Please make the compliance with the terms and conditions listed in this data.
M2M Communication Module
LTM100 Series Specification Document
Sep,2016
1
Revision history
Added FCC Warnings and Notices
Added Installation Guidelines for Antenna PAD & Antenna line Guidelines
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- Table of contents -
Revision history ........................................................................................................................................................................ 2
1. Introduction ............................................................................................................................................................................. 5
1. 1 Terms and acronyms .............................................................................................................................................. 6
1. 2 Module Introduction ............................................................................................................................................. 7
1. 2. 1 Air Interface ................................................................................................................................................. 7
1. 2. 2 External Interface ...................................................................................................................................... 7
1. 2. 3 Certification Approval ............................................................................................................................. 8
2. Product Specification .......................................................................................................................................................... 9
2. 1 General Specifications ........................................................................................................................................... 9
2. 2 Electrical specifications (Absolute maximum ratings) ............................................................................ 9
2. 3 Electrical specifications (Operating conditions) ......................................................................................10
2. 4 Drawing modem ....................................................................................................................................................12
2. 5 Real Picture ..............................................................................................................................................................12
2. 6 Interface PAD (SMD Type).................................................................................................................................13
2. 6. 1 101 PAD Detail Outline ........................................................................................................................13
2. 6. 2 101 PAD Description .............................................................................................................................14
2. 6. 3 Module DC Power Input PADs .........................................................................................................16
2. 6. 4 Module Power on/off and Reset control PADs .........................................................................17
2. 6. 5 UART Interface PADs .............................................................................................................................18
2. 6. 6 USB Interface PADs ................................................................................................................................18
2. 6. 7 External USIM Interface PADs ...........................................................................................................19
2. 6. 8 Audio and I2C Interface PADs ..........................................................................................................19
2. 6. 9 SPI and SDIO Interface PADs ............................................................................................................20
2. 6. 10 GPIO Interface PADs ...........................................................................................................................20
2. 6. 11 RF signal PADs .......................................................................................................................................21
2. 6. 12 Reserved and Not Used PADs........................................................................................................21
3. Customer PCB Design Guide....................................................................................................................................22
3. 1 Customer PCB PAD Design Guide .................................................................................................................22
3. 2 Installation Guidelines for Antenna PAD ....................................................................................................23
3. 3 Antenna line Guidelines .....................................................................................................................................24
4. FCC Warnings and Notices ............................................................................................................................................24
4. 1 FCC Warnings ..........................................................................................................................................................24
4. 2 Notices .......................................................................................................................................................................24
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■ Appendix A (80pin BtoB connector Type: LTM100D)
A. 1 Air Interface .............................................................................................................................................................27
A. 2 External Interface ..................................................................................................................................................27
A. 3 Module Drawing ...................................................................................................................................................28
A. 4 Real Picture ..............................................................................................................................................................28
A. 5 80pin BtoB connector Specification .............................................................................................................29
A. 6 80pin BtoB connector pin Map .....................................................................................................................31
A. 6. 1 Module DC Power Input pins ...........................................................................................................33
A. 6. 2 Module Power on/off and Reset control pins ..........................................................................33
A. 6. 3 UART Interface pins ...............................................................................................................................34
A. 6. 4 USB Interface pins .................................................................................................................................35
A. 6. 5 External USIM Interface pins .............................................................................................................35
A. 6. 6 I2C and Analog Interface pins .........................................................................................................35
A. 6. 7 GPIO Interface pins ...............................................................................................................................36
A. 6. 8 Reserved and Not USED pins ...........................................................................................................36
A. 7 Antenna Connector Specification description ......................................................................................37
A. 7. 1 Antenna Connector Specification ................................................................................................37
A. 7. 2 Antenna Connector Description ...................................................................................................38
A. 8 Module Assembly Guide ...................................................................................................................................39
A. 8. 1 Module Assembly Instruction ...........................................................................................................39
A. 9 Customer PCB Board Layout Guide .............................................................................................................40
1. Introduction
LTM100 Series Specification(hereinafter, this Document)document is a guide for our customers to
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provide the design by applying the 3G/LTE communication modem LTM100.
·The information contained in this document are described in the design and the contents to
prevent problems in advance.
·The information contained in this document are not guaranteed for operation of the system to
the (customer center) from the customer device..
·I would like to design according hoping to comply with the information contained in thid document,
there is no special reason.
