Wistron NeWeb IMS2 User Manual

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IMS2 module user manual

Project Name: IMS2

Author: Wistron NeWeb Corporation

Revision: 1.1

Revision Date: 2017/09/13

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Technical Support Website

https://SupportIoT.wnc.com.tw

Company Website

www.wnc.com.tw

Rev. #

Author

Summary of Changes

Date

1.0

WNC

First release

2017/07/14

1.1

WNC

Add FCC statement and manual information to the end user in the user manual

2017/09/13

Contact Information

Revision History

Product datasheet

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THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND IS THE EXCLUSIVE PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED, REPRODUCED, OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION FROM WNC.

LIMITATION OF LIABILITY

THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR DESIGN REFERENCE AND SUBJECT TO REVISION BY WNC AT ANY TIME. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY WARRANTY OR RIGHT TO USE THE MATERIAL CONTAINED HEREIN WITHOUT WNC’S PRIOR EXPRESS WRITTEN CONSENT. WNC SHALL NOT BE LIABLE FOR ANY USE, APPLICATION OR DEVELOPMENT DERIVED FROM THE MATERIAL WITHOUT SUCH PRIOR EXPRESS WRITTEN CONSENT.

FCC Statement Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID:NKRIMS2”. Any similar wording that expresses the same meaning may be used.

Manual Information to the End User The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application; a separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

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Contents

Contact Information .......................................................................................................................... 2

Revision History ............................................................................................................................... 2

1 Product Features ...................................................................................................................... 6

1.1 Features Description ........................................................................................................... 6

2 Pin Definitions ......................................................................................................................... 8

2.1 LGA Module Pin Diagram .................................................................................................. 8

2.2 LGA Module Pin Definitions .............................................................................................. 8

3 Electrical Specifications ......................................................................................................... 12

3.1 Electrical Operating Conditions ........................................................................................ 12

3.1.1 Detailed Information .............................................................................................. 12

3.1.2 Power Tree ............................................................................................................. 12

3.2 Control Interfaces .............................................................................................................. 13

3.2.1 Power-on Signal (TBD) ......................................................................................... 13

3.2.2 Wake-up Interface (TBD) ...................................................................................... 13

3.2.3 Reset Signal ............................................................................................................ 14

3.3 UART Interface ................................................................................................................. 14

3.4 UIM Interface .................................................................................................................... 15

3.5 I/O Characteristics ............................................................................................................. 15

3.6 JTAG Interface .................................................................................................................. 17

3.7 Power Consumption .......................................................................................................... 17

3.8 RF Performance ................................................................................................................ 18

3.8.1 RF Pad Design ....................................................................................................... 18

3.8.2 RF Matching Guide ................................................................................................ 21

3.8.3 Interference and Sensitivity .................................................................................... 21

3.8.4 Band Support .......................................................................................................... 22

3.8.5 Bandwidth Support................................................................................................. 22

3.8.6 RF Transmission Specifications ............................................................................. 22

3.8.7 RF Receiver Specifications .................................................................................... 23

3.9 Temperature ...................................................................................................................... 23

3.10 LTE Power Saving Mode ................................................................................................ 23

3.11 Serial Number and IMEI ................................................................................................. 23

4 Mechanical Information ......................................................................................................... 25

4.1 Physical Dimensions ......................................................................................................... 25

4.2 Pin Dimensions ................................................................................................................. 25

4.3 Marking Information ......................................................................................................... 27

5 Packing Information............................................................................................................... 28

5.1 Packing Information .......................................................................................................... 28

5.2 Storage Conditions ............................................................................................................ 28

6 PCB Mounting Guidelines ..................................................................................................... 28

6.1 Mounting Considerations .................................................................................................. 28

7 Regulatory and Industry Approval ......................................................................................... 28

7.1 Certification Testing ......................................................................................................... 28

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7.2 GP Compliance ................................................................................................................. 28

Initialisms ........................................................................................................................................ 29

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1 Product Features

General interfaces

• JTAG

• USIM

• GPIO

• UART

Supported frequency bands

• LTE Band 2

• LTE Band 4

• LTE Band 12

Operating voltage

• VCC (range from 3.3 V to 4.2 V)

Packaging

• LGA module

• 104 pads (21.5 mm × 16.5 mm × 2.3 mm)

• RoHS compliant

Operating temperature

• 3GPP compliant: –20 °C to +60 °C (ambient)

• Operational: –40 °C to +85 °C (functional)

1.1 Features Description

The WNC IMS2 module includes the Sequans SQN3330 Cat. M1 baseband, a complete three LTE band (2/4/12) RF front-end, memory, and required circuitry to fulfill 3GPP E-UTRA (Long Term Evolution - LTE, Release 13 specifications) and AT&T Wireless LTE Cat. M1 UE specifications. The architecture block diagram of the IMS2 is presented in Figure 1-1 below.

