Wistron NeWeb IMS2 User Manual

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IMS2 module user manual

Project Name: IMS2

Author: Wistron NeWeb Corporation

Revision: 1.1

Revision Date: 2017/09/13

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Technical Support Website

https://SupportIoT.wnc.com.tw

Company Website

www.wnc.com.tw

Rev. #

Author

Summary of Changes

Date

1.0

WNC

First release

2017/07/14

1.1

WNC

Add FCC statement and manual information to
the end user in the user manual

2017/09/13

Contact Information

Revision History

Product datasheet

Product datasheet

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© Wistron NeWeb Corporation

THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND
IS THE EXCLUSIVE PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED,
REPRODUCED, OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN
PERMISSION FROM WNC.

LIMITATION OF LIABILITY

THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR
DESIGN REFERENCE AND SUBJECT TO REVISION BY WNC AT ANY TIME. NOTHING IN
THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY WARRANTY OR RIGHT
TO USE THE MATERIAL CONTAINED HEREIN WITHOUT WNC’S PRIOR EXPRESS
WRITTEN CONSENT. WNC SHALL NOT BE LIABLE FOR ANY USE, APPLICATION OR
DEVELOPMENT DERIVED FROM THE MATERIAL WITHOUT SUCH PRIOR EXPRESS
WRITTEN CONSENT.

FCC Statement
Please notice that if the FCC identification number is not visible when the module is
installed inside another device, then the outside of the device into which the module
is installed must also display a label referring to the enclosed module. This exterior
label can use wording such as the following: “Contains FCC ID:NKRIMS2”. Any similar
wording that expresses the same meaning may be used.

Manual Information to the End User
The module is limited to OEM installation ONLY.
The OEM integrator is responsible for ensuring that the end-user has no manual
instruction to remove or install module.
The module is limited to installation in mobile application; a separate approval is
required for all other operating configurations, including portable configurations
with respect to Part 2.1093 and difference antenna configurations.
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with a
minimum distance of 20cm between the radiator & your body. This transmitter must
not be co-located or operating in conjunction with any other antenna or transmitter.

Product datasheet

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Contents

Contact Information .......................................................................................................................... 2

Revision History ............................................................................................................................... 2

1 Product Features ...................................................................................................................... 6

1.1 Features Description ........................................................................................................... 6

2 Pin Definitions ......................................................................................................................... 8

2.1 LGA Module Pin Diagram .................................................................................................. 8

2.2 LGA Module Pin Definitions .............................................................................................. 8

3 Electrical Specifications ......................................................................................................... 12

3.1 Electrical Operating Conditions ........................................................................................ 12

3.1.1 Detailed Information .............................................................................................. 12

3.1.2 Power Tree ............................................................................................................. 12

3.2 Control Interfaces .............................................................................................................. 13

3.2.1 Power-on Signal (TBD) ......................................................................................... 13

3.2.2 Wake-up Interface (TBD) ...................................................................................... 13

3.2.3 Reset Signal ............................................................................................................ 14

3.3 UART Interface ................................................................................................................. 14

3.4 UIM Interface .................................................................................................................... 15

3.5 I/O Characteristics ............................................................................................................. 15

3.6 JTAG Interface .................................................................................................................. 17

3.7 Power Consumption .......................................................................................................... 17

3.8 RF Performance ................................................................................................................ 18

3.8.1 RF Pad Design ....................................................................................................... 18

3.8.2 RF Matching Guide ................................................................................................ 21

3.8.3 Interference and Sensitivity .................................................................................... 21

3.8.4 Band Support .......................................................................................................... 22

3.8.5 Bandwidth Support................................................................................................. 22

3.8.6 RF Transmission Specifications ............................................................................. 22

3.8.7 RF Receiver Specifications .................................................................................... 23

3.9 Temperature ...................................................................................................................... 23

3.10 LTE Power Saving Mode ................................................................................................ 23

3.11 Serial Number and IMEI ................................................................................................. 23

4 Mechanical Information ......................................................................................................... 25

4.1 Physical Dimensions ......................................................................................................... 25

4.2 Pin Dimensions ................................................................................................................. 25

4.3 Marking Information ......................................................................................................... 27

5 Packing Information............................................................................................................... 28

5.1 Packing Information .......................................................................................................... 28

5.2 Storage Conditions ............................................................................................................ 28

