Wistron TXD01, TXE01 Users Manual

Confidential

Wistron 3D

RF Tx Module: TXE01

RF Tx Dongle: TXD01

Rev 0.01

HEAD OFFICE: 21F, 88, Sec. 1, Hsin Tai Wu Rd; Hsichih, Taipei Hsien (221) Taiwan, R.O.C.

Wistron Corporation

TEL: 886-2-6612-2390, FAX: 886-2-6612-2384

. Wistron 3D RF Tx Module and Tx Dongle

Copyright

Disclaimer

The programs are provided "as is" without warranty of any kind either expressed or implied, including but not limited to the implied warranties of merchantability and fitness for a particular purpose. This publication could contain technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of this publication. Wistron Corporation is without obligation to notify any person of such revisions or changes.

Page 1 27 October 2011

Date

Revision

Revised

Changes

10/26/2011

0.01

Earnest Chan

Initial Release.

Revision History

. Wistron 3D RF Tx Module and Tx Dongle

Page 2 27 October 2011

. Wistron 3D RF Tx Module and Tx Dongle

Table of Contents

1 Overview…………………………………………………………………………………..…………….4

1.1 Environmental Protection……………………………………………………………………..4

1.1.1 Restricted Substances and Environmental Requirements……………………………...4

1.1.2 RoHS………………………………………………………………………………………….4

1.2 Product Specification………………………………………………………………………….5

1.2.1 3D RF Tx Module…………………………………...……………………………………….5

1.2.2 3D RF Tx Dongle……………………..……………………………………………………..5

1.3 Physical Description and Specification………………………………………………………5

1.3.1 Hardware Specification……………………………………………………………………..5

1.3.2 Hardware Block Diagram…………………………………………………………………...6

1.3.3 Subsystem……………………………………………………………………………………7

1.4 Operational Concept……………………………………………………………………...…..9

1.5 Packing…………………………………………………………………………………………9

2 Reliability……………………………………………………………………………………………….11

2.1 Purpose………………………………………………………………………………………..11

2.2 Scope…………………………………………………………………………………………..11

2.3 Testing Condition……………………………………………………………………………..11

3 Certification.…………………………………………………………………………………………...12

Page 3 27 October 2011

. Wistron 3D RF Tx Module and Tx Dongle

1 Overview

As 3D display device getting more and more popular, the 3D active shutter demand is speedy increased. Different from the traditional 3D shutter glasses using IR technology, Wistron 3D Tx module and Tx dongle are using RF technology. RF technology will not be limited by the direction and can support multi-3D RF Rx module at the same time.

1.1 Environmental Protection

1.1.1 Restricted Substances and Environmental Requirements All the materials and manufacturing process used to produce 3D RF Tx module and RF Tx

dongle must comply with RoHS requirements.

1.1.2 RoHS All materials contained in the 3D RF Tx module and 3D RF Tx dongle complies with RoHS.

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. Wistron 3D RF Tx Module and Tx Dongle

1.2 Product Specification

1.2.1 3D RF Tx Module:

 Dimension: (L)23 x (W)9.1 x (H)3.55 mm +/-0.1mm  2.4GHz  Trigger frequency: support 50~60hz, switchable  Power: 1 set power for 3.3V (3.3V/150mA)

 RF triggle signal power: 3.3V  RF performance: 10m  1 3D RF Tx module can support up to 10 3D RF Rx module at one time

Wire connector:

 1 pcs for 4 pin

 Power

 INT

 Paring

 GND

1.2.2 3D RF Tx Dongle:

 Dimension: (L)28.2 x (W)15.14 x (H)6.44 mm +/-0.1mm  2.4GHz  Trigger frequency: support 50~60hz, switchable  Power: 1 set power for 5V (5V/100mA)

 RF triggle signal power: 3.3V  RF performance: 10m  1 Tx USB dongle can support up to 10 Rx module at one time

Connector:

 2 pcs  1 for 4 pin USB 2.0 type-A  Another 1 for paring button

1.3 Physical Description and Specification

1.3.1 Hardware Specification

3D RF Tx Module Specification

Connector:

 4 pin connector: System power source and 3D trigger signal.

Electronics module:

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. Wistron 3D RF Tx Module and Tx Dongle

3D system

RF IC

 Microprocessor.  Trigger signal.  2.4G RF circuitry

Power:

 3.3V power source.

3D RF Tx Dongle Specification

Connector:

 USB 2.0 type A connector: System power source and 3D trigger signal.

Electronics module:

 Microprocessor.  Trigger signal.  2.4G RF circuitry

Power:

 5V power source

1.3.2 Hardware Block Diagram 3D RF Tx Module Block Diagram

Page 6 27 October 2011

. Wistron 3D RF Tx Module and Tx Dongle

Pin1

3.3V

Pin2

3D trigger signal

Pin3

paring

Pin4

GND

3D RF Tx Dongle Block Diagram

1.3.3 Subsystem 3D RF Tx Module

Connector:

 4 pin connector: System power source and 3D trigger signal.

