WOLFSPEED CSD01060A Datasheet

CSD01060

Silicon Carbide Schottky Diode

Zero recovery® RectifieR

V

= 600 V

RRM

IF (T

=135˚C) = 2 A

C

Qc = 3.3 nC

Features

• 600-Volt Schottky Rectier

• Zero Reverse Recovery Current

• Zero Forward Recovery Voltage

• High-Frequency Operation

• Temperature-Independent Switching Behavior

• Extremely Fast Switching

• Positive Temperature Coefcient on V

Benets

F

• Replace Bipolar with Unipolar Rectiers

• Essentially No Switching Losses

• Higher Efciency

• Reduction of Rectier Heat Sink

• Parallel Devices Without Thermal Runaway

Applications

• Switch Mode Power Supplies

• Power Factor Correction

- Typical PFC P

• Motor Drives

- Typical Power : 0.25HP-0.5HP

: 100W-200W

out

Package

TO-252-2 TO-220-2

PIN 1

CASE

PIN 2

Part Number Package Marking

CSD01060A TO-220-2 CSD01060

CSD01060E TO-252-2 CSD01060

Maximum Ratings (T

= 25 ˚C unless otherwise specied)

C

Symbol Parameter Value Unit Test Conditions Note

V

RRM

V

RSM

V

I

FRM

I

FSM

I

FSM

P

TJ , T

Repetitive Peak Reverse Voltage 600 V

Surge Peak Reverse Voltage 600 V

DC Blocking Voltage 600 V

DC

Continuous Forward Current

F

Repetitive Peak Forward Surge Current

Non-Repetitive Peak Forward Surge Current 9 A TC=25˚C, tP=1.5 ms, Half Sine Wave

Non-Repetitive Peak Forward Surge Current 32 A TC=25˚C, tP=10 µs, Pulse

Power Dissipation

tot

Operating Junction and Storage Temperature

stg

TO-220 Mounting Torque

4 2 1

7

5.5

21.4

7.1

-55 to

+175

1

8.8Nmlbf-in

TC=25˚C

A

TC=135˚C TC=158˚C

TC=25˚C, tP=10 ms, Half Sine Wave

A

TC=125˚C, tP=10 ms, Half Sine Wave

TC=25˚C

W

TC=125˚C

˚C

M3 Screw 6-32 Screw

1 CSD01060 Rev. P

Electrical Characteristics

TJ 25 ° C T

J

100 ° C

T

J

200 ° C

Symbol Parameter Typ. Max. Unit Test Conditions Note

V

I

Q

Forward Voltage

F

Reverse Current

R

Total Capacitive Charge 3.3 nC

C

1.6

2.0

20 40

1.8

2.4

100 500

V

μA

80

C Total Capacitance

11

pF

8.5

Note:

1. This is a majority carrier diode, so there is no reverse recovery charge.

Thermal Characteristics

Symbol Parameter Typ. Unit

R

θJC

R

θJA

Typical Performance

Thermal Resistance from Junction to Case 7 °C/W

Thermal Resistance from Junction to Ambient 60 ˚C/W

IF = 1 A TJ=25°C IF = 1 A TJ=175°C

VR = 600 V TJ=25°C VR = 600 V TJ=150°C

VR = 600 V, IF = 1 A di/dt = 500 A/μs TJ = 25°C

VR = 0 V, TJ = 25°C, f = 1 MHz VR = 200 V, TJ = 25˚C, f = 1 MHz VR = 400 V, TJ = 25˚C, f = 1 MHz

2.0

1.8

1.6

TJ = 25°C TJ = 50°C TJ = 100°C TJ = 150°C

1.4

1.2

1.0

0.8

Forward Current (A)

0.6

F

I

0.4

0.2

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

VF Forward Voltage (V)

50

TJ = 25°C TJ = 100°C

TJ = 25°C

40

30

20

Reverse Current (μA)

R

IR Reverse Current (µA)

I

10

0

0 200 400 600 800 1000

V

R

TJ = 200°C

= 100°C

T

J

T

= 200°C

J

Reverse Voltage (V

Reverse Voltage (V)

V

R

)

Figure 1. Forward Characteristics Figure 2. Reverse Characteristics

2 CSD01060 Rev. P

Current Derating

Typical Performance

14

50

45

50

45

12

10

8

6

Peak Forward Current (A)

4

F(PEAK)

I

2

0

25 50 75 100 125 150 175 200

T

Case Temperature (

C

* Frequency > 1KHz

30% Duty* 50% Duty* 70% Duty*

DC

°

C

)

10% Duty*

Figure 3. Current Derating

40

35

30

25

20

Capacitance (pF)

C Capacitance (pF)

15

C

10

5

0

1 10 100 1000

V

Reverse Voltage (V

Reverse Voltage (V)

