Mean on-state current, T
Mean on-state current. T
Mean on-state current. T
Nominal RMS on-state current, T
D.C. on-state current, T
Peak non-repetitive surge tp=10ms, VRM=0.6V
Peak non-repetitive surge tp=10ms, V
2
t capacity for fusing tp=10ms, VRM=0.6V
2
t capacity for fusing tp=10ms, V
I
Maximum rate of rise of on-state current (repetitive), (Note 6)1000A/µs
Maximum rate of rise of on-state current (non-repetitive), (Note 6)1500A/µs
Peak reverse gate voltage5V
Mean forward gate power2W
Peak forward gate power30W
Non-trigger gate voltage, (Note 7)0.25V
Operating temperature range-40 to +125°C
Storage temperature range-40 to +150°C
=55°C, (note 2)1178A
sink
=85°C, (note 2)767A
sink
=85°C, (note 3)433A
sink
=25°C, (note 2)2395A
sink
=25°C, (note 4)892A
sink
, (note 5)17kA
RRM
≤
10V, (note 5)
RM
, (note 5)1.45×10
RRM
≤
10V, (note 5)
RM
Data Sheet Issue:- 1
MAXIMUM
LIMITS
MAXIMUM
LIMITS
18.7kA
6
1.75×10
6
UNITS
UNITS
A2s
A2s
Notes:-
1)
De-rating factor of 0.13% per °C is applicable for Tj below 25°C.
2)
Double side cooled, single phase; 50Hz, 180° half-sinewave.
3)
Single side cooled, single phase; 50Hz, 180° half-sinewave.
4)
Double side cooled.
5)
Half-sinewave, 125°C Tj initial.
6)
VD=67% V
7)
Rated V
Data Sheet. Types R325CH02 to R325CH14 Issue 1Page 1 of 12December, 2000
DRM
, IFG=2A, t
DRM
.
≤
0.5µs, T
r
case
=125°C.
WESTCODE
Positive development in power electronics
Characteristics
R325CH02 to R325CH14
PARAMETERMIN.TYP. MAX. TEST CONDITIONS
V
V
r
dv/dtCritical rate of rise of off-state voltage--200VD=80% V
I
I
V
I
I
Q
t
R
Maximum peak on-state voltage--2.2ITM=2000AV
TM
Threshold voltage--1.6V
0
Slope resistance--0.3
S
Peak off-state current--150Rated V
DRM
Peak reverse current--150Rated V
RRM
Gate trigger voltage--3.0Tj=25°CV
GT
Gate trigger current--300Tj=25°CVD=10V, IT=2AmA
GT
Holding current--1000 Tj=25°CmA
H
Recovered charge, 50% Chord-170190
ra
--35
Turn-off time
q
25-40
Thermal resistance, junction to
θ
heatsink
--0.024 Double side cooled
--0.048 Single side cooled
ITM=1000A, tp=1000µs, di/dt=60A/µs,
V
ITM=1000A, tp=1000µs, di/dt=60A/µs,
V
ITM=1000A, tp=1000µs, di/dt=60A/µs,
V
DRM
RRM
=50V
r
=50V, Vdr=80%V
r
=50V, Vdr=80%V
r
DRM
(Note 1)
, dVdr/dt=20V/µs
DRM
, dVdr/dt=200V/µs
DRM
UNITS
m
V/µs
mA
µC
µs
K/W
FMounting force19-26kN
W
Weight-510-g
t
Ω
Notes:-
Unless otherwise indicated Tj=125°C.
1)
Data Sheet. Types R325CH02 to R325CH14 Issue 1Page 2 of 12December, 2000
2.0 Extension of Voltage Grades
This report is applicable to other and higher voltage grades when supply has been agreed by
Sales/Production.
3.0 Extension of Turn-off Time
This Report is applicable to other tq/re-applied dv/dt combinations when supply has been agreed by
Sales/Production.
4.0 Repetitive dv/dt
Higher dv/dt selections are available up to 1000V/µs on request.
5.0 De-rating Factor
DRM VDSM VRRM
V
V
RSM
V
V
V
D
DC V
R
A blocking voltage de-rating factor of 0.13%/°C is applicable to this device for Tj below 25°C.
6.0 Rate of rise of on-state current
The maxim um un-primed rate of rise of on-s tate current must not exceed 1500A/µs at any time dur ing
turn-on on a non-repetitive basis. For repetitive per formanc e, the on-state r ate of r ise of c urrent m ust not
exceed 1000A/µs at any time during turn-on. Note that these values of rate of rise of current apply to the
total device current including that from any local snubber network.
7.0 Square wave ratings
These ratings are given for load component rate of rise of forward current of 100 and 500A/µs.
8.0 Duty cycle lines
The 100% duty cycle is represented on all the ratings by a straight line. Other duties can be included as
parallel to the first.
9.0 Maximum Operating Frequency
The maximum operating frequenc y is set by the on-state duty, the time required for the thyristor to turn off
) and for the off-state voltage to reach full value (tv), i.e.
(t
q
1
=
max
f
++
ttt
vqpulse
Data Sheet. Types R325CH02 to R325CH14 Issue 1Page 3 of 12December, 2000
WESTCODE
(
)
(
)
)
10.0 On-State Energy per Pulse Characteristics
These curves enable rapid estim ation of device dissipation to be obtained for conditions not covered by
the frequency ratings.
Then the average dissipation will be:
Positive development in power electronics
be the Energy per pulse for a given current and pulse width, in joules
Let E
p
Let R
and T
be the steady-state d.c. thermal resistance (junction to sink)
th(J-Hs)
be the heat sink temperature.
SINK
R325CH02 to R325CH14
11.0 Reverse recovery ratings
(i) Qra is based on 50% Irm chord as shown in Fig. 1 below.
is based on a 150µs integration time.
(ii) Q
rr
i.e.
=
.)(max
150
∫
0
µ
s
rrrr
125
Fig. 1
.
dtiQ
⋅−=⋅=
RWT and fEW
()
−
HsJthAVSINKPAV
1
t
(iii)
12.0 Reverse Recovery Loss
12.1 Determination by Measurement
From waveforms of recovery current obtained from a high frequency shunt (see Note 1, Page 5) and
reverse voltage present during recovery, an instantaneous reverse recovery loss waveform must be
constructed. Let the area under this waveform be E joules per pulse. A new heat sink temperature c an
then be evaluated from the following:
where k = 0.227 (°C/W)/s
E = Area under reverse loss waveform per pulse in joules (W.s)
f = Rated frequency (in Hz) at the original heat sink temperature
R
Data Sheet. Types R325CH02 to R325CH14 Issue 1Page 4 of 12December, 2000
= D.C. thermal resistance (°C/W)
th(J-Hs
FactorK
)()(
=
2
t
⋅+⋅−=
RfkETT
()
−
HsJthoriginalSINKnewSINK
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