WISOL LTM100 User Manual

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M2M Communication Module
LTM100 Series Specification Document
Sep,2016
1
Revision history
Revision
Date
Description
Rev20
Jul 2016
Initial release
Rev21
Sep 2016
Added FCC Warnings and Notices
Rev22
Sep 2016
Added Installation Guidelines for Antenna PAD & Antenna line Guidelines
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- Table of contents -
Revision history ........................................................................................................................................................................ 2
1. Introduction ............................................................................................................................................................................. 5
1. 1 Terms and acronyms .............................................................................................................................................. 6
1. 2 Module Introduction ............................................................................................................................................. 7
1. 2. 1 Air Interface ................................................................................................................................................. 7
1. 2. 2 External Interface ...................................................................................................................................... 7
1. 2. 3 Certification Approval ............................................................................................................................. 8
2. Product Specification .......................................................................................................................................................... 9
2. 1 General Specifications ........................................................................................................................................... 9
2. 2 Electrical specifications (Absolute maximum ratings) ............................................................................ 9
2. 3 Electrical specifications (Operating conditions) ......................................................................................10
2. 4 Drawing modem ....................................................................................................................................................12
2. 5 Real Picture ..............................................................................................................................................................12
2. 6 Interface PAD (SMD Type).................................................................................................................................13
2. 6. 1 101 PAD Detail Outline ........................................................................................................................13
2. 6. 2 101 PAD Description .............................................................................................................................14
2. 6. 3 Module DC Power Input PADs .........................................................................................................16
2. 6. 4 Module Power on/off and Reset control PADs .........................................................................17
2. 6. 5 UART Interface PADs .............................................................................................................................18
2. 6. 6 USB Interface PADs ................................................................................................................................18
2. 6. 7 External USIM Interface PADs ...........................................................................................................19
2. 6. 8 Audio and I2C Interface PADs ..........................................................................................................19
2. 6. 9 SPI and SDIO Interface PADs ............................................................................................................20
2. 6. 10 GPIO Interface PADs ...........................................................................................................................20
2. 6. 11 RF signal PADs .......................................................................................................................................21
2. 6. 12 Reserved and Not Used PADs........................................................................................................21
3. Customer PCB Design Guide....................................................................................................................................22
3. 1 Customer PCB PAD Design Guide .................................................................................................................22
3. 2 Installation Guidelines for Antenna PAD ....................................................................................................23
3. 3 Antenna line Guidelines .....................................................................................................................................24
4. FCC Warnings and Notices ............................................................................................................................................24
4. 1 FCC Warnings ..........................................................................................................................................................24
4. 2 Notices .......................................................................................................................................................................24
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Appendix A (80pin BtoB connector Type: LTM100D)
A. 1 Air Interface .............................................................................................................................................................27
A. 2 External Interface ..................................................................................................................................................27
A. 3 Module Drawing ...................................................................................................................................................28
A. 4 Real Picture ..............................................................................................................................................................28
A. 5 80pin BtoB connector Specification .............................................................................................................29
A. 6 80pin BtoB connector pin Map .....................................................................................................................31
A. 6. 1 Module DC Power Input pins ...........................................................................................................33
A. 6. 2 Module Power on/off and Reset control pins ..........................................................................33
A. 6. 3 UART Interface pins ...............................................................................................................................34
A. 6. 4 USB Interface pins .................................................................................................................................35
A. 6. 5 External USIM Interface pins .............................................................................................................35
A. 6. 6 I2C and Analog Interface pins .........................................................................................................35
A. 6. 7 GPIO Interface pins ...............................................................................................................................36
A. 6. 8 Reserved and Not USED pins ...........................................................................................................36
A. 7 Antenna Connector Specification description ......................................................................................37
A. 7. 1 Antenna Connector Specification ................................................................................................37
A. 7. 2 Antenna Connector Description ...................................................................................................38
A. 8 Module Assembly Guide ...................................................................................................................................39
A. 8. 1 Module Assembly Instruction ...........................................................................................................39
A. 9 Customer PCB Board Layout Guide .............................................................................................................40
1. Introduction
LTM100 Series Specification(hereinafter, this Document)document is a guide for our customers to
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provide the design by applying the 3G/LTE communication modem LTM100.
·The information contained in this document are described in the design and the contents to
prevent problems in advance.
·The information contained in this document are not guaranteed for operation of the system to
the (customer center) from the customer device..