6 PCB Mounting Guidelines ..................................................................................................... 28

6.1 Mounting Considerations .................................................................................................. 28

7 Regulatory and Industry Approval ......................................................................................... 28

7.1 Certification Testing ......................................................................................................... 28

Product datasheet

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7.2 GP Compliance ................................................................................................................. 28

Initialisms ........................................................................................................................................ 29

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1 Product Features

General interfaces

• JTAG

• USIM

• GPIO

• UART

Supported frequency bands

• LTE Band 2

• LTE Band 4

• LTE Band 12

Operating voltage

• VCC (range from 3.3 V to 4.2 V)

Packaging

• LGA module

• 104 pads (21.5 mm × 16.5 mm × 2.3 mm)

• RoHS compliant

Operating temperature

• 3GPP compliant: –20 °C to +60 °C (ambient)

• Operational: –40 °C to +85 °C (functional)

1.1 Features Description

The WNC IMS2 module includes the Sequans SQN3330 Cat. M1 baseband, a
complete three LTE band (2/4/12) RF front-end, memory, and required circuitry to
fulfill 3GPP E-UTRA (Long Term Evolution - LTE, Release 13 specifications) and
AT&T Wireless LTE Cat. M1 UE specifications.
The architecture block diagram of the IMS2 is presented in Figure 1-1 below.

Figure 1-1. IMS2 block diagram

Table 1-1. General features of the IMS2

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Standards
compliance

• 3GPP E-UTRA Release 13

PHY

• One UL and one DL transceiver

• Supports HD-FDD Duplexing

• Category M1 UE

• Normal cyclic prefix

• Supports MPDCCH

• Modulation

- DL: QPSK, 16QAM

- UL: QPSK, 16QAM

• All coding schemes corresponding to modulations

• All channel coding (turbo-coding with inter-leaver, tail biting

convolutional coding, block and repetition coding) and CRC
lengths

• All power control schemes and DL power allocation schemes

• UEPCOP (from 3GPP Release 12) Power Saving Mode

MAC

• Random access procedure in normal sub-frames

• Scheduling request, buffer status reporting, and power

headroom reporting

• Discontinuous reception (DRX, eDRX) with long and short cycles

• Fast scanning

• IPv4, IPv6

RLC

• ARQ modes: UM, AM, and TM

PDCP

• Ciphering and deciphering: NULL, AES, SNOW 3G

• Integrity and protection: AES, SNOW 3G

RRC

• MIB and new SIB1bis

• Supports up to eight data radio bearers

NAS and above

• NAS

• SMS over SG

• LWM2M client

Table 1-2. LTE-related features of the IMS2

Product datasheet

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Pin No.

Name

Description

7

GND

Ground

8

GND

Ground

9

NC

Not connected

10

GND

Ground

11

GND

Ground

12

GND

Ground

13

GND

Ground

14

GND

Ground

2 Pin Definitions

2.1 LGA Module Pin Diagram

The IMS2 LGA module pin layout is illustrated below.

Product datasheet

Figure 2-1. IMS2 LGA module pin layout

2.2 LGA Module Pin Definitions

The signals and all the related details are listed in the below table.

Table 2-1. IMS2 module pin definition

Product datasheet

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15

Main antenna

Main antenna port

16

GND

Ground

17

GND

Ground

18

GND

Ground

19

GND

Ground

20

GND

Ground

21

NC

Not connected

22

GND

Ground

23

GND

Ground

24

GND

Ground

25

GND

Ground

26

GND

Ground

27

NC

Not connected

28

GND

Ground

29

GND

Ground

30

GND

Ground

37

Power

Power

38

Power

Power

39

Power

Power

40

Power

Power

41

Power

Power

42

Power

Power

43

NC

Not connected

44

GND

Ground

45

GND

Ground

46

GPIO46

General purpose input/output

47

GPIO47

General purpose input/output

48

GPIO48

General purpose input/output

49

GPIO49

General purpose input/output

50

GND

Ground

51

GND

Ground

52

GPIO01

General purpose input/output

53

GPIO02

General purpose input/output

80

UART1_CTS

Clear to send for UART 1

81

UART1_RTS

Request to send for UART 1

82

UART1_Rx

Receive for UART 1

83

UART1_Tx

Transmit for UART 1

84

GND

Ground

85

GND

Ground