1. 1 Terms and acronyms
This document requires a description for representation of the term there is a technical term is
described below.
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Table 1.1 Definitions of terms
Data communication equipment(LTM100)
Mounted with a module(LTM100) customer's equipment(DTE)
Subscriber identity module
Universal asynchronous receiver transmitter
Serial peripheral interface
Analog-to-digital converter
Wideband code division multiple access
Global navigation satellite system
General-purpose input/output
Surface Mounter Technology
eNB,MME for 3 G or LTE Communication.
3 G or LTE Network Communication Regulation
(When a disaster occurs,
If the telecommunications service provider telecommunications
regulatory when communicating many users at the same time.
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1. 2 Module Introduction
LTM100 Module is a wireless modem that supports Global 3G / LTE,
Data Speed in the case of LTE (Cat4) can be up to downlink 150Mbps uplink 50Mbps,
In case of 3G (HSPA +) up to downlink 42Mbps uplink 5.76Mbps.
LTM100 possible applications include security, power meter, remote control systems, billing
systems,BIS, gateway, and so can the instruments and devices in a variety of industries and
provides a SMD type and B2B connector type.
1. 2. 1 Air Interface
■ Support Band
- LTE : B1, B2, B4, B5, B7, B18, B19 (Note: LTE B7 does not work in US)
- WCDMA : B1, B2, B4, B5, B19
- GSM : 850, 900, 1800, 1900
- GNSS(Gen 8C) : GPS, GLONASS, BeiDou, Galileo and QZSS
■ Data Speed
- FDD LTE CAT4 (Down link: 150Mbps / Up link: 50Mbps)
- WCDMA HSPA+ (Down link: 42Mbps / Up link: 5.76Mbps)
※ Data throughput Depending on External communication environment.
■ RF Interface Type (SMD PAD)
- SMD Type
- 3 PADs : Main Antenna PAD, Sub Antenna PAD, GPS Antenna PAD
1. 2. 2 External Interface
■ DC Power Supply : 3.4V ~ 4.2V
■ External Interface
- UART : up to 4MHz support (2port)
- USB : USB 2.0 Support (1port)
- SDIO / SPI (UP TO 50MHz) Interface support
■ USIM Interface (2port)
- External UIM card support (Voltage 1.8V/2.95V)
■ Audio Interface (I2S)
- External Audion Codec Support
■ Control Interface
- Control pin : power on, reset, I2C, Status Indicator Output
■ Interface Type
- SMD PAD Type (101-PAD)
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1. 2. 3 Certification Approval
B1 B2 B4 B5 B19 B1 B2 B4 B5 B7 B18 B19 850 900 1800 1900
FCC ○ ○ ○ ○ ○ ○ ○ ○
CE ○ ○ ○ ○
JATE/Telec ○ ○ ○ ○ ○
Table 1.2 below is a list of Certification this module is approved.
Table 1.2 Certification Approval Band
note) LTE B7 does not work in US
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2. Product Specification
GPS,Glonass,Beidou,Galileo, QZSS
4Gb NAND Flash / 2Gb LPDDR2 SDRAM
DC / UART(x2) / USB 2.0 / External USIM / I2C /
SDIO / SPI / Power on key / Reset key / GPIO
MAIN(LTE P,WCDMA), SUB(LTE S), GPS Antenna PAD
LTE P:Primary
LTE S:Secondary
+3.4 Vdc~ +4.2 Vdc (Typ 3.8Vdc)
2. 1 General Specifications
Table 2. 1 General Specifications
2. 2 Electrical specifications (Absolute maximum ratings)
It could affect the reliability of the module, please observe the following Absolute maximum
ratings.
Table 2. 2 Absolute maximum ratings
The module is not protected against overvoltage and reverse voltage.
If you need more than the supply voltage specifications given in the Table above, use the
appropriate protective circuit.
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2. 3 Electrical specifications (Operating conditions)
General Purpose Input Output
Operating Temperature range
Operating Temperature range
Current consumption ( VBATT = 3.7V)
LTE sleep current (Avg.)
USB & UART interface disconnected
LTE sleep current (Avg.)
UART interface connected
LTE sleep current (Avg.)
USB interface connected
LTE Idle current (Avg.),
USB interface disconnected
LTE Idle current (Avg.),
USB interface connected
LTE connected current (Avg.),
Tx power = 0dBm
Please observe the following design Operating conditions .
Table 2. 3 Operating conditions
note1) In case of GSM communication, The minimum supply voltage is +3.8Vdc.
