Wistron NeWeb M18Q2 User Manual
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User manual
Project Name: M18Q2
Author: Wistron NeWeb Corporation
Revision: 1.4
Revision Date: 2016/05/20
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User Manual
Sale and Technical Support
SupportIoT.MBA@wnc.com.tw
Website
www.wnc.com.tw
Rev. #
Author
Summary of Changes
Date
1.0
WNC MBU
Draft release
2016/4/15
1.1
WNC MBU
Fine-tune wording
2016/5/12
1.2
WNC MBU
Update RF Exposure Information
2016/5/17
1.3
WNC MBU
Update antenna and PCB layout guidance
2016/5/17
1.4
WNC MBU
Update layout guidance
2016/5/20
Contact Information
Revision History
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User Manual
© Wistron NeWeb Corporation
THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND IS THE EXCLUSIVE
PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED, REPRODUCED, OR DISCLOSED IN WHOLE OR IN
PART WITHOUT PRIOR WRITTEN PERMISSION FROM WNC.
LIMITATION OF LIABILITY
THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR DESIGN REFERENCE AND
SUBJECT TO REVISION BY WNC AT ANY TIME. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS
GRANTING ANY WARRANTY OR RIGHT TO USE THE MATERIAL CONTAINED HEREIN WITHOUT WNC’S
PRIOR EXPRESS WRITTEN CONSENT. WNC SHALL NOT BE LIABLE FOR ANY USE, APPLICATION OR
DEVELOPMENT DERIVED FROM THE MATERIAL WITHOUT SUCH PRIOR EXPRESS WRITTEN CONSENT.
FCC Regulations:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) This device must accept any interference received, including interference
that may cause undesired operation.
This device has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the
FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference
to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged
to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
Caution: Changes or modifications not expressly approved by the party responsible for compliance could void the user‘s
authority to operate the equipment.
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RF Exposure Information
This device is intended only for OEM integrators under the following conditions:
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the
maximum antenna gain including cable loss in a mobile exposure condition must not exceed:
Standalone Condition:
。 8.0 dBi in 700 MHz Band
。8.0 dBi in 850 MHz Band
。5.0 dBi in 1700 MHz Band
。7.5 dBi in 1900 MHz Band
Assuming collocated with a WLAN transmitter with maximum 27 dBm average EIRP power
。 7.0 dBi in 700 MHz Band
。5.0 dBi in 850 MHz Band
。5.0 dBi in 1700 MHz Band
。7.5 dBi in 1900 MHz Band
Remark: This assumption is not valid if the output power of the collocated WLAN transmitter is higher than 27 dBm.
IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement
of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between
the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation
exposure limits set forth for an population/uncontrolled environment can be satisfied.
Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate
this equipment.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the
antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency
exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any
changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this
equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required
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to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference
received, including interference that may cause undesired operation.
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Contents
Contact Information ......................................................................................................................... 2
Revision History ................................................................................................................................ 2
Contents ........................................................................................................................................ 6
1. Introduction ........................................................................................................................... 8
1.1. Features .................................................................................................................................8
2. Electrical Specifications...................................................................................................... 9
2.1. Host interface pin assignments...........................................................................................9
2.1.1. LGA Pad Diagram ....................................................................................................9
2.1.2. Pin Assignments .....................................................................................................10
2.2. Power supply .......................................................................................................................12
2.3. USB interface .......................................................................................................................14
2.4. SGMII interface ...................................................................................................................15
2.5. HSIC interface .....................................................................................................................16
2.6. SIM interface ........................................................................................................................17
2.7. Control interface (wakeup) ................................................................................................17
2.8. Digital interface ....................................................................................................................18
2.8.1. JTAG Interface ........................................................................................................18
2.8.2. SPI Master Interface ..............................................................................................18
2.8.3. PCM Interface .........................................................................................................19
2.8.4. I2S Interface ............................................................................................................19
2.8.5. I2C Interface ...........................................................................................................20
2.8.6. UART Interface .......................................................................................................20
2.8.7. ADC Interface .........................................................................................................21
3. RF Specifications ............................................................................................................... 22
3.1. RF connections ...................................................................................................................22
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3.2. RF Layout guidance ...........................................................................................................22
3.3. Antenna Guidance ..............................................................................................................24
3.4. Interference and sensitivity ................................................................................................24
3.5. Radiated sensitivity measurement ...................................................................................25
3.6. GNSS external circuit design ............................................................................................25
3.7. Supported frequencies .......................................................................................................25
4. Software Interface .............................................................................................................. 27
4.1. Support tools ........................................................................................................................27
4.2. USB interface .......................................................................................................................27
5. Mechanical and Environmental Certifications ............................................................... 28
5.1. PCBA Form Factor ..............................................................................................................28
5.2. Labeling ................................................................................................................................31
6. Regulatory Compliance and Certification....................................................................... 32
6.1. Certification testing .............................................................................................................32
7. Safety Recommendation ................................................................................................... 33
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1. Introduction
The M18Q2 is a Cat. 4 LTE modem which incorporates an application CPU subsystem and a host of
peripheral interfaces and functions uniquely designed to address the power/performance/cost
requirements of IoT and M2M applications. The chip is based on Qualcomm’s MDM architecture which
offers OFDMA-related software based signal processing capabilities that significantly exceed traditional
communications ARM cores.
