

3
4

1
2

3
4

5
6

7
8

16
15

14
13

12
11
10

9
8

9

PIN NAMES

I/O Data Input/Output
CE
OE
WE
WP
V

CC

V

SS

Chip Enable Input
Output Enable Input
Write Enable Input
Write Protect Input
Supply Voltage

Ground

NC No Connect

PIN DESCRIPTIONS
Chip Enable (CE)

The Chip Enable input must be LOW to enable all read/
write operations. When CE is HIGH, the chip is dese­lected, the I/O pin is in the high impedance state, and
unless a nonvolatile write operation is underway, the
device is in the standby pow er mode.

Output Enable (OE)

The Output Enable input must be LOW to enable the out­put buffer and to read data from the de vice on the I/O line.

Write Enable (WE)

The Write Enable input must be LOW to write either data
or command sequences to the device.

Data In/Data Out (I/O)

Data and command sequences are serially written to or
serially read from the device through the I/O pin.

Write Protect (WP)

When the Write Protect input is LOW, nonvolatile writes to
the device are disabled. When WP is HIGH, all functions,
including nonvolatile writes, operate normally. If a nonvol­atile write cycle is in progress, WP going LOW will have
no effect on the cycle already underway, but will inhibit
any additional nonvolatile write cycles.

DEVICE OPERATION

The X84256 serial EEPROM is designed to interface
directly with most microprocessor buses. Standard CE,
OE, and WE signals control the read and write opera­tions, and a single l/O line is used to send and receive
data and commands serially .

2

X84256 Preliminary

Data Timing

Data input on the l/O line is latched on the rising edge of
either WE or CE, whichever occurs first. Data output on
the l/O line is active whenev er both OE and CE are LO W.
Care should be taken to ensure that WE and OE are
never both LO W while CE is LO W .

Read Sequence

A read sequence consists of sending a 16-bit address
followed by the reading of data serially. The address is
written by issuing 16 separate write cycles (WE and CE
LOW, OE HIGH) to the part without a read cycle between
the write cycles. The address is sent serially, most signifi­cant bit first, over the I/O line. Note that this sequence is
fully static, with no special timing restrictions, and the
processor is free to perform other tasks on the bus when­ever the device CE pin is HIGH. Once the 16 address
bits are sent, a byte of data can be read on the I/O line by
issuing 8 separate read cycles (OE and CE LOW, WE
HIGH). At this point, writing a ‘1’ will terminate the read
sequence and enter the low power standby state, other­wise the device will await further reads in the sequential
read mode.

Sequential Read

The byte address is automatically incremented to the
next higher address after each byte of data is read. The
data stored in the memory at the next address can be
read sequentially by continuing to issue read cycles.
When the highest address in the array is reached, the
address counter rolls over to address $0000 and reading
may be continued indefinitely.

Reset Sequence

The reset sequence resets the device and sets an inter­nal write enable latch. A reset sequence can be sent at
any time by performing a read/write “0”/read operation
(see Figs. 1 and 2). This breaks the multiple read or write
cycle sequences that are normally used to read from or
write to the part. The reset sequence can be used at any
time to interrupt or end a sequential read or page load.
As soon as the write “0” cycle is complete, the part is
reset (unless a nonvolatile write cycle is in progress). The
second read cycle in this sequence, and any further read
cycles, will read a HIGH on the l/O pin until a valid read
sequence (which includes the address) is issued. The
reset sequence must be issued at the beginning of both
read and write sequences to be sure the device initiates
these operations properly .

Write Sequence

A nonvolatile write sequence consists of sending a reset
sequence, a 16-bit address, up to 64 bytes of data, and
then a special “start nonvolatile write cycle” command
sequence.

The reset sequence is issued first (as described in the
Reset Sequence section) to set an internal write enable
latch. The address is written serially by issuing 16
separate write cycles (WE

and CE LOW, OE HIGH) to
the part without any read cycles between the writes. The
address is sent serially, most significant bit first, on the
l/O pin. Up to 64 bytes of data are written by issuing a
multiple of 8 write cycles. Again, no read cycles are
allowed between writes.

