Wistron NeWeb UMC 6055Q Users manual

Product specification

Wistron NeWeb Corp.

CONFIDENTIAL

THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION, WHICH IS THE PROPERTY OF

THE WISTRON NEWEB CORPORATION AND SHALL NOT BE DISCLOSED TO OTHERS IN WHOLE OR IN

PART, REPRODUCED, COPIED, OR USED AS THE BASIS FOR DESIGN, MANUFACTURING, OR SALE OF

APPARATUS WITHOUT WRITTEN PERMISSION OF WISTRON NEWEB CORPORATION.

UMC-6055QV

User Guide

1

Product specification

Revision

Date

Description

V1.0

April 7 2014

Initial release

V2.0

May 13 2014

Modify recommended operating condition

CONTENTS

CONTENTS .......................................................................................................................................................................... 2

1. INTRODUCTION ...................................................................................................................................................... 3

1.1 PRODUCT CONCEPT ........................................................................................................................................ 3

1.2 STANDARDS ....................................................................................................................................................... 3

1.3 TERMS AND ABBREVIATION ......................................................................................................................... 4

1.4 CONVENTIONS ................................................................................................................................................... 4

1.5 PRODUCT FEATURES OVERVIEW ............................................................................................................... 4

2. BLOCK DIAGRAM & PIN ASSIGNMENT ........................................................................................................... 7

3. RF AIR INTERFACES AND PERFORMANCE ................................................................................................ 14

3.1 RF AIR INTERFACE AND BAND CONFIGURATION ................................................................................ 14

3.1.1 Air interfaces ............................................................................................................................................. 14

3.2 RF PERFORMANCE ......................................................................................................................................... 14

3.3 TRANSMITTER POWER CLASS ................................................................................................................... 14

4. OPERATING CONDITIONS ................................................................................................................................ 15

4.1 ABSOLUTE MAXIMUM RATINGS ................................................................................................................. 15

4.2 RECOMMENDED OPERATING CONDITION .............................................................................................. 16

5. CURRENT CONSUMPTION ................................................................................................................................ 17

6. APPLCATION DESIGN NOTES ......................................................................................................................... 18

6.1 LAYOUT NOTES .................................................................................................................................. 18

6.2 RF PIN INPUT IMPEDANCE MATCHING ........................................................................................... 18

6.3 HANDING REQUIREMENTS .......................................................................................................................... 18

6.4 SOLDING REQUIREMENTS ........................................................................................................................... 18

7. MECHANICAL REQUIREMENTS ...................................................................................................................... 20

7.1 MODULE DIMENSION AND FOOTPRINT.................................................................................................... 20

8. CERTIFICATION REQUIREMENTS ................................................................................................................ 22

8.1 CARRIER CERTIFICATION REQUIREMENTS ........................................................................................... 22

8.2 REGULATORY COMPLIANCE ..................................................................................................................... 22

8.3 FCC WARNING STATEMENT ........................................................................................................................ 22

Revision history

2

Product specification

FCC

RF : FCC Part 22H (850 Band )
FCC Part 24E (for 1900 Band)

FCC Part 22 Subpart H:
Cellular Radiotelephone Service; Subpart I: Offshore
Radiotelephone Service;

FCC Part 24 E: Personal Communications Service; Subpart E:
Broadband PCS.

EMI: FCC Part 15B

Subpart B - Radio frequency devices subpart B – Unintentional
Radiators

SAR(MPE) : OET65C

1. INTRODUCTION

This document describes the hardware interface of the WNC Small Form Factor (SFF) module used to connect
the device application and the air interface.

Two versions of Small Form Factor (SFF) module are described in this specification document as follows:

 UMC-6055QV - CDMA2000 1X

1.1 PRODUCT CONCEPT

The SFF module is one of the smallest available CDMA2000 1X modules of the market. The target application
is the Machine to Machine (M2M) market including automotive, AMM (Automatic Metering Management),
tracking system, Alarm, Healthcare/monitoring, Telematics etc. Despite its small size and cost,

In addition to its size it has the following outstanding characteristics:

 Minimum low power consumption in idle mode: 1.4mA
 High input voltage range: 3.4 V to 4.2 V
 USB High Speed
 Digital Audio PCM
 Full set of AT commands as well as analogue and Digital audio interface.

