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IMQ3 module user manual
Project Name: IMQ3 series Module
Author: Wistron NeWeb Corporation
Revision: 0.4
Revision Date: 2019/5/16
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Contact Information
Technical Support website
https://SupportIoT.wnc.com.tw
Company Website
www.wnc.com.tw
Rev. #
Author
Summary of Changes
Date
0.1
WNC
Draft release
2018/12/25
0.2
WNC
Add FCC/IC Statement
2019/4/23
0.3
WNC
Remove the function diagram
2019/5/6
0.4
WNC
Update Antenna frequency range
2019/5/16
Revision History
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© Wistron NeWeb Corporation
THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND IS THE
EXCLUSIVE PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED, REPRODUCED, OR
DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION FROM WNC.
LIMITATION OF LIABILITY
THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR DESIGN
REFERENCE AND SUBJECT TO REVISION BY WNC AT ANY TIME. NOTHING IN THIS
DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY WARRANTY OR RIGHT TO USE THE
MATERIAL CONTAINED HEREIN WITHOUT WNC’S PRIOR EXPRESS WRITTEN CONSENT. WNC
SHALL NOT BE LIABLE FOR ANY USE, APPLICATION OR DEVELOPMENT DERIVED FROM THE
MATERIAL WITHOUT SUCH PRIOR EXPRESS WRITTEN CONSENT.
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Contents
Contact Information
Revision History
Contents
1. Introduction
2. Pin Definitions
....................................................................................................................................
1.1. Modules RF band support
1.2. Features
1.3. Module Connection Interface
1.4. Environmental Specifications and Certifications
1.4.1. Environmental Specifications
1.4.2. Certifications
1.4.3. Green Product Compliance
2.1. LGA Module Pin Diagram
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2
2
4
7
7
7
8
8
8
9
9
10
10
2.2. LGA Module Pin Definitions
3. Electrical Specifications
3.1. Power supply
3.2. Power consumption
3.3. I/O Interface
3.4. USB interface
3.5. UIM interface
3.6. Control interface
3.6.1. Power-on/ WAKEUP_IN Signal
3.6.2. WAKEUP_OUT interface
3.6.3. Reset Signal
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25
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3.6.4. SPI Master Interface
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30
3.6.5. PCM Interface
3.6.6. I2S Interface
3.6.7. I2C Interface
3.6.8. UART Interface
3.6.9. ADC Interface
3.7. RF Specifications
3.7.1. Band support
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3.7.2. Bandwidth support
3.7.3. RF Transmit Specification
3.7.4. RF Receiver Specification
3.7.5. GNSS Receiver Specification
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31
33
34
35
35
36
36
37
37
38
39
4. Software Interface
4.1. Support tools
4.2. USB interface
5. Mechanical
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5.1. PCBA Form Factor
6. Design Guide
6.1. Power supply
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6.2. Thermal design
6.3. USB design
6.4. RF connection
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6.5. Interference and sensitivity
6.6. GNSS external circuit design
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40
40
40
41
41
44
44
45
46
46
48
49
6.7. Reflow
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50
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6.8. PCB pad design
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51
6.9. Stencil
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6.10. Antenna design requirement
7. Labeling and Packaging
7.1. Labeling
7.2. Packing
7.3. MSL level
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8. Safety Recommendation
Initialisms
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54
55
55
55
57
58
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1. Introduction
The WNC IMQ3 series modules are includes the Qualcomm MDM9206 Cat. M1 baseband, a
1.1. Modules RF band support
Table 1. IMQ3 series module overview
Module
LTE CAT M1
GPRS/EGPRS
GPS
IMQ3-2√√
√
IMQ3-1√√
×
IMQ3-0√×
√
IMQ3-3√×
×
Note:
1. LTE global band definition is B1/B2/B3/B4/B5/B8/B12/B13/B18/B19/B20/B25/B26/B28
2. EGPRS band definition is quad-band.
3. “√” indicates supporting. “×” indicates not supporting.
1.2. Features
LTE 3GPP release 13
3GPP category support: LTE Cat. M1 with 375 Kbps for UL, 300 Kbps for DL,
Ultra-high-performance Cortex A7 microprocessor
Modem subsystem (MSS)
Resource and power management (RPM) subsystem
Optimized for M2M and IoT markets
Interfaces
–
HS USB 2.0 with integrated PHY
–
Dual UART interfaces (4 bit and 2 bit) for data transfer and diagnostic tools
complete LTE RF front-end, memory, and required circuitry to fulfill 3GPP E-UTRA (Long Term
Evolution - LTE, Rel-13 specifications). IMQ3 series modules provide a variety of interfaces
including USB, SPI, UART, PCM, I2C, UIM.
This section lists main features and capability that IMQ3 series module support, for wireless
technology and band support information among different modules, please refer to table1
for detail information.
Feature list:
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– I2C/SPI interface
– USIM interface
– GPIOs
– ADC
– PCM/I2S
1.3. Module Connection Interface
The IMQ3 modules are LGA device. All electrical and mechanical connections are made through
the 104 pads on the bottom side of the PCB.
Figure 1. LGA pad
1.4. Environmental Specifications and Certifications
1.4.1. Environmental Specifications
The environmental specifications for both operating and storage conditions are defined in
Grade
Operating
3GPP compliant
Functional work
Storage
Industrial
–40 °C~+85 °C
–20 °C~+60 °C
–40 °C~+85 °C
–40 °C ~+85 °C
the table below.