The CPU subsystem features a high performance Cortex A7 microprocessor running a Linux OS with a
variety of host interfaces including USB 2.0, SGMII, SPI, UART, PCM, I2C, HSIC, USIM & SDC. The module
supports integrated VoLTE functionality, with a variety of narrow- and wide-band CODECs and full IMS
signaling.
1.1. Features
3GPP category support: LTE Cat. 4 with 150/50 Mbps for DL/UL
Supports LTE B2/4/5/12
Supports WCDMA B2/5
Ultra-high-performance Cortex A7 microprocessor
Modem subsystem (MSS)
Integrated support for VoLTE
Resource and power management (RPM) subsystem
Optimized for M2M and IoT markets
Interfaces
– HS USB 2.0 with integrated PHY
– SGMII interface
– HSIC interface
– Dual UART interfaces (4 bit and 2 bit) for data transfer and diagnostic tools
– SDC1: First SPI interface
– I2C: Second SPI interface
– USIM interface
– GPIOs
– ADC
– PCM/I2S
– JTAG interface
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2. Electrical Specifications
2.1. Host interface pin assignments
2.1.1. LGA Pad Diagram
Figure 1. LGA pad diagram (top view)
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Interface Family
Signal
Description
I/O
RF Interfaces
ANT1_DRX
Diversity antenna
I
ANT_GNSS
Reserved for GNSS receiver
I
ANT0_TRX
Main Antenna
I/O
User Identity Module
VREG_L6_UIM1
Power source for UIM
O
UIM1_DATA
Data in/out
I/O
UIM1_CLK
Clock signal
O
UIM1_RESET
Reset signal
O
UIM1_DETECT
UIM Detect signal
I/O
Data
Interfaces
USB 2.0
USB_HS_DP
USB Data Positive
I/O
USB Detect
USB Detect
I
USB_HS_DM
USB Data Negative
I/O
HSIC
HSIC USB_STROBE
HSIC USB Strobe
I/O
HSIC USB_DATA
HSIC USB Data
I/O
SGMII
SGMII_RX_P
SGMII receive - plus
I
SGMII_RX_M
SGMII receive - minus
I
SGMII_TX_P
SGMII transmit - plus
O
SGMII_TX_M
SGMII transmit - minus
O
SGMII_MDIO
SGMII Management data
I/O
SGMII_MDC
SGMII Management data clock
I/O
UART1
UART1_CTS_N
Clear To Send for UART 1
I
UART1_RFR_N
UART ready for frame
O
UART1_RX
Receive for UART 1
I
UART1_TX
Transmit for UART 1
O
UART2
MDM_DBG_UART_RX
Receive for UART 2
I
MDM_DBG_UART_TX
Transmit for UART 2
O
I2C/2nd_ SPI
I2C_SDA
Data in/out
I/O
2nd_SPI_EN_1
2nd_SPI chip select
O
I2C_SCL
Clock signal
O
2nd_SPI_CLK
2nd_SPI serial clock
O
NC
NC
SPI_MOSI
2nd_SPI master out slave in
O
NC
NC
2.1.2. Pin Assignments
Table 1. Pin interface family
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