CE

OE

WE

"0"

I/O (IN)

I/O (OUT)

RESET

WHEN ACCESSING: X84256 ARRAY: A15=0

A15 A14 A13 A12 A11

A10

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

D7 D6 D5 D4 D3 D2 D1 D0

LOAD ADDRESS READ DATA

Figure 1. Read Sequence

3

X84256 Preliminary

CE

OE

WE

"0"

I/O (IN)

I/O (OUT)

RESET LOAD ADDRESS LOAD DATA START

WHEN ACCESSING: X84256 ARRAY: A15=0

A15 A14 A13 A12 A11

A10

A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0

A9

Figure 2. Write Sequence

The nonvolatile write cycle is initiated by issuing a special
read/write “1”/read sequence. The first read cycle ends
the page load, then the write “1” followed by a read starts
the nonvolatile write cycle. The device recognizes 64­byte pages (e.g., beginning at addresses XXXXXXXXX
000000 for X84256).

When sending data to the part, attempts to exceed the
upper address of the page will result in the address
counter “wrapping-around” to the first address on the
page, where data loading can continue. For this reason,
sending more than 512 consecutive data bits will result in
overwriting previous data.

A nonvolatile write cycle will not start if a partial or incom­plete write sequence is issued. The inter nal wr ite enable
latch is reset when the nonvolatile write cycle is com­pleted and after an invalid write to prevent inadvertent
writes. Note that this sequence is fully static , with no spe­cial timing restrictions. The processor is free to perform
other tasks on the bus whenever the chip enable pin
(CE) is HIGH.

Nonvolatile Write Status

The status of a nonvolatile write cycle can be determined
at any time by simply reading the state of the l/O pin on
the device. This pin is read when OE and CE are LOW
and WE is HIGH. During a nonvolatile write cycle the l/O
pin is LOW. When the non volatile write cycle is complete,
the l/O pin goes HIGH. A reset sequence can also be
issued during a nonvolatile write cycle with the same

"1"

"0"

NONVOLATILE

WRITE

result: I/O is LOW as long as a nonvolatile write cycle is
in progress, and l/O is HIGH when the nonvolatile write
cycle is done.

Low Power Operation

The device enters an idle state, which draws minimal
current when:

• an illegal sequence is entered. The following are the
more common illegal sequences:

—Read/Write/Write—any time
—Read/Write ‘1’—When writing the address or writ-

ing data.

SYMBOL TABLE

WAVEFORM INPUTS OUTPUTS

Must be
steady

May change
from LOW to
HIGH

May change
from HIGH to
LOW

Don’t Care:
Changes
Allowed

N/A Center Line

Will be
steady

Will change
from LOW to
HIGH

Will change
from HIGH to
LOW

Changing:
State Not
Known

is High
Impedance

4

µ

µ

µ

X84256 Preliminary

—Write ‘1’—when reading data
—Read/Read/Write ‘1’—after data is written to device,

but before entering the NV write sequence.
—the device powers-up;
—a nonvolatile write operation completes.

While a sequential read is in progress, the device remains
in an active state. This state draws more current than the
idle state, but not as much as during a read itself. To go
back to the lowest pow er condition, an inv alid condition is
created by writing a ‘1’ after the last bit of a read operation.

Write Protection

The following circuitry has been included to prevent
inadvertent nonvolatile writes:

—A special “start nonvolatile write” command sequence

is required to start a nonvolatile write cycle.

ABSOLUTE MAXIMUM RATINGS*

Temperature under Bias......................–65°C to +135°C

Storage Temperature...........................–65°C to +150°C

T erminal V oltage with

Respect to V

.......................................–1V to +7V

SS

DC Output Current................................................... 5mA

Lead Temperature (Soldering, 10 seconds)..........300°C

RECOMMENDED OPERATING CONDITIONS

Temperature Min. Max.

Commercial 0°C +70°C

Industrial –40°C +85°C

Military† –55°C +125°C

*COMMENT

Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and the functional operation
of the device at these or any other conditions above
those indicated in the operational sections of this speci­fication is not implied. Exposure to absolute maximum
rating conditions for e xtended periods ma y affect device
reliability.

Supply Voltage Limits

X84256 5V ± 10%
X84256 – 2.5 2.5V to 5.5V
X84256 – 1.8 1.8V to 3.6V

D.C. OPERATING CHARACTERISTICS (V

= 5V ± 10%)

CC

(Over the recommended operating conditions, unless otherwise specified.)