Note: The temperature above refers to ambient temperature.
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1.4.2. Certifications
The IMQ3 module is compliant with the following regulations: PTCRB, GCF, FCC, IC, AT&T,
1.4.3. Green Product Compliance
Verizon and Sprint.
RoHS (2011/65/EU)
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2. Pin Definitions
2.1. LGA Module Pin Diagram
The IMQ3 LGA module pin layout is illustrated below.
Figure 2. LGA pad diagram (top view)
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2.2. LGA Module Pin Definitions
The signals and all the related details are listed in the below table.
Table 2. module pin definitions
Pin No.
PIN Definition
Voltage Level (V)
Min.
Typ.
Max.
1
GND-0
-
2
GND-0
-
3NC---
4
GND-0
-
5
GND-0
-
6
GND-0
-
7
GND-0
-
8
GND-0
-
9
RF_GNSS
---
10
GND-0
-
11
GND-0
-
12
GND-0
-
13
GND-0
-
14
GND-0
-
15
RF_1--
-
16
GND-0
-
17
GND-0
-
18
GND-0
-
19
GND-0
-
20
GND-0
-
21NC---
22
GND-0
-
23
GND-0
-
24
GND-0
-
25
GND-0
-
26
GND-0
-
27NC---
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28
GND-0
-
29
GND-0
-
30
GND-0
-
31
GND-0
-
32
GND-0
-
33NC---
34
GND-0
-
35
GND-0
-
36
GND-0
-
37
VCC1
3.3
3.8
4.2
38
VCC2
3.3
3.8
4.2
39
VCC3
3.3
3.8
4.2
40
VCC4
3.3
3.8
4.2
41
VCC5
3.3
3.8
4.2
42
VCC6
3.3
3.8
4.2
43NC---
44
GND-0
-
45
GND-0
-
46
PCM_SYNC/GPIO46 (RFU)
1.7
1.8
1.9
47
PCM_DIN/GPIO47 (RFU)
1.7
1.8
1.9
48
PCM_DOUT/GPIO48 (RFU)
1.7
1.8
1.9
49
PCM_CLK/GPIO49 (RFU)
1.7
1.8
1.9
50
GND-0
-
51
GND-0
-
52
Force USB BOOT Config
1.7
1.8
1.9
53NC---
54
GPIO03
1.7
1.8
1.9
55NC---
56NC---
57NC---
58NC---
59NC---
60
I2C_SDA/SPI_EN_1
1.7
1.8
1.9
61
I2C_SCL/SPI_CLK
1.7
1.8
1.9
62
SPI_MOSI
1.7
1.8
1.9
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63
SPI_MISO
1.7
1.8
1.9
74
GND-0
-
75
GND-0
-
76NC---
77NC---
78NC---
79NC---
80
UART1_CTS (UART 1)
1.7
1.8
1.9
81
UART1_RTS (UART 1)
1.7
1.8
1.9
82
UART1_RX (UART 1)
1.7
1.8
1.9
83
UART1_TX (UART 1)
1.7
1.8
1.9
84
GND-0
-
85
GND-0
-
86
USB_Dp
-
Note6
-
87
USB Detect
1.7
1.8
1.9
88
USB_Dn
-
Note6
-
89
GND-0
-
90
GND-0
-
91
GND-0
-
92
GPIO92
1.7
1.8
1.9
93
GPIO93
1.7
1.8
1.9
94
GPIO94
1.7
1.8
1.9
95
GPIO95
1.7
1.8
1.9
96
GPIO96
1.7
1.8
1.9
97
GPIO97
1.7
1.8
1.9
98
GPIO98
1.7
1.8
1.9
99NC---
100NC---
101
GPIO101
1.7
1.8
1.9
102
GPIO102
1.7
1.8
1.9
103NC---
104
GND-0
-
105
GND-0
-
106
UART2_RX (UART 2)
1.7
1.8
1.9
107
UART2_TX (UART 2)
1.7
1.8
1.9
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108
GND-0
-
109
GND-0
-
120NC---
121NC---
122
AD Converter
0.1-1.7
123NC---
124NC---
125NC---
126NC---
127NC---
128NC---
129
GPIO05
1.7
1.8
1.9
130
GPIO06
1.7
1.8
1.9
131NC---
132NC---
133
UIM_VCC
1.7/2.7
1.8/3.0
1.9/3.3
134
UIM_DATA
1.7/2.7
1.8/3.0
1.9/3.3
135
UIM_CLK
1.7/2.7
1.8/3.0
1.9/3.3
136
UIM_RESET
1.7/2.7
1.8/3.0
1.9/3.3
137
UIM_DETECT
1.7
1.8
1.9
138NC---
139
GND-0
-
140
GND-0
-
141
WWAN_STATE
1.7
1.8
1.9
142
POWER_ON/WAKEUP_IN
1.7
1.8
1.9
143
WAKEUP_OUT
1.7
1.8
1.9
144NC---
145
RESET
1.7
1.8
1.9
146
VREF
1.7
1.8
1.9
200NC---
201NC---
202NC---
203NC---
204NC---
205NC---
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206NC---
207NC---
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3. Electrical Specifications
3.1. Power supply
The IMQ3 modules are supplied through the power signal with the following
Table 3. Power supply
Direction
Vmin
Typical
Vmax
Power (37–42)
In
3.3 V
3.8 V
4.2 V
VREF
Out
1.71 V
1.8 V
1.89 V
UIM_VCC
Out
1.71 V
1.8 V
1.89 V
2.85 V
3.0 V
3.15 V
3.2. Power consumption
Powering on
Conditions
Result
Peak power consumption
Max transient current consumption when the module runs at the
maximum power.