·I would like to design according hoping to comply with the information contained in thid document,
there is no special reason.
1. 1 Terms and acronyms
This document requires a description for representation of the term there is a technical term is
described below.
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Table 1.1 Definitions of terms
Term
Definition
DCE
Data communication equipment(LTM100)
DTE
Data terminal equipment
External Equipment
Mounted with a module(LTM100) customer's equipment(DTE)
SIM
Subscriber identity module
UART
Universal asynchronous receiver transmitter
SPI
Serial peripheral interface
USB
Universal serial bus
ADC
Analog-to-digital converter
WCDMA
Wideband code division multiple access
LTE
Long term evolution
I2C
Inter-integrated circuit
I2S
Inter-IC sound
GNSS
Global navigation satellite system
GPIO
General-purpose input/output
HSIC
High-speed inter-chip
SMD
Surface Mount Devices
SMT
Surface Mounter Technology
Idle
Stanby status(LTM100)
RF
Radio Frequency
During
communication
On communication status
3G/LTE Network
eNB,MME for 3 G or LTE Communication.
Network Regulation
3 G or LTE Network Communication Regulation
(When a disaster occurs,
If the telecommunications service provider telecommunications
regulatory when communicating many users at the same time.
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1. 2 Module Introduction
LTM100 Module is a wireless modem that supports Global 3G / LTE,
Data Speed in the case of LTE (Cat4) can be up to downlink 150Mbps uplink 50Mbps,
In case of 3G (HSPA +) up to downlink 42Mbps uplink 5.76Mbps.
LTM100 possible applications include security, power meter, remote control systems, billing
systems,BIS, gateway, and so can the instruments and devices in a variety of industries and
provides a SMD type and B2B connector type.
1. 2. 1 Air Interface
Support Band
- LTE : B1, B2, B4, B5, B7, B18, B19 (Note: LTE B7 does not work in US)
- WCDMA : B1, B2, B4, B5, B19
- GSM : 850, 900, 1800, 1900
- GNSS(Gen 8C) : GPS, GLONASS, BeiDou, Galileo and QZSS
Data Speed
- FDD LTE CAT4 (Down link: 150Mbps / Up link: 50Mbps)
- WCDMA HSPA+ (Down link: 42Mbps / Up link: 5.76Mbps)
Data throughput Depending on External communication environment.
RF Interface Type (SMD PAD)
- SMD Type
- 3 PADs : Main Antenna PAD, Sub Antenna PAD, GPS Antenna PAD
1. 2. 2 External Interface
DC Power Supply : 3.4V ~ 4.2V
External Interface
- UART : up to 4MHz support (2port)
- USB : USB 2.0 Support (1port)
- SDIO / SPI (UP TO 50MHz) Interface support
USIM Interface (2port)
- External UIM card support (Voltage 1.8V/2.95V)
Audio Interface (I2S)
- External Audion Codec Support
Control Interface
- Control pin : power on, reset, I2C, Status Indicator Output
Interface Type
- SMD PAD Type (101-PAD)
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1. 2. 3 Certification Approval
B1 B2 B4 B5 B19 B1 B2 B4 B5 B7 B18 B19 850 900 1800 1900
FCC
CE
JATE/Telec
LTE
GSM
WCDMA
Table 1.2 below is a list of Certification this module is approved.
Table 1.2 Certification Approval Band
note) LTE B7 does not work in US
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2. Product Specification
Classification
Specification
Remark
BAND
LTE
B1/B2/B4/B5/B7/B18/B19
B7 does not work in US
WCDMA
B1/B2/B4/B5/B19
GSM
850/900/1800/1900
GPS
GPS,Glonass,Beidou,Galileo, QZSS
Memory (MCP)
4Gb NAND Flash / 2Gb LPDDR2 SDRAM
101 PAD I/O
DC / UART(x2) / USB 2.0 / External USIM / I2C /
SDIO / SPI / Power on key / Reset key / GPIO
Antenna
MAIN(LTE P,WCDMA), SUB(LTE S), GPS Antenna PAD
LTE P:Primary
LTE S:Secondary
Operating Voltage
+3.4 Vdc~ +4.2 Vdc (Typ 3.8Vdc)
Dimensions
30 x 36.7 x 2.85 (mm)
Weight
5.4g
Temperature Range
-30°C to +85°C
Function
Description
Port
Min.
Max.