Table 2. 4 Current consumption
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LTE connected current (Avg.),
Maximum Tx power (Typ. 22.5dBm)
WCDMA sleep current (Avg.)
WCDMA Idle current (Avg.),
USB interface disconnected
WCDMA Idle current (Avg.),
USB interface connected
WCDMA connected current (Avg.),
Tx power = 0dBm
WCDMA connected current (Avg.),
Maximum Tx power (Typ. 22.5dBm)
GSM Idle current (Avg.),
USB interface disconnected
GSM Idle current (Avg.),
USB interface connected
GSM connected current (Avg.), (4Tx+1Rx)
Maximum Tx power (Typ. 27.5dBm)
GSM connected current (Avg.), (4Tx+1Rx)
Maximum Tx power (Typ. 30.5dBm)
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2. 4 Drawing modem
[ Top View] (unit: mm)
Figure 2. 1 LTM100 Outline drawing
2. 5 Real Picture
Figure 2. 2 LTM100 Real Picture
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2. 6 Interface PAD (SMD Type)
This module offers the Interface of 101 PAD Bottom side so that you can send and receive control
data and control by connecting with external devices.
Please design with reference to the description of each of the PAD.
2. 6. 1 101 PAD Detail Outline
Module Bottom PAD(101 ea) are formed as SMD Type as the following drawings
SMT(Surface Mounting Technology) with the customer's device, it can Module, control and
communications
[Bottom View]
Figure 2. 3 LTM100 Bottom Drawing
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2. 6. 2 101 PAD Description
For EMERGENCY DOWNLOAD/
internal pull up (Low enable)
4 GPO_01 1.8V Out GPIO output port 01
5 DSR 1.8V Out UART1 Data Set Ready
6 RI 1.8V Out
Out SPI Master-out Slave-in
In SPI Master-in Slave-out
9 SPI_CLK 1.8V Out Clock for SPI data communication
10 SPI_CS 1.8V Out Chip Selectfor SPI data communication
11 RESOUT_N 1.8V Out RESOUT signal output (Low active)
12 UIM2 Power 1.8/2.95V
Bath I2C Data (for Codec)
Out I2C Clock (for Codec)
- I2S DATA bit 0 (for Codec)
- I2S DATA bit 1 (for Codec)
- I2S Data Clock (for Codec)
- I2S Word Select (for Codec)
Out I2S Master Clock (for Codec)
Descriptions of Bottom side 101PAD refer to Table 2.5 below.
Table 2. 5 101 PAD description
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Voltage Type
41 CODEC_RESET_N 1.8V
Out RESET signal output (for Codec)
51 GPI_03 1.8V In GPIO input port 03
52 UIM1 Power 1.8/2.95V
53 ADC 1.8V In Analog-to-digital converter
54 Not used
55 USB_VBUS
5.0V In
USB Power
56
60 GPI_04 1.8V In GPIO input port 04
61 GPO_02 1.8V Out GPIO output port 02
62 RESET_N 1.8V In Hardware Reset (low active)
63 Power_on_key 1.8V In Power on/off (Low enable)
64 In_Service_IND 1.8V Out In Service(3G/LTE) Indicate
65
Development key
Dump mode
Dump mode for Software/
internal pull down (High enable)
66 GPO_03 1.8V Out GPIO output port 03
67 GPO_04 1.8V Out GPIO output port 04
68 DTR 1.8V In UART1 Data Terminal Ready
69 DCD 1.8V Out UART1 Data Carrier Detect
70 Not used - - Not used
71 Not used - - Not used
72 Not used - - Not used
73 Not used - - Not used
74 Not used - - Not used
75 Not used - - Not used
76 UIM1_CLK 1.8/2.95V
80 LTE_Service 1.8V Out LTE Service Indicate
81 UART2_TXD 1.8V In UART2 Data Input
82 I2C_SCL 1.8V Out I2C Clock
83 UART2_RXD 1.8V Out UART2 Data Output
84 I2C_SDA 1.8V Both I2C Data
85 GPO_05 1.8V Out GPIO output port 05
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note1) In/Out indication of the "Type is based on the module.
Voltage Type
86 3G_Service 1.8V Out 3G Service Indicate
87
- - GPS Antenna connection PAD
- - 2nd Antenna connection PAD
- - 1st Antenna connection PAD
note2) Reserved, Not Used pin should not be there, please open a connection with your device.