620mA
Power off
Conditions
Result
Power off consumption
Only the module; no other devices; only RTC functions in deep
sleep.
9.4uA
Working
Mode
Conditions
Result
characteristics.
This section describes typical power consumption of IMQ3 for reference. The current data is
measured at 3.8V VCC.
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LTE Band 1 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
173mA
LTE Band 2 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
171mA
LTE Band 3 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
156mA
LTE Band 4 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
157mA
LTE Band 5 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
171mA
LTE Band 8 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
177mA
LTE Band 12 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
174mA
LTE Band 13 working mode
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Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
164mA
LTE Band 18 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
173mA
LTE Band 19 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
179mA
LTE Band 20 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
179mA
LTE Band 25 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
169mA
LTE Band 26 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
173mA
LTE Band 28 working mode
Max Tx power without throughput, Power voltage 3.8 V; average
current, CMW500 eMTC mode.
174mA
GPRS working mode(1DL4UL)
Max Tx power without throughput, Power voltage 3.8 V; average
current, GSM850
281.84mA
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Max Tx power without throughput, Power voltage 3.8 V; average
current, GSM900
281mA
Max Tx power without throughput, Power voltage 3.8 V; average
current, DCS1800
236mA
Max Tx power without throughput, Power voltage 3.8 V; average
current, PCS1900
220.55mA
Low power
Mode
Conditions
Result
Idle mode
LTE Standby, 1.28s
1.66mA
LTE Standby, 2.56s
1.307mA
e-DRX mode
LTE standby 10MHz w/81.92s
0.902mA
e-DRX PTW 20.48 and DRx 2.56Sec
PSM mode
T3412-Extended=24H,T3324=10s,
20.57uA
One PSM cycle per day
Rock bottom current
Only the module; no other devices; only RTC functions in deep
sleep.
9.4uA
Note: USB is disabled when testing airplane mode and standby mode.
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3.3. I/O Interface
I/O type description:
AO : Analog Output
AI : Analog Input
DO : Digital Output
DI : Digital Input
Table 4. Pin interface family
Interface Family
Signal
Description
I/O
RF Interfaces
RF_GNSS
Reserved for GNSS
receiver
AI
RF_1
Main Antenna
AI/AO
User Identity Module
UIM_VCC
Power source for UIM
AO
UIM_DATA
Data in/out
DI/DO
UIM_CLK
Clock signal
DO
UIM_RESET
Reset signal
DO
UIM_DETECT
UIM Detect signal
DI/DO
Data Interfaces- USB 2.0
USB_HS_DP
USB Data Positive
DI/DO
USB Detect
USB Detect
DI
USB_HS_DM
USB Data Negative
DI/DO
Data Interfaces- UART1
UART1_CTS_N
Clear To Send for UART 1
DI
UART1_RFR_N
Ready for receive for
UART1
DO
UART1_RX
Receive for UART 1
DI
UART1_TX
Transmit for UART 1
DO
Data Interfaces- UART2
UART2_RX
Receive for UART 2
DI
UART2_TX
Transmit for UART 2
DO
Data Interfaces- I2C/ SPI
I2C_SDA
Data in/out
DI/DO
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SPI_EN_1
SPI chip select
DO
I2C_SCL
Clock signal
DO
SPI_CLK
SPI serial clock
DO
SPI_MOSI
SPI master out slave in
DO
NCNC-
SPI_MISO
SPI master in slave out
DI
Module Control and State
Interfaces
WWAN_STATE
Wireless WAN Radio
State
DO
POWER_ON
Power On the module
DI
WAKEUP_OUT
Module wakes up host
DO
WAKEUP_IN
Host wakes up module
DI
RESET
Reset the module
DI
Power and Ground
VREF
Voltage Reference
Output
AO
VCC
Main Power
AI
GND
GND
AI
General Purpose
GPIO
Digital I/O
DI/DO
ADC_CONVENTOR
ADC_CONVENTOR
AI
AUDIO- PCM/I2S（RFU）
PCM_DIN
PCM_DIN
DI
I2S_DATA0
I2S_DATA0
DI/DO
PCM_DOUT
PCM_DOUT
DO
I2S_DATA1
I2S_DATA1
DI/DO
PCM_CLK
PCM_CLK
DO
I2S_SCK
I2S_SCK
DO
PCM_SYNC
PCM_SYNC
DO
I2S_WS
I2S_WS
DO
RFU- RFU
RFU
Reserved For Future Use
-
Debug- Force_USB_BOOT
Force_USB_BOOT_CONFIG
Force USB BOOT CONFIG
DI
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Notes: *2. Do not pull pin143 WAKEUP_OUT to high; otherwise boot will fail.
Table 5. Digital I/O characteristics
PU: Pull Up.
PD: Pull Down
NP: Non-Pull
*3. Pull Pin144 WAKEUP_IN to VREF with a 100k resistor and keep it high before
system boot process is complete.
*4. Pull pin142 POWER_ON to VREF with a 100k resistor for stability considerations.