Figure 1-1. IMS2 block diagram

Table 1-1. General features of the IMS2

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Standards compliance

• 3GPP E-UTRA Release 13

PHY

• One UL and one DL transceiver

• Supports HD-FDD Duplexing

• Category M1 UE

• Normal cyclic prefix

• Supports MPDCCH

• Modulation

- DL: QPSK, 16QAM

- UL: QPSK, 16QAM

• All coding schemes corresponding to modulations

• All channel coding (turbo-coding with inter-leaver, tail biting

convolutional coding, block and repetition coding) and CRC lengths

• All power control schemes and DL power allocation schemes

• UEPCOP (from 3GPP Release 12) Power Saving Mode

MAC

• Random access procedure in normal sub-frames

• Scheduling request, buffer status reporting, and power

headroom reporting

• Discontinuous reception (DRX, eDRX) with long and short cycles

• Fast scanning

• IPv4, IPv6

RLC

• ARQ modes: UM, AM, and TM

PDCP

• Ciphering and deciphering: NULL, AES, SNOW 3G

• Integrity and protection: AES, SNOW 3G

RRC

• MIB and new SIB1bis

• Supports up to eight data radio bearers

NAS and above

• NAS

• SMS over SG

• LWM2M client

Table 1-2. LTE-related features of the IMS2

Product datasheet

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Pin No.

Name

Description

GND

Ground

GND

Ground

Not connected

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

2 Pin Definitions

2.1 LGA Module Pin Diagram

The IMS2 LGA module pin layout is illustrated below.

Product datasheet

Figure 2-1. IMS2 LGA module pin layout

2.2 LGA Module Pin Definitions

The signals and all the related details are listed in the below table.

Table 2-1. IMS2 module pin definition

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Main antenna

Main antenna port

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

Not connected

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

Not connected

GND

Ground

GND

Ground

GND

Ground

Power

Not connected

GND

Ground

GND

Ground

GPIO46

General purpose input/output

GPIO47

General purpose input/output

GPIO48

General purpose input/output

GPIO49

General purpose input/output

GND

Ground

GND

Ground

GPIO01

General purpose input/output

GPIO02

General purpose input/output

UART1_CTS

Clear to send for UART 1

UART1_RTS

Request to send for UART 1

UART1_Rx

Receive for UART 1

UART1_Tx

Transmit for UART 1

GND

Ground

GND

Ground

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Not connected

GND

Ground

GND

Ground

GND

Ground

UART0_CTS

Clear to send for UART 0

UART0_TX

Transmit for UART 0

UART2_TX

Transmit for UART 2

UART0_RX

Receive for UART 0

UART2_RX

Receive for UART 2

UART0_RTS

Request to send for UART 0

UART2_RTS

Request to send for UART 2

UART2_CTS

Clear to send for UART 2

100

FFF/FFH mode switch

FFF/FFH mode switch; FFF is normal mode; FFH is for design mode.

101

RFDATA5

RF control interface

102

RFDATA6

RF control interface

103

RFDATA7

RF control interface

130

ADC

Analog-to-digital converter

131

ADC

Analog-to-digital converter

132

GPIO08

General purpose input/output

133

UIM_VCC

SIM card power

134

UIM DATA

SIM card data line

135

UIM CLK

SIM card clock line

136

UIM RESET

SIM card reset line

137

UIM DETECT

SIM card detect line

138

Not connected

139

GND

Ground

140

GND

Ground

141

WWAN_STATE

Wireless WAN radio state

142

Power on

Power on the module

143

WAKEUP_OUT

Module wakes up host.

144

WAKEUP_IN

Host wakes up module.