Limits

Symbol Parameter

I

CC1

I

CC2

I

SB1

I

LI

I

LO

(1)

V

lL

(1)

V

IH

V

OL

V

OH

Notes: (1) V

V

Supply Current (Read) 1 mA OE = V

CC

V

Supply Current (Write)

CC

V

Standby Current

CC

3mA

1
Input Leakage Current 10
Output Leakage Current 10

V

Input LOW Voltage –0.5

V

Input HIGH Voltage

x 0.7 V

CC

CC
CC

x 0.3

+ 0.5
Output LOW Voltage 0.4 V

V

Output HIGH Voltage

Min. and V

IL

Max. are f or reference only and are not tested.

IH

CC

– 0.8

Units Test ConditionsMin. Max.

, WE = V

IL

IH

,

I/O = Open, CE clocking @ 10MHz

During Nonvolatile Write Cycle

I

CC

All Inputs at CMOS Levels
CE = V

A

V

A
A

V

IN
OUT

, Other Inputs = V

CC

= V

to V

SS

= V

to V

SS

CC

CC

CC

or V

SS

V
V

I

= 2.1mA

OL

I

V

= –1mA

OH

5

X84256 Preliminary

D.C. OPERATING CHARACTERISTICS (V

= 2.5V to 5.5V)

CC

(Over the recommended operating conditions, unless otherwise specified.)

Limits

Symbol Parameter

Units Test Conditions

Min. Max.

I

CC1

I

CC2

I

SB1

I

LI

I

LO

(1)

V

lL

(1)

V

IH

V

OL

V

OH

D.C. OPERATING CHARACTERISTICS (V

VCC Supply Current (Read)

VCC Supply Current (Write)
VCC Standby Current

1mA

3mA

1µA
Input Leakage Current 10 µA
Output Leakage Current 10 µA
Input LOW Voltage –0.5

Input HIGH Voltage

VCC x 0.7 VCC + 0.5

VCC x 0.3

Output LOW Voltage 0.4 V
Output HIGH Voltage

VCC – 0.4

= 1.8V to 3.6V)

CC

(Over the recommended operating conditions, unless otherwise specified.)

OE = VIL, WE = VIH,
I/O = Open, CE clocking @ 5MHz

ICC During Nonvolatile Write Cycle
All Inputs at CMOS Levels

CE = VCC, Other Inputs = VCC or V
VIN = VSS to V
V

= VSS to V

OUT

CC

CC

V
V

IOL = 1mA, VCC = 3V
IOH = –400µA, VCC = 3V

V

SS

Symbol Parameter

I

CC1

I

CC2

I

SB1

I

LI

I

LO

(1)

V

lL

(1)

V

IH

V

OL

V

OH

Notes: (1) V

VCC Supply Current (Read)

VCC Supply Current (Write)
VCC Standby Current

Input Leakage Current 10 µA
Output Leakage Current 10 µA
Input LOW Voltage –0.5

Input HIGH Voltage
Output LOW Voltage 0.4 V
Output HIGH Voltage

Min. and V

IL

Max. are f or reference only and are not tested.

IH

Limits

Min. Max.

500 µA

2mA

1µA

VCC x 0.3

VCC x 0.7 VCC + 0.5

VCC – 0.2

Units Test Conditions

OE = VIL, WE = VIH,
I/O = Open, CE clocking @ 3MHz

ICC During Nonvolatile Write Cycle
All Inputs at CMOS Levels

CE = VCC, Other Inputs = VCC or V
VIN = VSS to V
V

= VSS to V

OUT

CC

CC

V
V

IOL = 0.5mA, VCC = 2V
IOH = –250µA, VCC = 2V

V

SS

6

X84256 Preliminary

CAPACITANCE TA = +25°C, f = 1MHz, VCC = 5V

Symbol Parameter Max. Units Test Conditions

(2)

C

I/O

(2)

C

IN

Notes: (2) Periodically sampled, but not 100% tested.

Input/Output Capacitance 8 pF
Input Capacitance 6 pF

POWER-UP TIMING

Symbol Parameter Max. Units

(3)

t

PUR

t

PUW

(3)

Power-up to Read Operation 2 ms
Power-up to Write Operation 5 ms

V

= 0V

I/O

VIN = 0V

Notes: (3) Time delays required from the time the VCC is stable until the specific operation can be initiated.

Periodically sampled, but not 100% tested.

