Wistron NeWeb 96E1 User Manual

User manual of 3G SEP EVDO module
User manual of
3G SEP Module
(EVDO version)
Wistron NeWeb Corp.
啟碁科技股份有限公司
Page 1
User manual of 3G SEP EVDO module
Revision History
Version Change history Date
Ver 0.1 Initial version 2012-10-15 Ver 0.2 Update EVDO 2013-1-16 Ver 0.3 Update IO spec 2013-1-22
Ver 0.4
Ver 0.5
Update FCC/IC warning
2013-5-16
statement
Modify 6.4 FCC Module
2013-5-29
Integration Restriction
Page 2
User manual of 3G SEP EVDO module
Contents
Contents........................................................................................................................ 3
1.introduction ............................................................................................................ 5
1.1 productconcept.........................................................................................5
1.2 Ter ms andabbreviation.............................................................................5
1.3 Conventions...............................................................................................7
1.4 Productfeaturesoverview.........................................................................7
2.3GSEP Module Block diagram ............................................................................ 10
2.1 SIM...........................................................................................................12
2.2 AUDIO.......................................................................................................13
2.3 Highspeedinterchip(HSIC)Interface....................................................18
2.4 GeneralpurposeI/O................................................................................18
2.5 RESET........................................................................................................19
2.6 ADC...........................................................................................................19
PowerOUTPUT.....................................................................................................19
2.7 POWERSUPPLY&GND............................................................................19
2.8 POWERMANAGEMENT...........................................................................20
2.9 Sleepmodes.............................................................................................20
2.10RTCfuncution...........................................................................................22
3.Pinout ................................................................................................................... 23
3.1 I/OConnectorPinAssignments...............................................................23
4.Electrical specificationS ....................................................................................... 30
4.1 VPHPwr...................................................................................................30
4.2 Vbackup....................................................................................................30
4.3 VSIM.........................................................................................................31
4.4 Digitalinterface........................................................................................31
4.5 RESET........................................................................................................31
4.6 SIM...........................................................................................................32
I2CInterfacE.........................................................................................................32
I2Chasthefollowingcharacteristics:..................................................................32
4.7 USB...........................................................................................................32
Page 3
User manual of 3G SEP EVDO module
4.8 ADC...........................................................................................................32
4.9 UART.........................................................................................................33
4.10SPI.............................................................................................................33
4.11SDIO..........................................................................................................34
4.12Highspeedinterchip(HSIC)interface....................................................36
4.13 DIGITALAUDIO.........................................................................................36
Theaudiooutputscontainthefollowingcharacteristics:...................................36
4.14RFSIGNAL.................................................................................................40
5.Environmental specificationS .............................................................................. 41
5.1 NormaltemperatureRange.....................................................................41
5.2 ExtendedtemperatureRange..................................................................42
6.FCC warning statement ........................................................................................ 43
6.1 General.....................................................................................................43
6.2 EndProductLabeling(FCC)......................................................................43
6.3 RequiredFCCComplianceStatementforHostIntegration.....................43
6.4 FCCModuleIntegrationRestriction:........................................................44
Page 4
User manual of 3G SEP EVDO module
1. INTRODUCTION
This document describes the specifications of the WNC 3G SEP M2M module
used to connect the device application and the air interface.
1.1 PRODUCT CONCEPT
The 3G SEP module provides CDMA connectivity for machine-to-machine
(M2M) application over dual frequency bands BC0 and BC1. The markets of
application include AMM (Automatic Metering Management), tracking system,
and alarm, etc.
Application and physical features:
Operating temperature range: -30°C to +85°C Interface and dimension: LGA; 34X34mm Minimum low power consumption in the standby mode: 1.5mA DC supply: 3.4 V to 4.2 V USB2.0 high speed
Supported frequency bands:
BC0 BC1
In addition to the 3G SEP module, a complete development kit can be provided
to customers.
1.2 TERMS AND ABBREVIATION
ADC Analog to Digital Converter
CDMA Code Division Multiple Access
CODEC Coder-Decoder
CLIP Calling Line Identification Presentation
COLP Connected Line Identification Presentation
CLIR Calling Line Identification Restriction
COLR Connected Line Identification Restriction
CTS Clear To Send
CSD Circuit Switched Data
Page 5
User manual of 3G SEP EVDO module
CS Coding Scheme
DCS Digital Communications System
DSR Data Set Ready
DTR Data Terminal Ready
EDGE Enhanced Data Rate for GSM Evolution
EGSM Extended GSM
ENS Enhanced network selection
EONS Enhanced operator name string
ESD Electrostatic Discharge
ETS European Telecommunication Standard
GNSS Global Navigation Satellite System
GSM Global System for Mobile communication
GPRS General Packet Radio Services
GPS Global Positioning System
HSCSD High Speed Circuit Switched Data
HSDPA High Speed Downlink Packet Access
HSIC High-speed inter-chip
HSPA+ Evolved High-Speed Packet Access
HSUPA High Speed Uplink Packet Access
IC Integrated Circuit
IEEE Institute of Electrical and Electronics Engineers
I/O Input / Output
ISO International Standards Organization
ITU International Telecommunication Union I2C Inter-integrated circuit
I2S Inter-IC sound
JTAG Joint Test Action Group
Kbps kilobit per second
LCD Liquid Crystal Display
LED Light Emitting Diode LTE Long term evolution
Mbps Megabit per second PA Power amplifier
PBCCH Packet Broadcast Control Channel
PCB Printed Circuit Board
Page 6
User manual of 3G SEP EVDO module
PCM Pulse Code Modulation
PCS Personal Communication System PMIC Power management integrated circuit
PWM Pulse Width Modulation
RAM Random Access Memory
RF Radio Frequency
RI Ring Indication
RMS Root Mean Square
RTS Ready To Send
RX Reception
SIM Subscriber Identification Module
SMS Short Message Service
TBC To Be Confirmed
TBD To Be Defined TCXO Temperature-compensated crystal oscillator
TX Transmission
UART Universal Asynchronous Receiver and Transmitter UIM User identity module
UMTS Universal Mobile Telecommunications System
USB Universal Serial Bus
USSD Unstructured Supplementary Service Data WCDMA Wideband Code Division Multiple Access
1.3 CONVENTIONS
Throughout this document, DTE (data terminal equipment) indicates the
equipment which masters and controls the module device UMC-3GSEP by
sending AT commands via its serial interface.
