Detected
—User Enabled Option
—Open Drain AUTOSTORE Status Output Pin
• Power-on Recall
—E2PROM Data Automatically Recalled Into
RAM Upon Power-up
• Software Data Protection
—Locks Out Inadvertent Store Operations
• Low Power CMOS
—Standby: 250µA
• Infinite E
and Write Cycles
PIN CONFIGURATION
2
PROM Array Recall, and RAM Read
DESCRIPTION
The Xicor X20C16 is a 2K x 8 NOVRAM featuring a highspeed static RAM overlaid bit-for-bit with a nonvolatile
electrically erasable PROM (E2PROM) and the
AUTOSTORE feature which automatically saves the
RAM contents to E2PROM at power-down. The X20C16
is fabricated with advanced CMOS floating gate technology to achieve high speed with low power and wide
power-supply margin. The X20C16 features a compatible JEDEC approved pinout for byte-wide memories,
for industry standard RAMs, ROMs, EPROMs, and
E2PROMs.
The NOVRAM design allows data to be easily transferred from RAM to E2PROM (store) and E2PROM to
RAM (recall). The store operation is completed in 5ms or
less and the recall operation is completed in 10µs or
less. An automatic array recall operation reloads the
contents of the E2PROM into RAM upon power-up.
Xicor NOVRAMS are designed for unlimited write
operations to RAM, either from the host or recalls from
E2PROM, and a minimum 1,000,000 store operations to
the E2PROM. Data retention is specified to be greater
than 100 years.
The Address inputs select an 8-bit memory location
during a read or write operation.
Chip Enable (CE)
The Chip Enable input must be LOW to enable all read/
write operations. When CE is HIGH, power consumption
is reduced.
Output Enable (OE)
The Output Enable input controls the data output buffers
and is used to initiate read and recall operations. Output
Enable LOW disables a store operation regardless of
the state of CE, WE, or NE.
Data In/Data Out (I/O0–I/O7)
Data is written to or read from the X20C16 through the
I/O pins. The I/O pins are placed in the high impedance
state when either CE or OE is HIGH or when NE is LOW.
Write Enable (WE)
The Write Enable input controls the writing of data to the
static RAM.
FUNCTIONAL DIAGRAM
Nonvolatile Enable (NE)
The Nonvolatile Enable input controls the recall function
to the E2PROM array.
AUTOSTORE Output (AS)
AS is an open drain output which, when asserted indi-
cates VCC has fallen below the AUTOSTORE threshold
(V
). AS may be wire-ORed with multiple open drain
ASTH
outputs and used as an interrupt input to a microcontroller.
The CE, OE, WE, and NE inputs control the X20C16
operation. The X20C16 byte-wide NOVRAM uses a
2-line control architecture to eliminate bus contention in
a system environment. The I/O bus will be in a high
impedance state when either OE or CE is HIGH, or
when NE is LOW.
RAM Operations
RAM read and write operations are performed as they
would be with any static RAM. A read operation requires
CE and OE to be LOW with WE and NE HIGH. A write
operation requires CE and WE to be LOW with NE
HIGH. There is no limit to the number of read or write
operations performed to the RAM portion of the X20C16.
Memory Transfer Operations
There are two memory transfer operations: a recall
operation whereby the data stored in the E2PROM array
is transferred to the RAM array; and a store operation
which causes the entire contents of the RAM array to be
stored in the E2PROM array.
Recall operations are performed automatically upon
power-up and under host system control when NE, OE
and CE are LOW and WE is HIGH. The recall operation
takes a maximum of 5µs.
SDP (Software Data Protection)
There are two methods of initiating a store operation.
The first is the software store command. This command
takes the place of the hardware store employed on the
X20C04. This command is issued by entering into the
special command mode: NE, CE, and WE strobe LOW
while at the same time a specific address and data
combination is sent to the device. This is a three step
operation: the first address/data combination is 555[H]/
AA[H]; the second combination is 2AA[H]/55[H]; and the
final command combination is 555[H]/33[H]. This sequence of pseudo write operations will immediately
initiate a store operation. Refer to the software command timing diagrams for details on set and hold times
for the various signals.
The second method of storing data is with the
AUTOSTORE command. When enabled, data is auto-
matically stored from the RAM into the E2PROM array
whenever VCC falls below the preset Autostore threshold. This feature is enabled by performing the first two
steps for the software store with the command combination being 555[H]/CC[H].
The AUTOSTORE feature is disabled by issuing the
three step command sequence with the command combination being 555[H]/CD[H]. The AUTOSTORE feature
will also be reset if VCC falls below the power-up reset
threshold (approximately 3.5V) and is then raised back
into the operation range.
