Wistron NeWeb DAUKW12 Users manual
MODEL: DAUK-W12
Confidential. Wistron Neweb Corporation
1 / 17
Product Description
802.11a/b/g/n/ac Wireless LAN Module
Customer Part Number
098001402081
WNC Part Number
91DAUK13.G32
WNC Model Name
DAUK-W12
Issue Version :
V1.9
Manufacturer
Wistron NeWeb Corporation (WNC)
Address: 20 Park Avenue II Road, Hsinchu Science Park, Hsinchu 308, Taiwan, R.O.C.
(ZIP Code: 308)
Tel: +886-3-666-7799
Production Factory
Wistron NeWeb (Kunshan) Corporation
Address: 789 Yujinxiang Road, Comprehensive Free Trade Zone, Kunshan City, Jiangsu
Province, P.R.C (ZIP Code: 215300)
Tel: 0086-512-5772-2688
Production Country
People's Republic of China
PO Reception & Invoice
Release Company
ANC holding Corporation
P.O. Box 3152, Road Town, Tortola, British Virgin Islands
Date: 2016/12/01
Delivery Specifications
MODEL: DAUK-W12
Confidential. Wistron Neweb Corporation
2 / 17
Version
Change history
Date
V1.0
Initial version
2016/09/30
V1.1
Updated operation voltage tolerance, output power tolerance,
pin define, shielding cover dimension, module dimension and
module label information
2016/10/05
V1.2
Updated product photo, output power and PCB layout
2016/10/18
V1.3
Updated product photo, schematic, PCB Layout and module
dimension
2016/11/09
V1.4
Updated product photo
2016/11/10
V1.5
Updated module label and BOM
2016/11/10
V1.6
Updated packing information
2016/11/11
V1.7
Updated product photo and module dimension
2016/11/21
V1.8
Updated customer PN, product photo, schematic, PCB
layout, shielding cover dimension, module label information,
packing information, BOM and reliability environment
specification
2016/11/30
V1.9
Updated PCB flame class, shielding cover material
certificate, reliability and environment complete date and
antenna radiation pattern
2016/12/01
Revision History
MODEL: DAUK-W12
Confidential. Wistron Neweb Corporation
3 / 17
Contents
1. Product Introduction .................................................................................................. 4
2. Product Photograph ................................................................................................... 5
3. Functional Block Diagram ......................................................................................... 6
4. I/O Pin Definition ......................................................................................................... 6
5. Product Specification ................................................................................................. 7
5.1 Specifications ............................................................................................................................................ 7
5.2 EEPROM Information ............................................................................................................................... 12
6. Schematic.................................................................................................................... 13
7. PCB Layout ................................................................................................................. 14
7.1 Layer-1 (Top) ............................................................................................................................................ 14
7.2 Layer-2 ...................................................................................................................................................... 14
7.3 Layer-3 ...................................................................................................................................................... 14
7.4 Layer-4 (Bottom) ...................................................................................................................................... 14
8. Mechanical Dimension ............................................................................................... 15
8.1 Connector Dimension ............................................................................................................................... 15
8.2 Shielding cover Dimension ....................................................................................................................... 17
8.3 Module Dimension .................................................................................................................................... 18
9. Module Label Information .......................................................................................... 19
10. Packing Information ................................................................................................... 20
10.1 Packing Assembly ..................................................................................................................................... 20
10.2 Tray ........................................................................................................................................................... 21
10.3 Carton Label Information .......................................................................................................................... 22
11. BOM ............................................................................................................................. 23
12. Reliability and Environment specification................................................................ 25
13. Antenna Radiation Pattern......................................................................................... 27
MODEL: DAUK-W12
Confidential. Wistron Neweb Corporation
4 / 17
1. Product Introduction
DAUK-W12 is a 802.11 a/b/g/n/ac WLAN module which compliant with IEEE802.11n/ac
standard supports 2x2 ac/a/b/g/n MIMO technology with data rate from MCS 0-15 in
20MHz/40MHz/80MHz Channels.
Features
Full IEEE 802.11 a/b/g/n/ac legacy compatibility with enhanced performance
Dual-stream spatial multiplexing up to 866.7 Mbps data rate, supports 20, 40 and 80 channels
with optional SGI (256 QAM modulation)
Wake on WLAN function
Double-side SMT process
Two on-board metal antennas
Interfaces and Power supply
WLAN RF interface
USB interface
5V supply voltage
8 pins I/O connector
MODEL: DAUK-W12
Confidential. Wistron Neweb Corporation
5 / 17
2. Product Photograph
Top side
Bottom side
MODEL: DAUK-W12
Confidential. Wistron Neweb Corporation
6 / 17
Item
Key specifications
Main chipset
Realtek RTL8812AU-VS
TX/RX
2T2R
Host interface
USB 2.0
Operation voltage
5V DC +/- 5%
Frequency range
2.400 ~ 2.483GHz, 5.15 ~ 5.85GHz
PCB dimension
100mm*17mm*1.0mm, 4L, FR4
Modulation
technique
802.11 Legacy a/b/g
DSSS (DBPSK, DQPSK, CCK)
OFDM (BPSK, QPSK, 16-QAM, 64-QAM)
DSSS (Direct Sequence Spread Spectrum) with
DBPSK (Differential Binary Phase Shift Keying 1Mbps),
DQPSK (Differential Quaternary Phase Shift Keying 2Mbps), and
CCK (Complementary Code Keying 5.5&11Mbps), and
OFDM (Orthogonal Frequency Division Multiplexing with BPSK for 6,9Mbps
、
QPSK for 12,18Mbps
、 16QAM for 24,36Mbps、 64QAM for 48,54Mbps)
802.11n a/g
OFDM (BPSK, QPSK, 16-QAM, 64-QAM)
802.11ac
OFDM (BPSK, QPSK, 16-QAM, 64-QAM, 256-QAM)
Output power
(for each chain;
with ±1.5dBm
tolerance)
802.11b
Test Frequencies 1/2_Target 5.5_Target 11_Target
2412 17 17 17
2437 17 17 17
2462 17 17 17
802.11g
Test Frequencies 6-24_Target 36_Target 48_Target 54_Target
2412 16 16 16 16
2437 16 16 16 16
2462 16 16 16 16
802.11a
Test Frequencies 6-24_Target 36_Target 48_Target 54_Target
5180 14 14 14 14
5500 14 14 14 14
5785 14 14 14 14
802.11n 2G HT20
Test Frequencies MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7
2412 15 15 15 15 15 15 15 15
2437 15 15 15 15 15 15 15 15
2462 15 15 15 15 15 15 15 15
802.11n 2G HT40
Test Frequencies MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7
2422 15 15 15 15 15 15 15 15
2437 15 15 15 15 15 15 15 15
2452 15 15 15 15 15 15 15 15
802.11n 5G HT20
Test Frequencies MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7
5180 13 13 13 13 13 13 13 13
5500 13 13 13 13 13 13 13 13
5785 13 13 13 13 13 13 13 13
802.11n 5G HT40
Test Frequencies MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7
5190 13 13 13 13 13 13 13 13
4. Product Specification
5.1 Specifications
Loading...