Electronics module:

 Microprocessor.

 There shall be GPIO that is used to trigger 3D signal.  Immediately via 2.4G RF wireless output the 3D signal to radio.  Firmware and paring ID upgrades support.

 Trigger signal.

 Voltage : 3.3V +- 5%  Pulse

 2.4G RF circuitry

 Connectivity supporting: frequency hopping with 3 channels.  RF performance: 10 meters  1 3D RF Tx module can support up to 10 3D RF Rx module at one time

Page 7 27 October 2011

. Wistron 3D RF Tx Module and Tx Dongle

Pin1

5V

Pin2

3D Trigger Signal

Pin3

Paring

Pin4

GND

3D RF Tx Dongle

Connector:

 USB 2.0 type A connector: System power source and 3D trigger signal.

Electronics module:

 Microprocessor.

 There shall be GPIO that is used to trigger 3D signal.  Immediately via 2.4G RF wireless output the 3D signal to radio.  Firmware and paring ID upgrades support.

 Trigger signal.

 Voltage : 3.3V +- 5%  Pulse

 2.4G RF circuitry

 Connectivity supporting: frequency hopping with 3 channel  RF performance: 10 meters  1 3D RF Tx dongle can support up to 10 3D RF Rx module at one time

Page 8 27 October 2011

. Wistron 3D RF Tx Module and Tx Dongle

Description

Q'ty

Remark

CTN AB B/R 323*290*136MM

0.0028

350 pcs in 1 carton

PAD B 310*275MM

0.0085

PARTITION B 312*52MM

0.0966

PARTITION B 279*52MM

0.6818

BAG CONDUCTIVE GRID 70*60MM

1

‧1.4 Operational Concept

1.5 Packing

3D RF Tx Module and 3D RF Tx Dongle Packing Material

Page 9 27 October 2011

. Wistron 3D RF Tx Module and Tx Dongle

 Packing photo

2 Reliability

2.1 Purpose

To insure the quality of Wistron 3D radio frequency product which developed, designed and

Page 10 27 October 2011

. Wistron 3D RF Tx Module and Tx Dongle

Test item

Condition

1000mm for 1 worse case of concer 3 edges cartons damage.

9 Antenna Performance Test

in band (2400~2483.5MHz)

- antenna efficiency

- Antenna Return loss

7 ESD Test

2 Cold and hot start Test

Cold start: Temp:0C, 5 times Warm start: Temp:40C, 5 times

3 Climatic tests on non-packed product (testing under non-operation)

–Cyclic humidity test –Damp heat steady state test –Dry heat test –Cold test

4 Package Vibration Test

X,Y axis Test Time: 30 minutes Random Vibration:Grms =1.04

8 RF Performance Test

RF performance-conductive & air test

10 EE Basic Function Test

Test coverage:

- Quick Scan

- System All Clock Check

- RF function

- DC Distribution At Device Power Line

- System Power consumption

- Room temperature System Long Run

- TX USB dongle - detect and remove on NB 20 times 1 Operation Temp/Hum Cycle Test

Temp: 0~40C, Humidity: 90%, Test duration : 24hrs

Follow up CE standard

Air Con Require ±8kV ±4kV Normal performance within the specification limits (B)

5 Package Drop Test

6 EMI Test

12 Button Test (Tx dongle)

Pairing mode by manual - 100 times 11 Angles of receive signal

Different angles from Tx or Tx dongle by 360 degrees

13 USB

15 FW & ID reflash

- Follow reflash SOP

14 RF performance

- Paired glasses and device distance 10M

- 1 Tx to 10 Rx and distance 10M

Power switch Button:20000times

16 Button and Switch Life Test (only for Tx USB dongle paring button)

17 Tx Dongle Connector Life Test

Plug in and out system for 2000 times

produced meet requirements of customers.

2.2 Scope

This document defines an applicable set of tasks necessary for an effective 3D RF Tx module and 3D RF Tx dongle verification qualification program.

2.3 Testing Condition

Page 11 27 October 2011

Country logo Standard

FCC pasrt 15C FCC ID fee short term confidentiality EN 300 440 EN 301 489-1-3 EN 62311 ( MPE) notification 31 countries LP0002 ID fee

China SRRC RF Japan

Telec Telec

TW

NCC

USA

EU

CE FCC

3 Certification

. Wistron 3D RF Tx Module and Tx Dongle

Page 12 27 October 2011

Deral Communication Commission interference state-ment :

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help.

FCC Caution

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation

RF exposure warning: The equipment complies with RF exposure limits set forth for an uncontrolled environment. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void your authority to operate the equipment.