Wistron NeWeb IMS2 User Manual

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IMS2 module user manual

Project Name: IMS2

Author: Wistron NeWeb Corporation

Revision: 1.1

Revision Date: 2017/09/13

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Technical Support Website

https://SupportIoT.wnc.com.tw

Company Website

www.wnc.com.tw

Rev. #

Author

Summary of Changes

Date

1.0

WNC

First release

2017/07/14

1.1

WNC

Add FCC statement and manual information to the end user in the user manual

2017/09/13

Contact Information

Revision History

Product datasheet

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THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND IS THE EXCLUSIVE PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED, REPRODUCED, OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION FROM WNC.

LIMITATION OF LIABILITY

THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR DESIGN REFERENCE AND SUBJECT TO REVISION BY WNC AT ANY TIME. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY WARRANTY OR RIGHT TO USE THE MATERIAL CONTAINED HEREIN WITHOUT WNC’S PRIOR EXPRESS WRITTEN CONSENT. WNC SHALL NOT BE LIABLE FOR ANY USE, APPLICATION OR DEVELOPMENT DERIVED FROM THE MATERIAL WITHOUT SUCH PRIOR EXPRESS WRITTEN CONSENT.

FCC Statement Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID:NKRIMS2”. Any similar wording that expresses the same meaning may be used.

Manual Information to the End User The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application; a separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Product datasheet

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Contents

Contact Information .......................................................................................................................... 2

Revision History ............................................................................................................................... 2

1 Product Features ...................................................................................................................... 6

1.1 Features Description ........................................................................................................... 6

2 Pin Definitions ......................................................................................................................... 8

2.1 LGA Module Pin Diagram .................................................................................................. 8

2.2 LGA Module Pin Definitions .............................................................................................. 8

3 Electrical Specifications ......................................................................................................... 12

3.1 Electrical Operating Conditions ........................................................................................ 12

3.1.1 Detailed Information .............................................................................................. 12

3.1.2 Power Tree ............................................................................................................. 12

3.2 Control Interfaces .............................................................................................................. 13

3.2.1 Power-on Signal (TBD) ......................................................................................... 13

3.2.2 Wake-up Interface (TBD) ...................................................................................... 13

3.2.3 Reset Signal ............................................................................................................ 14

3.3 UART Interface ................................................................................................................. 14

3.4 UIM Interface .................................................................................................................... 15

3.5 I/O Characteristics ............................................................................................................. 15

3.6 JTAG Interface .................................................................................................................. 17

3.7 Power Consumption .......................................................................................................... 17

3.8 RF Performance ................................................................................................................ 18

3.8.1 RF Pad Design ....................................................................................................... 18

3.8.2 RF Matching Guide ................................................................................................ 21

3.8.3 Interference and Sensitivity .................................................................................... 21

3.8.4 Band Support .......................................................................................................... 22

3.8.5 Bandwidth Support................................................................................................. 22

3.8.6 RF Transmission Specifications ............................................................................. 22

3.8.7 RF Receiver Specifications .................................................................................... 23

3.9 Temperature ...................................................................................................................... 23

3.10 LTE Power Saving Mode ................................................................................................ 23

3.11 Serial Number and IMEI ................................................................................................. 23

4 Mechanical Information ......................................................................................................... 25

4.1 Physical Dimensions ......................................................................................................... 25

4.2 Pin Dimensions ................................................................................................................. 25

4.3 Marking Information ......................................................................................................... 27

5 Packing Information............................................................................................................... 28

5.1 Packing Information .......................................................................................................... 28

5.2 Storage Conditions ............................................................................................................ 28

6 PCB Mounting Guidelines ..................................................................................................... 28

6.1 Mounting Considerations .................................................................................................. 28

7 Regulatory and Industry Approval ......................................................................................... 28

7.1 Certification Testing ......................................................................................................... 28

Product datasheet

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7.2 GP Compliance ................................................................................................................. 28

Initialisms ........................................................................................................................................ 29

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1 Product Features

General interfaces

• JTAG

• USIM

• GPIO

• UART

Supported frequency bands

• LTE Band 2

• LTE Band 4

• LTE Band 12

Operating voltage

• VCC (range from 3.3 V to 4.2 V)

Packaging

• LGA module

• 104 pads (21.5 mm × 16.5 mm × 2.3 mm)

• RoHS compliant

Operating temperature

• 3GPP compliant: –20 °C to +60 °C (ambient)

• Operational: –40 °C to +85 °C (functional)

1.1 Features Description

The WNC IMS2 module includes the Sequans SQN3330 Cat. M1 baseband, a complete three LTE band (2/4/12) RF front-end, memory, and required circuitry to fulfill 3GPP E-UTRA (Long Term Evolution - LTE, Release 13 specifications) and AT&T Wireless LTE Cat. M1 UE specifications. The architecture block diagram of the IMS2 is presented in Figure 1-1 below.

Figure 1-1. IMS2 block diagram

Table 1-1. General features of the IMS2

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Standards compliance

• 3GPP E-UTRA Release 13

PHY

• One UL and one DL transceiver

• Supports HD-FDD Duplexing

• Category M1 UE

• Normal cyclic prefix

• Supports MPDCCH

• Modulation

- DL: QPSK, 16QAM

- UL: QPSK, 16QAM

• All coding schemes corresponding to modulations

• All channel coding (turbo-coding with inter-leaver, tail biting

convolutional coding, block and repetition coding) and CRC lengths

• All power control schemes and DL power allocation schemes

• UEPCOP (from 3GPP Release 12) Power Saving Mode

MAC

• Random access procedure in normal sub-frames

• Scheduling request, buffer status reporting, and power

headroom reporting

• Discontinuous reception (DRX, eDRX) with long and short cycles

• Fast scanning

• IPv4, IPv6

RLC

• ARQ modes: UM, AM, and TM

PDCP

• Ciphering and deciphering: NULL, AES, SNOW 3G

• Integrity and protection: AES, SNOW 3G

RRC

• MIB and new SIB1bis

• Supports up to eight data radio bearers

NAS and above

• NAS

• SMS over SG

• LWM2M client

Table 1-2. LTE-related features of the IMS2

Product datasheet

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Pin No.

Name

Description

GND

Ground

GND

Ground

Not connected

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

2 Pin Definitions

2.1 LGA Module Pin Diagram

The IMS2 LGA module pin layout is illustrated below.

Product datasheet

Figure 2-1. IMS2 LGA module pin layout

2.2 LGA Module Pin Definitions

The signals and all the related details are listed in the below table.

Table 2-1. IMS2 module pin definition

Product datasheet

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Main antenna

Main antenna port

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

Not connected

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

Not connected

GND

Ground

GND

Ground

GND

Ground

Power

Not connected

GND

Ground

GND

Ground

GPIO46

General purpose input/output

GPIO47

General purpose input/output

GPIO48

General purpose input/output

GPIO49

General purpose input/output

GND

Ground

GND

Ground

GPIO01

General purpose input/output

GPIO02

General purpose input/output

UART1_CTS

Clear to send for UART 1

UART1_RTS

Request to send for UART 1

UART1_Rx

Receive for UART 1

UART1_Tx

Transmit for UART 1

GND

Ground

GND

Ground

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