Wistron NeWeb DHURW32 Users manual

MODEL: DHUR-W32

Date: 2016/08/01

Delivery Specifications

Product Description 802.11a/b/g/n WLAN/Bluetooth 4.1LE Combo Module
Customer Part Number 098001403080

WNC Part Number 91DHUR13.G21
WNC Model Name DHUR-W32

Issue Version : V1.4

Wistron NeWeb Corporation (WNC)

Manufacturer

Production Factory

Production Country People's Republic of China
PO Reception & Invoice

Release Company

Address: 20 Park Avenue II Road, Hsinchu Science Park, Hsinchu 308, Taiwan, R.O.C.
(ZIP Code: 308)
Tel: [phone]

Wistron NeWeb (Kunshan) Corporation

Address: 789 Yujinxiang Road, Comprehensive Free T rade Zone, Kunshan City, Jiangsu
Province, P.R.C (ZIP Code: 215300)
Tel: [phone]

ANC holding Corporation
P.O. Box 3152, Road Town, Tortola, British Virgin Islands

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MODEL: DHUR-W32

Revision History

Version Change history Date

V1.0 Initial version 2016/07/15
V1.1 Add/modify some items, page.1, 4, 5, 17, 18, 22~29 2016/07/18
V1.2 Modify mainchip PN 2016/07/19
V1.3 Add module label and packing information 2016/07/20
V1.4 Update packing information 2016/08/01

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MODEL: DHUR-W32

Contents

1. Production Introduction ............................................................................................. 4

2. Photo Photograph ...................................................................................................... 5

3. Functional Block Diagram ......................................................................................... 6

4. I/O Pin Definition ......................................................................................................... 7

5. Product Specification ................................................................................................. 8

5.1 WiFi portion ............................................................................................................................................... 8

5.2 BT portion ................................................................................................................................................. 14

5.3 EEPROM Information ............................................................................................................................... 15

6. Schematic ................................................................................................................... 16

7. PCB Layout ................................................................................................................. 17

7.1 Layer-1 (Top) ............................................................................................................................................ 17

7.2 Layer-2 ...................................................................................................................................................... 17

7.3 Layer-3 ...................................................................................................................................................... 17

7.4 Layer-4 (Bottom) ...................................................................................................................................... 17

8. Mechanical Dimension ............................................................................................... 18

8.1 Connector Dimension ............................................................................................................................... 18

8.2 Shielding cover Dimension ....................................................................................................................... 20

8.3 Module Dimension .................................................................................................................................... 21

9. Module Label Information .......................................................................................... 22

10. Packing Information ................................................................................................... 23

10.1 Packing Assembly ..................................................................................................................................... 23

10.2 Tray ........................................................................................................................................................... 24

10.3 Carton Label Information .......................................................................................................................... 25

11. BOM ............................................................................................................................. 26

12. Reliability and Environment specification................................................................ 27

13. Component Certification Marks/File No. ................................................................. 28

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MODEL: DHUR-W32

1. Product Introduction

DHUR-W32 is a 802.11 a/b/g/n WLAN/Bluetooth Combo Module which compliant with
IEEE802.11n standard supports 2x2 ac/a/b/g/n MIMO technology with data rate from MCS 0­15 in 20MHz/40MHz Channels, and BT4.1 LE specifications.

Features

 Full IEEE 802.11 a/b/g/n legacy compatibility with enhanced performance
 Dual-stream spatial multiplexing up to 300 Mbps data rate, supports 20 and 40 channels with

optional SGI (256 QAM modulation)

 Complies with Bluetooth Core Specification Version 4.1 + EDR with provisions for supporting

future specifications

 Bluetooth class 1 or class 2 transmitter operation
 Wake on WLAN and Bluetooth function
 Double-side SMT process
 Two on-board metal antennas

Interfaces and Power supply

 WLAN / Bluetooth RF interface
 5V supply voltage
 9 pins I/O connector

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MODEL: DHUR-W32

2. Product Photograph

Top side

Bottom side

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4. I/O Pin Definition

MODEL:

DHUR-W32

Connector dimension, please refer to Chapter 8.1

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