*6. Refer to section 2.3, for more information please check USB2.0 standard
*8. Pull pin87 USB detect to VREF with a 100k resistor to enable module USB, pull
pin87 low to disable module USB, CPU USB PHY consumes some current when
USB is enabled.
*9. Do not pull pin52 to high before the system boot process is complete.
*10. Leave unused pins floating
*11. Reserve test points on pin52/86/88/106/107 for debug purpose if possible.
*12. If voltage level of digital I/O from the other side is not compatible with module,
level shifter is recommended to transfer the voltage level to 1.8V.
Note2,3,4,8,9,10 must be followed otherwise module may fail or malfunction.
Below is the I/O default setting table to describe the level. It’s recommended to follow the
pulling High or Low to choose a suitable GPIO for application.
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Table 6. I/O default setting table
Pin No.
Signal Name
Type
Default setting in Normal mode
46
PCM_SYNC/GPIO46(RFU)
DI /DO
PD
47
PCM_IN/GPIO47(RFU)
DI /DO
PD
48
PCM_OUT/GPIO48(RFU)
DI /DO
PD
49
PCM_CLK/GPIO49(RFU)
DI /DO
PD
52
Force USB BOOT Config
DI/DO
PD
54
GPIO03
DI/DO
PD
60
I2C_SCL/SPI_CLK
DI/DO
PD
61
I2C_SDA/SPI_EN_1
DI/DO
PD
62
SPI_MOSI
DI/DO
PD
63
SPI_MISO
DI/DO
PD
80
UART1_CTS (UART1)
DI/DO
PD
81
UART1_RTS (UART1)
DI/DO
PD
82
UART1_RX (UART1)
DI/DO
PD
83
UART1_TX (UART1)
DI/DO
PD
92
GPIO92
DI/DO
PD
93
GPIO93
DO
NP
94
GPIO94
DI/DO
PD
95
GPIO95
DI/DO
PD
96
GPIO96
DI/DO
PD
97
GPIO97
DI/DO
PD
98
GPIO98
DI/DO
PU
101
GPIO101
DI/DO
PD
102
GPIO102
DI/DO
PD
106
UART2_RX (UART2)
DI/DO
PD
107
UART2_TX (UART2)
DI/DO
PD
120
GPIO120
DI/DO
PD
129
GPIO05
DI/DO
PD
130
GPIO06
DI/DO
PD
141
WWAN_STATE
DI/DO
PD
143
WAKEUP_OUT
DI/DO
PD
144
WAKEUP_IN
DI
PD
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3.4. USB interface
The IMQ3 series modules comply with USB 2.0 high-speed protocol. The USB input/output
Table 7. Signals of the USB interface
Name
Description
Input/Output (Direction
to module)
Voltage Level (V)
Min.
Typ.
Max.
D+
USB data positive
(low-/full-speed)
Input High
2
3.3
3.6
Input Low
0
0.8
Output High
2.8
3.3
3.6
Output Low
0.3
USB data positive
(high-speed)
Input High
0.3
0.44
Input Low
0
0.01
Output High
0.36
0.38
0.44
Output Low
0
0.01
D–
USB data negative
(low-/full-speed)
Input High
2
3.3
3.6
Input Low
0
0.8
Output High
2.8
3.3
3.6
Output Low
0.3
USB data negative
(high-speed)
Input High
0.3
0.44
Input Low
0
0.01
Output High
0.36
0.38
0.44
Output Low
0
0.01
lines follow USB 2.0 specifications.
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3.5. UIM interface
IMQ3 series modules provide an UIM_DETECT input pin for UIM connector to detect UIM
Figure 3. UIM card circuit example
card. When UIM card is present, UIM_DETECT should be high(1.8V). If UIM card is absent,
UIM_DETECT should be low. It’s required to pull UIM_DETECT to VREF with a 470k resistor.
A 0.1μF and a 33pF capacitor are recommended to place between UIM_VCC and Ground in
parallel. A 33pF capacitor is recommended to place between UIM_RESET, UIM_CLK and
UIM_DATA and Ground in parallel see Figure5 for reference.
Electrostatic discharge (ESD) protection circuit is also recommended to place near the UIM
socket as close as possible, and the Ground pin of the ESD protection component must be
well connected to the Ground plane.
The following figure shows an example of UIM card circuit.
It’s highly suggested to make sure that SIM electrical characteristics can meet ETSI TS
102 221 requirement before going to certification like PTCRB. Refer to the following
capture from ETSI TS 102 221 section 5 for critical requirement:
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3.6. Control interface
This section describes the power-on/off, wake-up and reset interface on how to control the
3.6.1. Power-on/ WAKEUP_IN Signal
Module Off - VCC is not present.
Module Enabled - VCC is supplied, and the module is enabled.
Module Disabled - VCC is supplied, and the module is disabled.
When voltage is applied to VCC, the module shall enter the Module Disabled
An input to the POWER_ON pin shall trigger the transition from the Module
module.
The POWER_ON is an active Low input signal used to enable or disable the module. Do not
toggle the PERST# pin during power-on. This signal has the highest priority over the wakeup,
the alarms signals, and the digital control pins.
There are three possible states of the module:
The state transitions are defined as follows:
state.
Disabled to the Module Enabled state. See figure6, a low pulse(tlow > 0s) on
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POWER_ON pad will enable the module after VCC is applied.
Figure 4. Power ON/OFF timing
3.6.2. WAKEUP_OUT interface
3.6.3. Reset Signal
After module power on, it also can wakeup the module in PSM deep sleep mode if host
want to transmit data.