V

R

)

Figure 4. Capacitance vs. Reverse Voltage

1.0E+01

1.0E+00

Zth (°C/W)

1.0E-01

1.0E-02

1.E-07 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00

Time (s)

Figure 5. Transient Thermal Impedance

3 CSD01060 Rev. P

Typical Performance

VT R

T

Diode Model CSD01060

Vf T = VT + If*R

30

25

20

15

10

Power Dissipation (W)

5

0

25 50 75 100 125 150 175

T

Case Temperature (

C

°

C

)

Figure 6. Power Derating

Diode Model

T

V

0.94 + (Tj * -1.2*10-3)

T=

R

0.015 + (Tj * 6.4*10-3)

T=

Note: Tj = Diode Junction Temperature In Degrees Celsius

4 CSD01060 Rev. P

Package Dimensions

A

C

E

D

G

H

B

J

L

M

N

F

P

Q

S

T U

V

W

X

Y

M in M ax M in M ax

A .395 .410 10 .033 10.414

B .235 .25 5 5.96 9 6.47 7

C .102 .112 2.591 2 .845

D .337 .337 8 .560 8 .560

E .590 .610 14 .986 15.49 4

F .149 .153 3.785 3.88 6

G 1.127 1.14 7 28 .626 29.13 4

H .530 .550 13.46 2 13.9 70

J

L .028 .03 6 .711 .9 14

M .045 .05 5 1.143 1.397

N .195 .205 4.9 53 5.20 7

P .17 0 .18 0 4.318 4.572

Q .04 8 .054 1.219 1.371

S 3° 5° 3° 5°

T 3° 5° 3° 5°

U 3 ° 5° 3° 5°

V .10 0 .110 2.54 2 .794

W .014 .021 .35 6 .5 33

X 3° 5° 3° 5°

Y .395 .410 10 .033 10.414

Z .130 .150 3.30 2 3.810

Inc he s

M illim ete rs

P OS

R 0.010 R 0.254

1 2

Z

Package TO-220-2

PIN 1

PIN 2

CASE

POS

A .381 .410 9.677 10.414

B .235 .255 5.969 6.477

C .100 .120 2.540 3.048

D .223 .337 5.664 8.560

E .590 .615 14.986 15.621

F .143 .153 3.632 3.886

G 1.105 1.147 28.067 29.134 H .500 .550 12.700 13.970

J R 0.197 R 0.197

L .025 .036 .635 .914

M .045 .055 1.143 1.397

N .195 .205 4.953 5.207 P .165 .185 4.191 4.699

Q .048 .054 1.219 1.372

S 3° 6° 3° 6°

T 3° 6° 3° 6° U 3° 6° 3° 6°

V .094 .110 2.388 2.794

W .014 .025 .356 .635

X 3° 5.5° 3° 5.5°

Y .385 .410 9.779 10.414

z

Inches Millimeters

Min Max Min Max

.130 .150 3.302 3.810

NOTE:

1. Dimension L, M, W apply for Solder Dip

Finish

Package Dimensions

Package TO-252-2

PIN 1

PIN 2

*

5 CSD01060 Rev. P

POS

A .255 .265 6.477 6.731

B .197 .205 5.004 5.207

C .027 .033 .686 .838

D* .270 .322 6.858 8.179

E .178 .182 4.521 4.623

F .025 .035 .635 .889 G 44˚ 46˚ 44˚ 46˚

CASE

H .382 .397 9.703 10.084

J .090 TYP 2.286 TYP K 6˚ 8˚ 6˚ 8˚ L .086 .094 2.184 2.388

M .030 .034 .762 .864

N .040 .044 1.016 1.118 P .235 .245 5.969 6.223

Q 0.00 .004 0.00 .102 R R0.01 TYP R0.31 TYP

S .017 .023 .428 .588

T .040 .044 1.016 1.118

U .021 .027 .534 1.118

Note: * Tab “D” may not be present

Inches Millimeters

Min Max Min Max

Recommended Solder Pad Layout

.08

.26

TO-252-2 TO-220-2

Part Number Package Marking

CSD01060A TO-220-2 CSD01060

CSD01060E TO-252-2 CSD01060

Note: Recommended soldering proles can be found in the applications note here:

http://www.cree.com/power_app_notes/soldering

Notes

• RoHSCompliance

The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of www.cree.com.

• REAChCompliance

REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future,please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request.

• This product has not been designed or tested for use in, and is not intended for use in, applications implanted into

the human body nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines,

cardiacdebrillatorsorsimilaremergencymedicalequipment,aircraftnavigationorcommunicationorcontrol systems,airtrafccontrolsystems,orweaponssystems.

66 CSD01060 Rev. P

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

Fax: +1.919.313.5451

www.cree.com/power