t capacity for fusing tp=10ms, Vrm≤10V, (note 5)1.33×10
I
Critical rate of rise of on-state current (repetitive), (Note 6)1000A/µs
cr
Critical rate of rise of on-state current (non-repetitive), (Note 6)1500A/µs
Peak reverse gate voltage5V
Mean forward gate power5W
Peak forward gate power30W
Operating temperature range-40 to +125°C
Storage temperature range-40 to +150°C
MAXIMUM
LIMITS
MAXIMUM
LIMITS
=55°C, (note 2)1280A
sink
=85°C, (note 2)851A
sink
=85°C, (note 3)493A
sink
=25°C, (note 2)2571A
sink
=25°C, (note 4)2123A
sink
, (note 5)14.8kA
RRM
16.3kA
, (note 5)
RRM
1.10×10
6
6
UNITS
UNITS
A2s
A2s
Notes:-
1) De-rating factor of 0.13% per °C is applicable for T
2) Double side cooled, single phase; 50Hz, 180° half-sinewave.
3) Single side cooled, single phase; 50Hz, 180° half-sinewave.
4) Double side cooled.
5) Half-sinewave, 125°C T
6) V
=67% V
D
Data Sheet. Type R1280NS18# to R1280NS25# Issue 4Page 1 of 12March, 2003
, IFG=2A, tr≤0.5µs, T
DRM
initial.
j
case
=125°C.
below 25°C.
j
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Characteristics
PARAMETERMIN.TYP.MAX. TEST CONDITIONS (Note 1)UNITS
V
TM
V
TM
V
T0
r
T
(dv/dt)crCritical rate of rise of off-state voltage200--VD=80% V
I
DRM
I
RRM
V
GT
I
GT
V
GD
I
H
t
gd
t
gt
Q
rr
Q
ra
I
rm
t
rr
t
q
R
thJK
Maximum peak on-state voltage--2.1ITM=2000AV
Maximum peak on-state voltage--2.7ITM=3850AV
Threshold voltage--1.44V
Slope resistance--0.33
, Linear ramp, Gate o/c
DRM
Peak off-state current--150Rated V
Peak reverse current--150Rated V
Gate trigger voltage--3.0V
T
Gate trigger current--300
Gate non-trigger voltage--0.25Rated V
DRM
RRM
=25°CVD=10V, IT=3A
j
DRM
mΩ
V/µs
mA
mA
mA
V
Holding current--1000Tj=25°CmA
Gate controlled turn-on delay time-0.51.0
Turn-on time-1.22.5
=67% V
V
D
I
=2A, tr=0.5µs, Tj=25°C
FG
, ITM=1000A, di/dt=60A/µs,
DRM
µs
Recovered charge-1200-µC
Recovered charge, 50% Chord-600720µC
Reverse recovery current-200-A
Reverse recovery time-5.8-
50-60
Turn-off time (note 2)
60-70
Thermal resistance, junction to heatsink
--0.022 Double side cooledK/W
I
=1000A, tp=1000µs, di/dt=60A/µs,
TM
V
=50V
r
ITM=1000A, tp=1000µs, di/dt=60A/µs,
V
=50V, Vdr=33%V
r
, dVdr/dt=20V/µs
DRM
ITM=1000A, tp=1000µs, di/dt=60A/µs,
V
=50V, Vdr=33%V
r
, dVdr/dt=200V/µs
DRM
µs
µs
--0.044 Single side cooledK/W
FMounting force19-26kN
W
Weight-510-g
t
Notes:-
1) Unless otherwise indicated T
2) The required t
details of t
Data Sheet. Type R1280NS18# to R1280NS25# Issue 4Page 2 of 12March, 2003
(specified with dVdr/dt=200V/µs) is represented by a ‘#’ in the device part number. See ordering information for
q
codes.
q
=125°C.
j
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Notes on Ratings and Characteristics
1.0 Voltage Grade Table
Voltage Grade
V
DRM VDSM
V
V
RRM
V
V
RSM
V
V
D
DC V
V
DC V
1818001800190011501150
2020002000210012501250
2121002100220013001300
2222002100220013501300
2424002100220014501300
2525002100220015001300
2.0 Extension of Voltage Grades
This report is applicable to other and higher voltage grades when supply has been agreed by
Sales/Production.