WAKEUP_IN description: (Host: Output, Modem: Input)
– HIGH:
Host does not require the modem (allowing it to enter PSM deep-sleep mode).
– LOW:
If the modem is in PSM deep-sleep mode, set this pin to low level will wakeup the modem.
"WAKEUP_OUT" (Host: Input, Modem: Output):
– LOW: The modem is power off or in PSM deep-sleep mode.
– HIGH: The modem is normal/eDRX /DRX mode and other status.
T he Reset Signal is a hardware reset signal to control the system reset directly. You can
connect it to a key or a control signal. A low pulse(3s<tlow<4s) after power on will reset the
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module, see figure7.
Figure 5. Reset Signals circuit
3.6.4. SPI Master Interface
SPIM_CLK – Output clock
SPIM_CS – Output, chip-select
SPIM_MOSI – Output, data to slave
SPIM_MISO – Input, data from slave
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Timing
Figure 6. SPI timing parameters
3.6.5. PCM Interface
Figure 7. PCM connection (example)
IMQ3 series modules provide one PCM master digital audio interface. Keep PCM signal
traces far away from noise and radiating signal on PCB
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Timing
Figure 8. PCM timing diagram
Figure 9. PCM timing parameters
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3.6.6. I2S Interface
PCM and I2S share the same pins on the modules, I2C only support master mode, keep I2S
Config1
Config2
PCM_SYNC
I2S_WS
PCM_DIN
I2S_DATA0
PCM_DOUT
I2S_DATA1
PCM_CLK
I2S_SCK
Figure 10. I2S connection (example)
signal trace far away from noise and radiating signal on PCB
Timing
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Figure 11. I2S timing diagram
Figure 12. I2S timing parameters
3.6.7. I2C Interface
IMQ3 series modules provide one I2C interface, I2C only support master mode.
Figure 13. I2C connection (example)
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3.6.8. UART Interface
There are dual UART interfaces. One is 4 bit for high-speed data transfer, and the other is
Figure 14. Recommended circuit for UART interface (4 bit) with Level Shifter
3.6.9. ADC Interface
2 bit for diagnostic tools and debugging. Recommended to reserve a pull down 1kΩ
resistor on UART1_RTS signal near IMQ3 module
An Analog to Digital Converter (ADC) input is provided by the IMQ3 series. The converter is
16 bit resolution, ranging from 0.1 V to 1.7 V, with a sampling rate of 2.4 MHz.
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Layout suggestion:
ADC signal trace should be well protected by GND plane
ADC signal trace should be protected from noise and other radiating signals
3.7. RF Specifications
3.7.1. Band support
Table 8. Band support
LTE Band
Uplink (MHz)
Downlink (MHz)
LTE Band 1
1,920-1,980
2,110-2,170
LTE Band 2
1,850–1,910
1,930–1,990
LTE Band 3
1,710-1,785
1,805-1,880
LTE Band 4
1,710–1,755
2,110–2,155
LTE Band 5
824–849
869–894
LTE Band 8
880-915
925-960
LTE Band 12
699–716
729–746
LTE Band 13
777-787
746-756
LTE Band 18
815-830
860-875
LTE Band 19
830-845
875-890
LTE Band 20
832-862
791-821
LTE Band 25
1,850–1,915
1,930–1,995
LTE Band 26
814-849
859-894
LTE Band 28
703-748
758-803
EGPRS Band
Uplink (MHz)
Downlink (MHz)
GSM850
824–849
869–894
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GSM900
880-915
925-960
DCS1800
1,710-1,785
1,805-1,880
PCS1900
1,850–1,910
1,930–1,990
3.7.2. Bandwidth support
Table 9. Bandwidth support
Band
Bandwidth
1.4 MHz
3 MHz
5 MHz
10 MHz
15 MHz
20 MHz
LTE Band 1
--
LTE Band 2
LTE Band 3
LTE Band 4
LTE Band 5
-
-
LTE Band 8
-
-
LTE Band 12
-
-
LTE Band 13
-
-
-
-
LTE Band 18
--
-
LTE Band 19
-
-
-
LTE Band 20
-
-
LTE Band 25
LTE Band 26
-
LTE Band 28
-
3.7.3. RF Transmit Specification
Table 10. Conductive Tx output power
Band
Items
Parameter
Unit
Min.
Typ.
Max.
LTE Band 1
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 2
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 3
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 4
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 5
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 8
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 12
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
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LTE Band 13
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 18
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 19
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 20
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 25
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 26
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 28
Max. TX Power
10 MHz 4 RBs/QPSK
dBm
19.8
23
25.7
Band
Items
Parameter
Unit
Min.
Typ.
Max.
EGPRS 850
Max. TX power
-
dBm2123
25
EGPRS900
Max. TX power
-
dBm2123
25
EGPRS1800
Max. TX power
-
dBm2022
24
EGPRS1900
Max. TX power
-
dBm2022
24
Note: 1.The RF Transmit Specification is defined at the LGA pad.
2. IMQ3 series meet 3GPP TS 36.521-1/TS 51.010-1 test standard.
3.7.4. RF Receiver Specification
Table 11. Conductive Rx sensitivity-3GPP
LTE Band
Items
Parameter
Unit
Typ.