A.C. CONDITIONS OF TEST

Input Pulse Levels

VCC x 0.1 to VCC x 0.9
Input Rise and Fall Times 5ns
Input and Output Timing Levels

VCC x 0.5

EQUIVALENT A.C. LOAD CIRCUITS

2.06KΩ

OUTPUT

3.03KΩ

5V

30pF

7008 FRM F06

2.39KΩ

OUTPUT

4.58KΩ

3V

OUTPUT

30pF

7008 FRM F07

2.8KΩ

5.6KΩ

2V

30pF

7

X84256 Preliminary

A.C. CHARACTERISTICS

(Over the recommended operating conditions, unless otherwise specified.)

Read Cycle Limits – X84256

VCC = 5V±10% VCC = 2.5V – 5.5V VCC = 1.8V – 3.6V

Symbol Parameter

t

RC

t

CE

t

OE

t

OEL

t

OEH

t

LOW

t

HIGH

(4)

t

LZ

(4)

t

HZ

t

OLZ

t

OHZ

t

OH

t

WES

t

WEH

Notes: (4) Periodically sampled, but not 100% tested. tHZ and t

Read Cycle Time 100 200 330 ns
CE Access Time 25 50 70 ns
OE Access Time 25 50 70 ns
OE Pulse Width 50 60 90 ns
OE High Recovery Time 50 60 90 ns
CE LOW Time 50 70 90 ns
CE HIGH Time 50 120 180 ns
CE LOW to Output In Low Z 0 0 0 ns

CE HIGH to Output In High Z 0 25 0 30 0 35 ns

(4)

OE LOW to Output In Low Z 0 0 0 ns

(4)

OE HIGH to Output In High Z 0 25 0 30 0 35 ns
Output Hold from CE or OE HIGH 0 0 0 ns
WE HIGH Setup Time 25 25 25 ns
WE HIGH Hold Time 25 25 25 ns

first) to the time when I/O is no longer being driven into a 5pF load.

are measured from the point where CE or OE goes HIGH (whichever occurs

OHZ

UnitsMin. Max Min. Max. Min. Max.

CE

WE

OE

I/O

t

WES

t

RC

t

LOW

t

CE

t

OEL

t

OE

DATA

t

t
t

OLZ
LZ

OH

8

t

HIGH

t

WEH

t

OHZ

t

HZ

t

OEH

HIGH Z

X84256 Preliminary

Write Cycle Limits – X84256

Symbol Parameter

(5)

t

NVWC

t

WC

t

WP

t

WPH

t

CS

t

CH

t

CP

t

CPH

t

OES

t

OEH

(6)

t

DS

(6)

t

DH

t

WPSU

t

WPHD

Nonvolatile Write Cycle Time 5 5 5 ms
Write Cycle Time 100 200 330 ns

WE Pulse Width 25 40 70 ns
WE HIGH Recovery Time 65 150 200 ns
Write Setup Time 0 0 0 ns
Write Hold Time 0 0 0 ns
CE Pulse Width 25 40 70 ns
CE HIGH Recovery Time 65 150 200 ns
OE HIGH Setup Time 25 25 50 ns
OE HIGH Hold Time 25 25 50 ns
Data Setup Time 12 20 30 ns

Data Hold Time 5 5 5 ns

(7)

WP HIGH Setup 100 100 150 ns

(7)

WP HIGH Hold 100 100 150 ns

VCC = 5V ±10% VCC = 2.5V – 5.5V VCC = 1.8V – 3.6V

Units

Min. Max. Min. Max. Min. Max.

Notes: (5) t

(6) Data is latched into the X84256 on the rising edge of CE or WE, whichev er occurs first.

(7) Periodically sampled, but not 100% tested.

is the time from the falling edge of OE or CE (whichever occurs last) of the second read cycle in the “start nonvolatile write cycle”

NVWC

sequence until the self-timed, internal nonvolatile write cycle is completed.

9

X84256 Preliminary

CE Controlled Write Cycle

t

CPH

t

CP

CE

OE

WE

WP

I/O

WE Controlled Write Cycle

CE

t

WPSU

t

OES

t

OES

t

CS

t

t

t

DS

CP

WP

t

OEH

t

CH

t

WPHD

DATA

t

WC

t

WPH

t

DH

HIGH Z

t

CPH

OE

WE

WP

I/O

t

WPSU

t

CS

t

t

DS

WP

t

CH

t

OEH

DATA

t

WC

t

WPH

t

WPHD

t

DH

HIGH Z

10

X84256 Preliminary

PACKAGING INFORMATION

8-LEAD XBGA

X84256: Bottom View

D1

V

I/O

B

CE

V

SS

e

A

WP

CC

NC

C

WE

OE

D

D

E

A1

E

A1

NOTE: ALL DIMENSIONS IN µM

ALL DIMENSIONS ARE TYPICAL VALUES

11

X84256 Preliminary

PACKAGING INFORMATION

8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S

PIN 1 INDEX

(4X) 7°

0.050 (1.27)