3.0 Extension of Turn-off Time
This Report is applicable to other tq/re-applied dv/dt combinations when supply has been agreed by
Sales/Production.
4.0 Repetitive dv/dt
Higher dv/dt selections are available up to 1000V/µs on request.
5.0 De-rating Factor
A blocking voltage de-rating factor of 0.13%/°C is applicable to this device for Tj below 25°C.
6.0 Snubber Components
R
When selecting snubber components, care must be taken not to use excessively large values of snubber
capacitor or excessively small values of snubber resistor. Such excessive component values may lead to
device damage due to the large resultant values of snubber discharge current. If required, please consult
the factory for assistance.
7.0 Rate of rise of on-state current
The maximum un-primed rate of rise of on-state current must not exceed 1500A/µs at any time during
turn-on on a non-repetitive basis. For repetitive performance, the on-state rate of rise of current must not
exceed 1000A/µs at any time during turn-on. Note that these values of rate of rise of current apply to the
total device current including that from any local snubber network.
8.0 Gate Drive
The nominal requirement for a typical gate drive is illustrated below. An open circuit voltage of at least 30V
is assumed. This gate drive must be applied when using the full di/dt capability of the device.
I
GM
4A/µs
I
G
t
p1
The magnitude of IGM should be between five and ten times IGT, which is shown on page 2. Its duration
) should be 20µs or sufficient to allow the anode current to reach ten times IL, whichever is greater.
(t
p1
Otherwise, an increase in pulse current could be needed to supply the necessary charge to trigger. The
‘back-porch’ current I
magnitude in the order of 1.5 times I
should remain flowing for the same duration as the anode current and have a
G
GT
.
Data Sheet. Type R1280NS18# to R1280NS25# Issue 4Page 3 of 12March, 2003
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9.0 Frequency Ratings
The curves illustrated in figures 10 to 18 are for guidance only and are superseded by the maximum
ratings shown on page 1.
10.0 Square wave ratings
These ratings are given for load component rate of rise of forward current of 100 and 500 A/µs.
11.0 Duty cycle lines
The 100% duty cycle is represented on all the ratings by a straight line. Other duties can be included as
parallel to the first.
12.0 Maximum Operating Frequency
The maximum operating frequency is set by the on-state duty, the time required for the thyristor to turn off
) and for the off-state voltage to reach full value (tv), i.e.
(t
q
f
13.0 On-State Energy per Pulse Characteristics
These curves enable rapid estimation of device dissipation to be obtained for conditions not covered by
the frequency ratings.
Then the average dissipation will be:
14.0 Reverse recovery ratings
(i) Qra is based on 50% Irm chord as shown in Fig. 1
=
vqpulsettt
++
be the Energy per pulse for a given current and pulse width, in joules
Let E
p
Let R
and T
be the steady-state d.c. thermal resistance (junction to sink)
th(J-Hs)
be the heat sink temperature.
SINK
.)(max
⋅−=⋅=125
RWT and fEW
()
HsJthAVSINKPAV
−
Fig. 1
max
1
(ii) Qrr is based on a 150µs integration time i.e.
(iii)
=
FactorK=
150
s
µ
dtiQ
.
rrrr
∫
0
t
1
2
Data Sheet. Type R1280NS18# to R1280NS25# Issue 4Page 4 of 12March, 2003
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15.0 Reverse Recovery Loss
15.1 Determination by Measurement
From waveforms of recovery current obtained from a high frequency shunt (see Note 1, Page 5) and
reverse voltage present during recovery, an instantaneous reverse recovery loss waveform must be
constructed. Let the area under this waveform be E joules per pulse. A new heat sink temperature can
then be evaluated from the following:
RfkETT
⋅+⋅−=
()
HsJthoriginalSINKnewSINK
)()(
Where k=0.227 (°C/W)/s
E = Area under reverse loss waveform per pulse in joules (W.s.)
f = rated frequency Hz at the original heat sink temperature.