Module is can be damage and can cause malfunctions muse be urged compliance .
2. 6. 3 Module DC Power Input PADs
The Power supply of the modules are designed to supply hope in the Table below of the Power and
Ground PAD 101 PADs.
Table 2. 6 DC Power Input PADs
note) Please supply VBATT pins have a DC power on 3.4V ~ 4.2V (Typ. 3.8V) range.
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2. 6. 4 Module Power on/off and Reset control PADs
Modem Hardware Power Reset control (Active Low)
Modem Power on/off control (Active Low)
Power on / off control of the Module is in a 101 PAD "Power_on_key signal" of PAD number 63,
"Hardware Power Reset" of Module is controlled by the RESET_N signal of the PAD number 62.
Table 2. 7 Power on/off 및 Reset control PADs
When power on as "Figure 2-4" below 1.5s (1,500ms) to over, power off when there 2.0s (2,000ms) is
applied to at least give it high signal on / off operation.
Figure 2. 4 Power On/Off control
Module power on If the condition remains, the pin 36 is High (approximately 1.6V) by the internal
pull-up, to give Module Reset maintain a "Low" signal as shown below 500ms or more if required
by the Low Module It will be Reset.
Figure 2. 5 RESET control
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2. 6. 5 UART Interface PADs
UART1 Data Terminal Ready
UART1 Data Carrier Detect
As Interface for "Data terminal equipment"(DTE) and UART data communications, and supports
UART1 and UART2, you can send and receive data by RS-232 data communication requirements.
Table 2. 8 UART Interface PADs
2. 6. 6 USB Interface PADs
As Interface for "Data terminal equipment"(DTE) and USB data communication, in addition to
data communication it can also be used as a Source Download Software and debugging purposes.
Table 2. 9 USB Interface PAD s
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2. 6. 7 External USIM Interface PADs
Note1) I2C Data (for Codec)
Note1) I2C Clock (for Codec)
I2S DATA bit 0 (for Codec)
I2S DATA bit 1 (for Codec)
I2S Data Clock (for Codec)
I2S Word Select (for Codec)
I2S Master Clock (for Codec)
RESET signal output (for Codec)
Analog-to-digital converter
Note2) I2C Clock (for external device)
Note2) I2C Data (for external device)
This model is used to select an internal e-SIM, or support the Interface to enable External USIM outside.
Table 2. 10 External USIM Interface PADs
2. 6. 8 Audio and I2C Interface PADs
This Module with I2C Interface is able to control communication with the outside Device, Interface,
which offers support for external Codec.
Table 2. 11 I2C and Audio Interface PADs
note1) These signals are set high by internal pull-up resistor.
note2) These signals require external pull-up resistor.
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2. 6. 9 SPI and SDIO Interface PADs
Clock for SPI data communication
Chip Selectfor SPI data communication
- - For EMERGENCY DOWNLOAD (Low enable)
RESOUT signal output (Low active)
In Service(3G/LTE) Indicate
Dump mode for Software (High enable)
This module also supports SPI and SDIO Interface for additional data communication with external
devices.
Table 2. 12 SPI and SDIO Interface PADs
2. 6. 10 GPIO Interface PADs
Indicating the status of this Module is a GPO and the GPI are available to suit customers' applications ,
As shown below are assigned as the general Input / Output PADs.
Table 2. 13 GPIO Interface PAD s
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2. 6. 11 RF signal PADs
2nd RF connection PAD
(LTE 2nd RF signal PAD)
1st RF connection PAD
(WCDMA Main RF signal PAD
LTE 1st RF signal PAD)
17,18,19,20,34,39,42,43,48
So please RF signal is assigned to the following PADs see Table 2.14 below when connected to the
Antenna.
Table 2. 14 RF signal PADs
2. 6. 12 Reserved and Not Used PADs
Assigned to the pin to the inside of the other uses of this Module,don't need to connect
customer's device, please to open
Table 2. 15 Reserved & Not Used PADs
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3. Customer PCB Design Guide
3. 1 Customer PCB PAD Design Guide
With reference to the following Figure 3. 1 Design Guide, please design the customer's PCB.