Write Protection
The X20C16 supports two methods of protecting the
nonvolatile data.
—If after power-up the AUTOSTORE feature is not
enabled, no AUTOSTORE can occur.
—VCC Sense – All functions are inhibited when VCC is
≤ 3.0V typical.
SYMBOL TABLE
The following symbol table provides a key to understanding the conventions used in the device timing
diagrams. The diagrams should be used in conjunction
with the device timing specifications to determine actual
device operation and performance, as well as device
suitability for user’s application.
WAVEFORM
INPUTS
Must be
steady
May change
from LOW
to HIGH
May change
from HIGH
to LOW
Don’t Care:
Changes
Allowed
N/A
OUTPUTS
Will be
steady
Will change
from LOW
to HIGH
Will change
from HIGH
to LOW
Changing:
State Not
Known
Center Line
is High
Impedance
3
X20C16
ABSOLUTE MAXIMUM RATINGS*
Temperature under Bias .................. –65°C to +135°C
Storage Temperature ....................... –65°C to +150°C
Voltage on any Pin with
Respect to V
.......................................
SS
–1V to +7V
D.C. Output Current ........................................... 10mA
Lead Temperature (Soldering, 10 seconds)...... 300°C
RECOMMENDED OPERATING CONDITIONS
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and the functional operation of
the device at these or any conditions other than those
indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Endurance100,000Data Changes Per Bit
Store Cycles1,000,000Store Cycles
Data Retention100Years
MODE SELECTION
CEWENEOEModeI/OPower
HXXXNot SelectedOutput High ZStandby
LHHLRead RAMOutput DataActive
LLHHWrite “1” RAMInput Data HighActive
LLHHWrite “0” RAMInput Data LowActive
LHLLArray RecallOutput High ZActive
LLLHSoftware CommandInput DataActive
LHHHOutput DisabledOutput High ZActive
LLLLNot AllowedOutput High ZActive
LHLHNo OperationOutput High ZActive
3826 PGM T07.1
3826 PGM T09
EQUIVALENT A.C. LOAD CIRCUITA.C. CONDITIONS OF TEST
Input Pulse Levels0V to 3V
5V
Input Rise and
Fall Times5ns
735Ω
Input and Output
Timing Levels1.5V
OUTPUT
318Ω
30pF
3826 FHD F04
3826 PGM T08.1
5
X20C16
A.C. CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified)
Read Cycle Limits
X20C16-35
–40 to +85°CX20C16-45X20C16-55
SymbolParameter Min. Max.Min.Max.Min.Max.Units
t
RC
t
CE
t
AA
t
OE
(3)
t
LZ
(3)
t
OLZ
(3)
t
HZ
(3)
t
OHZ
t
OH
Read Cycle
ADDRESS
CE
Read Cycle Time354555ns
Chip Enable Access Time354555ns
Address Access Time354555ns
Output Enable Access Time202530ns
Chip Enable to Output in Low Z000ns
Output Enable to Output in Low Z000ns
Chip Disable to Output in High Z0150200 25ns
Output Disable to Output in High Z0150200 25ns
Output Hold From Address Change000ns
3826 PGM T10
t
RC
t
CE
t
t
OE
OE
OE
WE
DATA I/O
Note: (3) tLZ min., tHZ, t
CL = 5pF, from the point when CE or OE return HIGH (whichever occurs first) to the time when the outptus are no longer driven.
min., and t
OLZ
t
OLZ
t
LZ
DATA VALID
are periodically sampled and not 100% tested. tHZ max. and t
OHZ
6
t
OH
t
AA
t
HZ
DATA VALID
max. are measured, with
OHZ
t
OHZ
3826 FHD F05
X20C16
Write Cycle Limits
X20C16-35X20C16-45X20C16-55
SymbolParameter Min. Max.Min.Max.Min.Max.Units
t
WC
t
CW
t
AS
t
WP
t
WR
t
DW
t
DH
(4)
t
WZ
(4)
t
OW
(4)
t
OZ
WE Controlled Write Cycle
Write Cycle Time354555ns
Chip Enable to End of Write Input303540ns
Address Setup Time000ns
Write Pulse Width303540ns
Write Recovery Time000ns
Data Setup to End of Write152025ns
Data Hold Time333ns
Write Enable to Output in High Z152025ns
Output Active from End of Write555ns
Output Enable to Output in High Z152025ns
3826 PGM T11
ADDRESS
OE
CE
WE
DATA OUT
DATA IN
t
AS
t
OZ
t
t
CW
WC
t
WP
t
DW
DATA VALID
t
DH
t
WR
t
OW
3826 FHD F06
Note: (4) tWZ, tOW, tOZ are periodically sampled and not 100% tested.
7
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