3GPP limit
LTE Band 1
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-107
-102.3
LTE Band 2
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-107
–100.3
LTE Band 3
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-107.5
–99.3
LTE Band 4
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-107.5
–102.3
LTE Band 5
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-107
–100.8
LTE Band 8
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-107
–99.8
LTE Band 12
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-108
–99.3
LTE Band 13
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-108
–99.3
LTE Band 18
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-107.5
–102.3
LTE Band 19
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-107
–102.3
LTE Band 20
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-108
–99.8
LTE Band 25
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-107.5
–98.8
LTE Band 26
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-107
–100.3
LTE Band 28
RX Sensitivity
5 MHz with 4 RBs
dBm/720KHz
-108
–100.8
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GSM Band
Items
Parameter
Unit
Typ.
3GPP limit
EGPRS850(MCS9)
RX Sensitivity
-
dBm
-91
–86
EGPRS900(MCS9)
RX Sensitivity
-
dBm
-91
–86
EGPRS1800(MCS9)
RX Sensitivity
-
dBm
-91
–86
EGPRS1900(MCS9)
RX Sensitivity
-
dBm
-91
–86
Note: 1. The RF Receiver Specification is defined at the LGA pad.
2. IMQ3 series meet 3GPP TS 36.521-1/TS 34.121-1 test standard.
3.7.5. GNSS Receiver Specification
Table 12. GNSS receiver performance
Test items
Parameter
Min.
Typ.
Max.
Cold start TTFF
(@-130dBm)
-
38S
-
Hot start TTFF
(@-130dBm)
-2S-
CEP-50 Accuracy
Open sky with -130 dBm input
-
<3m
-
Cold start sensitivity
Acquire First with Signal level
-
-146dBm
-
Tracking sensitivity(GPS)
Detect an in-view satellite 50% of
the time.
-
-162dBm
-
Tracking sensitivity
(Glonass)
Detect an in-view satellite 50% of
the time.
-
-162dBm
-
Note1. The test point shows as below.
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4. Software Interface
4.1. Support tools
The IMQ3 series modules are compatible with the following support tools:
WNC IMQ3 Connection Manager (WNCCM) (TBD)
4.2. USB interface
The IMQ3 series modules support 3GPP standard AT commands and proprietary AT
commands.
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5. Mechanical
5.1. PCBA Form Factor
IMQ3 series modules have the same dimensions:
Top view
Right view
Figure 15. PCBA dimension
26.3 mm (typ.) × 23.1 mm (typ.) × 2.56 mm (typ.)
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Figure 16. Pad dimension(Bottom view)
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Figure 17. Recommend PCB footprint
Figure 18. Pin1 location
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6. Design Guide
6.1. Power supply
LTE module power input is VCC. The internal power chipset will transfer VCC to other power
Table 13. Power supply voltage level
Power
Pin Name
Pads
Description
Voltage Level (V)
Min.
Typ.
Max.
VCC
VCC1 to VCC6
Nos. 37 to 42
Main Power Supply
3.3
3.8
4.2
level.
The IMQ3 series module include an integrated power manager enabling single and direct
voltage supply from the battery, reducing the overall bill of materials. The typical voltage
3.8V is recommended.
Schematic suggestion: Must to separate module power supply to three paths to keep
power clean as below for TX spurious performance. The VPH_PWR is for Baseband and RF
transceiver, the VPH_PWR_RF is for RF PA, the VPH_PWR_RF_VBATT is for RF PA control
circuit.
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Layout Suggestion: The 22μF, 0.1uF, 12pF and 8pF capacitors are required to place near
Net Name
Current Value
VCC(1–2) total
1A
VCC(3) total
100mA
VCC(4–6) total
1A
UIM_VCC
150 mA
VREF
300 mA
6.2. Thermal design
Grade
Operating
3GPP compliant
Functional work
Storage
Commercial
–25 °C~+75 °C
–20 °C~+60 °C
–25 °C~+75 °C
–40 °C~+85 °C
Industrial
–40 °C~+85 °C
–20 °C~+60 °C
–40 °C~+85 °C
–40 °C ~+85 °C
VCC pins as close as possible. Each power trace should possess
sufficient line width to withstand its respective current listed in the
table below:
Note: The temperature above refers to ambient temperature.
The case temperature of module shielding cover must be < 85 °C when integrated to
prevent damage.
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Design points used to improve the thermal performance:
It’s better to add a naked copper area onto IMQ3 modules’ back side of the PCB.
It’s recommended to have a thermal pad or a heat sink on shielding cover to
If systems with IMQ3 series modules embedded intend to work under ambient
6.3. USB design
Differential impedance: 90 Ω
Space to other signals should be at least 20 mils
Intra-lane length difference should be less than 150 mils
Maximum length for each trace:150 mm
Function
Net
Length (mil)
USB
USB_Dp
545.54
USB_Dn
503.04
6.4. RF connection
If the thermal performance becomes an issue in the customer’s product, add
thermal solutions for improvement such as a thermal pad or a heat sink.
help transfer heat.
temperatures as low as -40°C, it’s suggested that:
1. SIM Card need to be well arranged to make sure it is functional at the
condition of ambient temperature as low as -40°C.
2. Adding heating circuit on board design, the circuit mainly consists of
temperature sensing unit, heating element and control unit.
The layout design of this circuit on the carrier board should comply with the USB 2.0
high-speed protocol.
Layout suggestion:
Signals lengths on modules are tuned as below:
The IMQ3 series modules have three RF pads; developers must connect them via 50 Ω
traces to the main board.