145

RESET

Main reset line

146

VREF

Reference logic voltage (1.8 V voltage)

201

JTAG TCK

202

JTAG TDI

203

JTAG TDO

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204

JTAG_TMS

205

JTAG_SRST_N

206

Not connected

208

GND

Ground

209

GND

Ground

210

GND

Ground

211

GND

Ground

212

GND

Ground

213

GND

Ground

214

GND

Ground

215

GND

Ground

216

GND

Ground

217

GND

Ground

218

GND

Ground

219

GND

Ground

220

GND

Ground

221

GND

Ground

222

GND

Ground

223

GND

Ground

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Direction

Minimum

Typical

Maximum

VCC

3.3 V

3.8 V

4.2 V

Net Name

Current Value

VCC(1–6) total

TBD

UIM_VCC

TBD

VREF

TBD

3 Electrical Specifications

3.1 Electrical Operating Conditions

3.1.1 Detailed Information

Table 3-1. Electrical operating conditions for the IMS2.

IMS2 includes an integrated Power Manager enabling single and direct voltage supply from the battery and reducing the overall bill of materials.

Layout Suggestion: Each power trace should possess sufficient line width to withstand its respective current listed in Table 3-2 below.

Table 3-2. Power supply reference currency

Note: Routing under a 1 A design is desired as it will result in more stable power.

3.1.2 Power Tree

Figure 3-1 provides a representation of the power tree of the IMS2 LGA module

Figure 3-1. IMS2 power tree

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3.2 Control Interfaces

This section describes the power-on/off, wake-up, and reset interface for controlling the module.

3.2.1 Power-on Signal (TBD)

The POWER_ON signal is an active low input signal used to enable or disable the module. Do not toggle the PERST# pin during power-on. This signal has the highest priority among the wakeup, the alarm signal, and the digital control pins.

There are three possible states of the module:

• Module Off: VCC is not present.

• Module Enabled: VCC is supplied, and the module is enabled.

• Module Disabled: VCC is supplied, and the module is disabled.

The state transitions are defined as follows:

• When voltage is applied to VCC, the module shall enter the Module Disabled state.

An input to the POWER_ON pin shall trigger the transition from the Module Disabled to the Module Enabled state. See Figure 6; a low pulse (tlow > 0s) on the POWER_ON pad will enable the module after VCC is applied.

3.2.2 Wake-up Interface (TBD)

In applications where power consumption is a major factor in performance metrics (such as battery-operated sensors that are based on an IOT/M2M modem solution and also include a third-party host), definitions are necessary for a simple interface that will enable both the modem and the host to enter low-power states whenever possible and the other side to wake it up once required.

For example, if the host has no data to transmit or any other tasks, it may enter a low-power state according to its own capabilities and configurations. If during that period the host is in a low-power state and the modem suddenly receives data, it must wake-up the host.

A similar requirement exists in the reverse case. For example, if the modem is in a low-power state and suddenly the host must transmit data, it must be able to wakeup the modem.

The interface consists of two signals: One is triggered by the host and received by the modem; the other is triggered by the modem and received by the host.

Each side can wake the other by toggling a wakeup signal high and enabling the

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other side to activate sleep mode when not needed by toggling it low.

• “WAKEUP_IN” (Host: Output, Modem: Input):

• LOW: SoC does not require the MODEM (allowing it to sleep).

• HIGH: SoC requires the MODEM or acknowledges it is ready

following a wakeup request from the MODEM.

• “WAKEUP_OUT” (Host: Input, Modem: Output):

• LOW: The MODEM does not require the Host (allowing it to sleep).

• HIGH: The MODEM requires the Host or acknowledges it is ready

following a wakeup request from the SoC.

When the IMS2 module functions as a modem, keep WAKEUP_IN high before the system boot process is complete. After the system boot, maintain WAKEUP_IN in a low state. The WAKEUP_IN and WAKEUP_OUT operation in host mode will be discussed according to product specifications.

3.2.3 Reset Signal

The Reset Signal is a hardware reset signal to control the system reset directly. The user can connect it to a key or a control signal. A low pulse after power on will reset the module.

3.3 UART Interface

There are three UART interfaces; these interfaces are 4 bit for high-speed data transfer, and the UART definitions of IMS2 are shown in Figure 3-2.

1. UART0 for data

2. UART1 for debugging the DM tool and software upgrade

3. UART2 for the console

Figure 3-2. UART connection (example)

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Parameter

Drive

Strength

Min.

Nom.

Max.