[Top View]
Figure 3. 1 Cusomer PCB Layout Guide
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3. 2 Installation Guidelines for Antenna PAD
The proper connection between the antenna pad and the application PCB
must be implementing the following installation guidelines for the layout of the application PCB.
a) The whole layer stack below the antenna connection pad should be free of digital lines.
b) Increase GND keep-out (i.e. clearance) around the antenna pad, on the top layer of the
application PCB, to at least 150 µm up to adjacent pads metal definition on the area below the
module, to reduce parasitic capacitance to ground.
c) Add GND clearance on the buried metal layer below the antenna pad,
to reduce parasitic capacitance to ground.
Figure 3. 2 GND clearance on top layer around antenna pad
Figure 3. 3 On the 2nd buried layer below antenna pad
When you intend to install this module(LTM100) with RF connector type,
please refer to the trace guideline figure below. (trace loss: max. 0.3dB)
Figure 3. 4 Trace guideline from the antenna pad to the RF connector pad
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3. 3 Antenna line Guidelines
Max. Permitted Antenna Gain
a) Make sure that the impedance of the microstrip line is 50ohm.
b) Reduce the return loss(or V.S.W.R.) as possible with the help of antenna designers.
c) Avoid having other signal tracks and crossing any un-shielded transmission line footprint
with other signal tracks on different layers.
d) The ground surrounding the antenna line should be directly connected to the main ground
plane on the PCB by means of via holes.
e) Place EM noisy devices far away from the antenna line as possible.
f) Keep the antenna line far away from the power supply lines.
4. FCC Warnings and Notices
4. 1 FCC Warnings
The FCC requires the user to be notified that any changes or modifications made to this
module that are not expressly approved by WISOL CO., LTD could void the user's authority
to operate the equipment.
4. 2 Notices
a) If not installed and used in accordance with the instructions on the manual,
this module may cause a malfunction.
In designing this module, please follow the instructions in this manual.
b) Final Installers should be require to satisfy RF exposure compliance for installations and final
host devices.
Compliance of this device in all final host configurations is the responsibility of the guarantee.
The maximum permitted antenna gain including cable loss of the final host device is as follows.
Table 4. 1 The Maximum Permitted Antenna Gain
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The user manual which is provided by OEM integrators for end users must include the
following information in a prominent location.
“To comply with FCC RF exposure compliance requirements, the antenna used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all
persons and must not be co-located or operating in conjunction with any other antenna
or transmitter.
c) If the FCC ID is not visible when this module(LTM100) is installed inside final host device,
then a label must be affixed to the outside of the final host device with a statement similar
to the following:
"Contains FCC ID: 2ABA2LTM100" or “This device contains FCC ID: 2ABA2LTM100”
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■ Appendix A
(80pin BtoB connector Type:
LTM100D)
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■ Appendix A (80pin BtoB connector Type)
A. 1 Air Interface
■ Support Band
- LTE : B1, B4, B5, B7, B11, B18, B19 (Note: LTE B7 does not work in US)
- WCDMA : B1, B2, B4, B5(B6,B19)
- GSM : 850, 900, 1800, 1900
- GNSS(Gen 8C) : GPS, GLONASS, BeiDou, Galileo and QZSS
■ Data Speed
- FDD LTE CAT4 (Down link: 150Mbps / Up link: 50Mbps)
- WCDMA HSPA+ (Down link: 42Mbps / Up link: 5.76Mbps)
※ Data throughput Depending on External communication environment.
■ Air Interface Type (Coaxial Connector 3port)
- U.FL-R-SMT (HIROSE社 )
- 3port : 1st / 2nd Antenna 2port, GPS Antenna 1port
A. 2 External Interface
■ DC Power supply : 3.4V ~ 4.2V
■ Communication Interface
- UART : up to 4Mbps Support (2port)
- USB : USB 2.0 Support (1port)
■ USIM Interface
- External UIM card Support (Voltage 1.8V/2.95V)
■ Audio Interface
- Audio : Analog output (2pin)
■ Control Interface
- Control pin : power on, reset, I2C,Status Indicator Output
■ Interface Type (80pin B2B Connector)
- AXK6F80347YG (Panasonic社 )
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A. 3 Module Drawing
Please refer to the following module design drawings.
(Unit: mm)
Figure A-1 Outline Drawing
A. 4 Real Picture
[Top] [Bottom]
Figure A-2 Real Picture
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A. 5 80pin BtoB connector Specification
Mounted on this Module 80pin BtoB connector Spec(Header)
Part number(Mounted on this Module)
Connecting Components with external devices is recommended for parts described below.