DCE (data communication equipment) indicates the UMC-3GSEP module
device.
1.4 PRODUCT FEATURES OVERVIEW
Page 7
User manual of 3G SEP EVDO module
Mechanical & environment
Temperature range Normal range: -30°C to +70°C (fully compliant)
Extended range: -30°C to +85°C (fully functional)
Storage: -40°C to +105°C
Weight (g) 6 grams
ESD ESD protection :+/- 2 kV
Physical dimensions 34x34x3 mm
Connection 157 pins LGA contact
Power supply 3.4V to 4.2V range, 4.0V nominal
Power consumption1 Off mode: 50 µA typical
Registered idle mode: (cell power -55dBm/1.23MHz)
CDMA: 200mA
Peak Current
CDMA: up to 780mA
Cellular technologies
CDMA bands BC0 : Tx: 824–849 MHz; Rx: 869–894 MHz
BC1 : Tx: 1850–1910 MHz; Rx: 1930–1990 MHz
Transmit power 24dBm+/-1dB
Main interfaces
1
Thepowerconsumptionishighlydependentonthecustomer’sproductdesignandthemodule
environment.
Page 8
User manual of 3G SEP EVDO module
USB Supports USB High speed 480Mbps and full speed
12Mbps, with 3 logical Channels.
UART interface with flow
control
Up to 3.6 Mbit/s for data transmission (no auto-bauding)
Full flow control signals (+1.8V) are provided on a 94 pins
LGA connector.
A reference schematic to build the RS232 interface is
provided in the UMC-3GSEP application note.
Supported SIM cards 3V and 1.8V SIM cards
SIM slot Signals for the management of the SIM card are provided
on LGA pins.
SIM detect Provides SIM card insert detection.
General purpose I/O pins GPIOs can be customized easily from the customer’s
application and they can be configured as input or output
Power on pin Available
Audio
Digital audio link A digital audio interface PCM/I2S bus is provided.
Voice codec Half Rate, Full Rate, Enhanced Full Rate, Adaptive Multi
Rate
Data/command multiplexing Software management of data/command multiplexing on
the serial link UART.
Data services
1xEV-DOrA High-speed peak data rates – 3.1 Mbps forward link; 1.8
Mbps reverse link
Page 9
User manual of 3G SEP EVDO module
2. 3GSEP MODULE BLOCK DIAGRAM
Page 10
User manual of 3G SEP EVDO module
Figure 1: 3G SEP Pin-out (Top view)
Page 11
User manual of 3G SEP EVDO module
2.1 SIM
2.1.1 SIM card interface
The SIM Card Interface is compatible with the ISO 7816-3 IC card standard on
the issues required by the GSM 11.11 Phase 2+ standard and adapts to 3V
and 1.8V SIM cards.
To prevent SIM card damage, the power supply of the module must be turned
off before any manipulation of the SIM card.
The SIM card interface includes:
Power supply output (LDO6) Bi-direction data signal (UIM1_DATA), Clock output (UIM1_CLK) Reset signal (UIM1_RESET)
Signal Pin N° Description
UIM1_RESET 26 SIM reset, provided by Base-band processor
UIM1_CLK 90 SIM clock, provided by Base-band processor
LDO6 91 SIM supply voltage
UIM1_DATA 27 SIM serial data line, input and output
Page 12
2.1.2 SIM CARD CONNECTION
User manual of 3G SEP EVDO module
Figure 2: SIM connection
Note: A reference schematic of the SIM card connection is given in the
application note.
2.2 AUDIO
2.2.1 Audio interface
The 3G SEP M2M module features a PCM/I2S interface.
The PCM/I2S interface is a High speed full duplex interface that can be used to
send and receive digital audio data to external audio ICs with the following
characteristics:
Audio data could be transferred back and forth (Rx and Tx) using legacy digital
audio interface
Inter-IC sound (I2S) ports:
 No external controller support.
Page 13
User manual of 3G SEP EVDO module
Pulse-code modulation (PCM) audio ports:
  Fixed sampling rate at 8 kHz
  8 bits A-Law or µ-Law
  16 bits linear PCM
  PCM master mode
Fixed PCM clock rate at 128 kHz or 2.048 MHz
  PCM slave mode
Fixed PCM clock rate at 2.048 MHz only
Signal Pin N° Description
I2S/PCM_CLK 113 I2S/PCM clock signal
I2S_WS/PCM_SYNC 49 I2S word select/ PCM sync signal
I2S/PCM_RX 115 I2S/PCM data input
I2S/PCM_TX 50 I2S/PCM data output
I2S_MCLK 114 I2S master clock
2.2.2 Data services
The module supports the following services: Data 1xEV-DOrA:
Standard
- DL: up to 3.1 Mbps
- UL: up to 1.8 Mbps
2.2.3 UART interface
The UART interface is provided on external pins of the module with the
following signals:
RX/TX RFR/CTS
UART Speed
AT commands and DATA: up to 4 Mbit/s
Page 14
Loading...
+ 30 hidden pages