In addition to the module, a complete development kit can be provided for customers.

1.2 STANDARDS

This product, together with its evaluation board, is in compliance with the directives and standards listed below:

Directives

3

Product specification

Temperature range

Operation Temperature: -25°C to +85°C
Storage: -40°C to +85°C

Weight

6 g (typ.)

ESD

ESD protection >= 2 kV

1.3 TERMS AND ABBREVIATION

ADC Analog to Digital Converter
CODEC Coder-Decoder
CLIP Calling Line Identification Presentation
COLP Connected Line Identification Presentation
CLIR Calling Line Identification Restriction
COLR Connected Line Identification Restriction
CTS Clear To Send
CSD Circuit Switched Data
CS Codec Scheme
DSR Data Set Ready
ENS Enhanced network selection
EONS Enhanced operator name string
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FAX Facsimile
IC Integrated Circuit
IEEE Institute of Electrical and Electronics Engineers
I/O Input / Output
ISO International Standards Organization
ITU International Telecommunication Union
JTAG Joint Test Action Group
Kbps kilobit per second
LCD Liquid Crystal Display
LED Light Emitting Diode
Mbps Megabit per second
PCB Printed Circuit Board
PCM Pulse Code Modulation
PCS Personal Communication System
PWM Pulse Width Modulation
RAM Random Access Memory
RF Radio Frequency
RI Ring Indication
RMS Root Mean Square
RTS Ready To Send
RX Reception
SMS Short Message Service
TBC To Be Confirmed
TBD To Be Defined
TX Transmission
UART Universal Asynchronous Receiver and Transmitter
USB Universal Serial Bus
USSD Unstructured Supplementary Service Data

1.4 CONVENTIONS

Throughout this document, DTE (data terminal equipment) indicates the equipment which masters and controls
the module device by sending AT commands via its serial interface.
DCE (data communication equipment) indicates the module device.

1.5 PRODUCT FEATURES OVERVIEW

4

Product specification

Physical dimensions

22.1 x 25.1 x 2.65 mm (typical)

Connection

141 pin LGA type

Power supply

3.4V to 4.2V range, 3.8V nominal

Power consumption*

Off mode: 50 µA typical
Registered idle mode:

 CDMA2000: 1.3 mA

Peak Current

 CDMA2000: up to 700 mA

Antenna /RF interface

Both GPS and transmitter/receiver RF are LGA Pad.

Frequency bands

UMC-6055QV module supports
CDMA2000 BC0/BC1

Transmit power

Class 3 for CDMA2000 BC0/BC1

PWM

Signal for LED, vibrating device and Buzzer management is provided
on the PWM pin

Digital audio link

A digital audio interface PCM bus is provided. Master mode with 16
bits and a frequency of 2048 KHz.

Data/command multiplexing

Software management of data/command multiplexing on the serial
link UART.

USB

Supports USB High speed 480Mbps and full speed 12Mbps, with 3
logical Channels. Battery charging is achieved through USB

Module Hardware Configuration

The SFF LGA module will support the QSC6055 chipset with the configuration described below.

For UMC-6055QV module:

Key Features

• Compliant with 3GPP for CDMA 1xRTT

• Max. Data Rate : 153kbps FL; 153kbps RL

• Support OS: Brew Mobile Platform

• ARM9 operating at 192Mhz maximum frequency

• Data interface: USB2.0 Host High Speed

• Form Factor: LGA module

Specification

• Communication Interface: (I2C x1/UART x1/USB2.0 x1/SDIO x1)

• Supported SIM cards (3V and 1.8V SIM cards)

• General purpose I/O pins ( x25 )

• Audio Interface (PCM/ I2S)

• MCP (DDR 512Mb + 1Gb NAND)

• Support GPS

• RF interface: 2 RF pads for CDMA TX/RX, and GPS.

CDMA2000 Support Bands

• Band BC0

*

The power consumption is highly dependent on the customer’s product design and the module environment.

5

Product specification

• Band BC1

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Product specification

2. BLOCK DIAGRAM & PIN ASSIGNMENT

Pin Definition 4

This section is intended to capture the final LGA pin out for the SFF Module.
The interfaces with a SFF module are all through a 141-pin surface LGA pad, as shown in Figure 2-1.

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