= d.c. thermal resistance (°C/W).
R
th(J-Hs)
The total dissipation is now given by:
(original)(TOT)
15.2 Determination without Measurement
fEWW
⋅+=
−
In circumstances where it is not possible to measure voltage and current conditions, or for design
purposes, the additional losses E in joules may be estimated as follows.
Let E be the value of energy per reverse cycle in joules (curves in Figure 9).
Let f be the operating frequency in Hz
()( )
Where T
T
SINK (original)
A suitable R-C snubber network is connected across the thyristor to restrict the transient reverse voltage
to a peak value (V
67% of Grade, the reverse loss may be approximated by a pro rata adjustment of the maximum value
obtained from the curves.
NOTE 1- Reverse Recovery Loss by Measurement
This thyristor has a low reverse recovered charge and peak reverse recovery current. When measuring
the charge, care must be taken to ensure that:
(a) a.c. coupled devices such as current transformers are not affected by prior passage of high
amplitude forward current.
(b) A suitable, polarised, clipping circuit must be connected to the input of the measuring oscilloscope
to avoid overloading the internal amplifiers by the relatively high amplitude forward current signal
(c) Measurement of reverse recovery waveform should be carried out with an appropriate critically
damped snubber, connected across diode anode to cathode. The formula used for the calculation
of this snubber is shown below:
SINK (new)
is the required maximum heat sink temperature and
is the heat sink temperature given with the frequency ratings.
) of 67% of the maximum grade. If a different grade is being used or Vrm is other than
rm
()
fRETT
⋅⋅−=
thoriginalSINKnewSINK
V
=
2
R
Data Sheet. Type R1280NS18# to R1280NS25# Issue 4Page 5 of 12March, 2003
V
C
r
di
⋅
dt
S
Where:
⋅= 4
r
C
S
R
Commutating source voltage
=
Snubber capacitance
=
Snubber resistance
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16.0 Computer Modelling Parameters
16.1 Calculating VT using ABCD Coefficients
The on-state characteristic I
(i) the well established V
(ii) a set of constants A, B, C, D, forming the coefficients of the representative equation for V
terms of I
The constants, derived by curve fitting software, are given in this report for hot and cold characteristics
where possible. The resulting values for V
which is limited to that plotted.
16.2 D.C. Thermal Impedance Calculation
given below:
T
vs VT, on page 7 is represented in two ways;
T
and rs tangent used for rating purposes and
0
()
agree with the true device characteristic over a current range,
T
125°C Coefficients
A5.23269156
B-0.8154181
C-3.626×10
D0.07016205
=
np
∑
pt
=
p
1
-5
−
t
1
−⋅=
τ
p
err
in
T
IDICIBAV⋅+⋅+⋅+=ln
TTTT
Where p = 1 to n, n is the number of terms in the series.
t = Duration of heating pulse in seconds.
= Thermal resistance at time t.
r
t
r
= Amplitude of pth term.
= Time Constant of rth term.
τ
D.C. Single Side Cooled
Term1234
r
p
τ
p
Term1234
r
p
τ
p
0.01304256.2957×10
1.531090.1656470.02072673.4714×10
D.C. Double Side Cooled
0.035179575.171738×10
6.4316440.52348920.083018915.032106×10
-3
-3
2.35655×10
5.107098×10
-3
-3
2.23408×10
3.198402×10
-3
-3
-3
-3
Data Sheet. Type R1280NS18# to R1280NS25# Issue 4Page 6 of 12March, 2003
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3540 Bassett Street
Santa Clara CA 95054 USA
Tel: +1 (408) 982 0700
Fax: +1 (408) 496 0670
E-mail: sales@ixys.net
The information contained herein is confidential and is protected by Copyright. The information may not be used or
disclosed except with the written permission of and in the manner permitted by the proprietors Westcode Semiconductors
Ltd.
In the interest of product improvement, Westcode reserves the right to change specifications at any ti me without prior
notice.
Devices with a suffix code (2-letter or letter/digit/letter combination) added to their generic code are not necessari ly subject
to the conditions and limits contained in this report.