Unit
Supply voltages
VBATT
Module Supply Voltage
Input
-0.3
4.6 V USB
USB D+/D-
Input
-0.3
5.35 V UIM
USIM Interface
Input
-0.3
2.1/3.2 V UART
UART Interface
Input
-0.3
2.1 V GPI
General Purpose Input
Input
-0.3
2.1 V PWR_ON
Power on signal
Input
-0.3
2.1 V RESET_N
RESET signal
Input
-0.15
2.1
V
Storage Temperature
Temperature
Storage Temperature
-
-40
90
°C
2. 1 General Specifications
Table 2. 1 General Specifications
2. 2 Electrical specifications (Absolute maximum ratings)
It could affect the reliability of the module, please observe the following Absolute maximum
ratings.
Table 2. 2 Absolute maximum ratings
The module is not protected against overvoltage and reverse voltage.
If you need more than the supply voltage specifications given in the Table above, use the
appropriate protective circuit.
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2. 3 Electrical specifications (Operating conditions)
Parameter
Min.
Typ.
Max.
Unit
Supply voltages
VBATT
Module Supply Voltage
note1) 3.4
3.8
4.2 V USB
USB D+/D-
-0.3
-
5.0
V
UIM
USIM Interface
1.76
1.8
1.83 V 2.8
2.85
2.95 V UART
UART Interface
-0.3
1.8
2.1 V GPIO
General Purpose Input Output
-0.3
1.8
2.1 V PWR_ON
Power on signal
-0.3
0
2.1 V RESET_N
RESET signal
-0.15
1.8
2.1
V
Operating Temperature range
Temperature
Operating Temperature range
-30 85
°C
Current consumption ( VBATT = 3.7V)
Mode
Condition
Band
Min.
Typ.
Max.
Unit
Power down mode
Module Power down (Avg.)
-
50uA
uA
LTE sleep mode
LTE sleep current (Avg.)
USB & UART interface disconnected
All -
2.0
mA
LTE sleep current (Avg.)
UART interface connected
All -
33
mA
LTE sleep current (Avg.)
USB interface connected
All -
42
mA
LTE Idle mode
LTE Idle current (Avg.),
USB interface disconnected
All
TBD mA
LTE Idle current (Avg.),
USB interface connected
All
TBD mA
LTE connected mode
LTE connected current (Avg.),
Tx power = 0dBm
Band1
260
270
mA
Band2
TBD mA
Band4
TBD mA
Band5
TBD mA
Band7
TBD mA
Band18
TBD mA
Please observe the following design Operating conditions.
Table 2. 3 Operating conditions
note1) In case of GSM communication, The minimum supply voltage is +3.8Vdc.
Table 2. 4 Current consumption
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Band19
TBD mA
LTE connected current (Avg.),
Maximum Tx power (Typ. 22.5dBm)
Band1
650
680
mA
Band2
TBD mA
Band4
TBD mA
Band5
TBD mA
Band7
TBD mA
Band18
TBD mA
Band19
TBD mA
WCDMA sleep mode
WCDMA sleep current (Avg.)
All
TBD mA
WCDMA Idle mode
WCDMA Idle current (Avg.),
USB interface disconnected
All
TBD mA
WCDMA Idle current (Avg.),
USB interface connected
All
TBD mA
WCDMA
connected mode
WCDMA connected current (Avg.),
Tx power = 0dBm
Band1
TBD mA
Band2
TBD mA
Band4
TBD mA
Band5
TBD mA
Band19
TBD mA
WCDMA connected current (Avg.),
Maximum Tx power (Typ. 22.5dBm)
Band1
TBD mA
Band2
TBD mA
Band4
TBD mA
Band5
TBD mA
Band19
TBD mA
GSM sleep mode
GSM sleep current (Avg.)
All
TBD mA
GSM Idle mode
GSM Idle current (Avg.),
USB interface disconnected
All
TBD mA
GSM Idle current (Avg.),
USB interface connected
All
TBD mA
GSM
connected mode
GSM connected current (Avg.), (4Tx+1Rx)
Maximum Tx power (Typ. 27.5dBm)
DCS1800
PCS1900
TBD mA
GSM connected current (Avg.), (4Tx+1Rx)
Maximum Tx power (Typ. 30.5dBm)
GSM850
EGSM900
TBD mA
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2. 4 Drawing modem
[Top View] (unit: mm)
Figure 2. 1 LTM100 Outline drawing
2. 5 Real Picture
Figure 2. 2 LTM100 Real Picture
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