Unit

VIL Input low voltage

VSS

0.3 × PVDD_1V8

VIH Input high voltage

0.7 × PVDD_1V8

PVDD_1V8

3.4 UIM Interface

IMS2 modules provide a UIM_DETECT input pin for UIM connectors to detect a UIM card. When a UIM card is present, UIM_DETECT should be high (1.8 V). If the UIM card is absent, UIM_DETECT should be low. This is required to pull UIM_DETECT to VREF with a 470 kΩ resistor. A 0.1 μF and a 33 pF capacitor are recommended to place between UIM_VCC and Ground in parallel. We recommend placing a 33 pF capacitor between UIM_RESET, UIM_CLK, and UIM_DATA and Ground in parallel. (Refer to Figure 5.) An electrostatic discharge (ESD) protection circuit is also recommended to place near the UIM socket as close as possible, and the Ground pin of the ESD protection component must be well connected to the Ground plane.

The following figure illustrates an example UIM card circuit. The default configuration is active high.

Figure 3-3. Example UIM card circuit

3.5 I/O Characteristics

The voltage and current characteristics of the various IO pads of the IMS2 versus IO bank supply voltage are illustrated in Table 3-3 below.

Table 3-3. DC characteristics for digital IOs, voltage 1.8 V - BIDIR and IN types

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VOL Output low voltage

VSS

0.2 × PVDD_1V8

VOH Output high voltage

0.8 × PVDD_1V8

PVDD_1V8

IRPU Input pull-up resistor current

μA

RPU Input pull-up resistance

32.4

kΩ

IRPD Input pull-down resistor current

μA

RPD Input pull-down resistance

32.4

kΩ

VH Input hysteresis

0.1 × PVDD_1V8

IPAD Input leakage current, nontolerant

–1

μA

IOZ Off-state leakage current

μA

IOL Sink current at VOL (max)

2 mA

1.11

4 mA

2.25

8 mA

4.48

12 mA

6.72

IOH Source current at VOH (max)

2 mA

1.1

4 mA

2.2

8 mA

4.4

12 mA

6.6

m A

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Working Mode

Conditions

Result

Airplane mode

Only the module; no other devices

TBD

Power saving mode

TBD

LTE Band2 working mode

TBD

LTE Band4 working mode

TBD

LTE Band12 working mode

TBD

Powering on

Conditions

Result

Peak power consumption

Power consumption peak when the module is powering on

TBD

3.6 JTAG Interface

The IMS2 series contains one JTAG interface; leave JTAG pins floating if they are not used.

Figure 3-4. JTAG schematic

3.7 Power Consumption

This section describes the typical power consumption of the IMS2 (for reference).

Table 3-4. LTE power consumption

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Power off

Conditions

Result

Power off consumption

The module is powered off.

TBD

3.8 RF Performance

Each IMS2 module has only one RF pad; developers must connect it via 50 Ω traces to the main board.

Main antenna pad (Pin15) – Primary RX/TX path

3.8.1 RF Pad Design

We recommended that a ground not be present under the surface of the RF pads in the layout. Details are included below. Layer2 has the same exclusion area as Layer1.

Figure 3-5. Sample RF pad layout

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The RF trace between RF pads and antenna should as shorter as possible with 50ohm characteristic impedance. The characteristic impedance depends on the dielectric of PCB, the track width and the ground plane spacing. Microstrip type is required. The detail simulation as below.

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The antenna should be 50ohm characteristic impedance with the return loss of better than -10dB at the operation band. The antenna gain would affect the radiated power and regulator test result.

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IMS2

module

Primary

Antenna

Pin15 RF_1

Antenna

matching

RF connector

1. Reserve the matching circuit as depicted in the topological structure below.

2. The matching circuit should be as close to the module as possible.

The impedance (S11) should be close to 50 Ω, VSWR < 1.5.

3.8.2 RF Matching Guide

Figure 3-6. RF matching guide

Product datasheet

3.8.3 Interference and Sensitivity

This section includes tips to help developers identify interferences that may affect the IMS2 module when used in systems.

 Interference from other wireless devices

– Harmonics, inter-modulated signals generated from wireless devices

within the RX ranges of the modules may result in degraded RX performance.

– We highly recommend checking the RX performance of entire

systems within the shielding environment.

 Interference from the host interface

– High-speed signal-switching elements in systems can easily couple

noise into the module (ex.: DDR memory, LCD modules, DC-DC converters, PCM signals).

 Methods to avoid sources of interference

– Antenna location is important; we recommend directing the

antenna away from high-speed switching signals. Furthermore, the trace from the module to the antenna should be as short as possible and must be shielded by complete grounding.