(80pin Board to Board connector, hereinafter, 80pin BtoB connector)
Table A-1 80pin BtoB connector Specification
※ Customer connector Spec: AXK5F80547YG (Socket Type / Mated height 2.0mm / Panasonic社 )
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A. 6 80pin BtoB connector pin Map
2 Reserved - - note2) reserved
3 Reserved - - note2) reserved
6 DA Analog Out DAC(PDM) Output
7 Reserved - - note2) reserved
8 VUIM2 1.8/2.95V Out External UIM Power
9 Reserved - - note2) reserved
10 UIM2_RESET/ 1.8/2.95V Out External UIM Reset
11 Reserved - - note2) reserved
12 UIM2_DATA 1.8/2.95V Both External UIM Data
13 Reserved - - note2) reserved
14 UIM2_CLK 1.8/2.95V Out External UIM Clock
15 Reserved - - note2) reserved
16 Reserved - - note2) reserved
17 Not USED - - note2) Not used
18 GPO1 3.0V Out General Output signal 01
19 UART_INIT 3.0V In Reset of the UART data rate
20 AREA_IND 3.0V Out Communication service area indicator
21 PS_HOLD 3.0V Out Modem Power On status indicator
22 RESET_CHK 3.0V Out Module status indicator
23 RI 3.0V Out SMS Receive notification signal
24 DSR 3.0V Out UART1 Data Set Ready
25 DCD 3.0V Out UART1 Data Carrier Detect
26 RTS 3.0V In UART1 Ready To Send
27 CTS 3.0V Out UART1 Clear To Send
28 DTR 3.0V In UART1 Data Terminal Ready
29 RXD 3.0V Out note1) UART1 receiving signal data/DCE(modem) → DTE(customer)
30 TXD 3.0V In note1) UART1 transmitting signal data/DCE(modem) ← DTE(customer)
31 VBATT 3.8V In Power input
33 VBATT 3.8V In Power input
34 Reserved - - note2) reserved
35 PWR_ON 2.8V In Power on/off input signal
36 RESET_N 1.8V In External Reset input signal
37 Reserved - - note2) reserved
38 VBATT 3.8V In Power input
39 C_STATUS/GPO2 3.0V Out General Output signal 02
40 VBATT 3.8V In Power input
Refer to below Table A-2 pin description about 80pin BtoB connector.
Table A-2 80pin BtoB connector pin description
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41 GPI1 3.0V In General Input signal 01
42 Not USED - - note2) Not used
43 I2C_SCL 3.0V Out I2C clock signal
44 I2C_SDA 3.0V Both I2C data signal
45 GPI2 3.0V In General Input signal 02
46 GPI3 3.0V In General Input signal 03
47 RXD2 3.0V Out note1) UART2 receiving signal data/DCE(modem) → DTE(customer)
48 TXD2 3.0V In note1) UART2 transmitting signal data/DCE(modem) ← DTE(customer)
49 FUPSTS_OUT/EMG_RI 3.0V Out Emergency ring indicator
50 ANTINF_0 3.0V Out Antenna Information about receiver sensitivity (bit"0")
52 ANTINF_1 3.0V Out Antenna Information about receiver sensitivity (bit"1")
54 MOS_IND 3.0V Out MRMS Reservation status indicator
56 Reserved - - note2) reserved
58 Reserved - - note2) reserved
59 Reserved - - note2) reserved
60 Audio_In_P Analog Out note1) Module Audio Positive Output signal
61 Reserved - - note2) reserved
62 Audio_In_N Analog Out note1) Module Audio Negative Output signal
64 Reserved - - note2) reserved
66 Reserved - - note2) reserved
67 Reserved - - note2) reserved
68 Reserved - - note2) reserved
69 Reserved - - note2) reserved
70 Reserved - - note2) reserved
71 GPI4 3.0V In General Input signal 04
72 VBUS 5.0V In USB Power
73 GPI5/APL_MODE 3.0V In General Input signal 05
74 D- USB Both USB (-) signal
75 RF_CONT 3.0V In airplane mode
76 D+ USB Both USB (+) signal
note1)Pin name of the UART1, UART2, Audio are in your products view.
In practice, Please transmit / receive of the signal, see In / Out of the Type.
note2) Reserved, Not Used pin should not be there, please open a connection with your device.
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A. 6. 1 Module DC Power Input pins
Power on/off input signal (Range: 2.2V ~ 3.0V)
External Reset input signal (Active Low)
The power supply in this module, Please use the following Power and Ground pin of the "80pin
Interface connector pin".