ANT0_TRX pad (Pin15) – Primary RX/TX path
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ANT_GNSS pad (Pin9) – GNSS path (optional)
Figure 19. RF pad layout suggestion
It is recommended that grounds not be present under the surface of the RF pads in the
layout. Details are included below. Layer2 has the same keep out size as Layer1
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Figure 20. RF matching guide
6.5. Interference and sensitivity
This section includes tips to assist developers in identifying the interference that may affect
Interference from other wireless devices
–
Harmonics, inter-modulated signal generated from wireless devices that
–
It is highly recommended to check RX performance of entire systems
Interference from host interface
–
High-speed signal-switching elements in systems can easily couple noise
Methods to avoid sources of interference
– Antenna location is important; we recommend directing the antenna
IMQ3 series modules when used in systems.
fall in RX ranges of the modules, may result in degraded RX performance.
within the shielding environment.
into the module (Ex.: DDR memory, LCD modules, DC-DC converter, PCM
signal).
away from high-speed switching signals. Furthermore, the trace from the
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module to the antenna should be as short as possible and must be
– The IMQ3 series modules are well shielded; the high-speed elements
6.6. GNSS external circuit design
Figure 21. GNSS design suggestion
shielded by complete grounding.
(Ex.: DDR memory, LCD modules, DC-DC converter, PCM signal) on a
system should have shielding reserved during the early stages of
development.
Caution: DDR bus, LCD bus, DC-DC switching and PCM signals are
easily to influence the WWAN and GPS receiver performance, these
signals must to be routed in the inner layer of the PCB and far away
from the WWAN and GPS receiver path.
One GNSS SAW filter, LNA, and another GNSS SAW filter need to be used between the
module and antenna. Detail design guide as below. in129 GPIO05Pin129 GPI
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The following SAW filter and LNA components have been implemented by WNC
SAW filter1: Murata SAFFB1G56KB0F0AR15
LNA: INFINEON BGA824N6
SAW fiter2: Murata SAFFB1G56KB0F0AR15
6.7. Reflow
Temp. Region
1234567891011
Upper temp. region
160
170
180
180
180
205
225
230
240
250
245
Lower temp. region
160
170
180
180
180
205
225
230
240
250
245
Conveyer band speed
90 cm/minute
PWI = 48%
U10-1
T1-2
J3-3
U42-4
Temp.
Difference
Preheat from 140–190°C
development board.
In the reference design, Pin146 (VREF,1.8V) of module supply to the LNA BGA824N6 for
power supply. Pin129 (GPIO05) of module is feed to LNA enable control pin. It is as default
in the module FW.
This section details the recommended reflow profile when the module is mounted onto
other boards.
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81.48
81.13
81.94
79.07
2.87
–34%
–36%
–32%
–48%
Melt-out Time/230°C
46.91
49.26
53.50
48.18
6.59
-31%
-7%
35%
–18%
Max Temp
240.40
241.34
241.84
241.32
1.44
4%
13%
18%
13%
Total Time/217°C
81.18
82.95
87.61
81.24
6.43
-15%
-8%
10%
–15%
Gradient1 (100–150°C)
1.88
1.91
1.87
1.86
0.05
25%
28%
25%
24%
Process limit:
Solder Paste
Lead-free
Profile feature
Min.
Max.
Unit
Gradient1 (Target = 1.5) (100 °C–150 °C)
(Time period = 20 s)
03°C/S
Preheat time from 140 °C to 190 °C
70
105
S
Time maintained above 230 °C
4060S
Peak package body temperature
230
250
°C
Time maintained above 217 °C
60
110
S
6.8. PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads of the PCB on
which IMQ3 series modules will be mounted, this kind of design is good to soldering
reliability in SMT process.
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Figure 22. NSMD solder pad design
It is not recommended to place via or micro-via not covered by solder resist in an area of
6.9. Stencil
0.3 mm around the pads unless it carries the same signal of the pad itself, see following
figure.
Holes in pad are allowed only for blind holes and not for through holes.
0.15mm stencil-foil thickness is recommended to obtain the best performance to prevent
voids during SMT reflow, 0.12mm is the minimum requirement if there is any
restrictions.
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Figure 23. Label drawing
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6.10. Antenna design requirement
The antenna need meet below specification
ANTENNA REQUIREMENTS for IMQ3
Frequency range
LTE Band High Band : 1710MHz-2170MHz,
LTE Low Band : 699MHz-960MHz
Polarization
Linear
Radiation pattern
Omni-directional
Impedance
50 ohm
Input power
> 24dBm Average power in LTE
VSWR absolute max
≤ 3:1
VSWR absolute recommended
≤ 2:1
Antenna ruggedness(Output RF load
mismatch ruggedness at ANT pins)
10:1 (max) VSWR
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7. Labeling and Packaging
7.1. Labeling
Figure25 shows label drawing of IMQ3 series modules.
Figure 24. Label drawing
7.2. Packing
Tape-and-Reel Package
The module is delivered in tape-and-reel based on MPQ (500 pcs./reel).4 reel/carton.
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Figure 25. Packing--tape
Figure 26. Packing—reel
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Single Packaging for Samples
Figure 27. Packing—carton
7.3. MSL level
50 pcs./box; no vacuum packaging; must be baked for 8 hours at 85 °C before SMT at least.
The IMS2 module MSL level is 3.