– The IMS2 module is well shielded; high-speed elements (Ex.: DDR

memory, LCD modules, DC-to-DC converters, PCM signals) on a system should have shielding reserved during the early stages of development.

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Band

Uplink (MHz)

Downlink (MHz)

LTE Band 2

1,850–1,910

1,930–1,990

LTE Band 4

1,710–1,755

2,110–2,155

LTE Band 12

699–716

729–746

Band

Bandwidth

1.4 MHz

3 MHz

5 MHz

10 MHz

15 MHz

20 MHz

LTE Band 2

- -   



LTE Band 4

- -   



LTE Band 12

- -   -

Band

Items

Parameter

Unit

Min.

Typ.

Max.

LTE Band 2

Max. TX Power

20 MHz 1 RBs/QPSK

dBm

20.3

25.7

LTE Band 4

Max. TX Power

20 MHz 1 RBs/QPSK

dBm

20.3

25.7

LTE Band 12

Max. TX Power

10 MHz 1 RBs/QPSK

dBm

20.3

25.7

3.8.4 Band Support

Table 3-5. Band support

3.8.5 Bandwidth Support

Table 3-6. Bandwidth support

Product datasheet

Note: The IMS2 supports 1.4 MHz and 3 MHz (not default settings).

3.8.6 RF Transmission Specifications

Table 3-7. Conductive Tx output power

Notes: 1.The RF transmission specification is defined at the LGA pad.

2. IMS2 fulfills 3GPP test standards.

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Band

Items

Parameter

Unit

Min.

Typ.

Max.

L T E

B a n d

R X

S e n s i t i v i t y

5 M Hz wit h 4 RB s

d B m

–99.5

LTE Band 4

RX Sensitivity

5 MHz with 4 RBs

dBm

–101.5

LTE Band 12

RX Sensitivity

5 MHz with 4 RBs

dBm

–98.5

3.8.7 RF Receiver Specifications

Table 3-7. Conductive Rx sensitivity-3GPP

Product datasheet

Notes: 1. The RF receiver specification is defined at the LGA pad.

2. IMS2 fulfills 3GPP test standards.

3.9 Temperature

• 3GPP compliance: –20 °C to +60 °C (ambient)

• Functional: –40 °C to +85 °C

• Storage: –40 °C to +85 °C

3.10 LTE Power Saving Mode

Note: Details will be provided in a future revision of this document.

3.11 Serial Number and IMEI

Serial number and IMEI data can be written to the module only once; these two data

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points cannot be rewritten on the SQN3330 platform.

Product datasheet

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Figure 4-1. Top view

Figure 4-2. Right view

4 Mechanical Information

4.1 Physical Dimensions

Device dimensions illustrated in Figure 4-1 and Figure 4-2 below.

Product datasheet

4.2 Pin Dimensions

The dimensions are illustrated in Figure 4-3, Figure 4-4, and Figure 4-5 below.

Figure 4-3. PIN dimensions (bottom view)

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Figure 4-4. PIN dimensions

Figure 4-5. PIN dimensions

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4.3 Marking Information

Note: Details will be provided in a future version of this document.

Product datasheet

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5 Packing Information

5.1 Packing Information

The module is delivered in tape-and-reel based on MPQ.

Note: Module packing details will be provided in a future revision of this document.

5.2 Storage Conditions

Note: Details will be provided in a future revision of this document.

6 PCB Mounting Guidelines

6.1 Mounting Considerations

This section details the recommended reflow profile when the module is mounted onto other boards.

Note: Details will be provided in a future revision of this document.

7 Regulatory and Industry Approval

7.1 Certification Testing

PTCRB, FCC, and AT&T TA

7.2 GP Compliance

RoHS (2011/65/EU)

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Initialism

Definition

Alternating Current

Direct Current

ETSI

European Telecommunications Standards Institute

GND

Ground

GPIO

General Purpose Input Output

I/O

Input/Output

IoT

Internet of Things

I2C

Inter-Integrated Circuit

LGA

Land Grid Array

LTE

Long Term Evolution

N/A

Not/Applicable

Operating System

Personal Identification Number

SIM

Subscriber Identity Module

SPI

Serial Peripheral Interface

UART

Universal Asynchronous Receiver-Transmitter

UIM

User Identity Module

USB

Universal Serial Bus

Vref

Voltage reference

WNC

Wistron NeWeb Corporation

Initialisms

Initialisms and Definitions

Product datasheet