Table A-3 DC Power input pins
note)Please supply VBATT pins have a DC power on 3.4V ~ 4.2V (Typ. 3.8V) range.
A. 6. 2 Module Power on/off and Reset control pins
Module is controlled by the Power on / off the 80 pin connector "PWR_ON signal" of the PAD
number 35, Module Hardware Reset power is controlled by the "RESET_N signal" of the PAD
number 36.
Table A-4 Power on/off and Reset control pins
When power on as "Figure A-4" below 1.5s (1,500ms) to over, power off when there 2.0s (2,000ms)
is applied to at least give it high signal on / off operation.
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Figure A-3 PWR_ON control
Reset of the UART data rate
UART1 Data Carrier Detect
UART1 Data Terminal Ready
UART1 receiving signal data/DCE(modem) → DTE(customer)
UART1 transmitting signal data/DCE(modem) ← DTE(customer)
UART2 receiving signal data/DCE(modem) → DTE(customer)
UART2 transmitting signal data/DCE(modem) ← DTE(customer)
Module power on If the condition remains, the pin 36 is High (approximately 1.6V) by the internal
pull-up, to give Module Reset maintain a "Low" signal as shown below 500ms or more if required
by the Low Module It will be Reset.
Figure A-4 RESET_N control
A. 6. 3 UART Interface pins
As Interface for "Data terminal equipment"(DTE) and UART data communications, and supports
UART1 and UART2, you can send and receive data by RS-232 data communication requirements.
Table A-5 UART Interface pins
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A. 6. 4 USB Interface pins
Module Audio Positive Output signal
Module Audio Negative Output signal
As Interface for data terminal equipment (DTE) and USB data communication, in addition to data
communication it can also be used as a Source Download Software and debugging purposes.
Table A-6 USB Interface pins
A. 6. 5 External USIM Interface pins
This model is used to select an internal e-SIM, or support the Interface to enable External USIM outside.
Table A-7 External USIM Interface pins
A. 6. 6 I2C and Analog Interface pins
This Module has to do with I2C Interface External Device communication and control, and
support Audio output.
Table A-8 I2C and Analog Interface pins
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A. 6. 7 GPIO Interface pins
Communication service area indicator
Modem Power On status indicator
SMS Receive notification signal
Antenna Information about receiver sensitivity (bit"0")
Antenna Information about receiver sensitivity (bit"1")
MRMS Reservation status indicator
2,3,7,9,11,13,15,16,
34,37,56,58,59,61,
64,66,67,68,69,70
Indicating the status of this Module is a GPO and the GPI are available to suit customers' applications ,
As shown below are assigned as the general Input / Output PADs.
Table A-9 GPIO Interface pins
A. 6. 8 Reserved and Not USED pins
Assigned to the pin to the inside of the other uses of this Module,don't need to connect
customer's device, please to open
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Table A-10 Reserved & Not USED pins
A. 7 Antenna Connector Specification description
Antenna connection
connector
3 port
(LTE 2port,
GPS 1port)
Antenna connector Specification
Part number(Mounted on this Module)
This module had three of the external antenna port.
LTE Primary or WCDMA(3G) Antenna 1 port , LTE Secondary Antenna 1 port,
GPS Antenna 1 port.
The antenna port may be connected to the customer's device antenna.
A. 7. 1 Antenna Connector Specification
Table A-11 Antenna connector Specification
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A. 7. 2 Antenna Connector Description
For Antenna connector locations, see the Figure A-6 below.
Figure A-5 Antenna Connector
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A. 8 Module Assembly Guide
A. 8. 1 Module Assembly Instruction
When this Module mounted on the Board(PCB) assembled by the customer,
please refer to Figure A-7.
Please fix the Module each three screws and nuts.
When the assembly while power is on customer during assembly in customers' Board,
Damage given in this Module, please note that it may be a problem such as a power failure and
malfunction occurred.
fixed screw: M2.0 X d mm
d = 2.8 + t + 3.0 ± 0.2mm (t : Customer device PCB thickness)
Notice) fixed screw tighten torque: 1.2 ± 0.2kgfcm (Don't tighten the screw to more than 1.5kgfcm )
Figure A-6 Module Assembly Instruction
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A. 9 Customer PCB Board Layout Guide
Board Layout of customers design, please refer to the drawing below
Figure A-7 Customer PCB Layout Guide
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