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8. Safety Recommendation
Be sure the use of this product is allowed in the country and in the environment required.
Where it can interfere with other electronic devices in environments such as
Where there is a risk of explosion such as gasoline stations and oil refineries
The use of this product may be dangerous and must be avoided in the following areas:
hospitals, airports, and aircraft
It is the responsibility of the user to comply with his or her country’s regulations and the
specific environmental regulations.
Do not disassemble the product; any mark of tampering will compromise the warranty’s
validity.
We recommend following the instructions of the hardware user guides for a correct wiring
of the product. The product must be supplied with a stabilized voltage source, and the
wiring must conform to the security and fire-prevention regulations.
This product must be handled with care; avoid any contact with the pins because
electrostatic discharge may damage the product. Same caution must be taken regarding the
UIM card; carefully check the instructions for its use. Do not insert or remove the UIM when
the product is in power-saving mode.
The system integrator is responsible of the functioning of the final product; therefore, care
must be taken for the external components of the module as well as for project or
installation issues—there may be a risk of disturbing the GSM network or external devices
or of having an impact on device security. If you have any doubts, please refer to the
technical documentation and the relevant regulations in force.
Every module must be equipped with a proper antenna with specific characteristics. The
antenna must be installed with care in order to avoid any interference with other electronic
devices.
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Federal Communication Commission Interference Statement
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one of the following measures:
to which the receiver is connected.
FCC Caution:
compliance could void the user's authority to operate this equipment.
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Radiation Exposure Statement:
1) The antenna must be installed such that 20 cm is maintained between the
2) The transmitter module may not be co-located with any other transmitter or
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with
minimum distance 20cm between the radiator & your body.
This device is intended only for OEM integrators under the following conditions:
antenna and users, and
antenna.
As long as 2 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example
certain laptop configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID can not be used on the
final product. In these circumstances, the OEM integrator will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate
FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may
be installed such that 20 cm may be maintained between the antenna and users.
The final end product must be labeled in a visible area with the following: “Contains
FCC ID: NKRIMQ3”. The grantee's FCC ID can be used only when all FCC compliance
requirements are met.
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Manual Information To the End User
This device complies with Industry Canada license-exempt RSS standard(s). Operation
1) this device may not cause interference, and
2) this device must accept any interference, including interference that may cause
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
1) l'appareil ne doit pas produire de brouillage, et
2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même
This device and its antenna(s) must not be co-located or operating in conjunction with
Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction
The County Code Selection feature is disabled for products marketed in the US/
The OEM integrator has to be aware not to provide information to the end user
regarding how to install or remove this RF module in the user’s manual of the end
product which integrates this module.
The end user manual shall include all required regulatory information/warning as
show in this manual.
Industry Canada statement
is subject to the following two conditions:
undesired operation of the device.
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
si le brouillage est susceptible d'en compromettre le fonctionnement.
any other antenna or transmitter, except tested built-in radios.
avec une autre antenne ou un autre émetteur, exception faites des radios intégrées
qui ont été testées.
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Canada.
La fonction de sélection de l'indicatif du pays est désactivée pour les produits
commercialisés aux États-Unis et au Canada.
Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance
20cm between the radiator & your body.
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour
un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un
minimum de 20 cm de distance entre la source de rayonnement et votre corps.
<For modular Approval>
This device is intended only for OEM integrators under the following conditions: (For module
device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and
users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour
utilisation de dispositif module)
1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre
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l'antenne et les utilisateurs, et
2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur
ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais
sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce
module installé.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations
or co-location with another transmitter), then the Canada authorization is no longer
considered valid and the IC ID can not be used on the final product. In these circumstances,
the OEM integrator will be responsible for re-evaluating the end product (including the
transmitter) and obtaining a separate Canada authorization.
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines
configurations d'ordinateur portable ou de certaines co-localisation avec un autre
émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas
être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de
réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte
au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be
installed such that 20 cm may be maintained between the antenna and users. The final end
product must be labeled in a visible area with the following: “Contains IC: 4441A-IMQ3”.
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où
l'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenue
entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible
avec l'inscription suivante: "Contient des IC: 441A-IMQ3".
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Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding
how to install or remove this RF module in the user’s manual of the end product which
integrates this module.
The end user manual shall include all required regulatory information/warning as show in
this manual.
Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final
quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du
produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises
et avertissements comme indiqué dans ce manuel.
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Initialisms
Table 14. Initialisms and Definitions
Abbreviation
Definition
AC
Alternating Current
DC
Direct Current
ETSI
European Telecommunications Standards Institute
GND
GrouND
GPS
Global Positioning System
GNSS
Any single or combined satellite navigation system (GPS,
GLONASS and combined GPS/GLONASS)
GPIO
General Purpose Input Output
I/O
Input/Output
IoT
Internet of Things
I2C
Inter-Integrated Circuit
LGA
Land Grid Array
LTE
Long Term Evolution
Mbps
Megabits per second
MIPS
Millions of Instructions Per Second
N/A
Not/Applicable
OS
Operating System
PCM
Pulse Code Modulation
SIM
Subscriber Identity Module
SMA
Surface Mount Antenna
SPI
Serial Peripheral Interface
UART
Universal Asynchronous Receiver-Transmitter
UIM
User Identity Module
USB
Universal Serial Bus
Vref
Voltage reference
WNC
Wistron NeWeb Corporation
RFU
Reserved For Future Use
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