0.010 (0.25)

0.020 (0.50)

X 45°

PIN 1

0.014 (0.35)

0.019 (0.49)

0.188 (4.78)

0.197 (5.00)

0.150 (3.80)

0.158 (4.00)

0.004 (0.19)

0.010 (0.25)

0.228 (5.80)

0.244 (6.20)

0.053 (1.35)

0.069 (1.75)

0.050"TYPICAL

0° – 8°

0.0075 (0.19)

0.010 (0.25)

0.016 (0.410)

0.037 (0.937)

0.250"

FOOTPRINT

NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)

12

0.050"
TYPICAL

0.030"

TYPICAL

8 PLACES

X84256 Preliminary

16-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S

PIN 1 INDEX

(4X) 7°

0.050 (1.27)

PIN 1

0.010 (0.25)

0.020 (0.50)

X 45°

0.014 (0.35)

0.020 (0.51)

0.386 (9.80)

0.394 (10.01)

0.150 (3.80)

0.158 (4.00)

0.004 (0.19)

0.010 (0.25)

0.228 (5.80)

0.244 (6.20)

0.053 (1.35)

0.069 (1.75)

0.050" Typical

0° – 8°

0.0075 (0.19)

0.010 (0.25)

0.016 (0.410)

0.037 (0.937)

0.250"

FOOTPRINT

NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)

13

0.030" Typical
16 Places

0.050"

Typical

X84256 Preliminary

PACKAGING INFORMATION

14-LEAD PLASTIC, TSSOP, PACKAGE TYPE V

.025 (.65) BSC

0° – 8°

.0075 (.19)

.0118 (.30)

.193 (4.9)
.200 (5.1)

.019 (.50)
.029 (.75)

DetailA (20X)

.169 (4.3)
.177 (4.5)

.047 (1.20)

.002 (.05)
.006 (.15)

.010 (.25)

Seating Plane

.252 (6.4) BSC

Gage Plane

.031 (.80)

.041 (1.05)

See Detail “A”

NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)

14

X84256 Preliminary

ORDERING INFORMATION

Device

*PART MARK CONVENTION
14-Lead TSSOP

YWW

84256

F = 2.5 to 5.5V, 0 to +70°C
G = 2.5 to 5.5V, -40 to +85°C
Blank = 4.5 to 5.5V, 0 to +70°C
I = 4.5 to 5.5V, -40 to +85°C

X84256 X X

–X

8-Lead SOIC

X84256 X

Blank = 8-Lead SOIC

XX

F = 2.5 to 5.5V, 0 to +70°C
G = 2.5 to 5.5V, -40 to +85°C
Blank = 4.5 to 5.5V, 0 to +70°C
I = 4.5 to 5.5V, -40 to +85°C

VCC Range

Blank = 4.5V to 5.5V, 10 MHz

2.5 = 2.5V to 5.5V, 5 MHz

1.8 = 1.8V to 3.6V, 3MHz (contact factory)

Temperature Range

Blank = Commercial = 0°C to +70°C
I = Industrial = –40°C to +85°C

Military = –55°C to +125°C (contact factory)

Packages:
X84256

S8 = 8-Lead SOIC
S16 = 16-Lead SOIC
V14 = 14-Lead TSSOP
Z = 8-Lead XBGA

8-Lead XBGA

Complete Part Number Top Mark

X84256Z–2.5
X84256ZI–2.5

XABA
XABB

LIMITED WARRANTY

Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc.
makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the
described devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the
right to discontinue production and change specifications and prices at any time and without notice.

Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents,
licenses are implied.

U.S. PATENTS

Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481;
4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967;
4,883, 976. F oreign patents and additional patents pending.

LIFE RELA TED POLICY

In situations where semiconductor component failure may endanger life, system designers using this product should design the system with
appropriate error detection and correction, redundancy and back-up features to prev ent such an occurence.

Xicor's products are not authorized for use in critical components in life support devices or systems.

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain
life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury to the user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or system, or to affect its saf ety or effectiveness.

15